TW202330140A - Method for manufacturing laminate - Google Patents
Method for manufacturing laminate Download PDFInfo
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- TW202330140A TW202330140A TW111148633A TW111148633A TW202330140A TW 202330140 A TW202330140 A TW 202330140A TW 111148633 A TW111148633 A TW 111148633A TW 111148633 A TW111148633 A TW 111148633A TW 202330140 A TW202330140 A TW 202330140A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000011521 glass Substances 0.000 claims abstract description 120
- 238000005520 cutting process Methods 0.000 claims abstract description 89
- 239000011347 resin Substances 0.000 claims abstract description 70
- 229920005989 resin Polymers 0.000 claims abstract description 70
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 127
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 12
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 2
- 239000005345 chemically strengthened glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007500 overflow downdraw method Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Dicing (AREA)
Abstract
Description
本揭示是有關於一種積層體的製造方法,詳細而言,本揭示是有關於一種包括如下步驟的方法:在製造將玻璃層與樹脂層積層而成的積層體時,將成為其基礎的積層體切斷。This disclosure relates to a method for manufacturing a laminate. Specifically, this disclosure relates to a method including the steps of: when manufacturing a laminate obtained by laminating a glass layer and a resin layer, the laminate to be the base body cut off.
玻璃板的耐候性、耐化學品性、耐擦傷性優異,另一方面,具有針對物理衝擊或熱衝擊而容易破損的缺點。為了消除該玻璃板的缺點,而提出有一種將由玻璃板形成的玻璃層與由樹脂板形成的樹脂層積層並一體化而成的積層體。While the glass plate is excellent in weather resistance, chemical resistance, and scratch resistance, it has a disadvantage of being easily damaged by physical shock or thermal shock. In order to eliminate the disadvantages of the glass plate, a laminate in which a glass layer formed of a glass plate and a resin laminate formed of a resin plate are laminated and integrated has been proposed.
樹脂板與玻璃板相比,耐候性、耐化學品性、耐擦傷性較差,另一方面,具有比重小於玻璃板、耐物理衝擊性亦強的優點。因此,在所述積層體中,能夠藉由玻璃板與樹脂板各自的長處彌補各自的短處。進而,在所述積層體中,和具有與該積層體相同的厚度的玻璃板相比,亦能夠實現大幅輕量化。Compared with glass plates, resin plates are inferior in weather resistance, chemical resistance, and scratch resistance. On the other hand, they have the advantages of having a smaller specific gravity than glass plates and strong physical impact resistance. Therefore, in the above-mentioned laminate, the advantages of each of the glass plate and the resin plate can make up for each of the disadvantages. Furthermore, in the laminated body, it is also possible to significantly reduce the weight compared with a glass plate having the same thickness as the laminated body.
用以製造所述積層體的步驟多數情況包括將成為其基礎的積層體切斷的步驟。專利文獻1中揭示有切斷積層體的方法的一例。The steps for producing the above-mentioned laminate often include a step of cutting the base laminate.
在同一方法中,在切斷將玻璃層與樹脂層積層而成的積層體時,首先,對積層體的樹脂層照射雷射,藉此執行切斷樹脂層的步驟。其後,對積層體的玻璃層照射超短脈衝雷射,藉此執行切斷玻璃層的步驟。藉由執行該兩個步驟,而將積層體的總厚度切斷。 現有技術文獻 專利文獻 In the same method, when cutting a laminate obtained by laminating a glass layer and a resin, first, the resin layer of the laminate is irradiated with laser light, thereby performing a step of cutting the resin layer. Thereafter, the step of cutting the glass layer is performed by irradiating the glass layer of the laminate with an ultrashort pulse laser. By performing these two steps, the total thickness of the laminate is cut. prior art literature patent documents
專利文獻1:日本專利特開2019-122966號公報Patent Document 1: Japanese Patent Laid-Open No. 2019-122966
[發明所欲解決之課題] 在利用所述方法切斷積層體的情況下,因玻璃層的切斷使用超短脈衝雷射,使得切斷後的玻璃層的端面包含缺陷(裂紋等),由此導致有時玻璃層的端面強度變得不充分。尤其是在具有能夠彎曲的柔性的元件等所採用的薄型的積層體中,玻璃層的端面強度的不足變得顯著。 [Problem to be Solved by the Invention] In the case of cutting the laminated body by the above method, since an ultrashort pulse laser is used for cutting the glass layer, the end surface of the cut glass layer contains defects (cracks, etc.), which may cause the end surface of the glass layer to be damaged. Strength becomes insufficient. In particular, in a thin laminate used for a bendable flexible element, etc., the lack of end surface strength of the glass layer becomes conspicuous.
鑒於所述情況,應解決的技術課題在於:在製造將玻璃層與樹脂層積層而成的積層體時,在將成為其基礎的積層體切斷的情況下,提高切斷後的玻璃層的端面強度。 [解決課題之手段] In view of the above, the technical problem to be solved is to raise the end surface of the glass layer after cutting when cutting the laminated body which is the base when manufacturing a laminated body obtained by laminating a glass layer and a resin layer. strength. [Means to solve the problem]
用以解決所述課題的積層體的製造方法包括沿著切斷預定線切斷將玻璃層與樹脂層積層而成的積層體的步驟,所述積層體的製造方法的特徵在於切斷的步驟包括:樹脂層切斷步驟,沿著切斷預定線自樹脂層側對積層體照射雷射,藉此切斷樹脂層;凹部形成步驟,使按壓玻璃層的表面的鑽尖沿著切斷預定線移動,藉此沿著切斷預定線形成玻璃層的表面發生塑性變形而成的凹部;裂紋形成步驟,沿著凹部形成裂紋線;及玻璃層折斷步驟,以裂紋線為起點,將玻璃層折斷而切斷。A method for producing a laminate for solving the above-mentioned problem includes a step of cutting a laminate formed by laminating a glass layer and a resin layer along a line to be cut, and the method for producing a laminate is characterized in that the step of cutting It includes: a step of cutting the resin layer, irradiating laser light on the laminate from the side of the resin layer along the planned cutting line, thereby cutting the resin layer; Line movement, thereby forming a concave portion formed by plastic deformation of the surface of the glass layer along the planned cutting line; a crack forming step, forming a crack line along the concave portion; and a glass layer breaking step, starting from the crack line, the glass layer To break off and cut off.
根據本方法,藉由執行凹部形成步驟及裂紋形成步驟,能夠避免玻璃層中側向裂紋的產生,並且形成裂紋線。若執行凹部形成步驟,則在使玻璃層的表面塑性變形所形成的凹部的表層部形成壓縮應力發揮作用的壓縮應力層。進而,在壓縮應力層的正下方形成拉伸應力發揮作用的拉伸應力層。其後,若執行裂紋形成步驟,則在拉伸應力層形成裂紋線。如此,藉由利用發生塑性變形而成的凹部形成裂紋線,而能夠防止伴隨形成而在玻璃層發生側向裂紋的情況。藉此,對於藉由執行玻璃層折斷步驟所形成的切斷後的玻璃層的端面,能夠設為不存在由側向裂紋引起的缺陷的端面。其結果為,能夠提高切斷後的玻璃層的端面強度。According to this method, by performing the concave portion forming step and the crack forming step, it is possible to avoid the generation of lateral cracks in the glass layer and to form crack lines. When the concave portion forming step is performed, a compressive stress layer in which compressive stress acts is formed on the surface layer portion of the concave portion formed by plastically deforming the surface of the glass layer. Furthermore, a tensile stress layer in which tensile stress acts is formed directly under the compressive stress layer. Thereafter, when the crack forming step is performed, crack lines are formed in the tensile stress layer. In this way, by forming the crack line using the concave portion that has undergone plastic deformation, it is possible to prevent the occurrence of lateral cracks in the glass layer accompanying the formation. Thereby, the end surface of the cut glass layer formed by performing the glass layer breaking step can be set as an end surface free of defects caused by side cracks. As a result, the end surface strength of the cut glass layer can be improved.
在所述方法中,較佳為在執行玻璃層折斷步驟之前,執行樹脂層切斷步驟。In the method, it is preferable to perform the step of cutting the resin layer before performing the step of breaking the glass layer.
由此,在執行玻璃層折斷步驟時,由於在同一步驟之前執行樹脂層切斷步驟,故而處於已切斷積層體的樹脂層的狀態。因此,在執行玻璃層折斷步驟而將玻璃層切斷後,切斷了積層體的總厚度,因此能夠使切斷後處於相向的狀態的玻璃層的端面彼此立即背離。藉此,能夠儘可能地排除切斷後的玻璃層的端面彼此接觸而端面強度降低的擔憂。Thus, when the glass layer breaking step is performed, since the resin layer cutting step is performed before the same step, the resin layer of the laminate is already cut. Therefore, since the total thickness of the laminate is cut after the glass layer is cut in the glass layer breaking step, the end faces of the glass layers facing each other after cutting can be separated from each other immediately. Thereby, the possibility that the end surfaces of the cut glass layers may come into contact with each other and the strength of the end surfaces may be reduced can be eliminated as much as possible.
在所述方法中,較佳為在玻璃層與樹脂層之間介置將兩層接著的接著層,在樹脂層切斷步驟中,除了樹脂層以外還切斷接著層的厚度的一部分。In the above method, it is preferable to interpose an adhesive layer connecting the two layers between the glass layer and the resin layer, and in the step of cutting the resin layer, a part of the thickness of the adhesive layer is cut in addition to the resin layer.
由此,對於在樹脂層切斷步驟中自樹脂層側對積層體照射的雷射,能夠儘可能地避免該雷射的熱影響不僅波及樹脂層、而且波及到玻璃層的情況。藉此,能夠儘可能地排除雷射的熱影響導致玻璃層產生缺陷的擔憂。Accordingly, it is possible to avoid as much as possible that the thermal influence of the laser irradiated on the laminated body from the resin layer side not only the resin layer but also the glass layer is affected by the laser in the resin layer cutting step. In this way, it is possible to eliminate as much as possible the fear of defects in the glass layer due to the thermal influence of the laser.
在所述方法中,較佳為作為雷射,使用脈衝寬度為500 ps以下的雷射。In the above method, it is preferable to use a laser with a pulse width of 500 ps or less as the laser.
由此,在執行樹脂層切斷步驟時,能夠大致確實地排除雷射的熱影響導致玻璃層產生缺陷的擔憂。As a result, when the resin layer cutting step is performed, it is possible to almost certainly eliminate the possibility of defects in the glass layer due to the thermal influence of the laser.
在所述方法中,較佳為在執行裂紋形成步驟後接續執行玻璃層折斷步驟。In the method, preferably, the glass layer breaking step is performed successively after the crack forming step is performed.
於在執行裂紋形成步驟後不接續同一步驟而執行玻璃層折斷步驟的情況下(在裂紋形成步驟與玻璃層折斷步驟之間執行其他步驟的情況等),在執行玻璃層折斷步驟之前,有玻璃層被意外地切斷之虞。在發生此種事態的情況下,玻璃層的端面(藉由意外的切斷所形成的端面)可以脫離裂紋線的狀態形成。其結果為,可能發生無法採用所製造的積層體作為製品的事態。然而,若在執行裂紋形成步驟後接續執行玻璃層折斷步驟,則能夠大致確實地排除上述擔憂,而能夠確保所製造的積層體的品質。 [發明的效果] In the case where the glass layer breaking step is performed without continuing the same step after the crack forming step (the case where other steps are performed between the crack forming step and the glass layer breaking step, etc.), before performing the glass layer breaking step, there is a glass Layers are at risk of being cut off accidentally. When such a situation occurs, the end face of the glass layer (the end face formed by accidental cutting) can be formed in a state detached from the crack line. As a result, a situation may arise where the manufactured laminate cannot be used as a product. However, if the glass layer breaking step is performed consecutively after the crack forming step, the above-mentioned concern can be almost certainly eliminated, and the quality of the laminate to be produced can be ensured. [Effect of the invention]
根據本發明的積層體的製造方法,在製造將玻璃層與樹脂層積層而成的積層體時,在將成為其基礎的積層體切斷的情況下,能夠提高切斷後的玻璃層的端面強度。According to the method for producing a laminated body of the present invention, when the laminated body forming the base is cut when manufacturing a laminated body formed by laminating a glass layer and a resin layer, the end face strength of the cut glass layer can be increased. .
以下,參照隨附圖式對實施方式的積層體的製造方法進行說明。Hereinafter, the method of manufacturing the laminate according to the embodiment will be described with reference to the accompanying drawings.
本製造方法包括切斷積層體的步驟(以下表述為切斷步驟)。在本實施方式中,例示藉由在切斷步驟中切斷積層體而自該積層體挖出成為製品的部位的情況。This manufacturing method includes a step of cutting the laminate (hereinafter referred to as a cutting step). In this embodiment, the case where the part which becomes a product is excavated from this laminated body by cutting a laminated body in a cutting process is illustrated.
首先,對成為切斷對象的積層體進行說明。First, a laminate to be cut will be described.
如圖1及圖2所示,積層體1包括作為玻璃層的玻璃片材2、作為樹脂層的樹脂片材3、及介置於該兩個片材2、片材3的相互間的接著層4。積層體1是藉由接著層4將兩個片材2、片材3接著並積層一體化而成者。本實施方式中的玻璃片材2、樹脂片材3、及接著層4均為透明體,但不限於此。As shown in FIG. 1 and FIG. 2, the laminated
圖2中以二點鏈線表示的切斷預定線5是表示下文所述的切斷步驟中積層體1的切斷位置的線。切斷預定線5在俯視下呈閉環,並且成為積層體1所包括的製品部1a與廢棄部1b的邊界線。製品部1a是之後成為製品的部位,廢棄部1b是不會成為製品而被廢棄的部位。製品部1a在俯視下呈四角彎曲的矩形狀。再者,製品部1a的形狀亦可不為矩形狀(例如為圓形、橢圓形等)。若在切斷步驟中切斷積層體1,則自該積層體1挖出製品部1a。A planned
積層體1的厚度並無限定,本實施方式中的積層體1具有能夠賦予可撓性的程度的厚度。藉此,自積層體1挖出的製品部1a例如可用作具有能夠彎曲的柔性的元件(可攜式終端等)的蓋玻璃。再者,就對積層體1賦予可撓性的觀點而言,積層體1的厚度較佳為500 μm以下,進而較佳為250 μm以下,最佳為125 μm以下。The thickness of the laminated
玻璃片材2的厚度較佳為200 μm以下,進而較佳為100 μm以下,最佳為50 μm以下。在本實施方式中,玻璃片材2的厚度為100 μm。作為玻璃片材2的種類,較佳為使用硼矽酸玻璃、鈉鈣玻璃、鋁矽酸鹽玻璃,最佳為使用無鹼玻璃或化學強化玻璃。除此以外,作為玻璃片材2的種類,亦可使用矽酸鹽玻璃、二氧化矽玻璃等。再者,在使用化學強化玻璃的情況下,可將鋁矽酸鹽玻璃進行化學強化而使用。在本實施方式中,使用無鹼玻璃作為玻璃片材2。The thickness of the
在使用無鹼玻璃作為玻璃片材2的情況下,積層體1的透明性提高。此處,所謂「無鹼玻璃」是實質上不含鹼性成分(鹼金屬氧化物)的玻璃,具體而言,為鹼性成分的重量比為3000 ppm以下的玻璃。再者,鹼性成分的重量比較佳為1000 ppm以下,更佳為500 ppm以下,最佳為300 ppm以下。When using alkali-free glass as the
玻璃片材2可藉由浮式法、滾壓法、流孔下引法、再曳引法等成形,較佳為藉由溢流下拉法所成形者。藉由溢流下拉法,玻璃片材2可獲得高的表面平滑性。藉此,能夠提高玻璃片材2與接著層4的密接力,而能夠使玻璃片材2與樹脂片材3準確且精密地積層。The
樹脂片材3的厚度較佳為200 μm以下,進而較佳為100 μm以下,最佳為50 μm以下。在本實施方式中,樹脂片材3的厚度為100 μm。作為樹脂片材3的種類,可使用聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚萘二甲酸乙二酯(polyethylene naphthalate,PEN)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯樹脂(polymethyl methacrylate,PMMA)、聚醯亞胺(polyimide,PI)等。在本實施方式中,使用聚對苯二甲酸乙二酯作為樹脂片材3。The thickness of the
接著層4的厚度較佳為100 μm以下,進而較佳為50 μm以下,最佳為25 μm以下。在本實施方式中,接著層4的厚度為25 μm。作為接著層4,例如可使用丙烯酸系、矽酮系、胺基甲酸酯系等黏著片材或紫外線硬化型樹脂、熱固性樹脂等。在本實施方式中,使用光學用黏著劑(Optical Clear Adhesive,OCA)作為接著層4。The thickness of the
以下,對本製造方法所包括的切斷步驟進行詳細說明。Hereinafter, the cutting step included in this production method will be described in detail.
在切斷步驟中,沿著切斷預定線5切斷所述積層體1。切斷步驟按照時間序列的順序,包括樹脂層切斷步驟P1(圖3、圖4)、凹部形成步驟P2(圖5、圖6)、裂紋形成步驟P3(圖7)、及玻璃層折斷步驟P4(圖8、圖9)。In the cutting step, the
<樹脂層切斷步驟>
如圖3及圖4所示,在樹脂層切斷步驟P1中,沿著切斷預定線5自樹脂片材3側對積層體1照射雷射6,藉此切斷樹脂片材3。再者,雷射6的照射使用雷射照射器7。
<Resin layer cutting procedure>
As shown in FIGS. 3 and 4 , in the resin layer cutting step P1 , the
作為樹脂層切斷步驟P1的具體態樣,如圖4中箭頭D1~箭頭D4所示,使對積層體1照射的雷射6沿著切斷預定線5環繞。再者,在本實施方式中,使雷射6多次環繞切斷預定線5所形成的閉環。而且,在本實施方式中,使用超短脈衝雷射作為雷射6,藉由使用超短脈衝雷射的剝蝕加工切斷樹脂片材3的總厚度。藉此,形成切斷樹脂片材3而成的切斷部3a。再者,在切斷預定線5上,開始雷射6的照射的地點、及結束照射的地點可設為任意地點。而且,使雷射6沿著切斷預定線5移動的速度(掃描速度)例如為0.1 m/s~5 m/s。As a specific aspect of the resin layer cutting step P1 , as shown by arrows D1 to D4 in FIG. 4 , the
在樹脂層切斷步驟P1中,除了樹脂片材3以外還切斷接著層4的厚度的一部分。即,如圖3中的A部的放大圖所示,在樹脂層切斷步驟P1結束的時點,使接著層4的厚度的一部分以未切斷的狀態殘留。設為此種態樣的目的在於避免雷射6的熱影響不當地波及至玻璃片材2。再者,以未切斷的狀態殘留的接著層4亦應避免妨礙積層體1的順利切斷。因此,就兼顧避免對玻璃片材2的熱影響與積層體1的順利切斷的觀點而言,較佳為將以未切斷的狀態殘留的接著層4的厚度t設為1 μm~10 μm。在本實施方式中,以厚度t的值成為所述範圍內的方式調節雷射6沿著切斷預定線5環繞的環繞數。In the resin layer cutting step P1 , a part of the thickness of the
再者,在之後執行的玻璃層折斷步驟P4中將玻璃片材2折斷而切斷時,多數情況下以未切斷的狀態殘留的接著層4與玻璃片材2一起被切斷。而且,即便在未與玻璃片材2一起被切斷的情況下,由於所殘留的接著層4的厚度極薄,故而亦僅藉由施加少許的力(拉伸力、剪切力等)即能夠容易地切斷。In addition, when breaking and cutting the
此處,作為雷射6的種類,能夠使用紫外線(ultra violet,UV)雷射、CO
2雷射等。在本實施方式中,使用UV雷射。而且,作為雷射6的波長,較佳為設為200 nm~12000 nm,進而較佳為設為300 nm~8000 nm,最佳為設為350 nm~4000 nm。在本實施方式中,將波長設為355 nm。進而,作為雷射6的脈衝寬度,較佳為設為皮秒級或飛秒級,具體而言設為500 ps以下。再者,更佳為300 ps以下,最佳為100 ps以下。
Here, as the type of the
藉由樹脂層切斷步驟P1所形成的切斷部3a的寬度W較佳為0.005 mm~0.5 mm。若切斷部3a的寬度W窄於0.005 mm,則有所切斷的接著層4可能不當地再次結合之虞。另一方面,若切斷部3a的寬度W寬於0.5 mm,則有之後執行的凹部形成步驟P2中發生異常之虞。詳細而言,若切斷部3a的寬度W過寬,則如圖5所示,在為了形成凹部2a而利用鑽尖8按壓玻璃片材2的表面時,有寬的切斷部3a不當地導致玻璃片材2撓曲而無法順利按壓之虞。The width W of the
<凹部形成步驟>
如圖5及圖6所示,在凹部形成步驟P2中,藉由使按壓玻璃片材2的表面的鑽尖8沿著切斷預定線5移動,而沿著切斷預定線5形成玻璃片材2的表面發生塑性變形而成的凹部2a。此處,在本實施方式中,在執行凹部形成步驟P2時,使積層體1的上下(表背)相對於執行樹脂層切斷步驟P1時反轉。
<Concave forming step>
As shown in FIGS. 5 and 6 , in the concave portion forming step P2, the glass sheet is formed along the line to cut 5 by moving the
鑽尖8包括柄部8a、及固定於柄部8a的一端部的刀尖8b。柄部8a例如包含金屬,形成為圓柱狀或多角柱狀。刀尖8b例如包含單晶或多晶的金剛石,除此以外,亦可包含聚晶立方氮化硼(Polycrystalline Cubic Boron Nitride,PCBN)、陶瓷、超硬合金、其他金屬。刀尖8b藉由接著劑、釺料等固定於柄部8a。The
作為凹部形成步驟P2的具體態樣,如圖6所示,以存在於切斷預定線5上的點5a作為開始玻璃片材2的表面按壓的地點。並且,如箭頭E1~箭頭E4所示,使鑽尖8沿著切斷預定線5移動。藉此,繞了切斷預定線5一周的鑽尖8再次返回點5a。其後,繼續以鑽尖8按壓玻璃片材2的表面,並且如箭頭E5所示,使鑽尖8移動至玻璃片材2的端部(點2e)。藉此,並非僅沿著切斷預定線5,而是在點5a至點2e的區間亦形成凹部2a。再者,作為開始按壓的地點的點5a的位置只要為切斷預定線5上,則可設為任意地點。而且,使鑽尖8沿著切斷預定線5移動的速度(移行速度)例如為1 mm/s~500 mm/s。As a specific aspect of the concave portion forming step P2 , as shown in FIG. 6 , the
此處,作為本實施方式的變形例,可為在繞了切斷預定線5一周的鑽尖8再次返回點5a後,使鑽尖8在點5a至點2e的區間的途中停止,而非到達玻璃片材2的端部(點2e)。在該情況下,沿著切斷預定線5形成凹部2a,並且使凹部2a形成至自點5a至點2e的區間的途中(以下將同一變形例表述為凹部形成變形例)。Here, as a modified example of this embodiment, after the
如圖5中的B部的放大圖(放大圖中省略鑽尖8的圖示)所示,在凹部2a的表層部形成壓縮應力發揮作用的壓縮應力層2ax。而且,在壓縮應力層2ax的正下方形成拉伸應力發揮作用的拉伸應力層2ay。As shown in the enlarged view of part B in FIG. 5 (the
<裂紋形成步驟>
如圖7所示,在裂紋形成步驟P3中,沿著凹部2a形成裂紋線9。
<Crack Formation Procedure>
As shown in FIG. 7 , in the crack forming step P3 , a
在本實施方式中,在上述凹部形成步驟P2中,若鑽尖8到達玻璃片材2的端部(點2e),則伴隨於此而在拉伸應力層2ay形成裂紋線9。此時,沿著與形成凹部2a時鑽尖8移動的方向相反的方向形成裂紋線9。即,自玻璃片材2的端部(點2e)起開始裂紋線9的形成,裂紋線9按照箭頭E5~箭頭E1的順序發展,在點5a處停止裂紋線9的形成。藉此,沿著切斷預定線5的全長形成裂紋線9。In the present embodiment, when the
此處,在凹部形成步驟P2中應用上述凹部形成變形例的情況下,在裂紋形成步驟P3中,作為一例而以如下述的形態形成裂紋線9。首先,準備輪式切割機。其次,以與形成至自點5a至點2e的區間的途中的凹部2a交叉的方式,使輪式切割機在玻璃片材2的表面上滾動。藉此,以橫穿凹部2a的方式在玻璃片材2的表面形成劃痕。由此,自凹部2a與劃痕交叉的地點起開始裂紋線9的形成,在點5a處停止裂紋線9的形成。藉此,沿著切斷預定線5的全長形成裂紋線9。Here, in the case of applying the above-described recess forming modification in the recess forming step P2, in the crack forming step P3, as an example, the
<玻璃層折斷步驟>
如圖8及圖9所示,在玻璃層折斷步驟P4中,以裂紋線9為起點將玻璃片材2折斷而切斷。在折斷玻璃片材2時,如圖8中二點鏈線所示,以玻璃片材2中形成有裂紋線9的面側凸出的方式使積層體1彎曲。藉此,形成將玻璃片材2切斷而成的切斷部2x。再者,玻璃片材2的折斷是以圖9所示的點2e作為開始的地點,按照箭頭F1~箭頭F5所示的順序進行。並且,將同一圖所示的點5a設為折斷結束的地點。玻璃片材2的折斷結束後,將積層體1的總厚度切斷,而自積層體1挖出製品部1a。藉由以上,結束切斷步驟所包括的全部步驟。
<Procedure for breaking the glass layer>
As shown in FIGS. 8 and 9 , in the glass layer breaking step P4 , the
此處,對於所述實施方式,亦可應用如以下的變形例。Here, the following modifications can also be applied to the above-described embodiment.
執行樹脂層切斷步驟P1~玻璃層折斷步驟P4的順序亦可不同於所述實施方式。在四個步驟P1~步驟P4中,三個步驟P2~步驟P4需要按照與所述實施方式相同的順序執行,但執行樹脂層切斷步驟P1的時機可變更而不同於所述實施方式。即,可在凹部形成步驟P2與裂紋形成步驟P3之間、裂紋形成步驟P3與玻璃層折斷步驟P4之間、玻璃層折斷步驟P4之後的任一時機執行樹脂層切斷步驟P1。The order of performing resin layer cutting process P1 - glass layer breaking process P4 may differ from the said embodiment. Among the four steps P1 to P4, the three steps P2 to P4 need to be performed in the same order as in the above embodiment, but the timing of performing the resin layer cutting step P1 can be changed from the above embodiment. That is, the resin layer cutting step P1 can be performed at any timing between the recess forming step P2 and the crack forming step P3, between the crack forming step P3 and the glass layer breaking step P4, and after the glass layer breaking step P4.
其中,較佳為在執行裂紋形成步驟P3後,不間隔樹脂層切斷步驟P1,而繼續執行玻璃層折斷步驟P4。其原因在於:抑制玻璃片材2在執行玻璃層折斷步驟P4之前被意外地切斷的情況。而且,較佳為在執行玻璃層折斷步驟P4之前執行樹脂層切斷步驟P1。其原因在於:在切斷玻璃片材2後,只要能夠使處於相向的狀態的玻璃片材2的端面彼此(藉由切斷所形成的端面彼此)立即背離,則在避免由端面彼此的接觸引起的端面強度的降低的方面有利。Among them, preferably, after the crack formation step P3 is performed, the glass layer breaking step P4 is continuously performed without intervening the resin layer cutting step P1. The reason for this is to suppress the
再者,於在玻璃層折斷步驟P4之後執行樹脂層切斷步驟P1的情況下,樹脂層切斷步驟P1所使用的雷射6的脈衝寬度無需如所述實施方式般為皮秒級或飛秒級,亦可為奈秒級。Furthermore, in the case where the resin layer cutting step P1 is performed after the glass layer breaking step P4, the pulse width of the
而且,在所述實施方式中,採用切斷預定線5呈閉環且自積層體1挖出製品部1a的形態,但不限於此。例如亦可設為藉由沿著直線延伸的切斷預定線5切斷積層體1而將積層體1分斷成兩部分的形態。In addition, in the above-described embodiment, the line to cut 5 forms a closed loop and the product part 1a is dug out from the
1:積層體
1a:製品部
1b:廢棄部
2:玻璃片材
2a:凹部
2ax:壓縮應力層
2ay:拉伸應力層
2e、5a:點
2x、3a:切斷部
3:樹脂片材
4:接著層
5:切斷預定線
6:雷射
7:雷射照射器
8:鑽尖
8a:柄部
8b:刀尖
9:裂紋線
A、B:放大圖
D1~D4、E1~E5、F1~F5:箭頭
P1:樹脂層切斷步驟
P2:凹部形成步驟
P3:裂紋形成步驟
P4:玻璃層折斷步驟
t:厚度
W:寬度
1: laminated body
1a:
圖1是表示積層體的剖視圖。 圖2是表示積層體的平面圖。 圖3是表示積層體的製造方法所包括的樹脂層切斷步驟的剖視圖。 圖4是表示積層體的製造方法所包括的樹脂層切斷步驟的平面圖。 圖5是表示積層體的製造方法所包括的凹部形成步驟的剖視圖。 圖6是表示積層體的製造方法所包括的凹部形成步驟的平面圖。 圖7是表示積層體的製造方法所包括的裂紋形成步驟的剖視圖。 圖8是表示積層體的製造方法所包括的玻璃層折斷步驟的剖視圖。 圖9是表示積層體的製造方法所包括的玻璃層折斷步驟的平面圖。 FIG. 1 is a cross-sectional view showing a laminate. Fig. 2 is a plan view showing a laminate. Fig. 3 is a cross-sectional view showing a resin layer cutting step included in the method of manufacturing the laminate. 4 is a plan view showing a step of cutting a resin layer included in the method of manufacturing a laminate. Fig. 5 is a cross-sectional view showing a concave portion forming step included in the method of manufacturing the laminate. 6 is a plan view showing a concave portion forming step included in the method of manufacturing the laminate. 7 is a cross-sectional view showing a crack formation step included in the method of manufacturing the laminate. Fig. 8 is a cross-sectional view showing a glass layer breaking step included in the method of manufacturing the laminate. Fig. 9 is a plan view showing a glass layer breaking step included in the method of manufacturing the laminate.
1:積層體 1: laminated body
2:玻璃片材 2: glass sheet
2a:凹部 2a: concave part
2ax:壓縮應力層 2ax: compressive stress layer
2ay:拉伸應力層 2ay: tensile stress layer
3:樹脂片材 3: Resin sheet
3a:切斷部 3a: cutting part
4:接著層 4: Next layer
5:切斷預定線 5: cut off the scheduled line
9:裂紋線 9: crack line
B:放大圖 B: Zoom in
P3:裂紋形成步驟 P3: Crack formation step
Claims (5)
Applications Claiming Priority (2)
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JP2021-209313 | 2021-12-23 | ||
JP2021209313A JP2023094076A (en) | 2021-12-23 | 2021-12-23 | Manufacturing method of laminate |
Publications (1)
Publication Number | Publication Date |
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TW202330140A true TW202330140A (en) | 2023-08-01 |
Family
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Family Applications (1)
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TW111148633A TW202330140A (en) | 2021-12-23 | 2022-12-19 | Method for manufacturing laminate |
Country Status (3)
Country | Link |
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JP (1) | JP2023094076A (en) |
TW (1) | TW202330140A (en) |
WO (1) | WO2023120246A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016164101A (en) * | 2015-03-06 | 2016-09-08 | 三星ダイヤモンド工業株式会社 | Processing method of laminated substrate, and processing device of laminated substrate by laser beam |
KR102322397B1 (en) * | 2016-10-05 | 2021-11-05 | 니폰 덴키 가라스 가부시키가이샤 | The manufacturing method of a glass resin laminated body, and a glass resin laminated body |
JP6355783B2 (en) * | 2017-03-14 | 2018-07-11 | 日東電工株式会社 | Method for producing flexible film |
JP6911720B2 (en) * | 2017-11-14 | 2021-07-28 | 日本電気硝子株式会社 | Glass plate manufacturing method and glass plate |
JP7182362B2 (en) * | 2018-01-12 | 2022-12-02 | 日東電工株式会社 | Composite parting method |
JP2019167270A (en) * | 2018-03-23 | 2019-10-03 | 日東電工株式会社 | Method for manufacturing glass structure piece |
JP2022166863A (en) * | 2019-10-03 | 2022-11-04 | 日本電気硝子株式会社 | Laminate and manufacturing method for laminate |
JP7421162B2 (en) * | 2020-01-08 | 2024-01-24 | 日本電気硝子株式会社 | Glass plate manufacturing method |
-
2021
- 2021-12-23 JP JP2021209313A patent/JP2023094076A/en active Pending
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2022
- 2022-12-09 WO PCT/JP2022/045496 patent/WO2023120246A1/en unknown
- 2022-12-19 TW TW111148633A patent/TW202330140A/en unknown
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WO2023120246A1 (en) | 2023-06-29 |
JP2023094076A (en) | 2023-07-05 |
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