JP2012240881A - Method of processing fragile material substrate - Google Patents

Method of processing fragile material substrate Download PDF

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Publication number
JP2012240881A
JP2012240881A JP2011112107A JP2011112107A JP2012240881A JP 2012240881 A JP2012240881 A JP 2012240881A JP 2011112107 A JP2011112107 A JP 2011112107A JP 2011112107 A JP2011112107 A JP 2011112107A JP 2012240881 A JP2012240881 A JP 2012240881A
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laser beam
substrate
material substrate
processing
brittle material
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JP5536713B2 (en
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Kenji Fukuhara
健司 福原
Hirokazu Okamoto
浩和 岡本
Miki Arakawa
美紀 荒川
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2011112107A priority Critical patent/JP5536713B2/en
Priority to TW101113560A priority patent/TWI532693B/en
Priority to KR1020120046201A priority patent/KR101396988B1/en
Priority to CN201210152395.8A priority patent/CN102786214B/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce poor cutting in forming lattice scribe grooves in a fragile material substrate having a relatively large linear expansion coefficient and cutting.SOLUTION: The processing method is for irradiating a fragile material substrate with a pulse laser beam along lattice lines to be cut and includes the first process of scanning a pulse laser beam along lattice lines to be cut which extend in the first direction, in order to form the first scribe grooves, the second process of, after the formation of the first scribe grooves, radiating a pulse laser beam along lines to be cut which extend in the second direction perpendicular to the first direction, in such a manner that pulse laser beams do not overlap each other but that processed marks formed in the substrate by the pulse laser beam overlap each other, in order to form the second scribe grooves in the surface of the substrate and the third process of pressing both sides of each scribe groove to cut the substrate along each scribe groove.

Description

本発明は、脆性材料基板の加工方法、特に、格子状の分断予定ラインに沿ってパルスレーザ光を脆性材料基板に照射し、脆性材料基板を分断するための脆性材料基板の加工方法に関する。   The present invention relates to a method for processing a brittle material substrate, and more particularly, to a method for processing a brittle material substrate for dividing a brittle material substrate by irradiating the brittle material substrate with a pulsed laser beam along a grid-like division line.

液晶ディスプレイ等に用いられるガラスを加工する方法として、例えば特許文献１に示された方法がある。この特許文献１に示された方法は、パルスレーザとして紫外線領域を用い、各照射個所でのパルス数の合計が２６６７〜８０００パルス数の範囲となるようにパルスレーザを相対移動させながら照射し、ガラスの厚さの１．８〜６．３％の深さにスクライブ溝を形成するものである。   As a method for processing glass used for a liquid crystal display or the like, for example, there is a method disclosed in Patent Document 1. The method disclosed in Patent Document 1 uses an ultraviolet region as a pulse laser, and irradiates the pulse laser while relatively moving so that the total number of pulses at each irradiation point is in the range of 2667 to 8000 pulses. Scribe grooves are formed at a depth of 1.8 to 6.3% of the glass thickness.

この特許文献１に示された方法によってガラスを分断することにより、交差するスクライブ溝を形成する場合にも、煩雑な作業が不要であることが示されている。   It is shown that a complicated operation is not required even when the intersecting scribe grooves are formed by dividing the glass by the method disclosed in Patent Document 1.

特開２００５−３１４１２７号公報JP 2005-314127 A

最近のタッチパネル等に用いられるガラスは、無アルカリガラスよりも線膨張係数が大きいガラスが用いられる場合が多い。このようなガラスに格子状のスクライブ溝（クロススクライブ）を形成し、分断する場合、従来の方法では欠陥が発生して良好な分断を行うことはできない。具体的には、第１方向に第１スクライブ溝を形成し、その後第１方向と直交する第２方向に第２スクライブ溝を形成する場合、第２スクライブ溝の形成時に熱が周囲に伝わろうとするが、第１スクライブ溝によって熱の伝達が遮られ、特に第１スクライブ溝と第２スクライブ溝との交点の部分に大きい内部応力が残ってしまう。この熱影響により、時間経過とともに欠陥が発生し、分断時に端面にバリや欠けが発生する。   As glass used for recent touch panels and the like, glass having a larger linear expansion coefficient than non-alkali glass is often used. When a lattice-like scribe groove (cross scribe) is formed in such a glass and divided, defects are generated in the conventional method, and good division cannot be performed. Specifically, when the first scribe groove is formed in the first direction and then the second scribe groove is formed in the second direction orthogonal to the first direction, heat is transmitted to the surroundings when the second scribe groove is formed. However, heat transfer is blocked by the first scribe groove, and a large internal stress remains particularly at the intersection of the first scribe groove and the second scribe groove. Due to this thermal effect, defects occur over time, and burrs and chips are generated on the end face during division.

本発明の課題は、線膨張係数が比較的大きい脆性材料基板に格子状のスクライブ溝を形成し、分断する際に、分断不良少なくすることにある。   SUMMARY OF THE INVENTION An object of the present invention is to form a lattice-shaped scribe groove on a brittle material substrate having a relatively large linear expansion coefficient, and to reduce the division failure when dividing.

第１発明に係る脆性材料基板の加工方法は、格子状の分断予定ラインに沿ってパルスレーザ光を脆性材料基板に照射し、脆性材料基板を分断するための加工方法であって、第１工程と、第２工程と、第３工程と、を含んでいる。第１工程は、第１方向に延びる分断予定ラインに沿ってパルスレーザ光を走査し、基板表面に第１スクライブ溝を形成する。第２工程は、第１スクライブ溝の形成後に、第１方向と直交する第２方向に延びる分断予定ラインに沿って、パルスレーザ光をオーバーラップさせずにかつパルスレーザ光による基板への加工痕がオーバーラップするようにパルスレーザ光を照射し、基板表面に第２スクライブ溝を形成する。第３工程は各スクライブ溝の両側を押圧して各スクライブ溝に沿って基板を分断する。   A processing method for a brittle material substrate according to a first aspect of the present invention is a processing method for dividing a brittle material substrate by irradiating the brittle material substrate with a pulsed laser beam along a lattice-shaped division planned line. And a second step and a third step. In the first step, a pulsed laser beam is scanned along a planned dividing line extending in the first direction to form a first scribe groove on the substrate surface. In the second step, after forming the first scribe groove, along the planned dividing line extending in the second direction orthogonal to the first direction, the processing marks on the substrate by the pulse laser light without overlapping the pulse laser light Are irradiated with pulsed laser light so as to overlap each other, thereby forming a second scribe groove on the substrate surface. In the third step, both sides of each scribe groove are pressed to divide the substrate along each scribe groove.

ここでは、まず、第１方向に延びる分断予定ラインに沿ってパルスレーザ光が走査されて基板表面に第１スクライブ溝が形成される。次に、第２方向に延びる分断予定ラインに沿って、パルスレーザ光をオーバーラップさせずにかつパルスレーザ光による基板への加工痕がオーバーラップするようにパルスレーザ光が照射され、第２スクライブ溝が形成される。以上のようにして各スクライブ溝が形成された後に、各スクライブ溝の両側が押圧されて基板が分断される。   Here, first, a pulsed laser beam is scanned along a planned dividing line extending in the first direction to form a first scribe groove on the substrate surface. Next, the pulsed laser beam is irradiated along the planned dividing line extending in the second direction without overlapping the pulsed laser beam and so that the processing marks on the substrate by the pulsed laser beam overlap, and the second scribe is performed. A groove is formed. After each scribe groove is formed as described above, both sides of each scribe groove are pressed to divide the substrate.

以上の加工方法では、従来の加工方法のようにパルスレーザ光をオーバーラップさせてスクライブ溝を形成する場合に比較して、基板への熱影響が抑えられる。このため、基板分断後に時間が経過しても欠陥が発生しにくい。すなわち、分断不良を少なくすることができる。   In the above processing method, the thermal influence on the substrate can be suppressed as compared with the case where the scribe groove is formed by overlapping the pulse laser light as in the conventional processing method. For this reason, even if time passes after board | substrate parting, a defect does not generate | occur | produce easily. That is, it is possible to reduce the division failure.

第２発明に係る脆性材料基板の加工方法は、第１発明の加工方法において、第１工程では、分断予定ラインに沿って、パルスレーザ光をオーバーラップさせずにかつパルスレーザ光による基板への加工痕がオーバーラップするようにパルスレーザ光を照射する。   The processing method of the brittle material substrate according to the second invention is the processing method according to the first invention, wherein in the first step, the pulse laser beam is not overlapped along the planned dividing line and is applied to the substrate by the pulse laser beam. Irradiate pulsed laser light so that the processing marks overlap.

ここでは、第２スクライブ溝の形成時だけでなく、第１スクライブ溝の形成時においてもパルスレーザ光をオーバーラップさせずにかつパルスレーザ光による基板への加工痕がオーバーラップするようにパルスレーザ光が照射される。このため、基板への熱影響がより抑えられ、分断不良をさらに小さくできる。   Here, not only at the time of forming the second scribe groove, but also at the time of forming the first scribe groove, the pulse laser does not overlap the pulse laser light so that the processing marks on the substrate by the pulse laser light overlap. Light is irradiated. For this reason, the heat influence on a board | substrate is suppressed more and a division defect can be made still smaller.

第３発明に係る脆性材料基板の加工方法は、第１又は第２発明の加工方法において、脆性材料基板は、無アルカリガラスに比較して線膨張係数が大きいガラス材料基板である。   The brittle material substrate processing method according to a third aspect of the present invention is the processing method of the first or second aspect, wherein the brittle material substrate is a glass material substrate having a larger linear expansion coefficient than non-alkali glass.

線膨張係数が比較的大きいガラス材料基板では、熱影響による欠けやクラックなどの欠陥が発生する可能性が大きいので、この種のガラス基板に本発明を適用することで、分断不良を効果的に抑えることができる。   A glass material substrate having a relatively large linear expansion coefficient has a high possibility of occurrence of defects such as chipping and cracking due to thermal effects. Therefore, by applying the present invention to this type of glass substrate, it is possible to effectively prevent division defects. Can be suppressed.

第４発明に係る脆性材料基板の加工方法は、第１から第３発明のいずれかの加工方法において、第２工程では、パルスレーザ光のオーバーラップ率が−４７％以上−９７％以下に設定され、かつレーザ強度が３．１×１０１０［W/cm2］以上５．１×１０１０［W/cm2］以下に設定される。 The processing method for a brittle material substrate according to a fourth aspect of the present invention is the processing method according to any one of the first to third aspects, wherein in the second step, the overlap rate of the pulse laser beam is set to -47% or more and -97% or less. The laser intensity is set to 3.1 × 10 10 [W / cm 2 ] or more and 5.1 × 10 10 [W / cm 2 ] or less.

以上のような本発明では、特に、線膨張係数が比較的大きい脆性材料基板に格子状のスクライブ溝を形成し、分断する際に、分断不良少なくすることができる。   In the present invention as described above, in particular, when a lattice-shaped scribe groove is formed on a brittle material substrate having a relatively large linear expansion coefficient and is divided, the division failure can be reduced.

本発明の一実施形態による加工方法を実施するためのレーザ加工装置の概略構成図。The schematic block diagram of the laser processing apparatus for enforcing the processing method by one Embodiment of this invention. クロススクライブの実験例１のスクライブ溝及び分断結果を示す加工サンプルの写真。The photograph of the processing sample which shows the scribe groove | channel of the example 1 of cross scribing, and a cutting | disconnection result.

［加工対象］
本発明の一実施形態による加工方法は、主に、無アルカリガラスよりも線膨張係数が大きいＤ２６３（SCHOTT製）等のガラスに対して交差するスクライブ溝（クロススクライブ）を形成する場合に適用される。 [Processing target]
The processing method according to an embodiment of the present invention is mainly applied when forming a scribe groove (cross scribe) that intersects a glass such as D263 (manufactured by SCHOTT) having a linear expansion coefficient larger than that of non-alkali glass. The

［レーザ加工装置］
図１は、本発明の一実施形態による加工方法を実施するためのレーザ加工装置５の概略構成を示したものである。レーザ加工装置５は、レーザ光線発振器６ａやレーザ制御部６ｂを含むレーザ光線発振ユニット６と、レーザ光を所定の方向に導くための複数のミラーを含む伝送光学系７と、伝送光学系７からのレーザ光を集光させるための集光レンズ８と、を有している。レーザ光線発振ユニット６からは、ビーム強度等の照射条件が制御されたパルスレーザ光（以下、単にレーザ光と記す）が出射される。なお、ガラス基板１はテーブル９に載置されている。テーブル９は、駆動制御部２０によって駆動制御され、水平面内で移動が可能である。すなわち、テーブル９に載置されたガラス基板１と集光レンズ８から照射されるレーザ光線とは水平面内で相対移動が可能である。また、レーザ光とガラス基板１が載置されるテーブル９とは、相対的に上下方向に移動が可能である。レーザ制御部６ｂ及び駆動制御部２０は、加工制御部２１によって制御されるようになっている。 [Laser processing equipment]
FIG. 1 shows a schematic configuration of a laser processing apparatus 5 for performing a processing method according to an embodiment of the present invention. The laser processing apparatus 5 includes a laser beam oscillation unit 6 including a laser beam oscillator 6 a and a laser control unit 6 b, a transmission optical system 7 including a plurality of mirrors for guiding laser light in a predetermined direction, and a transmission optical system 7. And a condensing lens 8 for condensing the laser beam. The laser beam oscillation unit 6 emits pulsed laser light (hereinafter simply referred to as laser light) whose irradiation conditions such as beam intensity are controlled. The glass substrate 1 is placed on the table 9. The table 9 is driven and controlled by the drive control unit 20 and can move in a horizontal plane. That is, the glass substrate 1 placed on the table 9 and the laser beam irradiated from the condenser lens 8 can be relatively moved in a horizontal plane. Further, the laser beam and the table 9 on which the glass substrate 1 is placed can move relatively in the vertical direction. The laser control unit 6b and the drive control unit 20 are controlled by a processing control unit 21.

加工制御部２１は、マイクロコンピュータで構成されており、レーザ制御部６ｂ及び駆動制御部２０を制御して、以下のような処理を実行する。   The processing control unit 21 includes a microcomputer, and controls the laser control unit 6b and the drive control unit 20 to execute the following processing.

（１）ビーム強度の調整されたレーザ光をガラス基板１に照射するとともに第１方向及びこれと直交する第２方向に延びる分断予定ラインに沿って走査し、分断予定ラインに沿って交差するスクライブ溝を形成する。すなわち、クロススクライブを行う。   (1) A laser beam whose beam intensity is adjusted is irradiated onto the glass substrate 1, scanned along a planned dividing line extending in the first direction and a second direction perpendicular thereto, and scribed to intersect along the planned dividing line. Grooves are formed. That is, cross scribing is performed.

（２）スクライブ溝の形成に際し、パルスレーザ光をオーバーラップさせずに、パルスレーザ光による加工痕がオーバーラップするようにレーザ光の照射条件を設定する。   (2) When forming the scribe groove, the irradiation condition of the laser beam is set so that the processing marks by the pulse laser beam overlap without overlapping the pulse laser beam.

［レーザ加工方法］
ガラス基板を分断する場合は、まず、レーザ加工装置５によって各分断予定ラインに沿ってスクライブ溝を形成する。このとき、前述のように、パルスレーザ光をオーバーラップさせずに、パルスレーザ光による加工痕がオーバーラップするようにレーザ光が照射される。 [Laser processing method]
When the glass substrate is divided, first, a scribe groove is formed along each scheduled cutting line by the laser processing apparatus 5. At this time, as described above, the laser beam is irradiated so that the processing marks by the pulse laser beam overlap without overlapping the pulse laser beam.

次に、スクライブ溝の両側に圧力をかける。これにより、ガラス基板はスクライブ溝に沿って分断される。   Next, pressure is applied to both sides of the scribe groove. Thereby, a glass substrate is parted along a scribe groove | channel.

［実験例］
図２に、加工対象基板としてＤ２６３を例にとり、格子状のスクライブ溝（クロススクライブ）を形成し、分断した場合の実験例を示す。 [Experimental example]
FIG. 2 shows an experimental example in which D263 is taken as an example of the substrate to be processed, and a lattice-shaped scribe groove (cross scribe) is formed and divided.

−実験例１−
＜レーザ条件＞
波長：２６６nm
パルス幅：１８ns
集光径（基板上面の直径）：３．４μm
繰り返し周波数：６０kHz
強度：３．０８×１０10W/cm2
走査速度：３００mm/s−−−オーバーラップ率：−４７．３％
焦点位置：基板上面
走査回数：１回
＜基板＞
種類：Ｄ２６３（SCHOTT製）
厚み：０．３mm
なお、「オーバーラップ率」は、以下の式から算出される値である。 -Experimental example 1-
<Laser conditions>
Wavelength: 266nm
Pulse width: 18ns
Condensing diameter (diameter of substrate upper surface): 3.4 μm
Repeat frequency: 60kHz
Strength: 3.08 × 10 10 W / cm 2
Scanning speed: 300 mm / s --- Overlap ratio: -47.3%
Focus position: Upper surface of substrate Scanning frequency: Once <Substrate>
Type: D263 (manufactured by SCHOTT)
Thickness: 0.3mm
The “overlap rate” is a value calculated from the following equation.

オーバーラップ率（％）
＝（１−（走査速度［mm/s］／（繰り返し周波数［Hz］×集光径［mm］）））
以上の条件で加工した結果を、図２に示している。図２（ａ）はスクライブ溝を加工した後の基板上面の様子を拡大して示したものである。この図から、パルスレーザ光による加工痕がオーバーラップしていることは明らかである。図２（ｂ）は分断後の端面を上方から見た様子を拡大して示したものである。また図２（ｃ）は分断後の分断面の様子を示したものである。これらの図２（ｂ）（ｃ）から、分断後にスクライブ溝の交点部にバリや欠け等の欠陥が発生していないことが確認できる。 Overlap rate (%)
= (1- (Scanning speed [mm / s] / (Repetition frequency [Hz] × Condensing diameter [mm])))
The result of processing under the above conditions is shown in FIG. FIG. 2A shows an enlarged view of the upper surface of the substrate after processing the scribe grooves. From this figure, it is clear that the processing marks by the pulse laser beam overlap. FIG. 2B shows an enlarged view of the end face after the division as viewed from above. FIG. 2 (c) shows the state of the divided section after dividing. 2B and 2C, it can be confirmed that defects such as burrs and chips are not generated at the intersections of the scribe grooves after the division.

−実験例２−
次に、レーザ強度及びオーバーラップ率を変化させた場合の分断評価を表１に示す。この表１では、レーザ強度を１．０〜５．１×１０10W/cm2の範囲で、またオーバーラップ率を７５．４〜−９６．８％の範囲で変化させた場合の、分断品質の結果を示している。なお、他のレーザ条件及び加工対象については、実験例１と同じである。 -Experimental example 2-
Next, Table 1 shows the evaluation of splitting when the laser intensity and the overlap ratio are changed. In this Table 1, when the laser intensity is changed in the range of 1.0 to 5.1 × 10 10 W / cm 2 and the overlap ratio is changed in the range of 75.4 to −96.8%, the fragmentation occurs. Shows quality results. The other laser conditions and the processing target are the same as in Experimental Example 1.

○：分断可能（品質：良好）
×：分断不良（品質：欠け又はクラックが発生）
以上の実験結果から、スクライブ溝の形成に際し、パルスレーザ光のオーバーラップ率が−４７％以上−９７％以下に設定され、かつレーザ強度が３．１×１０１０W/cm2以上５．１×１０１０W/cm2以下に設定することによって、クロススクライブを良好な分断品質で行うことができることがわかる。 ○: Can be divided (quality: good)
×: poor separation (quality: chipping or cracking)
From the above experimental results, when forming the scribe groove, the overlap rate of the pulse laser beam is set to -47% or more and -97% or less, and the laser intensity is 3.1 × 10 10 W / cm 2 or more and 5.1. It can be seen that the cross scribe can be performed with good splitting quality by setting it to 10 × 10 10 W / cm 2 or less.

［他の実施形態］
本発明は以上のような実施形態に限定されるものではなく、本発明の範囲を逸脱することなく種々の変形又は修正が可能である。 [Other Embodiments]
The present invention is not limited to the above-described embodiments, and various changes or modifications can be made without departing from the scope of the present invention.

例えば、前記実施形態では加工対象をＤ２６３としたが、比較的線膨張係数の大きい他の脆性材料基板においても同様に適用できる。   For example, although the processing target is D263 in the above-described embodiment, the present invention can be similarly applied to other brittle material substrates having a relatively large linear expansion coefficient.

１ ガラス基板 1 Glass substrate

Claims (4)

格子状の分断予定ラインに沿ってパルスレーザ光を脆性材料基板に照射し、脆性材料基板を分断するための脆性材料基板の加工方法であって、
第１方向に延びる分断予定ラインに沿ってパルスレーザ光を走査し、基板表面に第１スクライブ溝を形成する第１工程と、
前記第１スクライブ溝の形成後に、前記第１方向と直交する第２方向に延びる分断予定ラインに沿って、パルスレーザ光をオーバーラップさせずにかつパルスレーザ光による基板への加工痕がオーバーラップするようにパルスレーザ光を照射し、基板表面に第２スクライブ溝を形成する第２工程と、
前記各スクライブ溝の両側を押圧して前記各スクライブ溝に沿って基板を分断する第３工程と、
を含む、脆性材料基板の加工方法。 A method of processing a brittle material substrate for dividing a brittle material substrate by irradiating the brittle material substrate with a pulsed laser beam along a grid-like division line,
A first step of scanning the pulsed laser beam along a dividing line extending in the first direction to form a first scribe groove on the substrate surface;
After the formation of the first scribe groove, the processing traces on the substrate by the pulse laser beam overlap along the planned dividing line extending in the second direction orthogonal to the first direction without overlapping the pulse laser beam. A second step of irradiating a pulsed laser beam to form a second scribe groove on the substrate surface;
A third step of pressing the both sides of each scribe groove to divide the substrate along each scribe groove;
A method for processing a brittle material substrate, comprising: 前記第１工程では、分断予定ラインに沿って、パルスレーザ光をオーバーラップさせずにかつパルスレーザ光による基板への加工痕がオーバーラップするようにパルスレーザ光を照射する、請求項１に記載の脆性材料基板の加工方法。   The said 1st process irradiates with a pulsed laser beam so that the processing trace to the board | substrate by a pulsed laser beam may overlap without dividing a pulsed laser beam along the division planned line. Method for processing a brittle material substrate. 前記脆性材料基板は、無アルカリガラスに比較して線膨張係数が大きいガラス材料基板である、請求項１又は２に記載の脆性材料基板の加工方法。   The method for processing a brittle material substrate according to claim 1, wherein the brittle material substrate is a glass material substrate having a larger linear expansion coefficient than non-alkali glass. 前記第２工程では、パルスレーザ光のオーバーラップ率が−４７％以上−９７％以下に設定され、かつレーザ強度が３．１×１０１０［W/cm2］以上５．１×１０１０［W/cm2］以下に設定される、請求項１から３のいずれかに記載の脆性材料基板の加工方法。 In the second step, the overlap rate of the pulse laser beam is set to −47% or more and −97% or less, and the laser intensity is 3.1 × 10 10 [W / cm 2 ] or more to 5.1 × 10 10 [ W / cm 2 ] The method for processing a brittle material substrate according to any one of claims 1 to 3, which is set below.
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