JP5331078B2 - Method for scribing a brittle material substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a scribing method capable of acquiring a highly-penetrated and excellent vertical crack of a groove face, while using a normal cutter. <P>SOLUTION: Highly-penetrated breakpoints are formed at prescribed pitches on a scribing line by repeating each process, namely, a scribing process in which the normal cutter not having a notch formed on a blade edge ridgeline part is advanced as long as a first distance, while being pressed with a first pressing load onto a scribing-scheduled line on a brittle material substrate, a process in which the normal cutter is retreated as long as a second distance which is shorter than the first distance, a breakpoint forming process for forming a breakpoint by raising a blade edge load of the normal cutter to a second pressing load at the retreat position, and a scribing process in which the normal cutter is returned to the first pressing load and is advanced as long as the first distance from the breakpoint. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a scribing method for forming a scribe line (cut groove) on the surface of a glass substrate or a brittle material substrate such as a semiconductor wafer or ceramic, and more particularly to a method for forming a scribe line using a cutter wheel.

  In a process of dividing a substrate by forming a scribe line on a brittle material substrate and then breaking along the scribe line, a scribe line is rolled by rolling a disk-like cutter wheel (also called a scribing wheel) on the substrate surface. A method of forming a line is generally known, and is disclosed in, for example, Patent Document 1.

The liquid crystal panel or the like, as shown in FIG. 4, a scribe line S ₁ in the X direction is formed by the cutter wheel against the surface of the glass substrate M having a large area, then a scribe line in the Y direction crossing the X direction S ₂ is formed. After forming a plurality of scribe lines intersecting in the X-Y direction in this way, the substrate M is sent to the breaking device and bent along the scribe lines to be divided into unit substrates to be products.

As a cutter wheel for forming a scribe line on a glass substrate, a cutter wheel 1a in which a notch (concave portion) is not formed in a cutting edge ridge line portion as shown in FIG. 5 and a cutting edge ridge line portion 2 as shown in FIG. There is a cutter wheel 1b provided with a notch 3 (concave portion). Hereinafter, the former is referred to as a normal cutter (wheel), and the latter is referred to as a grooved cutter (wheel).
The normal cutter 1a has a ridgeline surface roughness of 0.2 μm or less. The grooved cutter 1b is actively grooved at a constant pitch along the ridgeline, and specifically, a penet (Penett (registered trademark)) cutter wheel, Apio (APIO (registered trademark)) manufactured by Samsung Diamond Co., Ltd. ) There is a cutter wheel.

Japanese Patent No. 3074143

  In the grooved cutter 1b provided with a notch (concave portion) on the ridge line of the blade edge, the frictional force and the biting force to the glass substrate are large, and the impact on the glass substrate by a protrusion formed at the corner of the concave portion (destruction) Point), compared to a normal cutter, there is an advantage that deep vertical cracks can be formed in the thickness direction with a light load. On the other hand, the impact on the scribe line tends to leave scratches on the scribe line, and the end face strength of the unit substrate after division tends to deteriorate, which tends to cause small cracks and the like.

On the other hand, the normal cutter 1a has a smooth finish at the edge of the cutting edge, so that it is possible to form a clean groove surface as compared to the cutter with grooves when forming the scribe line, and along the formed scribe line. When the glass substrate is broken, there is an advantage that no scar remains on the end face and the end face strength is excellent.
However, on the other hand, since the frictional force against the glass substrate is small and the biting force during processing is small and slippery, a deep vertical crack like a grooved cutter wheel cannot be formed. If the pressing load (pressure applied to the glass substrate by the cutter) is increased in order to obtain a highly penetrating vertical crack, an irregular horizontal crack called a so-called “previous run” occurs, resulting in a processing failure. This phenomenon is particularly noticeable when the plate thickness is thin.

Further, when the normal cutter 1a is used to perform the X-Y direction cross scribing on the glass substrate M, the Y direction scribing line S ₁ at the intersection where the normal cutter 1a passes through the first formed X direction scribing line S1. _A phenomenon in which ₂ is not partially formed, that is, a phenomenon called “intersection jump” may occur. Intersection The intersection skipping phenomenon, and initially formed X direction of the stress on the groove sides of the scribe line S ₁ is left, when forming the scribe line S ₂ of the next Y-direction, the stress remaining Therefore, it is considered that the pressing force for generating the vertical crack is scraped off. When such a phenomenon of “intersection point jump” occurs, when the glass substrate is broken along the scribe line in the next step, the dividing surface is detached from the scribe line, or scratches are generated on the dividing surface, resulting in high quality. I can't get the product.

  Therefore, the present invention can use a normal cutter when forming a scribe line on a brittle material substrate such as a glass substrate, while being able to obtain a vertical crack in a highly grooved and clean groove surface, It is an object of the present invention to provide a novel scribing method that does not cause such inconvenient phenomena.

  In order to achieve the above object, the present invention takes the following technical means. That is, the scribing method of the present invention is a scribing method for forming a scribe line by rolling on a brittle material substrate using a normal cutter wheel in which notches are not formed in the edge of the cutting edge, and the normal cutter A scribing step of advancing the first distance while pressing with a first pressing load on the scribe line of the brittle material substrate, a step of retracting the normal cutter by a second distance shorter than the first distance, and a retreating The breaking point forming step of forming the breaking point with the second pressing load obtained by raising the blade load of the normal cutter above the first pressing load at the position where the normal cutter is moved, and the breaking point by returning the normal cutter to the first pressing load. By repeating the scribing process to advance the first distance from, the breaking points are formed on the scribe line at a predetermined pitch Was to so that.

  Here, the first pressing load of the normal cutter in the scribing step is the same load as the normal pressing load at the time of scribing with a normal cutter that is generally performed, and is about 0.05 to 0.08 MPa. In the range, it is preferably 0.07 MPa. Moreover, it is preferable that the fracture point forming load as the second pressing load is about 0.24 to 0.28 MPa. The first distance, which is the advance distance of the normal cutter in the scribing process, is preferably set appropriately according to the pitch of the breaking points. For example, when it is desired to set the pitch of the breaking points to 500 μm to 700 μm, it is preferable that the first distance as the advance distance is 800 μm and the second distance as the retreat distance is about 100 to 300 μm as an example. Depending on the outer diameter of the normal cutter, there is a pitch of breaking points suitable for processing, and therefore a normal cutter having an optimum outer diameter may be selected according to the desired breaking point pitch.

  In addition, the edge angle of a normal cutter is generally 100 degrees to 160 degrees, but when carrying out the method of the present invention, it is better to use an acute angle because the range of fracture points becomes narrower. Easy to groove. Specifically, about 100 to 130 degrees is preferable.

  According to the scribing method of the present invention, high penetration break points are formed on the scribe line at a constant pitch, so that a deep vertical crack similar to that when using a grooved cutter is used while using a normal cutter. Can be formed.

  As a result, it is possible to reliably perform the dividing operation in the next process and to eliminate inconveniences such as “intersection jump” at the time of cross scribing. Further, since the normal cutter is used, the groove surface of the scribe line can be formed neatly and the end face strength can be prevented from being deteriorated.

It is a schematic front view which shows one Example of the scribing apparatus used for the scribing method of this invention. It is a figure which shows the procedure of the scribing method of this invention. It is a figure which shows the procedure of the scribing method of this invention. It is a top view which shows the cross-scribe method with respect to a brittle material board | substrate. It shows a general normal cutter, in which (a) is a front view and (b) is a side view. It is a side view which shows a general grooved cutter.

Details of the scribing method according to the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic front view showing a general scribing apparatus for carrying out the method of the present invention.
The scribing apparatus A includes a horizontally rotatable table 4 that holds a brittle material substrate M such as a glass substrate on its upper surface, a rail 5 that holds the table 4 so as to be movable in one direction, and a rail 5 that is located above the table 4. A guide bar 6 bridged in an orthogonal direction (the left-right direction in FIG. 1), a scribe head 7 movably provided along the guide bar 6, and a cutter attached to the lower end of the scribe head 7 so as to be movable up and down. And a holder 8. The normal cutter 1 a shown in FIG. 5 is attached to the cutter holder 8. When processing a scribe line on the brittle material substrate M, the normal cutter 1a is lowered onto the brittle material substrate M and scribed by the following method.

FIG. 2 is an explanatory diagram showing the procedure of the scribing method of the present invention.
First, as shown in FIG. 2A, the normal cutter 1a is lowered onto the brittle material substrate M. The normal cutter 1a is preferably an acute angle of the blade edge, and is 115 degrees here. In this example, a normal cutter having a diameter of 2 mm was used.

Next, as shown in FIG. 2B, scribing is performed by moving the normal cutter 1a forward along the planned scribe line by a first distance while pressing with a first pressing load. This advance distance is about 800 μm.
The first pressing load of the normal cutter 1a in the scribing step here is preferably set to the same level as the pressing load at the time of scribing by the normal normal cutter 1a that is generally performed. It is selected in the range of 0.05 to 0.08 MPa. In this embodiment, the first pressing load is set to 0.07 MPa. Accordingly, at this stage, a scribe groove having a relatively shallow vertical crack, which is the same as a scribe groove processed by a normal cutter, is formed. The penetration depth of this vertical crack is about 10 to 20% of the plate thickness.

Next, as shown in FIG. 2C, the normal cutter 1a is moved backward by a second distance (but shorter than the first distance) while maintaining the first pressing load during forward movement. This second distance (retraction distance) is selected in the range of about 100 to 300 μm, and in this embodiment, it is set to 200 μm.
And in retracted position, forming a breaking point _{G 1} by raising the blade load of the normal cutter 1a in the range of load of approximately 0.24~0.28MPa a second pressing load. This breaking point G ₁ is deeper vertical crack in the thickness direction is extended. According to experiments, high penetration vertical cracks of 80% of the plate thickness were obtained.

Then, as shown in FIG. 2 (d), the breaking point G ₁ is returned to normal cutter 1a to 0.07MPa same first pressing load at the time of previous scribing, the same first distance and the previous scribe ( Scribing is performed by advancing by 800 μm, which is the advance distance.

Thereafter, as shown in FIGS. 2 (e) and 2 (f), the normal cutter 1a is maintained at the first pressing load at the time of forward movement, and is the same distance as the preceding second distance (retraction distance). retracted, forming a breaking point G ₂ for high penetration at a position retracted in the same way as before.

In this way, by repeating the scribing process by moving forward by the first distance of the normal cutter 1a and the breaking point forming process by moving backward by the second distance to form the breaking point, as shown in FIG. Breakage points G ₁ , G ₂ ,..., G _n ,... For penetration can form on the scribe line with a pitch P. The pitch P of the breaking point is a difference between the first distance (forward distance) and the second distance (backward distance) of the normal cutter 1a.

  As described above, in this scribing method, although the normal cutter 1a is used, the high penetration break points similar to the grooved cutter 1b in FIG. 6 are formed on the scribe line at a predetermined pitch. Cracks can be formed. As a result, inconvenient phenomena such as “intersection jump” at the time of cross scribing can be eliminated, and the dividing operation in the next process can be performed reliably. Further, since the normal cutter 1a is used, the groove surface of the scribe line can be formed neatly, and the end surface strength can be prevented from deteriorating by eliminating the scar on the divided end surface when the brittle material substrate is divided.

  As described above, the first distance (advance distance) and the second distance (retraction distance) of the normal cutter 1a can be set to preferable values depending on the diameter of the normal cutter 1a used. That is, if the diameter of the normal cutter 1a is reduced, the first distance and the second distance are smaller than the numerical values of the above-described embodiments, and if the diameter is increased, the first distance and the second distance are larger than the above numerical values.

  Although typical examples of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments. The present invention achieves its purpose and appropriately modifies and changes within the scope of the claims. It is possible.

  The scribing method of the present invention can be used when scribing a substrate made of a brittle material such as a glass substrate, silicon, ceramic, or compound semiconductor.

M brittle material substrate 1a normal cutter _{G 1, G 2, G n} breaking point P breaking point pitch

Claims (2)

A scribing method for forming a scribe line by rolling on a brittle material substrate using a normal cutter wheel in which a notch is not formed in a cutting edge ridge line portion,
A scribing step of advancing a first distance while pressing a normal cutter on a scribe planned line of a brittle material substrate with a first pressing load;
A step of retracting the normal cutter by a second distance shorter than the first distance;
A breaking point forming step of forming a breaking point with a second pressing load in which the blade edge load of the normal cutter is raised from the first pressing load at the retracted position;
The brittleness is characterized by forming the breaking points on the scribe line at a predetermined pitch by repeating the scribing process of returning the normal cutter to the first pressing load and moving the first distance forward from the breaking point. A scribing method for material substrates.   The first pressing load of the normal cutter in the scribe process is 0.05 to 0.08 MPa, the second pressing load is 0.24 to 0.28 MPa, and the first distance of the normal cutter in the scribe process is 800 μm. The scribing method for a brittle material substrate according to claim 1, wherein the second distance of the normal cutter is 100 to 300 μm.

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