CN102643019B - Scribing method for glass substrate - Google Patents
Scribing method for glass substrate Download PDFInfo
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- CN102643019B CN102643019B CN201210034230.0A CN201210034230A CN102643019B CN 102643019 B CN102643019 B CN 102643019B CN 201210034230 A CN201210034230 A CN 201210034230A CN 102643019 B CN102643019 B CN 102643019B
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- cracks
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- glass substrate
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/072—Armoured glass, i.e. comprising reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a glass substrate scribing method, which can cut glass substrates into a desired shape and meanwhile prevent full-cutting when a scribing groove is formed on reinforced glass with a reinforced surface. The method is applied for scribing reinforced glass having a surface with a compression stress enhancing layer. The method comprises two steps. In the first step, initial cracks are formed on the reinforced glass surface on the inner side of the glass substrate end face located on the scanning starting side of a scribing predetermined line. In the second step, the initial cracks are irradiated by laser and heated along the scribing predetermined line except the scanning starting side and the end part on the scanning stopping side. Then the heated zone is cooled and the cracks are developed along the scribing predetermined line.
Description
Technical field
The present invention relates to glass substrate rose method, particularly relate to the glass substrate rose method that the chilled glass to be formed with strengthening layer on surface is delineated.
Background technology
As the method for the scored groove that is formed for cutting apart, there is the method forming with laser on glass substrate.Now, make part dissolving, the evaporation of substrate by carrying out irradiating laser along delineation preset lines, form scored groove.But in the method, the part of substrate dissolved, evaporation is attached on substrate surface sometimes, incident is the deterioration of quality.In addition, the spot forming in part dissolved, that evaporate becomes the reason that reduces substrate end-face intensity.
As other delineation groove forming method, exist as disclosed method in patent documentation 1 or 2., in the place of the scored groove starting point as glass substrate, be formed with initial be full of cracks herein, to this initial be full of cracks irradiating laser.Thus, produce thermal stresses in laser radiation part, be full of cracks develops and formation scored groove.
In addition, in patent documentation 3, disclose the squareness of the section for improving divided substrate and the laser grooving and scribing method of rectilinear propagation.In the time forming scored groove along delineation preset lines on substrate, near the terminal of delineation preset lines, form the region that is not formed with scored groove herein.
[patent documentation]
[patent documentation 1] Japanese kokai publication hei 3-489 communique
[patent documentation 2] Japanese kokai publication hei 9-1370 communique
[patent documentation 3] Japan is No. 2007/094348 communique of public table special permission again
But nearest FPD (flat-panel monitor) industry is emphasized the intensity of substrate end-face, therefore as glass substrate, mainly use the chemically reinforced glass that is formed with strengthening layer on surface.This chemically reinforced glass has by ion exchange treatment makes surface have the layer (strengthening layer) of stress under compression, recently, particularly in the cover plate such as touch panel that requires end face intensity, applies.
Chilled glass as above, weather resistance is high and very difficult impaired.Therefore, be difficult to stably form and initially chap and form scored groove on the end face of chilled glass.For example, in the time of the depth as shallow of initial be full of cracks, can not form scored groove.And, on the contrary, chapped when dark when initial, can not make initial be full of cracks along the development of delineation preset lines, can not form the scored groove of expectation.
In addition, chilled glass as above has very strong stress under compression on surface, have tensile stress in inside.Therefore, in the time that utilization method in the past forms scored groove to chilled glass irradiating laser, be full of cracks be mainly scored groove (be full of cracks) to start to form on the substrate end-face of side in the scanning of laser as starting point, situation about developing on whole thickness direction is more.As mentioned above, in the time forming on the entire depth of be full of cracks at substrate, substrate is along delineation line naturally separated (following, the situation that substrate is cut apart completely by delineation is designated as " entirely cutting ").In situation as above, intersect delineation operation, form scored groove along the delineation line vertical with delineation line before operation become very difficult.
Summary of the invention
The object of the invention is to, can form the scored groove of expecting than the chilled glass being easier to and stably effects on surface is reinforced.
Another object of the present invention is to, the chilled glass being reinforced at effects on surface can prevent from entirely cutting while forming scored groove, and easily glass substrate is divided into the shape of expectation.
The glass substrate rose method that chilled glass is delineated of the 1st invention, the surface of this chilled glass possesses the strengthening layer with stress under compression, and wherein, described rose method comprises: the 1st step and the 2nd step.In the 1st step, on the surface of chilled glass, remove strengthening layer and form initial be full of cracks.In the 2nd step, when initial be full of cracks irradiating laser is heated, heated region is carried out cooling, make be full of cracks along delineation preset lines development, in described the 1st step, more than 1.14 times of the strengthening layer thickness that the degree of depth of initial be full of cracks is chilled glass and below 1.67 times.
On the surface of chilled glass, form the initial be full of cracks that exceedes Depth of hardening layer herein.Afterwards, initial be full of cracks irradiating laser is heated, and carry out cooling to heated region.Thus, initial be full of cracks is along the development of delineation preset lines.
, form the initial be full of cracks that exceedes Depth of hardening layer herein, thus can be than being easier to, stably forming the scored groove of expecting.
And in the time of 1.14 times of the strengthening layer thickness of the not enough chilled glass of the degree of depth of initial be full of cracks, strengthening layer can residual, even if carry out the heat treated based on laser radiation and cooling process in subsequent step, be full of cracks also can not develop, and is difficult to formation scored groove.On the other hand, in the time that the degree of depth of initial be full of cracks exceedes 1.67 times of strengthening layer thickness, by the heating in subsequent step and cooling, be full of cracks meeting outside expecting to being different from the direction progress that is formed with delineation line direction, be difficult to form the scored groove of expecting.
Therefore, in the present invention, make the degree of depth of initial be full of cracks become more than 1.14 times and below 1.67 times of strengthening layer thickness of chilled glass.Therefore, can stably form the scored groove of expectation.
The glass substrate rose method of the 2nd invention is in the rose method of the 1st invention, in the 1st step, the degree of depth of initial be full of cracks be no more than chilled glass whole thickness 5.4%.
As mentioned above, though the degree of depth of initial be full of cracks is strengthening layer 1.14～1.67 times, in the case of the thin thickness of glass substrate entirety, when initial crack formation obtains chin-deep, be full of cracks also can not develop along delineation preset lines sometimes.
Therefore, in the present invention, make the degree of depth of initial be full of cracks be no more than chilled glass whole thickness 5.4%.Therefore, can stably form the scored groove of expectation.
The glass substrate rose method that chilled glass is delineated of the 3rd invention, the surface of this chilled glass possesses the strengthening layer with stress under compression, and wherein, described rose method comprises the 1st step and the 2nd step.In the 1st step, start the surface of the chilled glass at the predetermined distance place of the glass substrate end face inner side of side in the scanning of delineation preset lines, form initially be full of cracks.In the 2nd step, at the end regions that starts side except scanning, when heating from initial be full of cracks along delineation preset lines irradiating laser, carry out cooling to heated region, make be full of cracks along the development of delineation preset lines, in the 2nd step, from the glass substrate end face of the end of scan side of delineation preset lines till the end regions of the predetermined distance of inner side, stop the cooling of heating based on laser radiation and heating region.
, form initial be full of cracks on the surface of chilled glass herein, afterwards initial be full of cracks irradiating laser is heated, and cooling heated region.Thus, initial be full of cracks is along the development of delineation preset lines.Now, start the glass substrate end face of side to the surface of the chilled glass of the predetermined distance of inner side from the scanning of delineation preset lines, form initially be full of cracks, from the irradiation of this initial crack initiation laser., till the end regions of initial be full of cracks, do not carry out heating based on laser and the cooling process of heating region at the glass end face that starts side from the scanning of laser.And, except scanning starts the end regions of side, to the end regions of end of scan side also irradiating laser not.Therefore, can avoid more reliably the natural separation of substrate.
As previously discussed, owing to starting on the end regions of side not irradiating laser in the scanning of laser, therefore can avoid the natural separation of the substrate producing in the time chilled glass being delineated by previous methods.Therefore, easily for example intersect and delineate the procedure of processing after waiting.
The glass substrate rose method of the 4th invention is in the rose method of the 3rd invention, and on the surface of chilled glass, the scanning that the reflectance coating of reflection laser is formed at delineation preset lines starts the end regions of side.And the 2nd step is that processing is carried out on the surface of the chilled glass to being formed with reflectance coating.
In the time forming the region of irradiating laser not, can synchronize to form with the movement of optical system etc. by the on/off control that makes laser generation.But, as shown in the present, by form reflectance coating on the region of irradiating laser not, thereby can more easily implement the 2nd step.In addition, as reflectance coating, can consider to reflect metal pattern film, the ITO film etc. of laser.
The glass substrate rose method of the 5th invention is in the rose method of the 3rd invention, and the 2nd step is the end regions by start side and end of scan side in the scanning of delineation preset lines, and the reflectance coating that forms reflection laser is implemented.
With similarly above-mentioned, by form reflectance coating on the region of irradiating laser not, thereby can more easily implement the 2nd step herein.
The glass substrate rose method of the 6th invention is in the rose method of any one of the 3rd to the 5th invention, in the 1st step, more than 1.14 times of the strengthening layer thickness that the degree of depth of initial be full of cracks is chilled glass and below 1.67 times.
Herein, same with the 1st invention, can stably form the scored groove of expectation.
The glass substrate rose method of the 7th invention is in the rose method of the 6th invention, in the 1st step, the degree of depth of initial be full of cracks be no more than chilled glass whole thickness 5.4%.
Herein, same with the 2nd invention, can stably form the scored groove of expectation.
Invention effect
As previously discussed, in the present invention, chilled glass that can stably effects on surface is reinforced with comparalive ease forms the scored groove of expecting.
In addition, in the invention of another viewpoint, the chilled glass being reinforced at effects on surface can prevent from entirely cutting while forming scored groove, and easily glass substrate is divided into the shape of expectation.
Brief description of the drawings
Fig. 1 is the schematic configuration diagram of the device of the rose method for implementing the 1st embodiment of the present invention.
Fig. 2 is the schematic configuration diagram of the device of the rose method for implementing the 2nd embodiment of the present invention.
Fig. 3 is illustrated in while having implemented delineation by previous methods, the figure of the appearance of substrate natural separation.
Fig. 4 is the figure that is illustrated in the evaluation while having implemented the rose method based on an embodiment of the invention.
Fig. 5 represents to form relation between swage load and the initial be full of cracks of initial be full of cracks and the figure of delineation result for the chilled glass that is 0.55mm to thickness.
Fig. 6 is the amplification profile that is formed with a part for the chilled glass of initial be full of cracks.
Fig. 7 represents to form relation between swage load and the initial be full of cracks of initial be full of cracks and the figure of delineation result for the chilled glass that is 0.7mm to thickness.
Fig. 8 represents to form relation between swage load and the initial be full of cracks of initial be full of cracks and the figure of delineation result for the chilled glass that is 1.1mm to thickness.
Nomenclature
1: scoring device;
G: glass substrate;
LB: laser beam;
LS: light beam spot;
SL1～SL5: delineation preset lines;
CP: cooling point;
RC1～RC4: reflectance coating.
Embodiment
[apparatus structure]
Fig. 1 is the figure that represents the schematic construction of the scoring device of the method for implementing an embodiment of the invention.Scoring device 1 is for example for female glass substrate being divided into the device of the multiple glass substrates that use at FPD (flat-panel monitor).About glass substrate herein, the main chemically reinforced glass that uses surface to be formed with strengthening layer.As mentioned above, this chemically reinforced glass has the strengthening layer on surface by ion exchange treatment with stress under compression.
Scoring device 1 has: to irradiation portion 2, cooling end 3 and the not shown moving part of glass substrate G irradiating laser light beam.Cooling end 3 sprays by nozzle 4 refrigeration agent that never illustrated cryogen source is supplied with, and forms cooling point CP.Moving part makes the nozzle 4 of irradiation portion 2 and cooling end 3 along the delineation preset lines SL1～SL5 that is set in glass substrate G, and relatively moves between glass substrate G.
Irradiation portion 2 has: laser oscillator (for example, CO2 laser apparatus), its irradiating laser light beam LB, is radiated at the upper light beam spot LS that forms of glass substrate G by optical system by this laser beam LB.
In addition, although not shown herein, be provided with initial crack formation unit, it forms the initial be full of cracks as delineation starting point for the end at glass substrate G.As initial crack formation unit, although use the machine tools such as pressure head or break bar, also can process to form initial be full of cracks by laser ablation.
[rose method]
-1 embodiment-
First, as shown in Figure 1, use the initial crack formation unit such as break bar, form the initial be full of cracks TR as delineation starting point in the end of glass substrate G.Now, the degree of depth of initial be full of cracks is set as the degree of depth of having removed the strengthening layer degree with stress under compression that is formed on chilled glass surface.Specifically, the degree of depth of initial be full of cracks is set as the degree of depth more than 1.14 times and below 1.67 times of strengthening layer thickness.
Then, from irradiation portion 2 to glass substrate G irradiating laser light beam LB.This laser beam LB is irradiated on glass substrate G as light beam spot LS.And, the laser beam LB penetrating from irradiation portion 2 is relatively moved along delineation preset lines SL and glass substrate G.By light beam spot LS glass substrate, G is heated to the temperature lower than the softening temperature of glass substrate G.In addition, make cooling point CP follow the rear at the travel direction of light beam spot LS.
Thus, although in the irradiation by laser beam LB and near of heated light beam spot LS has produced stress under compression, but due to after just producing stress under compression, form cooling point CP by the injection of refrigeration agent, therefore produce the effective tensile stress of the formation of vertical slight crack.By this tensile stress, taking the initial be full of cracks TR that is formed on glass substrate G end as starting point, form along the vertical slight crack of delineation preset lines SL, form the scored groove of expecting.
-2 embodiments-
First, as shown in Figure 2, prepare to be formed with at 4 limit end regions the glass substrate G of the reflectance coating RC1～RC4 of reflection laser.Reflectance coating RC1 is formed at and is carrying out the scanning of laser radiation while forming the processing (following, to be designated as delineation and to process) of scored groove along delineation preset lines SL1, SL2 and start the end regions of side.Reflectance coating RC2 is formed at the end regions of the end of scan side of laser radiation in the time carrying out delineation processing along delineation preset lines SL1, SL2.In addition, the scanning that reflectance coating RC3 is formed at laser radiation in the time carrying out delineation along delineation preset lines SL3, SL4, SL5 and process starts the end regions of side, and reflectance coating RC4 is formed at the end regions of the end of scan side of laser radiation in the time carrying out delineation along delineation preset lines SL3, SL4, SL5 and process.In addition, be formed on the reflectance coating RC1, the width of RC3 that scanning starts the end regions of side and be preferably 3mm～5mm.In addition, be formed on the reflectance coating RC2 of the end regions of end of scan side, the width of RC4 is preferably 8mm～20mm.
Then, use the initial crack formation unit such as break bar, form the initial be full of cracks TR as delineation starting point in the end of glass substrate G.Now, the position of initial be full of cracks and reflectance coating in abutting connection with and be positioned at inside it.In addition, the degree of depth of initial be full of cracks is set as the degree of depth of having removed the surperficial strengthening layer degree with stress under compression that is formed on chilled glass.Specifically, the degree of depth of initial be full of cracks is set as the degree of depth more than 1.14 times and below 1.67 times of strengthening layer thickness.
Then, from irradiation portion 2 to glass substrate G irradiating laser light beam LB.This laser beam LB is irradiated on glass substrate G as light beam spot LS.And, the laser beam LB penetrating from irradiation portion 2 is relatively moved with glass substrate G along each delineation preset lines SL1～SL5.
Now, because the end regions that starts side and end of scan side in scanning is formed with reflectance coating RC1～RC4, therefore in these end regions, laser beam LB is reflected and can be irradiated to glass substrate G.Therefore, being formed with in the region of these reflectance coatings RC1～RC4, glass substrate G can not be heated.
Not forming in the region of reflectance coating RC1～RC4, glass substrate G is heated to the temperature lower than the softening temperature of glass substrate G by light beam spot LS.In addition, by cooling point CP is followed at the rear of the travel direction of light beam spot LS, thereby carry out cooling to heated region.
Thus, although in the irradiation by laser beam LB and heated light beam spot LS near generation stress under compression, but due to after just producing stress under compression, form cooling point CP by the injection of refrigeration agent, therefore produce the effective tensile stress of the formation of vertical slight crack.By this tensile stress, taking the initial be full of cracks TR of end that is formed on glass substrate G as starting point, form along the vertical slight crack of delineation preset lines SL, form the scored groove of expecting.And not having in the end regions of irradiating laser light beam LB, be full of cracks does not make progress, even or be full of cracks progress be only also very shallow region.
In rose method as above, be full of cracks can not develop at the entire depth of glass substrate G from initial crack initiation, can prevent that substrate is naturally and understandably separated.
[checking relevant with cutting apart of glass substrate]
The experimental example > of < conventional example
Existing method is shown in Fig. 3, has not formed reflectance coating and carried out LASER HEATING and the example when cooling from the starting end of delineation preset lines to finishing end.Substrate is that integral thickness is that the thickness of 0.7mm, strengthening layer is the chilled glass of 18 μ m.In addition, the condition of laser beam is that Laser output is that 200W, sweep velocity are 200mm/sec.In addition, in Fig. 3, the end regions of glass substrate is not shown.
Fig. 3 (a) is the state after just delineation.Herein, the state (following, this state is designated as to " hemisection ") that delineation line (scored groove) develops on the entire depth at substrate not, represents with fine rule in the drawings.
Fig. 3 (b) is the state after 5 seconds from delineation processing starts.Entirely cut (representing with thick line in the drawings) from the starting point side (right side figure) of delineation till delineate line near the central authorities of figure herein.
Fig. 3 (c) is the state after 20 seconds from delineation processing starts.Herein, all parts that represent in the drawings, delineation line is cut (representing with thick line in the drawings) entirely.
As mentioned above, at the starting end from delineation preset lines till finish that LASER HEATING has been carried out in all positions of end and when cooling, naturally and understandably divided (by entirely cutting) of substrate.
< embodiment and comparative example >
Fig. 4 shows to comprise and utilizes the rose method of the 2nd embodiment to carry out the result of the example of delineation processing.Herein, identical with the comparative example shown in Fig. 3 as the glass substrate of object.In addition, the condition of laser beam is also identical with the comparative example shown in Fig. 3.
In Fig. 4, " substrate beginning edge " means that delineation (scanning) starts the substrate end of side, and " substrate end edge " means that delineation (scanning) finishes the substrate end of side.In addition, " cover " and mean reflectance coating." n/5 " represents to carry out 5 delineations and processes, and n realization do not cut but the delineation processing of hemisection entirely.
In addition, in these examples, initial crack formation is in the position of inner side 10mm of substrate end-face that is positioned at delineation (scanning) beginning side.
And the condition of covering is as follows.
" substrate beginning edge ": in the time covering initial be full of cracks, because be full of cracks does not develop, therefore covered the scope that starts 5mm from the substrate end-face of delineation (scanning) beginning side, not cover initial be full of cracks.
" substrate end edge ": covered the scope that starts 10mm from the substrate end-face of delineation (scanning) end side.In addition, about finishing covering of side, in the time that width is 5mm degree, be full of cracks naturally and understandably develops into end face portion sometimes, starts from here to become entirely to cut.Therefore, the preferred shelter width that does not become delineation (scanning) the end side of entirely cutting is more than 8mm.
In the experiment of this Fig. 4, by being attached to substrate surface, aluminium strip is used as reflectance coating.
With condition as above, to the end from glass substrate till the sliver of end has irradiated laser beam.
The summary > of < experimental example and comparative example
From the checking of Fig. 4, in the time at least delineation not being started to the end regions irradiating laser light beam (laser beam is reflected) of side, can realize with 40% probability the delineation of hemisection.And, except delineation starts side, while also having covered delineation end side, can realize with 100% probability the delineation of hemisection.
On the other hand, while only having covered delineation end side not covering delineation beginning side, the probability that can realize the delineation of hemisection is reduced to 20%.In addition, less than covering on the end regions in the case of both sides, can not carry out the delineation of hemisection, entirely cut and become, this point also illustrates in Fig. 3.
[research relevant with initial be full of cracks]
Then, the experimental example relevant with the degree of depth of initial be full of cracks is being shown below.
< experimental example 1>
The thickness that it is 0.55mm, strengthening layer that Fig. 5 shows integral thickness is the experimental example 1 that the chilled glass of 18 μ m has formed scored groove.Specifically, the instrument (pressure head) of Fig. 5 in the time that initial crack formation is shown to glass press the relation between load and groove depth now in, illustrate based on after LASER HEATING and the delineation result of cooling process.
Laser output for heat treated is now that 200W, process velocity are 230mm/sec.In addition, cooling conditions is that the position that is 4mm at the height of light beam rear end configuration cooling jet, is ejected into by water coolant and air the part being heated by light beam spot.
From this experimental example 1, if the groove depth of initial be full of cracks is 19～30 μ m (strengthening layer thickness 1.05～1.67 times), form along delineation preset lines the scored groove of expecting.And known, in the time that groove depth is less than 19 μ m, be full of cracks can not develop (unstable) reliably, and in the time exceeding 30 μ m, breakage can occur and formation be full of cracks beyond delineation preset lines.
In addition, Fig. 6 shows the example of the groove depth of initial be full of cracks.As shown in Figure 6, by till guarantee that the degree of depth of the darkest part of regulation area is made as " groove depth ", ignore to fall a part and arrive radically the be full of cracks in deep.
[experimental example 2]
The thickness that it is 0.7mm and strengthening layer that Fig. 7 shows integral thickness is the experimental example 2 that the chilled glass of 21 μ m has formed scored groove.The transverse axis of figure is identical with the relation of the longitudinal axis and Fig. 5.In addition, be that 200W, process velocity are 170mm/sec for carrying out the Laser output of heat treated now.In addition, cooling conditions is identical with experimental example 1.
From this experimental example 2, if the groove depth of initial be full of cracks is approximately 24～50 μ m (strengthening layer thickness 1.14～2.38 times), form along delineation preset lines the scored groove of expecting.And known, in the time that groove depth is less than 24 μ m, be full of cracks can not develop (unstable) reliably, and in the time exceeding 50 μ m, breakage can occur and formation be full of cracks beyond delineation preset lines.In addition, if swage load is about 6～24N, even if groove depth exceedes 50 μ m, also can form the scored groove of expectation, but in the time only paying close attention to groove depth, the groove depth of appropriate initial be full of cracks is approximately 24～50 μ m.
[experimental example 3]
The thickness that it is 1.1mm and strengthening layer that Fig. 8 shows integral thickness is the experimental example 3 that the chilled glass of 34 μ m has formed scored groove.The transverse axis of figure is identical with the relation of the longitudinal axis and Fig. 5.In addition, be that 200W, process velocity are 170mm/sec for carrying out the Laser output of heat treated now.In addition, cooling conditions is identical with experimental example 1.
From this experimental example 3, if the groove depth of initial be full of cracks is approximately 24～60 μ m (strengthening layer thickness 0.71～1.76 times), form along delineation preset lines the scored groove of expecting.And, crosses shallow time be full of cracks in groove depth and do not develop, and when exceed 60 μ m, be full of cracks develops unstable.In addition, identical with experimental example 2, if swage load is about 6N～24N, even if groove depth exceedes 60 μ m, also can form the scored groove of expectation, but while only paying close attention to groove depth, the groove depth of appropriate initial be full of cracks is approximately 24～60 μ m.
[summary]
From above, for the scored groove along delineating preset lines formation expectation, the degree of depth of initial be full of cracks is preferably more than 1.14 times and below 1.67 times of strengthening layer thickness of chilled glass.In addition, preferably the degree of depth of initial be full of cracks is below 30 μ m (5.5%), is below 50 μ m (7.1%) in the time that glass thickness of slab is 0.7mm, in the time that glass thickness of slab is 1.1mm, is below 60 μ m (5.4%) in the time that glass thickness of slab is 0.55mm.This represents that the degree of depth of initial be full of cracks is preferably below 5.4% of thickness of slab of glass.
[feature]
(1) in the 2nd embodiment, owing to the scanning of delineation line not being started the end regions irradiating laser of side and end of scan side, therefore can realize the hemisection of substrate, can avoid the natural separation of substrate.Therefore, easily intersect the follow-up procedure of processings such as delineation.
(2) in the 2nd embodiment, as make laser beam irradiation less than means, form reflectance coating in the region, both ends of substrate, therefore can easily form the non-irradiation area of laser beam.
(3), in the time of the initial be full of cracks of formation, owing to making more than 1.14 times and below 1.67 times of strengthening layer thickness that the degree of depth of initial be full of cracks is chilled glass, therefore can stably form the scored groove of expectation.
(4) owing to making the degree of depth of initial be full of cracks become below 5.4% of whole thickness of chilled glass, therefore can suppress be full of cracks to less desirable future development.
[other embodiment]
The present invention is not limited to embodiment as above, in not departing from the scope of the present invention, can carry out various distortion or correction.
In above-mentioned the 2nd embodiment, although be the non-irradiation area that forms reflectance coating and form laser beam on substrate, can be also the non-irradiation area that breaks laser generation and form laser beam at each end regions.
Claims (7)
1. a glass substrate rose method of chilled glass being delineated, the surface of this chilled glass possesses the strengthening layer with stress under compression, and wherein, described rose method comprises:
The 1st step, on the surface of described chilled glass, removes strengthening layer and form initial be full of cracks; And
The 2nd step, when described initial be full of cracks irradiating laser is heated, carries out coolingly to heated region, make be full of cracks along delineation preset lines development,
In described the 1st step, more than 1.14 times of the strengthening layer thickness that the degree of depth of initial be full of cracks is chilled glass and below 1.67 times.
2. glass substrate rose method according to claim 1, wherein,
In described the 1st step, the degree of depth of initial be full of cracks be no more than chilled glass whole thickness 5.4%.
3. a glass substrate rose method of chilled glass being delineated, the surface of this chilled glass possesses the strengthening layer with stress under compression, and wherein, described rose method comprises:
The 1st step, starts the surface of the chilled glass at the predetermined distance place of the glass substrate end face inner side of side in the scanning of delineation preset lines, form initially be full of cracks; And
The 2nd step, except described scanning starts the end regions of side, when heating, carries out coolingly from described initial be full of cracks along delineation preset lines irradiating laser to heated region, make be full of cracks along the development of delineation preset lines,
In described the 2nd step, till the end regions of the predetermined distance of inner side, stop the cooling of heating based on laser radiation and heating region at the glass substrate end face of the end of scan side from delineation preset lines.
4. glass substrate rose method according to claim 3, wherein,
On the surface of described chilled glass, the scanning that the reflectance coating of reflection laser is formed at delineation preset lines starts the end regions of side,
The surface that described the 2nd step is the chilled glass to being formed with described reflectance coating is carried out and is processed.
5. glass substrate rose method according to claim 3, wherein,
On the surface of described chilled glass, the end regions that starts side and end of scan side in the scanning of delineation preset lines is formed with respectively the reflectance coating that reflects laser,
The surface that described the 2nd step is the chilled glass to being formed with described reflectance coating is carried out and is processed.
6. according to the glass substrate rose method described in claim 3 or 4, wherein,
More than 1.14 times of the strengthening layer thickness that the degree of depth of the initial be full of cracks in described the 1st step is chilled glass and below 1.67 times.
7. glass substrate rose method according to claim 6, wherein,
In described the 1st step, the degree of depth of initial be full of cracks be no more than chilled glass whole thickness 5.4%.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011032307A JP5292420B2 (en) | 2011-02-17 | 2011-02-17 | Glass substrate scribing method |
| JP2011-032307 | 2011-02-17 | ||
| JP2011032306A JP5205484B2 (en) | 2011-02-17 | 2011-02-17 | Glass substrate scribing method |
| JP2011-032306 | 2011-02-17 |
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| CN102643019B true CN102643019B (en) | 2014-10-01 |
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| KR102709031B1 (en) | 2016-06-10 | 2024-09-24 | 삼성디스플레이 주식회사 | Display device and mufacturing method thereof |
| KR102625796B1 (en) * | 2018-03-22 | 2024-01-16 | 코닝 인코포레이티드 | A method of inspecting a glass sheet, a method of manufacturing a glass sheet and a glass manufacturing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200802570A (en) * | 2006-02-15 | 2008-01-01 | Toray Eng Co Ltd | Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus |
| CN102741179A (en) * | 2009-11-30 | 2012-10-17 | 康宁股份有限公司 | Methods for laser scribing and separating glass substrates |
| CN103097313A (en) * | 2010-08-31 | 2013-05-08 | 康宁股份有限公司 | Methods of separating strengthened glass substrates |
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| KR20040021295A (en) * | 2002-09-03 | 2004-03-10 | 삼성에스디아이 주식회사 | G1ass cutting method utilizing a laser beam |
| JP2007076937A (en) * | 2005-09-13 | 2007-03-29 | Lemi Ltd | Method and apparatus for cutting scribed glass |
| US20100119846A1 (en) * | 2007-03-02 | 2010-05-13 | Masahiro Sawada | Reinforced plate glass and method for manufacturing the same |
| JP2009107304A (en) * | 2007-10-31 | 2009-05-21 | Lemi Ltd | Thermal stress cutting method for brittle material |
| JP5303238B2 (en) | 2008-10-10 | 2013-10-02 | 三星ダイヤモンド工業株式会社 | Cleaving method of brittle material substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200802570A (en) * | 2006-02-15 | 2008-01-01 | Toray Eng Co Ltd | Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus |
| CN102741179A (en) * | 2009-11-30 | 2012-10-17 | 康宁股份有限公司 | Methods for laser scribing and separating glass substrates |
| CN103097313A (en) * | 2010-08-31 | 2013-05-08 | 康宁股份有限公司 | Methods of separating strengthened glass substrates |
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| Title |
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| JP特开2007-76937A 2007.03.29 |
| JP特开2009-107304A 2009.05.21 |
| JP特开2010-89144A 2010.04.22 |
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| KR20120094841A (en) | 2012-08-27 |
| KR20140068834A (en) | 2014-06-09 |
| KR101405824B1 (en) | 2014-06-13 |
| CN102643019A (en) | 2012-08-22 |
| TWI469938B (en) | 2015-01-21 |
| TW201236987A (en) | 2012-09-16 |
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