JP2019215439A - Liquid crystal panel manufacturing method - Google Patents

Abstract

To provide a transparency thin film-attached glass panel manufacturing method and transparency thin film-attached crystal display panel manufacturing method that can hold down impacts of side etching accompanied by etching processing to a minimum.SOLUTION: A liquid crystal panel manufacturing method according to the present invention includes at least: a laser irradiation step; a scribe groove formation step. In the laser irradiation step, by irradiating laser light along a shape cut-out schedule line corresponding to a shape of a liquid crystal panel in a multiple chamfering-purpose glass base material 50, a reforming line 20 of a characteristic easy to be subjected to etching is formed in the multiple chamfering-purpose glass base material 50 along the shape cut-out schedule line. The laser irradiation step includes: a normal action mode when a location not adjacent to an electrode terminal part 122 is irradiated with the laser light; and a light condensing area adjustment mode when a location adjacent to the electrode terminal part 122 is irradiated with the laser light. In the light condensing area adjustment mode, a light condensing area is adjusted so as not to reach an intermediate layer.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a method for manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a desired shape from a glass preform for multi-paneling.

  Generally, when manufacturing glass panels such as a liquid crystal panel and a cover glass, a process is performed to obtain a plurality of glass panels of a desired shape from a glass preform for multi-paneling. For example, in the manufacture of liquid crystal panels, a technique (so-called multi-sided) is widely adopted in which a plurality of liquid crystal panels are manufactured simultaneously with a set of glass base materials, and then the glass base material is divided into a single liquid crystal panel. I came. And when dividing | segmenting a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were often used.

  However, when the scribe break is adopted, it is difficult to form a glass panel having a rounded outline. In laser ablation processing, problems such as slow processing speed and contamination due to ablation debris are likely to occur.

  Therefore, a technique of obtaining a plurality of glass panels by dividing a glass preform for multi-panning by etching has been attracting attention. Etching has come to be used to obtain a cover glass having a desired shape, and recently, a predetermined number of glass substrates for multi-surfaces for multi-sided liquid crystal panels formed by bonding an array substrate and a color filter substrate are used. Etching is also used to obtain a plurality of liquid crystal panels having a shape (see, for example, Patent Document 1).

JP 2016-224201 A

  However, in the etching process, in addition to the etching progressing in the thickness direction of the glass panel, side etching occurs in which the etching progresses in a direction perpendicular to the thickness direction. For this reason, in the etching process, it becomes difficult to form the cut surface of the glass panel so as to be substantially perpendicular to the main surface. For example, when liquid crystal panels are chamfered by etching, it is necessary to provide a space between each liquid crystal panel in the glass base material in consideration of the influence of side etching that proceeds in a direction perpendicular to the thickness direction of the glass base material. As a result, the multi-chamfering efficiency may deteriorate.

  An object of the present invention is to provide a liquid crystal panel manufacturing method capable of minimizing the influence of side etching accompanying an etching process.

  The present invention relates to a liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels of a predetermined shape from a multi-panel glass base material for multi-panel liquid crystal panels having an array substrate and a color filter substrate opposed to each other with an intermediate layer interposed therebetween. It is. A typical example of the intermediate layer is a liquid crystal layer, but a void region not filled with liquid crystal is also included in the intermediate layer.

  This liquid crystal panel manufacturing method includes at least a laser irradiation step and a scribe groove forming step. In the laser irradiation step, the multi-chamfered glass base material is etched along the shape cutting planned line by irradiating the laser light along the shape cutting planned line corresponding to the shape of the liquid crystal panel in the multi-faced glass base material. An easily modified line is formed.

  In the scribe groove forming step, a scribe groove is formed on the color filter substrate along a terminal portion region cutting line for removing a region of the color filter substrate facing the electrode terminal portion of the array substrate.

  The laser irradiation step includes a normal operation mode when irradiating laser light to a position not adjacent to the electrode terminal portion, and a converging region adjustment mode when irradiating laser light to a position adjacent to the electrode terminal portion. In the light collection region adjustment mode, the light collection region is adjusted so that the light collection region does not reach the intermediate layer. In the condensing region adjustment mode, for example, an optical system such as a lens may be adjusted so that the condensing region becomes short, or the condensing region may be displaced so as to move away from the intermediate layer.

  By adopting the above-described method, for example, the etching solution is easily penetrated along the reforming line, and the progress of the etching process is easy and short, so that the influence of the side etching is minimized. It becomes possible to do.

    Further, when irradiating the position adjacent to the electrode terminal portion with the laser light, the laser light focusing area does not reach the intermediate layer, so that the energy of the laser light is not transmitted to the intermediate layer. As a result, it is possible to prevent the terminal wiring pattern disposed in the electrode terminal portion from being melted and scattered by the energy of the laser, or causing trouble due to heat in other portions of the electrode terminal portion.

  In the above-described method of manufacturing a liquid crystal panel, it is preferable that the method further includes an etching step of etching the modified line by bringing the glass preform for multi-panel contact with an etchant. By etching the modified line, it becomes possible to form a cutting groove along the planned cutting line. For example, by applying a physical stress or a thermal stress to the cut groove, the liquid crystal panel is divided along the shape cutting planned line, so that the liquid crystal panel can be multi-faceted.

  In particular, since the laser light focusing region does not reach the intermediate layer at a position adjacent to the electrode terminal portion, terminal wiring of the electrode terminal portion is corroded due to excessive penetration of the etching solution in the vicinity of the electrode terminal portion. The occurrence of defects is suppressed.

  When a functional film that can be corroded by etching is formed on the array substrate or the color filter substrate, the functional film is covered with an etching-resistant protective film or an etching-resistant layer, and then the protective film is removed. It is advisable to add a step of providing an opening through which patterning or the like, such as a line to be cut, is exposed by patterning.

  By forming an opening at a position corresponding to the expected shape cutting line in the etching-resistant film or the etching-resistant layer, a functional film (for example, a protective film such as an overcoat or a transparent conductive film such as an ITO or an organic conductive film) is formed. It becomes possible to etch the reforming line in the glass preform for multi-chamfering while protecting.

  According to the present invention, it is possible to minimize the influence of side etching accompanying an etching process in a liquid crystal panel manufacturing method. Furthermore, it is possible to suppress the occurrence of problems such that the terminal wiring pattern is scattered near the electrode terminal portion or the terminal wiring is corroded due to excessive penetration of the etching solution.

It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows the schematic structure of the glass preform for multi-paning which contains several liquid crystal panels. It is a figure which shows the process included in one Embodiment of a liquid crystal panel manufacturing method. It is a figure which shows the process included in one Embodiment of a glass panel manufacturing method. It is explanatory drawing of the normal operation mode at the time of laser irradiation, and a condensing area | region adjustment mode. It is a figure which shows the process included in one Embodiment of a liquid crystal panel manufacturing method. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the scribe break process with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel.

  Hereinafter, an embodiment of a method for manufacturing a liquid crystal panel according to the present invention will be described with reference to the drawings. FIG. 1A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that an array substrate 12 and a color filter substrate 14 are bonded together with an intermediate layer such as a liquid crystal layer interposed therebetween. Since the configurations of the array substrate 12 and the color filter substrate 14 can be the same as known configurations, the description thereof is omitted here.

  The array substrate 12 has an electrode terminal portion 122 provided to extend from a region to be bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and these electric circuits are housed in a housing, so that, for example, a smartphone 100 as shown in FIG. Composed.

  Subsequently, an example of a method for manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 2 (A) and 2 (B), the liquid crystal panel 10 is generally manufactured as a multi-chamfer glass base material 50 including a plurality of liquid crystal panels 10. And the single liquid crystal panel 10 is obtained by parting this glass substrate 50 for multi-cavity.

  In this embodiment, for convenience, six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns, and a transparent thin film (a transparent conductive film such as an ITO film or an organic conductive film, a transparent protective film, or the like) is formed on the surface. The processing for the multi-paneling glass base material 50 on which 17) is formed will be described. However, the number of the liquid crystal panels 10 included in the multi-chamfer glass base material 50 is not limited to this, and can be appropriately increased or decreased.

  First, as shown in FIG. 3A and FIG. 3B, the glass preform 50 for multi-panning is formed by modifying the reforming line 20 along the shape cutting line corresponding to the shape (contour) of the liquid crystal panel 10. It is formed. The reforming line 20 is, for example, a filament array in which a plurality of filament layers formed by a light beam pulse (a beam diameter is about 1 to 5 μm) irradiated from a pulse laser such as a picosecond laser or a femtosecond laser. (See FIGS. 4A and 4B). For example, as shown in FIGS. 4A and 4B, the reforming line 20 has a perforated shape having a plurality of through holes or modified layers. The reforming line 20 has a property of being more easily etched than other portions of the multiple glass preform 50. Of course, the shape of the reforming line 20 is not limited to this shape, and may have a shape other than this.

  If the array substrate 12, the color filter substrate 14, and the transparent thin film 17 are simultaneously processed by one laser beam, a problem may occur in the liquid crystal layer. For this reason, in this embodiment, it becomes possible to suppress generation | occurrence | production of such a malfunction by employ | adopting laser processing as shown in FIG.3 (C) and FIG.3 (D). That is, as shown in FIG. 3 (C), the focus is adjusted and the intensity is adjusted so that the modified line 20 is formed only on the array substrate 12 from the array substrate 12 side, and then the laser is applied to the vicinity of the liquid crystal layer. It is better to make it difficult to transmit energy. If the multi-chamfer glass base material 50 can be divided by applying a physical action or a thermal action in this state, the laser processing ends here.

  On the other hand, in this state, when it is difficult to divide the multi-panel glass base material 50, as shown in FIG. 3D, the color filter substrate 14 is changed from the opposite side to the color filter substrate 14 only. It is preferable to irradiate a laser after adjusting the focus and intensity so as to form the reforming line 20. Although the number of laser processing steps is increased by performing the process shown in FIG. 3D, it is possible to easily divide the glass substrate 50 for multi-faces while suppressing the occurrence of defects in the liquid crystal layer. become.

  The light beam from the pico laser is controlled so that the focusing area differs depending on the operation mode. For example, in this embodiment, the normal operation mode is employed when irradiating a laser beam to a position not adjacent to the electrode terminal portion 122, while condensing when irradiating the laser beam to a position adjacent to the electrode terminal portion 122. A region adjustment mode is employed.

  5 (A) and 5 (B) show a laser beam irradiation state in the normal operation mode, and FIGS. 5 (C) and 5 (D) show laser beam irradiation states in the focusing area adjustment mode. Is shown. The normal operation mode is an operation mode that is employed when the laser beam is irradiated to a position that is not adjacent to the electrode terminal portion 122. On the other hand, the condensing region adjustment mode is an operation mode that is employed when laser light is irradiated to a position adjacent to the electrode terminal portion 122.

  In both the normal operation mode and the light-collecting area adjustment mode, the focal point of the laser beam is located at the center of the array substrate 12 or the color filter substrate 14 in the thickness direction of the substrate being processed. Is controlled so as to fall within the range of the thickness of the substrate being processed. However, even when the focal point of the laser light is located at the center of the array substrate 12 or the color filter substrate 14 in the thickness direction of the substrate being processed, the condensing region of the laser light is the substrate being processed. In some cases, the thickness of the intermediate layer and the other substrate may be exceeded.

  For this reason, as shown in FIGS. 5C and 5D, in the light-collecting region adjustment mode, the light-collecting region is specially adjusted so that the light-collecting region does not reach the intermediate layer. As a method for adjusting the condensing region, at least one of an optical system such as a laser head or an objective lens is moved in a direction in which the multi-surface glass base material 50 is separated, or an optical system for narrowing the condensing region. May be selectively placed on the optical path of the laser beam.

  When the laser beam is applied to a position adjacent to the electrode terminal portion 122, the light-collecting region is specially adjusted so that the light-collecting region does not reach the intermediate layer, so that the terminal wiring pattern is formed around the electrode terminal portion 122. Is prevented from melting and scattering. Further, it is possible to prevent the terminal wiring from being corroded due to excessive permeation of the etching solution when etching is performed.

  After the reforming line 20 is formed along the expected shape cutting line in the multiple glass preform 50, the multiple glass preform 50 is formed as shown in FIGS. 6A and 6B. An etching resistant film 16 having etching resistance is attached to both main surfaces. Here, polyethylene having a thickness of 50 to 75 μm is employed as the etching resistant film 16. However, the configuration of the etching resistant film 16 is not limited to this. For example, any material having resistance to an etching solution for etching glass, such as polypropylene, polyvinyl chloride, and olefin resin, can be appropriately selected and employed.

  When the attachment of the etching resistant film 16 is completed, subsequently, as shown in FIG. 6 (C), irradiation of the laser beam to the etching resistant film 16 is performed along a shape cutting line corresponding to the shape of the liquid crystal panel 10 to be taken out. Done. By this laser beam irradiation, the etching resistant film 16 is removed along the planned cutting line. And the opening part of the etching-resistant film 16 will be formed along a shape cutting plan line, As a result, modification | reformation of the glass base material 50 for multi-faces like the structure shown in FIG.3 (C). The formation position of the line 20 is exposed to the outside.

  When the above-mentioned laser processing is completed, as shown in FIG. 7, the glass preform 50 for multiple faces is introduced into an etching apparatus 300, and is subjected to an etching process using an etching solution containing hydrofluoric acid, hydrochloric acid and the like. In the etching apparatus 300, the glass preform 50 for multiple polishing is brought into contact with one or both sides of the glass preform 50 for multiple polishing in the etching chamber while the glass preform 50 for multiple polishing is transported by the transport roller. An etching process is performed on 50. In addition, since a cleaning chamber for washing away the etchant adhering to the multi-surface glass base material 50 is provided in the subsequent stage of the etching chamber in the etching apparatus 300, the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.

  As an example of a method of contacting the etching liquid with the glass preform 50 for multiple polishing, as shown in FIG. 8A, the etching liquid is applied to the glass preform 50 for multiple polishing in each etching chamber 302 of the etching apparatus 300. Spray etching. Further, instead of spray etching, as shown in FIG. 8 (B), in the overflow type etching chamber 304, a configuration is adopted in which the glass substrate 50 for multi-cavity is conveyed while being in contact with the overflowed etching solution. Is also possible.

  Further, as shown in FIG. 8C, dip-type etching in which one or a plurality of glass preforms 50 for multiple polishing accommodated in a carrier is immersed in an etching tank 306 in which an etching solution is accommodated. It is also possible.

  In any case, it is important that the shape cutting scheduled line penetrates in the thickness direction during the etching process so that the multiple glass preform 50 is not divided. For this reason, during the etching process (particularly in the latter half of the etching process), it is necessary to slow the etching rate and accurately control the etching amount. In this embodiment, the etching process proceeds at a slow speed of 3 μm / min or less by using a thin hydrofluoric acid of 2 wt% or less, but the present invention is not limited to this method.

  If the etching rate is not slowed down in the whole etching process but is gradually reduced while adopting a faster etching rate at first, the time required for the etching process can be reduced. For example, a configuration in which the hydrofluoric acid concentration in the etching solution is lowered as the process proceeds to the subsequent stage of the etching apparatus 300 may be employed.

  When the glass preform for multi-cavity 50 passes through the etching device 300, the reforming line 20 is etched. In the reforming line 20, the etching solution penetrates faster than other portions, and the glass is melted along this line, so that the color filter substrate can be easily cut by the reforming line 20. Further, even when a flaw or the like is generated during laser irradiation, the flaw is easily eliminated.

  When the etching process is completed, the attached etching resistant film 16 is peeled off. Next, as shown in FIGS. 9A to 9C, a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 is removed from the multiple glass preform 50. The process of forming the terminal portion cutting groove 30 is performed. In this embodiment, the scribe wheel (wheel cutter) 250 forms the terminal portion cutting groove 30 inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12. The terminal portion cutting groove 30 is formed along a terminal portion cutting planned line in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

  When the formation of the terminal portion cutting groove 30 by the scribe wheel 250 is completed, the process proceeds to the division of the multiple glass preform 50 and the removal of the region facing the electrode terminal portion 122. In the multi-chamfer glass base material 50, the modified line 20 is formed by laser filament processing, and the modified line is further etched to modify the multi-chamfer glass base material 50 with a slight mechanical pressure. The quality line 20 can be divided. For example, as shown in FIG. 10, the multi-chamfering glass base material 50 is soiled by applying a minute pressing force or pulling force to the multi-chamfering glass base material 50 or applying microscopic ultrasonic vibration. It is possible to divide without.

  Since the cutting is not completely performed by the etching process, it is possible to prevent a problem that the end faces of the liquid crystal panel 10 separated during the etching process are damaged by collision. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.

  FIGS. 11A to 11C show a schematic configuration of the liquid crystal panel 10 after division. As shown in the figure, the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper width (L1 to L4 in FIG. 11C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a thickness of about 0.15 mm to 0.25 mm is set to 50 μm or less (mostly 20 to 35 μm).

  As described above, since the influence of side etching hardly occurs in manufacturing the liquid crystal panel 10, it is possible to design the multi-panel glass base material 50 in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10.

  The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

Reference Signs List 10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 16-Etching resistant film 17-Transparent thin film 20-Modification line 30-Terminal cut groove 50-Glass preform for multi-panel removal 100-Smartphone 122-Electrode terminal 250-scribe wheel 300-etching equipment 302, 304-etching chamber 306-etching tank

Claims (2)

A liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity for multi-planarizing a liquid crystal panel in which an array substrate and a color filter substrate are arranged opposite to each other with an intermediate layer interposed therebetween,
The property of being easily etched into the multi-chamfering glass base material along the shape cutting planned line by irradiating laser light along the pre-cutting line corresponding to the shape of the liquid crystal panel in the multi-faced glass base material A laser irradiation step for forming a modified line of
For the color filter substrate, a scribe groove forming step of forming a scribe groove along a terminal portion region cutting planned line for removing a region facing the electrode terminal portion of the array substrate in the color filter substrate;
At least,
The laser irradiation step includes a normal operation mode when irradiating laser light to a position not adjacent to the electrode terminal portion, and a converging region adjustment mode when irradiating laser light to a position adjacent to the electrode terminal portion. Including
In the condensing region adjustment mode, the condensing region is adjusted so that the condensing region does not reach the intermediate layer.   The method according to claim 1, further comprising an etching step of etching the reforming line by contacting the glass preform for etching with an etchant.

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