CN111566058A

CN111566058A - Scribing method and scribing apparatus

Info

Publication number: CN111566058A
Application number: CN201880083476.2A
Authority: CN
Inventors: 西岛浩一; 中谷郁祥
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2017-12-27
Filing date: 2018-12-21
Publication date: 2020-08-21
Also published as: WO2019131525A1; KR20200102992A; JPWO2019131525A1; TW201938309A

Abstract

The invention aims to suppress product defects caused by bubbles generated from an adhesive when a glass substrate bonded with the adhesive is subjected to laser processing. A scribing method is a method for forming a scribing line on a glass substrate (G), wherein the glass substrate (G) comprises a 1 st glass substrate (31), a 2 nd glass substrate (33) and an annular sealing layer (35) which is arranged at a substrate cutting preset line (S) and is used for bonding the 1 st glass substrate (31) and the 2 nd glass substrate (33) together, and the scribing method comprises the following steps: a space section forming step of performing laser processing on the sealing layer (35) to form a space section (43) which extends from the substrate cutting line (S) or the vicinity thereof to the outside of the annular sealing layer (35) to the edge and is open; and a scribing line forming step of performing laser processing on the 1 st glass substrate (39) along the substrate cutting line (S) to form a processing mark (39) on the 1 st glass substrate (31) so as to communicate with the space (43).

Description

Scribing method and scribing apparatus

Technical Field

The present invention relates to a scribing method and a scribing apparatus, and more particularly, to a method and an apparatus for scribing two glass substrates bonded together via an adhesive layer.

Background

As a method of scribing a glass substrate, laser processing is known. As an object to be laser-processed, a substrate bonded with an adhesive such as a mother substrate divided into liquid crystal display panels is known (for example, see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2009-6334

Disclosure of Invention

Problems to be solved by the invention

The following problems occur when the substrate described in patent document 1 is laser-processed. That is, when the substrate is irradiated with the laser light, the adhesive expands due to the heat of the laser light, thereby generating a gap between the adhesive and the substrate, and as a result, bubbles reaching the pixel region of the liquid crystal display panel are generated between the adhesive and the substrate. When such bubbles are generated, display defects may occur in the liquid crystal display panel.

In order to solve the above problem, the technique disclosed in patent document 1 reduces the power of the laser beam when forming the modified region in the adhesive, as compared with when forming the modified region in another layer.

However, in the above method, the generation of bubbles from the adhesive may not be sufficiently prevented.

The invention aims to suppress product defects caused by bubbles generated from an adhesive when a glass substrate bonded with the adhesive is subjected to laser processing.

Means for solving the problems

Hereinafter, a plurality of embodiments will be described as means for solving the problem. These means can be arbitrarily combined as needed.

A scribing method according to an aspect of the present invention is a method of forming a scribing line on a composite glass substrate including a 1 st glass substrate, a 2 nd glass substrate, and an annular adhesive layer provided between the 1 st glass substrate and the 2 nd glass substrate and adhering the two substrates to each other at a predetermined substrate cutting line. The method comprises the following steps.

A space section forming step of performing laser processing on the annular adhesive layer to form a space section extending from the line or the vicinity of the substrate cutting line toward the outside of the annular adhesive layer to the edge and opening to the outside;

a scribing line forming step of performing laser processing on the 1 st glass substrate along the substrate cutting scheduled line to form a processing mark on the 1 st glass substrate so as to communicate with the space portion; and

the 2 nd scribe line forming step of performing laser processing on the 2 nd glass substrate along the substrate cutting scheduled line to form a processing mark on the 2 nd glass substrate.

In this method, first, a space is formed in the adhesive layer by laser processing the adhesive layer in the space forming step. Next, in the 1 st scribing line forming step, the 1 st glass substrate is laser-processed, whereby a processing mark is formed on the 1 st glass substrate. In this case, since the process mark communicates with the space portion, the gas generated from the adhesive layer in the 1 st scribe line forming step is discharged to the outside of the annular adhesive layer through the space portion. Therefore, the sealing layer remaining in the product is less likely to cause peeling of the seal by the gas.

In the 1 st scribe line forming step, laser pulses may be sequentially irradiated to positions separated from each other along the line to cut the substrate.

In this method, a scribe line is formed from a plurality of processing marks.

In the space portion forming step, the space portion may be formed at a position corresponding to a predetermined irradiation position of the laser pulse before the irradiation of the laser pulse in the 1 st scribe line forming step. The position corresponding to the irradiation predetermined position means a position where at least a part approaches or overlaps each other.

In this method, since a space is formed corresponding to each processing mark, the above-described effect is improved.

For example, after the plurality of space portions are formed in the space portion forming step, the plurality of space portions and the plurality of processing marks may be formed by forming the plurality of processing marks in the 1 st scribe line forming step. As another example, a plurality of space portions and a plurality of machining marks may be formed by repeating the formation of one machining mark after one space portion is formed.

The space portion may have a plurality of 1 st space portions formed of a plurality of processing marks extending in the width direction of the annular adhesive layer.

The 1 st scribing line may have a plurality of 2 nd space portions formed of a plurality of processing marks extending in the up-down direction on the 1 st glass substrate.

The 1 st and 2 nd space portions may communicate with each other.

The scribing processing device of another aspect of the invention has a laser device and a controller. The controller causes the laser device to execute a scribing method for forming a scribing line on a composite glass substrate, wherein the composite glass substrate comprises a 1 st glass substrate, a 2 nd glass substrate and an annular bonding layer which bonds the 1 st glass substrate and the 2 nd glass substrate and is arranged at a predetermined substrate cutting line.

The scribing method has the following steps.

a 1 st scribe line forming step of performing laser processing on a 1 st glass substrate along a substrate cutting scheduled line to form a processing mark on the 1 st glass substrate so as to communicate with the space portion; and

a 2 nd scribing line forming step of laser-processing the 2 nd glass substrate along the substrate cutting scheduled line to form a processing mark on the 2 nd glass substrate

In this apparatus, the same effects as those of the above-described method can be obtained.

Effects of the invention

In the scribing method and apparatus of the present invention, when laser processing is performed on a glass substrate bonded with an adhesive, product defects due to bubbles generated from the adhesive can be suppressed.

Drawings

Fig. 1 is a schematic view of a laser processing apparatus according to embodiment 1 of the present invention.

Fig. 2 is a plan view of the glass substrate according to embodiment 1.

Fig. 3 is a sectional view taken along the line III-III of fig. 2.

Fig. 4 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing.

Fig. 5 is a partial sectional view of a glass substrate.

Fig. 6 is a partial sectional view of a glass substrate.

Fig. 7 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing.

Fig. 8 is a partial sectional view of a glass substrate.

Fig. 9 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing.

Fig. 10 is a partial sectional view of a glass substrate.

Fig. 11 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 2.

Fig. 12A is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 2.

Fig. 12B is a partial plan view of the glass substrate for explaining the sequence of the pulse processing according to embodiment 2.

Fig. 12C is a partial plan view of the glass substrate for explaining the sequence of the pulse processing according to embodiment 2.

Fig. 13 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 2.

Fig. 14 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 3.

Fig. 15 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 4.

Fig. 16 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 5.

Fig. 17 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 6.

Fig. 18 is a partial plan view of a glass substrate for explaining the pulse processing procedure according to embodiment 7.

Fig. 19 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 8.

Fig. 20 is a schematic view of a laser processing apparatus according to embodiment 9.

Fig. 21 is a partial perspective view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 9.

Fig. 22 is a partial side view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 9.

Fig. 23 is a partial front view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 9.

Detailed Description

1. Embodiment 1

(1) Integral structure of laser processing device

Fig. 1 shows an overall configuration of a laser processing apparatus 1 for cutting a glass substrate according to an embodiment of the present invention. Fig. 1 is a schematic view of a laser processing apparatus according to embodiment 1 of the present invention.

The laser processing apparatus 1 includes a laser apparatus 3. The laser device 3 includes a laser oscillator 15 for irradiating the glass substrate G with a laser beam, and a laser control unit 17. The laser oscillator 15 is, for example, a picosecond laser having a wavelength of 340nm to 1100 nm. The laser control unit 17 can control the driving of the laser oscillator 15 and the laser power.

The laser device 3 includes a transmission optical system 5 that transmits laser light to a mechanical drive system described later. The transmission optical system 5 includes, for example, a condenser lens 19, a plurality of mirrors (not shown), a prism (not shown), and the like.

The laser processing apparatus 1 includes a drive mechanism 11, and the drive mechanism 11 changes the condensing angle of the laser beam by moving the position of the lens in the optical axis direction.

The laser processing apparatus 1 includes a processing table 7 on which a glass substrate G is placed. The machining table 7 is moved by a table driving unit 13. The table driving unit 13 includes a moving device (not shown) that moves the machining table 7 in a horizontal direction with respect to a bed (not shown). The moving device is a well-known mechanism having a guide rail, a motor, and the like.

The laser processing apparatus 1 includes a control unit 9. The controller 9 is a computer system having a processor (e.g., CPU), a storage device (e.g., ROM, RAM, HDD, SSD, etc.), and various interfaces (e.g., a/D converter, D/a converter, communication interface, etc.). The controller 9 executes a program stored in a storage unit (corresponding to a part or all of a storage area of the storage device) to perform various control operations.

The controller 9 may be constituted by one processor, or may be constituted by a plurality of independent processors for respective controls.

The controller 9 can control the laser controller 17. The control unit 9 can control the drive mechanism 11. The control unit 9 can control the table driving unit 13.

Although not shown, a sensor for detecting the size, shape, and position of the glass substrate G, a sensor and a switch for detecting the state of each device, and an information input device are connected to the control unit 9.

(2) Glass substrate

The glass substrate G will be described with reference to fig. 2 to 4. Fig. 2 is a plan view of the glass substrate according to embodiment 1. Fig. 3 is a sectional view taken along the line III-III of fig. 2. Fig. 4 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing.

The glass substrate G is a large-area bonded glass substrate used for manufacturing a flat panel display (hereinafter referred to as FPD) such as a liquid crystal display, a plasma display, and an organic EL display. A plurality of unit display substrates 37 to be FPDs are formed on the glass substrate G in advance, and then divided for each unit display substrate 37.

As shown in fig. 3, the glass substrate G has a 1 st glass substrate 31 and a 2 nd glass substrate 33. The 1 st glass substrate 31 and the 2 nd glass substrate 33 are, for example, alkali-free glass or soda glass. The 1 st glass substrate 31 and the 2 nd glass substrate 33 have a thickness in the range of 0.1mm to 0.7mm, for example. The 1 st glass substrate 31 and the 2 nd glass substrate are arranged to overlap each other with a gap of a thickness of a sealing layer 35 (described later) secured therebetween.

As shown in fig. 2 to 4, the glass substrate G has a sealing layer 35. The sealing layer 35 is a normal adhesive, and is disposed along the annular edge (aligned with the line S to cut the substrate) of the unit display substrate 37 between the 1 st glass substrate 31 and the 2 nd glass substrate 33 of the glass substrates G. Thereby, the 1 st glass substrate 31 and the 2 nd glass substrate 33 are bonded to each other. In addition, the annular line S to cut the substrate is provided in a width direction region of the sealing layer 35.

The width of the sealing layer 35 is, for example, 100 μm to 160 μm. The thickness of the sealing layer 35 is, for example, 2 μm to 6 μm.

(3) Brief description of the scribing line Forming method

A method of forming a scribe line by the laser device 3 will be described schematically with reference to fig. 4 to 6. Fig. 5 and 6 are partial sectional views of the glass substrate.

The laser processing apparatus 1 forms a 1 st scribing line S1 and a 2 nd scribing line S2 on the 1 st glass substrate 31 and the 2 nd glass substrate 33, respectively, by irradiating the glass substrate G with laser light along the ring-shaped edge (i.e., on the sealing layer 35) (fig. 6, 9, and 10). The reason why the sealing layer 35 is irradiated with laser light is because of a demand for a narrow frame of a liquid crystal display panel or the like. Then, by dividing the 1 st scribing line S1 and the 2 nd scribing line S2, the unit display substrate 37 composed of the 1 st glass substrate 31 and the 2 nd glass substrate 33 whose edges are bonded to each other via the sealant 35 is obtained.

More specifically, the step of forming the 1 st scribing line S1 and the 2 nd scribing line S2 is a step of: from the state shown in fig. 4 and 5, the internal processing of the 1 st glass substrate 31 and the 2 nd glass substrate 33 is intermittently performed in the planar direction by the pulse using the laser device 3 (that is, laser pulses are sequentially irradiated to positions separated from each other along the line S to cut the substrate). As shown in fig. 6, in each laser-irradiated portion, processing marks 39 and 41 extending long along the optical axis are formed in the 1 st glass substrate 31 and the 2 nd glass substrate 33, respectively. In addition, the processing mark 39 extends between the surfaces of the 1 st glass substrate 31. The processing mark 41 extends between the surfaces of the 2 nd glass substrate 33.

(4) Detailed description of the method of forming a scribe line

The scribing line forming method will be described in detail with reference to fig. 7 to 10. Fig. 7 and 9 are plan views of glass substrates for explaining the sequence of the pulse processing. Fig. 8 and 10 are partial sectional views of the glass substrate.

The scribing method includes a space portion forming step and a scribe line forming step.

(4-1) space Forming step

The process of forming the space portion 43 in the seal layer 35 from the state shown in fig. 4 and 5 will be described.

The space portion forming step is a step of: the seal layer 35 is laser-processed to form a space portion 43 extending from the substrate cutting line S or the vicinity thereof toward the outside of the annular seal layer 35 to the edge and opened to the outside. The space portion 43 has a slit shape or a groove shape. As shown in fig. 7 and 8, the formation position of the space portion 43 corresponds to the planned irradiation position of the laser pulse in the scribe line forming step. The laser beam is irradiated from the 1 st glass substrate 31 side.

More specifically, as shown in fig. 7, the space portion 43 extends in a direction perpendicular to the line S. As shown in fig. 8, the space portion 43 is formed to be offset toward the 1 st glass substrate 31. The space portion 43 is formed on the unit display substrate 37 side without exceeding the line to cut the substrate S. Therefore, the sealant 35 remains on the unit display substrate 37 side beyond the line to cut the substrate S. Further, if the space portion 43 is minute, it may exceed the line to cut the substrate S.

The sealing conditions will be described. The processing speed is 500 mm/s-4000 mm/s. The line pitch is 20 to 200. mu.m, preferably 40 to 100. mu.m. The laser output is 30W-100W.

(4-2) scribing line Forming step

A step of forming the 1 st scribing line S1 on the 1 st glass substrate 31 will be described.

Specifically, the step of forming the 1 st scribe line S1 is a step of: the internal processing of the 1 st glass substrate 31 is intermittently performed in the planar direction by a pulse using the laser device 3 (that is, laser pulses are sequentially irradiated to positions separated from each other along the line S to cut the substrate). As shown in fig. 10, in each laser-irradiated portion, a processing mark 39 extending long along the optical axis is formed in the 1 st glass substrate 31. Further, the processing mark 39 extends as a continuous line between the surfaces of the 1 st glass substrate 31.

In the glass substrate G, the 1 st scribing line S1 and the 2 nd scribing line S2 are formed in a ring shape. However, the scribe line may have a shape other than a ring shape.

The processing conditions of the scribe line will be described. The processing speed is 100 mm/s-500 mm/s. The distance between the pulses is 2-10 μm. The laser output is 20W-100W.

In the scribe line forming step described above, when the space portion 43 or its vicinity is irradiated with a laser pulse, as shown in fig. 9 and 10, the processing mark 39 communicates with the space portion 43. Specifically, the laser pulse is irradiated so as to overlap with the inner end of the space portion 43 or overlap with the vicinity thereof. As a result, the gas generated from the sealing layer 35 in the scribe line forming step is discharged to the outside of the annular sealing layer 35 through the space portion 43. Therefore, seal peeling due to gas is less likely to occur in the seal layer 35 remaining on the unit display substrate 37 (the air layer is formed between the seal layer 35 and the 1 st glass substrate 31). The reason why the gas is generated from the sealing layer 35 in the scribe line forming step is that the laser light is not completely absorbed by the 1 st glass substrate 31 and heats the sealing layer 35.

Specifically, as shown in fig. 9, one end of the space portion 43 is continuous with the machining mark 39.

The method of forming the 2 nd scribe line S2 is also performed in the same manner as described above.

After the scribing line forming step described above, laser processing for cutting the sealing layer 35 along the 1 st scribing line S1 and the 2 nd scribing line S2 may be performed. Instead of performing such laser processing, the sealing layer 35 may be torn off during glass division.

(4-3) modification

In the above embodiment, one end of the space portion 43 reaches the line to cut the substrate S, but the one end of the space portion 43 may be continuous with the processing mark 39 on the rear side, and may be positioned in front of the line to cut the substrate S and close to the line to cut the substrate S.

In the above embodiment, the space portion 43 is formed to be offset toward the 1 st glass substrate 31 side, but may penetrate from the 1 st glass substrate 31 to the 2 nd glass substrate 33.

In the space portion forming step of the above embodiment, the plurality of space portions are continuously formed for one seal layer 35, but the plurality of space portions may be continuously formed for the plurality of seal layers 35 in a lump.

In the above embodiment, the space portion extends perpendicular to the scribe line direction in a plan view. However, the direction in which the space portion extends in plan view is not particularly limited.

2. Embodiment 2

In embodiment 1, the space portion in the seal layer extends in the vertical direction in a plan view, but the processing method of the seal layer, that is, the method of forming the space portion is not limited to this.

Embodiment 2 will be described as a modification of the method of forming the space portion with reference to fig. 11 to 13. Specifically, in embodiment 2, a method of forming a single space portion by a plurality of times of laser processing will be described. Fig. 11 to 13 are partial plan views of a glass substrate for explaining the sequence of the pulse processing according to embodiment 2.

The configuration of the laser processing apparatus 1, the configuration and type of the glass substrate G, the scribe line forming step, and the like are common to those of embodiment 1. Therefore, the description is omitted.

Hereinafter, a process of forming a space portion in the seal layer 35 from the state shown in fig. 4 and 5 of embodiment 1 will be described.

The space portion forming step is a step of: the seal layer 35 is laser-processed to form a space portion 43 extending from the substrate cutting line S or the vicinity thereof toward the outside of the annular seal layer 35 to the edge and opened to the outside (see fig. 7 and 8 of embodiment 1). The space portion 43 has a slit shape or a groove shape. As shown in fig. 7 and 8 of embodiment 1, the formation position of the space portion 43 corresponds to the planned irradiation position of the laser pulse in the scribe line formation step. The laser beam is irradiated from the 1 st glass substrate 31 side.

First, an irradiation pattern of laser light in the present embodiment will be described with reference to fig. 11. In the present embodiment, as shown in fig. 11, the laser beam is irradiated so as to simultaneously process three portions, i.e., the 1 st portion 45, the 2 nd portion 47, and the 3 rd portion 49. The laser light irradiating the 1 st, 2 nd, and 3

rd portions

45, 47, and 49 is formed by branching one laser light using DOE, a spatial light modulator, or the like, for example. The 1 st portion 45 and the 2 nd portion 47, and the 2 nd portion 47 and the 3 rd portion 49 are separated by a predetermined pitch P in the extending direction of the sealing layer 35. The 1 st portion 45, the 2 nd portion 47, and the 3 rd portion 49 are each about 1/3 times the distance between the widthwise outer edge of the seal layer 35 and the line S to cut the substrate. The 1 st portion 45 is located on the outer edge of the seal layer 35 in the width direction, the 2 nd portion 47 is located closer to the line S than the 1 st portion 45, and the 3 rd portion 49 is located closer to the line S than the 2 nd portion 47.

Next, a laser processing method according to the present embodiment will be described with reference to fig. 12A to 12C. While the substrate is irradiated with the pulse laser light according to the laser light irradiation pattern shown in fig. 11, the substrate is moved from the outside of the sealing layer 35 to the side (arrow V) from the 1 st portion 45 toward the 3 rd portion 49 along the extending direction of the sealing layer 35. At this time, the oscillation interval of the pulse laser and the moving speed of the substrate are set so that the substrate is moved by the pitch P only within the time interval in which the pulse laser is oscillated.

Fig. 12A shows the state after the sealing layer 35 is first processed by the laser of part 1 45. At this time, the 1 st portion 45a, the 2 nd portion 47a, and the 3 rd portion 49a are irradiated with pulsed laser light. First, in the 1 st portion 45a, the sealing layer 35 is irradiated with laser light, whereby a part of the sealing layer 35 is removed. In addition, at this time, the 2 nd and 3

rd portions

47a and 49a irradiated at the same time are located outside the sealing layer 35.

Fig. 12B shows a state where the pulse laser is subsequently oscillated to irradiate the 1 st portion 45B, the 2 nd portion 47B, and the 3 rd portion 49B with the pulse laser. The 1 st portion 45b is formed at a position separated from the 1 st portion 45a by a pitch P, the 2 nd portion 47b is formed beside the 1 st portion 45a, and the 3 rd portion 49b is located outside the sealing layer 35.

Fig. 12C shows a state in which the pulse laser is oscillated and the 1 st portion 45C, the 2 nd portion 47C, and the 3 rd portion 49C are irradiated with the pulse laser after the state shown in fig. 12B. The 1 st portion 45c is formed at a position separated from the 1 st portion 45b by the pitch P, the 2 nd portion 47c is formed beside the 1 st portion 45b, and the 3 rd portion 49c is located beside the 2 nd portion 47 b. At this time, the 1 st portion 45a, the 2 nd portion 47b, and the 3 rd portion 49c form a space portion extending from the substrate cutting line S or the vicinity thereof toward the outside of the seal layer 35 to the edge and opened to the outside.

Fig. 13 shows a state in which the above-described processing is repeated, and the respective portions are continued at a plurality of positions, and as a result, a plurality of space portions are formed.

The shape, position, depth, and processing conditions of the completed space portion are the same as those of embodiment 1.

In this embodiment, the same effects as those of embodiment 1 can be obtained.

In the above embodiment, the laser processing is divided into three times to form one space portion, but the number of laser processing is not particularly limited.

3. Embodiment 3

Embodiment 3 as a modification of the space portion forming step will be described with reference to fig. 14. Fig. 14 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 3.

As shown in fig. 14, the planar shape of space 51 is formed by a plurality of inclined straight lines in the same direction. The space 51 extends from the line S to be cut and its vicinity toward the outside of the annular seal layer 35 to the edge and is open on the outside.

In this embodiment, the same effects as those of embodiment 1 can be obtained.

4. Embodiment 4

Embodiment 4 as a modification of the space portion forming step will be described with reference to fig. 15. Fig. 15 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 4.

As shown in fig. 15, the planar shape of the space portion 53 is constituted by one zigzag line. Each part of the space 53 extends from the substrate cutting line S or the vicinity thereof to the outside of the annular seal layer 35 to the edge and is open to the outside.

In this embodiment, the same effects as those of embodiment 1 can be obtained.

5. Embodiment 5

Embodiment 5 as a modification of the space portion forming step will be described with reference to fig. 16. Fig. 16 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 5.

As shown in fig. 16, the planar shape of the space portion 55 is constituted by a wavy line. Each part of the space 55 extends from the substrate cutting line S or the vicinity thereof to the outside of the annular seal layer 35 to the edge and is open to the outside.

In this embodiment, the same effects as those of embodiment 1 can be obtained.

6. Embodiment 6

Embodiment 6 as a modification of the space portion forming step will be described with reference to fig. 17. Fig. 17 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 6.

As shown in fig. 17, the planar shape of the space portion 57 is constituted by two zigzag lines crossing each other. Each part of the space portion 57 extends from the substrate cutting line S or the vicinity thereof to the outside of the annular seal layer 35 to the edge and is open to the outside.

The same effects as those of embodiment 1 can be obtained in this embodiment as well.

7. Embodiment 7

Embodiment 6 as a modification of the space portion forming step will be described with reference to fig. 18. Fig. 18 is a partial plan view of a glass substrate for explaining the pulse processing procedure according to embodiment 7.

As shown in fig. 18, the planar shape of the space portion 59 is constituted by one spiral line extending in the seal layer extension direction. Each part of the space portion 59 extends from the substrate cutting line S or its vicinity to the outside of the annular seal layer 35 to the edge and is open to the outside.

In this embodiment, the seal layer width direction outer side portion of the space portion 59 coincides with or is close to the width direction outer side edge of the seal layer 35.

8. Embodiment 8

Embodiment 6 as a modification of the space portion forming step will be described with reference to fig. 19. Fig. 19 is a partial plan view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 8.

As shown in fig. 19, the planar shape of the space portion 61 is a part of one spiral line extending in the seal layer extension direction. Each part of the space portion 61 extends from the substrate cutting line S or the vicinity thereof to the outside of the annular seal layer 35 to the edge and is open to the outside.

In this embodiment, one spiral line constituting the space portion 61 is also positioned on the other unit display substrate 37 side as a virtual line. That is, the space portion 61 is not a complete line in the sealing layer 35, but a plurality of curves extending from the substrate cutting line S or the vicinity thereof toward the outside of the annular sealing layer 35 to the edge and opening to the outside.

9. Embodiment 9

In embodiments 1 to 8, a plurality of machining marks are formed as scribe lines after the step of forming a plurality of space portions, but the formation of the space portions and the formation of the machining marks may be performed in one step.

Such an embodiment will be described with reference to fig. 20. Fig. 20 is a schematic view of a laser processing apparatus according to embodiment 9.

The laser processing apparatus 1A includes a spatial light modulator 21 for modulating laser light emitted from the laser apparatus 3. The Spatial Light Modulator 21 is, for example, a reflective type, and may be a Spatial Light Modulator (SLM) of a reflective Liquid Crystal (LCOS). The spatial light modulator 21 modulates laser light incident from the horizontal direction and reflects the modulated laser light downward.

The laser processing apparatus 1A includes a driving unit 23. The drive unit 23 applies a predetermined voltage to each pixel electrode of the spatial light modulator 21 to cause the liquid crystal layer to display a predetermined modulation pattern, thereby modulating the laser light as desired by the spatial light modulator 21. Here, the modulation pattern to be displayed on the liquid crystal layer is derived in advance from, for example, the position where the processing mark is to be formed, the wavelength of the laser beam to be irradiated, the material of the processing object, the refractive index of the transmission optical system 5 or the processing object, and the like, and is stored in the control unit 9.

In this method, the space portion and the scribe line can be simultaneously manufactured using the laser device 3.

The space portion forming method will be specifically described with reference to fig. 21 to 23.

Fig. 21 is a partial perspective view of a glass substrate for explaining the sequence of the pulse processing according to embodiment 9, fig. 22 is a partial side view, and fig. 23 is a partial front view of the glass substrate for explaining the sequence of the pulse processing according to embodiment 9.

Specifically, first, the 1 st space portion 63a is formed. The 1 st space portion 63a (an example of the 1 st space portion) is a plurality of processing marks formed in the seal layer 35, and is arranged in the seal layer width direction.

Next, a 1 st scribe line forming processing mark 65a is formed. The 1 st scribe line forming process mark 65a is a 2 nd space portion composed of a plurality of process marks formed on the 1 st glass substrate 31, and is arranged in the vertical direction. The 1 st scribe line forming process mark 65a is located at a position which coincides with the line to cut the substrate S in the seal layer width direction and is slightly shifted from the 1 st space portion 63a in the seal layer extending direction.

As a result, the 1 st scribe forming process mark 65a communicates with the 1 st space portion 63 a. As a result, the gas generated from the sealing layer 35 in the scribe line forming step is discharged to the outside of the annular sealing layer 35 through the 1 st space portion 63 a. Therefore, seal peeling due to gas is less likely to occur in the seal layer 35 remaining on the unit display substrate 37 (the air layer is formed between the seal layer 35 and the 1 st glass substrate 31).

Next, a 2 nd space portion 63b (an example of a 1 st space portion) is formed. The 2 nd space portion 63b is a plurality of processing marks formed in the seal layer 35, and is arranged in the seal layer width direction. The 2 nd space portion 63b is located at a position shifted from the 1 st space portion 63a in the seal layer extending direction.

Next, a 2 nd scribe line forming processing mark 65b is formed. The 2 nd scribe line forming process mark 65b is a 2 nd space portion composed of a plurality of process marks formed on the 1 st glass substrate 31, and is arranged in the vertical direction. The 2 nd scribe line forming process mark 65b is located at a position which coincides with the line to cut the substrate S in the seal layer width direction and is slightly shifted from the 2 nd space portion 63b in the seal layer extending direction.

As a result, the 2 nd scribe line forming process mark 65b communicates with the 2 nd space portion 63 b. As a result, the gas generated from the sealing layer 35 in the scribe line forming step is discharged to the outside of the annular sealing layer 35 through the 2 nd space portion 63 b.

Next, a 3 rd space portion 63c (an example of a 1 st space portion) is formed. The 3 rd space portion 63c is a plurality of processing marks formed in the seal layer 35, and is arranged in the seal layer width direction. The 3 rd space portion 63c is located at a position shifted from the 2 nd space portion 63b in the seal layer extending direction.

Next, a 3 rd scribe line forming processing mark 65c is formed. The 3 rd scribe line forming process mark 65c is a 2 nd space portion composed of a plurality of process marks formed on the 1 st glass substrate 31, and is arranged in the vertical direction. The 3 rd scribe line forming process mark 65c is located at a position which coincides with the line to cut the substrate S in the seal layer width direction and is slightly shifted from the 3 rd space portion 63c in the seal layer extending direction.

As a result, the 3 rd scribe line forming process mark 65c communicates with the 3 rd space portion 63 c. As a result, the gas generated from the sealing layer 35 in the scribe line forming step is discharged to the outside of the ring-shaped sealing layer 35 through the 3 rd space portion 63 c.

The same procedure is performed below.

The space portion and the scribe line forming process mark may be aligned in the seal layer extending direction.

The amount of displacement between the space and the scribe line forming process mark in the seal layer extending direction is not particularly limited as long as the gas generated from the seal layer 35 can be released to the outside.

10. Other embodiments

While one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be arbitrarily combined as needed.

The contents of the 1 st scribing line forming method and the 2 nd scribing line forming method may be different. For example, the space portion forming step may be omitted in the 2 nd scribe line forming method, or a space portion forming step different from the space portion forming step in the 1 st scribe line forming method may be employed.

Industrial applicability

The present invention can be widely applied to a method and an apparatus for scribing two glass substrates bonded together via an adhesive layer.

Description of the reference symbols

1: a laser processing device; 3: a laser device; 5: a transmission optical system; 7: a machining workbench; 9: a control unit; 11: a drive mechanism; 13: a table driving section; 15: a laser oscillator; 17: a laser control unit; 19: a condenser lens; 21: a spatial light modulator; 23: a drive section; 31: a 1 st glass substrate; 33: a 2 nd glass substrate; 35: a sealing layer; 37: a unit display substrate; 39: machining a mark; 43: a space section; g: a glass substrate; s1: 1, scribing; s2: and 2, scribing.

Claims

1. A scribing method for forming a scribing line on a composite glass substrate having a 1 st glass substrate, a 2 nd glass substrate, and an annular adhesive layer provided between the 1 st glass substrate and the 2 nd glass substrate and adhering the two substrates to each other at a predetermined substrate cutting line,

the scribing method comprises the following steps:

a space portion forming step of performing laser processing on the annular adhesive layer to form a space portion that is opened by extending from the line or vicinity where the substrate is to be cut toward the outside of the annular adhesive layer to the edge;

a 1 st scribe line forming step of performing laser processing on the 1 st glass substrate along the planned substrate cutting line to form a processing mark on the 1 st glass substrate so as to communicate with the space portion; and

and a 2 nd scribe line forming step of performing laser processing on the 2 nd glass substrate along the substrate cutting scheduled line to form a processing mark on the 2 nd glass substrate.

2. The scoring processing method according to claim 1,

in the 1 st scribe line forming step, laser pulses are sequentially irradiated to positions separated from each other along the line to cut the substrate.

3. The scoring processing method according to claim 1 or 2,

in the space portion forming step, the space portion is formed at a position corresponding to a predetermined irradiation position of the laser pulse before the irradiation of the laser pulse in the 1 st scribe line forming step.

4. The scoring processing method according to any one of claims 1 to 3,

the space portion has a plurality of No. 1 space portions formed by a plurality of processing marks extending along the width direction of the annular bonding layer,

the 1 st scribing line has a plurality of 2 nd space parts formed by a plurality of processing marks extending in the up-down direction on the 1 st glass substrate,

the 1 st space part and the 2 nd space part communicate with each other.

5. A scribing processing device, comprising:

a laser device; and

a controller that causes the laser device to execute a scribing method for forming a scribing line on a composite glass substrate having a 1 st glass substrate, a 2 nd glass substrate, and an annular adhesive layer that bonds the 1 st glass substrate and the 2 nd glass substrate together and is provided at a predetermined substrate cutting line,

the scribing method includes the following steps:

6. The score processing device of claim 5,

7. The scoring processing device of claim 5 or 6,

8. The score processing device of any one of claims 5 to 7, wherein,

the 1 st space part and the 2 nd space part communicate with each other.