CN112105984A

CN112105984A - Method for manufacturing liquid crystal panel

Info

Publication number: CN112105984A
Application number: CN201980031999.7A
Authority: CN
Inventors: 茅野真吾; 柏原康宏; 山内宽之; 堂园哲孝; 家原惠太; 向原聪; 镰苅守
Original assignee: NSC Co Ltd; Sharp Corp
Current assignee: NSC Co Ltd; Sharp Corp
Priority date: 2018-06-13
Filing date: 2019-05-29
Publication date: 2020-12-18
Anticipated expiration: 2039-05-29
Also published as: JP2019215439A; WO2019239889A1; CN112105984B; JP6578533B1; TW202006431A; TWI804634B

Abstract

The method for manufacturing a liquid crystal panel according to the present invention includes at least: a laser irradiation step for forming a modified line (20) having a property of being easily etched by irradiating a laser along a planned shape cutting line corresponding to the shape of the liquid crystal panel among the plurality of glass base materials (50) for acquisition; and a scribe line groove forming step of forming a scribe line groove by cutting a predetermined line along the terminal portion region with respect to the color filter substrate (14). The laser irradiation step includes: a normal operation mode in which laser light is irradiated to a position not adjacent to the electrode terminal portion; and a condensing area adjustment mode for irradiating the position adjacent to the electrode terminal portion with laser light. In the light-condensing-area adjustment mode, the light-condensing area is adjusted so that the light-condensing area does not reach the intermediate layer.

Description

Method for manufacturing liquid crystal panel

Technical Field

The present invention relates to a method for manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having desired shapes from a plurality of glass base materials for obtaining.

Background

In general, when manufacturing a glass panel such as a liquid crystal panel or a glass cover plate, a process of obtaining a plurality of glass panels having a desired shape from a plurality of glass base materials for obtaining glass is performed. For example, in the manufacture of liquid crystal panels, a method (so-called multi-panel obtaining) of simultaneously manufacturing a plurality of liquid crystal panels from a set of glass base materials and then dividing the glass base materials into individual liquid crystal panels is widely used. In addition, when the glass base material is divided, methods such as scribe break (scriber break), laser ablation processing, and etching processing are often used.

However, when the scribe line breaking is adopted, it is difficult to form a glass panel having a circular outline. In addition, in the case of laser ablation processing, problems such as a low processing speed and contamination due to ablation debris tend to occur.

Therefore, a technique of dividing a plurality of glass base materials for acquisition by etching to obtain a plurality of glass panels has been attracting attention. Etching is performed to obtain a glass cover plate having a desired shape, and recently, etching has also been used to obtain a liquid crystal panel having a predetermined shape from a plurality of glass base materials for obtaining, which are used to obtain a plurality of liquid crystal panels formed by laminating an array substrate and a color filter substrate (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2016-224201

Disclosure of Invention

Problems to be solved by the invention

However, in the etching treatment, in addition to the etching progress in the thickness direction of the glass panel, side etching in which the etching also progresses in the direction orthogonal thereto occurs. Therefore, in the etching treatment, it is difficult to form the cut surface of the glass panel substantially at right angles to the main surface. For example, when a plurality of liquid crystal panels are obtained by etching, a space needs to be provided between the liquid crystal panels in the glass base material in consideration of the influence of the lateral erosion that develops in the direction orthogonal to the thickness direction of the glass base material, and therefore, the efficiency of obtaining a plurality of liquid crystal panels may be deteriorated.

The invention aims to provide a method for manufacturing a liquid crystal panel, which can restrain the influence of side etching caused by etching treatment to the minimum.

Means for solving the problems

The present invention provides a method for manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having predetermined shapes from a plurality of glass base materials for obtaining a plurality of liquid crystal panels in which an array substrate and a color filter substrate are arranged to face each other with an intermediate layer interposed therebetween. A typical example of the intermediate layer is a liquid crystal layer, but a void region not filled with liquid crystal is also included in the intermediate layer.

The liquid crystal panel manufacturing method at least comprises a laser irradiation step and a scribing groove forming step. In the laser irradiation step, by irradiating the plurality of acquisition glass base materials with laser light along the planned shape cutting line corresponding to the shape of the liquid crystal panel, modified lines having a property of being easily etched are formed on the plurality of acquisition glass base materials along the planned shape cutting line.

In the scribing groove forming step, a scribing groove is formed by cutting a predetermined line along a terminal portion region for removing a region of the color filter substrate opposed to the electrode terminal portion of the array substrate.

The laser irradiation step includes: a normal operation mode in which laser light is irradiated to a position not adjacent to the electrode terminal portion; and a condensing area adjustment mode for irradiating the position adjacent to the electrode terminal portion with laser light. In the light-condensing-area adjustment mode, the light-condensing area is adjusted so that the light-condensing area does not reach the intermediate layer. In the light-collecting region adjustment mode, for example, an optical system such as a lens is adjusted so as to shorten the light-collecting region, or the light-collecting region is preferably displaced so as to be away from the intermediate layer.

By adopting the above-described method, for example, the etching liquid easily penetrates along the modified line, and the etching treatment is easily advanced in a short time, so that the influence of the undercut can be minimized.

When the laser beam is irradiated to a position adjacent to the electrode terminal portion, the condensed region of the laser beam does not reach the intermediate layer, and thus the energy of the laser beam is not transmitted to the intermediate layer. As a result, it is possible to prevent a terminal wiring pattern disposed in the electrode terminal portion from melting and scattering due to the energy of the laser beam, or from generating heat in other portions of the electrode terminal portion.

In the above method for manufacturing a liquid crystal panel, it is preferable that the method further includes: and an etching step of etching the modified wire by bringing the plurality of glass base materials for acquisition into contact with an etching solution. By etching the modified line, a cut groove can be formed along the shape-cutting predetermined line. By dividing the liquid crystal panel along the planned shape cutting line by applying physical stress or thermal stress to the cut groove, for example, a plurality of liquid crystal panels can be obtained.

In particular, since the light-condensing region of the laser beam does not reach the intermediate layer at a position adjacent to the electrode terminal portion, it is possible to suppress occurrence of a problem that the terminal wiring or the like of the electrode terminal portion is corroded in the vicinity of the electrode terminal portion due to excessive penetration of the etching solution.

In addition, when a functional film that can be etched by etching is formed on the array substrate or the color filter substrate, the following steps are preferably added: after the functional film is covered with a protective film having etching resistance or an etching-resistant layer, the protective film is patterned to provide an opening for exposing a portion to be etched, such as a line to be cut in a shape.

By forming the opening in the etching resistant film or the etching resistant layer at a position corresponding to the planned shape cutting line, it is possible to etch the modified lines in the plurality of glass base materials for acquisition while protecting the functional film (for example, a protective film such as an overcoat, or a transparent conductive film such as ITO or an organic conductive film).

Effects of the invention

According to the present invention, the influence of the undercut accompanying the etching process can be suppressed to the minimum in the liquid crystal panel manufacturing method. Further, it is possible to suppress the occurrence of such a problem that the terminal wiring pattern scatters in the vicinity of the electrode terminal portion or the terminal wiring is corroded due to excessive permeation of the etching liquid.

Drawings

Fig. 1 is a diagram showing a schematic configuration of a liquid crystal panel according to an embodiment of the present invention.

Fig. 2 is a view showing a schematic configuration of a plurality of glass base materials for obtaining including a plurality of liquid crystal panels.

Fig. 3 is a diagram illustrating steps included in one embodiment of a method for manufacturing a liquid crystal panel.

Fig. 4 is a diagram illustrating steps included in one embodiment of a method for manufacturing a glass panel.

Fig. 5 is an explanatory diagram of a normal operation mode and a condensed region adjustment mode at the time of laser irradiation.

Fig. 6 is a diagram illustrating steps included in one embodiment of a method for manufacturing a liquid crystal panel.

FIG. 7 is a view showing an example of an etching apparatus applied to the present invention.

Fig. 8 is a diagram showing a modification of the etching process applied to the present invention.

FIG. 9 is a schematic view showing a scribing and breaking process for a plurality of glass base materials for obtaining.

FIG. 10 is a schematic view showing a plurality of divided glass base materials for obtaining.

Fig. 11 is a diagram showing a characteristic of the structure of the liquid crystal panel.

Detailed Description

Hereinafter, an embodiment of a method for manufacturing a liquid crystal panel according to the present invention will be described with reference to the drawings. Fig. 1 (a) shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured by laminating an array substrate 12 and a color filter substrate 14 with an intermediate layer such as a liquid crystal layer interposed therebetween. The structures of the array substrate 12 and the color filter substrate 14 may be the same as those of known structures, and thus, descriptions thereof will be omitted.

The array substrate 12 has an electrode terminal portion 122, and the electrode terminal portion 122 is provided to extend from a region where the color filter substrate 14 is bonded. A plurality of circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and the circuits are housed in a housing, thereby constituting, for example, a smartphone 100 shown in fig. 1 (B).

Next, an example of a method for manufacturing the liquid crystal panel 10 will be described. As shown in fig. 2 (a) and 2 (B), the liquid crystal panel 10 is generally manufactured as a plurality of glass base materials 50 for obtaining including a plurality of the liquid crystal panels 10. Then, the plurality of glass base materials 50 for obtaining are divided to obtain individual liquid crystal panels 10.

In this embodiment, for convenience, a process of obtaining a plurality of glass base materials 50 for obtaining 6 liquid crystal panels 10 arranged in a matrix of 3 rows and 2 columns and having a transparent thin film (a transparent conductive film such as an ITO film or an organic conductive film, or a transparent protective film) 17 formed on the surface thereof will be described. However, the number of liquid crystal panels 10 included in the plurality of glass base materials 50 for acquisition is not limited to this, and may be increased or decreased as appropriate.

First, as shown in fig. 3 a and 3B, the plurality of glass base materials 50 for obtaining are cut along a predetermined line corresponding to the shape (contour) of the liquid crystal panel 10 to form a modified line 20. The modified line 20 is, for example, a thin line array in which a plurality of thin line layers are arranged by a beam pulse (beam diameter is about 1 to 5 μm) irradiated from a pulse laser such as a picosecond laser or a femtosecond laser. For example, as shown in fig. 4 (a) and 4 (B), the modified thread 20 is a perforated thread having a plurality of through holes or modified layers. The modified line 20 has a property of being etched more easily than other portions of the plurality of glass base materials 50 for obtaining. Of course, the shape of the modified line 20 is not limited to this shape, and may be other shapes.

When the array substrate 12, the color filter substrate 14, and the transparent film 17 are simultaneously processed with one laser beam, a defect may occur in the liquid crystal layer. Therefore, in the present embodiment, the occurrence of such a problem can be suppressed by using the laser processing shown in fig. 3 (C) and 3 (D). That is, as shown in fig. 3 (C), it is preferable that the focal point adjustment and the intensity adjustment are performed so that the modified line 20 is formed only on the array substrate 12 from the array substrate 12 side, and then the laser light is irradiated, so that energy is not easily transmitted to the vicinity of the liquid crystal layer. In this state, if the plurality of glass base materials 50 for obtaining can be divided by applying a physical action or a thermal action, the laser processing is terminated.

On the other hand, in the case where it is difficult to divide the plurality of glass base materials 50 for obtaining in this state, as shown in fig. 3 (D), it is preferable that the laser light is irradiated after the focus adjustment and the intensity adjustment are performed from the side of the color filter substrate 14 which is the opposite side so that the modified line 20 is formed only on the color filter substrate 14. By performing the processing shown in fig. 3 (D), although the number of steps of laser processing increases, it is possible to easily divide the plurality of glass base materials 50 for obtaining while suppressing occurrence of a defect in the liquid crystal layer.

The beam from the picosecond laser is controlled so that the focal area differs depending on the mode of operation. For example, in this embodiment, the normal operation mode is adopted when the laser light is irradiated to a position not adjacent to the electrode terminal portion 122, while the focal region adjustment mode is adopted when the laser light is irradiated to a position adjacent to the electrode terminal portion 122.

Fig. 5 (a) and 5 (B) show the laser irradiation state in the normal operation mode, and fig. 5 (C) and 5 (D) show the laser irradiation state in the condensed region adjustment mode. The normal operation mode is an operation mode employed when the laser light is irradiated to a position not adjacent to the electrode terminal portion 122. On the other hand, the condensed region adjustment mode is an operation mode employed when the laser light is irradiated to a position adjacent to the electrode terminal portion 122.

In both the normal operation mode and the condensed region adjustment mode, the focal point of the laser light is located at the center in the thickness direction of the substrate being processed among the array substrate 12 and the color filter substrate 14, and the condensed region is controlled so as to be within the range of the thickness of the substrate being processed. However, even when the focal point of the laser light is located at the central portion in the thickness direction of the substrate being processed among the array substrate 12 and the color filter substrate 14, the focal point region of the laser light may extend beyond the range of the thickness of the substrate being processed and may reach an intermediate layer or another substrate.

Therefore, as shown in fig. 5 (C) and 5 (D), in the condensed region adjustment mode, the condensed region is particularly adjusted so that the condensed region does not reach the intermediate layer. Examples of the method of adjusting the light condensing region include moving at least one of optical systems such as a laser head and an objective lens in a direction away from the plurality of glass parent materials 50 for obtaining, or selectively disposing an optical system for narrowing the light condensing region on the optical path of the laser light.

When the laser beam is irradiated to a position adjacent to the electrode terminal 122, the light converging region is particularly adjusted so as not to reach the intermediate layer, and thus the terminal wiring pattern can be prevented from melting and scattering around the electrode terminal 122. Further, it is possible to prevent the terminal wiring from being corroded by excessive penetration of the etching solution during etching.

After the reformed lines 20 are formed along the lines to be cut in the shape of the plurality of obtaining glass base materials 50, the plurality of obtaining glass base materials 50 are bonded with the etching resistant thin films 16 having etching resistance on both main surfaces as shown in fig. 6 (a) and 6 (B). The etching-resistant film 16 is made of polyethylene having a thickness of 50 to 75 μm. However, the structure of the etching resist film 16 is not limited thereto. For example, if the glass is resistant to an etching solution for etching glass, for example, polypropylene, polyvinyl chloride, or olefin resin, it can be appropriately selected and used.

After the adhesion of the etching resist film 16 is completed, as shown in fig. 6 (C), a laser beam is irradiated to the etching resist film 16 along a line to cut a shape corresponding to the shape of the liquid crystal panel 10 to be cut. By the irradiation of the laser beam, the etching resist film 16 is removed along the line to cut the shape. Then, the openings of the etching-resistant thin films 16 are formed along the lines to be cut in the shape, and as a result, the positions where the reformed lines 20 of the plurality of glass base materials 50 for obtaining are formed are exposed to the outside, similarly to the configuration shown in fig. 3 (C).

When the laser processing is completed, as shown in fig. 7, the plurality of glass base materials 50 for obtaining are introduced into an etching apparatus 300, and are subjected to etching treatment by an etching solution containing hydrofluoric acid, hydrochloric acid, and the like. In the etching apparatus 300, the plurality of glass base materials 50 for obtaining are conveyed by the conveying rollers, and the etching solution is brought into contact with one surface or both surfaces of the plurality of glass base materials 50 for obtaining in the etching chamber, thereby performing the etching treatment on the plurality of glass base materials 50 for obtaining. Further, since a cleaning chamber for washing the etching solution adhering to the plurality of glass base materials for obtaining 50 is provided at a later stage of the etching chamber in the etching apparatus 300, the plurality of glass base materials for obtaining 50 are discharged from the etching apparatus 300 in a state where the etching solution is removed.

As an example of a method of bringing the etching liquid into contact with the plurality of glass base materials 50 for obtaining, as shown in fig. 8 (a), spray etching in which the etching liquid is sprayed to the plurality of glass base materials 50 for obtaining in each etching chamber 302 of the etching apparatus 300 can be cited. Alternatively, instead of the spray etching, as shown in fig. 8 (B), a configuration may be adopted in which the plurality of glass base materials 50 for acquisition are conveyed in the overflow etching chamber 304 while being in contact with the overflowing etching liquid.

As shown in fig. 8 (C), immersion etching may be employed in which one or a plurality of the glass parent materials 50 for obtaining a plurality of glass parent materials stored in a carrier are immersed in an etching bath 306 containing an etching solution.

In either case, it is important: in the etching process, the plurality of obtaining glass base materials 50 are prevented from being divided because the planned shape cutting line penetrates in the thickness direction. Therefore, in the etching process (particularly, in the latter half of the etching process), it is necessary to slow down the etching rate and accurately control the etching amount. In this embodiment, the etching treatment is performed at a slow rate of 3 μm/min or less by using dilute hydrofluoric acid of 2 wt% or less, but the method is not limited thereto.

As long as the etching rate is not slowed down throughout the etching process but is initially taken fast and gradually slowed down in stages, the time of the etching process can be shortened. For example, the following structure is preferably employed: the concentration of hydrofluoric acid in the etching solution decreases as the etching apparatus 300 moves to the subsequent stage.

When the plurality of glass base materials 50 for obtaining pass through the etching apparatus 300, the modified wire 20 is etched. At the modified line 20, the etching solution penetrates faster than at other sites, and the glass dissolves along the line, thereby allowing the color filter substrate to be easily cut by the modified line 20. In addition, when a flaw or the like is generated during laser irradiation, the flaw is also easily eliminated.

After the etching process is completed, the adhered etching resist film 16 is peeled off. Next, as shown in fig. 9 (a) to 9 (C), the plurality of glass base materials for obtaining 50 are subjected to a process of forming the terminal-section-cut grooves 30 for removing the regions of the color filter substrate 14 that face the electrode terminal sections 122 of the array substrate 12. In this embodiment, the terminal portion cut groove 30 is formed inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 by a scribing wheel (wheel cutter) 250. The terminal portion cutting groove 30 is formed along the predetermined terminal portion cutting line to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

When the formation of the terminal-portion-cut groove 30 by the scribing wheel 250 is completed, the process proceeds to the division of the plurality of glass base materials for obtaining 50 and the removal of the region facing the electrode terminal portion 122. The plurality of obtaining glass parent materials 50 can be divided into a plurality of obtaining glass parent materials 50 at the modifying line 20 by forming the modifying line 20 by laser thinning processing and further etching the modifying line by only a slight mechanical pressure. For example, by applying a slight pressing force or a slight stretching force to the plurality of obtaining glass base materials 50 or applying a slight ultrasonic vibration, as shown in fig. 10, the plurality of obtaining glass base materials 50 can be divided without being stained.

Since the cutting is not completed by the etching process, it is possible to prevent the occurrence of a problem that the end faces of the liquid crystal panel 10 separated in the etching process collide with each other and are broken. Further, the plurality of glass base materials 50 for obtaining in a state of not being completely cut after the etching treatment may be directly conveyed (in a state of being kept large). Further, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having corrosion resistance. Further, since at least the central portion and the other portions of the end surfaces of the liquid crystal panel 10 are etched, the strength (for example, bending strength) of the liquid crystal panel is higher than that in the case of cutting only by laser processing.

Fig. 11 (a) to 11 (C) show a schematic configuration of the divided liquid crystal panel 10. As shown in the figure, the end face of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper widths (L1 to L4 in fig. 11C) generated at the end surfaces of the array substrate 12 and the color filter substrate 14, which have plate thicknesses of about 0.15mm to 0.25mm, respectively, can be suppressed to 50 μm or less (20 to 35 μm in most cases).

Since the liquid crystal panel 10 is manufactured in this manner, the influence of the undercut hardly occurs, and thus it is possible to design the plurality of glass base materials 50 for obtaining which the liquid crystal panels 10 are arranged close to each other. For example, if there is a gap of about 10 μm in total with a laser width of 2 μm + α, a plurality of glass base materials 50 for acquisition can be appropriately separated into individual liquid crystal panels 10.

The above description of embodiments is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Further, the scope of the present invention is intended to include all changes within the meaning and range equivalent to the appended claims.

Description of the symbols

10-liquid crystal panel

12-array substrate

14-colour filter substrate

16-etching-resistant film

17-transparent film

20-modified wire

30-terminal part cutting groove

50-Multi-piece glass base material for obtaining

100-smart phone

122-electrode terminal part

250-scribing wheel

300-etching apparatus

302. 304-etching chamber

306-etching bath

Claims

1. A method for manufacturing a liquid crystal panel, which is for obtaining a plurality of liquid crystal panels having predetermined shapes from a plurality of glass base materials for obtaining a plurality of liquid crystal panels in which an array substrate and a color filter substrate are arranged to face each other with an intermediate layer interposed therebetween, is characterized by comprising at least:

a laser irradiation step of forming modified lines having a property of being easily etched in the plurality of glass base materials for acquisition along planned shape cutting lines by irradiating laser light along planned shape cutting lines corresponding to shapes of liquid crystal panels in the plurality of glass base materials for acquisition; and

a scribe line forming step of forming a scribe line in the color filter substrate along a predetermined line for removing a terminal portion region of the color filter substrate which region faces an electrode terminal portion of the array substrate,

the laser irradiation step includes: a normal operation mode in which a laser beam is irradiated to a position not adjacent to the electrode terminal portion; and a condensing region adjustment mode for irradiating the position adjacent to the electrode terminal portion with laser light,

in the light condensing region adjustment mode, the light condensing region is adjusted so that the light condensing region does not reach the intermediate layer.

2. The liquid crystal panel manufacturing method according to claim 1,

the liquid crystal panel manufacturing method further includes: and an etching step of etching the modified line by bringing the plurality of glass base materials for acquisition into contact with an etching solution.