CN105461203A - Cutting method and cutting device - Google Patents
Cutting method and cutting device Download PDFInfo
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- CN105461203A CN105461203A CN201510641339.4A CN201510641339A CN105461203A CN 105461203 A CN105461203 A CN 105461203A CN 201510641339 A CN201510641339 A CN 201510641339A CN 105461203 A CN105461203 A CN 105461203A
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Abstract
The invention provides a cutting method and a cutting device which can restrain heat effects on a substrate caused by laser radiation, and can cut a glass substrate in a regular end face. In the cutting method and the cutting device, the glass substrate is cut along a cutting preset line. The cutting method comprises: a mechanical marking step, making a knife flywheel (16) move relatively while pressing and abutting the knife flywheel (16) on the surface of the glass substrate (1), to form cracks (S) in limited depth; and a laser cutting step, according to heat stress distribution generated by scanning laser beams along the cracks (S), making the cracks (S) obtained in the mechanical marking step permeate further, to completely cut the glass substrate (1). In the mechanical marking step, the cracks in 30-80% plate thickness are formed on the surface of the glass substrate (1). In the laser cutting step, laser in oscillation wavelength of 5 [mu]m is used.
Description
Technical field
The present invention relates to a kind of will comprise non-alkali glass etc. glass substrate segmentation dividing method and cutting device.Especially, the present invention relates to dividing method and cutting device that the thin glass substrate of a kind of thickness that will be suitable for the flat-panel monitor such as liquid-crystal display or plasma display (FPD) splits.
Background technology
All the time, there will be a known following technology: use laser scribing method, to disjunction chap (slight crack) (such as the reference patent documentation 1) of glass substrate processing along segmentation preset lines, or by complete for glass substrate thin for thickness of slab disjunction (complete cutting processing) (such as with reference to patent documentation 2), described laser scribing method is one side illuminating laser beam, while scan, substrate produces thermal stress distribution and delineates.
In laser scribing method so far, mainly use the CO that the uptake factor of glass substrate is large
2laser etc. to carrying out scanning heating near substrate surface, and are followed described operation and spray refrigerant from the nozzle of cooling body to heating region.Thus, the stress under compression produced according to the heating because preferentially carrying out and the stress distribution of tensile stress produced because of ensuing chilling, make the surface of glass substrate produce disjunction be full of cracks, or make be full of cracks permeate the whole thickness of substrate and carry out complete cutting processing.
Carrying out in laser grooving and scribing processing to relatively thick substrate (such as thickness of slab is more than 1mm), because carrying out the impact of heat conducting relaxation time along depth direction and causing the temperature head of above-below direction, substrate surface side becomes tensile stress and the stress distribution that substrate inside (deep) side becomes stress under compression becomes major effect thus, according to the stress distribution of this above-below direction, and processing be full of cracks (slight crack).On the other hand, when for thin substrate (such as thickness of slab is about 0.2 ~ 0.4mm), produce the temperature head of depth direction hardly, so also produce the impact of the stress distribution of above-below direction hardly, but replace, stress distribution along the fore-and-aft direction of scanning pattern can impact, and when forming strong stress distribution when the stress distribution because of this fore-and-aft direction, can carry out complete cutting processing.
[background technology document]
[patent documentation]
[patent documentation 1] International Publication WO03/008352 publication
[patent documentation 2] Japanese Patent Laid-Open 2001-170786 publication
Summary of the invention
[inventing the problem that will solve]
Describedly utilize CO
2the complete cutting processing (laser separation processing) in the past of laser etc. has the following advantages: even if thin glass substrate, also can while keep end face strength, disjunction on one side, and preferably following aspect: can not carry out mechanical dissection process and at once by substrate-cutting (segmentation) in subsequent step, so can simplify step.
But, in described complete cutting processing, owing to only utilizing the stress distribution of the fore-and-aft direction of the scanning pattern along laser beam by substrate-cutting, so large stress-difference must be produced at fore-and-aft direction, and need the heat input of the per unit area of enough sizes.For this reason, the output rating of the laser of irradiation must be made to become large, or make sweep velocity slack-off, but no matter which kind of situation, just utilize the CO that the uptake factor on substrate surface is large
2the laser radiation of laser etc. is large and surface can produce trickle damage to the infringement caused near substrate surface.
For described situation, in patent documentation 2 (0055 hurdle), also recite the CO that replacement wavelength is 10.6 μm
2laser, and use CO laser, YAG (YttriumAluminumGarnet, Yttrium-Aluminium-Garnet) laser, excimer laser to carry out laser grooving and scribing.But, without illustrating during use CO laser in the document.
In general, as long as think and use the laser little to the uptake factor of glass substrate, then principle can suppress the absorption near substrate surface, therefore, it is possible to realize the processing suppressing surface distress, but when the laser utilizing uptake factor little is delineated, produce following other problems.
That is, when the laser using the uptake factor of 1 mu m wavebands such as Nd ︰ YAG laser little, the energy of more than 90% do not absorbed by glass substrate and through, so substrate segmentation is needed large output (heat input), produce the worry on the contrary substrate being caused to cause thermal damage, and need to consider to make in substrate back side through heat dissipation etc., and generation device becomes the problem such as complicated.
Therefore, CO is being scanned to glass substrate
2or Nd ︰ YAG laser carrying out heat complete cutting processing, in namely laser separation processing, have the cause thermal damage caused substrate surface or inside to become the worry of problem.
On the other hand, as the complete cutting processing not producing heat affecting completely, also have and passing through while break bar (also referred to as tracing wheel) is pressed against glass substrate, while make break bar roll, and after forming the line be full of cracks, the mechanical means of disjunction is carried out along line pressing, but when making be full of cracks carry out disjunction along whole thickness direction infiltration, having the end face through disjunction to contact with each other and damaging or chap not is that through-thickness is expanded as the crow flies and departs from, and the problem that yield is deteriorated.
Therefore, the object of the present invention is to provide a kind of glass substrate for becoming disjunction object, suppress because of the heat affecting caused by heating during laser beam irradiation, and the dividing method with point section that end face strength is high and neat, glass substrate can split and cutting device.
[technique means of dealing with problems]
In order to reach described object, propose following technique means in the present invention.That is, the feature of dividing method of the present invention is: split along segmentation preset lines by glass substrate, and comprise: mechanical scratching step, by while break bar to be pressed against the surface of described glass substrate, while make break bar relative movement, and form the be full of cracks of finite depth along described segmentation preset lines; And laser separation step, according to by the thermal stress distribution that produces along described be full of cracks scanning laser beam, make processing in described mechanical scratching step and the be full of cracks that obtains is permeated further and cut completely by described glass substrate; And in described mechanical scratching step, form the be full of cracks of 30 ~ 80% of thickness of slab on the surface of described glass substrate, in described laser separation step, use oscillation wavelength is that the laser of 5 mu m wavebands is split.
Herein, the laser of so-called 5 mu m wavebands is such as equivalent to CO laser specifically.
In addition, the feature of break-up device of the present invention is: split along segmentation preset lines by glass substrate, and comprise: break bar, for carrying out mechanical scratching step, described mechanical scratching step is the be full of cracks forming finite depth on the surface of described glass substrate along segmentation preset lines; Machining control portion, the degree of depth of the be full of cracks formed to utilize described break bar becomes the mode of 30 ~ 80% of the thickness of slab of described glass substrate, controls the pressing loading of described break bar; And laser irradiating part, for carrying out laser separation step, described laser separation step is according to by the thermal stress distribution that produces along described be full of cracks scanning laser beam, makes processing in described mechanical scratching step and the be full of cracks that obtains is permeated further, and is cut completely by described glass substrate; And the oscillation wavelength of the laser irradiated from described laser irradiating part is the laser of 5 mu m wavebands.
In described invention, the break bar used in described mechanical scratching step can use diameter to be 1 ~ 3mm and form the trough of belt break bar of groove along the crestal line becoming point of a knife.
In addition, described glass substrate applied thickness is the glass substrate of 0.1 ~ 0.4mm.
[effect of invention]
According to the present invention, in the mechanical scratching step of preferentially carrying out, can use break bar easily the working depth thickness that is glass substrate 30 ~ 80% be full of cracks.In addition, about break bar, the break bar of the point of a knife trough of belt not easily slided preferably is used to delineate.In addition, by using trough of belt break bar, even if be low loading, the depth of penetration of be full of cracks also can be made to become described scope.And this be full of cracks by the laser separation step of follow-up use 5 mu m waveband laser (CO laser), and along the infiltration of substrate thickness direction, can carry out division processing thus.Now, the lingering section that divided part namely chaps is thin, even if so the stress distribution suppressing the heat input of laser radiation to make substrate produce diminishes, also can become complete cut state fully.The laser radiation of heat input is inhibit to process therefore, it is possible to utilize.
This laser separation utilizing the laser of 5 mu m wavebands to carry out and all the time used CO
2laser is compared, and because the loss when heat caused by the dissipation of heat from surface moves diminishes, and can realize utilization and compares CO
2the heat input that laser is little carries out laser separation (cutting completely), so can heat required part efficiently with few heat input, and can suppress the cause thermal damage on the surface of glass substrate.In addition, when using the laser of 1 mu m wavebands such as Nd ︰ YAG laser, the energy of more than 90% do not absorbed by glass substrate and through, so produce large heat energy loss, but if the CO laser of 5 mu m wavebands, then major part is absorbed in glass substrate, the energy only having 20 ~ 30% not by absorbing through, so can thermo-efficiency be promoted and without the need to consider to make through heat dissipation etc.
Thus, by the mechanical scratching step of preferentially carrying out and the combination of laser grooving and scribing step of laser utilizing 5 mu m wavebands, the heat because of laser beam can be avoided to cause damage to glass substrate, and can suppress to produce damage etc. at point section of glass substrate, can split with point section that end face strength is high and neat.
And then, with regard to CO in the past
2laser, in order to ensure heat input, the cross-sectional shape of the light beam spot of laser beam is set to elliptical beam, its major axis is scanned towards light beam direct of travel, but in the present invention, due to the heat input needed for segmentation can be suppressed, so the cross-sectional shape of light beam spot can be set to little circle.Its result, even if when carrying out along bending line the special-shaped disjunction scanned, also having and precision can carry out the effect of disjunction well.
Accompanying drawing explanation
Fig. 1 is the diagrammatic elevational view of an embodiment of the cutting device represented for implementing dividing method of the present invention.
Fig. 2 is the figure representing the break bar used in the present invention.
Fig. 3 is the stereographic map of the laser separation step that dividing method of the present invention is described.
Fig. 4 is the stereographic map of the cutting state of the glass substrate illustrated in the present invention.
Fig. 5 is the block diagram representing the controller controlling cutting device of the present invention.
Embodiment
Below, based on the embodiment shown in Fig. 1 ~ Fig. 5, details of the present invention is described.In the present embodiment, as the glass substrate 1 becoming disjunction object, use thickness is the non-alkali glass plate of the thin plate of 0.1 ~ 0.4mm.
Fig. 1 represents the figure for cutting device A of the present invention, possesses the platform 4 of mounting glass substrate 1.Platform 4 possesses retainer member glass substrate 1 being remained on the fixed position on platform 4.In the present embodiment, as this retainer member, via the multiple little air adsorption hole (not shown) forming opening on the surface of platform 4, absorption keeps substrate 1.In addition, platform 4 can be mobile on the track 5 of level in the Y direction (fore-and-aft direction of Fig. 1), and driven by the screw rod 6 rotated by electric motor (not shown).And then platform 4 can the turn in horizontal plane by the rotary driving part 7 of built-in motor.
The pillar stiffener 8,8 that bridge formation portion 10 possesses the both sides arranged across platform 4 and the crossbeam (cross bar) 9 flatly extended in X direction, and described bridge formation portion 10 is to arrange across the mode on platform 4.
Crossbeam 9 arranges the guide rail 11 flatly extended in X direction, break bar engraving head 12 and laser irradiating part engraving head 13 are arranged on this guide rail 11 as follows: can be moved in the X direction along guide rail 11 by the travel mechanism (not shown) using electric motor 14 as drive source.At break bar with on engraving head 12, through the retainer 15 of hoisting appliance 18 lifting, break bar 16 is installed, laser irradiating part engraving head 13 arranges the laser irradiating part 17 irradiated in the mode that laser beam is gathered in substrate surface.
In addition, in the present embodiment, represent example laser irradiating part 17 and break bar 16 being arranged on other engraving head 12,13, but also can be arranged on identical engraving head.
About break bar 16, when being used in the surface that is pressed against glass substrate 1 and rolling, can substrate processing thickness 30 ~ 80% the break bar of be full of cracks S of Thief zone.In the present embodiment, as shown in Figure 2, groove (otch) 16a that uses circumferentially crestal line to be formed and residual crestal line become the trough of belt break bar formed by cemented carbide disc 16c of nose part 16b.
In addition, in the processing trough of belt break bar 16 of this Thief zone, the Penett (Penett that Samsung DIAMOND limited-liability company manufactures is had; Registered trademark) break bar and APIO (APIO; Registered trademark) break bar.The former can form darker be full of cracks S, and the latter can form the be full of cracks S more shallow than the former, so suitably can select according to processing object substrate.
The laser irradiated from laser irradiating part 17 of the present invention uses oscillation wavelength to be the CO laser of 5 mu m wavebands.The output rating of laser and sweep velocity, according to becoming the thickness of glass substrate 1 of processing object or material, the degree of depth of be full of cracks S of processing and different, can be selected can damage condition little as far as possible in the output rating of disjunction and the condition and range of sweep velocity.That is, it is desirable to select can output rating be made as far as possible to diminish in the scope of disjunction and sweep velocity can not become slow condition.
And then as shown in the block diagram of Fig. 5, cutting device A of the present invention possesses controller 20, input operation part 21 and display part 22.Controller 20 possesses machining control portion 23 as the functional integrant realized by computer hardwares such as CPU, RAM, ROM.Machining control portion 23 carries out the control as the inferior processing treatment action entirety to glass substrate 1: utilize the absorption of absorption retainer member to keep glass substrate 1, utilize screw rod 6 or rotary driving part 7 that platform 4 is moved, utilize electric motor 14 that engraving head 12,13 is moved, utilize hoisting appliance 18 make break bar 16 carry out lifting action or glass substrate 1 carried out to the output rating etc. of push action and the laser from laser irradiating part 17.Input operation part 21 be operator for inputting the interface of various operation instruction or data to cutting device A, display part 22 is for display process menu or running-active status.
Next, to using the dividing method of the present invention of described device to be described.
First, as shown in Figures 1 and 3, glass substrate 1 is positioned in platform 4, break bar 16 is pressed against its surface, while make break bar 16 roll, thus, form the be full of cracks S (mechanical scratching step) of finite depth along segmentation preset lines.
In this mechanical scratching step, by using trough of belt break bar 16, can with low pressing loading easily the working depth thickness that is glass substrate 1 about 30 ~ 80% be full of cracks S.In addition, because trough of belt break bar not easily slides (easily blocking) on substrate, so make break bar collide glass end and be formed into the otch of triggering, thus do not carry out delineating (circumscribed) from edge of substrate, and from than edge of substrate slightly more in the inner part (inscribe) delineation.And in the present embodiment, making the degree of depth L of be full of cracks S be formed as relative to the thickness 0.2mm of glass substrate 1 is about about 70%.The degree of depth of this be full of cracks S can be undertaken by utilizing the machining control portion 23 of controller 20 to control the pressing loading of break bar 16.
Then, irradiate CO laser beam along be full of cracks S from laser irradiating part 17 scan and heat.According to the thermal stress distribution now produced, to make in the mechanical scratching step of preferentially carrying out processing and the be full of cracks S that obtain permeates along thickness direction further, and glass substrate 1 is cut (laser separation step) completely.
In addition, in the diagram, P1 represents the heating region utilizing laser beam.
In laser separation step, use oscillation wavelength is the CO laser of 5 mu m wavebands, and is not only absorbed at the near surface of glass substrate, and a part is absorbed in substrate inside, so can by substrate inside direct heating.In addition, the thickness due to substrate is thin is 0.2mm, so utilize laser radiation to be heated from the front of heating region P1 throughout back side moment, and produces the temperature head on depth direction hardly.Thus, at heating region P1, produce same stress under compression at depth direction.
On the other hand, the surrounding of heating region P1 is not heated, with heating region P1 around formation stress distribution.That is, heating region P1 produce stress under compression and around heating region P1 generation tensile stress, thus, as shown by the arrows in Figure 4, play a role with the power of the mode effect that glass substrate 1 is torn, and positively glass substrate 1 can be cut (segmentation) completely.
Especially, the laser of the CO laser used in the present invention to be oscillation wavelength described above be 5 mu m wavebands, and not only absorbed at the near surface of glass substrate, a part is absorbed in substrate inside, so can by inner for substrate direct heating, and can be efficient and will divide that section is neighbouring to be heated instantaneously.Therefore, if with the CO be all the time widely used
2laser is compared, then the loss when heat caused because of the dissipation of heat from surface moves diminishes, and can realize utilization and compare CO
2the heat input that laser is little carries out laser separation (cutting completely), so can heat required part efficiently with few heat input, and can suppress the cause thermal damage on glass substrate 1 surface.
If supplemented further, then by the CO laser of use 5 mu m waveband, the energy through glass substrate 1 can be suppressed fully.That is, when using the laser of 1 mu m wavebands such as Nd ︰ YAG laser, the energy of more than 90% do not absorbed by glass substrate and through, produce large heat energy loss, if the CO laser of 5 mu m wavebands, then major part is absorbed in glass substrate, the energy only having 20 ~ 30% not by absorbing through, so can thermo-efficiency be promoted.In addition, by the combination with mechanical scratching step, cut completely without using laser, so can the output rating of laser be suppressed little, and can suppress to produce damage at substrate surface, and can split with point section that end face strength is high and neat.
(embodiment)
The people such as inventor be utilize break bar 16 the glass substrate that thickness is 0.2mm to process the degree of depth be thickness of slab 70% be full of cracks after, use CO
2laser and CO laser carry out the comparative experiments of described laser separation step.
Its result, when for CO laser, can cut (segmentation) when the temperature of the irradiation position of the laser of substrate surface i.e. laser spots is 337 DEG C completely.In addition, when using CO with identical condition
2during laser, the temperature of the laser spots of substrate surface is 444 DEG C.According to described content, known CO laser can be split with the surface temperature of low about 100 DEG C.
As described above, in the present invention, the be full of cracks S of 30 ~ 80% of the thickness of break bar 16 processed glass substrate is used in the mechanical scratching step of preferentially carrying out, then, by the laser separation step of follow-up use CO laser, and make be full of cracks S along the infiltration of substrate thickness direction, thus cut completely (segmentation).Thus, namely the chap lingering section of S of the thickness of the part utilizing laser separation to process is thin, so according to the thermal stress distribution produced so that the energy of damage can not be caused to carry out heating by CO laser, positively glass substrate 1 can be cut (segmentation) completely.
And then in laser separation step of the present invention, energy when irradiating CO laser also can bring enough heats to the inside of substrate when utilizing circular light beam spot to scan.
By light beam spot is set to circle, and easily with curve shape non-linear shape process.That is, at use CO
2in the laser grooving and scribing in the past of laser, damage to not cause substrate surface and guarantee heat input, and the shape of the light beam spot of the laser exposed on glass substrate is set to ellipse, process in the mode that the direction of the major axis of the scanning direction with oval beam spot that make this oval beam spot is consistent.Now, shape due to light beam spot is oval, so be difficult to the nemaline processing of march, but be not the light beam spot of elliptical shape in laser separation of the present invention, can the conglobate light beam spot of shape, so without the need to making scanning direction consistent with the direction of light beam spot, the also easily nemaline processing of march.
Above, representational embodiment of the present invention is illustrated, but the present invention may not specifically for described embodiment, can reaching object of the present invention and suitably carry out revising, changing in the scope not departing from claims.
[industrial utilizability]
It is the thin glass substrates such as 0.1 ~ 0.4mm that the present invention is mainly used in split thickness.
[explanation of symbol]
A cutting device
S chaps
1 glass substrate
4 platforms
16 break bars
16a groove
16b nose part
16c disc
17 laser irradiating parts
20 controllers
23 machining control portions
Claims (5)
1. a dividing method, is characterized in that: split along segmentation preset lines by glass substrate, and comprise:
Mechanical scratching step, by break bar being pressed against the surface of described glass substrate, while make break bar relative movement, and forms the be full of cracks of finite depth along described segmentation preset lines; And
Laser separation step, according to by the thermal stress distribution that produces along described be full of cracks scanning laser beam, makes processing in described mechanical scratching step and the be full of cracks that obtains is permeated further, thus is cut completely by described glass substrate; And
In described mechanical scratching step, form the be full of cracks of 30 ~ 80% of thickness of slab on the surface of described glass substrate,
In described laser separation step, use oscillation wavelength is that the laser of 5 mu m wavebands is split.
2. dividing method according to claim 1, wherein said break bar is that diameter is 1 ~ 3mm and forms the trough of belt break bar of groove along the crestal line becoming point of a knife.
3. dividing method according to claim 1 and 2, the thickness of wherein said glass substrate is 0.1 ~ 0.4mm.
4. a cutting device, is characterized in that: split along segmentation preset lines by glass substrate, and comprise:
Break bar, for carrying out mechanical scratching step, described mechanical scratching step is the be full of cracks forming finite depth on the surface of described glass substrate along segmentation preset lines;
Machining control portion, the degree of depth of the be full of cracks formed to utilize described break bar becomes the mode of 30 ~ 80% of the thickness of slab of described glass substrate, controls the pressing loading of described break bar; And
Laser irradiating part, for carrying out laser separation step, described laser separation step is according to by the thermal stress distribution that produces along described be full of cracks scanning laser beam, makes processing in described mechanical scratching step and the be full of cracks that obtains is permeated further, and is cut completely by described glass substrate; And
The laser of the laser irradiated from described laser irradiating part to be oscillation wavelength be 5 mu m wavebands.
5. cutting device according to claim 4, wherein said break bar is that diameter is 1 ~ 3mm and forms the trough of belt break bar of groove along the crestal line becoming point of a knife.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-200119 | 2014-09-30 | ||
| JP2014200119A JP2016069223A (en) | 2014-09-30 | 2014-09-30 | Breaking method and breaking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105461203A true CN105461203A (en) | 2016-04-06 |
Family
ID=55599430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510641339.4A Pending CN105461203A (en) | 2014-09-30 | 2015-09-30 | Cutting method and cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016069223A (en) |
| KR (1) | KR20160038821A (en) |
| CN (1) | CN105461203A (en) |
| TW (1) | TW201620845A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109399902A (en) * | 2018-10-12 | 2019-03-01 | 重庆艺美玻璃有限公司 | Original sheet glass cutting means |
| CN109524332A (en) * | 2018-12-26 | 2019-03-26 | 江苏纳沛斯半导体有限公司 | A kind of accurate cutter device of semiconductor crystal wafer |
| CN110230182A (en) * | 2019-06-19 | 2019-09-13 | 天津市高洁卫生用品有限公司 | A kind of non-woven fabrics cutting machine with drying function |
| CN112384481A (en) * | 2018-08-10 | 2021-02-19 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
| CN113382970A (en) * | 2019-01-29 | 2021-09-10 | 康宁股份有限公司 | Method and apparatus for free form cutting of flexible thin glass |
| CN114829311A (en) * | 2020-02-03 | 2022-07-29 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
| CN114845964A (en) * | 2020-02-05 | 2022-08-02 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
| CN114981221A (en) * | 2020-02-04 | 2022-08-30 | 日本电气硝子株式会社 | Glass plate and method for manufacturing glass plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI837150B (en) * | 2018-09-28 | 2024-04-01 | 日商三星鑽石工業股份有限公司 | How to break GaN substrates |
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| CN109399902A (en) * | 2018-10-12 | 2019-03-01 | 重庆艺美玻璃有限公司 | Original sheet glass cutting means |
| CN109399902B (en) * | 2018-10-12 | 2021-11-23 | 重庆艺美玻璃有限公司 | Cutting device for glass sheet |
| CN109524332A (en) * | 2018-12-26 | 2019-03-26 | 江苏纳沛斯半导体有限公司 | A kind of accurate cutter device of semiconductor crystal wafer |
| CN109524332B (en) * | 2018-12-26 | 2020-10-20 | 江苏纳沛斯半导体有限公司 | Accurate cutting device of semiconductor wafer |
| CN113382970A (en) * | 2019-01-29 | 2021-09-10 | 康宁股份有限公司 | Method and apparatus for free form cutting of flexible thin glass |
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| CN114829311B (en) * | 2020-02-03 | 2024-03-12 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
| CN114981221A (en) * | 2020-02-04 | 2022-08-30 | 日本电气硝子株式会社 | Glass plate and method for manufacturing glass plate |
| CN114845964A (en) * | 2020-02-05 | 2022-08-02 | 日本电气硝子株式会社 | Method for manufacturing glass plate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160038821A (en) | 2016-04-07 |
| TW201620845A (en) | 2016-06-16 |
| JP2016069223A (en) | 2016-05-09 |
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Application publication date: 20160406 |