CN112105984B - Method for manufacturing liquid crystal panel - Google Patents
Method for manufacturing liquid crystal panel Download PDFInfo
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- CN112105984B CN112105984B CN201980031999.7A CN201980031999A CN112105984B CN 112105984 B CN112105984 B CN 112105984B CN 201980031999 A CN201980031999 A CN 201980031999A CN 112105984 B CN112105984 B CN 112105984B
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- liquid crystal
- etching
- crystal panel
- glass base
- terminal portion
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 238000005530 etching Methods 0.000 claims description 89
- 239000007788 liquid Substances 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
Abstract
The method for manufacturing the liquid crystal panel at least comprises the following steps: a laser irradiation step of irradiating laser light along a predetermined line for cutting a shape corresponding to the shape of the liquid crystal panel in the glass base material (50) for obtaining a plurality of pieces, thereby forming a modified line (20) having a property of being easily etched; and a scribe line formation step of forming a scribe line by cutting a predetermined line along the terminal portion region with respect to the color filter substrate (14). The laser irradiation step includes: a normal operation mode when laser light is irradiated to a position not adjacent to the electrode terminal portion; and a condensed region adjustment mode when laser light is irradiated to a position adjacent to the electrode terminal portion. In the condensed region adjustment mode, the condensed region is adjusted so that the condensed region does not reach the intermediate layer.
Description
Technical Field
The present invention relates to a liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels of desired shapes from a plurality of glass base materials for obtaining.
Background
In general, when manufacturing a glass panel such as a liquid crystal panel or a glass cover plate, a process is performed in which a plurality of glass panels having a desired shape are obtained from a plurality of glass base materials for acquisition. For example, in the production of liquid crystal panels, a method (so-called multi-block acquisition) is widely used in which a plurality of liquid crystal panels are simultaneously produced from a set of glass base materials, and then the glass base materials are divided into individual liquid crystal panels. In addition, in the case of dividing a glass base material, a method such as scribe break (scribe break), laser ablation processing, and etching processing is often used.
However, in the case of using scribe breakage, it is difficult to form a glass panel having a circular profile. In addition, in the case of laser ablation processing, defects such as a slow processing speed or contamination due to ablation debris are likely to occur.
Accordingly, a technique of dividing a plurality of glass base materials for obtaining a plurality of glass panels by etching has been attracting attention. The etching process is used to obtain a glass cover plate having a desired shape, and recently, the etching process has been used also when obtaining a liquid crystal panel having a predetermined shape from a plurality of glass base materials for obtaining a plurality of liquid crystal panels formed by bonding an array substrate and a color filter substrate (for example, refer to patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication 2016-224201
Disclosure of Invention
Problems to be solved by the invention
However, in the etching treatment, in addition to the progress of etching in the thickness direction of the glass panel, undercut in which etching also progresses in the direction orthogonal thereto occurs. Therefore, in the etching treatment, it is difficult to form the cut surface of the glass panel substantially at right angles to the main surface. For example, in the case of performing a plurality of liquid crystal panels by etching, since it is necessary to provide a space between the liquid crystal panels in the glass base material in consideration of the influence of undercut progressing in a direction orthogonal to the thickness direction of the glass base material, there is a case where the plurality of liquid crystal panels are obtained with poor efficiency.
The invention aims to provide a method for manufacturing a liquid crystal panel, which can restrain the influence of side etching accompanied with etching treatment to the minimum.
Means for solving the problems
The present invention provides a method for manufacturing a liquid crystal panel, which is used for obtaining a plurality of liquid crystal panels with a predetermined shape from a plurality of glass base materials for obtaining a plurality of liquid crystal panels in which an array substrate and a color filter substrate are arranged to face each other with an intermediate layer interposed therebetween. As a typical example of the intermediate layer, a liquid crystal layer is given, but a void region not filled with liquid crystal is also included in the intermediate layer.
The liquid crystal panel manufacturing method at least comprises a laser irradiation step and a scribing groove forming step. In the laser irradiation step, laser light is irradiated along a shape-cutting line corresponding to the shape of the liquid crystal panel in the plurality of glass base materials for obtaining, thereby forming a modified line having a property of being easily etched in the plurality of glass base materials for obtaining along the shape-cutting line.
In the scribing groove forming step, a predetermined line forming scribing groove is cut along a terminal portion region for removing a region of the color filter substrate that faces the electrode terminal portion of the array substrate.
The laser irradiation step includes: a normal operation mode when laser light is irradiated to a position not adjacent to the electrode terminal portion; and a condensed region adjustment mode when laser light is irradiated to a position adjacent to the electrode terminal portion. In the condensed region adjustment mode, the condensed region is adjusted so that the condensed region does not reach the intermediate layer. In the light collecting region adjustment mode, for example, it is preferable to adjust an optical system such as a lens so as to shorten the light collecting region, or to displace the light collecting region away from the intermediate layer.
By adopting the method as described above, for example, the etching liquid is likely to permeate along the modification line, and the progress of the etching process is easy and short-time, so that the influence of undercut can be minimized.
When the laser beam is irradiated to a position adjacent to the electrode terminal portion, the condensed region of the laser beam does not reach the intermediate layer, and therefore, the energy of the laser beam is not transmitted to the intermediate layer. As a result, it is possible to prevent the terminal wiring pattern disposed in the electrode terminal portion from being melted and scattered by the energy of the laser beam or from generating a defect caused by heat in other portions of the electrode terminal portion.
In the above-described method for manufacturing a liquid crystal panel, the method preferably further includes: and an etching step of etching the modified wire by bringing the plurality of glass base materials for acquisition into contact with an etching liquid. By etching the modified line, the cutting groove can be formed along the shape-cutting scheduled line. The liquid crystal panel is divided along the shape-cutting lines by applying physical stress or thermal stress to the cutting grooves, for example, whereby a plurality of pieces of liquid crystal panels can be obtained.
In particular, since the laser light condensing region does not reach the intermediate layer at a position adjacent to the electrode terminal portion, it is possible to suppress occurrence of a defect such as corrosion of the terminal wiring or the like of the electrode terminal portion due to excessive penetration of the etching liquid in the vicinity of the electrode terminal portion.
In the case where a functional film that can be etched is formed on the array substrate or the color filter substrate, the following steps may be added: after the functional film is covered with a protective film or an etching resist layer having etching resistance, the protective film is patterned to provide an opening for exposing a portion to be etched such as a line to be cut.
By forming an opening in the etching resist film or the etching resist layer at a portion corresponding to the line to be cut, the modified line in the glass base material for a plurality of pieces of acquisition can be etched while protecting the functional film (for example, a protective film such as an overcoat layer, a transparent conductive film such as an ITO or an organic conductive film).
Effects of the invention
According to the present invention, in the liquid crystal panel manufacturing method, the influence of the undercut accompanying the etching process can be suppressed to the minimum. Further, it is possible to suppress occurrence of defects such as scattering of the terminal wiring pattern in the vicinity of the electrode terminal portion or corrosion of the terminal wiring due to excessive penetration of the etching liquid.
Drawings
Fig. 1 is a diagram showing a schematic configuration of a liquid crystal panel according to an embodiment of the present invention.
Fig. 2 is a diagram showing a schematic structure of a glass base material for multi-block acquisition including a plurality of liquid crystal panels.
Fig. 3 is a diagram showing steps included in one embodiment of a method for manufacturing a liquid crystal panel.
Fig. 4 is a diagram showing steps included in one embodiment of the glass panel manufacturing method.
Fig. 5 is an explanatory diagram of a normal operation mode and a condensed region adjustment mode at the time of laser irradiation.
Fig. 6 is a diagram showing steps included in one embodiment of a method for manufacturing a liquid crystal panel.
Fig. 7 is a diagram showing an example of an etching apparatus applied to the present invention.
Fig. 8 is a diagram showing a modification of the etching process applied to the present invention.
Fig. 9 is a schematic diagram showing scribing and breaking processing of a plurality of glass base materials for obtaining.
Fig. 10 is a schematic view of a multi-piece glass base material for obtaining after division.
Fig. 11 is a diagram showing the features of the structure of the liquid crystal panel.
Detailed Description
Hereinafter, an embodiment of a method for manufacturing a liquid crystal panel according to the present invention will be described with reference to the drawings. Fig. 1 (a) shows a schematic structure of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is formed by bonding an array substrate 12 and a color filter substrate 14 with an intermediate layer such as a liquid crystal layer interposed therebetween. The array substrate 12 and the color filter substrate 14 may have the same structure as that of a known structure, and thus, description thereof will be omitted here.
The array substrate 12 has electrode terminal portions 122, and the electrode terminal portions 122 are provided so as to extend from a region to be bonded to the color filter substrate 14. The electrode terminal portion 122 is connected to a plurality of circuits, and the liquid crystal panel 10 and the circuits are housed in a housing, thereby constituting, for example, the smartphone 100 shown in fig. 1 (B).
Next, an example of a method of manufacturing the liquid crystal panel 10 will be described. As shown in fig. 2 (a) and 2 (B), in general, the liquid crystal panel 10 is manufactured to include a plurality of pieces of glass base materials 50 for obtaining the liquid crystal panel 10. Then, the plurality of glass base materials 50 for acquisition are divided to obtain individual liquid crystal panels 10.
In this embodiment, for convenience, a process of forming a plurality of glass base materials 50 for acquisition, in which the transparent thin films (transparent conductive films such as ITO films and organic conductive films, or transparent protective films) 17 are formed on the surfaces of the 6 liquid crystal panels 10 arranged in a matrix of 3 rows and 2 columns, will be described. However, the number of liquid crystal panels 10 included in the glass base material 50 for obtaining a plurality of pieces is not limited thereto, and may be increased or decreased as appropriate.
As shown in fig. 3 a and 3B, the glass base material 50 for multi-block acquisition is first cut into the shape of the modified line 20 along a shape corresponding to the shape (outline) of the liquid crystal panel 10. The modified wire 20 is, for example, a thin wire array in which a plurality of thin wire layers are arranged, the thin wire layers being formed by beam pulses (beam diameter is about 1 to 5 μm) emitted from a pulse laser such as a picosecond laser or a femtosecond laser. For example, as shown in fig. 4 (a) and 4 (B), the modified wire 20 has a perforated line shape having a plurality of through holes or modified layers. The modified wire 20 has a property that it is easier to etch than other portions of the plurality of glass base materials 50 for obtaining. Of course, the shape of the modified wire 20 is not limited to this shape, and may take other shapes.
When the array substrate 12, the color filter substrate 14, and the transparent film 17 are simultaneously processed with one laser beam, there is a possibility that a defect occurs in the liquid crystal layer. Therefore, in the present embodiment, the occurrence of such a defect can be suppressed by employing laser processing as shown in fig. 3 (C) and 3 (D). That is, as shown in fig. 3 (C), it is preferable that the energy is not easily transmitted to the vicinity of the liquid crystal layer by irradiating the laser beam after performing focus adjustment and intensity adjustment so that only the modified line 20 is formed on the array substrate 12 from the array substrate 12 side. In this state, if the division of the glass base material 50 for multiple-piece acquisition can be performed by applying a physical action or a thermal action, the laser processing ends.
On the other hand, in the case where the plurality of glass base materials 50 for acquisition are difficult to be divided in this state, as shown in fig. 3 (D), it is preferable to irradiate laser light after focus adjustment and intensity adjustment are performed from the color filter substrate 14 side which is the opposite side so that only the modified line 20 is formed on the color filter substrate 14. By performing the processing shown in fig. 3 (D), although the number of steps of laser processing increases, the glass base material 50 for multiple-block acquisition can be easily divided while suppressing occurrence of defects in the liquid crystal layer.
The beam from the picosecond laser is controlled to have a condensing area that differs according to its mode of operation. For example, in this embodiment, the normal operation mode is used when the laser light is irradiated to a position not adjacent to the electrode terminal portion 122, and the condensed region adjustment mode is used when the laser light is irradiated to a position adjacent to the electrode terminal portion 122.
Fig. 5 (a) and 5 (B) show the laser irradiation state in the normal operation mode, and fig. 5 (C) and 5 (D) show the laser irradiation state in the condensed region adjustment mode. The normal operation mode is an operation mode used when laser light is irradiated to a position not adjacent to the electrode terminal portion 122. On the other hand, the condensed region adjustment mode is an operation mode used when the laser beam is irradiated to a position adjacent to the electrode terminal portion 122.
In either the normal operation mode or the condensed region adjustment mode, the focal point of the laser beam is located at the center of the array substrate 12 or the color filter substrate 14 in the thickness direction of the substrate being processed, and the condensed region thereof is controlled so as to fall within the range of the thickness of the substrate being processed. However, even when the focal point of the laser light is located at the center of the array substrate 12 or the color filter substrate 14 in the thickness direction of the substrate being processed, the laser light may be condensed in a region exceeding the thickness of the substrate being processed and spreading to the intermediate layer or the other substrate.
Therefore, as shown in fig. 5 (C) and 5 (D), in the condensed region adjustment mode, the condensed region is specifically adjusted so that the condensed region does not reach the intermediate layer. As a method of adjusting the light collecting region, there is a method of moving at least one of an optical system such as a laser head or an objective lens in a direction away from the plurality of glass base materials 50 for acquisition, or a method of selectively disposing an optical system for narrowing the light collecting region on the optical path of the laser beam.
When the laser beam is irradiated to a position adjacent to the electrode terminal 122, the condensed region is adjusted so as not to reach the intermediate layer, whereby the surrounding terminal wiring pattern of the electrode terminal 122 can be prevented from being melted and scattered. In addition, it is possible to prevent the terminal wiring from being corroded due to excessive penetration of the etching liquid during etching.
After the modified line 20 is formed along the shape-cutting line in the glass base material 50 for obtaining a plurality of pieces, the glass base material 50 for obtaining a plurality of pieces is stuck with the etching-resistant film 16 having etching resistance on both main surfaces as shown in fig. 6 (a) and 6 (B). Here, as the etching-resistant film 16, polyethylene having a thickness of 50 to 75 μm is used. However, the structure of the etching-resistant film 16 is not limited thereto. For example, if the glass etching composition has resistance to an etching liquid for etching glass, such as polypropylene, polyvinyl chloride, or an olefin resin, the glass etching composition may be appropriately selected and used.
After the completion of the adhesion of the etching resist film 16, as shown in fig. 6 (C), a predetermined line is cut along a shape corresponding to the shape of the liquid crystal panel 10 to be cut, and the etching resist film 16 is irradiated with a laser beam. By irradiation of the laser beam, the etching resist film 16 is removed along the shape-cutting predetermined line. Then, as a result of forming the opening of the etching resist film 16 along the shape-cut scheduled line, the forming position of the modified line 20 of the glass base material 50 for multiple pieces is exposed to the outside as in the structure shown in fig. 3 (C).
After the laser processing described above is completed, as shown in fig. 7, the glass base material 50 for multiple pieces of acquisition is introduced into an etching apparatus 300, and is subjected to etching treatment by an etching solution containing hydrofluoric acid, hydrochloric acid, or the like. In the etching apparatus 300, the etching treatment for the plurality of glass base materials 50 for acquisition is performed by bringing an etching liquid into contact with one or both surfaces of the plurality of glass base materials 50 for acquisition in an etching chamber while conveying the plurality of glass base materials 50 for acquisition by a conveying roller. Further, since the etching apparatus 300 is provided with a cleaning chamber for cleaning the etching liquid adhering to the plurality of glass base materials 50 for acquisition at a later stage of the etching chamber, the plurality of glass base materials 50 for acquisition are discharged from the etching apparatus 300 in a state where the etching liquid is removed.
As an example of a method of bringing the etching liquid into contact with the plurality of glass base materials 50 for obtaining, as shown in fig. 8 (a), spray etching in which the etching liquid is sprayed onto the plurality of glass base materials 50 for obtaining in each etching chamber 302 of the etching apparatus 300 is given. Instead of the shower etching, as shown in fig. 8 (B), a configuration may be adopted in which a plurality of glass base materials 50 for acquisition are conveyed in the overflow etching chamber 304 while being brought into contact with the overflowed etching liquid.
As shown in fig. 8 (C), the glass preform 50 for obtaining a plurality of pieces accommodated in the carrier may be immersed in the etching bath 306 accommodating the etching solution.
In either case, it is important that: during the etching process, the glass base material 50 for obtaining a plurality of pieces is prevented from being divided by the penetration of the line for cutting a shape in the thickness direction. Therefore, in the etching process (particularly, the latter half of the etching process), it is necessary to slow down the etching rate and accurately control the etching amount. In this embodiment, the etching treatment is performed at a slow rate of 3 μm/min or less by dilute hydrofluoric acid of 2 wt% or less, but the method is not limited thereto.
The time of the etching process can be shortened as long as the etching rate is not slowed down in the entire etching process but is initially adopted to be fast and gradually slowed down stepwise. For example, the following structure is preferably adopted: as the etching solution enters the rear stage of the etching apparatus 300, the concentration of hydrofluoric acid in the etching solution is reduced.
When the plurality of glass base materials 50 for acquisition pass through the etching apparatus 300, the modified wire 20 is etched. At the modified line 20, the etching liquid permeates more quickly than other portions, and the glass dissolves along the line, thereby making the color filter substrate easily cut by the modified line 20. In addition, when a flaw or the like is generated during laser irradiation, the flaw is liable to disappear.
After the etching treatment is completed, the adhered etching resist film 16 is peeled off. Next, as shown in fig. 9 (a) to 9 (C), the plurality of pieces of glass base materials 50 for acquisition are subjected to a process of forming the terminal portion cutting grooves 30 for removing the regions of the color filter substrate 14 facing the electrode terminal portions 122 of the array substrate 12. In this embodiment, the terminal portion cutting groove 30 is formed inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 by a scribing wheel (wheel cutter) 250. The terminal portion cutting groove 30 is formed along a terminal portion cutting predetermined line to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.
After the end of the formation of the terminal portion cutting groove 30 by the scribing wheel 250, the glass base material 50 for multiple-block acquisition is divided and the region facing the electrode terminal portion 122 is removed. In the multiple-piece glass preform 50, the modified wire 20 is formed by fine wire processing with a laser beam, and the modified wire is further etched, so that the multiple-piece glass preform 50 can be separated at the modified wire 20 with only a small mechanical pressure. For example, by applying a small pressing force or stretching force or applying a small ultrasonic vibration to the glass base materials 50 for multiple pieces of acquisition, as shown in fig. 10, the glass base materials 50 for multiple pieces of acquisition can be divided without being stained.
Since the liquid crystal panel 10 is not completely cut by the etching process, it is possible to prevent the occurrence of a defect such as breakage due to collision of the end faces of the liquid crystal panel 10 separated during the etching process. The glass base material 50 for multiple pieces (in a large-sized state) may be directly conveyed in a state of not being completely cut after the etching treatment. Further, since the etching liquid does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having corrosion resistance. Further, since the etching treatment is performed at least in the center portion of the end face of the liquid crystal panel 10, the strength (for example, bending strength) of the liquid crystal panel is higher than that in the case of cutting only by laser processing.
Fig. 11 (a) to 11 (C) show schematic structures of the divided liquid crystal panel 10. As shown in the figure, the end face of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper widths (L1 to L4 in fig. 11C) generated at the end surfaces of the array substrate 12 and the color filter substrate 14, which have plate thicknesses of about 0.15mm to 0.25mm, can be suppressed to 50 μm or less (in most cases, 20 to 35 μm).
In this way, since the liquid crystal panel 10 is hardly affected by the undercut, the plurality of glass base materials 50 for obtaining can be designed in which the liquid crystal panels 10 are arranged close to each other. For example, if there is a gap of about 10 μm in total in terms of the laser width of 2 μm+α, the glass base material 50 for multiple acquisition can be appropriately separated into individual liquid crystal panels 10.
The above description of embodiments should be considered in all respects as illustrative and not restrictive. The scope of the invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the invention is intended to include all changes which come within the meaning and range of equivalency of the appended claims.
Symbol description
10-liquid crystal panel
12-array substrate
14-color filter substrate
16-etch resistant film
17-transparent film
20-modified wire
30-terminal portion cutting groove
50-multiple glass base material for obtaining
100-smart phone
122-electrode terminal part
250-scribing wheel
300-etching device
302. 304-etching chamber
306-etching bath
Claims (2)
1. A liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels of a predetermined shape from a plurality of glass base materials for obtaining a plurality of liquid crystal panels in which an array substrate and a color filter substrate are arranged to face each other with an intermediate layer interposed therebetween, the liquid crystal panel manufacturing method comprising at least:
a laser irradiation step of irradiating laser light along a shape cutting scheduled line corresponding to the shape of the liquid crystal panel in the plurality of glass base materials for obtaining, thereby forming a modified line having a property of being easily etched on the plurality of glass base materials for obtaining along the shape cutting scheduled line; and
a scribe line forming step of forming a scribe line on the color filter substrate along a terminal portion region for removing a region of the color filter substrate that faces the electrode terminal portion of the array substrate,
the laser irradiation step includes: a normal operation mode when laser light is irradiated to a position not adjacent to the electrode terminal portion; and a condensed region adjustment mode when laser light is irradiated to a position adjacent to the electrode terminal portion,
in the condensed region adjustment mode, the condensed region is adjusted so that the condensed region does not reach the intermediate layer.
2. The method for manufacturing a liquid crystal panel according to claim 1, wherein,
the liquid crystal panel manufacturing method further includes: and an etching step of etching the modified wire by bringing the plurality of glass base materials into contact with an etching liquid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018112396A JP6578533B1 (en) | 2018-06-13 | 2018-06-13 | Liquid crystal panel manufacturing method |
| JP2018-112396 | 2018-06-13 | ||
| PCT/JP2019/021217 WO2019239889A1 (en) | 2018-06-13 | 2019-05-29 | Liquid crystal panel manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112105984A CN112105984A (en) | 2020-12-18 |
| CN112105984B true CN112105984B (en) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201980031999.7A Active CN112105984B (en) | 2018-06-13 | 2019-05-29 | Method for manufacturing liquid crystal panel |
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| Country | Link |
|---|---|
| JP (1) | JP6578533B1 (en) |
| CN (1) | CN112105984B (en) |
| TW (1) | TWI804634B (en) |
| WO (1) | WO2019239889A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110764299A (en) * | 2019-10-29 | 2020-02-07 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and display module preparation method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN112105984A (en) | 2020-12-18 |
| JP6578533B1 (en) | 2019-09-25 |
| JP2019215439A (en) | 2019-12-19 |
| TW202006431A (en) | 2020-02-01 |
| WO2019239889A1 (en) | 2019-12-19 |
| TWI804634B (en) | 2023-06-11 |
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