JP2016043505A - Dividing method and dividing device of brittle material substrate - Google Patents

Dividing method and dividing device of brittle material substrate Download PDF

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JP2016043505A
JP2016043505A JP2014167322A JP2014167322A JP2016043505A JP 2016043505 A JP2016043505 A JP 2016043505A JP 2014167322 A JP2014167322 A JP 2014167322A JP 2014167322 A JP2014167322 A JP 2014167322A JP 2016043505 A JP2016043505 A JP 2016043505A
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brittle material
material substrate
protective film
main surface
substrate
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栗山　規由
Noriyoshi Kuriyama
規由 栗山
村上　健二
Kenji Murakami
健二 村上
武田　真和
Masakazu Takeda
真和 武田
久司 五十川
Hisaji Isokawa
久司 五十川
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2014167322A priority Critical patent/JP2016043505A/en
Priority to TW104108445A priority patent/TWI679094B/en
Priority to KR1020150079926A priority patent/KR20160022759A/en
Priority to CN201510399120.8A priority patent/CN105390444A/en
Publication of JP2016043505A publication Critical patent/JP2016043505A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Pressure Sensors (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a dividing method and a dividing device of a brittle material substrate which does not cause adhesion and residue of adhesive material or the like even while suitably protecting an abutted surface of the brittle material substrate.SOLUTION: A dividing method of a brittle material substrate includes: a process for forming a scribe line on a division object position of the one side principal plain side; a process for attaching one side principal plain of the substrate formed of the scribe line to an adhesive film while providing a blank area on a circumference; a process for arranging a protective film on the substrate by attaching a part which is not brought into contact with the substrate of the protective film to a blank area of the adhesive film while bringing the protective film which has not adhesion for the substrate into contact with the whole surface of the other side principal plain of the substrate; and a division process for dividing the brittle material substrate by causing the tip of an upper blade to descend while bringing the tip of the upper blade into contact with a division scheduled position of the other side principal plain side corresponding to a formation position of the scribe line.SELECTED DRAWING: Figure 4

Description

本発明は、脆性材料基板を分断する方法及び装置に関し、特に、３点曲げ方式にて分断する方法及び装置に関する。   The present invention relates to a method and an apparatus for dividing a brittle material substrate, and more particularly to a method and an apparatus for dividing by a three-point bending method.

半導体基板などの脆性材料基板を分割（チップの個片化）する手法として、ストリートと呼ばれる分割予定ラインに円形ホイールなどの刃先もしくはレーザーにて分割起点となるスクライブラインを形成し、その後ブレーク装置で脆性材料基板に対し３点曲げの手法にて曲げ応力を加えて分割起点からクラック（亀裂）を伸展させることによって基板を分断する態様がすでに公知である（例えば、特許文献１参照）。   As a method of dividing a brittle material substrate such as a semiconductor substrate (dividing chips into chips), a scribe line that is the starting point of division is formed with a cutting edge of a circular wheel or a laser on a planned division line called a street, and then a break device A mode is known in which a substrate is divided by applying a bending stress to a brittle material substrate by a three-point bending method and extending a crack from the division starting point (see, for example, Patent Document 1).

係る分断は、円形環状もしくは矩形環状の枠体であるダイシングフレームに張設された粘着性を有するダイシングテープの被接着面に分断対象たる脆性材料基板を貼付固定した状態で行うのが一般的である。   Such division is generally performed in a state in which a brittle material substrate to be divided is attached and fixed to a surface to be bonded of a dicing tape having adhesiveness stretched on a dicing frame that is a circular ring or a rectangular ring frame. is there.

また、分断に先立ち、キズ防止や汚染物の付着防止などを目的として、少なくとも脆性材料基板のブレーク装置の上刃（ブレーク刃）が当接する側の面（ブレーク時に下方支持される側の面の反対面）に、粘着力の弱い保護フィルムを貼付しておく態様も、すでに公知である（例えば、特許文献２参照）。   Prior to dividing, for the purpose of preventing scratches and preventing the adhesion of contaminants, at least the surface on the side where the upper blade (break blade) of the break device of the brittle material substrate abuts (the surface on the side supported downward during the break). An aspect in which a protective film having a weak adhesive force is attached to the opposite surface) is already known (see, for example, Patent Document 2).

特開２０１４−８３８２１号公報JP 2014-83821 A 特許４１９８６０１号公報Japanese Patent No. 4198601

ブレーク装置による脆性材料基板の分断は、下方支持された脆性材料基板の上面（被当接面）側に上刃（ブレーク刃）を当接させた状態でさらに押し込み、上刃先端の極小エリアに荷重を集中させることによってなされる。それゆえ、特許文献２に開示されているように、保護フィルムを使用した状態で分断を行った場合、たとえその粘着性が弱いものであったとしても、係る荷重集中の結果として、保護フィルムの粘着物が分断後の脆性材料基板に付着・残存してしまうことがある。   To break the brittle material substrate by the break device, press the upper blade (break blade) into contact with the upper surface (contacted surface) of the brittle material substrate supported below, and push it into the minimal area at the tip of the upper blade. This is done by concentrating the load. Therefore, as disclosed in Patent Document 2, when the protective film is used for separation, even if the adhesiveness is weak, as a result of such load concentration, the protective film The adhesive may adhere to or remain on the brittle material substrate after being divided.

本発明は上記課題に鑑みてなされたものであり、脆性材料基板の被当接面を好適に保護しつつも粘着物等の付着・残存が生じることのない脆性材料基板の分断方法を提供することを目的とする。   The present invention has been made in view of the above problems, and provides a method for dividing a brittle material substrate that suitably protects the contacted surface of the brittle material substrate but does not cause adhesion or remaining of an adhesive or the like. For the purpose.

上記課題を解決するため、請求項１の発明は、脆性材料基板を分断する方法であって、脆性材料基板の一方主面側の分断対象位置にスクライブラインを形成するスクライブライン形成工程と、前記スクライブラインが形成されてなる前記脆性材料基板の前記一方主面を、周囲に余白領域を設けつつ粘着フィルムに貼り付ける基板貼付工程と、前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記粘着フィルムの前記余白領域に貼付することによって前記保護フィルムを前記脆性材料基板上に配置する保護フィルム配置工程と、前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持した状態で、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する分断工程と、を備えることを特徴とする。   In order to solve the above-mentioned problem, the invention of claim 1 is a method of dividing a brittle material substrate, wherein a scribe line forming step of forming a scribe line at a division target position on one main surface side of the brittle material substrate, A substrate pasting step of pasting the one main surface of the brittle material substrate formed with a scribe line to an adhesive film while providing a blank area around the protective surface, and a protective film having no adhesiveness to the brittle material substrate A part of the protective film that is not in contact with the brittle material substrate is affixed to the blank area of the adhesive film while being in contact with the entire other main surface of the brittle material substrate. In the state of supporting the brittle material substrate in which the protective film is disposed and the brittle material substrate in which the protective film is disposed from below, Characterized by and a dividing step of dividing the brittle material substrate by lowering while the end so as to contact the be cut position of the other main surface side corresponding to the formation position of the scribe line.

請求項２の発明は、脆性材料基板を分断する方法であって、脆性材料基板の一方主面側の分断対象位置にスクライブラインを形成するスクライブライン形成工程と、前記スクライブラインが形成されてなる前記脆性材料基板の前記一方主面を、枠体に粘着フィルムを張設してなる基板保持部材の前記粘着フィルムに貼り付ける基板貼付工程と、前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記基板保持部材に固定することによって前記保護フィルムを前記脆性材料基板上に配置する保護フィルム配置工程と、前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持した状態で、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する分断工程と、を備えることを特徴とする。   The invention of claim 2 is a method of dividing a brittle material substrate, wherein a scribe line is formed at a position to be divided on one main surface side of the brittle material substrate, and the scribe line is formed. A substrate pasting step of pasting the one main surface of the brittle material substrate to the adhesive film of a substrate holding member formed by stretching an adhesive film on a frame, and a protective film having no adhesiveness to the brittle material substrate By fixing the portion of the protective film that is not in contact with the brittle material substrate to the substrate holding member while contacting the entire surface of the other main surface of the brittle material substrate. The tip of the upper blade is placed in the state of supporting the brittle material substrate on which the protective film is disposed and the brittle material substrate on which the protective film is disposed from below. Characterized by and a dividing step of dividing the brittle material substrate by lowering while so as to abut against the cutting scheduled position of the other main surface side corresponding to the formation position of the scribe line.

請求項３の発明は、脆性材料基板を分断する方法であって、あらかじめ一方主面側の分断対象位置にスクライブラインが形成されてなる脆性材料基板の前記一方主面を、周囲に余白領域を設けつつ粘着フィルムに貼り付けるとともに、前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記粘着フィルムの前記余白領域に貼付したうえで、前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持し、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する、ことを特徴とする。   The invention of claim 3 is a method for dividing a brittle material substrate, wherein the one main surface of the brittle material substrate in which a scribe line is formed in advance on the one main surface side is divided, and a blank area is formed around it. Adhering to the adhesive film while being provided, and contacting the brittle material substrate of the protective film with the protective film having no adhesiveness to the brittle material substrate being in contact with the entire other main surface of the brittle material substrate The other part corresponding to the formation position of the scribe line is supported by supporting the brittle material substrate on which the protective film is disposed from below and sticking a non-existing portion to the blank area of the adhesive film. The brittle material substrate is divided by being lowered while being brought into contact with a planned division position on the main surface side.

請求項４の発明は、脆性材料基板を分断する方法であって、あらかじめ一方主面側の分断対象位置にスクライブラインが形成されてなる脆性材料基板の前記一方主面を、枠体に粘着フィルムを張設してなる基板保持部材の前記粘着フィルムに貼り付けるとともに、前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記基板保持部材に固定したうえで、前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持し、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する、ことを特徴とする。   The invention according to claim 4 is a method for dividing a brittle material substrate, wherein the one main surface of the brittle material substrate in which a scribe line is formed in advance at a position to be divided on the one main surface side is attached to a frame with an adhesive film. Affixing the adhesive film to the adhesive film of the substrate holding member, and contacting the protective film having no adhesiveness to the brittle material substrate to the entire surface of the other main surface of the brittle material substrate. A portion that is not in contact with the brittle material substrate is fixed to the substrate holding member, the brittle material substrate on which the protective film is arranged is supported from below, and the tip of the upper blade is formed as the scribe line. The brittle material substrate is divided by being lowered while being brought into contact with the planned division position on the other main surface side corresponding to the position.

請求項５の発明は、脆性材料基板を分断するための装置であって、一方主面側の分断対象位置にスクライブラインが形成されてなる前記脆性材料基板の前記一方主面を、周囲に余白領域を設けつつ粘着フィルムに貼り付ける基板貼付手段と、前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記粘着フィルムの前記余白領域に貼付することによって前記保護フィルムを前記脆性材料基板上に配置する保護フィルム配置手段と、前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持する支持手段と、先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接可能な上刃と、前記上刃を前記スクライブラインの形成位置に対応する前記他方主面の分断予定位置に当接せるようにしながら下降させる手段と、を備えることを特徴とする。   The invention of claim 5 is an apparatus for dividing a brittle material substrate, wherein the one main surface of the brittle material substrate in which a scribe line is formed at a position to be divided on the one main surface side is blanked around the periphery. Substrate pasting means for adhering to the adhesive film while providing a region, and the brittle material substrate of the protective film while contacting a protective film having no adhesiveness to the brittle material substrate over the other main surface of the brittle material substrate A protective film placement means for placing the protective film on the brittle material substrate by affixing a portion not in contact with the blank area of the adhesive film, and the brittle material substrate on which the protective film is placed And a top blade capable of abutting a tip of the tip on the other main surface side corresponding to the formation position of the scribe line. Characterized in that it comprises a means for lowering while allowing contact to the upper blade to be cut position of said other major surface corresponding to the formation position of the scribe line.

請求項１ないし請求項５の発明によれば、分断によって得られる個片に対する粘着物の付着・残存といった不具合を生じさせることなく脆性材料基板を分断することができる。   According to invention of Claim 1 thru | or 5, a brittle material board | substrate can be parted, without producing malfunctions, such as adhesion of the adhesion thing with respect to the piece obtained by parting, and residual.

脆性材料基板１を例示する断面図である。1 is a cross-sectional view illustrating a brittle material substrate 1. スクライブラインＳを形成した脆性材料基板１を粘着フィルム２に貼付する様子を示す図である。It is a figure which shows a mode that the brittle material board | substrate 1 in which the scribe line S was formed is stuck on the adhesion film 2. FIG. 保護フィルム４を脆性材料基板１の主面１ｂ上に載置する様子を示す図である。It is a figure which shows a mode that the protective film 4 is mounted on the main surface 1b of the brittle material board | substrate 1. FIG. 主面１ｂからはみ出た保護フィルム４の外周部分を粘着フィルム２の粘着面２ａに貼付する様子を示す図である。2 is a view showing a state in which an outer peripheral portion of the protective film 4 protruding from the main surface 1b is attached to the adhesive surface 2a of the adhesive film 2. FIG. 脆性材料基板１を分断する様子を示す図である。It is a figure which shows a mode that the brittle material board | substrate 1 is parted.

本実施の形態においては、脆性材料基板をいわゆる３点曲げ方式にて分断する手法について説明する。図１は、本発明の実施の形態において分断対象とされる脆性材料基板１を例示する断面図である。図２ないし図５は、脆性材料基板１を用意した後、分断に至るまでに行う主な手順につき、模式的に示す図である。   In this embodiment, a method for dividing a brittle material substrate by a so-called three-point bending method will be described. FIG. 1 is a cross-sectional view illustrating a brittle material substrate 1 to be divided in the embodiment of the present invention. FIG. 2 to FIG. 5 are diagrams schematically showing main procedures performed after the brittle material substrate 1 is prepared and divided.

脆性材料基板１としては、例えば、半導体基板（シリコン基板など）やガラス基板などが例示される。半導体基板の一方主面には、所定のデバイス（例えば、ＣＭＯＳセンサなど）用のパターンが形成されていてもよい。   Examples of the brittle material substrate 1 include a semiconductor substrate (such as a silicon substrate) and a glass substrate. A pattern for a predetermined device (for example, a CMOS sensor) may be formed on one main surface of the semiconductor substrate.

脆性材料基板１を分断するにあたっては、まず、図１に示すように、その一方主面１ａの分断予定位置にスクライブラインＳを形成する。図１においては、図面に垂直な方向に分断予定位置およびスクライブラインＳが延在する場合を表している。スクライブラインＳは、脆性材料基板１の厚み方向に伸展するクラック（微小クラック）が脆性材料基板１の主面１ａ側において線状に連続したものである。   In dividing the brittle material substrate 1, first, as shown in FIG. 1, a scribe line S is formed at the planned division position of the one main surface 1 a. FIG. 1 shows a case where the planned cutting position and the scribe line S extend in a direction perpendicular to the drawing. The scribe line S is a line in which cracks (microcracks) extending in the thickness direction of the brittle material substrate 1 are linearly continued on the main surface 1 a side of the brittle material substrate 1.

なお、図１においては図示の簡単のため一のスクライブラインＳのみを示しているが、例えば脆性材料基板１を短冊状もしくは格子状に分断するなど、複数箇所で分断して多数の個片を得るような場合には、全ての分断予定位置に対してスクライブラインＳを形成する。以降、特に断らないが、その場合には、後段の処理についても、全ての分断予定位置に対してなされることになる。   In FIG. 1, only one scribe line S is shown for simplicity of illustration. However, for example, the brittle material substrate 1 is divided into a strip shape or a lattice shape, so that a large number of pieces are divided into a plurality of portions. In such a case, the scribe line S is formed for all the scheduled division positions. Thereafter, although not specifically stated, in this case, the subsequent processing is also performed for all scheduled division positions.

スクライブラインＳの形成には、公知の技術を適用可能である。例えば、超硬合金、焼結ダイヤモンド、単結晶ダイヤモンド等からなり、円板状をなし、かつ、外周部分に刃として機能する稜線を備えるカッターホイール（スクライブホイール）を、分断予定位置に沿って圧接転動させることによって、スクライブラインＳを形成する態様であってもよいし、分断予定位置に沿ってダイヤモンドポイントにより罫描くことによってスクライブラインＳを形成する態様であってもよいし、レーザ（例えば、紫外線（ＵＶ）レーザ）照射によるアブレーションや変質層の形成によってスクライブラインＳを形成する態様であってもよいし、レーザ（例えば、赤外線（ＩＲ）レーザ）による加熱と冷却とによる熱応力によってスクライブラインＳを形成する態様であってもよい。   A known technique can be applied to the formation of the scribe line S. For example, a cutter wheel (scribing wheel) made of cemented carbide, sintered diamond, single crystal diamond, etc., which has a disk shape and has a ridge line that functions as a blade on the outer peripheral part, is pressed along the planned cutting position. It may be a mode in which the scribe line S is formed by rolling, a mode in which the scribe line S is formed by drawing a diamond point along the scheduled cutting position, or a laser (for example, The scribe line S may be formed by ablation by irradiation with ultraviolet (UV) laser or formation of an altered layer, or scribe by thermal stress due to heating and cooling by a laser (for example, infrared (IR) laser). The aspect which forms the line S may be sufficient.

次に、図２に示すように、スクライブラインＳを形成した脆性材料基板１を、ダイシングテープとも称される粘着フィルム２に貼付する。粘着フィルム２は、その一方主面が粘着面２ａとなっており、ダイシングフレームとも称される、円形環状もしくは矩形環状の枠体３に張設されてなる。また、粘着フィルム２としては、脆性材料基板１を貼付した際に枠体３と脆性材料基板との間に余白領域（非貼付領域）が形成されるサイズのものを用意する。脆性材料基板１を貼付するにあたっては、矢印ＡＲ１にて示すようにスクライブラインＳが形成されてなる側の主面１ａを粘着面２ａに当接させ、他方主面１ｂが上面となるようにする。以降、粘着フィルム２が枠体３に張設されたものを、基板保持部材と総称する。   Next, as shown in FIG. 2, the brittle material substrate 1 on which the scribe line S is formed is attached to an adhesive film 2 also called a dicing tape. The pressure-sensitive adhesive film 2 has one main surface serving as a pressure-sensitive adhesive surface 2a, and is stretched around a circular ring or rectangular ring frame 3, which is also called a dicing frame. Moreover, as the adhesive film 2, the thing of the size in which a blank area | region (non-sticking area | region) is formed between the frame 3 and a brittle material board | substrate is prepared when the brittle material board | substrate 1 is affixed. When affixing the brittle material substrate 1, the main surface 1a on which the scribe line S is formed is brought into contact with the adhesive surface 2a as shown by an arrow AR1, and the other main surface 1b is the upper surface. . Hereinafter, the one in which the adhesive film 2 is stretched around the frame 3 is generically referred to as a substrate holding member.

脆性材料基板１を粘着フィルム２に貼付するためには、例えば、枠体３を水平状態に支持し、且つ、枠体３と同一平面内の枠体３の開口部（内環部）内に脆性材料基板１をスクライブラインが形成された一方主面を上向きとして支持することのできる支持手段（テーブル等）と、枠体３を覆う広さに裁断された粘着フィルム２に押し広げる張力を付加しながら粘着フィルム２を枠体３及び脆性材料基板１の上面上に配置することのできる粘着フィルム配置手段と、粘着フィルム２を上面側から押圧することによって枠体２及び脆性材料基板１に貼り付けることのできる粘着フィルム押圧手段と、を有する粘着フィルム貼付装置（基板貼付手段）を使用することができる。係る粘着フィルム貼付装置を用いる場合、基板保持部材の形成と脆性材料基板１の貼付とが同時に行われることになる。   In order to attach the brittle material substrate 1 to the adhesive film 2, for example, the frame 3 is supported in a horizontal state, and in the opening (inner ring) of the frame 3 in the same plane as the frame 3. A supporting means (table or the like) that can support the brittle material substrate 1 with the scribe line formed on one main surface facing upward, and tension that pushes the adhesive film 2 that is cut to a width covering the frame 3 are added. The adhesive film 2 can be placed on the frame 3 and the brittle material substrate 1 by pressing the adhesive film 2 from the upper surface side. An adhesive film sticking device (substrate sticking means) having an adhesive film pressing means that can be attached can be used. When such an adhesive film sticking apparatus is used, the formation of the substrate holding member and the sticking of the brittle material substrate 1 are performed simultaneously.

続いて、保護フィルム４を用意する。ただし、本実施の形態において用いる保護フィルム４は、特許文献２に開示されていたものとは異なり、少なくとも脆性材料基板１に対する粘着性を有していないものである。また、図３に示すように、本実施の形態においては、脆性材料基板１の平面サイズよりも十分に大きなサイズ（面積）の保護フィルム４を用いるものとする。係る保護フィルム４の材質としては、例えば、ポリエステル(PET)、ポリ塩化ビニル(PVC)、ポリオレフィンなどを例示することができる。   Subsequently, the protective film 4 is prepared. However, the protective film 4 used in the present embodiment is different from that disclosed in Patent Document 2 and has no adhesiveness to at least the brittle material substrate 1. Further, as shown in FIG. 3, in the present embodiment, a protective film 4 having a size (area) sufficiently larger than the planar size of the brittle material substrate 1 is used. Examples of the material of the protective film 4 include polyester (PET), polyvinyl chloride (PVC), and polyolefin.

そして、図３において矢印ＡＲ２にて示すように、係る保護フィルム４を脆性材料基板１の上方を向いた主面１ｂに近づけていき、該主面１ｂ上に載置する。さらには、図４に示すように、係る載置状態を保ちつつ、主面１ｂからはみ出た保護フィルム４の外周部分（脆性材料基板１とは接触していない部分）を、粘着フィルム２の粘着面２ａであって脆性材料基板１の周囲に存在する余白領域に貼付する。これによって、脆性材料基板１のうち少なくとも主面１ｂの上に保護フィルム４が配置固定された状態が実現される。上述したように、保護フィルム４は脆性材料基板１に対する粘着性を有していないので、係る配置状態においては、保護フィルム４は脆性材料基板１の主面１ｂの全面と隙間なく接触してはいるものの、粘着してはいない。   Then, as shown by an arrow AR2 in FIG. 3, the protective film 4 is brought close to the main surface 1b facing upward of the brittle material substrate 1 and placed on the main surface 1b. Furthermore, as shown in FIG. 4, the outer peripheral portion of the protective film 4 that protrudes from the main surface 1 b (the portion that is not in contact with the brittle material substrate 1) is kept in the pressure-sensitive adhesive film 2 while maintaining the mounting state. It is affixed to the blank area which exists on the surface 2a and around the brittle material substrate 1. Thereby, a state in which the protective film 4 is arranged and fixed on at least the main surface 1b of the brittle material substrate 1 is realized. As described above, since the protective film 4 does not have adhesiveness to the brittle material substrate 1, in such an arrangement state, the protective film 4 is not in contact with the entire surface of the main surface 1 b of the brittle material substrate 1 without a gap. Yes, but not sticky.

保護フィルム４を脆性材料基板１のスクライブラインの形成されていない他方主面の全面に接触させつつ粘着フィルム２の前記余白領域に貼付するには、例えば、枠体３に張設された粘着フィルム２にスクライブラインが形成された一方主面が貼り付けられた脆性材料基板１の他方主面側を上向きとして枠体３及び脆性材料基板１を支持することのできる支持手段（テーブル等）と、脆性材料基板１を覆う広さに裁断された保護フィルム４に押し広げる張力を付加しながら保護フィルム４を脆性材料基板２の上面（他方主面）上に配置することのできる保護フィルム配置手段と、保護フィルム４の脆性材料基板２の上面上からはみ出た部分（脆性材料基板１とは接触していない部分）を上面側から押圧することによって粘着フィルム２の余白領域に貼付する保護フィルム貼付手段（ローラ等）と、を有する保護フィルム配置手段を使用することができる。   In order to attach the protective film 4 to the blank area of the adhesive film 2 while being in contact with the other main surface of the brittle material substrate 1 where the scribe line is not formed, for example, an adhesive film stretched on the frame 3 A support means (table or the like) that can support the frame 3 and the brittle material substrate 1 with the other main surface side of the brittle material substrate 1 on which the one main surface having the scribe line formed in 2 is attached upward, Protective film disposing means capable of disposing the protective film 4 on the upper surface (the other main surface) of the brittle material substrate 2 while applying a tension to push the protective film 4 cut to a width covering the brittle material substrate 1; The margin of the adhesive film 2 by pressing the portion of the protective film 4 that protrudes from the upper surface of the brittle material substrate 2 (the portion that is not in contact with the brittle material substrate 1) from the upper surface side. A protective film sticking means for sticking the band (rollers and the like), it may be used a protective film arrangement means having.

本実施の形態においては、以上のような態様にて脆性材料基板１が貼付されてなるとともに保護フィルム４が主面１ｂ上に配置されてなる基板保持部材を、ブレーク装置による分断に供する。具体的には、図５に示すように、水平方向において離隔させた２つの下刃１０１Ａ、１０１Ｂの間にスクライブラインＳの形成箇所を位置させる態様にて、換言すれば、互いに平行に配置された２つの下刃１０１Ａ、１０１Ｂの間においてスクライブラインＳをそれぞれに平行に配置させる態様にて、脆性材料基板１の主面１ｂ上に保護フィルム４が配置された状態の基板保持部材を２つの下刃１０１Ａ、１０１Ｂによって下方から支持させる。なお、下刃１０１Ａ、１０１Ｂは脆性材料基板１に比して十分に剛性を有する部材にて設けられる。   In the present embodiment, the substrate holding member in which the brittle material substrate 1 is stuck in the above-described manner and the protective film 4 is disposed on the main surface 1b is subjected to division by a break device. Specifically, as shown in FIG. 5, the scribe line S is formed between the two lower blades 101 </ b> A and 101 </ b> B separated in the horizontal direction, in other words, they are arranged in parallel to each other. Two substrate holding members in a state in which the protective film 4 is disposed on the main surface 1b of the brittle material substrate 1 are arranged in such a manner that the scribe lines S are disposed in parallel between the two lower blades 101A and 101B. The lower blades 101A and 101B are supported from below. The lower blades 101 </ b> A and 101 </ b> B are provided by members having sufficient rigidity as compared with the brittle material substrate 1.

前記ブレーク装置としては、ブレーク刃を有する公知のブレーク装置を使用することができる。前記ブレーク装置としては、例えば、保護フィルム４が配置されてなる脆性材料基板１を下方から支持する支持手段（下刃１０１Ａ、１０１Ｂ、テーブル等）と、先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接可能な上刃（ブレーク刃）と、前記上刃を前記スクライブラインの形成位置に対応する前記他方主面の分断予定位置に当接せるようにしながら下降させる手段と、を備えるブレーク装置が例示される。   As the break device, a known break device having a break blade can be used. As the break device, for example, support means (lower blades 101A, 101B, a table, etc.) for supporting the brittle material substrate 1 on which the protective film 4 is disposed, and the tip correspond to the formation position of the scribe line. An upper blade (break blade) that can be brought into contact with the scheduled cutting position on the other main surface side, and the upper blade is brought into contact with the scheduled cutting position on the other main surface corresponding to the formation position of the scribe line. And a break device including a lowering means.

あるいは、脆性材料基板１を保持してなる基板保持部材を下刃１０１Ａ、１０１Ｂによって下方から支持させた後に保護フィルム４を配置するようにしてもよい。   Alternatively, the protective film 4 may be disposed after a substrate holding member that holds the brittle material substrate 1 is supported from below by the lower blades 101A and 101B.

上述の支持状態を得た後、図５に矢印ＡＲ３にて示すように、上刃（ブレーク刃）１０２を上方からスクライブラインＳの形成位置に向けて下降させてその先端を保護フィルム４を介して脆性材料基板１に当接させ、さらに上刃１０２を押し込むように下降させる。これにより、スクライブラインＳから基板厚み方向にクラックが伸展して、脆性材料基板１が分断される。   After obtaining the above support state, the upper blade (break blade) 102 is lowered from above toward the position where the scribe line S is formed as indicated by an arrow AR3 in FIG. Then, it is brought into contact with the brittle material substrate 1 and further lowered so as to push in the upper blade 102. Thereby, a crack extends in the substrate thickness direction from the scribe line S, and the brittle material substrate 1 is divided.

このとき、保護フィルム４は脆性材料基板１に対し粘着していないことから、特許文献２に開示されてなる技術のように粘着性のある保護フィルムを用いた場合に生じる、粘着物の付着・残存といった不具合が生じることはない。   At this time, since the protective film 4 is not adhered to the brittle material substrate 1, adhesion / adhesion caused when an adhesive protective film is used as in the technique disclosed in Patent Document 2 There is no problem of remaining.

また、脆性材料基板１と保護フィルム４とは互いに直接には固定されてはいないものの、保護フィルム４の外周部分は粘着フィルム２に貼付固定されてなることから、分断に際して保護フィルム４に位置ずれが生じることはない。さらには、分断によって得られた個片（チップ）が浮き上がって近傍の個片と接触し、端部にカケが生じたりすることもない。   Further, although the brittle material substrate 1 and the protective film 4 are not directly fixed to each other, the outer peripheral portion of the protective film 4 is stuck and fixed to the adhesive film 2, so that the position shifts to the protective film 4 when dividing. Will not occur. Furthermore, the pieces (chips) obtained by the division do not float and come into contact with neighboring pieces, and there is no occurrence of chipping at the ends.

以上、説明したように、本実施の形態によれば、円形環状もしくは矩形環状の枠体に張設されてなる保護フィルムに貼付された状態の脆性材料基板を３点曲げ方式にて分断するに先立って、上刃（ブレーク刃）の被当接面となる脆性材料基板の上面の全面に粘着性のない保護フィルムを隙間なく接触させるとともに、該保護フィルムの外周部分を保護フィルムに貼付固定しておくようにすることで、分断によって得られる個片に対する粘着物の付着・残存といった不具合を生じさせることなく脆性材料基板を分断することができる。   As described above, according to the present embodiment, a brittle material substrate in a state of being attached to a protective film stretched on a circular annular or rectangular annular frame is divided by a three-point bending method. Prior to making contact with a non-adhesive protective film on the entire upper surface of the brittle material substrate, which is the contact surface of the upper blade (break blade), the outer peripheral portion of the protective film is fixed to the protective film. By doing so, it is possible to cut the brittle material substrate without causing problems such as adhesion / remaining of an adhesive to the pieces obtained by the cutting.

＜変形例＞
上述の実施の形態においては、保護フィルム４の外周部分を粘着フィルム２の粘着面２ａの余白領域に貼付することによって保護フィルム４を配置固定するようにしているが、保護フィルム４を配置固定する態様はこれに限られない。例えば、基板保持部材の枠体３に保護フィルム４の外周部分を挟持固定する手段や貼付固定可能な粘着性を有する領域などが設けられるような態様であってもよい。係る場合、保護フィルム４を貼付するための余白領域を設ける必要がない。 <Modification>
In the above-described embodiment, the protective film 4 is arranged and fixed by sticking the outer peripheral portion of the protective film 4 to the blank area of the adhesive surface 2a of the adhesive film 2, but the protective film 4 is arranged and fixed. The aspect is not limited to this. For example, a mode in which a means for holding and fixing the outer peripheral portion of the protective film 4 or a sticky adhesive area is provided on the frame 3 of the substrate holding member may be used. In such a case, it is not necessary to provide a blank area for attaching the protective film 4.

１ 脆性材料基板
１ａ、１ｂ （脆性材料基板の）主面
２ 粘着フィルム
２ａ （粘着フィルムの）粘着面
３ 枠体
４ 保護フィルム
１０１Ａ、１０１Ｂ 下刃
１０２ 上刃
Ｓ スクライブライン DESCRIPTION OF SYMBOLS 1 Brittle material board | substrate 1a, 1b Main surface 2 (Adhesive film board | substrate) 2 Adhesive film 2a (Adhesive film adhesive face) 3 Frame 4 Protective film 101A, 101B Lower blade 102 Upper blade S Scribe line

Claims (5)

脆性材料基板を分断する方法であって、
脆性材料基板の一方主面側の分断対象位置にスクライブラインを形成するスクライブライン形成工程と、
前記スクライブラインが形成されてなる前記脆性材料基板の前記一方主面を、周囲に余白領域を設けつつ粘着フィルムに貼り付ける基板貼付工程と、
前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記粘着フィルムの前記余白領域に貼付することによって前記保護フィルムを前記脆性材料基板上に配置する保護フィルム配置工程と、
前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持した状態で、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する分断工程と、
を備えることを特徴とする、脆性材料基板の分断方法。 A method of dividing a brittle material substrate,
A scribe line forming step of forming a scribe line at a position to be divided on one main surface side of the brittle material substrate;
A substrate pasting step of pasting the one main surface of the brittle material substrate formed with the scribe line to an adhesive film while providing a blank area around the one surface;
A part of the protective film that is not in contact with the brittle material substrate is brought into contact with the entire surface of the other main surface of the brittle material substrate while a protective film having no adhesiveness to the brittle material substrate is brought into contact with the margin of the adhesive film. A protective film placement step of placing the protective film on the brittle material substrate by sticking to a region;
While the brittle material substrate on which the protective film is arranged is supported from below, the tip of the upper blade is brought into contact with the scheduled cutting position on the other main surface side corresponding to the formation position of the scribe line. A dividing step of dividing the brittle material substrate by lowering,
A method for dividing a brittle material substrate, comprising: 脆性材料基板を分断する方法であって、
脆性材料基板の一方主面側の分断対象位置にスクライブラインを形成するスクライブライン形成工程と、
前記スクライブラインが形成されてなる前記脆性材料基板の前記一方主面を、枠体に粘着フィルムを張設してなる基板保持部材の前記粘着フィルムに貼り付ける基板貼付工程と、
前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記基板保持部材に固定することによって前記保護フィルムを前記脆性材料基板上に配置する保護フィルム配置工程と、
前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持した状態で、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する分断工程と、
を備えることを特徴とする、脆性材料基板の分断方法。 A method of dividing a brittle material substrate,
A scribe line forming step of forming a scribe line at a position to be divided on one main surface side of the brittle material substrate;
A substrate pasting step of affixing the one main surface of the brittle material substrate formed with the scribe line to the adhesive film of a substrate holding member formed by stretching an adhesive film on a frame;
Fixing a portion of the protective film that is not in contact with the brittle material substrate to the substrate holding member while bringing a protective film having no adhesiveness to the brittle material substrate into contact with the entire other main surface of the brittle material substrate A protective film disposing step of disposing the protective film on the brittle material substrate by,
While the brittle material substrate on which the protective film is arranged is supported from below, the tip of the upper blade is brought into contact with the scheduled cutting position on the other main surface side corresponding to the formation position of the scribe line. A dividing step of dividing the brittle material substrate by lowering,
A method for dividing a brittle material substrate, comprising: 脆性材料基板を分断する方法であって、
あらかじめ一方主面側の分断対象位置にスクライブラインが形成されてなる脆性材料基板の前記一方主面を、周囲に余白領域を設けつつ粘着フィルムに貼り付けるとともに、
前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記粘着フィルムの前記余白領域に貼付したうえで、
前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持し、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する、
ことを特徴とする、脆性材料基板の分断方法。 A method of dividing a brittle material substrate,
Affixed to the adhesive film while providing a blank area around the one main surface of the brittle material substrate in which a scribe line is formed in a position to be divided on one main surface side in advance,
A part of the protective film that is not in contact with the brittle material substrate is brought into contact with the entire surface of the other main surface of the brittle material substrate while a protective film having no adhesiveness to the brittle material substrate is brought into contact with the margin of the adhesive film. After pasting on the area,
The brittle material substrate on which the protective film is arranged is supported from below, and the tip of the upper blade is lowered while being brought into contact with the planned cutting position on the other main surface side corresponding to the formation position of the scribe line. To sever the brittle material substrate,
A method for dividing a brittle material substrate. 脆性材料基板を分断する方法であって、
あらかじめ一方主面側の分断対象位置にスクライブラインが形成されてなる脆性材料基板の前記一方主面を、枠体に粘着フィルムを張設してなる基板保持部材の前記粘着フィルムに貼り付けるとともに、
前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記基板保持部材に固定したうえで、
前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持し、上刃の先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接させるようにしながら下降させることによって前記脆性材料基板を分断する、
ことを特徴とする、脆性材料基板の分断方法。 A method of dividing a brittle material substrate,
Affixing the one main surface of the brittle material substrate in which a scribe line is previously formed at a position to be divided on one main surface side to the adhesive film of the substrate holding member formed by stretching an adhesive film on the frame,
Fixing a portion of the protective film that is not in contact with the brittle material substrate to the substrate holding member while bringing a protective film having no adhesiveness to the brittle material substrate into contact with the entire other main surface of the brittle material substrate And then
The brittle material substrate on which the protective film is arranged is supported from below, and the tip of the upper blade is lowered while being brought into contact with the planned cutting position on the other main surface side corresponding to the formation position of the scribe line. To sever the brittle material substrate,
A method for dividing a brittle material substrate. 脆性材料基板を分断するための装置であって、
一方主面側の分断対象位置にスクライブラインが形成されてなる前記脆性材料基板の前記一方主面を、周囲に余白領域を設けつつ粘着フィルムに貼り付ける基板貼付手段と、
前記脆性材料基板に対する粘着性を有さない保護フィルムを前記脆性材料基板の他方主面の全面に接触させつつ前記保護フィルムの前記脆性材料基板とは接触していない部分を前記粘着フィルムの前記余白領域に貼付することによって前記保護フィルムを前記脆性材料基板上に配置する保護フィルム配置手段と、
前記保護フィルムが配置されてなる前記脆性材料基板を下方から支持する支持手段、
先端を前記スクライブラインの形成位置に対応する前記他方主面側の分断予定位置に当接可能な上刃と、
前記上刃を前記スクライブラインの形成位置に対応する前記他方主面の分断予定位置に当接せるようにしながら下降させる手段と、
を備えることを特徴とする、脆性材料基板の分断装置。 An apparatus for cutting a brittle material substrate,
A substrate pasting means for pasting the one main surface of the brittle material substrate, in which a scribe line is formed at a position to be divided on the one main surface side, to a pressure-sensitive adhesive film while providing a blank area around it,
A part of the protective film that is not in contact with the brittle material substrate is brought into contact with the entire surface of the other main surface of the brittle material substrate while a protective film having no adhesiveness to the brittle material substrate is brought into contact with the margin of the adhesive film. Protective film placement means for placing the protective film on the brittle material substrate by sticking to a region;
Support means for supporting the brittle material substrate on which the protective film is disposed from below;
An upper blade capable of abutting the tip with the scheduled cutting position on the other main surface side corresponding to the formation position of the scribe line;
Means for lowering the upper blade while bringing it into contact with the scheduled cutting position of the other main surface corresponding to the formation position of the scribe line;
An apparatus for cutting a brittle material substrate, comprising:
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