JP2005164798A - Method for manufacturing display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display panel with which the display panel is made thin and productivity thereof is increased by accurately forming scribe grooves for partition even when the display panel is large-sized and uses thinned substrates. <P>SOLUTION: A layer pattern 10, on which a region 7a to be partitioned of a panel 7 is exposed, is formed at least on a principal surface of the panel 7 constructed by bonding a TFT substrate 1 (a first substrate) and a counter substrate 2 (a second substrate) to each other. Next, parting grooves 11 are formed on the panel 7 by etching from above the layer pattern 10. In this case, the layer pattern is also simultaneously etching removed. Furthermore, the panel 7 is made to become a thin film by etching the panel 7. Subsequently, the panel 7 is partitioned along the parting grooves 11 into respective display panel parts 1a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a display panel manufacturing method, and more particularly to a display panel manufacturing method including a step of dividing a single panel into a plurality of display panels.

  In the manufacturing process of a display panel used for a liquid crystal display device, an organic EL display device, etc., for the purpose of improving productivity, a plurality of display panel portions are formed in a large panel, and this large display panel is obtained at an appropriate timing. Multi-chamfering is performed to divide the screen into a plurality of display panel portions.

  For example, in the manufacture of a display panel constituting a liquid crystal display device, first, a TFT substrate in which a thin film transistor is formed on each display panel portion on a large glass substrate and covered with an alignment film is manufactured. Further, a counter substrate is formed by forming a counter electrode on a glass substrate having the same size as the TFT substrate and covering it with an alignment film. Then, the TFT substrate and the counter substrate are arranged in a state where the respective alignment films face each other, and a panel is produced in which these substrates are bonded to each other while maintaining a gap at a predetermined interval through which liquid crystal is injected. The panel is then divided into respective display panel sections. Thereafter, liquid crystal is injected into the gap between the TFT substrate and the counter substrate in each divided display panel portion, and sealed to complete the display panel.

  In manufacturing such a display panel, in the process of dividing a large panel into each display panel portion, a dividing groove (so-called scribe groove) is formed on the surface of the glass substrate by a cutter or rotary blade made of diamond or a hard material. In other words, a method of cutting along the dividing grooves by applying an impact is performed. In particular, when one of the TFT substrate or the counter substrate constituting the large-sized panel is formed by adhering the microlens substrate to the entire surface of the glass substrate with an adhesive, the cut is made through the adhesive in advance. Two substrates (a TFT substrate and a counter substrate) are bonded together in a state in which the groove is formed on the glass substrate. In this state, a method has been proposed in which the above-described divided groove is formed in a portion corresponding to the cutting groove, and then the panel is cut along the divided groove by applying an impact in the same manner as described above (for example, See Patent Document 1 below).

Japanese Patent No. 3425747

  In recent years, display panels such as liquid crystal display devices have been made thinner and lighter, and in order to achieve this, the glass substrates constituting the display panel are also required to be made thinner. However, it is difficult to flatten a panel on which a thin glass substrate is bonded, particularly as the size of the panel increases. For this reason, in the method for forming the division grooves using the cutter or the rotary blade as described above, it is difficult to uniformly form the division grooves with good accuracy on the glass substrate surface.

  Therefore, in order to further reduce the thickness of the display panel, it is necessary to make the dividing grooves uniform by downsizing the glass substrate, that is, downsizing the panel. However, this reduces the number of display panels cut out from a single panel, thereby reducing the productivity of the display panel.

  Therefore, the present invention can form a slit for dividing with high accuracy even for a large-sized panel that is thinned, and thereby a display panel that can be thinned and productivity can be improved. It aims at providing the manufacturing method of.

  In order to achieve such an object, the present invention is characterized by being performed in the following procedure. First, a panel formed by bonding the first substrate and the second substrate is formed, and a layer pattern in which a divided region of the panel is exposed is formed on at least one main surface of the panel. Next, dividing grooves are formed in the panel by etching from above the layer pattern. Thereafter, the panel is divided into display panel portions along the dividing grooves.

  In such a manufacturing method, since the dividing groove is formed in the panel by etching from the layer pattern, the dividing groove having an equal depth is formed on the entire surface of the panel. For this reason, even if the panel is difficult to be flattened due to the progress of enlargement and thinning, the dividing grooves are formed with good accuracy over the entire surface.

  In the step of forming the dividing groove, the layer pattern may be removed by etching at the same time, and the panel can be further thinned by etching the panel.

  As described above, according to the display panel manufacturing method of the present invention, since the dividing groove can be formed with high accuracy over the entire surface of the panel which has been increased in size and thickness, the panel is divided. The display panel can be thinned, and the panel can be enlarged to cut out a plurality of display panel portions, so that the productivity of the display panel can be improved.

  Hereinafter, embodiments in which a method for manufacturing a display panel of the present invention is applied to manufacture of a display panel used in a liquid crystal display device will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a cross-sectional process diagram illustrating the manufacturing method of the first embodiment, and the manufacturing method of the first embodiment will be described with reference to this drawing.

  First, as shown in FIG. 1A, the TFT substrate 1 is manufactured as the first substrate, and the counter substrate 2 is manufactured as the second substrate. Although not shown here, the TFT substrate 1 is provided with a circuit having a TFT (thin film transistor) on a glass substrate, and further provided with an alignment film so as to cover the circuit. On the other hand, the counter substrate 2 is provided with a counter electrode on a glass substrate and further provided with an alignment film so as to cover the counter electrode.

  A resin pattern 3 having a shape surrounding each display panel portion 1a is formed on the alignment film forming surface of the TFT substrate 1 (or the counter substrate 2) configured as described above. The resin pattern 3 is provided with an inlet 3a for injecting liquid crystal later. Also, spacers (not shown) having a predetermined height are scattered on the alignment film forming surface of the TFT substrate 1 (or the counter substrate 2) so that the TFT substrate 1 and the counter substrate 2 face each other. Overlapping in the state. As a result, a gap a having a predetermined interval is formed between the TFT substrate 1 and the counter substrate 2 by the spacer. The spacer may be formed on the TFT substrate 1 (or the counter substrate 2) in advance. In this state, the peripheral edge of the TFT substrate 1 and the counter substrate 2 is covered with a resin 5, and the resin pattern 3 and the resin 5 are cured, whereby the panel 7 in which the TFT substrate 1 and the counter substrate 2 are bonded together is formed. obtain. Both surfaces of the panel 7 are the surfaces of the glass substrate.

  Next, as shown in FIG. 1B, a layer pattern 10 is formed on one main surface of the panel 7 so as to expose the divided region 7 a of the panel 7. Here, the case where the layer pattern 10 is formed on the counter substrate 2 is illustrated. Here, the division area 7a of the panel 7 is an area between the display panel portions 1a. Accordingly, the layer pattern 10 is formed in a shape covering the display panel portion 1a.

The layer pattern 10 is configured using a material appropriately selected from an oxide film such as SiO ₂ , a metal film, a plastic resin (epoxy-based, acrylic-based, and silica-based). Among them, in particular, in the etching performed next, a material to be etched together with the glass substrate constituting the TFT substrate 1 and the counter substrate 2 is selected and used. For example, in the next etching, when wet etching using hydrofluoric acid is performed, the layer pattern 10 is formed by selecting a material to be etched by hydrofluoric acid from a metal material, an oxide material, or a resin material. Formation of such a layer pattern 10 is not particularly limited, and pattern formation is performed by applying printing, adhesion, spraying, or lithography technology.

  When the layer pattern 10 is formed by lithography, the resist pattern formed by lithography may be used as the layer pattern 10 as long as the photosensitive composition used at this time is a material that is etched together with the glass substrate. . Alternatively, the layer pattern 10 made of this material film may be formed by etching a desired material film using a resist pattern as a mask. However, in this case, after the pattern etching for forming the layer pattern 10, a step of removing the resist pattern used as a mask is performed.

  Further, such a layer pattern 10 is completely removed in the next etching, and the panel 7 (glass substrate) in the next etching so that the dividing groove 11 formed by this etching has a predetermined depth. It is assumed that the film thickness T is set by the etching selectivity with respect to.

  Next, as shown in FIG. 1C, the exposed portion of the panel 7 is etched together with the layer pattern 10. Here, etching is advanced from all directions of the panel 7 by wet etching in which the panel 7 is immersed in an etching chemical. At this time, an etching chemical (for example, hydrofluoric acid) capable of etching the glass substrate constituting the panel 7 is used together with the layer pattern 10.

  Thereby, in the initial stage of etching, the portion exposed from the layer pattern 10, that is, the divided region 7 a is etched while the display panel portion 1 a of the counter substrate 2 is protected by the layer pattern 10. And the division | segmentation groove | channel 11 is formed in this division area 7a. On the TFT substrate 1 side, the panel 7 is made thinner by uniform etching on the entire surface. This etching is performed until at least the layer pattern 10 is completely removed. Further, even after the layer pattern 10 is removed, the panel 7 may be further thinned by continuing etching on both sides of the panel 7 as necessary. However, the etching after the layer pattern 10 is completely removed is performed in a range in which the dividing groove 11 does not reach the gap a between the TFT substrate 1 and the counter substrate 2. Are combined so that the thickness T1 of the panel 7 becomes a predetermined value and the dividing groove 11 has a predetermined depth d.

  Next, as shown in FIG. 1 (4), the panel 7 is divided into display panel portions 1a. At this time, the panel 7 is divided in the dividing groove 11 by giving an impact to the dividing groove 11 portion.

  Thereafter, liquid crystal (not shown) is injected into each gap a of the display panel portion 1a from an injection port 3a provided in the resin pattern 3, and the injection port 3a is sealed to complete the display panel 13.

  According to the manufacturing method as described above, as described with reference to FIG. 1 (3), the dividing grooves 11 are formed in the panel 7 by etching from the layer pattern 10, so that the uniform depth is obtained over the entire surface of the panel 7. A dividing groove 11 is formed. For this reason, the dividing groove 11 is formed with good accuracy over the entire surface of the panel 7, which is difficult to be flattened due to progress in size and thickness. Accordingly, it is possible to reduce the thickness of the display panel 13 formed by dividing the panel 7 by the dividing groove 11, and it is possible to cut out a larger number of display panels 1a by increasing the size of one panel 7. Therefore, the productivity of the display panel 13 can be improved. Specifically, by forming the dividing grooves 11 in the large panel 7 having a size of 1200 mm × 1200 mm, it becomes possible to produce the display panel 13 having a thickness reduced to 0.4 mm or less with good productivity.

  Moreover, as described above, in the etching for forming the dividing grooves 11, the thinning of the panel 7 is performed simultaneously with the formation of the dividing grooves 11. Therefore, it is possible to form the TFT substrate 1 and the counter substrate 2 using a thick glass substrate, and then reduce the thickness of the panel 7 to a predetermined thickness simultaneously with the formation of the dividing grooves 11. Therefore, the panel 7 (display panel 13) can be further thinned without being influenced by the formation process of the TFT substrate 1 and the counter substrate 2.

  Further, when the dividing groove 11 is formed, no pressure is applied to the panel 7, so that the panel 7 can be prevented from being damaged when the dividing groove 11 is formed. At the same time, by reducing the thickness of the panel 7 when the panel 7 is divided in the dividing groove 11, the pressure at the time of division can be reduced, so that breakage of the panel at the time of division can be suppressed. Therefore, the yield in display panel manufacturing can be improved.

  Furthermore, when the dividing groove 11 is formed, chips and fine dust (glass cullet powder) are not generated, and contamination of the process environment and products can be prevented. Also by this, the yield of the display panel 13 can be improved.

  Further, in the conventional method of forming the dividing groove by using a cutting tool such as a cutter or rotary blade made of diamond or a hard material, the cutting of the cutting tool has occurred due to the rise of the resin 5 when the dividing groove is formed. There is no need to worry about such tool breakage.

  Further, in this manufacturing method, as described with reference to FIG. 1 (3), the dividing groove 11 is formed by etching. Therefore, as shown in the plan view of FIG. 2A and the enlarged cross-sectional view of FIG. 2B, the dividing grooves 11 formed between the display panel portions 1a are rounded. Therefore, the display panel obtained after the division can be handled easily without causing corners or burrs of the glass substrate, and the labor of chamfering the display panel can be saved. Furthermore, since there is no concern that these corners and burrs will be lost, it is possible to prevent a decrease in yield.

  In addition, since the dividing groove 11 is formed by etching using the layer pattern 10 as a mask, the arrangement position and shape of the dividing groove 11 can be freely selected depending on the shape of the layer pattern 10 serving as a mask. Therefore, as shown in FIG. 3, it is possible to form the dividing grooves 11 having shapes corresponding to the display panel portions 1a having various shapes, and the display panel portion 1a (display panel) cut out from one panel 7 is formed. The degree of freedom of the shape can be improved.

  Furthermore, by performing wet etching when forming the dividing grooves 11, batch-type processing for simultaneously processing a plurality of panels 7 can be performed, and this can also improve productivity.

Second Embodiment
FIG. 4 is a cross-sectional process diagram illustrating the manufacturing method according to the second embodiment, and the manufacturing method according to the second embodiment will be described with reference to this drawing.

  First, as shown in FIG. 4A, a panel 7 similar to that described with reference to FIG. 1A in the first embodiment is formed.

  Next, as shown in FIG. 4B, the layer pattern 10 is formed on both surfaces of the panel 7. These layer patterns 10 are the same as those described with reference to FIG. 1B in the first embodiment, and are provided with the display panel portion 1a covered and the divided regions 7a exposed.

  Thereafter, as shown in FIG. 4 (3), the panel 7 provided with the layer pattern 10 is etched from the entire surface, thereby removing the layer pattern 10 and forming the dividing grooves 11 on both surfaces of the panel 7. This etching is performed in the same manner as in the first embodiment. For this reason, even after the layer pattern 10 is removed, the panel 7 may be thinned from both sides thereof by continuing the etching as necessary.

  After the above, as in the first embodiment, as shown in FIG. 4 (4), the panel 7 is divided into the display panel portions 1a in the dividing grooves 11 and further into the gaps a of the display panel portions 1a. Liquid crystal is injected to complete the display panel 13.

  Even if it is the above manufacturing methods, the effect similar to 1st Embodiment can be acquired. In particular, according to the method of the second embodiment, as described with reference to FIG. 4 (3), by forming the dividing grooves 11 on both surfaces of the panel 7, the dividing grooves 11 are linearly arranged in a plane. Even if it is not performed, the panel 7 can be more easily divided. That is, as described with reference to FIG. 3 in the first embodiment, the division of the panel 7 in the case where the display panel portion 1a is arranged with increased freedom can be facilitated.

<Third Embodiment>
FIG. 5 is a cross-sectional process diagram illustrating the manufacturing method of the third embodiment, and the manufacturing method of the third embodiment will be described with reference to this drawing.

  First, as shown in FIG. 5A, a panel 7 similar to that of the first embodiment is formed.

  Next, as shown in FIG. 5B, a layer pattern 10 'is formed on one main surface of the panel 7 in the same state as in the first embodiment. However, these layer patterns 10 ′ are made of a material having resistance in the next etching.

  After that, as shown in FIG. 5C, the exposed surface of the panel 7 is etched from the entire surface by wet etching using the layer pattern 10 'as a mask. Here, an etchant that can selectively etch the glass substrate constituting the panel 7 is used for the layer pattern 10 ′.

  As a result, etching of the divided region 7a exposed from the layer pattern 10 'is advanced to form the divided groove 11, and the other surface (TFT substrate 1) side of the panel 7 is etched uniformly. Promote thinning. This etching is performed so that the division groove 11 having a predetermined depth d is formed in the panel 7 and the plate thickness T1 of the panel 7 including the TFT substrate 1 and the counter substrate 2 becomes a predetermined value.

  After the above, as shown in FIG. 5 (4), the panel 7 is etched to selectively remove the layer pattern 10 '.

  After that, as in the first embodiment, as shown in FIG. 5 (5), the panel 7 is divided into display panel portions 1a in the dividing grooves 11, and liquid crystal is further provided in the gaps a of the display panel portions 1a. The display panel 13 is completed by pouring.

  In the manufacturing method as described above, although the etching process for removing the layer pattern 10 ′ shown in FIG. 5 (4) increases, the dividing groove 11 is formed by etching using the layer pattern 10 ′ as a mask. Therefore, the same effect as the first embodiment can be obtained. Further, in the method of the third embodiment, the thickness T of the layer pattern 10 ′ is related when the dividing groove 11 is formed with the predetermined depth d as described with reference to FIG. Therefore, the film thickness T of the layer pattern 10 ′ and the degree of freedom in material selection are increased. In the third embodiment, when it is not necessary to reduce the thickness of the panel 7 in the step of forming the dividing grooves 11, a layer pattern 10 ′ is formed on both surfaces of the panel 7 in combination with the second embodiment. May be.

  In each of the above embodiments, a method for manufacturing a display panel used in a liquid crystal display device has been described. However, the present invention is not limited to this. For example, an organic EL element is sandwiched between two substrates. The present invention can be similarly applied to the manufacture of a display panel for an organic EL display device. In this case, the manufacturing procedure of the panel 7 and the process after dividing the panel 7 are changed for the organic EL display device.

It is sectional process drawing which shows the manufacturing method of 1st Embodiment. It is a figure explaining the division | segmentation of the display panel by the manufacturing method of this invention. It is a figure explaining the division | segmentation of the display panel by the manufacturing method of this invention. It is sectional process drawing which shows the manufacturing method of 2nd Embodiment. It is sectional process drawing which shows the manufacturing method of 1st Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... TFT substrate (1st substrate), 1a ... Display panel part, 2 ... Counter substrate (2nd substrate), 5 ... Resin, 7 ... Panel, 7a ... Divided area 10, 10 '... Layer pattern, 11 ... Divided Groove, 13 ... Display panel, a ... Gap

Claims (6)

Forming a layer pattern in which a divided region of the panel is exposed on at least one main surface of the panel formed by bonding the first substrate and the second substrate;
Forming a dividing groove in the dividing region of the panel by etching from the layer pattern;
Dividing the panel into display panel portions along the dividing grooves. A method of manufacturing a display panel, comprising: In the manufacturing method of the display panel of Claim 1,
In the step of forming the dividing groove, the layer pattern is also removed by etching at the same time. In the manufacturing method of the display panel of Claim 2,
In the step of forming the dividing groove, the panel pattern is further etched after the layer pattern is removed by etching, thereby thinning the panel. In the manufacturing method of the display panel of Claim 1,
The layer pattern is provided only on one main surface of the panel,
In the step of forming the dividing groove, the panel surface opposite to the surface on which the layer pattern is provided is simultaneously etched to reduce the thickness of the panel. In the manufacturing method of the display panel of Claim 1,
A gap is provided between the first substrate and the second substrate,
In the step of forming the dividing groove, etching is performed in a range in which the depth of the dividing groove does not reach the gap. In the manufacturing method of the display panel of Claim 5,
A gap between the first substrate and the second substrate is sealed with a resin that covers a peripheral edge thereof.

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