TW201313636A - Scribe method for glass substrate - Google Patents

Abstract

This invention provides a scribe method for a glass substrate such that desired scribing trenches can be easily and stably formed on a tempered glass to prevent the glass from being naturally cracked. The method includes scribing a tempered glass surface formed with a compressed stress strengthened layer and forming a crack-restricting trench and a scribing trench. In the step of forming the crack-restricting trench, a predefined line having a predetermined width is drawn toward an end of a predefined crack-restricting area on the surface of glass in an intersection direction of the trench and the predefined line. In the step of forming the scribing trench, the glass surface is projected by laser beams to heat up and the heated glass area is cooled down so that the predetermined line can be drawn along to form the scribing trench by cutting.

Description

Glass substrate scribe method

The present invention relates to a method of scribing a glass substrate, and more particularly to a method of scribing a glass substrate in which a glass having a reinforcing layer having a compressive stress on the surface is scribed.

A method of forming a scribe groove in order to break a glass substrate is a method of forming a scribe groove by using laser light. In this case, the laser light is irradiated along a predetermined line of the scribe line, and one of the substrates is partially dissolved and evaporated to form a scribe groove. However, in this method, a part of the substrate which is dissolved and evaporated adheres to the surface of the substrate, which causes deterioration in quality. Further, the crack formed in the portion dissolved and evaporated is a cause of a decrease in the strength of the end face of the substrate.

Therefore, there is a method shown in Patent Document 1 or 2 for other methods of forming a scribe groove. Among them, an initial crack is formed at a position which is a starting point of a scribe line of a glass substrate, and the initial crack is irradiated with laser light. Thereby, thermal stress is generated in the laser irradiation portion, and the crack progresses to form a scribe groove.

Further, in the method of forming the scribe groove by irradiating the laser light, the crack of the scribe groove tends to be deep in the peripheral portion of the glass substrate. In this state, when the glass substrate is broken along the scribe line, there is a problem that the quality of the broken surface is lowered or the scribe groove is not formed straight.

Therefore, Patent Document 3 discloses a laser scribing method in which a region where a scribe groove is not formed is formed at a terminal portion of a predetermined line. According to this In this way, the cross-sectional quality of the terminal portion of the glass substrate can be improved without complicated control.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open No. 3-489

Patent Document 2: Japanese Patent Laid-Open Publication No. 9-1370

Patent Document 3: Japanese Re-issued Patent No. WO 2007/094348

However, in the recent FPD (flat panel display) industry, since the strength of the substrate end face is emphasized, a chemically strengthened glass having a reinforcing layer formed on its surface is mainly used as a glass substrate. The chemically strengthened glass has a layer (strengthening layer) which is subjected to compressive stress on the surface by ion exchange treatment, and has tensile stress inside. Recently, this chemically strengthened glass is used for a cover glass such as a touch panel which particularly requires end face strength.

The inventors of the present invention discovered through experiments that in the tempered glass, especially in the recently developed surface high-strength tempered glass, when the scribe line is formed by the laser scribing method, the deep crack will mainly come from The end portion of the scribe groove is naturally broken along the progress of the scribe groove. Here, the natural disconnection is a phenomenon in which the glass substrate is broken along the scribe line without forming the scribe line after the scribe line is formed.

The natural disconnection system may be caused by the fact that the crack of the scribe groove in the peripheral portion of the glass substrate is deep, and the deep crack is generated along the scribe groove. Further, the crack depth of the scribe groove in the peripheral portion of the glass substrate may be as follows The reason.

‧ In the end portion of the glass substrate in which the scribe groove is formed, since the end faces are not restrained, both sides of the scribe groove are easily opened.

‧ In the end portion of the glass substrate in which the scribe groove is formed, heat is not stopped at the end portion due to the fact that heat is not radiated from the terminal portion.

When a natural disconnection occurs due to the above reasons, the processing of the subsequent steps becomes difficult.

Therefore, in order to prevent the scribe groove from being formed on the peripheral edge portion of the glass substrate, it is conceivable to affix the aluminum strip to the end portion of the predetermined line to shield the laser light. However, this method is not practical from the viewpoint of productivity.

Further, it is conceivable that the heat treatment and the cooling treatment are not performed on the peripheral portion of the glass substrate by controlling the irradiation of the laser light, and the scribe line does not reach the end of the predetermined line. However, this method is difficult to stop the scribe groove at the desired position and is not stable.

Furthermore, the inventors of the present invention found that the same problem occurs not only at the end portion of the glass substrate but also at the beginning. That is, when an initial crack is formed at the edge portion of the glass substrate belonging to the beginning end of the line to be scribed, the initial crack is formed deeply in the step of forming the scribe groove. Further, due to the deep crack, after the scribe line is formed, the glass substrate is naturally broken without performing the breaking step.

Therefore, in order to avoid the countermeasure of natural disconnection, it is conceivable to form an initial crack from the start end (the edge of the substrate) to the inner side. However, even if the above countermeasures are taken, the situation of natural disconnection will be similarly caused. The phenomenon in this case is explained in more detail. First, the formation step in the dash In the second step, the crack is opposite to the scanning direction of the laser light, and the crack progresses from the initial crack to the edge of the glass substrate. Then, when the crack progresses from the initial crack to the edge of the glass substrate, the depth of the crack at the edge portion of the glass substrate is as deep as the entire thickness of the substrate. The glass substrate is naturally broken along the scribe groove due to the crack formed deep in the edge portion. When such a natural disconnection occurs, the processing of the subsequent steps becomes difficult.

Therefore, it is also considered to increase the amount of bias. However, when the amount of the offset is increased, a waste portion is added to the peripheral portion of the glass substrate (the portion which is a product cannot be secured), and the yield is poor.

An object of the present invention is to easily and stably form a desired scribe groove for a glass having a reinforcing layer on its surface to prevent natural breakage.

The method for scribing a glass substrate according to the first aspect of the invention is a method of scribing a glass having a reinforcing layer having a compressive stress on a surface thereof, and includes a crack restricting groove forming step and a scribing groove forming step. In the step of forming the crack restricting groove, a crack restricting groove having a predetermined width is formed on the surface of the glass at a terminal end portion of a predetermined line of the scribe line in a direction intersecting the predetermined line of the scribe line. In the scribe groove forming step, the laser light is irradiated onto the surface of the glass and heated, and the heated region is cooled, and the crack progresses along the predetermined line of the scribe line to form a scribe groove.

Here, the groove for restricting the progress of the crack is formed at the end portion of the predetermined line of the scribe line in a direction intersecting the predetermined line of the scribe line. Then, the laser light is irradiated on the surface of the glass to be heated, and the heated region is cooled. With this heating and cooling process, the crack progresses along the predetermined line of the scribe line. A scribe groove is formed. The progress of the crack is limited by the first formed crack limiting groove. Therefore, no scribe groove is formed at the end portion of the scribe line.

By this method, deep cracks can be prevented from being formed at the end portion of the predetermined line of the scribe line, and natural breakage can be avoided. Further, it is not necessary to apply an affliction to the aluminum tape or the like, and the formation of the scribe groove can be stably prevented at a desired position.

In the scribing method of the glass substrate according to the first aspect of the invention, the initial scribing step is further included as a step before the step of forming the scribing groove, and a part of the reinforcing layer is removed. An initial crack is formed on the surface of the glass.

Here, a portion of the reinforcing layer formed on the surface of the glass is removed by a cutting wheel or the like to form an initial crack. Then, the laser light is irradiated to the initial crack and heated, and the heated region is cooled. Thereby, the initial crack will cause the crack to progress along the line of the scribe line. Therefore, the desired scribe groove can be stably formed.

The method for scribing a glass substrate according to a third aspect of the present invention is a method of scribing a glass having a reinforcing layer having a compressive stress on a surface thereof, and includes an initial crack forming step, a scribing groove forming step, and a crack restricting groove forming method. step. The initial crack formation step removes at least a portion of the strengthening layer to form an initial crack on the surface of the glass. The scribe groove forming step heats the laser light on the surface of the glass, cools the heated region, and advances the initial crack along the predetermined line of the scribe line to form a scribe groove. The crack restricting groove forming step is for restricting the initial crack from progressing in a direction opposite to the progress of the crack in the step of forming the groove, and between the initial crack and the edge of the glass substrate in the surface of the glass. Toward and line the line The direction in which the directions of the intersection intersect is formed into a crack restricting groove having a predetermined width as a pre-treatment or post-treatment of the initial crack forming step.

Here, an initial crack is formed in the vicinity of the beginning end of the planned line of the scribe line. Further, between the initial crack and the edge of the glass substrate, a groove which restricts the formation of the crack in a direction intersecting the direction in which the predetermined line is extended is formed. Then, the laser light is irradiated onto the surface of the glass to be heated, and the heated region is cooled. By this heating and cooling treatment, the crack progresses along the predetermined line of the scribe line to form a scribe groove. At this time, although the crack progresses toward the end portion of the predetermined line, there is a case where the crack progresses in the opposite direction. However, the crack that progresses in the opposite direction is stopped by forming a groove between the initial crack and the edge of the glass substrate.

Therefore, it is possible to prevent the initial crack from progressing in the opposite direction and to form a deep crack at the edge portion of the glass substrate. Therefore, the natural disconnection after the formation of the predetermined line of the scribe line can be suppressed.

Further, since the crack can be restricted from the initial crack to the edge of the substrate, the initial crack can be prevented from being reduced as a part of the product, and the yield of the product can be improved.

In the scribing method according to any one of the first to third aspects of the present invention, in the step of forming the crack limiting groove, the crack restricting groove is perpendicular to a predetermined line of the scribe line. The direction is extended to form.

Here, since the crack restricting groove is formed in a direction perpendicular to a predetermined line of the scribe line, the progress of the crack can be more reliably prevented.

In the scribing method of the glass substrate according to any one of the first to fourth aspects of the present invention, in the step of forming a crack limiting groove, the cracking limit is The groove system is formed to be shallower than the depth of the scribe groove formed in the scribe groove forming step.

When the crack limiting groove is deepened, the crack tends to progress naturally from the crack limiting groove due to the tensile stress inside the glass substrate, and the substrate may be separated by the crack.

Therefore, in the fifth invention, the depth of the crack restricting groove is made shallower than the depth of the scribe groove to avoid natural breakage of the substrate.

The scribing method of the glass substrate according to the sixth aspect of the invention is the initial crack formed in the initial crack forming step and the groove formed in the crack restricting groove forming step in the scribing method according to the second or third aspect of the invention. It is formed at intervals between the two.

Here, since the initial crack and the crack restricting groove are formed apart from each other, it is possible to more reliably suppress the progress of the initial crack to the edge of the glass substrate.

As described above, the present invention is directed to the glass having a reinforcing layer having a compressive stress on the surface, and it is easy and stable to prevent the progress of the crack immediately before the end portion of the predetermined line. Therefore, it is possible to prevent the glass from being naturally broken at the time when the scribe groove is formed in the glass.

Further, in the present invention, it is possible to suppress the initial crack from progressing in the opposite direction toward the edge of the glass substrate. Therefore, it is possible to prevent the glass from being naturally broken at the time when the scribe groove is formed in the glass.

Fig. 1 is a schematic block diagram showing an apparatus for carrying out a scribing method according to an embodiment of the present invention. The scribing device 1 is, for example, a mother glass substrate The device is disconnected into a plurality of unit substrates used in an FPD (Flat Panel Display). Here, the glass substrate mainly uses a chemically strengthened glass in which a reinforcing layer is formed on the surface. As described above, the chemically strengthened glass has a strengthening layer which has a compressive stress on the surface by ion exchange treatment.

<Line device>

The scribing device 1 includes an illuminating unit 2 that radiates a laser beam toward the glass substrate G, a cooling unit 3, and a moving unit (not shown). The cooling unit 3 discharges the refrigerant supplied from a refrigerant source (not shown) through the nozzle 4 to form a cooling point CP. In the moving unit, the nozzles 4 of the irradiation unit 2 and the cooling unit 3 are relatively moved between the glass substrate G and the predetermined line SL set on the glass substrate G.

The illuminating unit 2 has a laser oscillator (for example, a CO ₂ laser) that irradiates the laser beam LB, and the laser beam LB is irradiated onto the glass substrate G as a beam spot LS through an optical system.

Here, although not shown, an initial crack forming means for forming an initial crack as a starting point of the scribe line is provided at the end of the glass substrate G. In the initial crack forming means, a mechanical tool such as a cutting wheel is used, but an initial crack may be formed by irradiation of a laser beam.

[scoping method] (First embodiment)

First, as shown in Fig. 1, an initial crack TR as a starting point of a scribe line is formed at an end portion of the glass substrate G by an initial crack forming means such as a cutter wheel. At this time, the depth of the initial crack TR is a depth to which the reinforcing layer formed on the surface of the glass substrate (tempered glass) is peeled off. Specifically, the depth of the initial crack TR is set to 1.0 times or more of the thickness of the reinforcing layer. Less than the following.

In the preceding step or the subsequent step of the initial cracking, a plurality of crack restricting grooves S for preventing the crack from progressing along the scribe line SL are formed at the end portion of the scribe line SL. Each of the plurality of crack restricting grooves S is formed in a direction orthogonal to the predetermined line SL by a predetermined width. Further, the depth of the crack restricting groove S is preferably formed to be shallower than the depth of the scribe groove formed in the subsequent step. The reason is that when the crack limiting groove S is too deep, the crack naturally progresses from the crack limiting groove S as a starting point due to the tensile stress inside the glass substrate, and the substrate is separated by the crack. Further, the depth of the crack restricting groove S is preferably set to be deeper than the thickness of the reinforcing layer.

Further, the crack restricting groove S may be one groove orthogonal to all the planned line SL. However, in order to reduce foreign matter such as dust generated when the groove is formed, it is preferable to form a plurality of grooves locally.

Next, the laser beam LB is irradiated from the irradiation unit 2 to the glass substrate G. This laser beam LB is irradiated onto the glass substrate G as a beam spot LS. Then, the laser beam LB emitted from the illuminating unit 2 is moved relative to the glass substrate G along the scribe line SL. The glass substrate G is heated to a temperature lower than the softening point of the glass substrate G by the beam spot LS. Further, the cooling point CP is caused to follow the moving direction of the beam spot LS. Further, in the scanning of the beam spot and the cooling point, it is also conceivable to stop the groove for stopping the crack growth. However, in order to facilitate the control of the laser irradiation, it is preferable to perform the end portion of the glass substrate G.

As described above, compressive stress is generated in the vicinity of the beam spot LS heated by the irradiation of the laser beam LB, but immediately after the ejection by the refrigerant A cooling point is formed, thus producing an effective tensile stress for the formation of vertical cracks. By the tensile stress, a vertical crack along the predetermined line SL of the scribe line is formed with the initial crack TR formed at the end portion of the glass substrate G as a starting point to form a desired scribe groove.

Here, since the crack restricting groove S is formed at the end portion of the scribe line SL, that is, the peripheral portion of the glass substrate G, the crack which progresses along the scribe line SL is stopped by the groove. Therefore, the crack does not progress to the full depth of the glass substrate G, and the substrate can be prevented from being naturally disconnected.

(Second embodiment)

Figure 2 shows an embodiment of another method. In this embodiment, the difference from the first embodiment is only the position at which the crack restricting groove S is formed, and the other methods are the same as those in the first embodiment.

Specifically, in the step of forming the initial crack TR, in the step of forming the groove in the next step, in order to prevent the crack from progressing from the initial crack TR to the crack (the scanning direction of the laser beam LB) progresses in the opposite direction to form the crack limiting groove S. The groove S is formed on the surface of the glass substrate G between the initial crack TR and the edge Ge of the glass substrate G. Further, the crack restricting groove S is formed in a direction orthogonal to the direction in which the predetermined line SL is extended with a predetermined width.

In addition, the depth or the number of the crack limiting grooves S is the same as that of the first embodiment. That is, the depth of the crack restricting groove S is preferably formed to be shallower than the depth of the scribe groove formed in the subsequent step. Further, the crack restricting groove S may be formed corresponding to each of the plurality of scribe lines SL, or may be one groove orthogonal to all the scribe lines SL.

In this embodiment, in the step of forming the scribe groove, even if the crack progresses from the initial crack TR to the direction opposite to the scanning direction of the laser beam LB, the edge of the initial crack TR and the glass substrate G is Ge. Since the crack restricting groove S is formed between them, the crack is stopped in the crack restricting groove S. Therefore, it is possible to prevent the crack from progressing from the initial crack TR to the edge Ge of the glass substrate G, and to form a deep crack at the edge portion of the glass substrate G. Thereby, the glass substrate G can be prevented from being naturally disconnected.

(Experimental example) (Verification of disconnection of glass substrate) [Experimental Example of Conventional Example]

Fig. 3 is a view showing an example of a conventional method, that is, a case where laser heating and cooling are performed from the beginning end to the end of the predetermined line of the scribe line without forming the crack restricting groove S. The tempered glass having a substrate thickness of 0.7 mm and a thickness of the reinforcing layer of 18 μm. In addition, the condition of the laser beam is a laser output of 200 W and a scanning speed of 200 mm/sec. Further, in Fig. 3, the end region of the glass substrate is not shown.

Fig. 3(a) shows the state immediately after the end of the scribe line. Here, the scribe line is not in a state in which the full depth of the substrate progresses (hereinafter, this state is referred to as "half-cut"), and is indicated by a thin line in the drawing.

Fig. 3(b) shows the state after 5 seconds from the scribing process. Here, the scribe line from the start point side (the right side of the figure) to the center of the figure is full cut (indicated by a thick line in the figure).

Fig. 3(c) shows the state after 20 seconds from the scribing process. Here, in all the parts shown in the figure, the scribe line is full cut (indicated by a thick line in the figure).

As described above, when the scribe line is formed by performing laser heating and cooling over all the portions from the start end to the end of the predetermined line of the scribe line, the substrate is naturally disconnected (completely cut).

<Example>

In the above conventional example, the crack limiting groove S is formed at the end portion of the scribe line SL, that is, between 10 and 20 mm from the end surface of the glass substrate G, and the full cutting of the substrate can be avoided.

Further, by forming the crack limiting groove S between the initial crack TR and the edge Ge of the glass substrate G, it is possible to prevent the crack from being formed from the initial crack TR to the edge of the substrate Ge, and the entire substrate can be avoided. Cut, that is, naturally disconnected.

Further, in either case, the grooves S are formed to be shallower than the depth of the formed scribe grooves.

[Investigation on initial cracks]

In the method of the present embodiment, the depth of the initial crack or the like has a large influence on the manufacturing quality. Therefore, an experimental example regarding the depth of the initial crack is shown below.

<Experimental Example 1>

Fig. 4 shows Experimental Example 1 in which a tempered glass was formed into a scribe groove with an overall thickness of 0.55 mm and a thickness of the reinforcing layer of 18 μm. Specifically, Fig. 4 shows the relationship between the pressing load of the tool for the initial crack formation and the groove depth at the time of the formation of the crack, and shows the results of the scribing of the subsequent laser heating and cooling treatment.

At this time, the laser output for the heat treatment was 200 W, and the processing speed was 230 mm/sec. In addition, the cooling condition is to arrange a cooling nozzle at the rear end of the beam. The cooling water and air are sent to the portion heated at the beam spot.

According to the experimental example 1, as long as the initial crack groove depth is 19 to 30 μm (1.05 to 1.67 times the thickness of the reinforcing layer), a desired scribe groove can be formed along the predetermined line of the scribe line. Further, it was found that when the groove depth was less than 19 μm, the crack did not progress reliably (unstable), and when the groove depth exceeded 30 μm, cracking occurred and cracks were formed outside the line to be scribed.

In addition, Fig. 5 shows an example of the depth of the initial crack groove. As shown in Fig. 5, the depth of the deepest portion of the predetermined area is referred to as the "ditch depth", and the crack which is partially sharply reached to the deep portion is ignored.

[Experimental Example 2]

Fig. 6 shows Experimental Example 2 in which a tempered glass having a total thickness of 0.7 mm and a thickness of the reinforcing layer of 21 μm was formed into a scribe groove. The relationship between the horizontal axis and the vertical axis of the figure is the same as in Fig. 4. At this time, the laser output for the heat treatment was 200 W, and the processing speed was 170 mm/sec. Further, the cooling conditions were the same as in Experimental Example 1.

According to the experimental example 2, as long as the initial crack groove depth is about 24 to 50 μm (1.14 to 2.38 times the thickness of the reinforcing layer), a desired scribe groove can be formed along the predetermined line of the scribe line. Further, it was found that when the groove depth was less than 24 μm, the crack did not progress reliably (unstable), and when the groove depth exceeded 50 μm, cracking occurred and cracks were formed outside the line to be scribed. Further, if the pressing load is about 6 to 24 N, the desired scribe groove can be formed even if the groove depth exceeds 50 μm, but the initial crack groove depth is preferably about 24 to 50 μm if only the groove depth is focused. .

[Experimental Example 3]

Fig. 7 shows Experimental Example 3 in which a tempered glass having a total thickness of 1.1 mm and a thickness of the reinforcing layer of 34 μm was formed into a scribe groove. The relationship between the horizontal axis and the vertical axis of the figure is the same as in Fig. 4. At this time, the laser output for the heat treatment was 200 W, and the processing speed was 170 mm/sec. Further, the cooling conditions were the same as in Experimental Example 1.

According to the experimental example 3, as long as the initial crack groove depth is 24 to 60 μm (0.71 to 1.76 times the thickness of the reinforcing layer), a desired scribe groove can be formed along the predetermined line of the scribe line. It is also known that when the depth of the groove is too shallow, the crack does not progress, and when the groove depth exceeds 60 μm, the crack progress is unstable. Further, in the same manner as in Experimental Example 2, if the pressing load is about 6 to 24 N, a desired scribe groove can be formed even if the groove depth exceeds 60 μm, but the depth of the initial crack groove is only focused on the groove depth. It is preferably about 24 to 60 μm.

〔to sum up〕

From the above, it is understood that the depth of the initial crack is preferably 1.0 times or more and 2.0 times or less the thickness of the reinforcing layer of the tempered glass in order to form a desired scribe line along the predetermined line of the scribe line. Further, it is understood that the depth of the initial crack is preferably 30 μm (5.5%) or less when the thickness of the glass sheet is 0.55 mm, and is 50 μm (7.1% or less, and the thickness of the glass sheet is 1.1 mm when the thickness of the glass sheet is 0.7 mm). The time is 60 μm (5.4%) or less. This means that the depth of the initial crack is preferably 7% or less of the thickness of the glass sheet at the maximum.

〔feature〕 - First embodiment -

(1) Since the end portion of the predetermined line SL is scanned, that is, the end of the scanning side The end portion is formed with a groove S for stopping the crack development orthogonal to the predetermined line SL, so that the half cut of the substrate can be realized, and the natural disconnection of the substrate can be avoided. Therefore, the subsequent processing steps of the cross-dash or the like become easy.

(2) Since the groove is formed as a means for stopping the cracking of the end portion of the scribe line SL, the natural detachment of the substrate can be avoided in a simple manner.

- Second embodiment -

(1) Since the groove S at the beginning end of the scribe line SL, that is, the initial crack and the edge of the substrate, is formed to restrict the crack orthogonal to the scribe line SL, the crack can be prevented from being The initial crack progresses toward the edge of the substrate. Therefore, it is possible to avoid formation of deep cracks at the edge portions of the substrate, and it is possible to avoid natural breakage of the substrate due to the deep cracks. Therefore, the processing steps after the cross-dash or the like become easy.

(2) Since the formation of cracks from the initial crack to the edge of the substrate is restricted, the amount of offset of the initial crack from the edge of the substrate can be reduced, and therefore, it is impossible to ensure that the portion as a product is reduced in the substrate. And the product yield can be improved.

(3) Since the groove is formed as a means for stopping the crack from the initial crack toward the edge of the substrate, the natural disconnection of the substrate can be avoided in a simple manner.

(4) Since the initial crack and the crack restricting groove are formed separately, it is possible to more reliably stop the crack from the initial crack toward the edge of the substrate.

- Common features -

Since the crack restricts the formation of the ditch locally, it can be suppressed as much as possible The generation of dust and the deterioration of the quality of the glass substrate can be avoided.

[Other Embodiments]

The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the scope of the invention.

Although the groove for stopping the progress of cracking is preferably formed so as to be orthogonal to the predetermined line of the scribe line, it may not be orthogonal as long as it is formed so as to intersect the line to be scribed.

1‧‧‧ scribe device

2‧‧‧ Department of Irradiation

3‧‧‧ Cooling Department

4‧‧‧ nozzle

CP‧‧‧cooling point

G‧‧‧glass substrate

The edge of the Ge‧‧‧ glass substrate

LB‧‧‧Laser beam

LS‧‧·beam point

S‧‧‧ crack limit groove

SL‧‧‧lined line

TR‧‧‧ initial crack

Fig. 1 is a schematic configuration diagram of an apparatus for carrying out the scribing method according to the first embodiment of the present invention.

Fig. 2 is a schematic configuration diagram of an apparatus for carrying out the scribing method according to the second embodiment of the present invention.

Fig. 3 is a view showing a state in which the substrate is naturally separated when the scribing is performed by a conventional method.

Fig. 4 is a graph showing the relationship between the pressing load for initial crack formation and the initial crack and the result of scribing with respect to the tempered glass having a thickness of 0.55 mm.

Fig. 5 is an enlarged cross-sectional view showing a portion of the tempered glass in which initial cracks are formed.

Fig. 6 is a graph showing the relationship between the pressing load for initial crack formation and the initial crack and the result of scribing with respect to the tempered glass having a thickness of 0.7 mm.

Fig. 7 is a graph showing the relationship between the pressing load for initial crack formation and the initial crack and the scribing result with respect to the tempered glass having a thickness of 1.1 mm.

1‧‧‧ scribe device

2‧‧‧ Department of Irradiation

3‧‧‧ Cooling Department

4‧‧‧ nozzle

CP‧‧‧cooling point

G‧‧‧glass substrate

LB‧‧‧Laser beam

LS‧‧·beam point

S‧‧‧ crack limit groove

SL‧‧‧lined line

TR‧‧‧ initial crack

Claims (6)

A method for scribing a glass substrate by scribing a glass having a reinforcing layer having a compressive stress on the surface, the method comprising: a crack restricting groove forming step, and a crack having a predetermined width on a surface of the glass The restricting groove is formed at a terminal end of the predetermined line of the scribe line in a direction intersecting the predetermined line of the scribe line; and the step of forming the scribe groove, the laser light is irradiated on the surface of the glass to be heated, and the heated region is cooled. The crack is formed along the predetermined line of the scribe line to form a scribe groove. The method for scribing a glass substrate according to claim 1, further comprising an initial crack forming step of removing a portion of the reinforcing layer as a step before the step of forming the dash groove to be in the glass The surface forms an initial crack. A method for scribing a glass substrate by scribing a glass having a reinforcing layer having a compressive stress on a surface thereof, the method comprising: an initial crack forming step of removing at least a portion of the reinforcing layer to be in the glass The surface is initially cracked; the scribe groove forming step is performed by irradiating the laser light on the surface of the glass, heating the heated region, and cooling the heated region to form a scribe line along the predetermined line of the scribe line. a groove and a crack restricting groove forming step for restricting the initial crack from progressing in a direction opposite to a direction in which the crack progresses in the step of forming the groove, and forming the initial crack and the glass substrate on the surface of the glass Between the end edges, forming a direction crossing the direction in which the predetermined line of the scribe line extends A crack limiting groove having a predetermined width is treated as a pre-treatment or post-treatment of the initial crack forming step. The method for scribing a glass substrate according to any one of claims 1 to 3, wherein, in the step of forming the crack limiting groove, the crack limiting groove is oriented toward a line Formed in a vertical direction. The method for scribing a glass substrate according to any one of the preceding claims, wherein, in the step of forming a crack limiting groove, the crack limiting groove is formed to be larger than the scribing line The depth of the scribe groove formed in the groove forming step is shallower. The method for scribing a glass substrate according to the second or third aspect of the invention, wherein the initial crack formed in the initial crack forming step and the groove formed in the crack restricting groove forming step , formed by the interval between the two.