KR20160144661A - Dividing method and dividing apparatus - Google Patents
Dividing method and dividing apparatus Download PDFInfo
- Publication number
- KR20160144661A KR20160144661A KR1020150081086A KR20150081086A KR20160144661A KR 20160144661 A KR20160144661 A KR 20160144661A KR 1020150081086 A KR1020150081086 A KR 1020150081086A KR 20150081086 A KR20150081086 A KR 20150081086A KR 20160144661 A KR20160144661 A KR 20160144661A
- Authority
- KR
- South Korea
- Prior art keywords
- scribing
- line
- glass substrate
- scribe
- scribed
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Description
The present invention relates to a dividing method and a dividing apparatus, and more particularly, to a dividing method and a dividing apparatus for dividing a glass substrate.
Currently, glass substrates are widely used in various parts of electronic products such as screens and cases. The surface of many glass substrates must undergo tempering treatment in order to meet the demand for use of the final product, and the scribing process is more difficult, and it is not easy to improve the yield rate. Therefore, how to scribe the glass substrate along the planned scribing line without generating defects on the surface of the glass substrate is an important issue in this industry.
1A and 1B, the
As shown in Fig. 2, in the case of scribing the
Taking these into consideration, it is a problem to be solved in the technical field of the present invention in the technical field of the present invention to avoid incomplete collision phenomenon and scribe in scribing a glass substrate and to avoid occurrence of defects in glass products.
SUMMARY OF THE INVENTION It is an object of the present invention to avoid the phenomenon of collision which occurs when scribing a glass substrate including a first surface and a second surface with respect to a first surface and incomplete scribing and to reduce the defects that occur when scribing a glass product A method of dividing a glass substrate, and a dividing device.
(A) forming a first scribe line by scribing the glass substrate on the first surface along a line to be scribed; and (b) ) Forming a second scribe line by scribing the glass substrate on the second surface along a second scribing line; (c) forming a first scribe line on the first surface, And breaking the glass substrate along the second scribe line on the second surface to form the glass product, wherein the step of projecting the second scribe line to the first surface The projection line of the line scheduled to be scribed intersects with the line scheduled to be scribed.
In order to achieve the above object, a breaking apparatus of the present invention comprises a first scribe head forming a first scribe line by scribing the glass substrate on the first surface along a first scribing line, A second scribe head forming a second scribe line by scribing the glass substrate on the second surface along a second scribe expected line, and a second scribe line on the first scribe line and on the second surface, And a braking device for forming the glass product by breaking the glass substrate along the second scribing line, wherein when the second scribing line is positively projected onto the first surface, The projection line crosses the first scheduled scribing line.
According to the present invention, it is possible to reduce defects that occur when scribing a glass product.
1A is a perspective view showing scribing of a glass substrate from a rim of a glass substrate by a known scribing method.
1B is a cross-sectional view of an actual scribe line when a glass substrate is scribed from a rim of a glass substrate by a known scribing method.
2 is a view showing scribing of a glass substrate along a plurality of intersecting scribing lines by a known scribing method.
Fig. 3 is a view showing scribing of a glass substrate along a line to be scribed by a plurality of scribing lines by the dividing method and the dividing device of the present invention. Fig.
4A is a view showing a first scribe line formed by scribing after forming a first initial crack by the dividing method and the dividing device of the present invention.
4B is a view showing that the first scribe line is formed by scribing after forming the first initial crack by the dividing method and the dividing device of the present invention.
4C is a view showing that the first scribe line is formed by scribing after forming the first initial crack by the dividing method and the dividing apparatus of the present invention.
5A is a view showing that a second scribe line is formed by scribing after forming a second initial crack by the dividing method and the dividing device of the present invention.
5B is a view showing that a second scribe line is formed by scribing after forming a second initial crack by the dividing method and the dividing device of the present invention.
FIG. 5C is a view showing that a second scribe line is formed by scribing after forming a second initial crack by the dividing method and the dividing device of the present invention. FIG.
(Mode for carrying out the invention)
As shown in Figure 3, the
3, in the step (a), the
As described above, according to the dividing method of the present invention, when the second
Further, the present invention can be carried out by the following method. 4A to 4C, in the step (a), when the scribing is started on the glass substrate, the
5A to 5C, when scribing is started with respect to the
As described above, according to the dividing method of the present invention, when the
4C and 5C, when the
In the step (a) and the step (b), the breaking method of the present invention is a method in which a first initial crack 541 (first crack) is generated by irradiating a laser, polishing with a grindstone, scribing with a diamond, or scribing with a scribe wheel And the second
3, the breaking apparatus of the present invention includes a
3, the
4A to 4C, the
5A to 5C, the
When the
The
As described above, according to the dividing method and the dividing apparatus of the present invention, since a scribe head, a laser head or the like traverses a scribed opening at the time of scribing like a known dividing method, a phenomenon And scribing is incomplete and various kinds of defects of the glass product are prevented from occurring due to unstable scribing pressure or energy to be performed on the substrate or occurrence of vibration.
1: glass substrate
101: tensile layer
102: Compressed layer
11: First surface
12: Second surface
14: Border
311: First scheduled scribing line
312: Scheduled second line to be scribed
313: Intersection
321: 1st scribe line
391: Scribe head
511: First scheduled scribing line
512: Scheduled second line to be scribed
521: 1st scribe line
522: 2nd scribe line
531: First initial position
532: Second initial position
541: first initial crack
542: second initial crack
591: First scribe head
592: second scribe head
Claims (16)
(a) forming a first scribe line by scribing the glass substrate on the first surface along a first scribing line; and
(b) forming a second scribe line by scribing the glass substrate on the second surface along a second scribing line; and
(c) breaking the glass substrate along the first scribe line on the first surface and breaking the glass substrate along the second scribe line on the second surface to form the glass product Including,
Wherein the projection line of the line scheduled to be scribed intersects the line scheduled to be scribed when the line scheduled to be scribed is regularly projected onto the first surface.
Wherein said step (a) comprises forming a first initial crack at a first initial position of said first scribing line on said first surface, away from all edges of said glass substrate, The first scribing line is formed by scribing the glass substrate along the first scribing line from the first initial crack on the first scribing line,
(B) comprises forming a second initial crack at a second initial position of the line to be scribed second on the second surface, away from all edges of the glass substrate, Wherein the second scribing line is formed by scribing the glass substrate along the second scribing line from the second initial crack on the first scribing line.
Wherein the glass substrate is a tempered glass substrate and includes a tensile layer and two compressive layers that are adjacent to the tensile layer and become the first surface and the second surface, Wherein the compression layer has a compressive internal stress, and the depths of the first initial crack and the second initial crack are smaller than the thickness of the compressed layer.
Wherein the first scribe line and the second scribe line have a depth greater than the thickness of the compressed layer and are drawn into the tensile layer.
Wherein the second scribing line and the first scribing line are perpendicular to each other when the second scribing line is fixedly projected onto the first surface.
Wherein the step (a) scribes the glass substrate on the first surface along a plurality of lines to be scribed, thereby forming a plurality of the first scribe lines,
The step (b) scribes the glass substrate on the second surface along a plurality of lines to be scribed, thereby forming a plurality of the second scribe lines,
Wherein the projection line of the line scheduled to be scribed intersects with the line scheduled to be scribed when the line scheduled to be scribed on the second surface is projected on the first surface.
In the step (a) and the step (b), the first initial crack and the second initial crack are generated by laser irradiation, polishing with a grindstone, scribing with diamond, or scribing with a scribe wheel, Is formed.
In the step (a) and the step (b), the first scribing line and the second scribing line may be formed by irradiating a laser, polishing with a grindstone, scribing with a diamond, or scribing with a scribing wheel. Is formed.
A first scribe head forming a first scribe line by scribing the glass substrate on the first surface along a first scribing line,
A second scribe head forming a second scribe line by scribing the glass substrate on the second surface along a second scribe line,
And a braking device for breaking the glass substrate along the first scribe line on the first surface and the second scribe line on the second surface to form the glass product,
And the projection line of the line scheduled to be scribed intersects with the line scheduled to be scribed when the second scheduled line is positively projected onto the first surface.
Wherein said first scribe head forms a first initial crack at a first initial position of said first scribe line on said first surface away from all edges of said glass substrate, The first scribing line is formed by scribing the glass substrate along the first scribing line from the first initial crack on the first scribing line,
The second scribe head forming a second initial crack at a second initial position of the second scribe line on the second surface away from all edges of the glass substrate, Wherein the second scribing line is formed by scribing the glass substrate along the second scribing line from the second initial crack on the first scribing line.
Wherein the glass substrate is a tempered glass substrate and includes a tensile layer and two compressive layers that are adjacent to the tensile layer and become the first surface and the second surface, Wherein the compression layer has a compressive internal stress, and the depths of the first initial crack and the second initial crack are smaller than the thickness of the compressed layer.
Wherein the first scribe line and the second scribe line have a depth greater than the thickness of the compressed layer and are drawn into the tensile layer.
Wherein the second scribing line and the first scribing line are perpendicular to each other when the second scribing line is fixedly projected onto the first surface.
The first scribing head scribes the glass substrate on the first surface along a plurality of the first scribing lines, thereby forming a plurality of the first scribing lines,
The second scribing head scribes the glass substrate on the second surface along a plurality of the second scheduled scribing lines to form a plurality of the second scribing lines, Wherein the projection line of the line scheduled to be scribed intersects with the line scheduled to be scribed when the projection is performed on the first surface.
The first scribing head and the second scribing head may be formed by irradiating a laser beam, polishing with a grindstone, scribing with a diamond, or scribing with a scribing wheel so that the first initial crack and the second initial crack Wherein the first and second members are separated from each other.
The first scribing head and the second scribing head may be formed by irradiating a laser beam, polishing with a grindstone, scribing with a diamond, or scribing with a scribing wheel so that the first scribing line and the second scribing line Wherein the first and second members are separated from each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150081086A KR20160144661A (en) | 2015-06-09 | 2015-06-09 | Dividing method and dividing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150081086A KR20160144661A (en) | 2015-06-09 | 2015-06-09 | Dividing method and dividing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160144661A true KR20160144661A (en) | 2016-12-19 |
Family
ID=57735324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150081086A KR20160144661A (en) | 2015-06-09 | 2015-06-09 | Dividing method and dividing apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20160144661A (en) |
-
2015
- 2015-06-09 KR KR1020150081086A patent/KR20160144661A/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102275229B (en) | Cutting method of fragile material base plate | |
JP5979600B2 (en) | Sheet glass breaking and separating method | |
TWI515174B (en) | Cutting method and cutting stage of toughened glass | |
TWI648231B (en) | Fragmentation method of brittle material substrate | |
JP5210356B2 (en) | Method for scribing a brittle material substrate | |
TW201348160A (en) | Cutting method and cutting apparatus for a glass substrate | |
WO2004039549A1 (en) | Method and device for scribing fragile material substrate | |
WO2016065790A1 (en) | Method and device for cutting lcd screen glass | |
KR20140142224A (en) | Glass film fracturing method and glass film laminate body | |
JP2015209357A (en) | Break method and break device | |
JP2012000792A (en) | Method for scribing brittle material substrate | |
TW201313636A (en) | Scribe method for glass substrate | |
JP2012240881A (en) | Method of processing fragile material substrate | |
TWI474981B (en) | Method for cutting a strengthened glass substrate accompanying control of compressive stress | |
KR20160144661A (en) | Dividing method and dividing apparatus | |
TWI619588B (en) | Fracture method and device for brittle material substrate | |
JP5292420B2 (en) | Glass substrate scribing method | |
TWI507371B (en) | Cutting method and cutting apparatus | |
KR101574934B1 (en) | Chamfering method for brittle material | |
TW201236987A (en) | Scribing method of glass substrate | |
JP2016216305A (en) | Parting method and parting device | |
CN106466888B (en) | Method for forming vertical crack in brittle material substrate and method for dividing same | |
TW201422546A (en) | One tempered glass sheet formed by unit cell G2 touch sensor processing method and producing method thereof | |
WO2016067728A1 (en) | Brittle base plate disjoining method | |
JP2014097908A (en) | Chemically strengthened glass, and cutting method of chemically strengthened glass |