TW200802570A - Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus - Google Patents

Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus

Info

Publication number
TW200802570A
TW200802570A TW096105605A TW96105605A TW200802570A TW 200802570 A TW200802570 A TW 200802570A TW 096105605 A TW096105605 A TW 096105605A TW 96105605 A TW96105605 A TW 96105605A TW 200802570 A TW200802570 A TW 200802570A
Authority
TW
Taiwan
Prior art keywords
laser scribing
substrate
scribing
cut
line
Prior art date
Application number
TW096105605A
Other languages
Chinese (zh)
Inventor
Yukihiro Uehara
Masanori Matsunaga
Tomoo Uchikata
Chisa Inaka
Hiroyuki Murata
Akihiro Kanazawa
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200802570A publication Critical patent/TW200802570A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Abstract

Provided are a laser scribing method and a laser scribing apparatus, by which the cross section of the cut end edge portion of a substrate after cutting is permitted to have high qualities with excellent squareness and linearity without requiring complicated control. In the laser scribing method and apparatus, a laser beam (L) is relatively shifted to a substrate (K) to be cut along a cut planned line (J) of the substrate (K), and a scribing line (S) from a start edge (JS) to an end edge (JE) of the cut planned line (J) is formed, prior to a breaking step of breaking the substrate (K). The method and the apparatus are characterized in that a non scribing line area (NR) wherein the scribing line (S) is not formed is formed in an area (AR) close to the end edge (JE) of the cut planned line (J).
TW096105605A 2006-02-15 2007-02-15 Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus TW200802570A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006037598 2006-02-15

Publications (1)

Publication Number Publication Date
TW200802570A true TW200802570A (en) 2008-01-01

Family

ID=38371526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105605A TW200802570A (en) 2006-02-15 2007-02-15 Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus

Country Status (3)

Country Link
JP (1) JPWO2007094348A1 (en)
TW (1) TW200802570A (en)
WO (1) WO2007094348A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102643019A (en) * 2011-02-17 2012-08-22 三星钻石工业股份有限公司 Scribing method for glass substrate

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101404250B1 (en) * 2008-12-16 2014-06-09 가부시키가이샤 레미 Splitting apparatus and cleavage method for brittle material
US8245540B2 (en) * 2009-02-24 2012-08-21 Corning Incorporated Method for scoring a sheet of brittle material
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
TWI580652B (en) 2009-11-30 2017-05-01 康寧公司 Methods of forming intersecting scribe vents in strengthened glass substrate comprising compressive surface layer and inner tension layer
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI494284B (en) 2010-03-19 2015-08-01 Corning Inc Mechanical scoring and separation of strengthened glass
US8910845B2 (en) * 2010-06-07 2014-12-16 Nippon Electric Glass Co., Ltd. Method for cutting glass sheet
US8864005B2 (en) 2010-07-16 2014-10-21 Corning Incorporated Methods for scribing and separating strengthened glass substrates
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
JP5205484B2 (en) * 2011-02-17 2013-06-05 三星ダイヤモンド工業株式会社 Glass substrate scribing method
KR101396989B1 (en) * 2011-08-24 2014-05-21 미쓰보시 다이야몬도 고교 가부시키가이샤 Scribe method for glass substrate
US10351460B2 (en) * 2012-05-22 2019-07-16 Corning Incorporated Methods of separating strengthened glass sheets by mechanical scribing
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312656A (en) * 1998-04-28 1999-11-09 Hitachi Cable Ltd Method and device for cutting substrate
JP3792639B2 (en) * 2002-11-08 2006-07-05 株式会社日本エミック Cutting device
JP2006137169A (en) * 2004-11-12 2006-06-01 Lemi Ltd Method and apparatus for breaking and cutting fragile material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102643019A (en) * 2011-02-17 2012-08-22 三星钻石工业股份有限公司 Scribing method for glass substrate
CN102643019B (en) * 2011-02-17 2014-10-01 三星钻石工业股份有限公司 Scribing method for glass substrate

Also Published As

Publication number Publication date
WO2007094348A1 (en) 2007-08-23
JPWO2007094348A1 (en) 2009-07-09

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