JP2019159178A - Liquid crystal panel and manufacturing method for liquid crystal panel - Google Patents

Abstract

To provide a manufacturing method for a liquid crystal panel having a contour consisting of a curved part and a linear part while suppressing the effect of side etching to a possible minimum.SOLUTION: The manufacturing method for a liquid crystal panel includes at least a laser scan step, an etching step, a scribe step, and a dividing step. In the laser scan step, a modification line 20 is formed on a predetermined shape cutting line corresponding to the shape of a liquid crystal panel 10 to be extracted. In the etching step, a curved line shaped cutting groove is formed in the modification line 20 by performing an etching process while taking care not to cut an array substrate 12 and a color filter substrate 14. In the scribe step, a scribe groove is formed in the linear part of the predetermined shape cutting line. In the dividing step, a glass matrix for multiple piece formation is divided utilizing the curved line shaped cutting groove and the scribe groove.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity for multi-planarizing a liquid crystal panel formed by bonding an array substrate and a color filter substrate.

  Generally, when manufacturing liquid crystal panels, a method (so-called multi-sided) is widely used in which a plurality of liquid crystal panels are manufactured simultaneously with a pair of glass base materials, and then the glass base material is divided into a single liquid crystal panel. It has been. And, when the glass base material is divided, a scribe break is often used.

  However, when the scribe break is employed, it is difficult to form a glass panel having a rounded outline or a glass panel having a notch. In recent years, in order to improve the design, the use of liquid crystal panels including a curved region in the contour has increased, and it has been difficult to cope with scribe breaks.

  Accordingly, a technique for obtaining a plurality of glass panels by dividing a multi-chamfered glass base material by an etching process has been attracting attention. Etching has come to be used to obtain a cover glass having a desired shape, and recently, a predetermined number of glass substrates for multi-surfaces for multi-sided liquid crystal panels formed by bonding an array substrate and a color filter substrate are used. Etching is also used when obtaining a plurality of liquid crystal panels having a shape (see, for example, Patent Document 1).

  In addition, there is a method of processing a liquid crystal panel including a curved region by using laser ablation processing (see, for example, Patent Document 2). By scanning the laser beam along the shape of the liquid crystal panel, it is possible to take out the liquid crystal panel along a desired shape planned line even when a curved portion is included.

Japanese Unexamined Patent Publication No. 2016-224201 JP 2009-066664 A

  However, in the etching process, in addition to the etching progressing in the thickness direction of the glass panel, side etching occurs in which the etching proceeds in the direction orthogonal to the thickness direction. For this reason, in the etching process, it becomes difficult to form the cut surface of the glass panel so as to be substantially perpendicular to the main surface. For example, when liquid crystal panels are chamfered by etching, it is necessary to provide a space between each liquid crystal panel in the glass base material in consideration of the influence of side etching that proceeds in a direction perpendicular to the thickness direction of the glass base material. As a result, the multi-chamfering efficiency may deteriorate.

  Further, in the case of laser ablation processing, problems such as contamination due to ablation debris easily occur. In addition, the laser beam must be scanned a plurality of times along the planned shape line of the liquid crystal panel, and the processing time increases as the shape becomes complicated, so that the production efficiency is inferior compared to the scribe processing or the like.

  The objective of this invention is providing the liquid crystal panel manufacturing method which has the outline which consists of a curved part and a linear part.

  The liquid crystal panel manufacturing method according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a multi-chamfering glass base material for multi-plying a liquid crystal panel formed by bonding an array substrate and a color filter substrate. This liquid crystal panel manufacturing method includes at least a laser scanning step, an etching step, a scribe step, and a dividing step.

  In the laser scanning step, laser scanning is performed on a part or all of the curved line portion of the shape cutting planned line corresponding to the shape of the liquid crystal panel to be taken out and including the straight line portion and the curved portion. A modified line having a property of being easily etched is formed in the glass substrate for chamfering. As a typical example of the method for forming the modified line, filament processing by a picosecond laser or a femtosecond laser can be cited. The width of the reforming line is preferably set to approximately 10 μm or less. Note that the shape cutting planned line is interpreted not only to be continuous with the contour portion of the liquid crystal panel but also includes a shape corresponding to the shape of a through hole or the like formed inside the contour portion.

  In the etching step, a curved cut groove is formed by performing an etching process on the multi-chamfer glass base material so that the array substrate and the color filter substrate are not cut in the modification line. As the etching process progresses, the curved cutting groove may penetrate in the thickness direction of the glass substrate for multi-chamfering, so the state of the shape cutting planned line is confirmed at a slow etching rate of 10 μm / min or less. However, it is preferable to perform the etching process.

  In the scribe step, a scribe groove is formed in the straight line portion of the shape cutting planned line. As a typical example of the technique for forming the scribe groove, there is a process using a scribe wheel.

  In the dividing step, the multi-chamfer glass base material is divided using the curved cutting grooves and the scribe grooves. The liquid crystal panel formed on the multi-face glass substrate is substantially cut at the curved cut grooves and scribe grooves. In practice, the central part of the multi-chamfer glass base material in the thickness direction is not divided, but cracks progress in the thickness direction from the bottom of the curved cut and scribe grooves by applying a slight stress. The multi-chamfer glass base material can be completely cut.

  In the present invention, among the planned cutting lines, the curved portion is processed by a combination of laser scanning and etching processing, and the straight portion is processed by scribe processing. Therefore, it is possible to process a liquid crystal panel having a shape that is difficult to process with a conventional scribe break. Further, by limiting the region where the laser treatment and the etching treatment are performed to the curved portion, it is possible to reduce the processing time of the laser scanning and the consumption of the etching solution. In addition, since the region where the modified line is formed is easier to etch in the plate thickness direction, the effect of side etching can be suppressed compared to the case of normal isotropic etching treatment. become.

  The liquid crystal panel manufacturing method according to the present invention may further include a protective film attaching step and a patterning step after the laser scanning step. In the protective film attaching step, a protective film is attached to the multi-chamfer glass base material. In the patterning step, the position corresponding to the modification line in the protective film is removed. On the main surface of the glass substrate for multiple surfaces, an overcoat layer, a transparent conductive film formed of ITO, an organic conductive film, or the like may be formed. Since such a functional film does not have resistance to the etching solution, it needs to be protected with a protective film. Further, in order to form a curved cut groove, a patterning process for removing the protective film is performed at least in a region corresponding to the reforming line. The patterning process can be performed by laser scanning, for example. Moreover, after a protective film is affixed on the glass substrate for multi-faces, the formation of the reforming line and the patterning of the protective film may be performed simultaneously.

  The liquid crystal panel manufacturing method according to the present invention may further include a rectangular cutting step and a shape forming step. In the rectangular cutting step, after the etching step, the multi-chamfered glass base material is cut into a rectangular liquid crystal panel along the scribe groove. In the shape forming step, the region where the modification line is formed is removed from the rectangular liquid crystal panel. When the region where the curved cutting groove is formed has a complicated shape, there is a possibility that burrs or cracks may be generated in the divided cross section, or that the crack may progress in an unexpected direction at the time of dividing. For this reason, by temporarily cutting the rectangular liquid crystal panel along the scribe groove and then removing the region by forming the reforming line, it is possible to obtain a favorable end face shape and to prevent the strength of the liquid crystal panel from being reduced. .

  Further, the liquid crystal panel may include a notch in the curved portion of the shape cutting planned line. In this case, the reforming line is formed at least in the notch. Liquid crystal panels with cutouts are being studied due to functional or design reasons, but the cutouts are particularly difficult to cut with a scribe, so the modified lines and curved cut grooves are By forming it, it becomes possible to manufacture a liquid crystal panel suitably.

  According to the present invention, it is possible to efficiently manufacture a liquid crystal panel having a curved portion and a straight portion in the contour.

It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfering containing a some liquid crystal panel. It is a figure which shows the outline of the laser processing with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the modification | reformation line formed in the glass base material for multiple chamfering. It is a figure which shows the outline of affixing of the protective film to the glass base material for multiple chamfering, and laser processing. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the curvilinear cutting groove formed in the glass base material for multi-faces. It is a figure which shows the outline of the peeling process of a protective film, and the formation process of a scribe groove | channel. It is a figure which shows the outline of the process of parting a liquid crystal panel from the glass base material for multiple chamfering. It is a figure which shows the outline of the process of parting a rectangular-shaped liquid crystal panel. It is a figure which shows the outline of the process of removing a glass piece from the notch part of a liquid crystal panel. It is a figure which shows the outline of the end surface of the liquid crystal panel processed by this embodiment.

  1A and 1B show a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that an array substrate 12 and a color filter substrate 14 are bonded together with a liquid crystal layer 16 interposed therebetween. Since the configurations of the array substrate 12 and the color filter substrate 14 can be the same as known configurations, the description thereof is omitted here.

  The liquid crystal panel 10 has a notch 24 formed in a part of its contour. The cutout portion 24 is a region cut out in a substantially U shape from the outline toward the inside of the liquid crystal panel 10. The shape of the notch is not limited to this, and may be appropriately changed to a circular arc shape, a V shape, a through hole shape, a through hole formed in the display area of the liquid crystal panel 10, or the like. Is possible. Furthermore, the corner portions 22 at the four corners of the liquid crystal panel 10 have rounded shapes. The array substrate 12 has an electrode terminal portion 122 provided so as to extend from a region bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and these electric circuits are housed in a housing, whereby, for example, a smartphone 100 as shown in FIG. Is done. In this configuration, the speaker 110 of the smartphone 100, the camera lens 112, wiring to each part, and the like are arranged in the region where the notch 24 is formed. By arranging the speaker 110 and the camera lens 112 in the cutout portion 24, an image can be displayed on almost the entire surface of the smartphone 100, and the functionality and design are improved.

  Next, an example of a method for manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 2A and 2B, the liquid crystal panel 10 is generally manufactured as a multi-chamfering glass base material 50 including a plurality of them, and the multi-chamfering glass base material 50 is divided. By doing so, a single liquid crystal panel 10 is obtained. In this embodiment, for the sake of convenience, a description will be given of processing for a multi-chamfer glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns. However, the liquid crystal panel included in the multi-chamfer glass base material 50 The number of 10 can be increased or decreased as appropriate. A transparent thin film 18 is formed on the main surface of the multi-chamfer glass base material 50. The transparent thin film 18 is a transparent conductive film such as an ITO film or an organic conductive film.

  In order to take out the liquid crystal panel 10 from the multi-face glass substrate 50, first, as shown in FIGS. 3A and 3B, the multi-face glass base material 50 is irradiated with a laser beam. Thus, the reforming line 20 is formed. In this embodiment, among the planned cutting lines corresponding to the contour shape of the liquid crystal panel 10, the reforming line 20 is formed while the transparent thin film 18 is removed at the corners 22 and the notches 24 at the four corners. . The reason why the reforming line 20 is formed in the corner portion 22 and the notch portion 24 is that the curved regions such as the corner portion 22 and the notch portion 24 are difficult to cut by a known scribe break, and even if they can be cut, the end face This is because fine scratches are generated, which causes a reduction in strength of the liquid crystal panel 10. In particular, since the notch 24 has a shape in which stress concentration is likely to occur, it is necessary to perform a cutting process so as not to cause a decrease in strength. On the other hand, the straight region can be easily divided by a scribe break, and stress concentration hardly occurs. Further, by limiting the region where the reforming line is formed, it is possible to shorten the processing time of laser scanning. In addition, in order to suppress a shift in a connection region between a scribe line, which will be described later, and a groove formed by etching, a modified line may be formed also in a straight portion connected to the curved portion. In this case, the reforming line 20 is formed in a range that does not significantly affect the processing time.

  The modification line 20 is, for example, a filament array in which a plurality of filament layers formed by a light beam pulse (a beam diameter of about 1 to 5 μm) irradiated from a pulse laser such as a picosecond laser or a femtosecond laser is arranged. . In this embodiment, the reforming line 20 has a plurality of through holes or cracks formed in the thickness direction as shown in FIG. The reforming line 20 has a property that it is more easily etched than other portions of the multi-chamfer glass base material 50. Of course, the shape of the reforming line 20 is not limited to such a shape, and any shape may be used as long as it has a property of being easily etched.

  The light beam from the pico laser has a depth of focus deeper than a range including at least both the array substrate 12 and the color filter substrate 14. For this reason, the modification line 20 for dividing the liquid crystal panel 10 is formed simultaneously on both the array substrate 12 and the color filter substrate 14. In principle, it is possible to process both the array substrate 12 and the color filter substrate 14 with one laser at the same time. However, if this causes a problem in the liquid crystal layer 16, the array substrate 12 from the array substrate 12 side is used. After forming the reforming line 20 only on the color 12, the reforming line 20 may be formed only on the color filter substrate 14 from the color filter substrate 14 side. By performing such processing, the number of laser scanning steps increases, but it becomes easy to suppress the occurrence of defects in the liquid crystal layer 16. In addition, the division process can be easily performed by forming the reforming line 20 along the entire area of the array substrate 12 and the color filter substrate 14 in the thickness direction. It is also possible to appropriately adjust the formation region of the quality line 20.

  After forming the reforming line 20, both main surfaces of the glass substrate 50 for multi-chamfering are covered with the protective film 26. The protective film 26 has resistance to at least an etching solution described later, and plays a role of protecting the glass substrate 50 for multiple surfaces and the transparent thin film 18. Here, polyethylene having a thickness of 50 to 75 μm is adopted as the protective film 26. However, the structure of the protective film 26 is not limited to this. For example, any material having resistance to an etching solution for etching glass, such as polypropylene, polyvinyl chloride, and olefin resin, can be appropriately selected and employed.

  When the application of the protective film 26 is completed, subsequently, as shown in FIG. 5B, the protective film 26 is scanned with a laser beam along the region where the modified line 20 is formed. By the scanning of the laser beam, the protective film 26 is removed at the corner portion 22 and the cutout portion 24. And the opening part of the protective film 26 will be formed, As a result, as shown in FIG.5 (C), the formation position of the modification | reformation line 20 of the glass base material 50 for multiple faces is exposed outside. become.

  In this embodiment, the protective film 26 is pasted and patterned after the reforming line 20 is formed, but the present invention is not limited to this order. For example, the protective film 26 may be patterned at the same time as the formation of the reforming line 20 after the protective film 26 is attached to the multi-chamfer glass substrate 50. In this case, it is necessary to adjust the output of the laser beam, the focal length, and the like so that the glass substrate can be sufficiently modified in the curved region while removing the protective film 26.

  When the laser scanning on the protective film 26 is finished, as shown in FIG. 6, the multi-chamfered glass base material 50 is introduced into the etching apparatus 300 and is subjected to an etching process with an etching solution containing hydrofluoric acid and hydrochloric acid. . In the etching apparatus 300, the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted. An etching process for 50 is performed. In addition, since a cleaning chamber for washing away the etchant adhering to the multi-surface glass base material 50 is provided in the subsequent stage of the etching chamber in the etching apparatus 300, the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.

  As an example of a method for bringing an etching solution into contact with the multi-chamfering glass base material 50, as shown in FIG. 7A, an etching solution is applied to the multi-chamfering glass base material 50 in each etching chamber 302 of the etching apparatus 300. Spray etching for spraying. Further, instead of spray etching, as shown in FIG. 7B, an overflow type etching chamber 304 adopts a configuration in which the multi-chamfer glass base material 50 is conveyed while being in contact with the overflowed etching solution. Is also possible.

  Furthermore, as shown in FIG. 7C, dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.

  In any case, it is important that the region where the modified line 20 is formed penetrates in the thickness direction during the etching process so that the multi-chamfer glass base material 50 is not divided. is there. If a part of the modification line 20 penetrates the array substrate 12 or the color filter substrate 14 during the etching process, the etching solution enters the liquid crystal panel 10. For this reason, during the etching process (particularly in the latter half of the etching process), it is necessary to slow the etching rate and accurately control the etching amount. In this embodiment, the etching process proceeds at a slow rate of 10 μm / min or less with 2% by weight or less of thin hydrofluoric acid, but the present invention is not limited to this method.

  If the etching rate is not slowed down in the whole etching process but is gradually reduced while adopting a faster etching rate at the beginning, it is possible to shorten the etching process time. For example, it is preferable to employ a configuration in which the hydrofluoric acid concentration in the etching solution is sequentially reduced within a range of about 1 to 10% by weight as the process proceeds to the subsequent stage of the etching apparatus 300.

  When the multi-chamfer glass base material 50 passes through the etching apparatus 300, the modified line 20 is etched, so that even if scratches or the like are generated during laser irradiation, the scratches are likely to disappear. Further, in the modified line 20, the etching solution penetrates faster than other portions, so that the etching amount increases in the depth direction of the glass substrate than in the width direction. FIG. 8 shows a cross section of the cutting groove 28 formed by the etching process. The cutting groove 28 is formed by etching the region where the modified line 20 is formed. Unlike the groove formed by the normal etching process, the cut groove 28 has an aspect ratio in the depth direction with respect to the width direction. For this reason, the cut groove 28 can be formed without affecting the liquid crystal panel 10 even if the glass substrate 50 for multiple chamfering is such that the liquid crystal panels are adjacent to each other. The cutting groove 28 is formed in the array substrate 12 or the color filter substrate 14 so as not to penetrate completely in the thickness direction. At this time, it is preferable to adjust the thickness of the lower portion of the cutting groove 28 to be 100 μm or less. When the plate thickness of the unetched portion exceeds 100 μm, it may be difficult to divide the liquid crystal panel 10 in the below-described dividing process.

  The protective film 26 is removed from both main surfaces of the etched multiple-surface glass base material 50. When removing the protective film 26, the protective film 26 is lifted by using physical force at one of the four corners of the multi-chamfering glass base material 50, and then the protective film 26 is placed on the multi-chamfering glass base material 50. It can peel by pulling toward the diagonal direction of (refer FIG. 9 (A)). At this time, since the patterning region of the protective film 26 is only the corner portion 22 and the notch portion 24, the problem that the protective film 26 breaks during peeling is unlikely to occur.

  The multi-chamfered glass base material 50 from which the protective film 26 has been peeled has a scribe groove 62 formed at a straight line portion of the shape cutting planned line. The scribe groove 62 is formed by scanning the scribe wheel 60 along the straight line portion. Similarly to the cutting groove 28, the scribe groove 62 is formed so as not to penetrate in the thickness direction. Alternatively, the multi-chamfered glass base material 50 may be cut at the straight portion of the shape cutting planned line by completely penetrating the scribe groove 62 in the plate thickness direction. By setting the width of the scribe groove 62 to 10 μm or less, even the multi-chamber glass base material 50 to which the liquid crystal panel 10 is adjacent can be suitably processed. Simultaneously with the formation of the scribe groove 62, a terminal cutting groove 64 is formed in order to remove the color filter substrate 14 in a region facing the electrode terminal portion 122. The terminal cutting groove 64 is formed so as not to penetrate in the thickness direction in the color filter substrate 14.

  After forming the scribe groove 62 and the terminal cutting groove 64, the liquid crystal panel 10 is separated from the multi-chamfered glass base material 50. By applying mechanical stress to the cutting groove 28 and the scribe groove 62, a crack progresses in the vertical direction from the lower part of the cutting groove 28 and the scribe groove 28, and the liquid crystal panel 10 is divided along the shape cutting planned line. . Similarly to the division of the liquid crystal panel 10, a part of the color filter substrate 12 in a region facing the electrode terminal portion 122 can be removed by applying stress to the terminal cutting groove 64. The liquid crystal panel 10 is used in a device such as the smartphone 100 after being appropriately processed in a subsequent process.

  In the present embodiment, the laser processing time is limited by limiting the laser processing region to a curved region that is difficult to scribe, such as the corner portion 22 and the notch portion 24, among the planned cutting lines of the liquid crystal panel 10. It is possible to shorten. In addition, since the straight portion of the shape cutting planned line is in an unprocessed state even after the etching process, the liquid crystal panel 10 of the liquid crystal panel 10 is removed when the multi-chamfered glass base material 50 after the etching process is transported or when the protective film 26 is removed. The problem that the end faces come into contact with each other and are damaged is prevented.

  In another embodiment of the present invention, the glass substrate for multi-face 50 subjected to the etching process may be temporarily divided as a rectangular liquid crystal panel 101. In this case, as shown in FIG. 11A, the rectangular liquid crystal panel 101 is separated from the multi-chamfered glass base material 50 after the etching process. The rectangular liquid crystal panel 101 is cut into a rectangular shape without performing separation of the corner portion 22 and the notch portion 24 from the liquid crystal panel 10 by performing a scribe break along the straight line portion of the shape cutting planned line. Then, a part of the color filter substrate 12 corresponding to a region facing the corner portion 22 and the electrode terminal portion 122 is removed from the rectangular liquid crystal panel 101. As described above, the region where the cutting groove 28 and the terminal cutting groove 64 are formed can be separated from the rectangular liquid crystal panel 101 by applying a slight stress.

  Although the glass substrate inside the notch 24 can be removed by the same method, the notch 24 has a shape in which stress concentration is likely to occur, so that burrs and fine scratches are generated on the end surface. It is necessary to avoid as much as possible. Moreover, since it is a complicated shape, a crack may progress to an unexpected region at the time of division. For this reason, it is necessary to pay more attention to the separation process than the corner portion 22 or the like. In such a case, it is preferable to remove the array substrate 12 and the color filter substrate 14 from the notch 24 using the ultrasonic cutting tool 70.

  The ultrasonic cutting tool 70 includes a horn 72, and the horn 72 is configured to vibrate finely in response to ultrasonic vibration generated from an ultrasonic transducer (not shown). The frequency of the ultrasonic vibration applied to the horn 72 is adjusted by the type and thickness of the glass substrate, but is preferably in the range of 20 kHz to 25 kHz. When the glass substrate in the notch 24 is removed, as shown in FIG. 12A, the tip of the horn 72 is made into the notch 24 so as not to affect the product area of the liquid crystal panel 10. Only contact the corresponding area. This is because when the horn 72 comes into contact with the glass substrate corresponding to the product area of the liquid crystal panel 10, fine scratches may occur on the glass substrate. When the cutout portion 24 is processed, the horn 72 does not need to be brought into contact with the reforming line 20 but may be brought into contact with the region surrounded by the reforming line 20. The tip shape of the horn 72 is preferably changed according to the shape of the notch 24. In this embodiment, the array substrate 12 and the color filter substrate 14 are removed by bringing the ultrasonic cutting tool 70 into contact with the color filter substrate 14. However, after the array substrate 12 is removed, the liquid crystal panel 10 is inverted. The color filter substrate 14 may be removed. Moreover, when processing the notch part 24, it is preferable to carry out in the state which does not support the notch part 24 from the downward direction. When processing is performed with the notch 24 placed on a processing stage or the like, vibration from the horn 72 is absorbed by the processing stage, making it difficult to remove the glass substrate.

  Further, in order to facilitate the removal of the array substrate 12 and the color filter substrate 14 in the region corresponding to the notch 24, an auxiliary line 210 is provided in the region of the notch 24 as shown in FIG. It may be formed. The auxiliary line 210 is formed by forming a modified portion on the array substrate 12 and the color filter substrate 14 by irradiating a laser pulse when the modified line 20 is formed, and then performing an etching process in the same manner as the modified line 20. Is done. By forming the auxiliary line 210, the strength in the notch 24 can be reduced, so that the array substrate 12 and the color filter substrate 14 can be more easily removed. In this embodiment, the two auxiliary lines 210 are formed so as to vertically cross in the region of the notch 24, but the shape of the auxiliary line 210 is not limited to this.

  As the ultrasonic vibration is propagated in the notch 24, the crack progresses in the vertical direction from the lower part of the cutting groove 28, and the glass piece in the notch 24 can be removed. Furthermore, since the ultrasonic cutting tool 70 can remove the glass piece inside the notch 24 without coming into contact with the sectional surface, no chipping or the like occurs on the end face. For this reason, in the liquid crystal panel 10, a decrease in strength (for example, bending strength) is suppressed.

  In this embodiment, the corner portion 22 and the cutout portion 24 are processed after the rectangular liquid crystal panel 101 is divided. However, the processing order can be appropriately changed. For example, a scribe break may be performed after removing the corner portion 22 and the cutout portion 24. If the liquid crystal panel 10 is subjected to ultrasonic vibration for a long time, the liquid crystal element or the like may be affected. Therefore, the processing using ultrasonic vibration is a notch portion that is difficult to process only by applying a pressing force. It is preferable to limit to 24 only.

  FIG. 13A to FIG. 13C show a schematic configuration of the end face of the liquid crystal panel 10 after division. FIG. 13A shows an end surface of the cutout portion 24 after being divided. The end face of the notch 24 has an inclined part 80 and a vertical part 82. The inclined portion 80 is an end surface region that is inclined outward from the main surfaces of the array substrate 12 and the color filter substrate 14. The inclined portion 80 has, for example, taper widths (L1 and L2 in FIG. 13A) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a thickness of about 0.15 mm to 0.25 mm. , And preferably 50 μm or less (mostly 20 to 35 μm). By controlling to such a taper width, the influence of side etching hardly occurs, so that it is possible to design a multi-chamber glass base material 50 in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10.

  The vertical portion 82 is a region connected to the inclined portion 80 in the center portion in the thickness direction on the end surface. The vertical portion 82 is formed in a direction perpendicular to the main surface of the liquid crystal panel 10. The length of the vertical portion 82 is preferably 100 μm or less. This is because if the length of the vertical portion 82 exceeds 100 μm, it becomes difficult to remove the glass substrate in the cutout portion 24.

  On the end face of the notch 24, linear concave portions 84 that are perpendicular to the thickness direction of the inclined portion 80 and the vertical portion 82 are formed at equal intervals. The linear recess 84 is formed by etching the modified line 20. The width of the linear recess 84 formed in the inclined portion 80 is larger than the width of the linear recess 84 formed in the vertical portion 82. Further, the inclined portion 80 has a wedge shape in which the width of the linear recess 84 gradually decreases from the main surface side toward the center portion in the plate thickness direction. This is because the inclined portion 80 is etched in the region where the modified line 20 is formed. For this reason, the end surface shape is a gentle wave shape in which the unevenness is repeated, and the strength reduction of the liquid crystal panel 10 can be suppressed. The end surface shape of the corner portion 22 is substantially the same as the end surface shape of the cutout portion 24.

  Note that the straight regions and the end face shapes of the terminal cutting grooves 64 in the shape cutting schedule are perpendicular to the main surface of the liquid crystal panel 10 as shown in FIG. In addition, scribe marks 86 are formed on the surface side of the array substrate 12 and the color filter substrate 14.

  In the above-described embodiment, the protective film 26 is used to protect the transparent thin film 18. However, in the aspect in which the transparent thin film 18 is not formed, it is not always necessary to attach the protective film 26. In that case, the multi-chamber glass base material 50 may be etched after the reforming line 20 is formed in a desired region. Although the multi-chamfer glass base material 50 is thinned as a whole, no particular problem occurs in the liquid crystal panel 10, so that the liquid crystal panel 10 is divided by dividing the liquid crystal panel 10 by the above-described method. Manufactured.

  The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 16-Liquid crystal layer 18-Transparent conductive film 20-Modification line 22-Corner part 24-Notch part 26-Protective film 28-Cutting groove 80-Inclined part 82 -Vertical part 84-Linear recessed part 50-Multi-chamfer glass base material 122-Electrode terminal part

Claims (7)

A method for producing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multiple chamfering for multi-planarizing a liquid crystal panel formed by laminating an array substrate and a color filter substrate,
By scanning the laser on a part or all of a curved line portion of a shape cutting planned line corresponding to the shape of the liquid crystal panel to be taken out and comprising a straight line portion and a curved portion, A laser scanning step to form a modified line that is easily etched into the material;
An etching step for forming a curved cut groove by performing an etching process while preventing the array substrate and the color filter substrate from being cut in the modified line with respect to the glass substrate for multi-faces,
A scribe step of forming a scribe groove in a straight line portion of the shape cutting planned line;
A dividing step of dividing the multi-chamfered glass base material using the curved cutting groove and the scribe groove;
A liquid crystal panel manufacturing method comprising at least After the laser scanning step, a protective film affixing step for affixing a protective film to the multi-chamfered glass base material,
A patterning step of removing a position corresponding to the modified line in the protective film;
The liquid crystal panel manufacturing method according to claim 1, further comprising: Further comprising a protective film sticking step of sticking a protective film on the glass substrate for multiple chamfering,
2. The liquid crystal panel manufacturing method according to claim 1, wherein in the laser scanning step, a position corresponding to the modified line in the protective film is removed simultaneously with the formation of the modified line. After the etching step, along the scribe groove, a rectangular cutting step of cutting the multi-chamfered glass base material into a rectangular liquid crystal panel;
The liquid crystal panel manufacturing method according to claim 1, further comprising: a shape forming step of removing a region outside the reforming line from the rectangular liquid crystal panel.   The liquid crystal panel includes a notch in a curved portion of the shape cutting planned line, and the reforming line is formed at least in the notch. 2. A method for producing a liquid crystal panel according to item 1. In a liquid crystal panel in which a liquid crystal layer is sandwiched between an array substrate and a color filter substrate, and an outer peripheral end surface of the array substrate and the color filter substrate includes a linear portion and a curved portion,
The outer peripheral end surface in the straight portion includes a vertical portion formed perpendicular to the main surface of the liquid crystal panel,
The outer peripheral end surface of the curved portion is disposed between the inclined portion that is inclined outward from the main surface side in the plate thickness direction toward the center portion, and the inclined surface at the central portion in the plate thickness direction, and is the main surface of the liquid crystal panel And a central part formed perpendicularly to the liquid crystal panel.   7. The liquid crystal panel according to claim 6, wherein the outer peripheral end surface of the curved portion is formed with a recess along the thickness direction in the inclined portion and the central portion.

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