CN203722999U - Adhesive film for adhering to substrate - Google Patents
Adhesive film for adhering to substrate Download PDFInfo
- Publication number
- CN203722999U CN203722999U CN201420078258.9U CN201420078258U CN203722999U CN 203722999 U CN203722999 U CN 203722999U CN 201420078258 U CN201420078258 U CN 201420078258U CN 203722999 U CN203722999 U CN 203722999U
- Authority
- CN
- China
- Prior art keywords
- joint
- rete
- opening
- subsides
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 239000002313 adhesive film Substances 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 108
- 238000005520 cutting process Methods 0.000 claims abstract description 83
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2901—Shape
- H01L2224/29012—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
Abstract
The utility model provides a pad pasting for laminating on the base plate, wherein the pad pasting has rete, opening and cutting line structure. The opening is formed on the film layer and is used for connecting the substrate to the flexible circuit board. The cutting line structure is formed on the film layer and is provided with a plurality of cutting lines, wherein the cutting lines form cutting lines, and the cutting lines are arranged to extend from the edge of the opening to the edge of the die layer, so that a user can tear the adhesive material body along the cutting line aligning part from the edge.
Description
Technical field
The utility model relates to a kind of material that pastes, and relates in particular to a kind of for fitting in the subsides material of semiconductor substrate.
Background technology
Semiconductor device has many circuit, and the substrate of for example contact panel is often covered with complicated circuit pattern, and this circuit is set to be coupled in other assemblies via transmission line, must reserve so be applied in the subsides material of semiconductor device the space that transmission line is set.But convenience when pasting material re-posted is pasted material and conventionally cannot be pasted whole semiconductor device, thereby makes semiconductor device in the time that static sent out test, be caused semiconductor device to lose efficacy by electrostatic breakdown or damage.
If in order to improve the protectiveness for static, can cause transmission line to come off because pullling transmission line or loose contact again when heavy industry, and because heavily man-hour requirement is used additional means, the efficiency of heavy industry also can significantly reduce.So the design of existing subsides material cannot take into account convenience and protectiveness simultaneously.
Utility model content
The utility model is intended to solve at least to a certain extent one of technical problem in correlation technique.
The utility model provides a kind of for fitting in the subsides material on semiconductor substrate on the one hand, comprising: rete; Opening, is formed on described rete and is provided for making described semiconductor substrate to be connected in external module; And sanction line structure, be formed on described rete and there are multiple joint-cuttings, wherein said multiple joint-cuttings form joint-cutting line, and described joint-cutting line is set to be extended to by the edge of described opening the edge of described mould layer.
The utility model provides a kind of contact panel on the other hand, comprising: substrate; Paste material, there is rete and fit on described substrate; Opening, is formed on described rete; And sanction line structure, be formed on described rete and there are multiple joint-cuttings, wherein said multiple joint-cuttings form at least one joint-cutting line, and described joint-cutting line is set to be extended to by the edge of described opening the edge of described rete.
The utility model provides a kind of for fitting in the removable subsides material of semiconductor subassembly more on the one hand, comprising: paste material body; Opening, is formed on described subsides material body; And sanction line structure, be formed on described subsides material body and there is accurate joint-cutting line, and described accurate joint-cutting line extends in described opening and at least approaches between the edge of described subsides material body, be beneficial to user and described in described accurate joint-cutting line part tear fracture, paste material body from described edge.
Brief description of the drawings
From below, about understanding in more detail the utility model the description of preferred embodiment, these preferred embodiments provide as an example, and are understood by reference to the accompanying drawings, wherein:
Fig. 1 is the schematic diagram that fits in semiconductor substrate by pasting material according to the utility model embodiment;
Fig. 2 is according to the vertical view of the subsides material of the utility model embodiment;
Fig. 3-Fig. 5 is the vertical view with the different subsides materials of cutting out line structure according to the utility model embodiment;
Fig. 6-Fig. 7 is the schematic diagram that pastes material that removes according to the utility model embodiment.
Reference numeral:
100: semiconductor substrate 105: glass substrate
110: nesa coating 115: circuit pattern
200: paste material 205: first surface
210: the second 215: opening
220: joint-cutting line 225: joint-cutting
300: paste material 315: opening
320: joint-cutting line 325: joint-cutting
330: the second blocks of 335: the first blocks
400: paste material 420: joint-cutting line
500: paste material 520: joint-cutting line
535: the second blocks of 530: the first blocks
545: the four blocks of 540: the three blocks
360: edge 560: edge
600: paste material 600a: region
Embodiment
The utility model can be fully understood by following embodiment explanation, and those skilled in the art can be completed accordingly, implement kenel but enforcement of the present utility model not can be limited by the following example it.
Term " better " is nonexcludability herein, should be understood to " be preferably but be not limited to ", described in any specification or claims or record any step can carry out in any order, and be not limited to the order described in claims, scope of the present utility model should only be determined by appended claims and impartial scheme thereof, should do not determined by the embodiment of execution mode example.
Term " comprises " and changes while appearing in specification and claims, is open term, does not have restrictive sense, does not get rid of other features or step.
Refer to Fig. 1, Fig. 1 is the schematic diagram that fits in semiconductor substrate by pasting material according to the utility model embodiment.In Fig. 1, semiconductor substrate 100 comprises glass substrate 105, nesa coating 110 and circuit pattern 115, paste material 200 comprise first surface 205 with second 210, and subsides material 200 for fitting in semiconductor substrate 100.Preferably, the first surface 205 that pastes material 200 is non-glue faces, and second 210 is glue face, and wherein the glue material of glue face has for repeated adhesion characteristic, has fitted in after semiconductor substrate 100 at subsides material 200, pastes material 200 and is optionally removed.
Refer to Fig. 2, Fig. 2 is according to the vertical view of the subsides material of the utility model embodiment.In Fig. 2, paste material 200 and comprise opening 215 and joint-cutting line 220, wherein joint-cutting line 220 comprises multiple joint-cuttings 225.Opening 215 is provided for making to paste material 200 and fits in after semiconductor substrate 100, and the circuit pattern 115 on semiconductor substrate 100 can connect external module by opening 215, for example flexible printed circuit board, printed circuit board (PCB), aluminium base and copper base.Preferably, pasting material 200 is the rete (film) with the combination of anti-scratch material, reduction reflectivity material, anti-dazzle material or above-mentioned material.Preferably, the shape of opening 215 is optional from rectangle, round, ellipse or polygonal.Preferably, opening 215 can be arranged at arbitrary place of pasting on material 200, for example: paste the centre that material 200 keeps to the side place or pastes material 200.Preferably, paste material 200 multiple openings 215 can be set.Preferably, the formation of joint-cutting 225 can make to paste the first surface 205 of material 200 and second 210 and respectively have joint-cutting mouth, and joint-cutting 225 is set to run through and pastes material 200.Preferably, the formation of joint-cutting 225 can make the first surface that pastes material 200 have joint-cutting mouth but not penetrate second 210, and joint-cutting 225 is set to form groove pasting on the first surface of material 200, pastes second of material 200 but do not run through.
Refer to Fig. 3-Fig. 5, Fig. 3-Fig. 5 is the vertical view with the different subsides materials of cutting out line structure according to the utility model embodiment.In Fig. 3, paste material 300 and comprise opening 315 and two joint-cutting lines 320, wherein joint-cutting line 320 has multiple joint-cuttings 325, and subsides material 300 is divided into the first block 330 and the second block 335 by two joint-cutting lines 320.Fit on semiconductor substrate but because pasting material 300 and semiconductor substrate and do not paste neat aligning need remove time when pasting material 300, operating personnel only need remove part block, for example, operating personnel optionally remove the first block 335 and retain the second block 330 simultaneously, can increase significantly thus the efficiency of heavy industry and the yield of product.In Fig. 4, paste material 400 and there are two joint-cutting lines 420, and joint-cutting line 420 is curve.
In Fig. 5, paste material 500 and comprise four joint-cutting lines 520, wherein paste material 500 and divided into the first block 530, the second block 535, the 3rd block 540 and the 4th block 545 by joint-cutting line 520, wherein the 3rd block 540 and the area of the 4th block 545 equate and are less than the area of the first block 530.Subsides material 500 shown in Fig. 5 with the difference of the subsides material 300 shown in Fig. 3 is, between the long limit of the opening 315 of subsides material 300 and edge 360, there is the first block 330, there is the first block 530, the 3rd block 540 and the 4th block 545 and paste between the long limit of opening 515 of material 500 and edge 560, pasted material more than 500 the 3rd block 540 and the 4th block 545.When the block that produces skew need be removed when the reason of operating personnel based on described in above-described embodiment, for example the second block 535 need to be removed, operating personnel can remove Second Region piece 535, the 3rd block 540 and the 4th block 545 also retain the first block 530, and then re-posted the second block 535, the 3rd block 540 and the 4th block 545 are set to heavy industry trough, when its advantage is heavy industry, because there is heavy industry trough, the second block 535 of re-posted can not cover the first block 530 of reservation, and then the surface that can make to paste material 500 can be because of overlapping and bossed out-of-flatness place of block, contribute to the laminating of follow-up other materials or rete.Preferably, the width of opening 515 is 5mm, and length is 10mm.
Refer to Fig. 6-Fig. 7, Fig. 6-Fig. 7 is the schematic diagram that pastes material that removes according to the utility model embodiment.As shown in Figure 6, paste material 600 and originally should fit in the position of region 600a, but produce deviation during because of laminating, so must remove pasting material 600.As shown in Figure 7, because there is the setting of joint-cutting line, operating personnel can comply with joint-cutting line by subsides material easily and remove.
In some embodiment of the present utility model, the joint-cutting line pasting on material can be formed by modes such as laser, line cutting and cutting dies.
The utility model has the advantage of that joint-cutting line has multiple joint-cuttings, paste when material is removed and can split along joint-cutting line, for example, so can not pull the external module having connected, flexible printed circuit board.Thus, while removing, just can not have influence on the connective stability of external module and semiconductor substrate, also not have the problem that external module comes off or signal is bad.In addition, see through design of the present utility model, pasting material can directly remove with hand, does not need to bestow other instruments, such as scissors, cutter etc. again.In other words, the utility model can significantly improve the efficiency of heavy industry, and yield while improving re-posted is to guarantee to paste the planarization on material surface.
Another advantage of the present utility model is when carrying out static sent out test (ESD) to product, because design of the present utility model pastes material and still cover most surface on substrate after heavy industry, so product can not caused by electrostatic breakdown damaging.That is to say, by design of the present utility model, neither easily pull flexible printed circuit board when heavy industry, again can protective substrate not breakdown, the utility model has high heavy industry and high protectiveness simultaneously.
Embodiment how of the present utility model is below provided.
Embodiment 1: a kind of for fitting in the subsides material on semiconductor substrate, comprising: rete; Opening, is formed on rete and is provided for making semiconductor substrate to be connected in external module; And sanction line structure, be formed on rete and there are multiple joint-cuttings, wherein multiple joint-cuttings form joint-cutting line, and joint-cutting line is set to be extended to by the edge of opening the edge of mould layer.
Embodiment 2: the subsides material as described in previous embodiment 1, wherein to cut out line structure and also comprise many joint-cutting lines, rete is divided into multiple blocks by many joint-cutting lines, and the adjacent position of the plurality of block has the multiple points of contact that do not separated by multiple joint-cuttings.
Embodiment 3: the subsides material as described in aforementioned each embodiment, wherein this sanction line structure also comprises many joint-cutting lines, rete is separated into multiple blocks by many joint-cutting lines.
Embodiment 4: the subsides material as described in aforementioned each embodiment, wherein external module is selected from flexible printed circuit board, printed circuit board (PCB), aluminium base and copper base.
Embodiment 5: the subsides material as described in aforementioned each embodiment, wherein the shape of this opening is selected from rectangle, round, ellipse and polygonal.
Embodiment 6: the subsides material as described in aforementioned each embodiment, wherein the material of rete is selected from anti-scratch material, reduction reflectivity material and anti-dazzle material.
Embodiment 7: the subsides material as described in aforementioned each embodiment, wherein rete has the characteristic that can be removed after laminating.
Embodiment 8: a kind of contact panel, comprises substrate; Paste material, there is rete and fit on substrate; Opening, is formed on rete; And sanction line structure, be formed on rete and there are multiple joint-cuttings, wherein multiple joint-cuttings form at least one joint-cutting line, and joint-cutting line is set to be extended to by the edge of opening the edge of mould layer.
Embodiment 9: the contact panel as described in aforementioned each embodiment, also comprises nesa coating, electrically-conducting paint layer and transducer.
Embodiment 10: a kind of for fitting in the removable subsides material of semiconductor subassembly, comprising: paste material body; Opening, is formed at and pastes on material body; And sanction line structure, be formed at and paste on material body and there is accurate joint-cutting line, and accurate joint-cutting line extends in opening and at least approach between the edge that pastes material body, be beneficial to user and paste material body from edge along accurate joint-cutting line part tear fracture.
The foregoing is only most preferred embodiment of the present utility model; when not limiting the scope that the utility model is implemented with this; scope of the present utility model should be as the criterion with the scope of claims request protection; the equalization of generally doing according to the scope of the utility model claims request protection changes and modifies, and all should still belong in the scope that the utility model contains.
Claims (10)
1. for fitting in the subsides material on semiconductor substrate, comprising:
Rete;
Opening, is formed on described rete and is provided for making described semiconductor substrate to be connected in external module; And
Cut out line structure, be formed on described rete and have multiple joint-cuttings, wherein said multiple joint-cuttings form joint-cutting line, and described joint-cutting line is set to be extended to by the edge of described opening the edge of described rete.
2. subsides material as claimed in claim 1, wherein, described sanction line structure also comprises many joint-cutting lines, described rete is divided into multiple blocks by described many joint-cutting lines, and the adjacent position of described multiple block has the multiple points of contact that do not separated by described multiple joint-cuttings.
3. subsides material as claimed in claim 1, wherein, described sanction line structure also comprises many joint-cutting lines, described rete is separated into multiple blocks by described many joint-cutting lines.
4. subsides material as claimed in claim 1, wherein, described external module is selected from flexible printed circuit board, printed circuit board (PCB), aluminium base and copper base.
5. subsides material as claimed in claim 1, wherein, the shape of described opening is selected from rectangle, round, ellipse and polygonal.
6. subsides material as claimed in claim 1, wherein, the material of described rete is selected from anti-scratch material, reduction reflectivity material and anti-dazzle material.
7. subsides material as claimed in claim 1, wherein, described rete has the characteristic that can be removed after laminating.
8. a contact panel, comprising:
Substrate;
Paste material, there is rete and fit on described substrate;
Opening, is formed on described rete; And
Cut out line structure, be formed on described rete and have multiple joint-cuttings, wherein said multiple joint-cuttings form at least one joint-cutting line, and described joint-cutting line is set to be extended to by the edge of described opening the edge of described rete.
9. contact panel as claimed in claim 8, also comprises nesa coating, electrically-conducting paint layer and transducer.
10. for fitting in a removable subsides material for semiconductor subassembly, comprising:
Paste material body;
Opening, is formed on described subsides material body; And
Cut out line structure, be formed on described subsides material body and there is accurate joint-cutting line, and described accurate joint-cutting line extends in described opening and at least approaches between the edge of described subsides material body, be beneficial to user and described in described accurate joint-cutting line part tear fracture, paste material body from described edge.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102224433 | 2013-12-25 | ||
| TW102224433U TWM483174U (en) | 2013-12-25 | 2013-12-25 | Adhesive film for adhering to substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203722999U true CN203722999U (en) | 2014-07-16 |
Family
ID=51162114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420078258.9U Expired - Fee Related CN203722999U (en) | 2013-12-25 | 2014-02-21 | Adhesive film for adhering to substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3195233U (en) |
| CN (1) | CN203722999U (en) |
| DE (1) | DE202014102749U1 (en) |
| TW (1) | TWM483174U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754928A (en) * | 2013-12-25 | 2015-07-01 | 恒颢科技股份有限公司 | Adhesive film for adhering to substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI602000B (en) * | 2015-12-30 | 2017-10-11 | 友達光電股份有限公司 | Conductive tape, panel device and adhering method of the conductive tape |
-
2013
- 2013-12-25 TW TW102224433U patent/TWM483174U/en unknown
-
2014
- 2014-02-21 CN CN201420078258.9U patent/CN203722999U/en not_active Expired - Fee Related
- 2014-06-13 DE DE202014102749.1U patent/DE202014102749U1/en not_active Expired - Lifetime
- 2014-10-24 JP JP2014005663U patent/JP3195233U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754928A (en) * | 2013-12-25 | 2015-07-01 | 恒颢科技股份有限公司 | Adhesive film for adhering to substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| DE202014102749U1 (en) | 2014-09-22 |
| JP3195233U (en) | 2015-01-08 |
| TWM483174U (en) | 2014-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20180221 |