JP6519045B2 - Glass panel manufacturing method and liquid crystal panel manufacturing method - Google Patents

Description

  The present invention relates to a glass panel manufacturing method and a liquid crystal panel manufacturing method for obtaining a plurality of glass panels of a desired shape and a liquid crystal panel of a desired shape from a glass substrate for multiple chamfers.

  Generally, at the time of manufacture of glass panels, such as a liquid crystal panel and cover glass, processing which obtains a plurality of glass panels of a desired shape from a glass base material for multiple chamfers is performed. For example, in the manufacture of liquid crystal panels, a method (so-called multi-chamfering) in which a plurality of liquid crystal panels are simultaneously manufactured from one set of glass base materials and then the glass base materials are divided into single liquid crystal panels It has And when dividing a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were used in many cases.

  However, when a scribe break is adopted, it is difficult to form a glass panel having a rounded contour. Further, in the laser ablation process, problems such as a slow processing speed and contamination due to ablation debris easily occurred.

  Therefore, in the past, techniques for obtaining a plurality of glass panels by dividing a glass substrate for multiple chamfers by etching processing have come to be noted. The etching process is used to obtain a cover glass having a desired shape, and recently, it is specified from a glass base material for multiple chamfering for multiple chamfering of a liquid crystal panel formed by bonding an array substrate and a color filter substrate. The etching process has come to be used also when obtaining a plurality of liquid crystal panels having a shape (see, for example, Patent Document 1).

JP, 2016-224201, A

  However, in the etching process, in addition to the etching progressing in the thickness direction of the glass panel, side etching occurs in which the etching progresses also in the direction orthogonal to this. Therefore, in the etching process, it is difficult to form the cut surface of the glass panel so as to be substantially perpendicular to the main surface. For example, when the liquid crystal panel is chamfered by etching, it is necessary to provide a space between the liquid crystal panels in the glass base material in consideration of the influence of side etching which proceeds in the direction orthogonal to the thickness direction of the glass base material. There are cases where the efficiency of multiple beveling is worse.

  An object of the present invention is to provide a glass panel manufacturing method and a liquid crystal panel manufacturing method capable of minimizing the influence of side etching associated with etching processing.

  The glass panel manufacturing method which concerns on this invention is a method for obtaining two or more glass panels of a desired shape from the glass base material for multiple chamfers for chamfering a glass panel multiple. The glass panel manufacturing method includes at least a step of forming a transparent etching resistant layer, a laser scanning step, and an etching step.

  In the step of forming a transparent etching resistant layer, a transparent etching resistant layer having etching resistance is formed on the surface of the glass panel with multiple bevels. A representative example of the etching resistant layer is an etching resistant film made of a transparent resin material resistant to an etching solution containing hydrofluoric acid for etching glass. The etching resistant film may be attached via a transparent etching resistant adhesive, or one having self-adhesiveness may be used. Besides the etching resistant film, it is possible to form the etching resistant layer using a transparent resist material with etching resistance and other transparent masking members.

  In the laser scanning step, the etching resistant layer is removed along the planned shape cutting line by scanning the laser along the planned shape cutting line corresponding to the shape of the glass panel to be taken out, and the glass substrate for multiple chamfers The reformed line of the nature which is easy to be etched is formed. By removing the etching resistant layer along the planned shape cutting line, the opening of the etching resistant layer is formed along the planned shape cutting line, and as a result, modification of the glass substrate for multiple beveling The line formation position is exposed. In particular, since the removal of the etching resistant layer and the formation of the reforming line are performed by the same laser beam, it is possible to prevent the shift between the opening position of the etching resistant layer and the forming position of the modifying line. Representative examples of the method of forming the reforming line include filament processing with a picosecond laser or a femtosecond laser. The width of the reforming line is preferably set to about 10 μm or less.

  In the etching step, after the laser scanning step, the reforming line is etched by bringing the glass substrate for multiple beveling into contact with the etching solution. Since the etchant easily penetrates along the reforming line and the progress of the etching process is easy and shortened, the influence of side etching can be minimized.

  In the glass panel manufacturing method described above, the transparent etching resistant layer is preferably a thin transparent film of 50 μm to 100 μm. By thinning the etching resistant layer to about 50 μm to 100 μm, it becomes easy to peel off. In addition, since the optical effect when the laser beam passes is also reduced, it becomes easy to accurately adjust the focus and beam profile of the laser beam. On the other hand, since the reforming line is formed along the planned shape cutting line, the etching process can be performed quickly, and the required etching resistance can be suppressed to a low level. Therefore, there is no problem even if the etching resistant film is thinner than the usual etching process. In addition, it can be said that it is more preferable from the viewpoint of the focus precision improvement of a laser beam that the characteristic of a thin transparent film to be similar to the characteristic of glass.

  Furthermore, the liquid crystal panel manufacturing method according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a multiple bevel glass base material for multi beveling a liquid crystal panel formed by bonding an array substrate and a color filter substrate. is there. This liquid crystal panel manufacturing method includes at least a step of forming a transparent etching resistant layer, a laser scanning step, and an etching step.

  In the step of forming a transparent etching resistant layer, a transparent etching layer having etching resistance is attached to the array substrate and the color filter substrate. As described above, as a representative example of the etching resistant layer, an etching resistant film made of a transparent resin material having resistance to an etching solution containing hydrofluoric acid for etching glass can be mentioned. The etching resistant film may be attached via a transparent etching resistant adhesive, or one having self-adhesiveness may be used. Besides the etching resistant film, it is possible to form the etching resistant layer using a transparent resist material with etching resistance and other transparent masking members.

  In the laser scanning step, the etching resistant layer is removed along the planned shape cutting line and the glass substrate for multiple chamfering is etched by scanning the laser along the planned shape cutting line corresponding to the shape of the liquid crystal panel. Form a reforming line of a nature that is easy to Furthermore, in the etching step, after the laser scanning step, the modified line is etched by bringing the multiple bevel glass substrate into contact with the etching solution.

  In this liquid crystal panel manufacturing method, modification lines are respectively formed on the array substrate and the color filter substrate, and therefore the multiple bevel glass base material is divided by etching while minimizing the influence of side etching on each substrate. It becomes possible.

  If defects such as air bubbles occur in the liquid crystal layer sandwiched between the array substrate and the color filter substrate in the above-mentioned laser scanning step, the etching resistant film is removed along the shape cutting lines and the reforming lines are arrayed. It is preferable to form on only one of the substrate and the color filter substrate. By adopting this method, it is possible to reduce the thermal influence and the like of the laser beam on the liquid crystal layer, so it becomes difficult to cause a problem such as generation of bubbles in the liquid crystal layer.

  In the method described in the preceding paragraph, when it becomes difficult to divide the glass member for multiple chamfers, the etching resistant film is removed along the shape cutting planned line in the above-mentioned laser scanning step, and the reforming line is modified. It is preferable to form the modified line on either the array substrate or the color filter substrate by scanning the laser from the opposite side only on either the array substrate or the color filter substrate.

  After the etching process, it is possible to achieve complete cutting by applying a slight mechanical pressure or thermal stress, since it is in a substantially substantially cut state at the shape cutting scheduled line. It is possible to realize complete cutting without staining the multi-faceted glass base material by applying a minute pressing force, giving a minute ultrasonic vibration, or heating.

  In the above-described glass panel manufacturing method and liquid crystal panel manufacturing method, it is preferable that the reforming line has a perforated shape having a plurality of through holes or a plurality of reforming holes formed by a beam of a pulse laser. In order to process the shape cutting scheduled line of a glass panel or a liquid crystal panel with a pulse laser, the contour of the glass panel or the liquid crystal panel includes a complicated curve or a minute curved portion, or an opening is formed in the glass panel or the liquid crystal panel Even if it is done, it becomes possible to realize appropriate processing.

  According to the present invention, it is possible to minimize the influence of side etching accompanying the etching process in the glass panel manufacturing method and the liquid crystal panel manufacturing method.

It is a figure which shows the process contained in one Embodiment of a glass panel manufacturing method. It is a figure which shows the process contained in one Embodiment of a glass panel manufacturing method. It is a figure which shows the state which obtained several glass panels from the glass base material for multiple chamfers. It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfers containing several liquid crystal panels. It is a figure which shows schematic structure of the glass base material for multiple chamfers of the state which affixed the etching resistant film. It is a figure which shows the outline of the laser processing with respect to the glass base material for multiple chamfers. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the scribing break process with respect to the glass base material for multiple chamfers. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel.

  First, an embodiment of a glass panel manufacturing method according to the present invention will be described using FIGS. 1 to 3. FIG. 1A shows an outline of a multiple bevel glass substrate 4 for multiple beveling of a glass panel 2. In order to obtain a plurality of glass panels 2 of a desired shape from the glass substrate 4 for multiple chamfering, first, as shown in FIG. 1 (B), the transparent etching resistant film 6 is at least both main sides of the glass substrate 4 for multiple chamfering. It is stuck on the face. In this embodiment, a transparent polyethylene resin material is employed as the etching resistant film 6. However, as the etching resistant film 6, it is also possible to employ transparent polypropylene, transparent polyvinyl chloride, an olefin resin, or the like.

  In this embodiment, the etching resistant film 6 corresponds to the etching resistant layer according to the present invention. As the etching resistant film 6, a thin film having a thickness of 100 μm or less is used. In view of the fact that thinning makes it easy to carry out peeling and optical effects when the laser beam passes is also reduced, the thickness of the etching resistant film 6 is the minimum necessary to satisfy the etching resistance performance. It is preferable to make it thick. Therefore, the thickness of the etching resistant film 6 is preferably suppressed to 75 μm or less, and more preferably, the thickness of the etching resistant film 6 is 60 μm or less. As described later, in this embodiment, the formation of the reforming line accelerates the etching process, so that the disadvantage is unlikely to occur even if the etching resistant film 6 is made extremely thin.

  After the etching resistant film 6 is attached to the glass substrate 4 for multiple beveling, the process proceeds to a laser scanning step shown in FIG. 1 (C). In the laser scanning step, scanning of the laser beam is performed along a shape cutting scheduled line corresponding to the shape of the glass panel 2 to be taken out. As a result, the etching resistant film is removed along the planned shape cutting line to form an opening.

  Furthermore, as shown to FIG. 2 (A)-FIG.2 (C), the modification line 20 of the property which is easy to be etched to the glass base material 4 for multiple chamfers is formed. By removing the etching resistant film 6 along the planned shape cutting line, the opening of the etching resistant film 6 is formed along the planned shape cutting line, and as a result, it is shown in FIG. 2 (C). Thus, the formation position of the reforming line 20 of the glass substrate 4 for multiple beveling is exposed to the outside. In this embodiment, filament processing with a picosecond laser is employed, and the width of the reforming line 20 is set to be approximately 10 μm or less.

  When the laser scanning step is finished, the etching step is started. After the laser scanning step, the reforming line 20 is etched by bringing the multiple bevel glass base material 4 into contact with the etching solution. Since the etchant easily penetrates along the reforming line 20, the etching process can be completed before the side etching largely progresses. As a result, it is possible to take out the plurality of glass panels 2 from the glass base material 4 for multi-faceting while minimizing the influence of side etching accompanying the etching process. In addition, about the structure etc. which are used in an etching step, in order to demonstrate at the time of manufacture of the below-mentioned liquid crystal panel collectively, the description is abbreviate | omitted here.

  Subsequently, an embodiment of a method of manufacturing a liquid crystal panel according to the present invention will be described. FIG. 4A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that the array substrate 12 and the color filter substrate 14 are bonded together with the liquid crystal layer interposed therebetween. The configurations of the array substrate 12 and the color filter substrate 14 may adopt the same configurations as known configurations, and thus the description thereof is omitted here.

  The array substrate 12 has an electrode terminal portion 122 provided so as to extend from the area to be bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and the electric circuits thereof are housed in a case, whereby, for example, the smartphone 100 as shown in FIG. Configured

  Subsequently, an example of a method of manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 5A and 5B, generally, the liquid crystal panel 10 is manufactured as a multiple bevel glass base material 50 including a plurality of liquid crystal panels, and the multiple bevel glass base material 50 is divided. By doing this, a single liquid crystal panel 10 is obtained. In this embodiment, for convenience, the process for the multiple bevel glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns will be described. However, the liquid crystal panel included in the multiple bevel glass base material 50 The number of ten can be increased or decreased as appropriate.

  First, as shown in FIG. 6A and FIG. 6B, a transparent etching resistant film 16 having etching resistance is attached to both main surfaces of the glass substrate 50 for multiple beveling. Here, polyethylene having a thickness of 50 to 75 μm is employed as the etching resistant film 16. However, the configuration of the etching resistant film 16 is not limited to this. For example, as long as it has transparency, such as polypropylene, polyvinyl chloride, olefin resin, etc., and has resistance to an etching solution for etching glass, it may be appropriately selected and adopted.

  Subsequently, as shown in FIGS. 7A and 7B, the glass substrate 50 for multiple beveling is a reforming line 20 along a planned shape cutting line corresponding to the shape (outline) of the liquid crystal panel 10. Is formed. The modification line 20 is, for example, a filament array in which a plurality of filament layers formed by light beam pulses (a beam diameter is about 1 to 5 μm) emitted from a pulse laser such as picosecond laser or femtosecond laser is there.

  The light beam from the picolaser generally has a beam profile such that the light intensity is uniform and strong over a wider range than the total thickness of at least the array substrate 12, the color filter substrate 14, and the etching resistant film 16. Is preferred. When such a configuration is employed, energy can be transmitted to all of the array substrate 12, the color filter substrate 14, and the etching resistant film 16, and the removal of the etching resistant film 16 and the liquid crystal panel 10 are realized. It is possible to simultaneously form the reforming line 20 for taking out.

  However, when problems occur in the liquid crystal layer by treating the array substrate 12, the color filter substrate 14 and the etching resistant film 16 simultaneously with one laser beam, as shown in FIGS. 7C and 7D. By adopting such laser processing, it is possible to suppress the occurrence of such a defect. That is, as shown in FIG. 7C, after adjusting the focus and adjusting the intensity so as to form the modifying line 20 only on the array substrate 12 from the array substrate 12 side, the laser is scanned and the energy in the vicinity of the liquid crystal layer Should be difficult to communicate. In this state, if it is possible to divide the multiple bevel glass base material 50 by applying physical action or thermal action, the laser processing ends here.

  On the other hand, if it is difficult to divide the multiple bevel glass base material 50 in this state, as shown in FIG. 7 (D), only the color filter substrate 14 from the color filter substrate 14 side opposite this time. It is preferable to scan the laser after focusing and adjusting the intensity to form the reforming line 20. By performing the process shown in FIG. 7 (D), although the number of steps of laser processing increases, it is possible to easily divide the glass substrate for multiple chamfers 50 while suppressing the occurrence of defects in the liquid crystal layer. become.

  Also in this embodiment, the reforming line 20 has a perforated shape having a plurality of through holes or reforming layers, as in the case shown in FIG. 2 (A) described above. The reforming line 20 has the property of being easier to etch than the other portions of the multiple bevel glass substrate 50. Of course, the shape of the reforming line 20 is not limited to this shape, and may have another shape.

  After the above-mentioned laser processing is completed, as shown in FIG. 8, the glass substrate for multiple beveling 50 is introduced into the etching apparatus 300 and is subjected to an etching process with an etching solution containing hydrofluoric acid, hydrochloric acid and the like. In the etching apparatus 300, the etching liquid is brought into contact with one side or both sides of the glass substrate for multiple chamfering 50 in the etching chamber while the glass substrate for multiple chamfering 50 is transported by the transport roller, thereby the glass substrate for multiple chamfering An etching process for 50 is performed. In addition, since the cleaning chamber for washing away the etching liquid adhering to the glass base material 50 for multiple chamfers is provided in the latter part of the etching chamber in the etching apparatus 300, the etching liquid removes the glass base material 50 for multiple chamfers. It is discharged from the etching apparatus 300 in the closed state.

  As an example of the method for bringing the etching solution into contact with the glass substrate 50 for multiple chamfering, as shown in FIG. 9A, the etching solution for the glass substrate 50 for multiple chamfering in each etching chamber 302 of the etching apparatus 300 And spray etching. Also, instead of spray etching, as shown in FIG. 9B, in the overflow type etching chamber 304, a configuration is employed in which the glass substrate for multiple chamfers 50 is transported while being in contact with the overflowing etching solution. Is also possible.

  Furthermore, as shown in FIG. 9C, a dip type etching is employed in which one or a plurality of multi-faceted glass base materials 50 contained in the carrier are immersed in the etching bath 306 containing the etching solution. It is also possible.

  In any case, it is important that the planned shape cutting line penetrates in the thickness direction during the etching process so that the multiple bevel glass base material 50 is not divided. Therefore, during the etching process (in particular, the latter half of the etching process), it is necessary to reduce the etching rate to control the etching amount accurately. In this embodiment, the etching process is performed at a slow speed of 3 μm / min or less by a thin hydrofluoric acid of 2 wt% or less, but the present invention is not limited to this method.

  If the etching rate is not slowed down in the entire etching process but is gradually delayed while adopting an earlier etching rate, it is possible to shorten the etching time. For example, it is preferable to adopt a configuration in which the concentration of hydrofluoric acid in the etching solution is reduced as it proceeds to the later stage of the etching apparatus 300.

  When the glass substrate for multiple chamfers 50 passes through the etching apparatus 300, the reforming line 20 is etched. In the modification line 20, the etchant penetrates faster than at other places, and the glass is dissolved along this line, so that the color filter substrate can be easily cut by the modification line 20. In addition, even when scratches and the like occur at the time of laser irradiation, the scratches easily disappear.

  When the etching process is completed, the pasted etching resistant film 16 is peeled off. Subsequently, in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 as shown in FIGS. 10A to 10C with respect to the glass substrate 50 for multiple beveling. A process of forming the terminal portion cutting groove 30 is performed. In this embodiment, the terminal cutting groove 30 is formed inside the area of the color filter substrate 14 facing the electrode terminal portion 122 of the color filter substrate 14 by the scribe wheel (wheel cutter) 250. The terminal portion cutting groove 30 is formed along the terminal portion cutting planned line in order to remove the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

  When the formation of the terminal portion cutting groove 30 by the scribing wheel 250 is finished, the process proceeds to the division of the multiple bevel glass base material 50 and the removal of the region facing the electrode terminal portion 122. In the glass substrate for multiple chamfers 50, the modification line 20 is formed by laser filament processing, and the modification line is further etched to modify the glass substrate for multiple chamfers 50 with only a slight mechanical pressure. It can be divided at the quality line 20. For example, as shown in FIG. 11, by applying a minute pressing force to the glass substrate for multiple chamfering 50 or giving a minute ultrasonic vibration, without staining the glass substrate for multiple chamfering 50, It is possible to divide.

  Despite this, since the etching process does not completely cut off, it is possible to prevent the occurrence of a defect that the end faces of the liquid crystal panel 10 separated during the etching collide with each other to be damaged. In addition, it is possible to carry the multi-faceted glass base material 50 in the incompletely cut state after the etching process (in the large size state). Furthermore, since the etching solution does not reach the electrode terminal portion, it becomes unnecessary to protect the electrode terminal portion by the masking agent having etching resistance. In addition, since the etching process is applied to at least the central portion of the end face of the liquid crystal panel 10, the strength (for example, bending strength) of the liquid crystal panel is higher than when the cutting is performed only by laser processing.

  12A to 12C show a schematic configuration of the liquid crystal panel 10 after division. As shown in the figure, the end face of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper width (L1 to L4 in FIG. 12C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a thickness of about 0.15 mm to 0.25 mm is 50 μm or less (mostly) It can be suppressed to 20 to 35 μm.

  As described above, when manufacturing the liquid crystal panel 10, the influence of the side etching hardly occurs, so that it is possible to design the multiple bevel glass base material 50 in which the liquid crystal panels 10 are arranged close to each other. For example, if there is a gap of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the multiple bevel glass base material 50 into a single liquid crystal panel 10.

  In the above-described embodiment, the overcoat (OC) film and the ITO film of the array substrate 12 and the color filter substrate 14 are not described for convenience of explanation, but they are not contaminated by the above process. Further, even the object to be treated (such as a liquid crystal panel) in which the overcoat (OC) film or the ITO film is not formed can be appropriately treated by the above-mentioned method.

  The above description of the embodiments should be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated not by the embodiments described above but by the claims. Further, the scope of the present invention is intended to include all modifications within the scope and meaning equivalent to the claims.

2-Glass panel 4-Glass substrate for multiple chamfering 6, 16-Etching resistant film 10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 20-Reforming line 30-Cutting groove for terminal part 50-Glass matrix for multiple chamfering Material 100-smartphone 122-electrode terminal portion 250-scribe wheel 300-etching apparatus 302, 304-etching chamber 306-etching tank

Claims (4)

A glass panel manufacturing method for obtaining a plurality of glass panels of a desired shape from a glass substrate for multiple chamfering for multiple chamfering of a glass panel, comprising:
Forming a transparent etching resistant layer having etching resistance on the surface of the multiple bevel glass substrate;
The transparent etching-resistant layer is removed along the shape cutting scheduled line by scanning the laser along the shape cutting planned line corresponding to the shape of the glass panel to be taken out, and the glass substrate for multiple chamfering is formed. A laser scanning step to form a reformed line of a nature susceptible to etching;
An etching step of etching the reforming line by bringing the multiple bevel glass substrate into contact with an etching solution after the laser scanning step;
At least including
The said transparent etching resistant layer is a 50 micrometers-100 micrometers thin transparent film, The glass panel manufacturing method characterized by the above-mentioned. A liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass base material having a plurality of chamfers for chamfering a liquid crystal panel formed by bonding an array substrate and a color filter substrate.
Forming a transparent etching resistant layer having etching resistance on the array substrate and the color filter substrate;
The transparent etching resistant layer is removed along the shape cutting scheduled line by scanning the laser along the shape cutting planned line corresponding to the shape of the liquid crystal panel, and the glass substrate for multiple beveling is etched. Laser scanning step to form a reforming line of easy nature;
An etching step of etching the reforming line by bringing the multiple bevel glass substrate into contact with an etching solution after the laser scanning step;
At least including
A method of manufacturing a liquid crystal panel, wherein the transparent etching resistant layer is a thin transparent film of 50 μm to 100 μm. In the laser scanning step, the transparent etching resistant layer is removed along the shape cutting scheduled line, and the modifying line is formed only on either the array substrate or the color filter substrate. The liquid crystal panel manufacturing method according to claim 2. In the laser scanning step, the transparent etching resistant layer is removed along the shape cutting scheduled line, and the reformed line is formed only on either the array substrate or the color filter substrate, and then the other is reversed. The transparent etching resistant layer is removed by scanning the laser from the side, and the reformed line is formed on either the array substrate or the color filter substrate, according to claim 2. Liquid crystal panel manufacturing method.

Images