JP6140325B2 - Fragment material substrate cutting device - Google Patents

Description

The present invention relates to partial sectional device you divide the brittle material substrate of a ceramic substrate or the like.

  A semiconductor element is manufactured by breaking an element region formed on a substrate at a boundary position of the region. As described above, when the substrate is broken, the breaking device is used. Such a break device is configured such that a substrate on which a scribe line formed by scribing the substrate surface with a scribing wheel is formed on one surface is separated from a surface opposite to the surface on which the scribe line is formed by a break bar. By pressing in the Z direction, the substrate is configured to break along a scribe line facing the X direction. When the substrate is broken, the substrate is abutted and supported by a pair of receiving members, which are called receiving blades or the like and are separated from each other by a minute distance in the Y direction (see, for example, Patent Document 1).

JP 2014-87937 A

  In the conventional method for dividing a brittle material substrate, first, as shown in FIG. 1A, a dicing tape 101 is attached to the inside of a circular annular ring 100. The dicing tape 101 is an adhesive and stretchable film. Thereafter, as shown in FIG. 1B, the brittle material substrate 102 is held on the dicing tape 101 and scribed. Then, the ring 100 is inverted as shown in FIG. 1C, the protective film 103 is placed on the substrate 102, and the periphery is brought into contact with the dicing tape 101. Usually, as the protective film 103, a film having no adhesiveness is used. Next, as shown in FIG.1 (d), the ring 100 is hold | maintained on the receiving blades 104 and 105 of a breaking device. Then, the scribed portion is arranged at the center of the pair of receiving blades 104 and 105, and is sequentially cut by pressing the break bar 106 along the scribe line from above.

  However, when a substrate scribed by such a method is to be broken, if the amount of pushing the break bar into the substrate is too large, the substrate is left and right as shown by arrows A and B in FIG. However, there is a problem in that a chipping force may be generated due to contact between the ends of the chips of the already divided substrate.

  The present invention has been made paying attention to such a problem, and even when a brittle material substrate is fixed on a ring and sequentially broken, it is ensured without causing chipping of already divided chips. It aims at providing the dividing method which can be divided.

In order to solve this problem, the cutting apparatus of the present invention breaks a brittle material substrate in which a scribe line is formed on one surface of a brittle material substrate and the surface on which the scribe line is formed is attached to an adhesive film. And a means for covering the other surface of the brittle material substrate affixed to the adhesive film with a protective film having no adhesiveness , and a scribe line of the brittle material substrate from the protective film side. In addition, a means for pressing the break bar is provided , and the means for covering with the protective film includes means for covering the protective film from the upper part of the brittle material substrate and means for contacting the periphery of the protective film with the adhesive film . As the protective film, it is preferable to use a film that does not have adhesiveness or has a lower adhesiveness than the adhesive film.

  According to the present invention having such a feature, a brittle material can be obtained by attaching a dicing tape on the scribe line side and a protective film on the opposite side when dividing the brittle material substrate, and pressing a break bar from the protective film side. The effect of being able to break without causing chipping or the like without damaging the substrate is obtained, and particularly when the protective film has no adhesiveness or the adhesiveness is low, a remarkable effect is obtained. .

FIG. 1 is a diagram showing a dividing process for breaking a conventional brittle material substrate. FIG. 2 is a perspective view of the breaking device according to the embodiment of the present invention. FIG. 3 is a perspective view of the breaking device according to the embodiment of the present invention. FIG. 4 is a plan view showing a ring member according to the embodiment of the present invention. FIG. 5 is a diagram showing a cutting process of a brittle material substrate according to the embodiment of the present invention.

  FIG. 2 and FIG. 3 are perspective views from different directions on the front, showing the brittle material substrate breaking device according to the first embodiment of the present invention. This brittle material substrate breaker is for breaking (breaking) a brittle material substrate (hereinafter simply referred to as “substrate”) made of a ceramic substrate, glass or other brittle material. In these drawings, the breaker 10 has a support table 11 held on a table 13 by four columns 12. The support table 11 supports the Y table 14, and a rotary table 15 is provided on the Y table 14. The Y table 14 is a table that moves the rotary table 15 in the y-axis direction, and the rotary table 15 is a table that rotates a substrate described later. In addition to the rotary table 15, four cylindrical lifting guides 17 are erected on the upper surface of the support table 11, and a gantry 18 is provided so as to bridge the upper end of the lifting guide 17. Between the support table 11 and the gantry 18 is provided an elevating table 19 which is elevating and guided by an elevating guide 17 so as to be freely movable only in the z-axis direction.

  A stepping motor 21 is provided on the gantry 18 via a support member 20. A ball screw 22 that passes through the rotation shaft of the stepping motor 21 so as to freely rotate with respect to the gantry 18 is connected. The ball screw 22 is screwed to the lifting table 19. Therefore, the lifting table 19 is moved up and down in the z-axis direction by driving the stepping motor 21. A break bar 23 that breaks the substrate by pressing the substrate during break is attached to the lower surface of the lifting table 19 via a support member 24. The break bar 23 is used to apply a force to break the substrate by pressing the substrate along a scribe line formed on the substrate when the substrate is broken.

  On the support table 11, a stepping motor 25 and a ball screw 26 that rotates by driving the stepping motor 25 are provided, and the Y table 14 is moved in the y-axis direction under the driving of the ball screw 26. The motor 27 and the rotation mechanism 28 rotate the rotary table 15. On the rotary table 15, a pair of receiving blades 30a and 30b are held.

  A camera 31 is installed below the support table 11. The camera 31 is a CCD camera, for example, for observing the front edge of the receiving blade and the blade 23 through an opening formed on the support table 11.

  A moving mechanism for moving the camera 31 in the x-axis direction is provided below the support table 11. As shown in FIG. 3, this moving mechanism has a stepping motor 32 and a bopole screw 33 connected to the shaft thereof. By moving the camera support 35 along the guide rail 34 in the x-axis direction, The upper camera 31 is moved in the x-axis direction.

  The brittle material substrate 40 to be broken (hereinafter simply referred to as a substrate) includes a substrate having a crystal structure such as a silicon single crystal substrate, a high-hardness substrate such as a sapphire substrate or a diamond substrate, and silicon carbide (SiC). And substrates such as aluminum nitride (AlN) substrates. Furthermore, various brittle material substrates such as a glass substrate may be used.

  FIG. 4 is a plan view showing a ring member 41 for setting the substrate 40 in the breaking device. An adhesive film 42 called a dicing tape is attached to a circular opening formed in the center of the ring member 41 with its adhesive surface facing the ring member 41 side. The adhesive film 42 is an adhesive and stretchable dicing tape. For example, the adhesive film 42 is made of PVC (polyvinyl chloride), PO (polyolefin) or the like and has a thickness of about 100 μm.

  On the substrate 40 to be broken, scribe lines are formed in a lattice shape so as to be separated into a large number of chips in advance as shown in FIG. Then, as shown in FIG. 5B, the scribed surface of the substrate 40 is attached to the adhesive surface of the adhesive film 42. Next, a protective film 43 thinner than the upper part of the substrate 40 is placed, and the periphery is brought into contact with the adhesive film 42. Here, the protective film 43 is made of, for example, PET (polyethylene terephthalate) having a thickness of about 25 μm. This protective film 43 is used to protect the substrate 40 at the time of the break and to prevent positional deviation of the chip and the substrate that are cut off at the time of the break. The ring member 41 to which the substrate 40 is attached is set on the turntable 15 shown in FIG. At this time, the scribe line is placed so as to be positioned between the receiving blades 30 a and 30 b of the rotary table 15 via the adhesive film 42.

  FIG. 5C is an enlarged view showing a state where the substrate 40 is broken. In this state, a pair of receiving blades 30a and 30b are disposed on the lower surface of the substrate 40, and the adhesive film 42 that adheres the substrate 40 is supported by the pair of receiving blades 30a and 30b. In this state, the scribe line is observed by the CCD camera 31 through a region between the pair of receiving blades 30a and 30b. And the break bar 23 is arrange | positioned in the position facing a scribe line. In this state, the break bar 23 is pressed from the end scribe line to break.

  When the break is completed, the substrate 40 is shifted to the side together with the ring member 41 and positioned so that the scribe line and the break bar 23 are positioned between the pair of receiving blades 30a and 30b. In this state, the break bar 23 is pressed from the scribe line as shown in FIG. In this way, when the break bar 23 is pressed, the adhesive film 42 is stretched to generate a lateral spreading force, and the adhesive film 42 is stretched to expand the substrate, and the contact between the chips is reduced. Will not occur. Thus, no chipping occurs even if breaks are repeated along the scribe line. If it carries out like this, the board | substrate 40 can be cut | disconnected completely along a scribe line, and can be individualized, and an end surface precision can be improved.

  In this embodiment, a pair of receiving blades are provided on the table of the breaking device, and the scribe line is positioned between them and pressed by a break bar so as to be broken by three-point bending. You may make it hold | maintain the board | substrate which should be broken through an adhesive film, and may make it break by pressing a break bar.

  The present invention eliminates chipping at the end of a chip when a brittle material substrate is attached to a ring and breaks, and is effective in a cutting method for dividing the substrate into minute chips.

DESCRIPTION OF SYMBOLS 10 Break apparatus 11 Support table 14 Y table 15 Rotating table 17 Lifting guide 18 Base 19 Lifting table 20 Supporting member 21 Stepping motor 22 Ball screw 23 Break bar 24 Supporting member 30a, 30b Receiving blade 40 Brittle material substrate 41 Ring member 42 Adhesiveness Film 43 Protective film

Claims (1)

A scribe line is formed on one surface of the brittle material substrate, and the cutting device breaks the brittle material substrate attached to the adhesive film on the surface on which the scribe line is formed,
Means for covering the other surface of the brittle material substrate affixed to the adhesive film with a protective film having no adhesiveness , and means for pressing the break bar from the protective film side in accordance with the scribe line of the brittle material substrate equipped with,
The means for covering with the protective film is a means for covering the protective film from an upper part of the brittle material substrate and a means for contacting the periphery of the protective film with the adhesive film.
A cutting apparatus comprising: