201247575 六、發明說明： 【發明所屬之枝術領域】 本發明係關於一種脆性材料基板的加工方法，特別是 關於用以將脈衝雷射（pulsed laser)光沿著格子狀的切割 預定線照射至職性材料基板，並切斷脆性材料基板的加工 方法。 【先前技術】 以將液晶顯示器等所使用之玻璃予以加工之方法而 言’例如有一種於專利文獻1所揭示之方法。該專利文獻 所揭示之方法’係為使用紫外線區域作為脈衝雷射，並以 在各照射部位的脈衝數之合計成為2667至8000脈衝數的 範圍之方式’一面使脈衝雷射相對移動而一面照射，並於 玻璃厚度之1. 8至6. 3%的深度形成切割（scribe)溝者。 藉由該專利文獻1所揭示之方法來切斷玻璃，即使在 形成交叉之切割溝時，亦不需要繁雜的作業。 (專利文獻） (專利文獻1) 曰本特開2005-314127號公報 【發明内容】 (發明所欲解決之課題） 最近之觸碰面板（touch panel)等所使用之玻璃，使 用線膨脹係數較無驗玻璃（non-alkali glass)大的玻璃的 情況為多。於此種玻璃形成格子狀的切割溝（cross scribe) ’並切斷時，在習知的方法中，會產生缺陷而無法 324075 4 201247575 情況’在第2切割溝之形:= =溝: 熱的傳達會被溝遮斷，制是在第 2而：:=·:!部份會殘留大的内部應力。因為該熱影響 戋缺:a經過產生缺陷，並於切斷時在端面產生毛邊201247575 VI. Description of the Invention: [Technical Field] The present invention relates to a method for processing a substrate of a brittle material, and more particularly to irradiating pulsed laser light along a grid-shaped cutting line to A material substrate for the job, and a method of cutting the substrate of the brittle material. [Prior Art] A method of processing a glass used for a liquid crystal display or the like is exemplified, for example, a method disclosed in Patent Document 1. In the method disclosed in the patent document, the ultraviolet region is used as a pulsed laser, and the pulse laser is relatively moved while being irradiated in a range of 2,667 to 8,000 pulses in the total number of pulses at each irradiation site. And forming a scribe groove at a depth of 1.8 to 6.3% of the thickness of the glass. According to the method disclosed in Patent Document 1, the glass is cut, and even when the intersecting cutting grooves are formed, complicated work is not required. (Patent Document 1) Japanese Unexamined Patent Publication No. Hei No. 2005-314127 (Summary of the Invention) The glass to be used in recent touch panels or the like has a linear expansion coefficient. There are many cases of large glass of non-alkali glass. When such a glass forms a lattice-shaped cutting groove and is cut, in the conventional method, a defect occurs and it is impossible to 324075 4 201247575 Case 'In the shape of the second cutting groove: = = groove: heat The communication will be interrupted by the ditch, and the system will have a large internal stress in the 2nd::=·:! Because the heat is affected by the lack of a: a defect occurs, and the edge is generated at the end when cutting
本發明之課_在於線祕餘較A 板形成格子狀的蝴溝，並予以切斷時減少切斷不7基 (解決課題之手段） 關於第1發明之脆性材料基板的加工方法係為用以 將脈衝雷射総著格子狀之切_定賴射至脆性材祕 板，並切斷脆性材料基板之加卫方法，係包含第i步驟、 第2步驟、及第3步驟。第1步驟係沿著朝第i方向延伸 之切斷預定線掃描脈衝雷射光，並於基板表面形成第丄切 割溝。第2步驟係於形成第i切割溝之後，沿著朝與第^ 方向正交之第2方向延伸的切斷預定線，以不使脈衝雷射 光重疊且使脈衝雷射光對基板所造成之加工痕重疊的方 式，照射脈衝雷射光，並於基板表面形成第2切割溝。第 3步驟係按壓各切割溝的兩侧而沿著各切割溝切斷基板。 在此，首先，使脈衝雷射光沿著朝第1方向延伸之切 斷預定線掃描，形成第1切割溝於基板表面。接著，沿著 朝第2方向延伸之切斷預定線，以不使脈衝雷射光重疊且 使脈衝雷射光對基板所造成之加工痕重疊的方式，照射脈 324075 5 201247575 ▲ 衝雷射光，並形成第2切割溝。在如同以上方式進行而形 .成各切割溝之後，按壓各切割溝的兩側來切斷基板。 在以上的加工方法中，相較於以習知之加工方法的方 式使脈衝雷射光重疊而形成切割溝的情況，較能抑制對基 板的熱影響。因此，即使在基板切斷後時間經過，亦難以 產生缺陷。亦即，能減少切斷不良。 關於第2發明之脆性材料基板的加工方法，係為於第 1發明之加工方法中’在第！步驟中，係沿著切斷預定線， 以不使脈衝雷射光重疊且使脈衝雷射光對基板所造成之加 工痕重疊的方式，照射脈衝雷射光。 在此，不僅於第2切割溝之形成時，於第丨切割溝形 成時，亦以不使脈衝雷射光重疊且使脈衝雷射光對基板所 把成之加工痕重疊的方式，照射脈衝雷射光。因此，能更 加抑制對基板的熱影響，並能進一步使切斷不良變小。 關於第3發明之脆性材料基板的加工方法，係為於第 1或第2發明之加工方法中，脆性材料基板係為線膨脹係 數較無鹼玻璃為大之玻璃材料基板。 在線膨脹係數比較大之玻璃材料基板中，因熱影響所 造成之缺口或裂紋等缺陷產生之可能性大，故藉由將本發 明應用於該種玻璃基板，能有效地抑制切斷不良。 關於第4發明之脆性材料基板的加工方法，係為於第 1至第3發明之任一種加工方法中，在第2步驟中，脈衝 雷射光的重疊率設定為一47°/。以上至一97%以下，且雷射強 度設定為3. lxl01()[W/cm2]以上至5. 1x10丨。[W/cm2]以下 324075 6 201247575 (發明之效果） 在以上之本發明中，特別是於線膨脹係數比較大的脆 性材料基板形成格子狀的切割溝，並切斷時，能減少切斷 不良。 【實施方式】 [加工對象] 本發明之一實施形態之加工方法，主要係適用於對線 膨服係數較無鹼玻璃大之D263(SCH〇TT製）等玻璃形成交 又切割溝（cross scribe)的情況。 [雷射加工裝置] 第1圖係為用以實施本發明之一實施形態的加工方法 之雷射加工裝置5的概略構成圖者。雷射加工裝置5係具 有包含雷射光線振蓋器6a及雷射控制部6b之雷射光線振 堡單元6、包含用以將雷射光朝預定之方向導引之複數個 鏡片（mirror)的傳送光學系統7、及用以使來自傳送光學 系統7的雷射光聚光之聚光透鏡8。從雷射光線振盪單元6 射出光束強度荨照射條件經控制的脈衝雷射光（以下會有 僅冗載為雷射光的情形）。再者，玻璃基板丨係載置於平台 9 °平台9係藉由驅動控制部2()來驅動控制，能在水平面 内移動。亦即，載置於平台9之玻璃基板丨與從聚光透鏡 8:、、、射之雷射光線係在水平面内可相對移動。&外，雷射 光與供载置玻璃純1的平台9，係為可相對性朝上下方 向移動。雷射控制部6b及驅動控制部20係藉由加 部21而控制。 324075 201247575 加工控制部21係以微電腦構成，並控制雷射控制部 6b及驅動控制部20以執行以下之處理。 (1) 將光束強度經調整之雷射光朝玻璃基板1照射’ 並且沿著第1方向及朝與第1方向正交之第2方向延伸之 切斷預定線掃描，沿著切斷預定線形成交叉的切割溝。亦 即，進行交叉切割。 (2) 在切割溝之形成時’不使脈衝雷射光重疊 (overlap)，而以脈衝雷射光所造成之加工痕重疊的方式， 設定雷射光的照射條件。 [雷射加工方法] 在將玻璃基板切斷時，首先’藉由雷射加工裝置5沿 著各切斷預定線形成切割溝。此時，如同前述，不使脈衝 雷射光重疊，而以脈衝雷射光所造成之加工痕重疊的方式 照射雷射光。 接著，對切割溝的兩側施加壓力。藉此，玻璃基板會 沿著切割溝切斷。 [實驗例] 第2圖係為顯示採用D263為例作為加工對象基板， 形成格子狀的切割溝（cross scribe)，並切斷之情況的實 驗例。 -實驗例1-〈雷射條件〉 波長：266nm 脈衝寬度：18ns 324075 8 201247575 • 聚光徑（基板上表面的直徑）：3. 4ym • 重複頻率：60kHz 強度：3. 08xl01DW/cm2 掃描強度：300mm/s---重疊率：一47. 3% 焦點位置：基板上表面 掃描次數：1次 〈基板〉 種類：D263CSCH0TT 製） 厚度：0. 3mm 再者，「重疊率」係為根據以下的式子所算出的值。 重疊率（％) =(1-(掃描速度[mm/s] / (重複頻率[Hz]x聚光 徑[mm]))) 將使用以上之條件加工之結果顯示於第2圖。第2圖 (a )係為將切割溝加工後之基板上表面的模樣予以擴大顯 示者。根據該圖可明瞭脈衝雷射光所造成之加工痕重疊之 情形。第2圖（b)係為將從上方觀察切斷後之端面的模樣予 以擴大顯示者。此外，第2圖（c)係為將切斷後之切斷面的 模樣予以顯示者。根據該等第2圖（b)、（c)，可確認在切 斷後於切割溝的交點部並未產生毛邊或缺口等缺陷。 -實驗例2- 接著，將使雷射強度及重疊率變化之情況的切斷評估 顯示於第1表。在該第1表中，係顯示使雷射強度在1. 0 324075 9 201247575 至5. ΙχΙΟΐ/αη2之範圍變化、且使重疊率在75·4至— 96. 8%的範圍變化之情況的切斷品質之結果。再者，關於其 他的雷射條件及加工對象，係為與實驗例1相同。 〔第1表〕In the course of the present invention, the line of the brittle material is formed by forming a grid-like groove with respect to the A-plate, and cutting is performed when the cutting is performed. The i-step, the second step, and the third step are included in the method of fixing the pulsed laser to the brittle material and cutting the brittle material substrate. In the first step, the pulsed laser light is scanned along a line to cut extending in the i-th direction, and a second cutting groove is formed on the surface of the substrate. The second step is a process of forming a ith dicing groove along a line to cut extending in a second direction orthogonal to the second direction so as not to overlap the pulsed laser light and causing the pulsed laser light to be processed on the substrate. The pattern of the marks overlaps, and the pulsed laser light is irradiated to form a second dicing groove on the surface of the substrate. In the third step, the both sides of each of the cutting grooves are pressed to cut the substrate along each of the cutting grooves. Here, first, the pulsed laser light is scanned along a planned cutting line extending in the first direction to form a first dicing groove on the surface of the substrate. Then, along the line to cut extending in the second direction, the laser beam is irradiated by the pulse 324075 5 201247575 ▲ so that the pulsed laser light is not overlapped and the processing marks caused by the pulsed laser light are superimposed on the substrate. The second cutting groove. After forming the respective grooves as described above, the both sides of each of the cutting grooves are pressed to cut the substrate. In the above processing method, the thermal influence on the substrate can be suppressed more than the case where the pulsed laser light is superposed to form a dicing groove in the manner of a conventional processing method. Therefore, even if the time passes after the substrate is cut, it is difficult to cause defects. That is, it is possible to reduce the poor cutting. The processing method of the brittle material substrate according to the second aspect of the invention is in the processing method of the first invention. In the step, the pulsed laser light is irradiated along the line to cut, so that the pulsed laser light is not overlapped and the processing marks caused by the pulsed laser light are superimposed on the substrate. Here, not only when the second dicing groove is formed, but also when the second dicing groove is formed, the pulsed laser light is irradiated so as not to overlap the pulsed laser light and to overlap the processing marks formed by the substrate by the pulsed laser light. . Therefore, the thermal influence on the substrate can be further suppressed, and the cutting failure can be further reduced. In the processing method of the brittle material substrate according to the third aspect of the invention, the brittle material substrate is a glass material substrate having a linear expansion coefficient larger than that of the alkali-free glass. In the glass material substrate having a relatively large coefficient of linear expansion, defects such as cracks or cracks due to thermal influence are likely to occur, and therefore, by applying the present invention to such a glass substrate, it is possible to effectively suppress the cutting failure. In the processing method of the brittle material substrate according to the fourth aspect of the invention, in the processing method of any one of the first to third aspects, in the second step, the overlapping ratio of the pulsed laser light is set to be 47°/. The above is up to 97%, and the laser intensity is set to 3. lxl01()[W/cm2] or more to 5. 1x10丨. [W/cm2] 324075 6 201247575 (Effects of the Invention) In the above invention, in particular, when a brittle material substrate having a relatively large linear expansion coefficient is formed into a lattice-shaped dicing groove, the cutting failure can be reduced. . [Embodiment] [Processing Object] The processing method according to an embodiment of the present invention is mainly applied to a glass forming cross-cutting groove (D263 (manufactured by SCH〇TT) having a larger linear expansion coefficient than alkali-free glass. )Case. [Laser processing apparatus] Fig. 1 is a schematic configuration diagram of a laser processing apparatus 5 for carrying out a processing method according to an embodiment of the present invention. The laser processing apparatus 5 has a laser beam unit 6 including a laser beam illuminator 6a and a laser control unit 6b, and a plurality of lenses including a mirror for guiding the laser light in a predetermined direction. The transmission optical system 7 and a collecting lens 8 for collecting the laser light from the transmission optical system 7 are collected. The laser beam intensity is emitted from the laser beam oscillating unit 6 and the pulsed laser light whose irradiation condition is controlled (hereinafter, only the case where the redundant load is laser light). Further, the glass substrate is placed on the platform. The 9° stage 9 is driven and controlled by the drive control unit 2 (), and is movable in the horizontal plane. That is, the glass substrate 载 placed on the stage 9 and the laser light from the condensing lens 8:, and the laser beam are relatively movable in the horizontal plane. In addition, the laser beam and the platform 9 for mounting the glass pure 1 are movable in a relative upward and downward direction. The laser control unit 6b and the drive control unit 20 are controlled by the addition unit 21. 324075 201247575 The machining control unit 21 is configured by a microcomputer, and controls the laser control unit 6b and the drive control unit 20 to execute the following processing. (1) The laser beam whose beam intensity is adjusted is irradiated toward the glass substrate 1 and scanned along the first direction and the line to cut extending in the second direction orthogonal to the first direction, and formed along the line to be cut. Cross cutting groove. That is, cross cutting is performed. (2) At the time of formation of the dicing groove, the irradiation conditions of the laser light are set so that the pulsed laser light is not overlapped and the processing marks caused by the pulsed laser light are overlapped. [Laser processing method] When the glass substrate is cut, first, the cutting groove is formed by the laser processing apparatus 5 along each of the planned cutting lines. At this time, as described above, the laser light is irradiated so that the pulsed laser light does not overlap, and the processing marks caused by the pulsed laser light overlap. Next, pressure is applied to both sides of the cutting groove. Thereby, the glass substrate is cut along the cutting groove. [Experimental Example] Fig. 2 is an experimental example showing a case where D263 is used as a substrate to be processed, and a grid-shaped dicing groove is formed and cut. -Experimental Example 1 - <Laser Condition> Wavelength: 266 nm Pulse Width: 18 ns 324075 8 201247575 • Convergence diameter (diameter of the upper surface of the substrate): 3. 4 μm • Repetition frequency: 60 kHz Intensity: 3. 08×l01 DW/cm 2 Scanning intensity: 300mm/s---overlap rate: a 47.3% focus position: number of times of surface scan on the substrate: 1 time <substrate> Type: D263CSCH0TT system) Thickness: 0. 3mm Further, the "overlap rate" is based on the following The value calculated by the formula. Overlap rate (%) = (1 - (scanning speed [mm/s] / (repetition frequency [Hz] x condensing diameter [mm]))) The results of processing using the above conditions are shown in Fig. 2. Fig. 2 (a) shows an enlarged view of the upper surface of the substrate after the dicing process. According to the figure, the overlap of the processing marks caused by the pulsed laser light can be clarified. Fig. 2(b) shows the appearance of the end surface after cutting from the upper side to enlarge the display. Further, Fig. 2(c) shows the appearance of the cut surface after cutting. According to the second drawings (b) and (c), it was confirmed that defects such as burrs or notches were not formed at the intersection of the dicing grooves after the cutting. - Experimental Example 2 Next, the cut evaluation of the case where the laser intensity and the overlap ratio were changed was shown in the first table. In the first table, the range in which the laser intensity is changed in the range of 1. 0 324075 9 201247575 to 5. ΙχΙΟΐ/αη2 and the overlap ratio is changed from 75·4 to 9.6.8% is shown. The result of cutting off the quality. Further, other laser conditions and processing objects were the same as in Experimental Example 1. [Table 1]
X :切斷不良（產生缺口或裂紋（crack)) 根據以上之實驗結果，在切割溝之形成時，可得知藉 由脈衝雷射光的重疊率設定為—47%以上至_97%以下，且 雷射強度設定^…〜/^以上至化心^以 下，月b以良好的切斷品質進行交叉切割。 [其他實施形態] 本發明並非為限定於以上之實施形態者’且可在不脫 離本發明之範圍進行種種變形或修正。 例如在前述實施形態中，雖以D263作為加工對象， 324075 201247575 但亦可同樣地應用於線膨脹係數比較大之其他的脆性材料 基板。 (產業上之利用可能性） 在本發明之加工方法中，係於線膨脹係數比較大的脆 性材料基板形成格子狀的切割溝並切斷時，特別能減少切 斷不良。 【圖式簡單說明】 第1圖係為用以實施本發明之一實施形態的加工方法 之雷射加工裝置的概略構成圖。 第2圖（a)至（c)係為顯示交叉切割之實驗例1的切割 溝及切斷結果的加工樣品之照片。 【主要元件符號說明】 1 玻璃基板 5 雷射加工裝置 6 雷射光線振盪單元 6a 雷射光線振盪器 6b 雷射控制部 7 傳送光學系統 8 聚光透鏡 9 平台 20 驅動控制部 21 加工控制部 324075 11X: poor cutting (causing a crack or crack) According to the above experimental results, when the cutting groove is formed, it can be known that the overlapping ratio of the pulsed laser light is set to be -47% or more to _97% or less. And the laser intensity is set to ^...~/^ above to the center of the heart ^, and the month b is cross-cut with good cutting quality. [Other Embodiments] The present invention is not limited to the above embodiments, and various modifications and changes can be made without departing from the scope of the invention. For example, in the above embodiment, D263 is used as a processing target, and 324075 201247575 can be similarly applied to other brittle material substrates having a relatively large linear expansion coefficient. (Industrial Applicability) In the processing method of the present invention, when a brittle-shaped dicing groove having a relatively large linear expansion coefficient is formed and cut into a lattice-shaped dicing groove, the cutting failure can be particularly reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic configuration diagram of a laser processing apparatus for carrying out a processing method according to an embodiment of the present invention. Fig. 2 (a) to (c) are photographs showing the cut grooves of the experimental example 1 of the cross cutting and the processed samples of the cutting results. [Description of main component symbols] 1 Glass substrate 5 Laser processing device 6 Laser beam oscillating unit 6a Laser ray oscillator 6b Laser control unit 7 Transmission optical system 8 Condenser lens 9 Platform 20 Drive control unit 21 Process control unit 324075 11