JP2002293560A5 - - Google Patents

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JP2002293560A5
JP2002293560A5 JP2001094075A JP2001094075A JP2002293560A5 JP 2002293560 A5 JP2002293560 A5 JP 2002293560A5 JP 2001094075 A JP2001094075 A JP 2001094075A JP 2001094075 A JP2001094075 A JP 2001094075A JP 2002293560 A5 JP2002293560 A5 JP 2002293560A5
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cutting
glass substrate
laser
respect
cutting method
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JP2001094075A
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JP2002293560A (en
JP3991608B2 (en
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Claims (15)

ガラス基板の切断予定線に沿ってレーザ光を照射して当該パネルを切断するレーザ切断方法であって、
前記ガラス基板に対する切断開始位置から切断終了位置までの間で前記レーザ光による切断条件を変更することを特徴とするレーザ切断方法。A laser cutting method of cutting the panel by irradiating a laser beam along a planned cutting line of the glass substrate,
A laser cutting method characterized by changing a cutting condition by the laser beam between a cutting start position and a cutting end position with respect to the glass substrate. 請求項１において、前記ガラス基板に対する切断結果を検査し、その検査結果を、それ以降に行うガラス基板に対する切断条件にフィードバックすることを特徴とするレーザ切断方法。The laser cutting method according to claim 1, wherein a cutting result for the glass substrate is inspected, and the inspection result is fed back to a subsequent cutting condition for the glass substrate. 請求項１または２において、前記ガラス基板に対する切断開始位置から切断終了位置までの間で前記レーザ光のパワーを変化させることを特徴とするレーザ切断方法。3. The laser cutting method according to claim 1, wherein the power of the laser beam is changed between a cutting start position and a cutting end position with respect to the glass substrate. 請求項３において、前記ガラス基板に対する切断開始位置付近では前記レーザ光のパワーを逓増することを特徴とするレーザ切断方法。4. The laser cutting method according to claim 3, wherein the power of the laser beam is gradually increased near a cutting start position with respect to the glass substrate. 請求項３または４において、前記ガラス基板に対する切断終了位置付近では前記レーザ光のパワーを逓減することを特徴とするレーザ切断方法。5. The laser cutting method according to claim 3, wherein the power of the laser beam is gradually reduced near a cutting end position with respect to the glass substrate. 請求項１ないし５のいずれかにおいて、前記ガラス基板に対する切断開始位置から切断終了位置までの間で前記ガラス基板上における前記レーザ光の照射位置の移動速度を変化させることを特徴とするレーザ切断方法。6. The laser cutting method according to claim 1, wherein a moving speed of an irradiation position of the laser beam on the glass substrate is changed between a cutting start position and a cutting end position with respect to the glass substrate. . 請求項６において、前記ガラス基板に対する切断開始位置付近では前記ガラス基板上における前記レーザ光の照射位置の移動速度を逓増することを特徴とするレーザ切断方法。7. The laser cutting method according to claim 6, wherein the moving speed of the irradiation position of the laser beam on the glass substrate is gradually increased near the cutting start position with respect to the glass substrate. 請求項６または７において、前記ガラス基板に対する切断終了位置付近では前記ガラス基板上における前記レーザ光の照射位置の移動速度を逓減することを特徴とするレーザ切断方法。8. The laser cutting method according to claim 6, wherein the moving speed of the irradiation position of the laser light on the glass substrate is gradually reduced near the cutting end position with respect to the glass substrate. 請求項１ないし８のいずれかにおいて、２枚の前記ガラス基板を重ねて貼り合わせることでパネルが構成され、
当該パネルの表面側および裏面側の双方に対して前記切断予定線に沿って前記レーザ光をそれぞれ照射して当該パネルを切断することを特徴とするレーザ切断方法。In any one of Claims 1 thru | or 8, a panel is comprised by laminating | stacking and bonding the two said glass substrates,
A laser cutting method, wherein the panel is cut by irradiating both the front side and the back side of the panel with the laser beam along the planned cutting line. 請求項１ないし９のいずれかにおいて、前記ガラス基板は、電気光学物質を保持するための基板であることを特徴とするレーザ切断方法。10. The laser cutting method according to claim 1, wherein the glass substrate is a substrate for holding an electro-optical material. 請求項１０において、前記電気光学物質は、液晶であることを特徴とするレーザ切断方法。11. The laser cutting method according to claim 10, wherein the electro-optic material is a liquid crystal. 請求項１０または１１に規定するレーザ切断方法を用いて、電気光学物質を保持するためのガラス基板を切断することを特徴とする電気光学装置の製造方法。12. A method for manufacturing an electro-optical device, comprising: cutting a glass substrate for holding an electro-optical material by using the laser cutting method defined in claim 10. 請求項１２に規定する方法により製造されたことを特徴とする電気光学装置。An electro-optical device manufactured by the method defined in claim 12. 請求項１３に規定する電気光学装置を表示部として備えていることを特徴とする電子機器。14. An electronic apparatus comprising the electro-optical device defined in claim 13 as a display unit. ガラス基板の切断予定線に沿ってレーザ光を照射して当該ガラス基板を切断するレーザ切断装置であって、
レーザ照射手段と、該レーザ照射手段から出射されたレーザ光の前記ガラス基板に対する照射位置を移動させる駆動手段と、該駆動手段および前記レーザ照射手段を制御して、前記ガラス基板に対する切断開始位置から切断終了位置までの間で前記レーザ光による切断条件を変更する制御手段とを有していることを特徴とするレーザ切断装置。A laser cutting device that cuts the glass substrate by irradiating laser light along a planned cutting line of the glass substrate,
A laser irradiation means, a drive means for moving the irradiation position of the laser light emitted from the laser irradiation means on the glass substrate, and the drive means and the laser irradiation means are controlled to start cutting from the glass substrate. And a control means for changing a cutting condition by the laser light up to a cutting end position.
JP2001094075A 2001-03-28 2001-03-28 LASER CUTTING METHOD, ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, ELECTRONIC DEVICE, AND LASER CUTTING DEVICE Expired - Fee Related JP3991608B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001094075A JP3991608B2 (en) 2001-03-28 2001-03-28 LASER CUTTING METHOD, ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, ELECTRONIC DEVICE, AND LASER CUTTING DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001094075A JP3991608B2 (en) 2001-03-28 2001-03-28 LASER CUTTING METHOD, ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, ELECTRONIC DEVICE, AND LASER CUTTING DEVICE

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007120581A Division JP4775313B2 (en) 2007-05-01 2007-05-01 Laser cutting method

Publications (3)

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JP2002293560A JP2002293560A (en) 2002-10-09
JP2002293560A5 true JP2002293560A5 (en) 2005-02-24
JP3991608B2 JP3991608B2 (en) 2007-10-17

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JP2001094075A Expired - Fee Related JP3991608B2 (en) 2001-03-28 2001-03-28 LASER CUTTING METHOD, ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, ELECTRONIC DEVICE, AND LASER CUTTING DEVICE

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100906543B1 (en) * 2004-12-08 2009-07-07 가부시키가이샤 레이져 솔루션즈 Method of forming split originating point on object to be split, method of splitting object to be split, and method of processing object to be processed by pulse laser beam
KR100693947B1 (en) 2006-05-17 2007-03-12 케이 이엔지(주) Glass cutting method using raser
DE102007008634B3 (en) * 2007-02-16 2008-08-07 Jenoptik Automatisierungstechnik Gmbh Cutting laminated glass sheets to make liquid crystal- and other electronic displays, supports glass on worktable and cuts from above and below using laser beams and coolant jets
JP5171294B2 (en) * 2008-02-06 2013-03-27 株式会社ディスコ Laser processing method
JP5074272B2 (en) * 2008-04-15 2012-11-14 株式会社リンクスタージャパン Processing apparatus and cutting method for brittle material substrate
JP2009255114A (en) * 2008-04-15 2009-11-05 Linkstar Japan Co Ltd Brittle material substrate processing apparatus and brittle material substrate cutting method
JP5220465B2 (en) * 2008-04-15 2013-06-26 株式会社リンクスタージャパン Processing apparatus and processing method for brittle material substrate
KR101010310B1 (en) * 2008-05-06 2011-01-25 세메스 주식회사 Scribing apparatus, and apparatus and method for cutting substrate using the same
JP2012221912A (en) * 2011-04-14 2012-11-12 Nissan Motor Co Ltd Electrode manufacturing method and electrode manufacturing device
CN113369712B (en) * 2021-06-23 2023-03-24 业成科技（成都）有限公司 Laser cutting method, laser cutting device and computer readable storage medium

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