JP6344787B2 - Ceramic substrate cutting method and scribing apparatus - Google Patents

Ceramic substrate cutting method and scribing apparatus Download PDF

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JP6344787B2
JP6344787B2 JP2012261824A JP2012261824A JP6344787B2 JP 6344787 B2 JP6344787 B2 JP 6344787B2 JP 2012261824 A JP2012261824 A JP 2012261824A JP 2012261824 A JP2012261824 A JP 2012261824A JP 6344787 B2 JP6344787 B2 JP 6344787B2
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scribing
ceramic substrate
scribe
line
load
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JP2014104736A (en
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武田 真和
真和 武田
村上 健二
健二 村上
健太 田村
健太 田村
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三星ダイヤモンド工業株式会社
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Description

  The present invention relates to a method for dividing a ceramic substrate and a scribing device for easily dividing a ceramic substrate.
  In the case of breaking a conventional ceramic substrate, a scribe line is first formed on the ceramic substrate, and then the surface on which the scribe line is formed is placed on the receiving blade as a lower surface, and the scribe line is directly above the scribed substrate. Was breaking by pressing the blade along. However, such a method has a drawback that not only a scribing device and a breaking device are required, but also work steps such as transporting the substrate from the scribing device to the breaking device are increased.
  In the scribe device, it is conceivable to complete the break by deeply scribing. Patent Document 1 discloses a scribing method in which an ordinary cutter is used for scribing for a fixed distance, scribing back a little, increasing the load, and repeating the scribing in the same direction to deeply penetrate vertical cracks. Proposed.
  Further, in Patent Document 2, a main scribe line is formed to sever a brittle material substrate such as a glass substrate, and an auxiliary scribe line is formed at an interval of 0.5 to 1.0 mm in the immediate vicinity of the main scribe line. A method of breaking along the main scribe line has been proposed.
JP2012-72008 WO 2004-48058
  However, in the method of Patent Document 1, a vertical crack can be deeply formed, but it cannot be divided. For this reason, if a break is attempted as it is, the scribe load will increase, leading to a problem that a pre-run or the like will occur, leading to quality degradation. Further, in the method of Patent Document 2, it is possible to break by forming an auxiliary scribe line adjacent to the method. However, when the ceramic substrate is used as a target, the accuracy of the divided end face is lowered. was there.
  The present invention has been made in view of such a conventional problem, and an object of the present invention is to scribe a ceramic substrate twice using a scribing device so that it can be completed up to cutting.
In order to solve this problem, the ceramic substrate cutting method of the present invention uses a first scribing wheel to form a scribe line on a ceramic substrate with a first load along a desired line, and the angle of the blade edge is the Sukurai ugly isosamples superimposed on the scribe on the line of the ceramic substrate in the second load greater than the first load with the second scribing wheel 130 ° or more, and to divide the ceramic substrate .
  Here, the first scribing step may be performed by scribing using a scribing wheel in which a large number of grooves are formed on the circumferential surface.
  Here, in the first scribing step, scribing may be performed using a scribing wheel having a blade edge angle of 90 ° to 125 °.
  Here, in the second scribing step, scribing may be performed using a scribing wheel having a blade edge without a groove.
  Here, in the second scribing step, scribing may be performed using a scribing wheel having a blade edge with an angle of the blade edge of 130 ° to 165 °.
In order to solve this problem, a scribing apparatus of the present invention is a scribing apparatus used for cutting a ceramic substrate, and includes a table for holding a ceramic substrate to be scribed, and a ceramic substrate installed on the table. A bridge having a beam parallel to the surface, and a scribing device provided so as to be movable along the beam and rolling a first scribing wheel along a scribe line of a ceramic substrate held on the table. A second scribing head that is movably provided along the beam and has a cutting edge angle of 130 ° or more with a scribing load that is larger than that formed when the first scribing line is formed on the scribing scribing line. then rolling the scribing wheel to perform the scribing More, those having a, a second scribing head to divide the ceramic substrate.
According to the present invention having such a feature, twice Sukurai ugly Rukoto the same line, an excellent effect that it is possible to complete the cutting of the substrate as if with a scribe and break simultaneously obtained . Accordingly, since it is sufficient to use only the scribing device, it is not necessary to carry or position the scribing device from the scribing device, and the number of work steps can be reduced. Moreover, it becomes possible to divide by improving the end face accuracy of the ceramic substrate.
FIG. 1 is a perspective view showing an example of a scribing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic view showing a scribe for realizing the dividing method according to the present embodiment. FIG. 3 is a diagram showing a result of division according to an example of the present invention and a comparative example.
  FIG. 1 is a schematic perspective view showing an example of a scribing device used for cutting a ceramic substrate according to an embodiment of the present invention. In the scribing device 10, a movable table 11 is held so as to be movable in the y-axis direction along a pair of guide rails 12 a and 12 b. The ball screw 13 is screwed with the movable table 11. The ball screw 13 is rotated by the drive of the motor 14 and moves the moving base 11 in the y-axis direction along the guide rails 12a and 12b. A motor 15 is provided on the upper surface of the movable table 11. The motor 15 rotates the table 16 on the xy plane and positions it at a predetermined angle.
  In the scribe device 10, a bridge 20 is installed by struts 21a and 21b along the x-axis direction so as to straddle the movable table 11 and the table 16 on the upper side thereof. The bridge 20 is provided with a beam 22 parallel to the surface of the table 16, and a linear motor 23 is provided in the longitudinal direction of the beam 22. The linear motor 23 is provided with a first scribe head 24 used in the first scribe process. A scribing wheel 25 is attached to the lower end of the scribe head 24. The scribing wheel 25 may be a normal cutting edge with no groove on the circumference, but it is preferable to use a scribing wheel capable of highly penetrating scribe. For example, as shown in Japanese Patent No. 3074143, there has been proposed a scribing wheel in which a large number of grooves are formed on the circumferential surface, and a high penetration type is formed with protrusions therebetween. The scribe head 24 is provided with an elevating part that enables such an elevating operation, for example, an air cylinder using air pressure control or an electric elevating part using a linear motor.
  The linear motor 23 is provided with a second scribe head 26 used in the second scribe process. A scribing wheel 27 is attached to the lower end of the scribe head 26. The scribing wheel 27 may have a cutting edge capable of highly penetrating scribe, but preferably has a normal cutting edge. The scribing head 26 is provided with an elevating unit that enables such an elevating operation, for example, an air cylinder using air pressure control or an electric elevating unit using a linear motor. The linear motor 23 is a drive source that moves the scribe heads 24 and 26 along the x-axis direction.
  Next, a scribing and dividing method using the scribing apparatus according to this embodiment will be described. In this apparatus, first, an object to be divided is a ceramic substrate, for example, an LTCC substrate 30, and is held on the table 16. The scribing wheel 25 uses a scribing wheel having a high penetration edge, and the angle of the edge of the scribing wheel is 90 ° or more, preferably 100 ° or more, and 125 ° or less, preferably 120 ° or less. The second scribing wheel 27 uses a so-called normal wheel having no groove on the circumference, and the angle of the blade edge is larger than that of the first scribing wheel 24, for example, 130 ° or more, preferably 135 ° or more, more preferably 140 ° or more, and 165 ° or less, preferably 160 ° or less, more preferably 155 ° or less.
  In the first scribe process, as shown in FIG. 2A, the first scribe head 24 is used, and the linear motor 23 is driven to move the scribe head 24. The scribing wheel 25 receives a first load and rolls on the LTCC substrate 30 to form a scribe line 31.
  Next, as shown in FIG. 2B, a second scribe is performed so as to overlap the scribe line 31 formed. Also at this time, the linear motor 23 is driven and the second scribing wheel 27 of the second scribe head 26 is used to scribe again with a second load larger than the first load. In the second scribe process, by making the load larger than that in the case of the first scribe, it is possible to apply a force to the already formed cracks and to spread and infiltrate them. By doing so, the LTCC substrate 30 can be substantially divided by the second scribe.
  For this reason, in this embodiment, the first scribe and the second scribe are continuously performed while the LTCC substrate 30 is held on the table 16 using only the scribe device, so that the division can be completed only by the scribe.
  Next, examples of scribing and dividing according to this embodiment will be described. Here, an LTCC substrate having a thickness of 0.65 mm was used as the ceramic substrate. For the first scribe, a scribing wheel having a high penetration edge with a diameter of 2φ and an edge angle of 110 ° was used, and the scribe load was set to 0.24 MPa.
  Next, for the second scribe, a scribing wheel with a normal edge was used, the edge angle was 150 °, and the scribe load was 0.40 MPa. For the second scribe, the scribe was attempted by changing the shift amount little by little with respect to the scribe line of the first scribe. The result is shown in FIG. Here, Example 1 has a shift amount of 0 mm, Example 2 has a shift amount of 0.02 mm, and Comparative Examples 1, 2, and 3 have shift amounts of 0.04 mm, 0.06 mm, and 0.08 mm, respectively. As shown in this test, the scribe quality and cross-section quality are good when the shift amount is 0 mm as in Example 1, that is, when the first and second scribes are made the same line, and light support is provided after the scribe is completed. Can separate the substrate. In addition, almost the same effect is obtained in Example 2 to which a shift of 0.02 mm is added. The amount of soge indicates the degree of unevenness in the cross section.
  On the other hand, as shown in Comparative Examples 1 to 3, when the shift amount is 0.4 mm or more, the scribe quality and the cross-sectional quality are deteriorated, and cracks are easily generated in the cross-section, and the quality is deteriorated. Therefore, the second scribe is preferably on the same line as the first scribe, but the allowable error range was ± 0.03 mm.
  Although this embodiment describes an LTCC substrate, the present invention describes scribing and cutting of various ceramic substrates, for example, ceramic substrates such as LTCC substrates, alumina (HTCC), aluminum nitride, barium titanate, ferrite, and silicon nitride. Can be applied to.
  The present invention can break using a ceramic substrate using a scribing device, and is effective for dividing the ceramic substrate.
DESCRIPTION OF SYMBOLS 10 Scribing device 11 Moving table 16 Table 20 Bridge 22 Beam 23 Linear motor 24, 26 Scribe head 25, 27 Scribing wheel 30 Ceramic substrate

Claims (2)

  1. Forming a scribe line on the ceramic substrate with a first load along a desired line using a first scribing wheel;
    The Sukurai ugly isosamples superimposed on the scribe line of the ceramic substrate in the first larger load second load with second scribing wheel angle of the cutting edge is not less than 130 °, dividing the ceramic substrate To cut ceramic substrate.
  2. A scribing device used for cutting a ceramic substrate,
    A table for holding a ceramic substrate to be scribed;
    A bridge having a beam parallel to the surface of the ceramic substrate placed on the table;
    A first scribing head that is movably provided along the beam and that performs scribing by rolling a first scribing wheel along a scribing line of a ceramic substrate held by the table;
    A second scribing wheel, which is provided so as to be movable along the beam and rolls over the scribed scribe line, has a cutting edge angle of 130 ° or more with a scribe load larger than that at the time of forming the first scribe line And a second scribing head that divides the ceramic substrate by performing scribing.
JP2012261824A 2012-11-30 2012-11-30 Ceramic substrate cutting method and scribing apparatus Active JP6344787B2 (en)

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JP2012261824A JP6344787B2 (en) 2012-11-30 2012-11-30 Ceramic substrate cutting method and scribing apparatus
TW102121479A TWI591032B (en) 2012-11-30 2013-06-18 Ceramic substrate breaking method and scoring device
CN201310528745.0A CN103991137A (en) 2012-11-30 2013-10-30 Cutting method for ceramic substrate and scribing device

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JP6344787B2 true JP6344787B2 (en) 2018-06-20

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TW202039193A (en) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 Method of dividing brittle substrate
CN107379292B (en) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 Cutting method, system and the storage medium of display panel

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JPH11138523A (en) * 1997-11-11 1999-05-25 Yamaha Corp Scribing device and scribing method of base
JPH11322355A (en) * 1998-05-20 1999-11-24 Toshiba Corp Formation of scribe
US7717311B2 (en) * 2002-11-22 2010-05-18 Mitsuboshi Diamond Industrial Co., Ltd. Method for dividing substrate and method for manufacturing substrate using such method
DE102005024497B4 (en) * 2005-05-27 2008-06-19 Schott Ag Method for mechanically breaking scored flat workpieces from brittle material
JP5023547B2 (en) * 2006-04-28 2012-09-12 坂東機工株式会社 Glass plate cutting method and glass plate cutting machine
EP2292398A4 (en) * 2008-06-05 2017-05-31 Mitsuboshi Diamond Industrial Co., Ltd. Scribing wheel and method for scribing brittle material substrate
JP2010126383A (en) * 2008-11-26 2010-06-10 Joyo Kogaku Kk Cutter wheel for cutting glass
JP5210355B2 (en) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 Method for scribing a brittle material substrate
JP2012012237A (en) * 2010-06-30 2012-01-19 Mitsuboshi Diamond Industrial Co Ltd Tool for setting distance between wheels
JP5331078B2 (en) * 2010-09-28 2013-10-30 三星ダイヤモンド工業株式会社 Method for scribing a brittle material substrate
TWI462885B (en) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
CN102653115B (en) * 2011-03-04 2015-01-14 三星钻石工业股份有限公司 Ruling device and ruling method

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TW201420524A (en) 2014-06-01
CN103991137A (en) 2014-08-20
JP2014104736A (en) 2014-06-09

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