CN106488694A - Pasting method in a kind of electronic product groove - Google Patents
Pasting method in a kind of electronic product groove Download PDFInfo
- Publication number
- CN106488694A CN106488694A CN201510540366.2A CN201510540366A CN106488694A CN 106488694 A CN106488694 A CN 106488694A CN 201510540366 A CN201510540366 A CN 201510540366A CN 106488694 A CN106488694 A CN 106488694A
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- paster
- carrier film
- electronic product
- groove
- carrier
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to pasting method in a kind of electronic product groove, first the paster being pasted onto on egative film is die cut so that paster is die-cut to set shape, and is ensured that egative film is complete, spaced between the paster on egative film；The surface of paster lay carrier, and make this carrier be bonded in simultaneously all cross cutting after chip surface；Carrier is die cut so that the surface of each paster is all correspondingly formed a carrier film, and is ensured that the size of this carrier film corresponds to electronic product inside grooves size, meanwhile, this carrier film size is more than patch size；Carrier film is taken off together with paster from egative film, the bonding of paster is faced down so that carrier film alignment electronic product inside groove frame, paster and carrier film are bonded in the groove of electronic product；Carrier film is taken off from chip surface, only paster is bonded in inside grooves, complete the paster in electronic product groove.Compared with prior art, the inventive method can reduce product fraction defective with improve production efficiency.
Description
Technical field
The present invention relates to a kind of pasting method, especially relate to pasting method in a kind of electronic product groove.
Background technology
With the development of electronic communication industry, as the electronic product specification such as mobile phone, panel computer and model increasingly
Many.And in these electronic products typically can by bonnet at be set to radome, and radome be generally not regular
Flat shape, but internal have reeded lid, simultaneously different according to product, the depth of groove or shape are not yet
Identical, along with the through hole often opening up on radome for arranging photographic head or some spliced eyes etc., lead to shield
Covering the internal pad pasting region of cover is not flat configuration.
These electronic products need before dispatching from the factory to carry out paster operation in the groove of radome, and general paster is exactly
There is the one side glue of special nature, and current way is by the paster cutting hand paste in groove, and cut out
The paster shearing usually is directly bonded on egative film, needs to pick up paster tweezers, be attached to groove before stickup
In, notice that certain gap will be left in paster and four sides of groove sometimes, so manual goes the gap essence pasted, stay
Accuracy is not high, and cannot guarantee that of pasting is very straight, and production capacity is low, and fraction defective is high.
Content of the invention
The purpose of the present invention is exactly to overcome the defect of above-mentioned prior art presence to provide a kind of raising to produce effect
Pasting method in rate, the electronic product groove of reduction fraction defective.
The purpose of the present invention can be achieved through the following technical solutions：
Pasting method in a kind of electronic product groove, comprises the following steps：
(1) paster being pasted onto on egative film is die cut so that paster is die-cut to set shape, and is ensured
Egative film is complete, spaced between the paster on egative film；
(2) the surface of paster lay carrier, and make this carrier be bonded in simultaneously all cross cutting after chip surface；
(3) carrier is die cut so that the surface of each paster is all correspondingly formed a carrier film, and is ensured
The size of this carrier film corresponds to electronic product inside grooves size, and meanwhile, this carrier film size is more than patch size；
(4) carrier film is taken off together with paster from egative film, the bonding of paster is faced down so that carrier film pair
Neat electronic product inside groove frame, paster and carrier film are bonded in the groove of electronic product；
(5) carrier film is taken off from chip surface, only paster is bonded in inside grooves, complete electronic product recessed
Paster in groove.
The width of described carrier film is equal with recess width, and described carrier film length is longer than groove, and carrier film is long
In groove position as hand-held portion.Described carrier film was not only wide than paster but also longer than paster, kept paster position simultaneously
In the centre of carrier film width, length direction, paster is located at the side of carrier film.Described carrier film and patch
Between the stand out of piece and paster and groove, preset clearance is equal.
The lower surface of described paster is adhesive surface, and upper surface is shiny surface.The upper surface of described carrier film is light
Sliding surface, lower surface is adhesive surface, and it is smooth carrier film to be taken from paster off the holding of bak stay surface.
Described carrier film is hard films.
Described paster is flexible membrane.
Above-mentioned electronic product groove is particularly suited for Mobile phone shielding case groove.
Compared with prior art, the present invention has advantages below and beneficial effect：
1st, the present invention has pasted carrier film in chip surface, and limits stand out and the paster of carrier film and paster
Preset clearance is equal between groove, and defines that carrier film width is equal with recess width, when so pasting,
The setting position that paster is accurately bonded in groove is enable by the position-limiting action of carrier film, improves stickup
Accuracy rate, reduce the fraction defective of product.
2nd, the present invention has pasted carrier film in chip surface, and makes carrier film length longer than groove, carrier film
Paster, as hand-held portion, is so directly bonded in the mode of operation of groove by the position being longer than groove compared to tradition,
Improve simple operation, be conducive to improve production efficiency.
3rd, the present invention by carrier film, paster is bonded in groove, and whole process does not need to touch paster so that paster
Cleanliness factor is high, improves product quality.
4th, the carrier film taken off can also recycle.
5th, after the present invention is defined so that taking carrier film from paster off to the viscosity of carrier film adhesive surface
Chip surface keeps smooth it is not necessary to be cleaned to chip surface processing.
6th, carrier film is designed as hard films, conveniently positioning and bonding, patch design are flexible membrane, are conducive to
Paster is close to the bonds well in groove.
Brief description
Fig. 1 is structural representation after egative film, paster and carrier film are die cut；
Fig. 2 is that paster and carrier film are pasted onto groove pre-structure schematic diagram；
Fig. 3 is that paster and carrier film are pasted onto structural representation after groove.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment
Pasting method in a kind of electronic product groove, comprises the following steps：
(1) paster being pasted onto on egative film is die cut so that paster is die-cut to set shape, and is ensured
Egative film is complete, spaced between the paster on egative film, lays carrier on the surface of paster, and makes this carrier simultaneously
It is bonded in the chip surface after all cross cuttings, carrier is die cut so that the surface of each paster is all correspondingly formed
One carrier film, and ensure the size correspondence electronic product inside grooves size of this carrier film, meanwhile, this carrier film
Size is more than patch size, as shown in figure 1, being arranged with paster 2 on egative film 1 after carrier cross cutting, in paster 2 table
Face is provided with carrier film 3；Carrier film 3 is hard films.Paster 2 is flexible membrane.
Wherein, the width of carrier film is equal with recess width, and carrier film length is longer than groove, and carrier film is longer than groove
Position as hand-held portion.Carrier film was not only wide than paster but also longer than paster, kept paster to be located at carrier film width simultaneously
The centre in direction, length direction, paster is located at the side of carrier film.The stand out of carrier film and paster and paster with
Between groove, preset clearance is equal；The lower surface of paster is adhesive surface, and upper surface is shiny surface.The upper table of carrier film
Face is shiny surface, and lower surface is adhesive surface, and it is smooth carrier film to be taken from paster off the holding of bak stay surface.
(2) carrier film 3 is taken off together with paster 2 from egative film, the bonding of paster 2 is faced down so that carrying
Body film 3 alignment electronic product inside groove 4 frame, as shown in Fig. 2 and be bonded in electronics by paster 2 and carrier film 3
In the groove 4 of product, as shown in Figure 3；
(3) carrier film is taken off from chip surface, only paster is bonded in inside grooves, complete electronic product recessed
Paster in groove.
In the present embodiment, above-mentioned electronic product groove is specially in Mobile phone shielding case groove.
The above-mentioned description to embodiment is to be understood that for ease of those skilled in the art and use to send out
Bright.Person skilled in the art obviously easily can make various modifications to these embodiments, and here
The General Principle illustrating is applied in other embodiment without through performing creative labour.Therefore, the present invention does not limit
In above-described embodiment, those skilled in the art according to the announcement of the present invention, without departing from changing that scope is made
Entering and change all should be within protection scope of the present invention.
Claims (9)
1. in a kind of electronic product groove pasting method it is characterised in that comprising the following steps：
(1) paster being pasted onto on egative film is die cut so that paster is die-cut to set shape, and is ensured
Egative film is complete, spaced between the paster on egative film；
(2) the surface of paster lay carrier, and make this carrier be bonded in simultaneously all cross cutting after chip surface；
(3) carrier is die cut so that the surface of each paster is all correspondingly formed a carrier film, and is ensured
The size of this carrier film corresponds to electronic product inside grooves size, and meanwhile, this carrier film size is more than patch size；
(4) carrier film is taken off together with paster from egative film, the bonding of paster is faced down so that carrier film pair
Neat electronic product inside groove frame, paster and carrier film are bonded in the groove of electronic product；
(5) carrier film is taken off from chip surface, only paster is bonded in inside grooves, complete electronic product recessed
Paster in groove.
2. in a kind of electronic product groove according to claim 1 pasting method it is characterised in that described
Carrier film not only wide than paster but also longer than paster, simultaneously keep paster be located at carrier film width centre, length
Direction, paster is located at the side of carrier film.
3. in a kind of electronic product groove according to claim 2 pasting method it is characterised in that described
Carrier film width equal with recess width, described carrier film length is longer than groove, and carrier film is longer than groove
Position is as hand-held portion.
4. in a kind of electronic product groove according to claim 2 pasting method it is characterised in that described
The stand out of carrier film and paster and paster and groove between preset clearance equal.
5. in a kind of electronic product groove according to claim 1 pasting method it is characterised in that described
Paster lower surface be adhesive surface, upper surface be shiny surface.
6. in a kind of electronic product groove according to claim 1 pasting method it is characterised in that described
The upper surface of carrier film be shiny surface, lower surface is adhesive surface, and carrier film is taken from paster off bak stay table
Face keeps smooth.
7. in a kind of electronic product groove according to claim 1 pasting method it is characterised in that described
Carrier film be hard films.
8. in a kind of electronic product groove according to claim 1 pasting method it is characterised in that described
Paster be flexible membrane.
9. in a kind of electronic product groove according to claim 1 pasting method it is characterised in that described
Electronic product groove be Mobile phone shielding case groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510540366.2A CN106488694B (en) | 2015-08-28 | 2015-08-28 | Pasting method in a kind of electronic product groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510540366.2A CN106488694B (en) | 2015-08-28 | 2015-08-28 | Pasting method in a kind of electronic product groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106488694A true CN106488694A (en) | 2017-03-08 |
| CN106488694B CN106488694B (en) | 2019-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510540366.2A Active CN106488694B (en) | 2015-08-28 | 2015-08-28 | Pasting method in a kind of electronic product groove |
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| Country | Link |
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| CN (1) | CN106488694B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662396A (en) * | 2019-09-23 | 2020-01-07 | 苏州泰吉诺新材料科技有限公司 | Online automatic chip mounting method for heat-conducting die-cutting gasket and automatic chip mounting equipment thereof |
| CN113099633A (en) * | 2019-12-23 | 2021-07-09 | 深圳市亚达明科技有限公司 | Method for sticking mobile communication product in groove |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202753552U (en) * | 2012-08-29 | 2013-02-27 | 新航发泡塑料（苏州）有限公司 | Propene polymer (PP) plate paster tool |
| CN203416517U (en) * | 2013-08-27 | 2014-01-29 | 苏州恒铭达电子科技有限公司 | Structure for arranging special-shaped SMDs (surface mounted devices) |
| CN203428077U (en) * | 2013-01-17 | 2014-02-12 | 郑圣馨 | Pad pasting device of quick diolame |
| CN103645580A (en) * | 2013-12-26 | 2014-03-19 | 星源电子科技(深圳)有限公司 | Connected polaroid attachment production method |
| CN203752244U (en) * | 2013-12-30 | 2014-08-06 | 上海景奕电子科技有限公司 | Straight knife die cutting system for processing paper substrate die cutting piece |
-
2015
- 2015-08-28 CN CN201510540366.2A patent/CN106488694B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202753552U (en) * | 2012-08-29 | 2013-02-27 | 新航发泡塑料（苏州）有限公司 | Propene polymer (PP) plate paster tool |
| CN203428077U (en) * | 2013-01-17 | 2014-02-12 | 郑圣馨 | Pad pasting device of quick diolame |
| CN203416517U (en) * | 2013-08-27 | 2014-01-29 | 苏州恒铭达电子科技有限公司 | Structure for arranging special-shaped SMDs (surface mounted devices) |
| CN103645580A (en) * | 2013-12-26 | 2014-03-19 | 星源电子科技(深圳)有限公司 | Connected polaroid attachment production method |
| CN203752244U (en) * | 2013-12-30 | 2014-08-06 | 上海景奕电子科技有限公司 | Straight knife die cutting system for processing paper substrate die cutting piece |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662396A (en) * | 2019-09-23 | 2020-01-07 | 苏州泰吉诺新材料科技有限公司 | Online automatic chip mounting method for heat-conducting die-cutting gasket and automatic chip mounting equipment thereof |
| CN110662396B (en) * | 2019-09-23 | 2020-11-17 | 苏州泰吉诺新材料科技有限公司 | Automatic paster equipment of online automatic paster method |
| CN113099633A (en) * | 2019-12-23 | 2021-07-09 | 深圳市亚达明科技有限公司 | Method for sticking mobile communication product in groove |
| CN113099633B (en) * | 2019-12-23 | 2022-09-16 | 深圳市亚达明科技有限公司 | Method for sticking mobile communication product in groove |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106488694B (en) | 2019-07-09 |
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