CN113369712B - Laser cutting method, laser cutting device and computer readable storage medium - Google Patents
Laser cutting method, laser cutting device and computer readable storage medium Download PDFInfo
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- CN113369712B CN113369712B CN202110699385.5A CN202110699385A CN113369712B CN 113369712 B CN113369712 B CN 113369712B CN 202110699385 A CN202110699385 A CN 202110699385A CN 113369712 B CN113369712 B CN 113369712B
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000003860 storage Methods 0.000 title claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 186
- 230000003287 optical effect Effects 0.000 claims abstract description 159
- 230000000149 penetrating effect Effects 0.000 claims abstract description 11
- 238000004364 calculation method Methods 0.000 claims description 30
- 238000004590 computer program Methods 0.000 claims description 7
- 238000012634 optical imaging Methods 0.000 abstract description 8
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- 230000001678 irradiating effect Effects 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Abstract
The invention relates to a laser cutting method, a laser cutting device and a computer readable storage medium, wherein the method comprises the following steps: controlling a laser cutting device to cut the film layer along the cutting line with preset initial strength, detecting a current optical signal value penetrating through the film layer, calculating the current optical signal value and the preset optical signal value, identifying whether a first section with an optical signal variation exceeding a preset threshold value and a second section with the optical signal variation not exceeding the preset threshold value exist in the film layer, if the first section exists, controlling the laser cutting device to cut the first section at least once along the cutting line with the strength less than the preset initial strength, and if the second section exists, controlling the laser cutting device to cut the second section at least once along the cutting line with the preset initial strength. The method can solve the problem that when the film layer is subjected to laser cutting at present, the substrate corresponding to the thinner part of the film layer is easily damaged seriously, so that the appearance, the optical imaging quality, the mechanical property and the like of a product are influenced.
Description
Technical Field
The invention relates to the technical field of electronic product preparation, in particular to a laser cutting method, a laser cutting device and a computer readable storage medium.
Background
In the preparation process of lens modules and various electronic products, a laser cutting procedure is usually involved, wherein in the laser cutting, a focused high-power-density laser beam is used for irradiating the products, so that the irradiated materials are quickly melted, vaporized and ablated or reach a burning point, and meanwhile, the melted materials are blown off by virtue of high-speed airflow coaxial with the beam, thereby realizing cutting. Specifically, when a laser cutting method is used for cutting a film layer arranged on a glass substrate or an acrylic substrate, energy is usually applied to the surface of the film layer along a cutting line for multiple times, and the film layer is successively permeated through multiple times of superposition until the film layer on the whole cutting path is completely cut off. For a film layer with uneven flatness or thickness, a cutting error easily causes a thicker part to be cut through, but if the number of times of superposition cutting is increased for cutting through the thicker part, a corresponding base material at a thinner part of the film layer can be seriously damaged, so that the appearance, the optical imaging quality, the mechanical property and the like of a product are influenced.
Disclosure of Invention
Therefore, it is necessary to provide a laser cutting method, a laser cutting device, and a computer-readable storage medium for solving the problem that when a film with uneven flatness or thickness is currently laser-cut, a substrate corresponding to a thinner portion of the film is easily damaged to affect the appearance, optical imaging quality, mechanical properties, and the like of a product.
A laser cutting method, the method comprising: controlling a laser cutting device to cut the film layer along a cutting line at a preset initial strength, and detecting a current optical signal value penetrating through the film layer; calculating the current optical signal value and a preset optical signal value to identify whether a first section with an optical signal variation exceeding a preset threshold value and a second section with an optical signal variation not exceeding the preset threshold value exist in the film layer; if a first section with the optical signal variation exceeding a preset threshold value exists in the film layer, controlling the laser cutting device to cut the first section at least once along the cutting line with the intensity smaller than the preset initial intensity; if a second section with the optical signal variation not exceeding the preset threshold exists in the film layer, controlling the laser cutting device to cut the second section at least once along the cutting line with the preset initial intensity until the optical signal variation of the second section completely exceeds the preset threshold.
In one embodiment, the cutting of the second section along the cutting line is performed at least once until the variation of the optical signal of the second section all exceeds a preset threshold, and each cutting is performed by the following steps: obtaining the calculation result of the optical signal variation of the second section cut at the previous time; when the optical signal variation calculation result indicates that a section with the optical signal variation exceeding a preset threshold exists in the second section of the previous cutting, taking the section with the optical signal variation exceeding the preset threshold as a first section of the current cutting, and controlling the laser cutting device to cut the first section of the current cutting along the cutting line at the intensity smaller than the preset initial intensity; when the optical signal variation calculation result indicates that a section with the optical signal variation not exceeding the preset threshold exists in the second section cut at the previous time, the section with the optical signal variation not exceeding the preset threshold is taken as the second section cut at the current time, the laser cutting device is controlled to cut the second section cut at the current time along the cutting line with the preset initial intensity, and the optical signal variation calculation is carried out to obtain the optical signal variation calculation result cut at the current time; and the calculation result of the optical signal variation of the current cutting is used as the calculation result of the optical signal variation of the second section of the previous cutting corresponding to the next cutting.
In one embodiment, the method further comprises detecting the presence of a cut through segment in the film layer after each cut; each of the at least one cut of the first section along the cut line is accomplished by: obtaining a film layer cutting-through result of the first section cut at the previous time; when the film layer cutting-through result represents that a cut-through section exists in the first section cut at the previous time, controlling the laser cutting device to stop emitting light to the cut-through section; when the film layer cutting-through result represents that a section which is not cut through exists in the first section which is cut at the previous time, controlling the laser cutting device to cut the section which is not cut through along the cutting line with the intensity smaller than the preset initial intensity, and performing film layer cutting-through identification to obtain a film layer cutting-through result of the first section which is cut at the current time; wherein the film layer cut-through result of the current cutting is used as the film layer cut-through result of the first section of the previous cutting corresponding to the next cutting.
In one embodiment, if there is no first section in the film where the variation of the optical signal exceeds a preset threshold, the laser cutting device is controlled to cut the film along the cutting line with the preset initial intensity.
In one embodiment, if there is no second section in the film layer whose optical signal variation does not exceed the preset threshold, identifying whether there are cut-through sections and uncut sections in the film layer; if the cut section exists in the film layer, controlling the laser cutting device to stop emitting light to the cut section; and if the section which is not cut through exists in the film layer, controlling the laser cutting device to cut the section which is not cut through along the cutting line with the intensity which is less than the preset initial intensity.
In one embodiment, the laser cutting apparatus includes a light sensor located on one side of the film layer, the light sensor being configured to detect a current light signal value transmitted through the film layer.
In one embodiment, the laser cutting device comprises a position sensor; the calculating the current optical signal value and the preset optical signal value to identify whether a first section in which the optical signal variation exceeds a preset threshold and a second section in which the optical signal variation does not exceed the preset threshold exist in the film layer includes: and controlling the position sensor to acquire the position information of a first section with the light signal variation exceeding a preset threshold value and acquire the position information of a second section with the light signal variation not exceeding the preset threshold value.
In one embodiment, the controlling the position sensor to obtain the position information of the first section where the variation of the optical signal exceeds the preset threshold specifically includes: acquiring an initial time t1 and an end time t2 when the variation of the optical signal exceeds a preset threshold; and calculating the position information of the first section with the light signal variation exceeding the preset threshold according to the initial time t1, the end time t2 and the cutting speed.
In one embodiment, the preset initial intensity comprises a preset initial light intensity.
In one embodiment, the laser cutting apparatus includes a temperature sensor located on one side of the film, the temperature sensor being configured to detect a current light signal value transmitted through the film based on heat generated by laser light transmitted through the film.
In one embodiment, the laser cutting apparatus includes an optical power meter disposed on one side of the film layer, and the optical power meter is configured to detect a current optical signal value transmitted through the film layer according to an optical power of the laser light transmitted through the film layer.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the aforementioned method.
A laser cutting apparatus comprising a controller, the controller comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, carries out the steps of the method as hereinbefore described.
According to the laser cutting method, when the film is subjected to laser cutting, factors such as uneven film thickness and uneven components can possibly cause different cutting depths of different sections of the film under the action of laser light with the same intensity; or, when the film composition is not uniform, the difficulty of laser beam cutting with the same intensity is different, which also results in different cutting depths. The cutting depth of the film layer is different, and the light transmission degree after cutting is also different. After the laser cutting device is controlled to cut the film layer along the cutting line with preset initial strength, the current optical signal value penetrating through the film layer is detected, and the current optical signal value and the preset optical signal value are calculated to identify whether a first section with the optical signal variation exceeding a preset threshold value and a second section with the optical signal variation not exceeding the preset threshold value exist in the film layer. If the second section with the optical signal variation not exceeding the preset threshold exists in the film layer, the laser cutting device is controlled to cut the second section at least once along the cutting line with the preset initial intensity until the optical signal variation of the second section completely exceeds the preset threshold, so that the part with thicker thickness or the part with uneven components and difficulty in cutting through is cut for multiple times with larger intensity, and higher cutting efficiency is guaranteed. If a first section with the optical signal variation exceeding a preset threshold exists in the film layer, controlling the laser cutting device to cut the first section at least once along the cutting line with the intensity smaller than the preset initial intensity; the parts which are easy to cut through and have small thickness are cut with small strength subsequently, and the phenomenon that the appearance, the optical imaging quality, the mechanical property and the like of the product are influenced because the base materials corresponding to the parts which are easy to cut through and have small film thickness are seriously damaged is avoided.
According to the laser cutting method, after the film is cut, according to the calculation results of the optical signal variation and the preset threshold value of the film, different sections of the cut film are respectively cut, so that the sections with different calculation results of the optical signal variation are cut in a sectional mode at the next cutting time, the part with thicker thickness or the part with uneven components and difficult cutting is cut for many times with higher strength, the part with thinner thickness and the like and easy cutting is subsequently cut with lower strength, and therefore the situation that the appearance, the optical imaging quality, the mechanical property and the like of a product are influenced due to the fact that the base materials corresponding to the part with thinner thickness and easy cutting are seriously damaged is avoided while the higher cutting efficiency is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a laser cutting method according to an embodiment of the present invention;
FIG. 2 is a flowchart of the steps taken in each of the at least one cuts made in FIG. 1 to a second section along a cutting line;
FIG. 3 is a flowchart of the steps taken in each of the at least one cuts made to the first section along the cut line of FIG. 1;
FIG. 4 is a schematic diagram illustrating a relative position relationship between a light sensor and a film layer according to an embodiment of the present invention;
FIG. 5 is a flowchart illustrating another embodiment of a laser dicing method according to the present invention;
fig. 6 is a flowchart of another embodiment of the laser cutting method of the present invention.
The reference numbers indicate:
100: film layer 300: light ray sensor
200: base material
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Laser cutting is achieved by irradiating a product with a focused high power density laser beam to rapidly melt, vaporize, ablate or reach a burning point of the irradiated material, and simultaneously blowing off the molten material with the aid of a high-speed gas stream coaxial with the beam. In lens module or electronic product, when needs will set up the rete on glass substrate or ya keli substrate and cut, can adopt radium-shine cutting usually, specific cutting mode is for applying energy to the rete surface along the cutting line many times, and it permeates one by one to superpose many times, until cutting off the rete on the whole cutting path completely. For a film layer with uneven components, uneven flatness or uneven thickness, a cutting error easily causes that the part which is difficult to cut, such as the film layer with thicker thickness, can not be cut through, but if the superposition cutting frequency is increased for cutting through the part which is difficult to cut, such as the film layer with thicker thickness, the base material corresponding to the part which is easy to cut, such as the film layer with thinner thickness, can cause serious damage, thereby affecting the appearance, optical imaging quality, mechanical property and the like of a product. Therefore, it is necessary to provide a laser cutting method to solve the above problems.
Referring to fig. 1, fig. 1 shows a flow chart of a laser cutting method in an embodiment of the present invention, and the laser cutting method provided in the embodiment of the present invention includes the following steps:
s1, controlling a laser cutting device to cut a film layer along a cutting line at a preset initial strength, and detecting a current optical signal value penetrating through the film layer;
step S2, calculating the current optical signal value and a preset optical signal value to identify whether a first section with the optical signal variation exceeding a preset threshold value and a second section with the optical signal variation not exceeding the preset threshold value exist in the film layer;
step S31, if a first section with the optical signal variation exceeding a preset threshold exists in the film layer, controlling the laser cutting device to cut the first section at least once along the cutting line with the intensity smaller than the preset initial intensity;
and step S32, if a second section with the optical signal variation not exceeding the preset threshold exists in the film layer, controlling the laser cutting device to cut the second section at least once along the cutting line at the preset initial intensity until the optical signal variation of the second section completely exceeds the preset threshold.
According to the laser cutting method, when the film is subjected to laser cutting, factors such as uneven film thickness and uneven components can possibly cause different cutting depths of different sections of the film under the action of laser light with the same intensity; or, when the film composition is not uniform, the difficulty of laser beam cutting with the same intensity is different, which also results in different cutting depths. The cutting depth of the film layer is different, and the light transmission degree after cutting is also different. After the laser cutting device is controlled to cut the film layer along the cutting line with preset initial strength, the current optical signal value penetrating through the film layer is detected, and the current optical signal value and the preset optical signal value are calculated to identify whether a first section with the optical signal variation exceeding a preset threshold value and a second section with the optical signal variation not exceeding the preset threshold value exist in the film layer. If the second section with the optical signal variation not exceeding the preset threshold exists in the film layer, the laser cutting device is controlled to cut the second section at least once along the cutting line with the preset initial intensity until the optical signal variation of the second section completely exceeds the preset threshold, so that the part with thicker thickness or the part with uneven components and difficulty in cutting through is cut for multiple times with larger intensity, and higher cutting efficiency is guaranteed. If a first section with the optical signal variation exceeding a preset threshold exists in the film layer, controlling the laser cutting device to cut the first section at least once along the cutting line with the intensity smaller than the preset initial intensity; the parts which are easy to cut through and have small thickness are cut with small strength subsequently, and the phenomenon that the appearance, the optical imaging quality, the mechanical property and the like of the product are influenced because the base materials corresponding to the parts which are easy to cut through and have small film thickness are seriously damaged is avoided.
According to the laser cutting method, after the film is cut, according to the calculation results of the optical signal variation and the preset threshold value of the film, different sections of the cut film are respectively cut, so that the sections with different calculation results of the optical signal variation are cut in a sectional mode at the next cutting time, the part with thicker thickness or the part with uneven components and difficult cutting is cut for many times with higher strength, the part with thinner thickness and the like and easy cutting is subsequently cut with lower strength, and therefore the situation that the appearance, the optical imaging quality, the mechanical property and the like of a product are influenced due to the fact that the base materials corresponding to the part with thinner thickness and easy cutting are seriously damaged is avoided while the higher cutting efficiency is guaranteed.
In the above embodiment, the preset initial strength is determined according to the thickness of the film layer, the depth of a single cut, and the number of predicted cuts, which is not limited herein. The intensity less than the preset initial intensity may be, specifically, 10%, 20%, 30%, 40%, 50%, or the like of the preset initial intensity.
Referring to fig. 2, in the above embodiment, at least one cutting is performed on the second segment along the cutting line until the optical signal variation of the second segment completely exceeds the preset threshold, and each cutting is implemented by the following steps:
step S321, obtaining a calculation result of the optical signal variation of the second section cut at the previous time;
step S322, when the calculation result of the optical signal variation indicates that a section with the optical signal variation exceeding a preset threshold exists in the second section of the previous cutting, taking the section with the optical signal variation exceeding the preset threshold as a first section of the current cutting, and controlling a laser cutting device to cut the first section of the current cutting along a cutting line with the intensity smaller than the preset initial intensity;
step S323, when the calculation result of the optical signal variation indicates that a section with the optical signal variation not exceeding the preset threshold exists in the second section cut last time, taking the section with the optical signal variation not exceeding the preset threshold as the second section cut at the current time, controlling the laser cutting device to cut the second section cut at the current time along the cutting line with preset initial intensity, and calculating the optical signal variation to obtain the calculation result of the optical signal variation cut at the current time; the calculation result of the variation of the optical signal of the current cutting is used as the calculation result of the variation of the optical signal of the second section of the previous cutting corresponding to the next cutting.
And after the previous cutting, calculating the current optical signal value and the preset optical signal value of the second section, and acquiring the calculation result of the optical signal variation of the second section of the previous cutting. When the optical signal variation calculation result represents that a section with the optical signal variation exceeding a preset threshold exists in the second section of the previous cutting, the section with the optical signal variation exceeding the preset threshold is used as the first section of the current cutting, and the laser cutting device is controlled to cut the first section of the current cutting along the cutting line at the intensity smaller than the preset initial intensity, so that the part with the thinner thickness generated after the previous cutting is cut at the lower intensity during the current cutting, and the base material is prevented from being damaged.
And when the light signal variation calculation result represents that the section with the light signal variation not exceeding the preset threshold exists in the second section of the previous cutting, the section with the light signal variation not exceeding the preset threshold is used as the second section of the current cutting, the laser cutting device is controlled, the second section of the current cutting is cut along the cutting line with preset initial strength, and therefore when the second cutting is performed, the part with the still thicker thickness after the previous cutting is cut with larger strength, and higher cutting efficiency is guaranteed. And after the current cutting, calculating the optical signal variation to obtain the optical signal variation calculation result of the current cutting, wherein the optical signal variation calculation result of the current cutting is used as the optical signal variation calculation result of the second section of the previous cutting corresponding to the next cutting, so that the cyclic cutting of the film layer is realized by the cutting method capable of avoiding the damage to the base material all the time.
Referring to fig. 3, in the above embodiment, the laser cutting method further includes detecting whether there is a cut-through section in the film after each cutting;
each of the at least one cutting of the first section along the cutting line is achieved by the following steps:
step S311, obtaining a film layer cutting-through result of the first section cut in the previous time;
step S312, when the film cutting result indicates that a cut section exists in the first section cut last time, controlling the laser cutting device to stop emitting light to the cut section;
step 313, when the film cutting result indicates that the first section cut last time has a section which is not cut through, controlling a laser cutting device to cut the section which is not cut through along a cutting line with the strength less than the preset initial strength, and identifying the film cutting to obtain the film cutting result of the first section cut last time; and the film layer cutting result of the current cutting is used as the film layer cutting result of the first section of the previous cutting corresponding to the next cutting.
And after the previous cutting, detecting whether the first section has a cut-through section, and acquiring a film layer cut-through result of the first section of the previous cutting. When the film cutting result indicates that a cut section exists in the first section cut at the previous time, the laser cutting device is controlled to stop emitting light to the cut section, so that the base material corresponding to the cut part is prevented from being damaged, and the energy loss is reduced.
When the film cutting result indicates that the first section cut last time has the section which is not cut through, the laser cutting device is controlled to cut the section which is not cut through along the cutting line with the intensity which is less than the preset initial intensity, so that the section which is not cut through in the first section is continuously cut, and the base material corresponding to the section which is not cut through is prevented from being damaged. And after the current cutting, identifying the film cutting through to obtain a film cutting through result of the first section of the current cutting, wherein the film cutting through result of the current cutting is used as a film cutting through result of the first section of the previous cutting corresponding to the next cutting, so that the film is ensured to be cut circularly by the cutting method capable of avoiding damage to the base material all the time until all the films in the first section are cut through, and the cutting is completed.
In some embodiments, after controlling the laser cutting device to cut the film layer along the cutting line with the preset initial intensity, and detecting the current optical signal value penetrating through the film layer, calculating the current optical signal value and the preset optical signal value to identify whether there are a first section where the optical signal variation exceeds the preset threshold and a second section where the optical signal variation does not exceed the preset threshold in the film layer, if there is no first section where the optical signal variation exceeds the preset threshold in the film layer, controlling the laser cutting device to cut the film layer along the cutting line with the preset initial intensity, that is, after the previous cutting, if the optical signal variation of all the sections in the film layer does not exceed the preset threshold, it indicates that the remaining thicknesses of all the sections in the film layer are thicker after the previous cutting, and at this time, controlling the laser cutting device to cut the film layer along the preset initial intensity, thereby ensuring higher cutting efficiency.
In some embodiments, after controlling the laser cutting device to cut the film at a preset initial intensity along the cutting line, detecting a current optical signal value penetrating through the film, and calculating the current optical signal value and the preset optical signal value to identify whether there are a first section where the optical signal variation exceeds a preset threshold and a second section where the optical signal variation does not exceed the preset threshold in the film, if there is no second section where the optical signal variation does not exceed the preset threshold in the film, identifying whether there are a cut-through section and a non-cut-through section in the film; if the cut section exists in the film layer, the laser cutting device is controlled to stop emitting light to the cut section, so that the base material corresponding to the cut section is prevented from being damaged. If the section which is not cut through exists in the film layer, the laser cutting device is controlled to cut the section which is not cut through along the cutting line with the intensity which is less than the preset initial intensity so as to prevent the base material which is not cut through and corresponds to the section of which the optical signal variation exceeds the preset threshold value from being damaged. And identifying the film cutting through after cutting, and determining whether the light emitting is stopped or the cutting is carried out at the intensity smaller than the preset initial intensity next time according to the film cutting through identification result until all sections are cut through.
Referring to fig. 4, in some embodiments, the laser cutting apparatus includes a light sensor 300 disposed on one side of the film 100, wherein the light sensor 300 is configured to detect a current light signal value transmitted through the film 100. Wherein, light sensor 300 sets up specifically including light sensor 300 to set up at the upside or the downside of rete 100 in one side of rete 100, and wherein the upside includes directly over or oblique top, and the downside includes directly under or oblique below, specifically sets up according to laser cutting device and the space that can supply to utilize around it to, can set up light sensor 300 respectively in the different sides of rete 100 simultaneously according to actual demand.
In the process of cutting the film, the cutting depth is different, and the light signal value detected by the light sensor 300 arranged on one side of the film layer 100 is different. The light sensor 300 is used to acquire a current light signal value transmitted through the film 100, and then the acquired current light signal value is compared with a preset light signal value. When the calculated optical signal variation exceeds the preset threshold, the section where the optical signal variation exceeds the preset threshold is used as a first section, and the first section is cut at an intensity less than the preset initial intensity during the next cutting, so as to prevent the base material 200 corresponding to the first section from being damaged. And when the calculated optical signal variation does not exceed the preset threshold, taking the section of which the optical signal variation does not exceed the preset threshold as a second section, and cutting the second section with preset initial intensity during next cutting so as to ensure that the cutting efficiency of the second section is higher during next cutting.
Referring to fig. 5, in some embodiments, the laser cutting apparatus includes a position sensor;
calculating the current optical signal value and a preset optical signal value to identify whether a first section with an optical signal variation exceeding a preset threshold and a second section with an optical signal variation not exceeding the preset threshold exist in the film layer, and then the method comprises the following steps:
step S211, controlling the position sensor to obtain the position information of the first section where the variation of the optical signal exceeds the preset threshold and obtain the position information of the second section where the variation of the optical signal does not exceed the preset threshold.
The position sensor is used for acquiring the position information corresponding to the first section in the first section with the optical signal variation exceeding the preset threshold value, and acquiring the position information corresponding to the second section in the second section with the optical signal variation not exceeding the preset threshold value, so that the position information of the section with the optical signal variation exceeding the preset threshold value and the position information of the section with the optical signal variation not exceeding the preset threshold value can be directly and quickly acquired, and the corresponding strength is controlled at the corresponding position for cutting in the next cutting.
Referring to fig. 6, in some embodiments, controlling the position sensor to acquire the position information of the first section where the variation of the optical signal exceeds the preset threshold specifically includes:
step S221, acquiring an initial time t1 and an end time t2 when the variation of the optical signal exceeds a preset threshold;
step S222, calculating position information of a first section where the variation of the optical signal exceeds a preset threshold according to the initial time t1, the end time t2 and the cutting speed.
The current section information is calculated by acquiring the initial time t1 and the finishing time t2 when the optical signal variation exceeds the preset threshold value and combining the cutting speed and is used as a light-transmitting section, the position information corresponding to the section when the optical signal variation exceeds the preset threshold value can be acquired without arranging an additional sensing device, and an additional position sensing function is realized by utilizing the existing sensing device, so that the structure is simple.
In the above embodiment, the preset initial intensity is a preset initial light intensity. The sectional cutting is realized by irradiating different sections in the film layer with light with different intensities in the process of the superposition cutting, namely, the light transmission degrees of the different sections are controlled to correspondingly select different light intensities for the superposition cutting, and the control method is simple and direct.
In some embodiments, the laser cutting apparatus includes a temperature sensor located on one side of the film, the temperature sensor configured to detect a current light signal value transmitted through the film based on heat generated by laser light transmitted through the film. Because the laser light is a coherent light source, the light intensity and the temperature of the laser light are higher than those of a common light source, so that the light intensity and the heat are transmitted, when the laser light irradiates the surface of an object, the temperature of the irradiated part of the surface of the object is increased, the temperature sensor can sense the temperature change on the surface of the object caused by the laser light penetrating through the film layer on the cutting path before and after laser cutting, and the light intensity change can be measured and calculated.
The above-mentioned embodiment detects the current light signal value who sees through the rete according to the heat that the radium-shine light that sees through the rete produced to calculate current light signal value and predetermine light signal value, in order to discern whether there are the first district section that light signal variation exceeds preset threshold value and the second district section that light signal variation does not exceed this preset threshold value in the rete, thereby confirm the intensity that each district section corresponds when cutting next time according to the recognition result, in order to guarantee cutting efficiency higher while, avoid the substrate to be damaged.
In some embodiments, the laser cutting apparatus includes an optical power meter located on one side of the film layer, the optical power meter being configured to detect a current optical signal value transmitted through the film layer based on the optical power of the laser light transmitted through the film layer.
In the secondary cutting process, the optical power of the light penetrating through the film layer is detected through the optical power meter, the current optical signal value penetrating through the film layer is obtained according to the detected degree of optical power loss, so that the corresponding strength of each section in the next cutting process is determined, and the base material is prevented from being damaged while the cutting efficiency is high.
The present invention also provides a computer readable storage medium, on which in some embodiments a computer program is stored, which computer program, when executed by a processor, performs the steps of the method as previously described. Since the computer-readable storage medium includes all technical features of the laser cutting method, the computer-readable storage medium has all technical effects in the above embodiments, and details are not described herein.
The present invention also provides a laser cutting apparatus, which in some embodiments comprises a controller including a memory and a processor, the memory storing a computer program that, when executed by the processor, performs the steps of the method described above.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A laser cutting method is characterized by comprising the following steps:
controlling a laser cutting device to cut the film layer along a cutting line at a preset initial strength, and detecting a current optical signal value penetrating through the film layer;
calculating the current optical signal value and a preset optical signal value to identify whether a first section with an optical signal variation exceeding a preset threshold and a second section with the optical signal variation not exceeding the preset threshold exist in the film layer;
if a first section with the optical signal variation exceeding a preset threshold value exists in the film layer, controlling the laser cutting device to cut the first section at least once along the cutting line with the intensity smaller than the preset initial intensity;
if a second section with the optical signal variation not exceeding the preset threshold exists in the film layer, controlling the laser cutting device to cut the second section at least once along the cutting line at the preset initial intensity until the optical signal variation of the second section completely exceeds the preset threshold;
the second section is cut at least once along the cutting line until the optical signal variation of the second section completely exceeds each cut in a preset threshold value, and the following steps are adopted:
obtaining the calculation result of the optical signal variation of the second section cut at the previous time;
when the optical signal variation calculation result indicates that a section with the optical signal variation exceeding a preset threshold exists in the second section of the previous cutting, taking the section with the optical signal variation exceeding the preset threshold as a first section of the current cutting, and controlling the laser cutting device to cut the first section of the current cutting along the cutting line with the intensity smaller than the preset initial intensity;
when the optical signal variation calculation result indicates that a section with the optical signal variation not exceeding the preset threshold exists in the second section cut at the previous time, the section with the optical signal variation not exceeding the preset threshold is taken as the second section cut at the current time, the laser cutting device is controlled to cut the second section cut at the current time along the cutting line with the preset initial intensity, and the optical signal variation calculation is carried out to obtain the optical signal variation calculation result cut at the current time; wherein, the calculation result of the variation of the optical signal of the current cutting is used as the calculation result of the variation of the optical signal of the second section of the previous cutting corresponding to the next cutting;
the method further comprises detecting whether there is a cut through segment in the film layer after each cut;
each of the at least one cut of the first section along the cut line is accomplished by:
obtaining a film layer cutting result of the first section cut at the previous time;
when the film layer cutting-through result represents that a cut-through section exists in the first section cut at the previous time, controlling the laser cutting device to stop emitting light to the cut-through section;
when the film layer cutting-through result represents that a section which is not cut through exists in the first section which is cut at the previous time, controlling the laser cutting device to cut the section which is not cut through along the cutting line with the intensity smaller than the preset initial intensity, and performing film layer cutting-through identification to obtain a film layer cutting-through result of the first section which is cut at the current time; wherein the film layer cut-through result of the current cutting is used as the film layer cut-through result of the first section of the previous cutting corresponding to the next cutting.
2. The laser cutting method of claim 1, wherein if there is no first segment in the film where the variation of the optical signal exceeds a predetermined threshold, the laser cutting apparatus is controlled to cut the film along the cutting line with the predetermined initial intensity.
3. The laser cutting method of claim 1, wherein if there is no second section in the film whose variation of the optical signal does not exceed the preset threshold, identifying whether there are cut-through sections and uncut sections in the film;
if the cut section exists in the film layer, controlling the laser cutting device to stop emitting light to the cut section;
and if the section which is not cut through exists in the film layer, controlling the laser cutting device to cut the section which is not cut through along the cutting line with the intensity which is less than the preset initial intensity.
4. The laser cutting method of any one of claims 1 to 3, wherein the laser cutting apparatus comprises a light sensor located on one side of the film layer, the light sensor being configured to detect a current light signal value transmitted through the film layer.
5. The laser cutting method of claim 4, wherein the laser cutting device comprises a position sensor;
the calculating the current optical signal value and the preset optical signal value to identify whether a first section in which the optical signal variation exceeds a preset threshold and a second section in which the optical signal variation does not exceed the preset threshold exist in the film layer includes:
and controlling the position sensor to acquire the position information of a first section with the light signal variation exceeding a preset threshold value and acquire the position information of a second section with the light signal variation not exceeding the preset threshold value.
6. The laser cutting method according to claim 5, wherein the controlling the position sensor to obtain the position information of the first section with the light signal variation exceeding the preset threshold specifically comprises:
acquiring an initial time t1 and an end time t2 when the variation of the optical signal exceeds a preset threshold;
and calculating the position information of the first section with the light signal variation exceeding the preset threshold according to the initial time t1, the end time t2 and the cutting speed.
7. The laser cutting method according to any one of claims 1 to 3, wherein the preset initial intensity comprises a preset initial light intensity.
8. The laser cutting method of any one of claims 1 to 3, wherein the laser cutting apparatus comprises a temperature sensor located on one side of the film, the temperature sensor being configured to detect a current light signal value transmitted through the film based on heat generated by the laser light transmitted through the film.
9. The laser cutting method according to any one of claims 1 to 3, wherein the laser cutting apparatus includes an optical power meter located on one side of the film, the optical power meter being configured to detect a current optical signal value transmitted through the film based on the optical power of the laser light transmitted through the film.
10. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 9.
11. A laser cutting apparatus comprising a controller including a memory and a processor, the memory storing a computer program which, when executed by the processor, performs the steps of the method of any one of claims 1 to 9.
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Effective date of registration: 20240109 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Patentee after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee after: Interface Technology (Chengdu) Co., Ltd. Patentee after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Patentee before: Interface Technology (Chengdu) Co., Ltd. Patentee before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Patentee before: GENERAL INTERFACE SOLUTION Ltd. |