JP2019066783A - Method for manufacturing substrate - Google Patents

Abstract

To provide a method for manufacturing a substrate, capable of preventing a protective film from being peeled during shape processing and easily peeling the protective film after the shape processing.SOLUTION: The method for manufacturing a substrate comprises: the attaching step of attaching a protective film having a non-adhesive region at a position facing a central portion of each substrate and having an adhesive region at a position facing an edge portion of each substrate so as to surround the non-adhesive region on a base material; the shape processing step of processing a predetermined shape in the base material having the attached protective film; the preliminary peeling step of forming a cut line in the non-adhesive region of the protective film; and the peeling step of peeling the protective film from the substrate by using the cut line as a starting point and peeling the protective film from a central portion of each substrate toward the outside.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a substrate manufacturing method for obtaining a plurality of substrates of a desired shape from a base material for chamfering substrates.

  Generally, at the time of manufacture of glass panels, such as a liquid crystal panel and cover glass, processing which obtains a plurality of glass panels of a desired shape from a glass base material for multiple chamfers is performed. For example, in the manufacture of liquid crystal panels, a method (so-called multi-chamfering) in which a plurality of liquid crystal panels are simultaneously manufactured from one set of glass base materials and then the glass base materials are divided into single liquid crystal panels It has And when dividing a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were used in many cases.

  However, when a scribe break is adopted, it is difficult to form a glass panel having a rounded contour. Further, in the laser ablation process, problems such as a slow processing speed and contamination due to ablation debris easily occurred.

  Therefore, in the past, techniques for obtaining a plurality of glass panels by dividing a glass substrate for multiple chamfers by etching processing have come to be noted. The etching process is used to obtain a cover glass having a desired shape, and recently, it is specified from a glass base material for multiple chamfering for multiple chamfering of a liquid crystal panel formed by bonding an array substrate and a color filter substrate. The etching process has come to be used also when obtaining a plurality of liquid crystal panels having a shape (see, for example, Patent Document 1).

JP, 2016-224201, A

  However, while shape processing such as etching involves the use of a protective film having performance such as etching resistance, it has sometimes become difficult to peel off this protective film after shape processing. As the adhesiveness of the protective film to the base material becomes stronger, peeling becomes more difficult, but if this adhesiveness is not sufficient, there may occur a problem that the protective film is peeled off during shape processing. For this reason, in order to prevent the protective film from peeling off during the shaping process, there is a technology in which the protective film can be peeled off relatively easily after the shaping process while keeping the adhesiveness of the protective film to the base material sufficiently strong. It was coveted.

  An object of the present invention is to provide a substrate manufacturing method capable of preventing peeling of a protective film during shape processing, and making it easy to peel the protective film after shape processing.

  The substrate manufacturing method according to the present invention is for obtaining a plurality of substrates having a desired shape from a base material for chamfering the substrate. The substrate manufacturing method includes a sticking step, a shape processing step, a preliminary peeling step, and a peeling step.

  At a sticking step, a protective film is stuck on a base material. The protective film to be attached has a non-adhesive area at a position to be opposed to the central portion of each substrate, and has an adhesive area at a position to be opposed to the edge of each substrate so as to surround the non-adhesive area. ing. The purpose of using such a protective film is to form a situation where the central portion of each substrate and the protective film do not stick, and only the edge of each substrate and the protective film stick.

  In the shape processing step, predetermined shape processing is performed on the base material to which the protective film is attached. Typical examples of shape processing include laser processing and etching, but in addition to these processing, other processing such as blast processing and scribe cut processing may be employed alone or in combination with other processing. It is possible.

  In the pre-peel step following the shaping process step, a cut is made in the adherend area of the protective film. This cut may be formed at least in the region to be adhered, but it is preferable to form it over a wide area from the region to be adhered to the adhesive region from the viewpoint of easy peeling. Further, in view of the ease of gripping the end of the cut, it may be more preferable to form two or more intersecting cuts.

  In the peeling step subsequent to the preliminary peeling step, the protective film is peeled from the substrate by peeling the protective film outward from the central portion of each substrate starting from the cut. In the absence of an origin, it is difficult to peel off the protective film, but in the present invention, since the origin for peeling is always present and the origin and the periphery thereof do not adhere to the substrate, It is easy to peel off.

  Further, instead of the above-mentioned sticking step, an intervening member is disposed at a position facing the central portion of each substrate, and the sticking step of sticking the protective film on the base material with these intervening members interposed is performed. It is possible to preferably carry out the invention.

  Examples of the interposed member include sheet materials such as non-adhesive or low-adhesive paper pieces, porous members such as sponge, and ring-shaped members for forming a gap between the protective film and the substrate. However, it is not limited to these.

  When such an interposed member is used, it is preferable to make a cut in the region of the protective film facing the interposed member after the shape processing step in the preliminary peeling step. As a result, as described above, since the starting point for peeling always exists and the starting point and the periphery thereof do not adhere to the substrate, it becomes easy to peel off the protective film.

  In the case of forming a non-adhesive region on the protective film, it is advantageous in terms of working efficiency because the process of arranging the intervening member can be omitted. However, when using an intervening member, since it is possible to use the existing protective film as it is, it can be said that it is advantageous in cost. It is preferable to select the preferred one as appropriate while comparing and considering these merits and demerits.

  In any case, the area facing the central portion of each substrate in the protective film is not adhered to the substrate, but since the periphery of the area is adhered to the substrate, the protective film is a substrate during the shaping process. It is hard to generate inconveniences such as peeling from metal.

  According to the present invention, it is possible to prevent the peeling of the protective film during the shaping process and to make the protective film easy to be peeled off after the shaping process.

It is a figure which shows the process contained in one Embodiment of a glass panel manufacturing method. It is a figure which shows the process contained in one Embodiment of a glass panel manufacturing method. It is a figure which shows the state which obtained several glass panels from the glass base material for multiple chamfers. It is a figure which shows an example of the operation | work which peels an etching resistant film. It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfers containing several liquid crystal panels. It is a figure which shows schematic structure of the glass base material for multiple chamfers of the state which affixed the etching resistant film. It is a figure which shows the outline of the laser processing with respect to the glass base material for multiple chamfers. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows an example of the operation | work which peels an etching resistant film. It is a figure which shows the outline of the scribing break process with respect to the glass base material for multiple chamfers. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel. It is a figure which shows the variation of schematic structure of an interposition member.

  First, an embodiment of a substrate manufacturing method according to the present invention will be described using FIGS. 1 to 3. FIG. 1A shows an outline of a multiple bevel glass substrate 4 for multiple beveling of a glass panel 2. In order to obtain a plurality of glass panels 2 having a desired shape from the glass substrate 4 for multiple chamfering, first, as shown in FIG. 1 (B), the transparent etching resistant film 6 (corresponding to the protective film of the present invention) It is stuck on at least both main surfaces of the glass base material 4. In this embodiment, a transparent polyethylene resin material is employed as the etching resistant film 6. However, as the etching resistant film 6, for example, transparent polypropylene, transparent polyvinyl chloride, an olefin resin, or the like can be employed. Moreover, it is not limited to these, It is also possible to use the film which does not have transparency.

  As the etching resistant film 6, a thin film having a thickness of 100 μm or less is used. In view of the fact that thinning makes it easy to carry out peeling and optical effects when the laser beam passes is also reduced, the thickness of the etching resistant film 6 is the minimum necessary to satisfy the etching resistance performance. It is preferable to make it thick. Therefore, the thickness of the etching resistant film 6 is preferably suppressed to 75 μm or less, and more preferably, the thickness of the etching resistant film 6 is 60 μm or less. As described later, in this embodiment, the formation of the reforming line accelerates the etching process, so that the disadvantage is unlikely to occur even if the etching resistant film 6 is made extremely thin.

  The attached etching resistant film 6 has a non-adhesive area 62 at a position to be opposed to the central part of each glass panel 2 as shown in FIG. 1 (B), and surrounds the non-adhesive area 62. An adhesive area is provided at a position to be opposed to the edge of each glass panel 2. By using such an etching resistant film 6, the central part of each glass panel 2 and the etching resistant film 6 can be made to be in an adhesive state, and the convenience of the peeling operation to be described later can be achieved. It is preferable from the viewpoint of ease of peeling that the non-adhesive region 62 be expanded as much as possible within the range in which the adhesion failure of the etching resistant film 6 does not occur.

  After the etching resistant film 6 is attached to the glass substrate 4 for multiple beveling, the process proceeds to a laser scanning step shown in FIG. 1 (C). In the laser scanning step, scanning of the laser beam is performed along a shape cutting scheduled line corresponding to the shape of the glass panel 2 to be taken out. As a result, the etching resistant film is removed along the planned shape cutting line to form an opening.

  Furthermore, as shown to FIG. 2 (A)-FIG.2 (C), the modification line 20 of the property which is easy to be etched to the glass base material 4 for multiple chamfers is formed. By removing the etching resistant film 6 along the planned shape cutting line, the opening of the etching resistant film 6 is formed along the planned shape cutting line, and as a result, it is shown in FIG. 2 (C). Thus, the formation position of the reforming line 20 of the glass substrate 4 for multiple beveling is exposed to the outside. In this embodiment, filament processing with a picosecond laser is employed, and the width of the reforming line 20 is set to be approximately 10 μm or less.

  When the laser scanning step is finished, the etching step is started. After the laser scanning step, the reforming line 20 is etched by bringing the multiple bevel glass base material 4 into contact with the etching solution. Since the etchant easily penetrates along the reforming line 20, the etching process can be completed before the side etching largely progresses. As a result, it is possible to take out the plurality of glass panels 2 from the glass base material 4 for multi-faceting while minimizing the influence of side etching accompanying the etching process. In addition, about the structure etc. which are used in an etching step, in order to demonstrate at the time of manufacture of the below-mentioned liquid crystal panel collectively, the description is abbreviate | omitted here.

  By the completion of the etching process, as shown in FIG. 3A, the glass panel 2 with the etching resistant film 6 separated into single pieces can be obtained. By peeling off the etching resistant film 6, a glass panel 2 processed into a desired shape as shown in FIG. 3 (B) can be obtained.

  Here, the method to peel the etching resistant film 6 from the glass panel 2 is demonstrated using FIG. 4 (A)-FIG.4 (C). After the etching process, a preliminary peeling operation is performed to cut the adherend area 62 of the etching resistant film 6. This cut may be formed at least in the region to be adhered 62, but in this case, not only the region to be adhered 62 but also a cut over the entire length and width direction is formed in consideration of the peelability. Further, although two intersecting cuts are formed here, the number of cuts can be appropriately increased or decreased in consideration of the convenience of the peeling operation. The cut can be formed by appropriately using known cutting means such as a blade-like cutter or a wheel-like cutter.

  By the preliminary peeling operation, as shown in FIG. 4 (B), it becomes easy to make the end portion which becomes the starting point of peeling rise from the glass panel 2. Thereafter, as shown in FIG. 4C, the etching resistant film 6 is peeled from the glass panel 2 by peeling the etching resistant film 6 outward from the central portion of the glass panel 2 starting from the cut. Can. Here, the etching resistant film 6 is wound around the peripheral surface of the peeling roller 8 using the peeling roller 8 provided with a rubber layer having a high coefficient of friction on the peripheral surface. However, the structure which peels the etching resistant film 6 is not limited to this, For example, it is also possible to employ | adopt structures, such as a holding mechanism which hold | maintains the etching resistant film 6, etc. FIG.

  Subsequently, another embodiment of the substrate manufacturing method according to the present invention will be described. FIG. 5A shows a schematic configuration of a liquid crystal panel 10 according to another embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that the array substrate 12 and the color filter substrate 14 are bonded together with the liquid crystal layer interposed therebetween. The configurations of the array substrate 12 and the color filter substrate 14 may adopt the same configurations as known configurations, and thus the description thereof is omitted here.

  The array substrate 12 has an electrode terminal portion 122 provided so as to extend from the area to be bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and the electric circuits thereof are housed in a case, whereby, for example, a smartphone 100 as shown in FIG. Configured

  Subsequently, an example of a method of manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 6A and 6B, generally, the liquid crystal panel 10 is manufactured as a multiple bevel glass base material 50 including a plurality of liquid crystal panels, and the multiple bevel glass base material 50 is divided. By doing this, a single liquid crystal panel 10 is obtained. In this embodiment, for convenience, the process for the multiple bevel glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns will be described. However, the liquid crystal panel included in the multiple bevel glass base material 50 The number of ten can be increased or decreased as appropriate.

  First, as shown in FIGS. 7A and 7B, a transparent etching resistant film 16 having etching resistance is attached to both main surfaces of the multiple bevel glass base material 50. Here, polyethylene having a thickness of 50 to 75 μm is employed as the etching resistant film 16. However, the configuration of the etching resistant film 16 is not limited to this. For example, as long as it has transparency, such as polypropylene, polyvinyl chloride, olefin resin, etc., and has resistance to an etching solution for etching glass, it may be appropriately selected and adopted. In addition, it is also possible to use a colored non-transparent film such as a black film, which is not transparent.

  Similarly to the etching resistant film 6 described above, the etching resistant film 16 is also provided with a non-adhesive area 162 in the area corresponding to the central portion of each liquid crystal panel 10. Similarly to the non-adhesive area 62 described above, the non-adhesive area 162 also exhibits the effect of improving the working efficiency of the peeling operation.

  Subsequently, as shown in FIGS. 8A and 8B, the glass substrate for multiple beveling 50 is a reforming line 20 along a planned shape cutting line corresponding to the shape (outline) of the liquid crystal panel 10. Is formed. The modification line 20 is, for example, a filament array in which a plurality of filament layers formed by light beam pulses (a beam diameter is about 1 to 5 μm) emitted from a pulse laser such as picosecond laser or femtosecond laser is there.

  The light beam from the picolaser generally has a beam profile such that the light intensity is uniform and strong over a wider range than the total thickness of at least the array substrate 12, the color filter substrate 14, and the etching resistant film 16. Is preferred. When such a configuration is employed, energy can be transmitted to all of the array substrate 12, the color filter substrate 14, and the etching resistant film 16, and the removal of the etching resistant film 16 and the liquid crystal panel 10 are realized. It is possible to simultaneously form the reforming line 20 for taking out.

  However, when problems occur in the liquid crystal layer by treating the array substrate 12, the color filter substrate 14 and the etching resistant film 16 simultaneously with one laser beam, as shown in FIGS. 8C and 8D. By adopting such laser processing, it is possible to suppress the occurrence of such a defect. That is, as shown in FIG. 8C, the laser beam is scanned after focusing and adjusting the intensity so that the modifying line 20 is formed only on the array substrate 12 from the array substrate 12 side, and energy in the vicinity of the liquid crystal layer Should be difficult to communicate. In this state, if it is possible to divide the multiple bevel glass base material 50 by applying physical action or thermal action, the laser processing ends here.

  On the other hand, if it is difficult to divide the multiple bevel glass base material 50 in this state, as shown in FIG. 8 (D), only the color filter substrate 14 from the color filter substrate 14 side which is opposite this time. It is preferable to scan the laser after focusing and adjusting the intensity to form the reforming line 20. By performing the process shown in FIG. 8 (D), although the number of steps of laser processing increases, it is possible to easily divide the glass substrate for multiple chamfers 50 while suppressing the occurrence of defects in the liquid crystal layer. become.

  Also in this embodiment, the reforming line 20 has a perforated shape having a plurality of through holes or reforming layers, as in the case shown in FIG. 2 (A) described above. The reforming line 20 has the property of being easier to etch than the other portions of the multiple bevel glass substrate 50. Of course, the shape of the reforming line 20 is not limited to this shape, and may have another shape.

  After the above-mentioned laser processing is completed, as shown in FIG. 9, the glass substrate for multiple beveling 50 is introduced into the etching apparatus 300, and is subjected to an etching process with an etching solution containing hydrofluoric acid, hydrochloric acid and the like. In the etching apparatus 300, the etching liquid is brought into contact with one side or both sides of the glass substrate for multiple chamfering 50 in the etching chamber while the glass substrate for multiple chamfering 50 is transported by the transport roller, thereby the glass substrate for multiple chamfering An etching process for 50 is performed. In addition, since the cleaning chamber for washing away the etching liquid adhering to the glass base material 50 for multiple chamfers is provided in the latter part of the etching chamber in the etching apparatus 300, the etching liquid removes the glass base material 50 for multiple chamfers. It is discharged from the etching apparatus 300 in the closed state.

  As an example of the method for bringing the etching solution into contact with the glass substrate 50 for multiple chamfering, as shown in FIG. 10A, the etching solution for the glass substrate 50 for multiple chamfering in each etching chamber 302 of the etching apparatus 300 And spray etching. Also, instead of spray etching, as shown in FIG. 10B, in the overflow type etching chamber 304, a configuration is employed in which the glass substrate for multiple chamfers 50 is transported while being in contact with the overflowing etching solution. Is also possible.

  Furthermore, as shown in FIG. 10C, a dip type etching is employed in which one or a plurality of multi-faceted glass base materials 50 contained in the carrier are immersed in the etching bath 306 containing the etching solution. It is also possible.

  In any case, it is important that the planned shape cutting line penetrates in the thickness direction during the etching process so that the multiple bevel glass base material 50 is not divided. Therefore, during the etching process (in particular, the latter half of the etching process), it is necessary to reduce the etching rate to control the etching amount accurately. In this embodiment, the etching process is performed at a slow speed of 3 μm / min or less by a thin hydrofluoric acid of 2 wt% or less, but the present invention is not limited to this method.

  If the etching rate is not slowed down in the entire etching process but is gradually delayed while adopting an earlier etching rate, it is possible to shorten the etching time. For example, it is preferable to adopt a configuration in which the concentration of hydrofluoric acid in the etching solution is reduced as it proceeds to the later stage of the etching apparatus 300.

  When the glass substrate for multiple chamfers 50 passes through the etching apparatus 300, the reforming line 20 is etched. In the modification line 20, the etchant penetrates faster than at other places, and the glass is dissolved along this line, so that the color filter substrate can be easily cut by the modification line 20. In addition, even when scratches and the like occur at the time of laser irradiation, the scratches easily disappear.

  When the etching process is completed, the pasted etching resistant film 16 is peeled off. The peeling operation of the etching resistant film 16 is the same as the peeling operation of the etching resistant film 6 described in FIG. First, as shown in FIG. 11A, a preliminary peeling operation is performed in which a cut is made in the adherend area 162 of the etching resistant film 16. This cut may be formed at least in the region to be adhered 162. Here, not only the region to be adhered 162 but also the entire region in the length direction and the width direction of the glass substrate for multiple chamfering 50 in consideration of the peelability. Form a cut across the Further, although two intersecting cuts are formed here, the number of cuts can be appropriately increased or decreased in consideration of the convenience of the peeling operation.

  By the preliminary peeling operation, as shown in FIG. 11 (B), it becomes easy to make the end portion which becomes the starting point of peeling rise from the multiple bevel glass base material 50. Thereafter, as shown in FIG. 11C, the etching resistant film 16 is peeled outward from the central portion of the multiple bevel glass base material 50 starting from the cut. This can be repeated to peel off the etching resistant film 16 from the entire area of the glass substrate 50 for multiple chamfering. Here, the etching resistant film 16 is peeled using the holding mechanism 80, but the etching resistant film 6 may be peeled using the peeling roller 8 described above or other means.

  Subsequently, in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 as shown in FIG. 12A to FIG. A process of forming the terminal portion cutting groove 30 is performed. In this embodiment, the terminal cutting groove 30 is formed inside the area of the color filter substrate 14 facing the electrode terminal portion 122 of the color filter substrate 14 by the scribe wheel (wheel cutter) 250. The terminal portion cutting groove 30 is formed along the terminal portion cutting planned line in order to remove the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

  When the formation of the terminal portion cutting groove 30 by the scribing wheel 250 is finished, the process proceeds to the division of the multiple bevel glass base material 50 and the removal of the region facing the electrode terminal portion 122. In the glass substrate for multiple chamfers 50, the modification line 20 is formed by laser filament processing, and the modification line is further etched to modify the glass substrate for multiple chamfers 50 with only a slight mechanical pressure. It can be divided at the quality line 20. For example, as shown in FIG. 13, by applying a minute pressing force to the glass substrate 50 for multiple chamfers or giving a minute ultrasonic vibration, without staining the glass substrate 50 for multiple chamfers, It is possible to divide.

  Despite this, since the etching process does not completely cut off, it is possible to prevent the occurrence of a defect that the end faces of the liquid crystal panel 10 separated during the etching collide with each other to be damaged. In addition, it is possible to carry the multi-faceted glass base material 50 in the incompletely cut state after the etching process (in the large size state). Furthermore, since the etching solution does not reach the electrode terminal portion, it becomes unnecessary to protect the electrode terminal portion by the masking agent having etching resistance. In addition, since the etching process is applied to at least the central portion of the end face of the liquid crystal panel 10, the strength (for example, bending strength) of the liquid crystal panel is higher than when the cutting is performed only by laser processing.

  FIG. 14A to FIG. 14C show schematic configurations of the liquid crystal panel 10 after division. As shown in the figure, the end face of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper widths (L1 to L4 in FIG. 14C) generated on the end faces of the array substrate 12 and the color filter substrate 14 each having a plate thickness of about 0.15 mm to 0.25 mm are 50 μm or less (mostly) It can be suppressed to 20 to 35 μm.

  As described above, when manufacturing the liquid crystal panel 10, the influence of the side etching hardly occurs, so that it is possible to design the multiple bevel glass base material 50 in which the liquid crystal panels 10 are arranged close to each other. For example, if there is a gap of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the multiple bevel glass base material 50 into a single liquid crystal panel 10.

  Also, instead of using the etching resistant film 6 having the non-adhesive region 62 described above or the etching resistant film 16 having the non-adhesive region 162, the interposed member is disposed at a position facing the central portion of each panel. You may make it use the normal etching-resistant film which does not have an adhesion area | region especially.

  The structural example of the intervening member is demonstrated using FIG. 15 (A)-FIG. 15 (C). In FIG. 15A, a non-tacky or low-tack paper piece 802 is interposed between the panel and the film. Instead of the paper piece 802, it is possible to use a resin sheet, a rubber sheet, or another sheet-like interposed member.

  In FIG. 15B, a non-tacky or low-tacky ring-shaped member 804 is interposed between the panel and the film. Examples of the material of the ring-shaped member 804 include paper and resin, but materials other than these may be used. As long as it has a function of forming a gap between the protective film and the substrate, it is possible to suitably use one other than the illustrated shape and structure of the ring-shaped member 804.

  In FIG. 15C, a non-adhesive or low-adhesive sponge member 806 is interposed between the panel and the film. Instead of the sponge member 806, another porous member may be used.

  When using an intervening member as shown in FIG. 15 (A) to FIG. 15 (C), in the preliminary peeling step, a cut is made in the region of the protective film facing the intervening member after the shape processing step. Good. As a result, as described above, since the starting point for peeling always exists and the starting point and the periphery thereof do not adhere to the substrate, it becomes easy to peel off the protective film.

  In the above-described embodiment, the overcoat (OC) film and the ITO film of the array substrate 12 and the color filter substrate 14 are not described for convenience of explanation, but they are not contaminated by the above process. Further, even the object to be treated (such as a liquid crystal panel) in which the overcoat (OC) film or the ITO film is not formed can be appropriately treated by the above-mentioned method.

  The above description of the embodiments should be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated not by the embodiments described above but by the claims. Further, the scope of the present invention is intended to include all modifications within the scope and meaning equivalent to the claims.

2-Glass panel 4-Glass substrate for multiple chamfers 6, 16-Etching resistant film 8-Peeling roller 10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 20-Reforming line 30-Terminal groove cutting groove 50-Many Glass base material for chamfering 80-gripping mechanism 100-smart phone 122-electrode terminal 250-scribing wheel 300-etching apparatus 302, 304-etching chamber 306-etching tank

Claims (2)

A substrate manufacturing method for obtaining a plurality of substrates of a desired shape from a base material for forming a plurality of substrates,
A protective film having a non-adhesive area at a position to be opposed to the central part of each substrate, and an adhesive area at a position to be opposed to the edge of each substrate so as to surround the non-adhesive area; Affixing steps to be applied to the
A shape processing step of performing predetermined shape processing on the base material to which the protective film is attached;
A preliminary peeling step of cutting the adherend area of the protective film after the shape processing step;
A peeling step of peeling the protective film from the substrate by peeling the protective film from the central portion of each substrate to the outside starting from the cut;
A substrate manufacturing method including: A substrate manufacturing method for obtaining a plurality of substrates of a desired shape from a base material for forming a plurality of substrates,
Placing an intervening member at a position opposed to the central portion of each substrate, and attaching a protective film to the base material with the interposed member interposed therebetween;
A shape processing step of performing predetermined shape processing on the base material to which the protective film is attached;
A preliminary peeling step of cutting the area of the protective film facing the interposed member after the shape processing step;
A peeling step of peeling the protective film from the substrate by peeling the protective film from the central portion of each substrate to the outside starting from the cut;
A substrate manufacturing method including:

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