KR102042170B1

KR102042170B1 - Method for cutting liquid crystal display panel

Info

Publication number: KR102042170B1
Application number: KR1020130076585A
Authority: KR
Inventors: 이동규; 손경모; 이은혜
Original assignee: 엘지디스플레이 주식회사
Priority date: 2013-07-01
Filing date: 2013-07-01
Publication date: 2019-11-07
Also published as: KR20150003559A

Abstract

The present invention relates to a method of cutting a liquid crystal display panel, and the disclosed invention comprises: forming first upper cutting lines on an upper mother substrate on which a plurality of liquid crystal display panel regions are formed; Forming first lower cutting lines on a lower mother substrate on which a plurality of liquid crystal display panel regions are formed; Bonding the upper mother substrate on which the first upper cutting lines are formed and the lower mother substrate on which the first lower cutting lines are formed; Forming second upper cutting lines on the bonded upper mother substrate; Forming second lower cutting lines on the bonded lower mother substrate; And applying a predetermined pressure along the second lower cutting schedule lines formed in the lower mother substrate to allow the crack to propagate.

Description

Cutting method of liquid crystal display panel {METHOD FOR CUTTING LIQUID CRYSTAL DISPLAY PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a liquid crystal display panel, and more particularly, to a method of cutting a liquid crystal display panel for cutting liquid crystal display panels fabricated on a large area glass substrate into individual unit liquid crystal display panels.

In general, a liquid crystal display device is a display device in which data signals corresponding to image information are individually supplied to pixels arranged in a matrix, and a desired image can be displayed by adjusting light transmittance of the pixels. .

In the liquid crystal display, thin film transistor array substrates are formed on a large mother substrate, color filter substrates are formed on a separate mother substrate, and two mother substrates are bonded to each other, whereby the thin film transistor array substrate and the color filter substrate are bonded together. A plurality of liquid crystal display panels are formed at the same time and then cut into unit liquid crystal display panels to improve yield.

In order to cut a plurality of liquid crystal display panels formed on the large-scale mother substrate into a unit liquid crystal display panel, forming a cutting line (scribing line) on the surface of the mother substrate with a wheel that is harder than glass, and A crack is propagated along the scheduled cutting groove.

In this regard, a unit liquid crystal display panel in which a thin film transistor array substrate and a color filter substrate of a general liquid crystal display device are opposed to each other will be described as follows.

Although not shown in the drawing, a general liquid crystal display panel includes an image display unit in which liquid crystal cells are arranged in a matrix, a gate pad unit connected to gate lines of the image display unit, and a data pad unit connected to data lines.

In this case, the gate pad portion and the data pad portion are formed in an edge region of the thin film transistor array substrate which does not overlap the color filter substrate, and the gate pad portion supplies a scan signal supplied from the gate driver integrated circuit to the gate lines of the image display portion. The data pad section supplies the image information supplied from the data driver integrated circuit to the data lines of the image display section.

In the thin film transistor array substrate of the image display unit, data lines to which image information is applied and gate lines to which a scan signal is applied are vertically intersected with each other, and a thin film transistor for switching liquid crystal cells at an intersection thereof, and the thin film transistor And a protective film formed on the front surface to protect the electrode and the thin film transistor.

In addition, the color filter substrate of the image display unit includes color filters separated and applied to each cell region by a black matrix, and a common transparent electrode serving as a counter electrode of a pixel electrode formed on the thin film transistor array substrate.

The thin film transistor array substrate and the color filter substrate configured as described above are provided with a cell-gap so as to be uniformly spaced apart from each other, and are bonded by a sealing portion (not shown) formed on the outside of the image display portion. A liquid crystal layer (not shown) is formed in the spaced space between the transistor array substrate and the color filter substrate.

A method of cutting a liquid crystal display device according to the related art having the above configuration will be described below with reference to FIGS. 1A to 1F.

1A to 1F are cutting process diagrams illustrating a cutting method of a liquid crystal display according to the related art.

First, as shown in FIG. 1A, upper and lower mother substrates 10 and 20 are prepared to be bonded to form a plurality of liquid crystal display panels C. Referring to FIG.

Next, as shown in FIG. 1B, a plurality of liquid crystal display panels are moved on one side of the bonded upper and lower mother substrates 10 and 20 while the wheel 30 is moved on one side of the upper mother substrate 10. The first upper cutting schedule line 35 dividing (C) in the first direction is sequentially formed.

Subsequently, as illustrated in FIG. 1C, a portion of the upper mother substrate 10 on which the first upper cutting line 35 is formed is inverted up and down, and the lower mother substrate 20 is disposed upward.

Next, as shown in FIG. 1D, the first lower cutting part partitioning the plurality of liquid crystal display panels C in the first direction while moving the wheel 30 in one direction on the lower mother substrate 20. The schedule line 37 is formed sequentially.

Subsequently, as shown in FIG. 1E, a portion of the lower mother substrate 20 on which the second lower cutting schedule line 37 is formed is inverted up and down, and the upper mother substrate 10 is disposed upward.

Next, as shown in FIG. 1F, the first upper cutting schedule line 35 of the upper mother substrate 10 part is sequentially hit by the brake bar 40 to sequentially align the first upper cutting schedule line 35. Allow cracks to propagate along the way.

By forming the first upper and lower cutting schedule lines 35 and 37 on the upper and lower mother substrates 10 and 20 thus bonded, the cutting process is performed by hitting the brake bar 40 in the order of hitting the plurality of upper and lower mother substrates 10 and 20. Upper and lower cell substrates 10a and 20a formed of unit liquid crystal cells C are formed.

Meanwhile, a method of cutting the upper and lower cell substrates having unit cells will be described with reference to FIGS. 2A through 2F.

2A to 2F are cutting process diagrams illustrating a cutting method of each unit liquid crystal cell according to the related art.

First, as shown in FIG. 2A, the bonded upper and lower mother substrates are cut to prepare upper and lower liquid crystal cell substrates 10a and 20a provided with a plurality of unit liquid crystal cells C.

Next, as shown in FIG. 2B, a plurality of liquid crystal display panels are moved while moving the wheel 30 in one direction on the upper liquid crystal cell substrate 10a among the upper and lower liquid crystal cell substrates 10a and 20a. A second upper cutting schedule line 35a that divides (C) in the first direction is sequentially formed.

Subsequently, as shown in FIG. 2C, the upper liquid crystal cell substrate 10a on which the second upper cutting schedule line 35a is formed is inverted up and down, and the lower liquid crystal cell substrate 20a is disposed upward. .

Next, as shown in FIG. 2D, the second lower part which divides the plurality of liquid crystal display panels C in the first direction while moving the wheel 30 in one direction on the lower liquid crystal cell substrate 20. The cutting schedule line 37a is formed sequentially.

Subsequently, as shown in FIG. 2E, a portion of the lower liquid crystal cell substrate 20a on which the second lower cutting schedule line 37a is formed is inverted up and down so that the upper liquid crystal cell substrate 10a faces upward. .

Next, as shown in FIG. 2F, the second upper cutting schedule line 35a of the portion of the upper liquid crystal cell substrate 10a is sequentially hit by the break bar 40 to thereby form the second upper cutting schedule line 35a. Allow cracks to propagate along

By forming the second upper and lower cutting lines 35a and 37a on the upper and lower liquid crystal cell substrates 10a and 20a thus bonded, a plurality of cutting processes are performed in the order of hitting using the brake bar 40. Unit liquid crystal cells C are separated.

On the other hand, as shown in Figure 3, in the process of forming a cutting schedule line on the outer surface of the upper, lower mother substrate 10, 20 bonded using the heel 30, the upper, lower mother substrate (10, 20) On the outer surface of the tensile stress is generated in both directions relative to the point where the wheel 30 is in contact, the inner surface of the upper and lower mother substrate (10, 20) the compressive stress is in contact with the wheel (30) Toward the point of

For this reason, in the process of forming a cutting schedule line on the upper and lower mother substrates 10 and 20, a crack is formed on the outer surfaces of the upper and lower mother substrates 10 and 20 that the wheel 30 contacts. Although well formed, cracks are hardly generated in the upper and lower mother substrates 10 and 20 that are not in contact with the wheel 30.

Therefore, as shown in FIG. 4, in the case of hitting along the cut line using the brake bar, a crack occurs well in the hitted portion, that is, the cut line, but the portion below it, i.e., the non-hit surface It can be seen that cracks are less likely to occur.

As described above, in the method of cutting the liquid crystal display panel according to the related art, in the process of forming a cutting schedule line on the bonded mother substrate, a process of performing a cutting schedule line using wheels on the upper and lower mother substrates is performed. Because of this, it is difficult to reduce the substrate penetration area according to the wheel angle. That is, it is difficult to reduce the margin according to the crack level using the existing wheel type equipment.

It is cracked by the minimum penetration depth and pressure for cutting, which makes it difficult to reduce the minimum margin.

In addition, in the liquid crystal panel cutting method according to the related art, crack formation due to compressive stress of the seal becomes difficult in the case of seal on scribing.

In the liquid crystal panel cutting method according to the related art, even in the case of a seal on scribing, crack formation is difficult even during a scribing process at a portion where the seal does not come into contact with each other, thereby increasing the breakage rate.

In the liquid crystal panel cutting method according to the related art, since the adhesive strength of the large model is stronger than that of the small model of the liquid crystal panel, the breakage rate increases.

In addition, the liquid crystal panel cutting method according to the prior art increases the breakage rate due to the seal compressive stress when the liquid crystal panel is not an etching substrate.

In addition, the liquid crystal panel cutting method according to the prior art may cause breakage of the unseparated portion during automatic transfer, and thus, the cutting operation is complicated because the operator must transfer the separation after separation. In particular, the breakage rate on the equipment is high after separation in an in-line manner.

On the other hand, the liquid crystal panel cutting method according to the prior art is not the case of the seal on scribe

The present invention is to solve all the problems of the prior art, an object of the present invention is to form a preliminary preliminary cutting line prior to the bonding of the upper and lower mother substrate in advance to improve the process of forming the cutting schedule line formation The present invention provides a method for cutting a panel.

According to another aspect of the present invention, there is provided a method of cutting a liquid crystal display panel, the method comprising: forming first upper cutting lines on an upper mother substrate on which a plurality of liquid crystal display panel regions are formed; Forming first lower cutting lines on a lower mother substrate on which a plurality of liquid crystal display panel regions are formed; Bonding the upper mother substrate on which the first upper cutting lines are formed and the lower mother substrate on which the first lower cutting lines are formed; Forming second upper cutting lines on the bonded upper mother substrate; Forming second lower cutting lines on the bonded lower mother substrate; And applying a predetermined pressure along the second lower cutting schedule lines formed on the lower mother substrate to propagate the crack.

In the cutting method of the liquid crystal display panel according to the present invention, pre-scribing lines are first formed on the upper and lower mother substrates before bonding the upper and lower mother substrates, and the upper and lower mother substrates are formed. By forming the second cut lines again after joining, the pre-scribing line is formed in the part where the crack formation by the seal was previously difficult. Crack formation and cutting ability are improved.

In addition, in the cutting method of the liquid crystal display panel according to the present invention, since the cutting process is performed in a state where a seal is formed on the preliminary cutting schedule line, the substrate cutting ability is improved accordingly, and the breakage rate is reduced.

In addition, the cutting method of the liquid crystal display panel according to the present invention reduces the scribing margin not only in the case of Seal On Scribe of the etching substrate but also in the case of other scribes except the case of other existing seal on scribes.

Furthermore, in the cutting method of the liquid crystal display panel according to the present invention, since the cutting process is performed while the seal is in contact with a preliminary cutting schedule line formed on each of the upper and lower mother substrates, the cutting capacity of the substrate is improved. Scribble (Seal On Scribe) is possible.

On the other hand, the present invention can reduce the scribe margin that can not be reduced when applying the model to the outside of the seal, and when applied to the model to seal up In addition, problems that could only be done with conventional etch substrates are possible even if they are not etched, and when etching, the margins can be further reduced.

1A to 1F are cutting process diagrams illustrating a cutting method of a liquid crystal display according to the related art.
2A to 2F are cutting process diagrams illustrating a cutting method of each unit liquid crystal cell according to the related art.
FIG. 3 schematically illustrates a state in which a tensile stress and a compressive stress generated in the upper and lower mother substrates are formed when a cutting schedule line is formed in the bonded upper and lower mother substrates according to the related art. One schematic.
FIG. 4 is a cross-sectional photograph of a substrate showing a degree of cracking in a cutting schedule line on the bonded upper and lower mother substrates in the method of cutting a liquid crystal display according to the related art.
5A to 5J are cutting process diagrams for describing a cutting method of a liquid crystal display according to the present invention.
6A to 6D are cross-sectional views illustrating a process of forming first and second cutting lines on each of the upper and lower mother substrates before the bonding of the upper and lower mother substrates according to the present invention.
FIG. 7 is an enlarged cross-sectional view of part A of FIG. 6D, in the cutting method of the liquid crystal display according to the present invention, in which a seal is in contact with preliminary cutting lines of upper and lower substrates and secondary cutting lines are formed; Schematic diagram schematically showing the state.
8 is a cross-sectional view schematically illustrating a state in which the upper and lower mother substrates cut through the cutting method of the liquid crystal display according to the present invention are cut.
FIG. 9 is a cross-sectional photograph of a mother substrate showing a degree of cracking in preliminary cutting lines and cutting lines of a bonded upper and lower mother substrate in the cutting method of the liquid crystal display according to the present invention.

Hereinafter, a method of cutting a liquid crystal display panel according to the present invention will be described in detail with reference to the accompanying drawings.

5A to 5J are cutting process diagrams for describing a cutting method of a liquid crystal display according to the present invention.

First, as shown in FIG. 5A, the upper mother substrate 110 in which the plurality of liquid crystal display panel regions C is defined is prepared.

Subsequently, as shown in FIG. 5B, first, the plurality of liquid crystal display panel regions C are partitioned in the first direction while the wheel 130 is moved in one direction on the upper mother substrate 110. The upper pre cut line 115a is sequentially formed.

Subsequently, the second upper preliminary cutting schedule for dividing the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction while rotating the upper mother substrate 110 by 90 degrees. Pre Scribe Lines 115b are sequentially formed.

Next, as shown in FIG. 5C, the lower mother substrate 120 on which the plurality of liquid crystal display panel regions C are defined is prepared.

Subsequently, as illustrated in FIG. 5D, the first lower preliminary partitioning the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction on the lower mother substrate 120. Prescribe lines 125a are sequentially formed.

Next, in the state in which the lower mother substrate 120 is rotated 90 degrees, the second lower preliminary cutting which divides the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction. Pre Scribe Lines 125b are sequentially formed.

Subsequently, as shown in FIG. 5E, the upper mother substrate 110 on which the first and second upper preliminary cutting lines 115a and 115b are formed, and the first and second lower preliminary cutting lines 125a and 125b are formed. The lower mother substrate 120 is bonded to each other. In this case, the first and second upper preliminary cutting lines 115a and 115b of the upper mother substrate 110 and the first and second lower preliminary cutting lines 125a and 125b of the lower mother substrate 120 are each other. Are arranged oppositely.

Accordingly, as shown in FIG. 5F, the first and second upper preliminary cutting lines 115a and 115b and the first and second lower preliminary cutting lines may be formed on the outer surfaces of the upper and lower mother substrates 120 and 120. 125a, 125b) are not exposed.

Next, as illustrated in FIG. 5G, the first upper part partitioning the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction on the upper mother substrate 110. Prescribe lines 117a are sequentially formed. In this case, the first upper cutting schedule line 117a is formed to correspond to the first upper preliminary cutting line 115a formed on the bottom surface of the mother substrate 110.

Subsequently, in a state in which the upper mother substrate 110 is rotated 90 degrees, the second upper cutting schedule line which divides the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction. (Pre Scribe Line) 117b is formed sequentially. In this case, the second upper cutting plan line 117b is formed to correspond to the second upper preliminary cutting line 115b formed on the lower surface of the mother substrate 110.

Next, as shown in FIG. 5H, the bonded upper and lower mother substrates 110 and 120 are inverted up and down, and the lower mother substrate 120 is disposed upward.

Subsequently, as illustrated in FIG. 5I, the first lower cutting part partitioning the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction on the lower mother substrate 120. Pre Scribe Lines 127a are sequentially formed. In this case, the first lower cutting schedule line 127a is formed to correspond to the first lower preliminary schedule line 125a formed on the lower surface of the mother substrate 120.

Next, while rotating the lower mother substrate 120 by 90 degrees, the second lower cutting schedule which partitions the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction. Pre Scribe Lines 127b are sequentially formed. In this case, the second lower cutting schedule line 127b is formed to correspond to the second lower preliminary schedule line 125b formed on the bottom surface of the mother substrate 110.

Subsequently, as illustrated in FIG. 5J, the first lower cutting schedule lines 127a of the lower mother substrate 120 may be sequentially hit with the brake bar 150 to sequentially cut the first lower cutting schedule lines 127a. This allows cracks to propagate.

Subsequently, in the state in which the bonded upper and lower mother substrates 110 and 120 are rotated by 90 degrees, the second lower cutting schedule lines 127b of the lower mother substrate 120 are sequentially formed by the brake bar 150. To propagate a crack along the second lower cutting schedule lines 127b.

Thus, first and second upper and lower preliminary cutting lines 115a, 115b, 125a, and 125b are formed on the upper and lower mother substrates 110 and 120, respectively, and the upper and lower mother substrates 110 and 120 are formed. After bonding, the first and second upper and lower cutting lines 117, 117b, 127a and 127b are again formed on the upper and lower mother substrates 110 and 120, and finally, the first and second mother substrates 110 and 120. The cutting process of the upper and lower cutting lines 117, 117b, 127a, and 127b is performed by hitting the break bar 150 using the brake bar 150 to complete the cutting process of the liquid crystal display panel according to the present invention.

In the method of cutting the liquid crystal display panel according to the present invention, the process of forming the first phase, the lower preliminary cut line, and the second phase, the bottom cut line is described with reference to FIGS. 6A to 6D. Same as

6A to 6D are cross-sectional views illustrating a process of forming first and second cutting lines on each of the upper and lower mother substrates before the bonding of the upper and lower mother substrates according to the present invention.

As shown in FIG. 6A, the plurality of liquid crystal display panel regions C may be removed while the wheel 130 is moved in one direction on the upper mother substrate 110 where the plurality of liquid crystal display panel regions C are defined. A first upper pre cut line 115a is formed to divide in one direction. In this case, a damage level (not shown) is formed on the upper surface of the upper mother substrate 110 along the first upper pre cut line 115a.

Next, as shown in FIG. 6B, the plurality of liquid crystal display panel regions C are moved while moving the wheel 130 in one direction on the lower mother substrate 120 on which the plurality of liquid crystal display panel regions C are defined. The first lower pre cut line 125a may be formed to partition the first and second lines in the first direction. In this case, a damage level (not shown) is formed on the upper surface of the lower mother substrate 120 along the first lower pre cut line 125a.

Subsequently, as illustrated in FIG. 6C, the upper mother substrate 110 having the first upper preliminary cutting line 115a and the lower mother substrate 120 having the first lower preliminary cutting line 125a are sealed. The patterns 140 adhere to each other. In this case, the first upper preliminary cutting line 115a of the upper mother substrate 110 and the first lower preliminary cutting line 125a of the lower mother substrate 120 are in contact with the seal pattern 140. Are cemented. Therefore, the first upper preliminary cutting line 115a and the first preliminary cutting line 125a are not exposed on the outer surfaces of the upper and lower mother substrates 120 and 120.

Next, as illustrated in FIG. 6D, the first upper part partitioning the plurality of liquid crystal display panel regions C in the first direction while moving the wheel 130 in one direction on the upper mother substrate 110. Prescribe lines 117a are sequentially formed. In this case, the first upper cutting schedule line 117a is formed to correspond to the first upper preliminary cutting line 115a formed on the bottom surface of the mother substrate 110.

Subsequently, although not shown in the drawing, the bonded upper and lower mother substrates 110 and 120 are inverted up and down, and the lower mother substrate 120 is disposed upward.

Next, a first lower cutting line for dividing the plurality of liquid crystal display panel regions C in a first direction while moving the wheel 130 in one direction on the lower mother substrate 120. 127a is formed sequentially. In this case, the first lower cutting schedule line 127a is formed to correspond to the first lower preliminary schedule line 125a formed on the lower surface of the mother substrate 120.

Subsequently, although not shown in the drawings, the break bar 150 sequentially strikes the first lower cutting schedule lines 127a of the lower mother substrate 120 to crack along the first lower cutting schedule lines 127a. Allow cracks to propagate

FIG. 7 is an enlarged cross-sectional view of part A of FIG. 6D, in the cutting method of the liquid crystal display according to the present invention, in which a seal is in contact with preliminary cutting lines of upper and lower substrates and secondary cutting lines are formed; Schematic diagram schematically showing the state.

Here, the seal pattern is described using the same model as the scribe line as an example, but the present invention is not limited thereto, and the seal pattern is applicable to a model in which the cut line is the outer side of the seal pattern.

As shown in FIG. 7, the first upper and lower cutting schedule lines 117a and 27a formed on the upper and lower mother substrates 110 and 120 are formed on the lower surface of the upper and lower mother substrates 110 and 120. The first upper and lower preliminary cutting lines 115a and 125a are formed to correspond to each other.

8 is a cross-sectional view schematically illustrating a state in which the upper and lower mother substrates bonded through the cutting method of the liquid crystal display according to the present invention are cut.

As shown in FIG. 8, the first upper preliminary cutting line 115a and the lower mother board are hit by the brake bar 150 along the first upper cutting line 117a of the upper mother substrate 110. Cracks are propagated along the first lower preliminary cutting line 125a of the 120 and the seal pattern 140 therebetween to separate and cut the upper and lower mother substrates 110 and 120.

FIG. 9 is a cross-sectional photograph of a mother substrate showing a degree of cracking in preliminary cutting lines and cutting lines of a bonded upper and lower mother substrate in the method of cutting a liquid crystal display according to the present invention.

As shown in FIG. 9, the first upper preliminary cutting line 115a and the lower mother substrate are hit by the brake bar 150 along the first upper cutting line 117a of the upper mother substrate 110. It can be seen that a crack in the first lower preliminary cut line 125a of 120 is well represented.

As described above, in the method of cutting the liquid crystal display panel according to the present invention, pre-scribing lines are first formed on the upper and lower mother substrates before bonding the upper and lower mother substrates. After the lower substrate is bonded, the second cutting lines are formed again, so that the crack formation by the seal is difficult, that is, the surfaces of the upper and lower mother substrates where the seals are in contact with each other. Since a prescribing line is formed, the crack forming and cutting capability is improved through a preliminary cutting line process.

In addition, the cutting method of the liquid crystal display panel according to the present invention reduces the scribe margin not only in the case of Seal On Scribe of the etching substrate but also in the case of other existing scribe formations, thereby implementing a narrow bezel. It can also be used to make panels.

In the cutting method of the liquid crystal display panel according to the present invention, since a cutting process is performed in a state in which a seal is in contact with a preliminary cutting schedule line formed on each of the upper and lower mother substrates, the breakage rate is reduced. Large size seal on scribing is possible.

Moreover, the present invention can reduce the scribe margin, which could not be reduced in the past, when applying a model outside the seal, and when applied to a model above the seal. In addition, problems that could only be performed in the existing etching substrate may be possible even when not etched, and when etching, the margin may be further reduced.

In the present invention, the liquid crystal display panels of the first size have been described in detail. However, those skilled in the art to which the present invention pertains may include the number and number of liquid crystal display panels within a range not departing from the technical idea of the present invention. It may be easily changed and applied to the case of various sizes.

110: upper mother substrate 115a, 115b: first and second upper preliminary cut lines
117a, 117b: First and second upper cutting line
120: lower mother substrate 125a, 125b: first and second lower preliminary cut lines
127a, 127b: first and second lower cutting schedule lines
130: wheel 140: seal pattern
150: brake bar

Claims

Forming upper preliminary cutting lines on the upper mother substrate on which the plurality of liquid crystal display panel regions are formed;
Forming lower preliminary cutting lines on a lower mother substrate on which a plurality of liquid crystal display panel regions are formed;
Bonding the upper mother substrate on which the upper preliminary cutting lines are formed and the lower mother substrate on which the lower preliminary cutting lines are formed;
Forming upper cutting lines on the bonded upper mother substrate;
Forming lower cutting lines on the bonded lower mother substrate; And
And applying a predetermined pressure along lower cutting schedule lines formed on the lower mother substrate to allow cracks to propagate.
The upper preliminary cutting line of the upper mother substrate and the lower preliminary cutting line of the lower mother substrate are bonded to each other in contact with a seal pattern.

The method of claim 1,
And the upper cutting schedule lines of the upper mother substrate correspond to the upper preliminary cutting schedule lines.

The method of claim 1,
And the lower cutting schedule lines of the lower mother substrate are positioned to correspond to the lower preliminary cutting schedule lines.

The method of claim 1,
And the lower preliminary lines to be cut are formed in the shape of being recessed in the direction of the lower lines to be cut.

The method of claim 1,
And the upper preliminary lines to be cut are formed in the shape of being recessed in the direction of the upper lines to be cut.

The method of claim 1,
And said crack propagates on said seal pattern.