KR20130048685A - Method for scribing reinforced glass substrate and apparatus for scribing the same - Google Patents

Abstract

PURPOSE: Scribing method and apparatus for a reinforced glass plate are provided to form a collision trace on a plate as a trigger groove by using a lining member. CONSTITUTION: A scribing method for a reinforced glass plate comprises a step of forming a collision trace(T1) on one inner side of a plate(M) to release a compression stress layer on the surface of the plate, and form the collision trace as a trigger groove which will be a starting point for scribing; a step of forming a scribing line(S) by rolling a cutter wheel(12) to the trigger groove. The collision trace is formed by using a lining member. The lining member has a point or a line-shaped tip. The lining member downwardly collides with the plate. The lining member is a diamond pointer(11) or a fixed blade. The depth of the collision trace is smaller than the thickness of the compression stress layer.

Description

Scribing method and scribing apparatus of a tempered glass substrate {METHOD FOR SCRIBING REINFORCED GLASS SUBSTRATE AND APPARATUS FOR SCRIBING THE SAME}

The present invention relates to a scribing method and a scribing apparatus for a glass substrate made of tempered glass.

Here, the term "tempered glass" refers to a compressive stress layer in which a compressive stress remains in a substrate surface layer (about 5 µm to 50 µm in depth from the substrate surface) of the glass substrate by a chemical treatment by ion exchange in the manufacturing process. Is formed, and refers to glass manufactured so that tensile stress remains inside the substrate.

The tempered glass has the property of being hard to be broken against external force under the influence of the compressive stress layer, whereas once the crack is formed on the surface of the substrate and proceeds to the inside of the substrate where the residual tensile stress is present, this time the crack penetrates deeply. It has the property of being easy.

In general, in a process of dividing a glass substrate, first, a scribing line having a finite depth is formed on the surface of the substrate, and then pushing with a brake bar or a brake roller along the scribe line from the back surface side of the substrate. And a method of braking is adopted.

In the process of forming the former scribe line, a method of scribing by rolling a disk-shaped cutter wheel (also called a scribing wheel) with respect to the substrate surface is known, for example, a patent document 1 and the like.

FIG. 10 shows cross scribing performed when the glass substrate M (mother substrate) is divided into unit substrates each of which is a product. First, a scribe line S _{1 in the} X direction is formed on the surface of the substrate M with a cutter wheel, and then a scribe line S _{2 in} the Y direction that crosses the X direction is formed. After forming a plurality of scribe lines intersecting in the X-Y direction in this manner, the substrate M is sent to the brake device and divided into unit substrates by bending them from the back surface side along each scribe line.

By the way, the method of scribing a glass substrate with a cutter wheel includes "outer" and "inner". According to the kind and use of a board | substrate, the scribing apparatus which made it possible to selectively distinguish external cut and internal cut is disclosed (refer patent document 2).

As shown in Fig. 11 (a), the former externally cuts the lowermost end of the cutter wheel to a slightly lower side than the surface (upper surface) of the substrate M. It is set in an outer position (scribe start position P1). The scribe is performed by moving the cutter wheel horizontally while moving horizontally from the set position, colliding with the end of the substrate M to be seated, and pressing with a predetermined scribe pressure.

In the external section, the problem that the cutter wheel slips at the end of the substrate M does not occur, and since the scribe line formed reaches the end of the substrate M, the brake in the next process is easy and accurate. Is done. On the other hand, since the blade tip collides with the end of the substrate M, chipping occurs at the end of the substrate M, and a full cut is made from the end under the influence of the tensile stress inside the substrate M. There is a risk of discarding, and the cutter wheel is also likely to be consumed due to collision with the edge portion.

As shown in Fig. 11 (b), the latter is lowered from the top of the substrate M by about 2 mm to 10 mm inwardly (the scribe start position Q1) to lower the cutter wheel from above. The scribe is performed by making the cutter wheel horizontally move while contacting (M) with a predetermined scribe pressure.

In internal cutting, since a cutter wheel does not collide with the edge part of the board | substrate M end, there is no possibility that a cutter may fall out at the board | substrate M end, and the consumption of a blade edge | tip can also be suppressed compared with outer one. . However, since the scribe line is not formed from the end of the substrate M to the scribe start position Q1, the brake tends to be difficult as compared with the external break. In addition, when the cutter wheel is moved in the horizontal direction in a state of being in contact with the substrate M, the edge of the blade tip is badly slipped and slips, which may not be possible to scribe.

As described above, the outer and inner sections have advantages and disadvantages, and therefore, the outer and inner sections are used separately according to the type and use of the substrate.

Japanese Patent No. 3074143 Japanese Laid-Open Patent Publication No. 2009-208237

In recent years, the use of what is called tempered glass (also called chemically tempered glass) is desired among the glass products used for cover glass, such as a mobile telephone. As described above, the tempered glass is manufactured such that the compressive stress remains in the substrate surface layer, whereby the glass which is hard to be broken is obtained despite the thin plate thickness of the glass.

Therefore, when tempered glass is used, it is excellent in the point that a thin, light, and durable cover glass can be manufactured. On the other hand, in order to make a cover glass, the process which cuts out from the large area mother board | substrate to the unit product of a desired size and a desired shape is required.

However, when a scribe line is formed in the outer part with respect to the tempered glass, if the blade edge is scribed deeper than the surface compressive stress layer when the blade tip collides at the substrate end, it is completely broken at once under the influence of the residual tensile stress inside the substrate. This may occur.

Therefore, as tempered glass, it is thought that it is preferable to scribe internally rather than external failure.

However, even if it is going to scribe by itself, since it is tempered glass when it comes into contact with the edge of a blade, it is hard to penetrate into the surface of a board | substrate under the influence of the residual compressive stress of a board | substrate surface layer, and the latch of the blade edge to a board | substrate is very bad, Slip occurred and was not able to scribe. Therefore, the problem that scribing becomes difficult rather arises.

Thus, unlike the scribing process with respect to the soda glass substrate conventionally used with respect to the tempered glass, it was difficult to form a scribe line properly also by external break and internal break. This tendency becomes more remarkable for a substrate having a larger compressive stress layer on the surface of the substrate and having a higher residual stress.

Then, an object of this invention is to provide the scribing method and scribing apparatus which can form a scribe line reliably internally, even if it is a glass substrate made of tempered glass which is difficult to process.

In order to achieve the above object, the present invention has taken the following technical means.

That is, in the scribing method of this invention, as a scribing method of the tempered glass substrate which forms a scribe line with respect to the tempered glass substrate in which the compressive stress layer was formed in the substrate surface,

(a) Collision traces are formed by colliding a line drawing member having a pointed tip or a linear tip at a position entered into an inner side of one end of the substrate so as to descend from the upper side with respect to the substrate. The peeling process of peeling the compressive stress layer on the surface of the substrate to form the impact trace as a trigger groove serving as a starting point of the scribe,

(b) The cutter wheel is brought into contact with the trigger groove so as to be squeezed and rolled to form a scribe line.

According to the scribing method of the present invention, when performing the "resistant" at the position which entered into the inside of one end of a board | substrate, a collision trace is formed by first colliding so that a line drawing member may descend from upper direction with respect to a board | substrate. If the contact part of the scribing member to be used is a point-shaped tip, the minute collision traces of a point shape are formed, and if it is a line-shaped tip, a fine collision trace of a linear shape is formed. The pressure applied to the surface at the time of collision is optimized by using a dummy substrate of the same material in advance, so that the pressure at the time of collision is too strong and does not break suddenly, and is too weak to prevent the formation of a collision trace. It can be formed reliably. Since the impact trace layer on the surface of the substrate can be peeled off by the formation of the impact trace, the portion of the impact trace is used as a trigger groove which is the starting point of the scribe. The scribe line can be formed without slipping by making the cutter wheel abut against the formed trigger groove and applying a predetermined scribe pressure.

According to the present invention, the cutter wheel has never been slipped, the substrate does not break, and the scribe line having a finite depth is formed by using the cutter wheel. You can do it.

Here, the line drawing member may be a pointer having a sharp tip (for example, a diamond pointer, a cemented carbide pointer, etc.), or a fixed blade (for example, a straight alloy cutter made of cemented carbide) having a straight blade formed at the tip. It may also be a rotary blade such as a cutter wheel. In the pointer, a point-like collision trail can be formed, and in the case of a fixed edge, a line-shaped collision trail corresponding to the trailing edge length can be formed. Further, in the cutter wheel, a linear collision trace along the ridge line of the wheel can be formed. Moreover, in the case of a cutter wheel, it can also be combined with the cutter wheel used for the scribe of a next process.

In a peeling process, you may expand and expand to a trigger groove of 1 mm-3 mm in length by moving a scribe member horizontally from a collision trace. By moving the scribing member horizontally from the collision trace, the trigger groove can be expanded, thereby making it easy to align, thereby facilitating use as a trigger groove during scribing in the next step.

It is preferable to collide the scribing member so that the depth of the collision trace becomes smaller than the thickness of the compressive stress layer. Since the information on the thickness of the compressive stress layer (usually about 5 to 50 m) can be obtained from the substrate maker in advance, the relationship between the impact pressure and the depth of the impact trace is obtained by preliminary experiments, and the thickness information of the compressive stress layer is obtained. By referring to the above, by adjusting to an appropriate collision pressure, the scribing member is collided so that the collision trace is shallower than the thickness of the compressive stress layer. Thereby, only a compression layer can be peeled off and the occurrence of the problem which breaks by mistake can be reliably prevented.

Moreover, the scribing apparatus of this invention which consists of another viewpoint is a scribing apparatus which forms a scribe line with respect to the tempered glass substrate in which the compressive stress layer is formed in the surface of a board | substrate, and has a point-shaped tip for forming a collision trace in a board | substrate. Or a linear drawing member having a linear tip, a cutter wheel for rolling along the scribing scheduled line from the collision trace, an elevating mechanism for elevating the linear drawing member and the cutter wheel, and a control unit for controlling the elevating mechanism. When the collision trace is formed by the scribing member, the controller lowers the scribing member to collide with the substrate and raises it away from the substrate after the collision. When the cutter wheel is driven, the controller lowers and abuts the cutter wheel. It is controlled so as to perform pressure welding transmission.

Here, the scribing member may be a pointer having a sharp tip, or a fixed blade having a straight blade at the tip.

In addition, the cutter wheel may be used as the scribing member.

1 is a front view showing an embodiment of a scribing apparatus used in the scribing method of the present invention.
FIG. 2 is an enlarged view illustrating an example of the diamond pointer of FIG. 1.
3 is a front view and a left side view of the cutter wheel of FIG. 1.
4 is a plan view illustrating a procedure of a scribing method by the scribing apparatus of FIG. 1.
5 is a front view showing another example of the scribing apparatus used in the scribing method of the present invention.
It is a figure which shows the fixed blade in FIG.
7 is a plan view illustrating a procedure of a scribing method by the scribing apparatus of FIG. 5.
Fig. 8 is a front view showing still another example of the scribing apparatus used in the scribing method of the present invention.
9 is a plan view illustrating a procedure of a scribing method by the scribing apparatus of FIG. 8.
It is a figure which shows the cross scribe process of a mother substrate.
11 is a view showing a conventional scribing method using a cutter wheel.

(Mode for carrying out the invention)

(Embodiment 1)

EMBODIMENT OF THE INVENTION Below, the detail of the scribing method which concerns on this invention is demonstrated in detail based on drawing.

1 is a front view showing an example of a scribing apparatus used when implementing the method of the present invention. In scribe apparatus SC1, a diamond pointer is used as a scribe member.

The scribe device SC1 holds the tempered glass substrate M on the upper surface, and has a table 4 having a horizontal rotating mechanism, and the table 4 in one direction (the direction perpendicular to the ground). The rail 5 which is movable so that it is supported by (), and the guide bar 6 extended in the direction (left-right direction of FIG. 1) orthogonal to the rail 5 from above the table 4 are provided.

The guide bar 6 is mounted on the guide bar 6 so as to be lifted and lowered by lifting mechanisms 10a and 10b at the lower ends of the two scribe heads 7a and 7b and the scribe heads 7a and 7b. Holders 8a and 8b. Among these, the diamond pointer 11 which is a scribe member for forming a collision trace is attached to one holder 8a, and the cutter wheel 12 is attached to the other holder 8b.

2 is an enlarged view illustrating an example of the diamond pointer 11. As for the diamond pointer 11, the diamond piece 11b which made the tip pointed is fixed to the front-end | tip of the cylindrical rod 11a by which the one end was formed in the cone shape, and this diamond piece 11b is reinforced glass substrate. By colliding with (M), a point-shaped collision trace is formed.

3 is a diagram illustrating an example of the cutter wheel 12. Ridges 12b serving as blade edges are formed on the disc 12a made of cemented carbide having a diameter of about 2 mm to 6 mm. In this embodiment, a grooveless wheel (also referred to as a normal wheel) in which no groove is formed in the ridge line is used, but a grooved wheel in which the groove is formed in the ridge line (for example, manufactured by Mitsubishi Diamond Industry Co., Ltd.) PIO (APIO) cutter wheel may be used.

And the operation | movement of scribe device SC1 is controlled by the control part 20 comprised from what is called a computer. In the above-described control of lifting of the lifting mechanisms 10a and 10b, when the holder 8a lowers the diamond pointer 11 to form a collision trace, the holder 8a descends in a rapid motion and performs control for raising immediately after the collision.

On the other hand, when the holder 8b is driven while lowering the cutter wheel 12 to press-contact the substrate, control is performed so as to be brought into contact as it is if the holder 8b is slowly lowered and brought into contact so as not to leave a collision trace.

Next, the scribing method using this scribe device SC1 is demonstrated.

First, as shown to Fig.4 (a)-(c), on a scribe plan line assumed to the board | substrate M, a diamond pointer is located in the place which entered into the inside (for example, 3 mm inside) from one end of the board | substrate M. to 11, and drops to Hi pre-collision pressure determined by preliminary experiments, tap the surface of the glass substrate (M) hit from above, and then, by lifting, to form a collision trace (T ₁₎ of the point-like. Crash trail because of the use as a starting point for scribing in the following process, also referred to as "trigger groove (T _1)." When increasing the collision trace T ₁ , as shown in FIG. 4 (d), the diamond pointer 11 is brought into contact with the collision trace T ₁ again to move horizontally in the direction of the scribe scheduled line and expanded. and, the length and the degree of the trigger 1㎜ ~ 3㎜ groove (T ₁ '). By forming the extended trigger groove T ₁ ′, the blade tip of the cutter wheel 12 is easily fitted.

Subsequently, as shown in FIG. 4E, the cutter wheel 12 is lowered to a position where the trigger groove T ₁ ′ is formed and brought into contact, and as shown in FIG. 4F, a scribe scheduled line The scribe lines S are formed by rolling while pressing along the lines. That is, the scribe line S is formed in accordance with the above-described internal technique. Since the cutter wheel 12 can penetrate into the trigger groove T ₁ ′ formed in advance, the scribe line S can be formed without slipping.

(Embodiment 2)

Fig. 5 is a schematic front view showing another example of a scribe device used when carrying out the method of the present invention. In addition, description is abbreviate | omitted by attaching | subjecting the same code | symbol about the part same as FIG. In this scribe device SC2, the fixed blade 13 of a straight blade is used as a scribe member.

6 (a) is a front view of the fixed blade 13, and FIG. 6 (b) is a side view. The fixed blade 13 has a straight blade 13b formed at one end of the rod 13a of the cemented carbide. Blade tip length (a) of the straight edge (13b) and has a 1㎜ ~ 3㎜, when the collision blade tip to the substrate (M), a collision trace (T ₂₎ of the linear shape of the blade tip length (a) is formed ( 7). Further, the blade tip length a of the straight blade 13b is shortened, and in the same manner as in the first embodiment described above, the collision trace is expanded by horizontally moving in a state where the blade edge of the straight blade 13b is brought into abutment after the collision. It is good also as 1 mm-3 mm. The collision trace T ₂ formed in this way forms the trigger groove T ₂ .

Next, the scribing method using this scribe device SC2 is demonstrated.

First, as shown to Fig.7 (a)-(c), on the scribe plan line assumed to the board | substrate M, the fixed blade 13 is glass from the top into the location which entered into the inside of one end of the board | substrate M from above. drop to bump lightly the surface of the substrate (M) and, by then rising, to form a collision trace of linear shape (T ₂₎ (trigger groove (T _2)). It is assumed here that a trigger groove T ₂ having a length of about 2 mm is formed.

Subsequently, as shown in FIG. 7 (d), the cutter wheel 12 is brought into contact with the cutter wheel 12 by dropping at the position where the trigger groove T ₂ is formed, and as shown in FIG. 7 (e). Similarly, the scribe line S is formed by rolling while squeezing along the scheduled scribe line. That is, the scribe line S is formed in accordance with the above-described internal technique. Since the cutter wheel 12 can penetrate into the trigger groove T ₂ formed in advance, the scribe line S can be formed without slipping.

(Embodiment 3)

8 is a schematic front view showing still another example of a scribe device used when carrying out the method of the present invention. In addition, description is abbreviate | omitted by attaching the eastern part about the same part as FIG. In this scribe apparatus SC3, the cutter wheel 12 shown in FIG. 3 is used as a scribe member. That is, the cutter wheel 12 also serves as a scribing member for forming a collision trace.

Therefore, only the scribe head 7b in FIG. 1 is used for the guide bar 6, the scribe head 7a in FIG. 1, the lifting mechanism 10a attached to this, and the holder 8a. Note that the scribing members 11 and 13 (see FIGS. 1 and 5) are not attached.

Next, the scribe method using this scribe device SC3 is demonstrated.

First, as shown to Fig.9 (a)-(c), on the scribe plan line assumed to the board | substrate M, the cutter wheel 12 is glass from the top into the location which entered inside the edge of the board | substrate M inside. drop to bump lightly the surface of the substrate (M) and, by then rising, to form a line of a shape corresponding to a ridge collision trace (T ₃₎ (trigger groove (T _3)). It is assumed here that a trigger groove T ₃ having a length of about 2 mm is formed.

Subsequently, as shown in FIG. 9 (d), the cutter wheel 12 is lowered again and brought into contact with the position where the trigger groove T ₃ is formed, and as shown in FIG. 9 (e), the scribe scheduled line The scribe lines S are formed by rolling while pressing along the lines. That is, the scribe line S is formed in accordance with the above-described internal technique. Since the cutter wheel 12 can penetrate into the trigger groove T ₃ formed in advance, the scribe line S can be formed without slipping.

Although the above-mentioned embodiment demonstrated the example which forms one scribe line, it is applicable also when forming two or more scribe lines in parallel or forming scribe lines which cross | intersect in an XY direction.

In addition, in the said embodiment, although the grooveless wheel was used for the cutter wheel 12, it is good also as a wheel with a groove. By using the grooved wheel, the sticking becomes better.

In the above embodiment, the trigger trace of the impact trace is formed, but since the position where the impact trace is formed is near the edge of the substrate, if this portion is placed in the single region, and finally discarded as the single substrate, Since there are no collision traces left on the product, the problem of collision traces does not occur.

In addition, in the present invention, the object can be achieved and modified and changed as appropriate without departing from the scope of the claims.

The scribing method of this invention can be used when scribing a tempered glass substrate.

M: Substrate
S: scribe line
T ₁ , T ₂ , T ₃ : Collision Trace (Trigger Home)
10a, 10b: lifting mechanism
11: diamond pointer
12: cutter wheel
13: fixed blade
20:

Claims (8)

As a scribing method of a reinforced glass substrate which forms a scribe line with respect to the reinforced glass substrate in which the compressive stress layer is formed in the surface of a board | substrate,
(a) Collision traces are made by colliding a line-like member having a pointed tip or a linear tip at a position entered inward from one edge of the substrate so as to descend from the upper side with respect to the substrate. A peeling step of peeling the compressive stress layer on the surface of the substrate to form the impact trace as a trigger groove serving as a starting point of the scribe;
(b) A scribing method of a tempered glass substrate, comprising a scribing step of forming a scribe line by bringing a cutter wheel into contact with the trigger groove and rolling it by pressure welding. The method of claim 1,
The said scribe member is a pointer with a sharp tip, or the scribe method of the tempered glass board | substrate which is a fixed blade with a straight blade formed in the front-end | tip. The method of claim 1,
The scribe method of the tempered glass substrate whose said scribe member is a cutter wheel. The method of claim 1,
The said scribe method WHEREIN: The scribe method of the tempered glass board | substrate which expands to the trigger groove of 1 mm-3 mm in length by moving the scribe member horizontally from the said impact trace. 5. The method according to any one of claims 1 to 4,
A method of scribing a tempered glass substrate, wherein the line drawing member is collided so that the depth of the impact trace becomes smaller than the thickness of the compressive stress layer. A scribing apparatus for forming a scribe line with respect to a tempered glass substrate having a compressive stress layer formed on the substrate surface,
A line drawing member having a pointed tip or a linear tip for forming a collision trace on the substrate;
A cutter wheel for driving along the scheduled scribe line from the impact trace,
An elevating mechanism for elevating the scribe member and the cutter wheel;
And a control unit for controlling the lifting mechanism,
When the collision trace is formed by the scribing member, the controller lowers the scribing member to collide with the substrate and raises it away from the substrate after the collision. When the cutter wheel is driven, the control unit descends and presses the cutter wheel while contacting it. A scribing apparatus, characterized by controlling to perform electric rolling. The method according to claim 6,
The scribing device is a scribe device which is a pointer having a sharp tip, or a fixed blade having a straight blade at the tip. The method according to claim 6,
A scribe device in which the cutter wheel also serves as the scribing member.

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