TW202330140A - Method for manufacturing laminate - Google Patents

Method for manufacturing laminate Download PDF

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TW202330140A
TW202330140A TW111148633A TW111148633A TW202330140A TW 202330140 A TW202330140 A TW 202330140A TW 111148633 A TW111148633 A TW 111148633A TW 111148633 A TW111148633 A TW 111148633A TW 202330140 A TW202330140 A TW 202330140A
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cutting
glass
layer
laminate
line
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TW111148633A
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山城陸
森弘樹
中嶋将雄
松伏泰生
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日商日本電氣硝子股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00Severing by means other than cutting; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)

Abstract

A method for manufacturing a laminate, the method comprising a step for cutting a laminate 1, which is formed by laminating a glass sheet 2 and a resin sheet 3, along a planned cutting line 5, wherein the cutting step includes: a resin layer cutting step P1 for irradiating the laminate 1 with a laser 6 from the resin-sheet 3 side along the planned cutting line 5, thereby cutting the resin sheet 3; a recess formation step P2 for moving a tip 8 that presses the surface of the glass sheet 2 along the planned cutting line 5, thereby forming a recess 2a, at which the surface of the glass sheet 2 plastically deforms, along the planned cutting line 5; a crack formation step P3 for forming a crack line 9 along the recess 2a; and a glass layer folding step P4 for folding and cutting the glass sheet 2 using the crack line 9 as a start point.

Description

積層體的製造方法Manufacturing method of laminated body

本揭示是有關於一種積層體的製造方法,詳細而言,本揭示是有關於一種包括如下步驟的方法:在製造將玻璃層與樹脂層積層而成的積層體時,將成為其基礎的積層體切斷。This disclosure relates to a method for manufacturing a laminate. Specifically, this disclosure relates to a method including the steps of: when manufacturing a laminate obtained by laminating a glass layer and a resin layer, the laminate to be the base body cut off.

玻璃板的耐候性、耐化學品性、耐擦傷性優異,另一方面,具有針對物理衝擊或熱衝擊而容易破損的缺點。為了消除該玻璃板的缺點,而提出有一種將由玻璃板形成的玻璃層與由樹脂板形成的樹脂層積層並一體化而成的積層體。While the glass plate is excellent in weather resistance, chemical resistance, and scratch resistance, it has a disadvantage of being easily damaged by physical shock or thermal shock. In order to eliminate the disadvantages of the glass plate, a laminate in which a glass layer formed of a glass plate and a resin laminate formed of a resin plate are laminated and integrated has been proposed.

樹脂板與玻璃板相比,耐候性、耐化學品性、耐擦傷性較差,另一方面,具有比重小於玻璃板、耐物理衝擊性亦強的優點。因此,在所述積層體中,能夠藉由玻璃板與樹脂板各自的長處彌補各自的短處。進而,在所述積層體中,和具有與該積層體相同的厚度的玻璃板相比,亦能夠實現大幅輕量化。Compared with glass plates, resin plates are inferior in weather resistance, chemical resistance, and scratch resistance. On the other hand, they have the advantages of having a smaller specific gravity than glass plates and strong physical impact resistance. Therefore, in the above-mentioned laminate, the advantages of each of the glass plate and the resin plate can make up for each of the disadvantages. Furthermore, in the laminated body, it is also possible to significantly reduce the weight compared with a glass plate having the same thickness as the laminated body.

用以製造所述積層體的步驟多數情況包括將成為其基礎的積層體切斷的步驟。專利文獻1中揭示有切斷積層體的方法的一例。The steps for producing the above-mentioned laminate often include a step of cutting the base laminate. Patent Document 1 discloses an example of a method of cutting a laminate.

在同一方法中,在切斷將玻璃層與樹脂層積層而成的積層體時,首先,對積層體的樹脂層照射雷射,藉此執行切斷樹脂層的步驟。其後,對積層體的玻璃層照射超短脈衝雷射,藉此執行切斷玻璃層的步驟。藉由執行該兩個步驟,而將積層體的總厚度切斷。 現有技術文獻 專利文獻 In the same method, when cutting a laminate obtained by laminating a glass layer and a resin, first, the resin layer of the laminate is irradiated with laser light, thereby performing a step of cutting the resin layer. Thereafter, the step of cutting the glass layer is performed by irradiating the glass layer of the laminate with an ultrashort pulse laser. By performing these two steps, the total thickness of the laminate is cut. prior art literature patent documents

專利文獻1:日本專利特開2019-122966號公報Patent Document 1: Japanese Patent Laid-Open No. 2019-122966

[發明所欲解決之課題] 在利用所述方法切斷積層體的情況下,因玻璃層的切斷使用超短脈衝雷射,使得切斷後的玻璃層的端面包含缺陷(裂紋等),由此導致有時玻璃層的端面強度變得不充分。尤其是在具有能夠彎曲的柔性的元件等所採用的薄型的積層體中,玻璃層的端面強度的不足變得顯著。 [Problem to be Solved by the Invention] In the case of cutting the laminated body by the above method, since an ultrashort pulse laser is used for cutting the glass layer, the end surface of the cut glass layer contains defects (cracks, etc.), which may cause the end surface of the glass layer to be damaged. Strength becomes insufficient. In particular, in a thin laminate used for a bendable flexible element, etc., the lack of end surface strength of the glass layer becomes conspicuous.

鑒於所述情況,應解決的技術課題在於:在製造將玻璃層與樹脂層積層而成的積層體時,在將成為其基礎的積層體切斷的情況下,提高切斷後的玻璃層的端面強度。 [解決課題之手段] In view of the above, the technical problem to be solved is to raise the end surface of the glass layer after cutting when cutting the laminated body which is the base when manufacturing a laminated body obtained by laminating a glass layer and a resin layer. strength. [Means to solve the problem]

用以解決所述課題的積層體的製造方法包括沿著切斷預定線切斷將玻璃層與樹脂層積層而成的積層體的步驟,所述積層體的製造方法的特徵在於切斷的步驟包括:樹脂層切斷步驟,沿著切斷預定線自樹脂層側對積層體照射雷射,藉此切斷樹脂層;凹部形成步驟,使按壓玻璃層的表面的鑽尖沿著切斷預定線移動,藉此沿著切斷預定線形成玻璃層的表面發生塑性變形而成的凹部;裂紋形成步驟,沿著凹部形成裂紋線;及玻璃層折斷步驟,以裂紋線為起點,將玻璃層折斷而切斷。A method for producing a laminate for solving the above-mentioned problem includes a step of cutting a laminate formed by laminating a glass layer and a resin layer along a line to be cut, and the method for producing a laminate is characterized in that the step of cutting It includes: a step of cutting the resin layer, irradiating laser light on the laminate from the side of the resin layer along the planned cutting line, thereby cutting the resin layer; Line movement, thereby forming a concave portion formed by plastic deformation of the surface of the glass layer along the planned cutting line; a crack forming step, forming a crack line along the concave portion; and a glass layer breaking step, starting from the crack line, the glass layer To break off and cut off.

根據本方法,藉由執行凹部形成步驟及裂紋形成步驟,能夠避免玻璃層中側向裂紋的產生,並且形成裂紋線。若執行凹部形成步驟,則在使玻璃層的表面塑性變形所形成的凹部的表層部形成壓縮應力發揮作用的壓縮應力層。進而,在壓縮應力層的正下方形成拉伸應力發揮作用的拉伸應力層。其後,若執行裂紋形成步驟,則在拉伸應力層形成裂紋線。如此,藉由利用發生塑性變形而成的凹部形成裂紋線,而能夠防止伴隨形成而在玻璃層發生側向裂紋的情況。藉此,對於藉由執行玻璃層折斷步驟所形成的切斷後的玻璃層的端面,能夠設為不存在由側向裂紋引起的缺陷的端面。其結果為,能夠提高切斷後的玻璃層的端面強度。According to this method, by performing the concave portion forming step and the crack forming step, it is possible to avoid the generation of lateral cracks in the glass layer and to form crack lines. When the concave portion forming step is performed, a compressive stress layer in which compressive stress acts is formed on the surface layer portion of the concave portion formed by plastically deforming the surface of the glass layer. Furthermore, a tensile stress layer in which tensile stress acts is formed directly under the compressive stress layer. Thereafter, when the crack forming step is performed, crack lines are formed in the tensile stress layer. In this way, by forming the crack line using the concave portion that has undergone plastic deformation, it is possible to prevent the occurrence of lateral cracks in the glass layer accompanying the formation. Thereby, the end surface of the cut glass layer formed by performing the glass layer breaking step can be set as an end surface free of defects caused by side cracks. As a result, the end surface strength of the cut glass layer can be improved.

在所述方法中,較佳為在執行玻璃層折斷步驟之前,執行樹脂層切斷步驟。In the method, it is preferable to perform the step of cutting the resin layer before performing the step of breaking the glass layer.

由此,在執行玻璃層折斷步驟時,由於在同一步驟之前執行樹脂層切斷步驟,故而處於已切斷積層體的樹脂層的狀態。因此,在執行玻璃層折斷步驟而將玻璃層切斷後,切斷了積層體的總厚度,因此能夠使切斷後處於相向的狀態的玻璃層的端面彼此立即背離。藉此,能夠儘可能地排除切斷後的玻璃層的端面彼此接觸而端面強度降低的擔憂。Thus, when the glass layer breaking step is performed, since the resin layer cutting step is performed before the same step, the resin layer of the laminate is already cut. Therefore, since the total thickness of the laminate is cut after the glass layer is cut in the glass layer breaking step, the end faces of the glass layers facing each other after cutting can be separated from each other immediately. Thereby, the possibility that the end surfaces of the cut glass layers may come into contact with each other and the strength of the end surfaces may be reduced can be eliminated as much as possible.

在所述方法中,較佳為在玻璃層與樹脂層之間介置將兩層接著的接著層,在樹脂層切斷步驟中,除了樹脂層以外還切斷接著層的厚度的一部分。In the above method, it is preferable to interpose an adhesive layer connecting the two layers between the glass layer and the resin layer, and in the step of cutting the resin layer, a part of the thickness of the adhesive layer is cut in addition to the resin layer.

由此,對於在樹脂層切斷步驟中自樹脂層側對積層體照射的雷射,能夠儘可能地避免該雷射的熱影響不僅波及樹脂層、而且波及到玻璃層的情況。藉此,能夠儘可能地排除雷射的熱影響導致玻璃層產生缺陷的擔憂。Accordingly, it is possible to avoid as much as possible that the thermal influence of the laser irradiated on the laminated body from the resin layer side not only the resin layer but also the glass layer is affected by the laser in the resin layer cutting step. In this way, it is possible to eliminate as much as possible the fear of defects in the glass layer due to the thermal influence of the laser.

在所述方法中,較佳為作為雷射,使用脈衝寬度為500 ps以下的雷射。In the above method, it is preferable to use a laser with a pulse width of 500 ps or less as the laser.

由此,在執行樹脂層切斷步驟時,能夠大致確實地排除雷射的熱影響導致玻璃層產生缺陷的擔憂。As a result, when the resin layer cutting step is performed, it is possible to almost certainly eliminate the possibility of defects in the glass layer due to the thermal influence of the laser.

在所述方法中,較佳為在執行裂紋形成步驟後接續執行玻璃層折斷步驟。In the method, preferably, the glass layer breaking step is performed successively after the crack forming step is performed.

於在執行裂紋形成步驟後不接續同一步驟而執行玻璃層折斷步驟的情況下(在裂紋形成步驟與玻璃層折斷步驟之間執行其他步驟的情況等),在執行玻璃層折斷步驟之前,有玻璃層被意外地切斷之虞。在發生此種事態的情況下,玻璃層的端面(藉由意外的切斷所形成的端面)可以脫離裂紋線的狀態形成。其結果為,可能發生無法採用所製造的積層體作為製品的事態。然而,若在執行裂紋形成步驟後接續執行玻璃層折斷步驟,則能夠大致確實地排除上述擔憂,而能夠確保所製造的積層體的品質。 [發明的效果] In the case where the glass layer breaking step is performed without continuing the same step after the crack forming step (the case where other steps are performed between the crack forming step and the glass layer breaking step, etc.), before performing the glass layer breaking step, there is a glass Layers are at risk of being cut off accidentally. When such a situation occurs, the end face of the glass layer (the end face formed by accidental cutting) can be formed in a state detached from the crack line. As a result, a situation may arise where the manufactured laminate cannot be used as a product. However, if the glass layer breaking step is performed consecutively after the crack forming step, the above-mentioned concern can be almost certainly eliminated, and the quality of the laminate to be produced can be ensured. [Effect of the invention]

根據本發明的積層體的製造方法,在製造將玻璃層與樹脂層積層而成的積層體時,在將成為其基礎的積層體切斷的情況下,能夠提高切斷後的玻璃層的端面強度。According to the method for producing a laminated body of the present invention, when the laminated body forming the base is cut when manufacturing a laminated body formed by laminating a glass layer and a resin layer, the end face strength of the cut glass layer can be increased. .

以下,參照隨附圖式對實施方式的積層體的製造方法進行說明。Hereinafter, the method of manufacturing the laminate according to the embodiment will be described with reference to the accompanying drawings.

本製造方法包括切斷積層體的步驟(以下表述為切斷步驟)。在本實施方式中,例示藉由在切斷步驟中切斷積層體而自該積層體挖出成為製品的部位的情況。This manufacturing method includes a step of cutting the laminate (hereinafter referred to as a cutting step). In this embodiment, the case where the part which becomes a product is excavated from this laminated body by cutting a laminated body in a cutting process is illustrated.

首先,對成為切斷對象的積層體進行說明。First, a laminate to be cut will be described.

如圖1及圖2所示,積層體1包括作為玻璃層的玻璃片材2、作為樹脂層的樹脂片材3、及介置於該兩個片材2、片材3的相互間的接著層4。積層體1是藉由接著層4將兩個片材2、片材3接著並積層一體化而成者。本實施方式中的玻璃片材2、樹脂片材3、及接著層4均為透明體,但不限於此。As shown in FIG. 1 and FIG. 2, the laminated body 1 includes a glass sheet 2 as a glass layer, a resin sheet 3 as a resin layer, and an adhesive interposed between the two sheets 2 and 3. Layer 4. The laminated body 1 is formed by bonding and laminating two sheets 2 and 3 with an adhesive layer 4 . In this embodiment, the glass sheet 2, the resin sheet 3, and the adhesive layer 4 are all transparent bodies, but are not limited thereto.

圖2中以二點鏈線表示的切斷預定線5是表示下文所述的切斷步驟中積層體1的切斷位置的線。切斷預定線5在俯視下呈閉環,並且成為積層體1所包括的製品部1a與廢棄部1b的邊界線。製品部1a是之後成為製品的部位,廢棄部1b是不會成為製品而被廢棄的部位。製品部1a在俯視下呈四角彎曲的矩形狀。再者,製品部1a的形狀亦可不為矩形狀(例如為圓形、橢圓形等)。若在切斷步驟中切斷積層體1,則自該積層體1挖出製品部1a。A planned cutting line 5 indicated by a two-dot chain line in FIG. 2 is a line indicating a cutting position of the laminate 1 in a cutting step described below. The line to cut 5 forms a closed loop in plan view, and serves as a boundary line between the product portion 1 a and the discarded portion 1 b included in the laminate 1 . The product part 1a is a part that becomes a product later, and the discard part 1b is a part that is discarded without becoming a product. The product portion 1a has a rectangular shape with four corners bent in plan view. In addition, the shape of the product part 1a does not need to be a rectangular shape (for example, a circle, an ellipse, etc.). When the laminated body 1 is cut in the cutting step, the product portion 1a is dug out from the laminated body 1 .

積層體1的厚度並無限定,本實施方式中的積層體1具有能夠賦予可撓性的程度的厚度。藉此,自積層體1挖出的製品部1a例如可用作具有能夠彎曲的柔性的元件(可攜式終端等)的蓋玻璃。再者,就對積層體1賦予可撓性的觀點而言,積層體1的厚度較佳為500 μm以下,進而較佳為250 μm以下,最佳為125 μm以下。The thickness of the laminated body 1 is not limited, and the laminated body 1 in this embodiment has a thickness to the extent that flexibility can be imparted. Thereby, the product part 1a excavated from the laminated body 1 can be used as a cover glass of the bendable flexible element (a portable terminal etc.), for example. Furthermore, from the viewpoint of imparting flexibility to the laminate 1, the thickness of the laminate 1 is preferably 500 μm or less, more preferably 250 μm or less, most preferably 125 μm or less.

玻璃片材2的厚度較佳為200 μm以下,進而較佳為100 μm以下,最佳為50 μm以下。在本實施方式中,玻璃片材2的厚度為100 μm。作為玻璃片材2的種類,較佳為使用硼矽酸玻璃、鈉鈣玻璃、鋁矽酸鹽玻璃,最佳為使用無鹼玻璃或化學強化玻璃。除此以外,作為玻璃片材2的種類,亦可使用矽酸鹽玻璃、二氧化矽玻璃等。再者,在使用化學強化玻璃的情況下,可將鋁矽酸鹽玻璃進行化學強化而使用。在本實施方式中,使用無鹼玻璃作為玻璃片材2。The thickness of the glass sheet 2 is preferably not more than 200 μm, more preferably not more than 100 μm, most preferably not more than 50 μm. In this embodiment, the thickness of the glass sheet 2 is 100 μm. As the type of the glass sheet 2, it is preferable to use borosilicate glass, soda lime glass, or aluminosilicate glass, and it is most preferable to use non-alkali glass or chemically strengthened glass. In addition, as the kind of glass sheet 2, silicate glass, silica glass, etc. can also be used. In addition, when chemically strengthened glass is used, aluminosilicate glass can be chemically strengthened and used. In this embodiment, alkali-free glass is used as the glass sheet 2 .

在使用無鹼玻璃作為玻璃片材2的情況下,積層體1的透明性提高。此處,所謂「無鹼玻璃」是實質上不含鹼性成分(鹼金屬氧化物)的玻璃,具體而言,為鹼性成分的重量比為3000 ppm以下的玻璃。再者,鹼性成分的重量比較佳為1000 ppm以下,更佳為500 ppm以下,最佳為300 ppm以下。When using alkali-free glass as the glass sheet 2, the transparency of the laminated body 1 improves. Here, the "alkali-free glass" is glass that does not substantially contain alkali components (alkali metal oxides), specifically, glass in which the weight ratio of alkali components is 3000 ppm or less. Furthermore, the weight ratio of the alkaline component is preferably less than 1000 ppm, more preferably less than 500 ppm, most preferably less than 300 ppm.

玻璃片材2可藉由浮式法、滾壓法、流孔下引法、再曳引法等成形,較佳為藉由溢流下拉法所成形者。藉由溢流下拉法,玻璃片材2可獲得高的表面平滑性。藉此,能夠提高玻璃片材2與接著層4的密接力,而能夠使玻璃片材2與樹脂片材3準確且精密地積層。The glass sheet 2 can be formed by a float method, a rolling method, an orifice downdraw method, a redraw method, etc., and is preferably formed by an overflow downdraw method. By the overflow down-draw method, the glass sheet 2 can obtain high surface smoothness. Thereby, the adhesive force of the glass sheet 2 and the adhesive layer 4 can be improved, and the glass sheet 2 and the resin sheet 3 can be laminated|stacked accurately and precisely.

樹脂片材3的厚度較佳為200 μm以下,進而較佳為100 μm以下,最佳為50 μm以下。在本實施方式中,樹脂片材3的厚度為100 μm。作為樹脂片材3的種類,可使用聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚萘二甲酸乙二酯(polyethylene naphthalate,PEN)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯樹脂(polymethyl methacrylate,PMMA)、聚醯亞胺(polyimide,PI)等。在本實施方式中,使用聚對苯二甲酸乙二酯作為樹脂片材3。The thickness of the resin sheet 3 is preferably not more than 200 μm, more preferably not more than 100 μm, most preferably not more than 50 μm. In this embodiment, the thickness of the resin sheet 3 is 100 μm. As the kind of resin sheet 3, polyethylene terephthalate (polyethylene terephthalate, PET), polyethylene naphthalate (polyethylene naphthalate, PEN), polycarbonate (polycarbonate, PC), polyform Base methyl acrylate resin (polymethyl methacrylate, PMMA), polyimide (polyimide, PI) and so on. In this embodiment, polyethylene terephthalate is used as the resin sheet 3 .

接著層4的厚度較佳為100 μm以下,進而較佳為50 μm以下,最佳為25 μm以下。在本實施方式中,接著層4的厚度為25 μm。作為接著層4,例如可使用丙烯酸系、矽酮系、胺基甲酸酯系等黏著片材或紫外線硬化型樹脂、熱固性樹脂等。在本實施方式中,使用光學用黏著劑(Optical Clear Adhesive,OCA)作為接著層4。The thickness of the subsequent layer 4 is preferably less than 100 μm, more preferably less than 50 μm, most preferably less than 25 μm. In this embodiment, the thickness of the adhesive layer 4 is 25 μm. As the adhesive layer 4 , for example, an adhesive sheet such as an acrylic type, a silicone type, or a urethane type, an ultraviolet curable resin, a thermosetting resin, or the like can be used. In this embodiment, an optical adhesive (Optical Clear Adhesive, OCA) is used as the adhesive layer 4 .

以下,對本製造方法所包括的切斷步驟進行詳細說明。Hereinafter, the cutting step included in this production method will be described in detail.

在切斷步驟中,沿著切斷預定線5切斷所述積層體1。切斷步驟按照時間序列的順序,包括樹脂層切斷步驟P1(圖3、圖4)、凹部形成步驟P2(圖5、圖6)、裂紋形成步驟P3(圖7)、及玻璃層折斷步驟P4(圖8、圖9)。In the cutting step, the laminated body 1 is cut along the planned cutting line 5 . The cutting steps are in chronological order, including the resin layer cutting step P1 (Fig. 3, Fig. 4), the recess forming step P2 (Fig. 5, Fig. 6), the crack forming step P3 (Fig. 7), and the glass layer breaking step P4 (Figure 8, Figure 9).

<樹脂層切斷步驟> 如圖3及圖4所示,在樹脂層切斷步驟P1中,沿著切斷預定線5自樹脂片材3側對積層體1照射雷射6,藉此切斷樹脂片材3。再者,雷射6的照射使用雷射照射器7。 <Resin layer cutting procedure> As shown in FIGS. 3 and 4 , in the resin layer cutting step P1 , the resin sheet 3 is cut by irradiating the laminate 1 with laser light 6 from the resin sheet 3 side along the planned cutting line 5 . In addition, a laser irradiator 7 is used for irradiation of the laser beam 6 .

作為樹脂層切斷步驟P1的具體態樣,如圖4中箭頭D1~箭頭D4所示,使對積層體1照射的雷射6沿著切斷預定線5環繞。再者,在本實施方式中,使雷射6多次環繞切斷預定線5所形成的閉環。而且,在本實施方式中,使用超短脈衝雷射作為雷射6,藉由使用超短脈衝雷射的剝蝕加工切斷樹脂片材3的總厚度。藉此,形成切斷樹脂片材3而成的切斷部3a。再者,在切斷預定線5上,開始雷射6的照射的地點、及結束照射的地點可設為任意地點。而且,使雷射6沿著切斷預定線5移動的速度(掃描速度)例如為0.1 m/s~5 m/s。As a specific aspect of the resin layer cutting step P1 , as shown by arrows D1 to D4 in FIG. 4 , the laser beam 6 irradiated on the laminate 1 is circled along the line to cut 5 . Furthermore, in this embodiment, the closed loop formed by making the laser beam 6 surround the planned cutting line 5 multiple times. Furthermore, in the present embodiment, an ultrashort pulse laser is used as the laser 6, and the entire thickness of the resin sheet 3 is cut by ablation processing using the ultrashort pulse laser. Thereby, the cut part 3a which cut the resin sheet 3 is formed. In addition, on the planned cutting line 5, the point where irradiation of the laser beam 6 starts, and the point where irradiation ends can be set as arbitrary points. Furthermore, the speed (scanning speed) at which the laser beam 6 is moved along the line to cut 5 is, for example, 0.1 m/s to 5 m/s.

在樹脂層切斷步驟P1中,除了樹脂片材3以外還切斷接著層4的厚度的一部分。即,如圖3中的A部的放大圖所示,在樹脂層切斷步驟P1結束的時點,使接著層4的厚度的一部分以未切斷的狀態殘留。設為此種態樣的目的在於避免雷射6的熱影響不當地波及至玻璃片材2。再者,以未切斷的狀態殘留的接著層4亦應避免妨礙積層體1的順利切斷。因此,就兼顧避免對玻璃片材2的熱影響與積層體1的順利切斷的觀點而言,較佳為將以未切斷的狀態殘留的接著層4的厚度t設為1 μm~10 μm。在本實施方式中,以厚度t的值成為所述範圍內的方式調節雷射6沿著切斷預定線5環繞的環繞數。In the resin layer cutting step P1 , a part of the thickness of the adhesive layer 4 is cut in addition to the resin sheet 3 . That is, as shown in the enlarged view of part A in FIG. 3 , when the resin layer cutting step P1 is completed, a part of the thickness of the adhesive layer 4 remains in an uncut state. The purpose of adopting such an aspect is to prevent the thermal influence of the laser beam 6 from inadvertently affecting the glass sheet 2 . Furthermore, the adhesive layer 4 remaining in the uncut state should also avoid hindering the smooth cutting of the laminated body 1 . Therefore, from the viewpoint of avoiding thermal influence on the glass sheet 2 and smooth cutting of the laminate 1, it is preferable to set the thickness t of the adhesive layer 4 remaining in an uncut state to 1 μm to 10 μm. μm. In the present embodiment, the number of turns of the laser beam 6 along the line to cut 5 is adjusted so that the value of the thickness t falls within the above range.

再者,在之後執行的玻璃層折斷步驟P4中將玻璃片材2折斷而切斷時,多數情況下以未切斷的狀態殘留的接著層4與玻璃片材2一起被切斷。而且,即便在未與玻璃片材2一起被切斷的情況下,由於所殘留的接著層4的厚度極薄,故而亦僅藉由施加少許的力(拉伸力、剪切力等)即能夠容易地切斷。In addition, when breaking and cutting the glass sheet 2 in the glass layer breaking step P4 performed later, the adhesive layer 4 which remains in the uncut state is often cut together with the glass sheet 2. Moreover, even when the glass sheet 2 is not cut together, since the thickness of the remaining adhesive layer 4 is extremely thin, it can Can be easily cut off.

此處,作為雷射6的種類,能夠使用紫外線(ultra violet,UV)雷射、CO 2雷射等。在本實施方式中,使用UV雷射。而且,作為雷射6的波長,較佳為設為200 nm~12000 nm,進而較佳為設為300 nm~8000 nm,最佳為設為350 nm~4000 nm。在本實施方式中,將波長設為355 nm。進而,作為雷射6的脈衝寬度,較佳為設為皮秒級或飛秒級,具體而言設為500 ps以下。再者,更佳為300 ps以下,最佳為100 ps以下。 Here, as the type of the laser 6 , an ultraviolet (ultra violet, UV) laser, a CO 2 laser, or the like can be used. In this embodiment, UV laser is used. Furthermore, the wavelength of the laser beam 6 is preferably 200 nm to 12000 nm, more preferably 300 nm to 8000 nm, most preferably 350 nm to 4000 nm. In this embodiment, the wavelength is set to 355 nm. Furthermore, as the pulse width of the laser 6, it is preferable to set it as a picosecond order or a femtosecond order, and specifically, to set it as 500 ps or less. Furthermore, it is more preferably below 300 ps, most preferably below 100 ps.

藉由樹脂層切斷步驟P1所形成的切斷部3a的寬度W較佳為0.005 mm~0.5 mm。若切斷部3a的寬度W窄於0.005 mm,則有所切斷的接著層4可能不當地再次結合之虞。另一方面,若切斷部3a的寬度W寬於0.5 mm,則有之後執行的凹部形成步驟P2中發生異常之虞。詳細而言,若切斷部3a的寬度W過寬,則如圖5所示,在為了形成凹部2a而利用鑽尖8按壓玻璃片材2的表面時,有寬的切斷部3a不當地導致玻璃片材2撓曲而無法順利按壓之虞。The width W of the cut portion 3 a formed by the resin layer cutting step P1 is preferably 0.005 mm˜0.5 mm. If the width W of the cut portion 3a is narrower than 0.005 mm, there is a possibility that the cut adhesive layer 4 may be improperly rejoined. On the other hand, if the width W of the cut portion 3 a is wider than 0.5 mm, there is a possibility that an abnormality may occur in the concave portion forming step P2 to be performed later. Specifically, if the width W of the cutting portion 3a is too large, as shown in FIG. There is a risk that the glass sheet 2 will bend and cannot be pressed smoothly.

<凹部形成步驟> 如圖5及圖6所示,在凹部形成步驟P2中,藉由使按壓玻璃片材2的表面的鑽尖8沿著切斷預定線5移動,而沿著切斷預定線5形成玻璃片材2的表面發生塑性變形而成的凹部2a。此處,在本實施方式中,在執行凹部形成步驟P2時,使積層體1的上下(表背)相對於執行樹脂層切斷步驟P1時反轉。 <Concave forming step> As shown in FIGS. 5 and 6 , in the concave portion forming step P2, the glass sheet is formed along the line to cut 5 by moving the drill tip 8 pressing the surface of the glass sheet 2 along the line to cut 5 . The concave portion 2a formed by plastic deformation on the surface of the material 2. Here, in the present embodiment, when the concave portion forming step P2 is performed, the upper and lower sides (front and back) of the laminate 1 are reversed with respect to the time when the resin layer cutting step P1 is performed.

鑽尖8包括柄部8a、及固定於柄部8a的一端部的刀尖8b。柄部8a例如包含金屬,形成為圓柱狀或多角柱狀。刀尖8b例如包含單晶或多晶的金剛石,除此以外,亦可包含聚晶立方氮化硼(Polycrystalline Cubic Boron Nitride,PCBN)、陶瓷、超硬合金、其他金屬。刀尖8b藉由接著劑、釺料等固定於柄部8a。The drill tip 8 includes a shank 8a and a cutting edge 8b fixed to one end of the shank 8a. The shank 8a is made of metal, for example, and is formed in a cylindrical shape or a polygonal column shape. The blade tip 8 b includes, for example, single crystal or polycrystalline diamond, and may also include polycrystalline cubic boron nitride (PCBN), ceramics, cemented carbide, and other metals. The blade tip 8b is fixed to the shank 8a by an adhesive, a paste, or the like.

作為凹部形成步驟P2的具體態樣,如圖6所示,以存在於切斷預定線5上的點5a作為開始玻璃片材2的表面按壓的地點。並且,如箭頭E1~箭頭E4所示,使鑽尖8沿著切斷預定線5移動。藉此,繞了切斷預定線5一周的鑽尖8再次返回點5a。其後,繼續以鑽尖8按壓玻璃片材2的表面,並且如箭頭E5所示,使鑽尖8移動至玻璃片材2的端部(點2e)。藉此,並非僅沿著切斷預定線5,而是在點5a至點2e的區間亦形成凹部2a。再者,作為開始按壓的地點的點5a的位置只要為切斷預定線5上,則可設為任意地點。而且,使鑽尖8沿著切斷預定線5移動的速度(移行速度)例如為1 mm/s~500 mm/s。As a specific aspect of the concave portion forming step P2 , as shown in FIG. 6 , the point 5 a present on the planned cutting line 5 is used as the point where the surface pressing of the glass sheet 2 is started. Then, as indicated by arrows E1 to E4 , the drill tip 8 is moved along the planned cutting line 5 . Thereby, the drill tip 8 which has circled the planned cutting line 5 once again returns to the point 5a. Thereafter, while continuing to press the surface of the glass sheet 2 with the drill point 8 , the drill point 8 is moved to the end of the glass sheet 2 as indicated by the arrow E5 (point 2 e ). Thereby, not only along the planned cutting line 5 but also in the section from the point 5a to the point 2e, the concave portion 2a is formed. In addition, the position of the point 5a which is the point where pressing starts can be set to any point as long as it is on the planned cutting line 5. FIG. Furthermore, the speed (travel speed) at which the drill tip 8 is moved along the planned cutting line 5 is, for example, 1 mm/s to 500 mm/s.

此處,作為本實施方式的變形例,可為在繞了切斷預定線5一周的鑽尖8再次返回點5a後,使鑽尖8在點5a至點2e的區間的途中停止,而非到達玻璃片材2的端部(點2e)。在該情況下,沿著切斷預定線5形成凹部2a,並且使凹部2a形成至自點5a至點2e的區間的途中(以下將同一變形例表述為凹部形成變形例)。Here, as a modified example of this embodiment, after the drill tip 8 that has circled the planned cutting line 5 once again returns to the point 5a, the drill tip 8 may be stopped midway between the point 5a and the point 2e, instead of The end of the glass sheet 2 is reached (point 2e). In this case, the recess 2 a is formed along the line to cut 5 , and the recess 2 a is formed in the middle of the section from the point 5 a to the point 2 e (hereinafter, the same modification will be referred to as a recess forming modification).

如圖5中的B部的放大圖(放大圖中省略鑽尖8的圖示)所示,在凹部2a的表層部形成壓縮應力發揮作用的壓縮應力層2ax。而且,在壓縮應力層2ax的正下方形成拉伸應力發揮作用的拉伸應力層2ay。As shown in the enlarged view of part B in FIG. 5 (the drill tip 8 is omitted from the enlarged view), a compressive stress layer 2ax in which compressive stress acts is formed on the surface portion of the concave portion 2a. Furthermore, the tensile stress layer 2ay in which tensile stress acts is formed directly under the compressive stress layer 2ax.

<裂紋形成步驟> 如圖7所示,在裂紋形成步驟P3中,沿著凹部2a形成裂紋線9。 <Crack Formation Procedure> As shown in FIG. 7 , in the crack forming step P3 , a crack line 9 is formed along the concave portion 2 a.

在本實施方式中,在上述凹部形成步驟P2中,若鑽尖8到達玻璃片材2的端部(點2e),則伴隨於此而在拉伸應力層2ay形成裂紋線9。此時,沿著與形成凹部2a時鑽尖8移動的方向相反的方向形成裂紋線9。即,自玻璃片材2的端部(點2e)起開始裂紋線9的形成,裂紋線9按照箭頭E5~箭頭E1的順序發展,在點5a處停止裂紋線9的形成。藉此,沿著切斷預定線5的全長形成裂紋線9。In the present embodiment, when the drill tip 8 reaches the end (point 2 e ) of the glass sheet 2 in the concave portion forming step P2 described above, the crack line 9 is formed in the tensile stress layer 2ay along with it. At this time, the crack line 9 is formed in a direction opposite to the direction in which the drill tip 8 moves when forming the concave portion 2a. That is, the formation of the crack line 9 starts from the end (point 2 e ) of the glass sheet 2 , the crack line 9 develops in the order of the arrows E5 to E1 , and the formation of the crack line 9 stops at the point 5 a. Thereby, the crack line 9 is formed along the entire length of the line to cut 5 .

此處,在凹部形成步驟P2中應用上述凹部形成變形例的情況下,在裂紋形成步驟P3中,作為一例而以如下述的形態形成裂紋線9。首先,準備輪式切割機。其次,以與形成至自點5a至點2e的區間的途中的凹部2a交叉的方式,使輪式切割機在玻璃片材2的表面上滾動。藉此,以橫穿凹部2a的方式在玻璃片材2的表面形成劃痕。由此,自凹部2a與劃痕交叉的地點起開始裂紋線9的形成,在點5a處停止裂紋線9的形成。藉此,沿著切斷預定線5的全長形成裂紋線9。Here, in the case of applying the above-described recess forming modification in the recess forming step P2, in the crack forming step P3, as an example, the crack line 9 is formed in the following form. First, prepare the wheel cutter. Next, the wheel cutter is rolled on the surface of the glass sheet 2 so that it may intersect with the recessed part 2a formed in the middle of the section from the point 5a to the point 2e. Thereby, scratches are formed on the surface of the glass sheet 2 so as to cross the recessed part 2a. As a result, the formation of the crack line 9 starts from the point where the concave portion 2 a intersects the scratch, and the formation of the crack line 9 stops at the point 5 a. Thereby, the crack line 9 is formed along the entire length of the line to cut 5 .

<玻璃層折斷步驟> 如圖8及圖9所示,在玻璃層折斷步驟P4中,以裂紋線9為起點將玻璃片材2折斷而切斷。在折斷玻璃片材2時,如圖8中二點鏈線所示,以玻璃片材2中形成有裂紋線9的面側凸出的方式使積層體1彎曲。藉此,形成將玻璃片材2切斷而成的切斷部2x。再者,玻璃片材2的折斷是以圖9所示的點2e作為開始的地點,按照箭頭F1~箭頭F5所示的順序進行。並且,將同一圖所示的點5a設為折斷結束的地點。玻璃片材2的折斷結束後,將積層體1的總厚度切斷,而自積層體1挖出製品部1a。藉由以上,結束切斷步驟所包括的全部步驟。 <Procedure for breaking the glass layer> As shown in FIGS. 8 and 9 , in the glass layer breaking step P4 , the glass sheet 2 is broken and cut starting from the crack line 9 . When the glass sheet 2 is broken, the laminated body 1 is bent so that the surface side of the glass sheet 2 on which the crack line 9 is formed protrudes as shown by the two-dot chain line in FIG. 8 . Thereby, the cut part 2x which cut the glass sheet 2 is formed. In addition, the breaking of the glass sheet 2 is performed in the order shown by arrow F1 - arrow F5 starting from the point 2e shown in FIG. 9 . And, let the point 5a shown in the same figure be the point where the breaking is completed. After the breaking of the glass sheet 2 is completed, the entire thickness of the laminate 1 is cut, and the product portion 1 a is dug out from the laminate 1 . Through the above, all the steps included in the cutting step are completed.

此處,對於所述實施方式,亦可應用如以下的變形例。Here, the following modifications can also be applied to the above-described embodiment.

執行樹脂層切斷步驟P1~玻璃層折斷步驟P4的順序亦可不同於所述實施方式。在四個步驟P1~步驟P4中,三個步驟P2~步驟P4需要按照與所述實施方式相同的順序執行,但執行樹脂層切斷步驟P1的時機可變更而不同於所述實施方式。即,可在凹部形成步驟P2與裂紋形成步驟P3之間、裂紋形成步驟P3與玻璃層折斷步驟P4之間、玻璃層折斷步驟P4之後的任一時機執行樹脂層切斷步驟P1。The order of performing resin layer cutting process P1 - glass layer breaking process P4 may differ from the said embodiment. Among the four steps P1 to P4, the three steps P2 to P4 need to be performed in the same order as in the above embodiment, but the timing of performing the resin layer cutting step P1 can be changed from the above embodiment. That is, the resin layer cutting step P1 can be performed at any timing between the recess forming step P2 and the crack forming step P3, between the crack forming step P3 and the glass layer breaking step P4, and after the glass layer breaking step P4.

其中,較佳為在執行裂紋形成步驟P3後,不間隔樹脂層切斷步驟P1,而繼續執行玻璃層折斷步驟P4。其原因在於:抑制玻璃片材2在執行玻璃層折斷步驟P4之前被意外地切斷的情況。而且,較佳為在執行玻璃層折斷步驟P4之前執行樹脂層切斷步驟P1。其原因在於:在切斷玻璃片材2後,只要能夠使處於相向的狀態的玻璃片材2的端面彼此(藉由切斷所形成的端面彼此)立即背離,則在避免由端面彼此的接觸引起的端面強度的降低的方面有利。Among them, preferably, after the crack formation step P3 is performed, the glass layer breaking step P4 is continuously performed without intervening the resin layer cutting step P1. The reason for this is to suppress the glass sheet 2 from being accidentally cut before the glass layer breaking step P4 is performed. Furthermore, it is preferable to perform the resin layer cutting process P1 before performing the glass layer breaking process P4. The reason is that after the glass sheet 2 is cut, as long as the end faces of the facing glass sheets 2 (the end faces formed by cutting) can be separated from each other immediately, the contact between the end faces will be avoided. It is advantageous in terms of the resulting reduction in the strength of the end faces.

再者,於在玻璃層折斷步驟P4之後執行樹脂層切斷步驟P1的情況下,樹脂層切斷步驟P1所使用的雷射6的脈衝寬度無需如所述實施方式般為皮秒級或飛秒級,亦可為奈秒級。Furthermore, in the case where the resin layer cutting step P1 is performed after the glass layer breaking step P4, the pulse width of the laser 6 used in the resin layer cutting step P1 does not need to be on the order of picoseconds or femtoseconds as in the above embodiment. Second level, can also be nanosecond level.

而且,在所述實施方式中,採用切斷預定線5呈閉環且自積層體1挖出製品部1a的形態,但不限於此。例如亦可設為藉由沿著直線延伸的切斷預定線5切斷積層體1而將積層體1分斷成兩部分的形態。In addition, in the above-described embodiment, the line to cut 5 forms a closed loop and the product part 1a is dug out from the laminate 1, but the present invention is not limited thereto. For example, the laminated body 1 may be divided into two by cutting the laminated body 1 along the line to cut 5 extending linearly.

1:積層體 1a:製品部 1b:廢棄部 2:玻璃片材 2a:凹部 2ax:壓縮應力層 2ay:拉伸應力層 2e、5a:點 2x、3a:切斷部 3:樹脂片材 4:接著層 5:切斷預定線 6:雷射 7:雷射照射器 8:鑽尖 8a:柄部 8b:刀尖 9:裂紋線 A、B:放大圖 D1~D4、E1~E5、F1~F5:箭頭 P1:樹脂層切斷步驟 P2:凹部形成步驟 P3:裂紋形成步驟 P4:玻璃層折斷步驟 t:厚度 W:寬度 1: laminated body 1a: Products Department 1b: Abandoned Department 2: glass sheet 2a: concave part 2ax: compressive stress layer 2ay: tensile stress layer 2e, 5a: point 2x, 3a: cutting part 3: Resin sheet 4: Next layer 5: cut off the scheduled line 6:Laser 7:Laser irradiator 8: drill point 8a: Shank 8b: Knife tip 9: crack line A, B: Zoom in D1~D4, E1~E5, F1~F5: Arrows P1: Resin layer cutting step P2: concave part forming step P3: Crack formation step P4: Glass layer breaking step t: thickness W: width

圖1是表示積層體的剖視圖。 圖2是表示積層體的平面圖。 圖3是表示積層體的製造方法所包括的樹脂層切斷步驟的剖視圖。 圖4是表示積層體的製造方法所包括的樹脂層切斷步驟的平面圖。 圖5是表示積層體的製造方法所包括的凹部形成步驟的剖視圖。 圖6是表示積層體的製造方法所包括的凹部形成步驟的平面圖。 圖7是表示積層體的製造方法所包括的裂紋形成步驟的剖視圖。 圖8是表示積層體的製造方法所包括的玻璃層折斷步驟的剖視圖。 圖9是表示積層體的製造方法所包括的玻璃層折斷步驟的平面圖。 FIG. 1 is a cross-sectional view showing a laminate. Fig. 2 is a plan view showing a laminate. Fig. 3 is a cross-sectional view showing a resin layer cutting step included in the method of manufacturing the laminate. 4 is a plan view showing a step of cutting a resin layer included in the method of manufacturing a laminate. Fig. 5 is a cross-sectional view showing a concave portion forming step included in the method of manufacturing the laminate. 6 is a plan view showing a concave portion forming step included in the method of manufacturing the laminate. 7 is a cross-sectional view showing a crack formation step included in the method of manufacturing the laminate. Fig. 8 is a cross-sectional view showing a glass layer breaking step included in the method of manufacturing the laminate. Fig. 9 is a plan view showing a glass layer breaking step included in the method of manufacturing the laminate.

1:積層體 1: laminated body

2:玻璃片材 2: glass sheet

2a:凹部 2a: concave part

2ax:壓縮應力層 2ax: compressive stress layer

2ay:拉伸應力層 2ay: tensile stress layer

3:樹脂片材 3: Resin sheet

3a:切斷部 3a: cutting part

4:接著層 4: Next layer

5:切斷預定線 5: cut off the scheduled line

9:裂紋線 9: crack line

B:放大圖 B: Zoom in

P3:裂紋形成步驟 P3: Crack formation step

Claims (5)

一種積層體的製造方法,包括沿著切斷預定線切斷將玻璃層與樹脂層積層而成的積層體的步驟, 所述積層體的製造方法的特徵在於所述切斷的步驟包括: 樹脂層切斷步驟,沿著所述切斷預定線自所述樹脂層側對所述積層體照射雷射,藉此切斷所述樹脂層; 凹部形成步驟,使按壓所述玻璃層的表面的鑽尖沿著所述切斷預定線移動,藉此沿著所述切斷預定線形成所述玻璃層的表面發生塑性變形而成的凹部; 裂紋形成步驟,沿著所述凹部形成裂紋線;及 玻璃層折斷步驟,以所述裂紋線為起點,將所述玻璃層折斷而切斷。 A method for manufacturing a laminate, comprising the step of cutting a laminate obtained by laminating a glass layer and a resin layer along a planned cutting line, The manufacturing method of the laminate is characterized in that the step of cutting includes: a resin layer cutting step of irradiating the laminate with laser light from the resin layer side along the planned cutting line, thereby cutting the resin layer; The step of forming a concave portion, moving a drill bit pressing the surface of the glass layer along the line to cut, thereby forming a concave portion in which the surface of the glass layer is plastically deformed along the line to cut; a crack forming step of forming a crack line along said recess; and In the step of breaking the glass layer, the glass layer is broken and cut starting from the crack line. 如請求項1所述的積層體的製造方法,其中在執行所述玻璃層折斷步驟之前,執行所述樹脂層切斷步驟。The method for manufacturing a laminate according to claim 1, wherein the step of cutting the resin layer is performed before the step of breaking the glass layer. 如請求項2所述的積層體的製造方法,其中在所述玻璃層與所述樹脂層之間介置有將兩層接著的接著層, 在所述樹脂層切斷步驟中,除了所述樹脂層以外還切斷所述接著層的厚度的一部分。 The method for manufacturing a laminate according to claim 2, wherein an adhesive layer for bonding the two layers is interposed between the glass layer and the resin layer, In the resin layer cutting step, a part of the thickness of the adhesive layer is cut in addition to the resin layer. 如請求項2或請求項3所述的積層體的製造方法,其中作為所述雷射,而使用脈衝寬度為500 ps以下的雷射。The method of manufacturing a laminate according to Claim 2 or Claim 3, wherein a laser having a pulse width of 500 ps or less is used as the laser. 如請求項1至請求項4中任一項所述的積層體的製造方法,其中在執行所述裂紋形成步驟後接續執行所述玻璃層折斷步驟。The method for manufacturing a laminate according to any one of claim 1 to claim 4, wherein the step of breaking the glass layer is performed successively after the step of forming the crack.
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