CN105390444A - Breaking method for brittle material substrate and breaking device - Google Patents
Breaking method for brittle material substrate and breaking device Download PDFInfo
- Publication number
- CN105390444A CN105390444A CN201510399120.8A CN201510399120A CN105390444A CN 105390444 A CN105390444 A CN 105390444A CN 201510399120 A CN201510399120 A CN 201510399120A CN 105390444 A CN105390444 A CN 105390444A
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- Prior art keywords
- brittle substrate
- disjunction
- diaphragm
- substrate
- interarea
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
The invention provides a breaking method for a brittle material substrate and a breaking device. The breaking method can relatively well protect an abutted surface of the brittle material substrate, prevent attachment of adhesive materials, etc. and avoid generation of residuals. The breaking method for the brittle material substrate comprises the following steps: an etching line forms on the target position of breaking of a main surface side; an adhesive film is bonded on one main surface of the substrate with the etching line expect the peripheral region; a protection film, which is not adhesive to substrate, is made to be in contact with another main body integral surface of the substrate, and a portion, which is not in contact with the substrate, of the protection film is bonded with area which is without the adhesive film so as to configure the protection film on the substrate; in a state that the brittle material substrate provided with the protection film is supported, the front end of an upper edge is made to abut against a breaking preset position, corresponding to the formation position of the etching line, of another main surface side and is simultaneously made to move downward so as to break the brittle material substrate.
Description
Technical field
The invention relates to a kind of method and device of disjunction brittle substrate, especially carry out method and the device of disjunction in three-point bending mode.
Background technology
As the means and methods of the brittle substrates such as disjunction (singualtion of chip) semiconductor substrate, known aspect (such as, with reference to patent documentation 1) have: utilize the sword front end of circular wheel etc. or laser and be formed into the score line of segmentation starting point in the segmentation preset lines being called as path (street), afterwards, brisement device is utilized to apply bending stress to brittle substrate with the means and methods of three-point bending and from segmentation starting point, crackle (be full of cracks) stretched, disjunction substrate whereby.
This disjunction, be generally be located at the framework of circular annular form or rectangular ring and cutting frame (dicingframe) have adhesive dicing tape (dicingtape) by bonding plane, paste the state be fixed with as the brittle substrate of disjunction object and carry out.
In addition; before disjunction; in case stop loss for the purpose of wound or the attachment of preventing pollution thing etc.; known aspect (such as; with reference to patent documentation 2) have: the face opposing face of the face of support side (below during in the brisement) at least abutting side at the upper sword (brisement sword) of the brisement device of brittle substrate, is pasted with the diaphragm that adhesion strength is more weak.
Patent documentation 1: Japanese Unexamined Patent Publication 2014-83821 publication
Patent documentation 2: Japanese Patent No. 4198601 publications
Utilize the disjunction to brittle substrate of brisement device, be on making sword (brisement sword) be connected to below supporting brittle substrate above (by bearing surface) side state under be pressed into further, load centralization is completed whereby in the very small region of upper sword front end.Therefore; as patent documentation 2 announcement, have following situation: the situation of carrying out disjunction under the state using diaphragm, even if its adherence is more weak; the result of this load centralization is, the adhesion of diaphragm still adheres to, remain in a point brittle substrate of having no progeny.
Summary of the invention
The present invention completes in view of above-mentioned problem; its object is to method for dividing and break-up device that a kind of brittle substrate is provided; specifically preferably protect brittle substrate by a bearing surface, and do not have the attachment of adhesion etc., the method for dividing of the residual brittle substrate produced.
In order to solve above-mentioned problem, the invention of the 1st technical scheme, is the method for disjunction brittle substrate, it is characterized in that, possess: score line forming step, and the disjunction object's position in an interarea side of brittle substrate forms score line; Substrate sticking step, will be formed with this interarea of this brittle substrate of this score line, be provided with around and stay white region also while be pasted on adhesive film; Diaphragm configuration step, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and the bonding partially do not contacted with this brittle substrate of this diaphragm is stayed white region at this of this adhesive film, whereby this diaphragm is configured on this brittle substrate; And disjunction step; supporting under the state being configured with this brittle substrate of this diaphragm from below; the front end of sword is made to be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line also while decline, this brittle substrate of disjunction whereby.
The invention of the 2nd technical scheme, is the method for disjunction brittle substrate, it is characterized in that, possess: score line forming step, and the disjunction object's position in an interarea side of brittle substrate forms score line; Substrate sticking step, will be formed with this interarea of this brittle substrate of this score line, be pasted on this adhesive film opening the substrate holding structure being provided with adhesive film in framework; Diaphragm configuration step, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and by the partial fixing do not contacted with this brittle substrate of this diaphragm in this substrate holding structure, whereby this diaphragm is configured on this brittle substrate; And disjunction step; supporting under the state being configured with this brittle substrate of this diaphragm from below; the front end of sword is made to be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line also while decline, this brittle substrate of disjunction whereby.
The invention of the 3rd technical scheme, it is the method for disjunction brittle substrate, it is characterized in that: this interarea disjunction object's position in advance an interarea side being formed with the brittle substrate of score line, be provided with around on one side and stay white region also while be pasted on adhesive film, and, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and the bonding partially do not contacted with this brittle substrate of this diaphragm is stayed white region at this of this adhesive film, afterwards, supporting is configured with this brittle substrate of this diaphragm from below, the front end of sword is made to be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line also while decline, this brittle substrate of disjunction whereby.
The invention of the 4th technical scheme, it is the method for disjunction brittle substrate, it is characterized in that: this interarea disjunction object's position in advance an interarea side being formed with the brittle substrate of score line, be pasted on this adhesive film opening the substrate holding structure being provided with adhesive film in framework, and, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and by the partial fixing do not contacted with this brittle substrate of this diaphragm in this substrate holding structure, afterwards, supporting is configured with this brittle substrate of this diaphragm from below, the front end of sword is made to be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line also while decline, this brittle substrate of disjunction whereby.
The invention of the 5th technical scheme, it is the device for disjunction brittle substrate, it is characterized in that, possess: substrate sticking means, disjunction object's position an interarea side is formed with this interarea of this brittle substrate of score line, is provided with around and stays white region also while be pasted on adhesive film; Diaphragm configuration means, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and the bonding partially do not contacted with this brittle substrate of this diaphragm is stayed white region at this of this adhesive film, whereby this diaphragm is configured on this brittle substrate; Supporting means, supporting is configured with this brittle substrate of this diaphragm from below; Upper sword, makes front end can be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line; And, the means that the disjunction precalculated position making sword on this be connected to this another interarea corresponding with the forming position of this score line also declines.
According to above-mentioned 5 technical schemes of the present invention, the present invention has the following advantages: can adhesion attachment can not be produced, remain in the not good situations such as the monolithic that obtains by disjunction and disjunction brittle substrate.
Accompanying drawing explanation
Fig. 1 is the profile illustrating brittle substrate 1.
Fig. 2 represents the brittle substrate 1 being formed with score line S to be pasted onto the graphic of the appearance of adhesive film 2.
Fig. 3 is represent the appearance be placed in by diaphragm 4 on the interarea 1b of brittle substrate 1 graphic.
Fig. 4 represents the outer peripheral portion of the diaphragm 4 exposed from interarea 1b to be pasted onto the graphic of the appearance of the bonding plane 2a of adhesive film 2.
Fig. 5 is the graphic of the appearance representing disjunction brittle substrate 1.
[main element symbol description]
1: brittle substrate
1a, 1b:(brittle substrate) interarea
2: adhesive film
2a:(adhesive film) bonding plane
3: framework
4: diaphragm
101A, 101B: lower sword
102: upper sword
S: score line
Embodiment
In the present embodiment, be described for the means and methods of so-called three-point bending mode disjunction brittle substrate.Fig. 1 illustrates the profile becoming the brittle substrate 1 of disjunction object in embodiments of the invention.Fig. 2 to Fig. 5 is shown schematically in prepare after brittle substrate 1, the main step of carrying out to disjunction graphic.
As brittle substrate 1, such as, semiconductor substrate (silicon substrate etc.) or glass substrate etc. can be exemplified.At an interarea of semiconductor substrate, the pattern of set element (such as, CMOS sensor etc.) also can be formed with.
When disjunction brittle substrate 1, first, as shown in Figure 1, score line S is formed in the disjunction precalculated position of an one interarea 1a.In FIG, the situation extended in the disjunction precalculated position, direction vertical with drawing and score line S is represented.Score line S is the crackle (fine crack) stretched at the thickness direction of brittle substrate 1 is that wire is continuous in the interarea 1a side of brittle substrate 1.
In addition, though only illustrate score line S to illustrate simplification in FIG, but such as when brittle substrate 1 point being broken into short strip shape or clathrate etc., carrying out disjunction at multiple position and obtain the situation as multiple monolithic, score line S is formed to all disjunction precalculated positions.Afterwards, though do not express especially, in this situation, for the process of back segment, also can all disjunction precalculated positions be carried out.
For the formation of score line S, known knowledge can be used.Such as, can be and rotate along the crimping of disjunction precalculated position by making to cut wheel (scribe wheel), and form the aspect of score line S, wherein, this cuts wheel (scribe wheel) is be made up of superhard alloy, sintering diamond, single crystal diamond etc., become discoideus, and possess the crest line playing function as blade at outer peripheral portion; Also can be and undertaken delineating by diamond cusp along disjunction precalculated position and form the aspect of score line S whereby; Also can be the formation of ablation (ablation) or the metamorphic layer irradiated by laser (such as, ultraviolet (UV) laser) and form the aspect of score line S; Also the heating that can be by laser (such as, infrared ray (IR) laser) forms the aspect of score line S with cooling the thermal stress that produces.
Then, as shown in Figure 2, will the brittle substrate 1 of score line S be formed with, be pasted onto the adhesive film 2 being also called as dicing tape.Adhesive film 2, an one interarea becomes bonding plane 2a, and opens the framework 3 being located at circular annular form or the rectangular ring being also called as cutting frame.In addition, as adhesive film 2, prepare between framework 3 and brittle substrate, form the size staying white region (non-sticking area) when being pasted with brittle substrate 1.When pasting brittle substrate 1, as shown in arrow A R1, make the interarea 1a of the side being formed with score line S be connected to bonding plane 2a, and make above another interarea 1b becomes.Afterwards, adhesive film 2 will be provided with framework 3, be referred to as substrate holding structure.
In order to brittle substrate 1 is pasted onto adhesive film 2, such as, the adhesive film sticker (substrate sticking means) with following means can be used: supporting means (platform etc.), framework 3 can be supported to level, and, with the peristome (internal ring portion) of the framework 3 in framework 3 same plane in support brittle substrate 1 in the supine mode of master being formed with score line; Adhesive film configuration means, can to the cropped adhesive film 2 becoming to cover the width of framework 3 apply to expand tension force and on one side adhesive film 2 be configured at framework 3 and brittle substrate 1 above on; Adhesive film pressing means, can be pasted on framework 3 and brittle substrate 1 by adhesive film 2 by carrying out from top side pressing.Using the situation of this adhesive film sticker, the formation of substrate holding structure and the stickup of brittle substrate 1 can be carried out simultaneously.
Then, diaphragm 4 is prepared.But, diaphragm 4 used in the present embodiment, from patent documentation 2 disclose different, be at least not there is adherence to brittle substrate 1.In addition, as shown in Figure 3, in the present embodiment, using compared to the planar dimension of brittle substrate 1 is the diaphragm 4 of very large size (area).As the material of this diaphragm 4, such as, polyester (polyester) (PET), polyvinyl chloride (PVC), polyene (polyolefin) etc. can be illustrated.
And as in figure 3 with as shown in arrow A R2, this diaphragm 4 close to the interarea 1b upward of brittle substrate 1, and is positioned on this interarea 1b.Further; as shown in Figure 4; while keep this carrying state, the outer peripheral portion (part do not contacted with brittle substrate 1) of the diaphragm 4 exposed from interarea 1b is pasted on the bonding plane 2a of adhesive film 2 simultaneously, is namely present in and stays white region around brittle substrate 1.Whereby, the upper configuration realizing at least interarea 1b among brittle substrate 1 is fixed with the state of diaphragm 4.As above, because diaphragm 4 pairs of brittle substrates 1 do not have adherence, therefore in this configuration status, diaphragm 4 does not exist with the whole face of interarea 1b of brittle substrate 1 and contacts with gap, but does not adhere.
Whole of another interarea not being formed with score line of brittle substrate 1 is contacted while this being pasted on adhesive film 2 stays white region for making diaphragm 4, such as, the diaphragm configuration means with following means can being used: supporting means (platform etc.), upwards supporting frame 3 and brittle substrate 1 can be set to by pasting at the adhesive film 2 being located at framework 3 another interarea side being formed with the brittle substrate 1 of an interarea of score line; Diaphragm configuration means, can apply expand tension force while to be configured at by diaphragm 4 above brittle substrate 1 on (another interarea) to the cropped diaphragm 4 becoming to cover the width of brittle substrate 1; Diaphragm pasting hacks (cylinder etc.), what can be pasted onto adhesive film 2 by pressing from top side to the part (part do not contacted with brittle substrate 1) exposed above brittle substrate 1 of diaphragm 4 stays white region.
In the present embodiment, be pasted with brittle substrate 1 with such as above aspect and on interarea 1b, be configured with the substrate holding structure of diaphragm 4, being supplied to brisement device to carry out disjunction.Specifically; as shown in Figure 5; 2 lower aspects between sword 101A, 101B of isolating in the horizontal direction to make the forming part of score line S be configured at; in other words; 2 the lower aspects between sword 101A, 101B be configured in parallel to each other are configured in respectively abreast to make score line S; make the substrate holding structure being configured with the state of diaphragm 4 on the interarea 1b of brittle substrate 1, support from below by 2 lower sword 101A, 101B.In addition, lower sword 101A, 101B are to be the component setting extremely with rigidity compared to brittle substrate 1.
As this brisement device, the known brisement device with brisement sword can be used.As this brisement device, such as, illustrate the brisement device having following means: supporting means (lower sword 101A, 101B, platform etc.), supporting is configured with the brittle substrate 1 of diaphragm 4 from below; Upper sword (brisement sword), makes front end can be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line; And, the means that the disjunction precalculated position making sword on this be connected to this another interarea corresponding with the forming position of this score line also declines.
Or, also can be: after the substrate holding structure making to maintain brittle substrate 1 supports from below by lower sword 101A, 101B, configuration protection film 4.
After obtaining above-mentioned bearing state; as in Fig. 5 with as shown in arrow A R3; sword (brisement sword) 102 is declined from top towards the forming position of score line S; and its front end is abutted with brittle substrate 1 across diaphragm 4, make sword 102 decline in the mode of press-in further.Whereby, crackle stretches from score line S toward substrate thickness direction, and by brittle substrate 1 disjunction.
Now, due to the inadhesion of diaphragm 4 pairs of brittle substrates 1, therefore can not produce to use as the technology that discloses as patent documentation 2 when there is adhesive diaphragm produce the attachment of adhesion, the not good situation such as residual.
In addition, brittle substrate 1 and diaphragm 4 are not reciprocally directly fixed, but the outer peripheral portion of diaphragm 4 is pasted and fixed on adhesive film 2, therefore do not have the situation producing position skew at diaphragm 4 when carrying out disjunction.Further, also do not have the monolithic (chip) obtained by disjunction float and contact with neighbouring monolithic, produce in end situations such as lacking.
Above; as described; according to the present embodiment; to the brittle substrate of state being pasted onto the diaphragm being located at circular annular form or rectangular ring framework; before carrying out disjunction in three-point bending mode; by make the adhesive diaphragm of not tool seamlessly with become upper sword (brisement sword) by above the brittle substrate of bearing surface whole contact; and the outer peripheral portion of this diaphragm is pasted and is fixed on adhesive film; and can not produce adhesion attachment, remain in the first-class not good situation of the monolithic obtained by disjunction, disjunction brittle substrate.
< variation >
In the above-described embodiment, though can configure fixing diaphragm 4 by the outer peripheral portion of diaphragm 4 is pasted onto the staying white region of bonding plane 2a of adhesive film 2, the aspect of the fixing diaphragm 4 of configuration is not limited to this.Such as, also can be following aspect: arrange the means of the framework 3 outer peripheral portion of diaphragm 4 being clamped to substrate holding structure or Pasting fixing there is adhesive region etc.In this situation, without the need to arrange be used for bonding protective film 4 stay white region.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (5)
1. a method for dividing for brittle substrate, is disjunction brittle substrate, it is characterized in that, possess:
Score line forming step, the disjunction object's position in an interarea side of brittle substrate forms score line;
Substrate sticking step, will be formed with this interarea of this brittle substrate of this score line, be provided with around and stay white region also while be pasted on adhesive film;
Diaphragm configuration step, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and the bonding partially do not contacted with this brittle substrate of this diaphragm is stayed white region at this of this adhesive film, whereby this diaphragm is configured on this brittle substrate; And
Disjunction step; supporting under the state being configured with this brittle substrate of this diaphragm from below; the front end of sword is made to be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line also while decline, this brittle substrate of disjunction whereby.
2. a method for dividing for brittle substrate, is disjunction brittle substrate, it is characterized in that, possess:
Score line forming step, the disjunction object's position in an interarea side of brittle substrate forms score line;
Substrate sticking step, will be formed with this interarea of this brittle substrate of this score line, be pasted on this adhesive film opening the substrate holding structure being provided with adhesive film in framework;
Diaphragm configuration step, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and by the partial fixing do not contacted with this brittle substrate of this diaphragm in this substrate holding structure, whereby this diaphragm is configured on this brittle substrate; And
Disjunction step; supporting under the state being configured with this brittle substrate of this diaphragm from below; the front end of sword is made to be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line also while decline, this brittle substrate of disjunction whereby.
3. a method for dividing for brittle substrate, is disjunction brittle substrate, it is characterized in that:
Disjunction object's position in advance an interarea side is formed with this interarea of the brittle substrate of score line, is provided with around and stays white region also while be pasted on adhesive film, and,
Make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and the bonding partially do not contacted with this brittle substrate of this diaphragm is stayed white region at this of this adhesive film, afterwards,
Supporting is configured with this brittle substrate of this diaphragm from below, makes the front end of sword be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line and decline, this brittle substrate of disjunction whereby.
4. a method for dividing for brittle substrate, is disjunction brittle substrate, it is characterized in that:
Disjunction object's position in advance an interarea side is formed with this interarea of the brittle substrate of score line, is pasted on this adhesive film opening the substrate holding structure being provided with adhesive film in framework, and,
Make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and by the partial fixing do not contacted with this brittle substrate of this diaphragm in this substrate holding structure, afterwards,
Supporting is configured with this brittle substrate of this diaphragm from below, makes the front end of sword be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line and decline, this brittle substrate of disjunction whereby.
5. a break-up device for brittle substrate, is for disjunction brittle substrate, it is characterized in that possessing:
Substrate sticking means, are formed with this interarea of this brittle substrate of score line by the disjunction object's position an interarea side, be provided with around and stay white region also while be pasted on adhesive film;
Diaphragm configuration means, make, to this brittle substrate, not there is whole of another interarea that adhesive diaphragm is contacted with this brittle substrate, and the bonding partially do not contacted with this brittle substrate of this diaphragm is stayed white region at this of this adhesive film, whereby this diaphragm is configured on this brittle substrate;
Supporting means, supporting is configured with this brittle substrate of this diaphragm from below;
Upper sword, makes front end can be connected to the disjunction precalculated position of this another the interarea side corresponding with the forming position of this score line; And,
Sword on this is made to be connected to the disjunction precalculated position of this another interarea corresponding with the forming position of this score line also while the means declined.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014167322A JP2016043505A (en) | 2014-08-20 | 2014-08-20 | Dividing method and dividing device of brittle material substrate |
| JP2014-167322 | 2014-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105390444A true CN105390444A (en) | 2016-03-09 |
Family
ID=55422577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510399120.8A Pending CN105390444A (en) | 2014-08-20 | 2015-07-08 | Breaking method for brittle material substrate and breaking device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016043505A (en) |
| KR (1) | KR20160022759A (en) |
| CN (1) | CN105390444A (en) |
| TW (1) | TWI679094B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110981175A (en) * | 2019-12-27 | 2020-04-10 | 黄石瑞视光电技术股份有限公司 | Ultrathin ITO glass cutting process of touch screen |
| CN111279459A (en) * | 2017-10-27 | 2020-06-12 | 三星钻石工业股份有限公司 | Method for dividing substrate with metal film |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7206829B2 (en) * | 2018-11-15 | 2023-01-18 | 日本電気硝子株式会社 | METHOD FOR MANUFACTURING PLATE MEMBER AND LAMINATE |
| JP7340838B2 (en) * | 2019-04-26 | 2023-09-08 | 三星ダイヤモンド工業株式会社 | Wafer breaking method and breaking device |
| JP7385908B2 (en) | 2019-10-30 | 2023-11-24 | 三星ダイヤモンド工業株式会社 | Method for dividing bonded substrates and method for dividing stressed substrates |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53111586A (en) * | 1977-03-09 | 1978-09-29 | Matsushita Electric Ind Co Ltd | Method of deviding thin plate |
| CN103786271A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
| CN105365060A (en) * | 2014-08-12 | 2016-03-02 | 三星钻石工业股份有限公司 | Method and device for dividing brittle material substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW559620B (en) * | 2001-06-28 | 2003-11-01 | Mitsuboshi Diamond Ind Co Ltd | Device and method for breaking fragile material substrate |
| CN1330596C (en) | 2002-04-01 | 2007-08-08 | 三星钻石工业股份有限公司 | Parting method for fragile material substrate and parting device using the method |
| JP5129826B2 (en) * | 2010-02-05 | 2013-01-30 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
| TWI508153B (en) * | 2010-04-30 | 2015-11-11 | Mitsuboshi Diamond Ind Co Ltd | Disconnection device and disconnection method of brittle material substrate |
| JP5187421B2 (en) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
| JP5991133B2 (en) * | 2012-10-16 | 2016-09-14 | 三星ダイヤモンド工業株式会社 | Breaking jig for brittle material substrate and breaking method |
| JP6039363B2 (en) | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing brittle material substrate |
| JP6043149B2 (en) * | 2012-10-29 | 2016-12-14 | 三星ダイヤモンド工業株式会社 | Breaking device for brittle material substrate and method for breaking brittle material substrate |
-
2014
- 2014-08-20 JP JP2014167322A patent/JP2016043505A/en active Pending
-
2015
- 2015-03-17 TW TW104108445A patent/TWI679094B/en not_active IP Right Cessation
- 2015-06-05 KR KR1020150079926A patent/KR20160022759A/en not_active Application Discontinuation
- 2015-07-08 CN CN201510399120.8A patent/CN105390444A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53111586A (en) * | 1977-03-09 | 1978-09-29 | Matsushita Electric Ind Co Ltd | Method of deviding thin plate |
| CN103786271A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
| CN105365060A (en) * | 2014-08-12 | 2016-03-02 | 三星钻石工业股份有限公司 | Method and device for dividing brittle material substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111279459A (en) * | 2017-10-27 | 2020-06-12 | 三星钻石工业股份有限公司 | Method for dividing substrate with metal film |
| CN110981175A (en) * | 2019-12-27 | 2020-04-10 | 黄石瑞视光电技术股份有限公司 | Ultrathin ITO glass cutting process of touch screen |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160022759A (en) | 2016-03-02 |
| JP2016043505A (en) | 2016-04-04 |
| TW201607715A (en) | 2016-03-01 |
| TWI679094B (en) | 2019-12-11 |
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