CN105278136A - Method for dividing bonded substrate - Google Patents
Method for dividing bonded substrate Download PDFInfo
- Publication number
- CN105278136A CN105278136A CN201510191220.1A CN201510191220A CN105278136A CN 105278136 A CN105278136 A CN 105278136A CN 201510191220 A CN201510191220 A CN 201510191220A CN 105278136 A CN105278136 A CN 105278136A
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- CN
- China
- Prior art keywords
- guide wire
- wire groove
- delineation
- sealing
- adhesive substrates
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- Joining Of Glass To Other Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a method for dividing a bonded substrate. The method comprises: a stage of irradiating laser to a sealing part (12) to form a cutting guide line groove (H1); a stage of irradiating laser to the sealing part (12) at the position isolated from the cutting guide line groove (H1) to form a determined cutting guide line groove (H2), and a stage of cutting an upper glass part (9) and a lower glass part (8) along the determined cutting guide line groove (H2) through a cutting wheel (70). The method for dividing the bonded substrate is capable of furthest reducing the needless end material part of the substrate when a liquid crystal substrate is divided and capable of obtaining a smooth divided surface.
Description
Technical field
The invention relates to a kind of method for dividing of adhesive substrates, specifically, is diminish to greatest extent about a kind of end material portion that substrate can not only be made not want, and also can obtain the method for dividing of the adhesive substrates of smooth point section.
Background technology
Generally speaking, existing known in the past when removing the end material portion that crystal liquid substrate is not wanted, only utilize scribe wheel.
Specifically, general crystal liquid substrate, between top glass portion and bottom glass portion after filling liquid crystal layer, does not utilize sealant to be sealed around the frame part of liquid crystal layer toward the mode of outside dew liquid with liquid crystal layer.
That is, become the face making sealant be attached to the mutual subtend in top glass portion and bottom glass portion, and with liquid crystal layer not toward the structure that the outside mode flowed out seals.
In addition, in order to improve sealing, and the bearing of trend of base plan is formed in making sealant wider width.
So, in existing known technology in the past, because the frame part at crystal liquid substrate comprises the sealant with wider width, therefore have following practical situation: diminish to make frame with the outer peripheral portion of the use of the state of larger frame (margo frontalis) (bezel) size or excision sealant.
But, also have recently and crystal liquid substrate is reciprocally connected to plane and the situation used, and in this situation, have problem points not smooth at sealant outer peripheral portion bond sites image each other when image specifically manifests.
In order to the problem points as solving so, and in order to the width of the sealant that cuts crystal liquid substrate to greatest extent, so utilize scribe wheel to carry out disjunction in the mode invaded deeper to the sealant of crystal liquid substrate.
But, when the sealant utilizing scribe wheel to crystal liquid substrate is delineated, because of the physical property that sealant has, and create scribe wheel and carry out delineation and lose rectilinear propagation, cannot carry out moving etc. along delineation preset lines and advance toward other directions, thus make the problem points that substrate becomes not good.
In addition, recently, by multiple crystal liquid substrate with plane and the device for image reciprocally abutting large-scale image is specifically manifested with frame and sell become many, thus in order to the part beyond the enable liquid crystal layer specifically manifesting image, such as sealant be that minimum research is widely tried.
Summary of the invention
The present invention be problem in order to solve as above and create, its object is to provide a kind of when utilizing laser to delineate adhesive substrates such as crystal liquid substrates, the end material portion that substrate can not only be made not want diminishes to greatest extent, and also can obtain the smooth method for dividing dividing the adhesive substrates of section.
In order to solve above-mentioned problem, the method for dividing of the adhesive substrates of one embodiment of the present of invention, being for carrying out disjunction on the sealing (12) be formed between the top glass portion (9) of adhesive substrates (10) and bottom glass portion (8), it is characterized in that comprising with the next stage: in sealing portion (12), delineation guide wire groove (H1) is formed to sealing portion (12) irradiating laser; After this delineation guide wire groove (H1) of formation, to sealing portion (12) irradiating laser of the position isolated across interval the position from this delineation guide wire groove (H1), and formed in sealing portion (12) and determine delineation guide wire groove (H2); And, after this determines delineation guide wire groove (H2) in formation, scribe wheel (70) is utilized to determine that delineation guide wire groove (H2) is delineated this top glass portion (9) and this bottom glass portion (8) along this.
Also can be: between this top glass portion (9) and this bottom glass portion (8), be formed with the liquid crystal portion (30) that outer peripheral portion is sealed by sealing portion (12); With this liquid crystal portion (30) for benchmark, this delineation guide wire groove (H1) is formed in comparatively that this determines to delineate guide wire groove (H2) farther position.
Also can be: formed this delineation guide wire groove (H1) stage before, be included in sealing portion (12) preset for the formation of this determine delineate guide wire groove (H2) position; Sealing portion (12) irradiating laser of the position isolated only arriving this distance forming precalculated position of determining to delineate guide wire groove (H2) with the bubble produced by sealing portion (12) when this delineation guide wire groove (H1) is formed, forms this delineation guide wire groove (H1).
By technique scheme, the present invention has following effect: do not flow into toward the liquid crystal layer side of adhesive substrates by the bubble produced when delineating with the sealing of laser to adhesive substrates, and can prevent liquid crystal layer contaminated, become defective products etc.
In addition, also there is following effect: point section that can form adhesive substrates well, and the separation property of adhesive substrates can be made to improve.
Accompanying drawing explanation
Fig. 1 a be represent of the present invention once delineate by the sealing of laser to adhesive substrates before the vertical view of state.
Fig. 1 b is the fragmentary cross-sectional view of the part A of Fig. 1 a.
Fig. 1 c represents that the imaginary of sealing determines the graphic of score line.
Fig. 1 d is represent the state of sealing through once delineating graphic.
Fig. 2 a represents the vertical view by laser, the sealing of adhesive substrates being carried out to the state before secondary delineation of the present invention.
Fig. 2 b is the fragmentary cross-sectional view of the part B of Fig. 2 a.
Fig. 2 c represents that the imaginary of sealing determines the graphic of score line.
Fig. 2 d is represent the state that sealing is delineated through secondary graphic.
Fig. 3 a represents of the present invention to carry out once the sealing of adhesive substrates and the vertical view of state after secondary delineation by laser.
Fig. 3 b is the fragmentary cross-sectional view of the C part of Fig. 3 a.
Fig. 3 c represents to utilize scribe wheel to carry out the graphic of the state of delineating.
Fig. 3 d represents state graphic of substrate through disjunction.
Fig. 4 is the graphic of bubble direct of travel when representing that the sealing to adhesive substrates of the present invention carries out laser grooving and scribing.
[main element symbol description]
H1: delineation guide wire groove H2: determine delineation guide wire groove
9: top glass portion 8: bottom glass portion
10: adhesive substrates 12: sealing
14: end material portion 30: liquid crystal portion
70: scribe wheel (it delineates path)
Embodiment
The method for dividing of the adhesive substrates of one embodiment of the present of invention is specifically described with reference to institute's accompanying drawings.
As shown in Fig. 1 a and Fig. 1 b, the adhesive substrates 10 of the present embodiment, comprises top glass portion 9 and bottom glass portion 8, and is formed with liquid crystal portion 30 between described top glass portion 9 and bottom glass portion 8.And, toward the mode of adhesive substrates 10 outside leakage, the periphery in liquid crystal portion 30 is not sealed with sealing 12 with liquid crystal portion 30.
Sealing 12, owing to having stickability and sealing, therefore can make top glass portion 9 and bottom glass portion 8 adhere, and makes the mode that do not flow out with the liquid crystal portion 30 between top glass portion 9 and bottom glass portion 8 and the state sealed is maintained.In addition, sealing 12, is formed as the form being coated on the bearing of trend in top glass portion 9 and bottom glass portion 8 in the without leakage mode in liquid crystal portion 30 more largo.
That is the adhesive substrates 10 of the present embodiment, engages the structure in fixing top glass portion 9 and bottom glass portion 8 under the state during fabrication with filling liquid crystal portion 30.
On the other hand, comprise sealing 12 in top glass portion 9 and bottom glass portion 8 and there is end material portion 14 not at outer peripheral portion.
But, when specifically manifesting image in the liquid crystal portion 30 of adhesive substrates 10 under the state that multiple adhesive substrates 10 abuts mutually, if the face wider width mutually abutted, cannot specifically manifest good image, therefore be necessary the end material portion 14 of not wanting including the sealing 12 being formed in adhesive substrates 10 outer peripheral portion to remove.
Therefore, in the method for dividing of the present embodiment, first sealing 12 irradiating laser is delineated in top glass portion 9 and bottom glass portion 8 previously to sealing 12.
Specifically, first, to set the actual part for disjunction of sealing 12 (following, be also called imaginary determine score line) as dotted arrows represented in such as Fig. 1 c.Then, set and determine that score line isolates the position of both set a distances toward outside that is end side, material portion 14 from imaginary, make laser irradiation device 1 move to this position.
Then, as illustrated in figure 1 c, utilize laser irradiation device 1, determine the position irradiating laser of score line toward the isolation of end side, material portion 14 to from imaginary, and form delineation guide wire groove H1 at sealing 12.
But, when forming delineation guide wire groove H1 to sealing 12 irradiating laser at sealing 12, to be heated and the sealing 12 of melting produces bubble.This bubble, advances toward the both sides that is the past direction intersected with delineation guide wire groove H1 of delineating guide wire groove H1.
Hold material portion 14 skidding to enter although the part in the bubble advanced in the direction intersected with delineation guide wire groove H1 is past, and another part enters toward liquid crystal portion 30 skidding, due to the wider width of sealing 12, therefore bubble does not invade in liquid crystal portion 30.In addition, if consider the travel distance etc. of the bubble produced when delineating guide wire groove H1 and being formed in advance, and imaginaryly determine that the position of the abundant separation as score line sets delineation guide wire groove H1 not arriving with bubble, then bubble just can not cross the imaginary position determining score line.
On the other hand, produce bubble delineation guide wire groove H1 around physical property weakening strength.
So after being formed with delineation guide wire groove H1, laser irradiation device 1 is moved to pre-set as the imaginary position determining score line, as shown in Figure 2 d, formed and determine delineation guide wire groove H2.
Determining to delineate the bubble produced when guide wire groove H2 is formed, induced by the bubble area side first produced when delineation guide wire groove H1 is formed.
Its reason is: due to when forming delineation guide wire groove H1, make the physical property weakening strength around delineation guide wire groove H1 because of the generation of bubble, therefore determining to delineate the bubble produced when guide wire groove H2 is formed, is induced by the part toward this reduction.
That is, in the method for dividing of the present embodiment, determining to delineate the bubble produced when guide wire groove H2 is formed, do not move toward side, liquid crystal portion 30, and only partially toward moving relative to the delineation guide wire groove H1 side died down.
Therefore, bubble invades liquid crystal portion 30 and situation about having problems can not occur.
Then, as shown in Fig. 3 a and Fig. 3 b, utilize scribe wheel 70 along determining that delineation guide wire groove H2 cuts top glass portion 9 and bottom glass portion 8.
Owing to sealing 12 being heated by laser grooving and scribing and melting and turn bubble into, the therefore not residual seal portion 12 in the region of the H2 of Fig. 3 b.Therefore, when utilizing scribe wheel 70 to delineate, only top glass portion 9 and bottom glass portion 8 are delineated.Therefore, it is possible to delineate adhesive substrates 10 under the interference without sealing 12, can obtain and make the section quality of adhesive substrates 10 improve and make the effect that the separation property of adhesive substrates 10 improves.
The method for dividing of the present embodiment, due to after delineating with the sealing 12 of laser to adhesive substrates 10, utilizes scribe wheel 70 to delineate, therefore, it is possible to carry out the disjunction in top glass portion 9 and bottom glass portion 8 glidingly.
In addition, the method for dividing of the present embodiment, owing to first delineating sealing 12 with laser, therefore has the end material portion 14 that can reduce adhesive substrates 10 to greatest extent and can carry out in the mode making frame diminish to greatest extent the advantage that manufactures.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (3)
1. the method for dividing of an adhesive substrates, being for carrying out disjunction on the sealing (12) be formed between the top glass portion (9) of adhesive substrates (10) and bottom glass portion (8), it is characterized in that comprising with the next stage:
In sealing portion (12), delineation guide wire groove (H1) is formed to sealing portion (12) irradiating laser;
After this delineation guide wire groove (H1) of formation, to sealing portion (12) irradiating laser of the position isolated across interval the position from this delineation guide wire groove (H1), and formed in sealing portion (12) and determine delineation guide wire groove (H2); And,
After this determines delineation guide wire groove (H2) in formation, scribe wheel (70) is utilized to determine that delineation guide wire groove (H2) is delineated this top glass portion (9) and this bottom glass portion (8) along this.
2. the method for dividing of adhesive substrates according to claim 1, it is characterized in that: wherein between this top glass portion (9) and this bottom glass portion (8), be formed with the liquid crystal portion (30) that outer peripheral portion is sealed by sealing portion (12);
With this liquid crystal portion (30) for benchmark, this delineation guide wire groove (H1) is formed in comparatively that this determines to delineate guide wire groove (H2) farther position.
3. the method for dividing of adhesive substrates according to claim 1 and 2, it is characterized in that: wherein formed this delineation guide wire groove (H1) stage before, be included in sealing portion (12) preset for the formation of this determine delineate guide wire groove (H2) position;
Sealing portion (12) irradiating laser of the position isolated only arriving this distance forming precalculated position of determining to delineate guide wire groove (H2) with the bubble produced by sealing portion (12) when this delineation guide wire groove (H1) is formed, forms this delineation guide wire groove (H1).
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20140078282 | 2014-06-25 | ||
| KR10-2014-0078282 | 2014-06-25 | ||
| KR10-2014-0106714 | 2014-08-18 | ||
| KR1020140106714A KR101596296B1 (en) | 2014-06-25 | 2014-08-18 | Method for cutting of bonded substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105278136A true CN105278136A (en) | 2016-01-27 |
| CN105278136B CN105278136B (en) | 2019-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510191220.1A Active CN105278136B (en) | 2014-06-25 | 2015-04-21 | The method for dividing of adhesive substrates |
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| Country | Link |
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| CN (1) | CN105278136B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107117803A (en) * | 2016-12-01 | 2017-09-01 | 塔工程有限公司 | Scribing equipment and dicing method |
| CN108710235A (en) * | 2018-06-26 | 2018-10-26 | 惠州市华星光电技术有限公司 | cutting method |
| CN111566058A (en) * | 2017-12-27 | 2020-08-21 | 三星钻石工业股份有限公司 | Scribing method and scribing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001035816A (en) * | 1999-07-21 | 2001-02-09 | U T K Syst:Kk | Glass board cutting method and cutting apparatus thereof |
| CN1646282A (en) * | 2002-04-01 | 2005-07-27 | 三星钻石工业股份有限公司 | Parting method for fragile material substrate and parting device using the method |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| JP4911239B2 (en) * | 2010-10-15 | 2012-04-04 | セイコーエプソン株式会社 | Multilayer structure substrate, droplet discharge head substrate, and method for manufacturing multilayer structure |
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2015
- 2015-04-21 CN CN201510191220.1A patent/CN105278136B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035816A (en) * | 1999-07-21 | 2001-02-09 | U T K Syst:Kk | Glass board cutting method and cutting apparatus thereof |
| CN1646282A (en) * | 2002-04-01 | 2005-07-27 | 三星钻石工业股份有限公司 | Parting method for fragile material substrate and parting device using the method |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| JP4911239B2 (en) * | 2010-10-15 | 2012-04-04 | セイコーエプソン株式会社 | Multilayer structure substrate, droplet discharge head substrate, and method for manufacturing multilayer structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107117803A (en) * | 2016-12-01 | 2017-09-01 | 塔工程有限公司 | Scribing equipment and dicing method |
| CN107117803B (en) * | 2016-12-01 | 2021-11-02 | 塔工程有限公司 | Scribing equipment and scribing method |
| CN111566058A (en) * | 2017-12-27 | 2020-08-21 | 三星钻石工业股份有限公司 | Scribing method and scribing apparatus |
| CN108710235A (en) * | 2018-06-26 | 2018-10-26 | 惠州市华星光电技术有限公司 | cutting method |
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| Publication number | Publication date |
|---|---|
| CN105278136B (en) | 2019-07-16 |
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