TW201516010A - Elastic support plate, fracture apparatus and dividing method - Google Patents

Abstract

The object of the present invention is to fracture the resin layer of a composite substrate along the division line. A resin layer is coated on one surface of the composite substrate which has a plurality of functional areas orderly arranged in the longitudinal direction and the transverse direction, and the substrate is partially fractured in advance. Structures 14 projected to each functional area are disposed on the upper surface of the composite substrate 10. An elastic support plate 40 contains protection holes 41 which are larger than the functional area and located at the center of each grid-shaped area which has the same spacing as the spacing of the scribe line. When fracturing the resin layer of the composite substrate 10, the structures 14 of the functional area are aligned with each protection hole 41, so that the composite substrate 10 is disposed on the elastic support plate 40, followed by directly pressing down an extension bar from above the composite substrate. Accordingly, the resin layer 12 is divided without damaging the functional area 13.

Description

Elastic support plate, breaking device and breaking method

The present invention relates to an elastic support plate, a breaking device, and a breaking method which are used when a composite substrate obtained by coating a resin layer on a substrate such as a semiconductor substrate or a ceramic substrate is divided.

A semiconductor wafer is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the element region. Previously, in the case where the wafer was broken into wafers, the cutting blade was rotated by the cutting device, thereby cutting the semiconductor wafer to be small by cutting.

However, in the case of using a cutting device, it is necessary to have water to discharge the discharged debris due to the cutting, and in order not to adversely affect the performance of the semiconductor wafer by the water or the discharged debris, it is necessary to protect the semiconductor wafer and The steps before cleaning off the water or discharging the debris. Therefore, the steps become complicated, and it is impossible to reduce the cost or shorten the processing time. Moreover, since cutting is performed using a dicing blade, problems such as film peeling or chipping occur. Moreover, in a MEMS (Micro-Electro-Mechanical Systems) substrate having a micro-mechanical structure, the structure is broken due to the surface tension of water, so that water cannot be used, and there is a problem that the cutting cannot be performed by cutting. .

Further, in Patent Documents 1 and 2, there is proposed a substrate breaking device which is formed by pressing a semiconductor wafer on which a scribe line is formed from a back surface of a surface on which a scribe line is formed, and perpendicularly to the surface along a scribe line. And break it. The outline of the cracking by such a breaking device is shown below. Forming a plurality of functional areas neatly arranged on a semiconductor wafer to be a cracked object area. In the case of performing the breaking, first, on the semiconductor wafer, scribe lines are formed in the longitudinal direction and the lateral direction at equal intervals between the functional regions. Then, the breaking is performed along the scribe line by means of a breaking device. Fig. 1(a) is a cross-sectional view showing a semiconductor wafer placed on a cracking device before breaking. As shown in the figure, functional regions 101a and 101b are formed on the composite substrate 101, and scribe lines S1, S2, S3, ... are formed between the functional regions 101a and 101b. In the case of breaking, the tape 102 is attached to the back surface of the composite substrate 101, and the protective film 103 is attached to the front surface. Then, when the crack is broken, as shown in Fig. 1(b), a scribe line to be broken is disposed in the middle of the support knives 105, 106, in this case, a scribe line S2, so that the blade 104 is aligned from the upper portion thereof. The scribing is lowered to press the composite substrate 101. In this way, the three-point bending of the pair of support blades 105, 106 and the blade 104 is used to break.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-39931

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-149495

In the cracking device having such a configuration, when the blade 104 is pressed down and pressed at the time of cracking, the composite substrate 101 is slightly bent, and therefore stress is concentrated on the composite substrate 101 and the support blade 105. , 106 part of the front edge contact. Therefore, if the portions of the support blades 105 and 106 of the breaking device contact the functional regions 101a and 101b as shown in Fig. 1(a), a force is applied to the functional region at the time of the breakage. Therefore, there is a problem that it is possible to damage a functional area on a semiconductor wafer.

Moreover, as a board|substrate which isolate|separated using a cracking device, the composite substrate which apply|coated the enamel resin on the ceramic substrate is used. The composite substrate also has a functional region such as a lens protruding from the resin layer in each functional region. In such a composite substrate, after the ceramic substrate is cracked, the resin layer is directly pressed by the split rod, and in this case, the resin layer is deformed easily. The problem of being damaged. Further, if it is desired to use a laser to break in order to solve the above problem, there is a problem that the laser is damaged by the influence of the heat of the laser or the spatter is attached to the periphery after the laser is irradiated. Moreover, when the composite substrate and the support blade are brought into contact with a region such as a lens protruding from the front as a lower side, there is a problem that the resin layer is damaged when it is broken.

The present invention has been made in view of such a problem, and an object thereof is to enable a composite substrate in which a brittle material substrate has been broken to be broken without damage.

In order to solve the problem, the elastic supporting plate of the present invention supports the composite substrate when the composite substrate is separated, and the composite substrate is coated on a brittle material substrate having a plurality of functional regions formed in a longitudinal direction and a lateral direction. a resin having a strip-shaped fracture line formed in a lattice shape to break a functional region on the brittle material substrate; the elastic support plate being a flat plate including at least an elastic member having the same shape as the composite substrate, and comprising A protective hole at each center position of the region surrounded by the lattice-shaped crack line.

In order to solve the problem, the breaking method of the present invention is a method for breaking a composite substrate by coating a resin on a brittle material substrate having a functional region on one side, and forming a crack line to break the above. a functional area; and an elastic support plate having a protective hole at each central position of the area surrounded by the lattice-shaped break line, wherein the functional areas of the composite substrate are aligned corresponding to the protective hole The composite substrate is disposed on the elastic support plate, and the resin layer is broken by pressing the expansion rod down the line that has been broken.

In order to solve the problem, the breaking device of the present invention is a breaking device for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region on one side, and a crack is formed on the brittle material substrate. a wire to break the functional area; the breaking device includes: a table; an elastic supporting plate, which is a flat plate including at least an elastic member having a width in a plane direction equivalent to the composite substrate, and includes a setting a protective hole at each center position of the region surrounded by the lattice-shaped crack line is disposed on the table, and the surface of the broken line is formed as an upper surface to hold the composite substrate; and the expander includes An extension rod; a moving mechanism that moves the table along the surface thereof; and a lifting mechanism that holds the composite substrate and the expansion rod in parallel while lifting the expander toward the surface of the composite substrate on the elastic support plate .

According to the invention having such a feature, the composite substrate is disposed on the elastic support plate having the opening including the protruding portion of each functional region, and the position of the lowermost end line of the strip-shaped expansion bar corresponds to the break line Align to break. Therefore, it is possible to obtain an effect of breaking the resin layer along the fracture line without damaging the functional region.

10‧‧‧Composite substrate

11‧‧‧Ceramic substrate

12‧‧‧矽 resin

13‧‧‧ functional area

14‧‧‧Buildings

20‧‧‧Fracture device

21‧‧‧Workbench

22, 25‧‧‧ horizontal fixed members

23‧‧‧Servo motor

24‧‧‧Ball screw

26, 29‧‧‧ moving components

27‧‧‧Female thread

28a‧‧‧Support shaft

28b‧‧‧Support shaft

30‧‧‧Expander

31‧‧‧Base

32a~32n‧‧‧Extension stick

40‧‧‧Flexible support plate

41‧‧‧Protection hole

50‧‧‧marking wheel

51‧‧‧Break

101‧‧‧Composite substrate

101a‧‧‧ functional area

101b‧‧‧ functional area

102‧‧‧ Tape

103‧‧‧Protective film

104‧‧‧blade

105‧‧‧Support knife

106‧‧‧Support knife

B _x1 ‧‧‧crack line

S1‧‧‧

S2‧‧‧ scribing

S3‧‧‧

S _x1 ~S _xm ‧‧‧Scratch line

S _y1 ~S _yn ‧‧‧Scratch line

1(a) and 1(b) are cross-sectional views showing the state of the prior semiconductor wafer at the time of cracking.

2(a) and 2(b) are a front view and a side view of a substrate to be separated in accordance with an embodiment of the present invention.

Fig. 3 is a perspective view showing an example of a breaking device for a resin layer at the time of breaking in the embodiment.

Fig. 4 is a perspective view showing an example of the expander of the embodiment.

Fig. 5 is a perspective view showing an elastic support plate for breaking at the embodiment of the present invention.

6(a) to 6(d) are schematic views showing the breaking process of the composite substrate of the embodiment.

Fig. 7 (a) to (d) are schematic views showing the breaking process of the resin layer of the embodiment.

Next, an embodiment of the present invention will be described. 2 is a front view and a side view showing a composite substrate 10 in which a semiconductor element is formed in a rectangular shape as an example of such a substrate. In the embodiment, the composite substrate 10 to be separated is a composite substrate 10 obtained by coating a resin layer, for example, a resin 12 on a ceramic substrate 11. Here, the division of only the ceramic substrate 11 of the composite substrate 10 causes the scribe to extend vertically to the substrate to be separated at one time, so that the division is expressed as "cracking" and the breaking of the enamel resin layer 12 is performed. Since the crack of the resin layer is gradually expanded by the application of force, the breaking is expressed as "fracture". Further, the division of the entire composite substrate 10 is expressed as "breaking". In the manufacturing step of the composite substrate 10, a plurality of functional regions 13 are formed in a lattice shape along a line parallel to the x-axis and the y-axis. This functional area 13 is, for example, an LED (Light-Emitting Diode). Each functional region includes a structure 14 such as a lens that protrudes from the surface of the composite substrate 10. Further, in order to form a semiconductor wafer for each functional region, as shown by a one-dot chain line, the longitudinally equally spaced lines are set as the scribed lines S _y1 to S _yn , and the horizontally equally spaced lines are set. To score the predetermined lines S _x1 ~S _xm , the parts of the functional area are located in the center of the square surrounded by the scribed lines.

Next, the breaking device 20 for breaking the resin layer 12 of the embodiment will be described. As shown in FIG. 3, the breaking device 20 includes a table 21 that is movable and rotatable in the y direction. In the breaking device 20, a moving mechanism is provided below the table 21, and the moving mechanism moves the table 21 along the surface thereof in the y-axis direction, thereby rotating the table 21 along the surface thereof. Further, the composite substrate 10 to be separated is placed on the table 21 via the elastic support plate 40 described below. On the top of the workbench 21, there is The horizontal fixing member 22 has a servo motor 23 held on the upper portion of the horizontal fixing member 22. A ball screw 24 is directly coupled to the rotating shaft of the servo motor 23. The lower end of the ball screw 24 is supported by another horizontal fixing member 25, and the ball screw 24 is rotatable. The upper moving member 26 includes a female screw 27 that is screwed to the ball screw 24 at the center portion, and support shafts 28a and 28b are provided downward from both end portions of the upper moving member 26. The support shafts 28a and 28b pass through one of the horizontal fixing members 25 to the through holes and are coupled to the lower moving member 29. The expander 30 described below is attached to the lower surface of the lower moving member 29 in parallel with the surface of the table 21. As a result, when the ball screw 24 is rotated by the servo motor 23, the upper moving member 26 and the lower moving member 29 are integrally moved up and down, and the expander 30 is simultaneously moved up and down. Here, the servo motor 23, the horizontal fixing members 22 and 25, and the upper and lower moving members 26 and 29 constitute an elevating mechanism for moving the expander 30 up and down.

Next, the expander 30 for breaking the resin layer will be described. For example, as shown in the perspective view of FIG. 4, the expander 30 is formed with a plurality of parallel strip-shaped expansion bars 32a to 32n side by side in a planar base 31. All of the ridges of each of the expanders form a plane. Further, the interval between the rods may be fixed and is an integral multiple of 2 or more of the interval between the planned lines, and is doubled in the present embodiment. In addition, the cross section of each of the expanded rods is not particularly limited as long as it has a protruding portion that can be pressed along the fracture line, but is preferably curved in an arc shape as described below. In FIG. 4, in order to clearly show the extension bars 32a to 32n, the extension bars 32a to 32n are shown as the upper surface, but in the case of use, the extension bars 32a to 32n are attached to the lower movement member 29 so as to be downward. .

In the present embodiment, the elastic support plate 40 is used when the resin layer of the composite substrate 10 is broken. As shown in the perspective view of Fig. 5, the elastic supporting plate 40 is an elastic jig made of rubber such as a rectangular flat plate, and has the same size as the composite substrate 10, and has a thickness of, for example, about several mm. The elastic supporting plate 40 has a plurality of circular protective holes 41 aligned in the longitudinal direction of the x-direction and the y-direction in a position corresponding to a region including the functional regions of the composite substrate 10. The distance between the protective holes 41 is exactly the same as the distance between the predetermined lines S _x1 to S _xm and S _y1 to _Syn of the composite substrate 10 to be fractured, and each of the protective holes 41 is located at a predetermined line. The center of each region surrounded by S _x1 ~S _xm and S _y1 ~S _yn is formed. The protective hole 41 is for not applying a force to the structural body 14 such as a lens of the composite substrate 10 at the time of fracture, and the through hole is larger than the structural body 14 here.

Next, a method of breaking the composite substrate 10 will be described. Fig. 6 is a view showing a breaking process, and Fig. 6(a) shows a part of the composite substrate 10. First, as shown in Fig. 6(b), the surface of the ceramic substrate 11 is used as the upper surface, and the scribing wheel 50 is moved by a scribing device (not shown) to perform scribing along the scribed line. Therefore, as shown in FIG. 2(a), the scribe lines S _x1 to S _xm in the x direction and the scribe lines S _y1 to S _{yn in the} y direction are formed.

Then, in the cracking step of the ceramic substrate 11, as shown in FIG. 6(c), the composite is first made. The substrate 10 is reversed. Then, using a breaking device (not shown), the split rod 51 is positioned directly above the already formed scribe line, and only the ceramic substrate 11 is broken by pressing the split rod 51 downward.

Thereby, only the ceramic substrate 11 is broken along the scribe lines S _x1 to S _xm and S _y1 to S _yn . Fig. 6(d) shows a portion of the composite substrate 10 after the respective scribe lines are broken along the x direction and the y direction. Further, since the scribe lines S _x1 to S _xm and S _y1 to S _yn are all broken, they are hereinafter referred to as break lines B _x1 to B _xm and B _y1 to B _yn .

Next, as shown in FIG. 7, the method of extending the fracture line formed on the ceramic substrate 11 to the resin layer and ending the division of the composite substrate 10 will be described. Fig. 7 is a view showing a fracture process of the resin layer, and Fig. 7(a) shows a part of the composite substrate. First, the elastic supporting plate 40 is placed on the table 21 of the breaking device 20, and the composite substrate 10 is placed on the upper surface of the elastic supporting plate 40. At this time, as shown in FIG. 7( a ), the resin layer 12 is placed in contact with the elastic support plate 40 . At this time, the composite substrate 10 is disposed such that the structure 14 of the functional region 13 of the composite substrate 10 is completely contained in the protective hole 41 of the elastic support plate 40. The cross-sectional view at this time is the one shown in FIG. 7(a), and all the structures 14 are positioned corresponding to the protective holes 41, and are not in direct contact with the elastic supporting plate 40.

The rupture line of the ceramic substrate 11, for example, S _{x1 is} the upper surface. Then, positioning is performed such that the lowermost ridge line of any one of the expanders 30, for example, 32a, is aligned with the broken line.

Then, the servo motor 23 is driven to lower the upper moving member 26 and the lower moving member 29 at the same time, and the expanding rod side of the expander 30 is gradually lowered while being kept parallel with respect to the table 21. Then, as shown in FIG. 7(b), the expanded rod 32a is pressed against the ceramic substrate 11 from directly above the break line _Bx1 . As described above, as shown in FIG. 7(c), the ceramic substrate 11 is pressed and deformed by the expansion bar 32a, and is sunk to deform the elastic support plate 40 into a V shape. At this time, as shown in FIG. 7(b), the composite substrate 10 is slightly sunk when the expansion rod 32a is pressed in. However, since the protective hole 41 is provided at a portion of the left and right corresponding to the functional region 13, the functional region may not be provided. The protruding structure 14 of 13 is directly in contact with the elastic supporting plate 40, and the resin layer 12 of the composite substrate 10 is broken. At this time, since the right and left sides of the ceramic substrate are uniformly deformed by the press-fitting of the expansion rod 32a, the crack can be extended downward along the fracture line. Here, the cross-sectional shape of the underside of the expansion rod is not particularly limited. However, in the case of, for example, a triangular shape, the necessity of accurately positioning the apex alignment break line is relatively high. Therefore, in order to deform the ceramic substrate 11 and the resin 12 in a balanced manner in this manner, the cross section below each of the expanded rods is formed in an arc shape. Thereby, the allowable range of the accuracy of positioning the ridge line of the expansion rod aligned with the broken line is relatively wide. Further, by sufficiently lowering the expansion rod, the crack in the resin progresses and the pushing force is applied to the right and left, thereby terminating the fracture. When the break is completed, the servo motor 23 is reversed and the expander 30 is raised.

At this time, a plurality of expansion rods are formed side by side in the expander 30, and the interval is twice as long as the scribe line, so that the expansion rod can simultaneously break the enamel resin 12 along the plurality of rupture lines every other broken line. .

Then, the table 21 is moved in the y-axis direction by an amount corresponding to the distance between the broken lines, and the expander 30 is similarly lowered, whereby the breakage of the resin layer can be ended for the other adjacent broken lines. Here, since the interval between the extension bars is twice the distance between the scribe lines, the fracture of all the x-axis directions of the composite substrate 10 can be terminated by breaking the table 21 once. Further, when the interval between the extension bars is three times the distance between the scribe lines, the fracture in the x-axis direction can be terminated by breaking the table 21 twice.

Then, the table 21 is rotated by 90°, and the expander 30 is similarly lowered for the y-axis breakage line to break the resin layer. Then, the table 21 is moved in the y-axis direction by an amount corresponding to the distance between the broken lines, and the expander 30 is similarly lowered. In this way, the entire surface is broken, and the resin is broken along each fracture line to break the square functional region, thereby forming a plurality of LED wafers.

Further, in this embodiment, in order to protect the functional region, the plurality of protective holes 41 of the elastic supporting plate 40 are formed as through holes, but the structural body 14 of the composite substrate 10 does not contact the elastic supporting plate as long as it is broken. 40 or not, but not as a through hole, but set to depth It is a hole in which the structure 14 does not contact the elastic support plate 40.

Further, in this embodiment, the ceramic substrate has been described as the substrate to be the base. However, the present invention is also applicable to various brittle material substrates such as a semiconductor substrate or a glass substrate.

In the embodiment, the tantalum resin is described as a resin applied to a ceramic substrate, but may be a layer of other various materials, for example, a layer such as a polarizing plate laminated on a glass substrate.

[Industrial availability]

When the brittle material substrate having the region to be protected is cut and cut, the present invention can be broken without damaging the region to be protected. Therefore, the present invention can be effectively applied to a fracture device for forming a substrate having a functional region.

11‧‧‧Ceramic substrate

12‧‧‧矽 resin

14‧‧‧Buildings

32a‧‧‧Extension stick

40‧‧‧Flexible support plate

41‧‧‧Protection hole

B _x1 ‧‧‧crack line

Claims (3)

An elastic support plate supporting the composite substrate when the composite substrate is divided, the composite substrate being coated with a resin on a brittle material substrate having a plurality of functional regions formed in a longitudinal direction and a lateral direction, and The brittle material substrate includes a strip-shaped fracture line formed in a lattice shape to break the functional region; and the elastic support plate is a flat plate including at least the elastic member having the same shape as the composite substrate, and is provided in the lattice shape a protective hole at each center position of the area surrounded by the broken line. A breaking method for dividing a composite substrate by coating a resin on a brittle material substrate having a functional region on one side, and forming a fracture line to break the functional region; and the above-mentioned breaking method is The elastic support plate of the protection hole is disposed at each central position of the region surrounded by the lattice-shaped crack line, and the composite substrate is disposed by positioning the functional regions of the composite substrate corresponding to the protection holes respectively; The cracked line is pressed down the expansion rod to break the resin layer. A breaking device for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region, and a fracture line is formed on the brittle material substrate to break the functional region; The device comprises: a work table; an elastic support plate, which is a flat plate including at least an elastic member having a width in a plane direction equivalent to the composite substrate, and includes a central position disposed at an area surrounded by the lattice-shaped crack line a protective hole, the elastic supporting plate is disposed on the working table, and the surface on which the broken line is formed is used as an upper surface to hold the composite substrate; An expander comprising an expansion rod; a moving mechanism for moving the table along the surface thereof; and a lifting mechanism for holding the composite substrate and the expansion rod in parallel with one side of the expander toward the elastic support plate The surface of the composite substrate is raised and lowered.