JP6043149B2 - Breaking device for brittle material substrate and method for breaking brittle material substrate - Google Patents

Breaking device for brittle material substrate and method for breaking brittle material substrate Download PDF

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JP6043149B2
JP6043149B2 JP2012237683A JP2012237683A JP6043149B2 JP 6043149 B2 JP6043149 B2 JP 6043149B2 JP 2012237683 A JP2012237683 A JP 2012237683A JP 2012237683 A JP2012237683 A JP 2012237683A JP 6043149 B2 JP6043149 B2 JP 6043149B2
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substrate
brittle
elastic
scribe line
breaking
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JP2014087936A (en
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武田 真和
真和 武田
村上 健二
健二 村上
健太 田村
健太 田村
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三星ダイヤモンド工業株式会社
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Description

  The present invention relates to a brittle material substrate breaking device and a breaking method for breaking a brittle material substrate.

  A semiconductor element is manufactured by breaking an element region formed on a substrate at a boundary position of the region. Thus, when the substrate is cleaved, a break device is used. Such a break device ablates the substrate surface with a scribing line formed by scribing the substrate surface with a scribing wheel, a scribe groove formed by cutting the substrate surface into a linear shape with a cutting tool such as a diamond cutter, or a laser beam. Ablation processing lines removed in a linear form, or processing lines in which the surface of the substrate is locally melted by laser light to alter the structure of the substrate into a linear shape. This substrate is called a “scribe line” by pressing it in the Z direction with a break bar from the main surface opposite to the main surface on which the scribe line is formed. Is broken at the scribe line facing the X direction. When the substrate is broken, the substrate is abutted and supported by a pair of receiving members, which are called receiving blades or the like and are separated from each other by a minute distance in the Y direction (see, for example, Patent Document 1).

  FIG. 8 is a schematic view showing a state in which a substrate is broken by such a conventional break device.

  An adhesive film 42 called a dicing tape is attached to the circular opening formed at the center of the ring member 43 with the adhesive surface thereof facing down. Then, the break target substrate 100 is attached to the adhesive surface of the adhesive film 42. The ring member 43 to which the substrate 100 is attached via the adhesive film 42 is set on the rotating member 11 of the breaking device. In this state, the substrate 100 is supported by the pair of receiving members 61 and 62 in the support mechanism 10 via the protective film 44.

  A scribe line 99 is formed on the lower main surface of the substrate 100. The scribe line 99 is photographed by the CCD camera 35 from the gap between the pair of receiving members 61 and 62, and the substrate 100 is positioned based on the image photographed by the CCD camera 35. Thereafter, the break bar 14 presses the main surface of the substrate 100 opposite to the main surface on which the scribe line is formed, so that the substrate 100 is broken along the scribe line 99.

JP 2004-39931 A

  As described above, when the structure in which the substrate 100 is attached to the adhesive film 42 and the break is adopted, there is a problem that the adhesive film 42 is consumed every time the break is executed. For this reason, the cost for the break of the substrate becomes high as much as the adhesive film 42 is consumed. Moreover, the operation | work for sticking the board | substrate 100 to the adhesive film 42 is needed.

  The present invention has been made in order to solve the above-mentioned problems. A brittle material that can break a substrate without using an adhesive film to improve work efficiency and reduce the cost of the adhesive film. It is an object of the present invention to provide a substrate breaking device and a brittle material substrate breaking method.

The invention according to claim 1 is a brittle material that breaks the brittle material substrate by pressing a break bar along the scribe line against the brittle material substrate having a scribe line formed on one main surface. An apparatus for breaking a substrate, which is translucent and supports the brittle material substrate in contact with a main surface of the brittle material substrate on which the scribe line is formed, and the brittle material substrate Is fixed to the elastic member, a fixing means for adsorbing and holding the elastic member on the surface of the elastic member, a translucent table that supports the elastic member from the side opposite to the brittle material substrate, and the elastic member. A break bar for pressing the brittle material substrate from the main surface opposite to the main surface on which the scribe line is formed, and the scribe line through the table and the elastic member A camera for shadow, based on the image taken by the camera, characterized by comprising a moving mechanism for relatively moving said table and said break bar.

  According to a second aspect of the present invention, in the first aspect of the present invention, the fixing means exhausts the brittle material substrate between the brittle material substrate and the elastic member, thereby removing the brittle material substrate from the surface of the elastic member. It is an adsorption holding mechanism for adsorbing and holding.

  According to a third aspect of the present invention, in the second aspect of the present invention, the suction holding mechanism breaks the brittle material substrate formed on a contact surface of the elastic member with the brittle material substrate. The suction port corresponding to each element is provided for sucking and holding each element created by the above.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the elastic member is a sheet-like member made of transparent rubber (for example, transparent silicone rubber).

  The invention according to claim 5 is a brittle material that breaks the brittle material substrate by pressing a break bar along the scribe line against the brittle material substrate having a scribe line formed on one main surface. A method of breaking a substrate, wherein a brittle material substrate in which the scribe line is formed on a surface of a light-transmitting elastic member disposed on a light-transmitting table is used as a main material in which the scribe line is formed. A placing step of placing the surface in contact with the surface of the elastic member; an adsorption holding step of adsorbing and holding the main surface on which the scribe line of the brittle material substrate is formed on the surface of the elastic member; The table is based on a photographing step of photographing a scribe line with the camera through the table and the elastic member, and an image photographed with the camera. The moving step of relatively moving the break bar, and the break bar presses the brittle material substrate adsorbed and held by the elastic member from the main surface opposite to the main surface on which the scribe line is formed. And a pressing step.

  According to invention of Claim 1 and Claim 5, a board | substrate can be broken by the effect | action of an elastic member, without using an adhesive film, and the operation | work which sticks a board | substrate to an adhesive film is abbreviate | omitted. In addition, the cost of the adhesive film can be reduced. At this time, since the elastic member and the table have translucency, it becomes possible to execute imaging of a scribe line for positioning the substrate and the break bar from the elastic member and the table side.

  According to the invention described in claim 2, it is possible to fix the substrate by adsorbing and holding the substrate on the surface of the elastic member.

  According to invention of Claim 3, it becomes possible to adsorb and hold each element created by the break on the surface of the elastic member.

  According to the invention described in claim 4, it is possible to obtain elasticity and translucency suitable for the break of the substrate.

1 is a perspective view of a breaking device for a brittle material substrate according to the present invention. 1 is a perspective view of a breaking device for a brittle material substrate according to the present invention. It is a schematic diagram which shows the state which arrange | positions the board | substrate 100 on the translucent table 102 and the elastic sheet member 101, and breaks. FIG. 4 is a partially enlarged view of FIG. 3. It is explanatory drawing which shows the arrangement | positioning of the suction opening 71 formed in the elastic sheet member 101 with the board | substrate 100. FIG. It is explanatory drawing which shows the structure of the adsorption | suction groove | channel 72 formed in the translucent table 102. FIG. It is a flowchart which shows a break operation | movement. It is a schematic diagram which shows a mode that a board | substrate is broken with the conventional break apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views of a brittle material substrate breaking device according to the present invention.

  This brittle material substrate breaker is composed of a brittle material substrate (hereinafter simply referred to as a ceramic material, glass or other brittle material such as LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics)). (To be referred to as “substrate”). The substrate breaker has a structure in which a substrate is sucked and held on an elastic sheet member 101 made of transparent silicone rubber disposed on a glass translucent table 102. The substrate breaker includes a rotating member 11 that rotates the translucent table 102 so that the direction of a scribe line formed on the substrate that is sucked and held on the elastic sheet member 101 is aligned with a desired direction, and the rotating member 11. A supporting Y table 12, a supporting table 13 that supports the Y table 12, and a lifting table 16 that moves up and down with respect to the rotating member 11 are provided. The support table 13 is installed on the ground via the four shafts 18, the base 17 and the legs 19.

  On the upper surface of the support table 13, four columnar lifting guides 24 are erected at positions outside the rotating member 11, and the gantry 21 is fixed so as to bridge the upper ends of these columnar lifting guides 24. ing. In addition, an elevating table 16 is provided between the support table 13 and the gantry 21 so as to be guided up and down by a columnar elevating guide 24.

  A stepping motor 23 is installed on the gantry 21 via a support member 22. A ball screw 25 that penetrates the gantry 21 in a rotatable state is connected to the rotation shaft of the stepping motor 23, and the ball screw 25 is screwed into a female screw portion formed on the lifting table 16. For this reason, the lifting table 16 moves up and down in the Z direction by driving the stepping motor 23.

  As shown in FIG. 2, a break bar 14 is attached to the lower surface of the lifting table 16 via a fishing support member 15. The break bar 14 is also called a blade or a break blade, and applies a force to break the substrate by pressing the substrate along a scribe line formed on the substrate when the substrate is broken. Is for.

  As shown in FIG. 2, the Y table 12 is driven by a ball screw 32 that is rotated by driving a stepping motor 31, and reciprocates on the support table 13 in the Y direction. In addition, the rotational angle position of the rotating member 11 can be adjusted by rotating the ball screw 33 by the stepping motor 34.

  As shown in FIG. 2, a CCD camera 35 is installed below the support table 13. The CCD camera 35 is movable in the X direction along a pair of guide rails 37 supported by a support plate 39 on the base 17. The support portion 41 of the CCD camera 35 is screwed with a ball screw 38 that is rotated by driving of the stepping motor 36. For this reason, the CCD camera 35 is driven by the stepping motor 36 to reciprocate in the X direction. The CCD camera 35 is for observing the positional relationship between the scribe line formed on the substrate and the break bar 14 via the translucent table 102 and the elastic sheet member 101.

  FIG. 3 is a schematic view showing a state in which the substrate 100 is disposed on the translucent table 102 and the elastic sheet member 101 and is broken, and FIG. 4 is a partially enlarged view thereof.

  As shown in FIGS. 3 and 4, the elastic sheet member 101 is provided with an adsorption port (exhaust port) 71 for adsorbing and holding the substrate 100 on the elastic sheet member 101. In addition, an adsorption groove (exhaust groove) 72 is formed at a position facing the adsorption port 71 in the translucent table 102. The suction groove 72 is connected to an exhaust part 74 such as a vacuum pump or an exhaust fan. For this reason, the substrate 100 placed on the elastic sheet member 101 is elasticized by exhausting between the substrate 100 and the elastic sheet member 101 through the suction groove 72 and the suction port 71 by the action of the exhaust unit 74. Adsorbed and held on the sheet member 101.

  Even in this state, since both the translucent table 102 and the elastic sheet member 101 have translucency, as shown in FIG. 3, the scribe line 99 formed on the substrate 100 has the translucent table 102 and Observation with the CCD camera 35 through the elastic sheet member 101 becomes possible.

  FIG. 5 is an explanatory view showing the arrangement of the suction ports 71 formed in the elastic sheet member 101 together with the substrate 100.

  In the embodiment shown in FIG. 5, the substrate 100 is divided into 42 elements P by being broken by five vertical and six horizontal scribe lines 99. For this reason, the elastic sheet member 101 is provided with 42 suction ports 71 corresponding to the respective elements P in order to suck and hold the respective elements P created by breaking the substrate 100. In this embodiment, for convenience of explanation, a case where the substrate 100 is divided into 42 elements P is shown, but actually, the substrate 100 is further divided into a large number of elements P.

  FIG. 6 is an explanatory view showing the configuration of the suction groove 72 formed in the translucent table 102.

  The translucent table 102 is formed with suction grooves 72 composed of six vertical and seven horizontal grooves. For this reason, the suction groove 72 is disposed at a position facing all the 42 suction ports 71 described above. The suction groove 72 need not be composed of vertical and horizontal groove portions, and may be composed of only vertical or horizontal groove portions. In short, it is only necessary that the suction grooves 72 are arranged at positions facing all the suction ports 71.

  Next, the breaking operation by the above-described breaking device for the substrate 100 will be described. FIG. 7 is a flowchart showing the break operation.

  When performing the breaking operation, first, the substrate 100 is placed on the elastic sheet member 101 in the breaking device (step S1). Then, by the action of the exhaust part 74, the space between the substrate 100 and the elastic sheet member 101 is exhausted through the suction groove 72 formed in the translucent table 102 and the suction port 71 formed in the elastic sheet member 101. Thus, the substrate 100 is sucked and held on the elastic sheet member 101 (step S2).

  Next, the scribe line 99 formed on the substrate 100 is photographed by the CCD camera 35 (step S3). At this time, since the translucent table 102 and the elastic sheet member 101 have translucency, they are formed on the substrate by the CCD camera 35 from below the substrate 100 via the translucent table 102 and the elastic sheet member 101. An image of the scribe line 99 can be taken. When photographing the scribe line 99, the CCD camera 35 is moved in the X direction by driving the stepping motor 36, and an image is photographed over the entire area of the scribe line 99 extending in the X direction.

  Next, the substrate 100 and the break bar 14 are moved relative to each other based on the image photographed by the CCD camera 35, thereby positioning the scribe line 99 and the break bar 14 on the substrate 100 (step S4). More specifically, the angle and position of the scribe line 99 formed on the substrate 100 are recognized based on the image of the scribe line 99 photographed by the CCD camera 35. Then, the Y table 12 is moved in the Y direction by driving the stepping motor 31, and the rotation angle position of the rotating member 11 is adjusted by driving the stepping motor 34 to move the substrate 100 in the Y direction and θ direction. The substrate 100 is arranged at a position where the scribe line 99 and the break bar 14 arranged at the end face each other accurately.

  Thereafter, the substrate 100 is pressed by the break bar 14 to break the substrate 100. That is, the lift table 16 is lowered by driving the stepping motor 23, the break bar 14 is brought into contact with the main surface of the substrate 100 opposite to the scribe line 99, and then the break bar 14 is further lowered. In this state, since the substrate 100 is supported by the elastic sheet member 101, a bending stress is generated in the substrate 100 by the elastic force of the elastic sheet member 101. When the break bar 14 is further lowered, the substrate 100 is broken at a position corresponding to the scribe line 99 in combination with the scribe line 99 being arranged so as to coincide with the break bar 14. The

  In order to appropriately break the substrate 100 by generating an appropriate bending stress on the substrate 100, it is necessary to appropriately select the thickness and hardness of the elastic sheet member 101. The thickness of the elastic sheet member 101 is preferably about 1 mm to 5 mm, although it depends on the hardness and thickness of the substrate 100. The hardness of the elastic sheet member 101 is preferably about 30 to 70 degrees (A50 to A70 according to JIS K 6253), although it depends on the hardness and thickness of the substrate 100.

  When the break along the first scribe line 99 of the substrate 100 is completed, the Y table 12 is moved in the Y direction by a distance corresponding to the pitch of the scribe line 99 by driving the stepping motor 31 while photographing the substrate 100 by the CCD camera 35. Then, the break bar 14 is lowered again to break the substrate 100 at a position corresponding to the next scribe line 99. Note that when the Y table 12 can be accurately moved by a distance corresponding to the pitch of the scribe lines 99, the photographing of the substrate 100 by the CCD camera 35 may be omitted.

  When the break is executed along the scribe line 99 in the direction orthogonal to the scribe line 99 that has completed the break, the stepping motor 34 is driven to rotate the rotating member 11 by 90 degrees, and then the above-described steps S3 and S4. Step S5 is repeated. In this case, even when the substrate 100 becomes the element P shown in FIG. 5 due to the breaking work of the substrate 100, the elastic sheet member 101 adsorbs each element P created by breaking the substrate 100. Since 42 suction ports 71 corresponding to each element P are formed for holding, the substrate 100 does not fall off the elastic sheet member 101.

  When the break operation of the substrate 100 is completed in the region corresponding to all the scribe lines 99 (step S6), the substrate 100 (each element P) is unloaded and the operation is terminated (step S7).

In the above-described embodiment, the fixing means for fixing the substrate 100 to the surface of the elastic sheet member 101 includes the suction port 71 and the suction groove 72, and the substrate 100 is sucked and held on the surface of the elastic sheet member 101. Although the suction holding mechanism is used, other fixing means may be used .

DESCRIPTION OF SYMBOLS 10 Support mechanism 11 Rotating member 12 Y table 13 Support table 15 Fishing support member 14 Break bar 16 Lifting table 23 Stepping motor 25 Ball screw 31 Stepping motor 32 Ball screw 33 Ball screw 34 Stepping motor 35 CCD camera 36 Stepping motor 37 Guide rail 38 Ball screw 71 Suction port 72 Suction groove 74 Exhaust part 99 Scribe line 100 Substrate 101 Elastic sheet member 102 Translucent table P element

Claims (5)

  1. A brittle material substrate breaking device that breaks the brittle material substrate by pressing a break bar along the scribe line against the brittle material substrate having a scribe line formed on one main surface,
    An elastic member that has translucency and supports the brittle material substrate in a state in contact with the main surface on which the scribe line of the brittle material substrate is formed;
    Fixing means for adsorbing and holding the brittle material substrate on the surface of the elastic member; and
    A table having translucency and supporting the elastic member from the side opposite to the brittle material substrate;
    A break bar that presses the brittle material substrate fixed to the elastic member from the main surface opposite to the main surface on which the scribe line is formed;
    A camera for photographing the scribe line through the table and the elastic member;
    A moving mechanism for relatively moving the table and the break bar based on an image captured by the camera;
    An apparatus for breaking a brittle material substrate, comprising:
  2. The apparatus for breaking a brittle material substrate according to claim 1,
    The brittle material substrate breaking device is an adsorption holding mechanism that sucks and holds the brittle material substrate on the surface of the elastic member by exhausting between the brittle material substrate and the elastic member.
  3. The apparatus for breaking a brittle material substrate according to claim 2,
    The adsorption holding mechanism corresponds to each element for adsorbing and holding each element formed by breaking the brittle material substrate formed on the contact surface of the elastic member with the brittle material substrate. Breaking device for brittle material substrate provided with a suction port.
  4. In the break apparatus of the brittle material substrate according to any one of claims 1 to 3,
    The brittle material substrate breaking device, wherein the elastic member is a sheet-like member made of transparent rubber.
  5. A brittle material substrate breaking method of breaking the brittle material substrate by pressing a break bar along the scribe line against the brittle material substrate having a scribe line formed on one main surface,
    A brittle material substrate in which the scribe line is formed on the surface of a light transmissive elastic member disposed on a light transmissive table, and a main surface on which the scribe line is formed is a surface of the elastic member. A placing step of placing in a contact state;
    An adsorption holding step of adsorbing and holding the main surface of the brittle material substrate on which the scribe line is formed on the surface of the elastic member;
    A photographing step of photographing the scribe line with the camera via the table and the elastic member;
    A moving step of relatively moving the table and the break bar based on an image taken by the camera;
    Pressing the brittle material substrate adsorbed and held by the elastic member from the main surface opposite to the main surface on which the scribe line is formed by the break bar;
    A method for breaking a brittle material substrate, comprising:
JP2012237683A 2012-10-29 2012-10-29 Breaking device for brittle material substrate and method for breaking brittle material substrate Active JP6043149B2 (en)

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JP2012237683A JP6043149B2 (en) 2012-10-29 2012-10-29 Breaking device for brittle material substrate and method for breaking brittle material substrate
TW102118209A TWI581930B (en) 2012-10-29 2013-05-23 Fracture material of brittle material substrate and cracking method of brittle material substrate
CN201310331803.0A CN103786269B (en) 2012-10-29 2013-07-29 The brisement device and the breaking method thereof of brittle substrate of brittle substrate

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TWI581930B (en) 2017-05-11
TW201416202A (en) 2014-05-01
CN103786269A (en) 2014-05-14
JP2014087936A (en) 2014-05-15

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