TWI676539B - Resin sheet breaking method and breaking device - Google Patents

Abstract

An object of the present invention is to accurately cut a resin sheet.

The resin sheet 33 is held on the adhesive tape 32 extended and held on the cutting ring 31, and the cutting ring 31 is fixed on the platform 16 of the cutting device. Then, the scribing head 27 is relatively moved relative to the platform 16, the scribing wheel 28 is rotated on the resin sheet 33, and the resin sheet 33 is scribed, thereby separating the resin sheet 33. In this way, the use of a scribing wheel enables the resin sheet to be cut into a desired shape with high accuracy.

Description

Method and device for cutting resin sheet

The invention relates to a cutting method and a cutting device for cutting a resin sheet such as a silicone sheet.

Patent Document 1 discloses a method for cutting a thermoplastic resin sheet using a cutting blade. When cutting, the blade is heated, and the cutting blade is reciprocated in the biting direction to cut. Further, Patent Document 2 discloses a method in which when cutting a single resin sheet, cutting is performed by using two upper and lower blades in order to remove burrs at the time of cutting.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 61-10280

[Patent Document 2] Japanese Patent No. 3625146

Conventionally, when cutting a resin sheet, the cutting blade was moved back and forth in the biting direction to perform cutting. Therefore, there was a problem that it was difficult to accurately perform cutting with high accuracy. In addition, the method of cutting using two upper and lower blades has a problem that it is difficult to accurately match the upper and lower cutting blades.

An object of the present invention is to provide a cutting method capable of cutting a resin sheet with high accuracy.

In order to solve the above problems, the resin sheet cutting method of the present invention is to divide the resin sheet by applying a load on the resin sheet and rotating the scribing wheel because the resin sheet is held on a platform.

In order to solve the above-mentioned problem, the method for cutting a resin sheet of the present invention is to adhere and hold the resin sheet on the upper surface of the adhesive tape held on the inside of the frame body by stretching, to hold the frame body on the platform, The resin sheet on the frame-like body is loaded with a load and the scribing wheel is rotated to separate the resin sheet, and the separated resin sheet is separated by expanding the adhesive tape from the lower surface.

In order to solve the above problems, the cutting device of the present invention is used for cutting a resin sheet, and includes: a frame-shaped body that holds a resin sheet to be a scribing object on an adhesive tape; a platform that maintains the frame shape Body; a scribing head that raises and lowers the scribing wheel relative to the resin sheet held on the platform; and a relative moving device that moves the scribing head and the platform relatively; and The resin sheet is rotated, and the resin sheet is divided.

Here, the resin sheet may be a silicone resin sheet.

Here, the scribing wheel may have a blade angle of 100 ° or less.

According to the present invention having such a characteristic, the resin sheet is divided by being underlined while the resin sheet is held on the adhesive tape and fixed on the platform, and the adhesive tape is expanded and separated. Therefore, it is possible to obtain an effect capable of accurately cutting the resin sheet in a specific shape.

10‧‧‧ Breaking device

11‧‧‧mobile station

12a, 12b‧‧‧Guide

13‧‧‧ball screw

14, 15, 25‧‧‧ Motor

16‧‧‧ platform

20‧‧‧Bridge

21a, 21b

22‧‧‧bridge

23‧‧‧Driver

24‧‧‧Slide

26‧‧‧Feed screw

27‧‧‧ crossed head

28‧‧‧ scribing wheel

31‧‧‧ cutting ring

32‧‧‧ Adhesive tape

33‧‧‧resin sheet

34‧‧‧ glass plate

35‧‧‧ Push up component

FIG. 1 is a schematic perspective view of a breaking device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing details of the platform and the resin sheet held on the upper part of the platform.

Fig. 3 is a side view showing a state where the cutting ring is held on the platform.

Fig. 4 is a perspective view showing a state where a cutting ring is held on the platform.

5 (a) and 5 (b) are a perspective view and a side view showing a state where the adhesive tape is pressed from below to expand the adhesive tape after scribing.

Next, a breaking device according to an embodiment of the present invention will be described. As shown in FIG. 1, in the breaking device 10 of this embodiment, the moving stage 11 is held so as to move freely in the y-axis direction along a pair of guide rails 12 a and 12 b. The ball screw 13 is screwed with the moving stage 11. The ball screw 13 is rotated by the drive of the motor 14 to move the moving stage 11 along the guide rails 12a and 12b in the y-axis direction. A motor 15 is provided on the upper surface of the moving table 11. The motor 15 rotates the platform 16 in the xy plane and positions the platform 16 at a specific angle. As described below, a substrate to be scribed is placed on the platform 16 and held by a vacuum suction device or the like (not shown).

In the breaking device 10, the bridge body 20 is erected along the x-axis direction by using the pillars 21a and 21b so as to straddle the mobile station 11 and the upper platform 16 thereof. A bridge 22 is horizontally provided on the bridge body 20, and a driving portion 23 is provided on the bridge 22. The drive unit 23 moves the carriage 24 in the x-axis direction and includes a motor 25 and a feed screw 26 that is connected to the motor 25 and is rotatably held at the center of the side surface of the bridge 22. As shown in FIG. 1, a scribe head 27 is attached to the carriage 24. A crystal holder is mounted on the lower end of the scribing head 27. The wafer holder holds the disc-shaped scribing wheel 28 rotatably at the lower portion. Inside the scribing head 27, an elevating section capable of raising and lowering the wafer seat is provided, such as a pneumatically controlled cylinder or an electrically controlled linear motor. In this embodiment, a scribing wheel having a vertex angle of 100 ° is used as the scribing wheel 28. Furthermore, the moving mechanism of the platform 16 and the driving part for moving the slide 24 constitute a relative movement device, which relatively moves the scribing head relative to the platform.

FIG. 2 is a perspective view showing details of the platform 16 and a resin sheet held on the upper portion of the platform 16, and FIG. 3 is a side view of FIG. 2. In this embodiment, the cutting target is a silicone resin sheet. In order to hold the resin sheet, a dicing ring 31 is used. The dicing ring 31 is a ring-shaped frame used for separating a semiconductor wafer into wafers. As shown in the figure, an adhesive tape 32 having an adhesive material is attached to the inside of the cutting ring 31 upward. The adhesive tape 32 is a double-layered adhesive tape, which has a base material layer such as vinyl chloride and an adhesive material layer on the upper surface thereof. For example, the base material layer has a thickness of 80 μm, the adhesive material layer has a thickness of 20 μm, and the total thickness is 100 μm. and, A resin sheet 33 (for example, a silicone resin sheet) to be cut is attached to the center of the upper surface of the adhesive tape 32. The resin sheet 33 has elasticity, and it has not previously been thought that the resin sheet 33 can be divided by scribing. In the present embodiment, the resin sheet 33 has a thickness of 0.005 to 1 mm, and here is, for example, a substantially square silicone resin sheet having a thickness of 0.1 mm. This resin sheet 33 is accurately divided into a plurality of square minute sheets of 1 × 1 mm square.

As shown in FIG. 2, a protective thin glass plate 34 having a thickness of, for example, about 0.3 mm is placed on the platform 16 of the breaking device 10. Further, a cutting ring 31 is arranged on the stage 16 so that the resin sheet 33 is positioned above the glass plate 34. The resin sheet 33 is held from below the platform 16 by a vacuum suction device or the like (not shown). In this way, as shown in FIG. 3, the lower surface of the adhesive tape 32 is adsorbed, so the glass plate 34, the adhesive tape 32, and the resin sheet 33 on the upper surface thereof can be held on the platform 16.

Next, a method for cutting the resin sheet 33 will be described. First, the slider 24 and the platform 16 are moved so that the resin sheet 33 is located directly below the scribing wheel 28. Then, the scribing head 27 is lowered so that the scribing wheel 28 reaches a position slightly lower than the upper surface of the resin sheet 33 outside the resin sheet 33. In this state, the carriage 24 is moved in the x-axis direction, whereby the scribing wheel 28 can be rotated while applying a load to the resin sheet 33 to perform scribing. In this manner, the resin sheet 33 such as a silicone resin can be separated by scribing.

Next, the scribing head 27 is raised, and the platform 16 is slightly moved along the y-axis direction at a specific pitch, and then the scribing head 27 is lowered, and the scribing wheel 28 is further moved along the bridge 22 in the x-axis direction. Repeat the way. When all the scribe lines in the x-axis direction are completed, it is convenient to rotate the platform 16 by the motor 15 to change the cutting direction, and repeat the scribe lines similarly. Then, by rotating the scribing wheel from the upper part, the resin sheet 33 is cut in a grid pattern as shown in FIG. 4.

Moreover, as shown in FIGS. 5 (a) and (b), the cutting ring 31 and the resin sheet 33 on the upper part are taken out from the platform 16, and the cutting ring 31 is held from the center lower part, as shown in FIG. 5 (b). The adhesive tape 32 is pushed up from below by the push-up member 35. A wafer expansion device can also be used at this time. In this way, the adhesive tape 32 is expanded, and each of the divided square resin sheets is separated from the adhesive tape 32 to confirm the individual pieces, and each wafer can be easily taken out.

In this embodiment, since the adhesive tape is stretched and attached to the annular cutting ring, and the resin sheet is adhered and held on the upper part, the handling of the resin sheet becomes easy. Moreover, the resin sheet after separation can also be easily taken out by pushing up the adhesive tape. In this way, the dicing ring used in the semiconductor manufacturing step can be effectively used for resin sheet breaking.

In this embodiment, the resin sheet to be cut is described as a sheet containing a silicone resin, but other resin sheets, such as a urethane resin sheet, can also be applied to the same. this invention.

In this embodiment, a thin glass plate 34 is placed on the platform 16 and the resin sheet 33 is kept stretched and held in the cutting ring 31 on the glass plate 34. However, since the glass plate 34 is only used to protect the platform 16 Therefore, it is not necessary to use the glass plate 34.

In this embodiment, a cutter wheel having a vertex angle of 100 ° is used as the scribing wheel, but a scribing wheel having a smaller vertex angle may be used. If the vertex angle is large, the life of the scribing wheel is long, but if the vertex angle is small, accuracy can be increased. For example, using a scribing wheel with a vertex angle of 30 ° can similarly divide the resin sheet by scribing. Therefore, in the range of at least 30 to 100 °, the scoring wheel with any corner can be used to cut the resin sheet.

Further, in this embodiment, the resin sheet is held on the adhesive tape stretched and held on the frame-shaped cutting ring, but it is not limited to the cutting ring as long as it is a frame-shaped body. Further, the resin sheet can be divided by holding the resin sheet on a platform without using a frame-like body, and dividing the resin sheet.

[Industrial availability]

The present invention can accurately cut the resin sheet by using a cutting device, so it is suitable for a cutting device that accurately cuts the resin sheet.

Claims (5)

A method for cutting a resin sheet is to adhere and hold the resin sheet on the upper surface of an adhesive tape stretched and held on the inside of the frame body, place a platform protection board on the platform, and hold the frame body On the plate for protecting the platform, a load is applied to the resin sheet held on the frame and the scribing head is relatively moved to the platform, so that the scribing wheel is rotated, and the scribing wheel is moved by The resin sheet is rotated to cut the resin sheet, and the cut resin sheet is separated by expanding the adhesive tape from the lower surface. The method for cutting a resin sheet according to claim 1, wherein the resin sheet is a silicone resin sheet. A cutting device is used for cutting a resin sheet, and the cutting device comprises: a frame-shaped body that holds a resin sheet to be a scribing object on an adhesive tape; a platform that holds the frame-shaped body; A protective plate is placed on the platform; a scribing head raises and lowers a scribing wheel relative to a resin sheet held on the platform protection plate on the platform; and a relative moving device causes the above The scribing head moves relatively to the platform; and the resin sheet is divided by rotating the scribing wheel on the resin sheet. The breaking device according to claim 3, wherein the resin sheet is a silicone resin sheet. The breaking device as claimed in claim 4, wherein the scribing wheel has a blade angle below 100 °.