CN106488694B - Pasting method in a kind of electronic product groove - Google Patents
Pasting method in a kind of electronic product groove Download PDFInfo
- Publication number
- CN106488694B CN106488694B CN201510540366.2A CN201510540366A CN106488694B CN 106488694 B CN106488694 B CN 106488694B CN 201510540366 A CN201510540366 A CN 201510540366A CN 106488694 B CN106488694 B CN 106488694B
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- Prior art keywords
- patch
- carrier film
- electronic product
- groove
- carrier
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention relates to pasting methods in a kind of electronic product groove, are die cut first to the patch being pasted on egative film, so that patch is die-cut to setting shape, and guarantee that egative film is complete, spaced between the patch on egative film；Carrier, and the chip surface for making the carrier while being bonded in after all cross cuttings are laid on the surface of patch；Carrier is die cut, so that the surface of each patch is correspondingly formed a carrier film, and guarantees that the size of the carrier film corresponds to electronic product inside grooves size, meanwhile, which is greater than patch size；Carrier film is taken off from egative film together with patch, the bonding of patch is face-down, so that carrier film is aligned electronic product inside groove frame, patch and carrier film are bonded in the groove of electronic product；Carrier film is removed from chip surface, only patch is bonded in inside grooves, completes the patch in electronic product groove.Compared with prior art, production efficiency can be improved in the method for the present invention, reduces product defect rate.
Description
Technical field
The present invention relates to a kind of pasting methods, more particularly, to pasting method in a kind of electronic product groove.
Background technique
With the development of electronic communication industry, as the electronic products such as mobile phone, tablet computer specification and model are more and more.And
Generally shielding case can will be set as at rear cover in these electronic products, and shielding case is generally not regular flat shape, and
It is the internal reeded lid of tool, while according to product difference, the depth or shape of groove be not also identical, along on shielding case
Through-hole or some spliced eyes etc. for camera to be arranged often are opened up, pad pasting region inside shielding case is caused to be also not smooth
Structure.
It needs to carry out patch process in the groove of shielding case before the factory of these electronic products, general patch is exactly to have
The one side glue of special nature, and current way is the patch hand paste that will cut in groove, and the patch cut
Usually be directly bonded on egative film, need to pick up patch with tweezers before stickup, be attached in groove, pay attention to sometimes patch with
Four sides of groove will be there are certain gap, and manual in this way goes to paste, and the gap precision stayed is not high, and that pastes can not protect
Card is very straight, and production capacity is low, and fraction defective is high.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of raising production efficiency,
Reduce pasting method in the electronic product groove of fraction defective.
The purpose of the present invention can be achieved through the following technical solutions:
Pasting method in a kind of electronic product groove, comprising the following steps:
(1) patch being pasted on egative film is die cut, so that patch is die-cut to setting shape, and guarantees that egative film is complete
It is whole, it is spaced between the patch on egative film；
(2) carrier, and the chip surface for making the carrier while being bonded in after all cross cuttings are laid on the surface of patch；
(3) carrier is die cut, so that the surface of each patch is correspondingly formed a carrier film, and guarantees the carrier
The size of film corresponds to electronic product inside grooves size, meanwhile, which is greater than patch size；
(4) carrier film is taken off from egative film together with patch, the bonding of patch is face-down, so that carrier film is aligned electronics
Product inside groove frame, patch and carrier film are bonded in the groove of electronic product；
(5) carrier film is removed from chip surface, only patch is bonded in inside grooves, completes in electronic product groove
Patch.
The width of the carrier film is equal with recess width, and the carrier film length is longer than groove, and carrier film is longer than
Portion is taken as hand in the position of groove.The carrier film was not only wider than patch but also longer than patch, while patch being kept to be located at carrier film
The centre of width direction, length direction, patch are located at the side of carrier film.The width difference and patch of the carrier film and patch
Preset clearance is equal between groove.
The lower surface of the patch is adhesive surface, and upper surface is shiny surface.The upper surface of the carrier film is smooth
Face, lower surface are adhesive surface, and take carrier film off bak stay surface from patch and keep smooth.
The carrier film is hard films.
The patch is flexible membrane.
Above-mentioned electronic product groove is particularly suitable for Mobile phone shielding case groove.
Compared with prior art, the present invention has the following advantages and beneficial effects:
1, the present invention in chip surface has pasted carrier film, and limit carrier film and patch width difference and patch with it is recessed
Preset clearance is equal between slot, and defines that carrier film width is equal with recess width, when pasting in this way, passes through carrier film
Position-limiting action enables patch to be accurately bonded in the setting position in groove, improves the accuracy rate of stickup, reduces production
The fraction defective of product.
2, the present invention has pasted carrier film in chip surface, and makes carrier film length longer than groove, and carrier film is longer than
Portion is taken as hand in the position of groove, and patch is directly bonded in compared to tradition the mode of operation of groove in this way, improves operation
Convenience is conducive to improve production efficiency.
3, patch is bonded in groove by the present invention by carrier film, and whole process does not need to touch patch, so that patch is clean
Degree is high, improves product quality.
4, the carrier film taken off can also recycle.
5, the present invention is defined the viscosity of carrier film adhesive surface, so that taking carrier film off bak stay from patch
Surface keeps smooth, does not need to carry out cleaning treatment to chip surface.
6, carrier film is designed as hard films, facilitate positioning and bonding, by patch design be flexible membrane, be conducive to patch with
Bonds well in groove is close to.
Detailed description of the invention
Fig. 1 is structural schematic diagram after egative film, patch and carrier film are die cut；
Fig. 2 is that patch and carrier film are pasted onto groove pre-structure schematic diagram；
Fig. 3 is that patch and carrier film are pasted onto structural schematic diagram after groove.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment
Pasting method in a kind of electronic product groove, comprising the following steps:
(1) patch being pasted on egative film is die cut, so that patch is die-cut to setting shape, and guarantees that egative film is complete
It is whole, it is spaced between the patch on egative film, it is laid with carrier on the surface of patch, and make the carrier while being bonded in all cross cuttings
Chip surface afterwards, is die cut carrier, so that the surface of each patch is correspondingly formed a carrier film, and guarantees the load
The size of body film corresponds to electronic product inside grooves size, meanwhile, the carrier film size be greater than patch size, carrier cross cutting after such as
Shown in Fig. 1, it is arranged with patch 2 on egative film 1, is equipped with carrier film 3 on 2 surface of patch；Carrier film 3 is hard films.Patch 2 is flexibility
Film.
Wherein, the width of carrier film is equal with recess width, and carrier film length is longer than groove, and carrier film is longer than the portion of groove
Portion is taken as hand in position.Carrier film was not only wider than patch but also longer than patch, while patch being kept to be located at the centre of carrier film width direction,
Length direction, patch are located at the side of carrier film.Preset clearance phase between carrier film and the width difference and patch and groove of patch
Deng；The lower surface of patch is adhesive surface, and upper surface is shiny surface.The upper surface of carrier film is shiny surface, and lower surface is adhesive surface,
And carrier film is taken off to bak stay surface from patch and keeps smooth.
(2) carrier film 3 is taken off from egative film together with patch 2, the bonding of patch 2 is face-down, so that carrier film 3 is aligned
4 frame of electronic product inside groove, as shown in Fig. 2, and patch 2 and carrier film 3 are bonded in the groove 4 of electronic product, such as Fig. 3 institute
Show；
(3) carrier film is removed from chip surface, only patch is bonded in inside grooves, completes in electronic product groove
Patch.
In the present embodiment, above-mentioned electronic product groove is specially in Mobile phone shielding case groove.
The above description of the embodiments is intended to facilitate ordinary skill in the art to understand and use the invention.
Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein general
Principle is applied in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments, ability
Field technique personnel announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be of the invention
Within protection scope.
Claims (5)
1. pasting method in a kind of electronic product groove, which comprises the following steps:
(1) patch being pasted on egative film is die cut, so that patch is die-cut to setting shape, and guarantees that egative film is complete,
It is spaced between patch on egative film；
(2) carrier, and the chip surface for making the carrier while being bonded in after all cross cuttings are laid on the surface of patch；
(3) carrier is die cut, so that the surface of each patch is correspondingly formed a carrier film, and guarantees the carrier film
Size corresponds to electronic product inside grooves size, meanwhile, which is greater than patch size；
(4) carrier film is taken off from egative film together with patch, the bonding of patch is face-down, so that carrier film is aligned electronic product
Inside groove frame, patch and carrier film are bonded in the groove of electronic product；
(5) carrier film is removed from chip surface, only patch is bonded in inside grooves, completes the patch in electronic product groove
Piece；
The lower surface of the patch is adhesive surface, and upper surface is shiny surface, and the upper surface of the carrier film is shiny surface, under
Surface is adhesive surface, and it is hard films, institute that carrier film, which is taken off bak stay surface to keep smooth, described carrier film from patch,
The patch stated is flexible membrane.
2. pasting method in a kind of electronic product groove according to claim 1, which is characterized in that the carrier film was both
It is wider than patch and longer than patch, while patch being kept to be located at the centre of carrier film width direction, length direction, patch is located at carrier
The side of film.
3. pasting method in a kind of electronic product groove according to claim 2, which is characterized in that the carrier film
Width is equal with recess width, and the carrier film length is longer than groove, and portion is taken as hand in the position that carrier film is longer than groove.
4. pasting method in a kind of electronic product groove according to claim 2, which is characterized in that the carrier film with
Preset clearance is equal between the width difference and patch and groove of patch.
5. pasting method in a kind of electronic product groove according to claim 1, which is characterized in that the electronic product
Groove is Mobile phone shielding case groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510540366.2A CN106488694B (en) | 2015-08-28 | 2015-08-28 | Pasting method in a kind of electronic product groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510540366.2A CN106488694B (en) | 2015-08-28 | 2015-08-28 | Pasting method in a kind of electronic product groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106488694A CN106488694A (en) | 2017-03-08 |
| CN106488694B true CN106488694B (en) | 2019-07-09 |
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ID=58235921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510540366.2A Expired - Fee Related CN106488694B (en) | 2015-08-28 | 2015-08-28 | Pasting method in a kind of electronic product groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106488694B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662396B (en) * | 2019-09-23 | 2020-11-17 | 苏州泰吉诺新材料科技有限公司 | Automatic paster equipment of online automatic paster method |
| CN113099633B (en) * | 2019-12-23 | 2022-09-16 | 深圳市亚达明科技有限公司 | Method for sticking mobile communication product in groove |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202753552U (en) * | 2012-08-29 | 2013-02-27 | 新航发泡塑料（苏州）有限公司 | Propene polymer (PP) plate paster tool |
| CN203416517U (en) * | 2013-08-27 | 2014-01-29 | 苏州恒铭达电子科技有限公司 | Structure for arranging special-shaped SMDs (surface mounted devices) |
| CN203428077U (en) * | 2013-01-17 | 2014-02-12 | 郑圣馨 | Pad pasting device of quick diolame |
| CN103645580A (en) * | 2013-12-26 | 2014-03-19 | 星源电子科技(深圳)有限公司 | Connected polaroid attachment production method |
| CN203752244U (en) * | 2013-12-30 | 2014-08-06 | 上海景奕电子科技有限公司 | Straight knife die cutting system for processing paper substrate die cutting piece |
-
2015
- 2015-08-28 CN CN201510540366.2A patent/CN106488694B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202753552U (en) * | 2012-08-29 | 2013-02-27 | 新航发泡塑料（苏州）有限公司 | Propene polymer (PP) plate paster tool |
| CN203428077U (en) * | 2013-01-17 | 2014-02-12 | 郑圣馨 | Pad pasting device of quick diolame |
| CN203416517U (en) * | 2013-08-27 | 2014-01-29 | 苏州恒铭达电子科技有限公司 | Structure for arranging special-shaped SMDs (surface mounted devices) |
| CN103645580A (en) * | 2013-12-26 | 2014-03-19 | 星源电子科技(深圳)有限公司 | Connected polaroid attachment production method |
| CN203752244U (en) * | 2013-12-30 | 2014-08-06 | 上海景奕电子科技有限公司 | Straight knife die cutting system for processing paper substrate die cutting piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106488694A (en) | 2017-03-08 |
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