JP2001250798A - Method and apparatus for dividing material along scribing line - Google Patents

Method and apparatus for dividing material along scribing line

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Publication number
JP2001250798A
JP2001250798A JP2000060240A JP2000060240A JP2001250798A JP 2001250798 A JP2001250798 A JP 2001250798A JP 2000060240 A JP2000060240 A JP 2000060240A JP 2000060240 A JP2000060240 A JP 2000060240A JP 2001250798 A JP2001250798 A JP 2001250798A
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Prior art keywords
material
load
scribe line
surface
line
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JP2000060240A
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Japanese (ja)
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Masaaki Ikeda
真朗 池田
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Sony Corp
ソニー株式会社
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Priority to JP2000060240A priority Critical patent/JP2001250798A/en
Publication of JP2001250798A publication Critical patent/JP2001250798A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To reduce generation of cracking by concentrating a stress along a scribing line and dividing a material accurately along the scribing line. SOLUTION: In the method for dividing an objective material 1 along a scribing line 2 formed therein by applying a stress along the scribing line 2, the material is supported by a spring means 5A of a specified load at a part close to the scribing line on the side 1b opposite to the side 1a where the scribing line is formed and by a spring means 5B of a lower load at a part remote from the scribing line. The load is applied to a part remote from the scribing line on the side where the scribing line is formed.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は新規なケガキ線で材料を分割する方法及び装置に関する。 The present invention relates to relates to a method and apparatus for dividing the material in a new scribe line. 詳しくは、半導体結晶基板等の対象となる材料をケガキ線に沿って応力を集中させて、ケガキ線に沿って正確に材料を分割し、クラックなどの発生を減少させる技術に関する。 Specifically, the subject to material such as a semiconductor crystal substrate by concentrating the stress along the scribe line, divided exactly material along the scribe line, a technique for reducing the occurrence of cracks.

【0002】 [0002]

【従来の技術】分割しようとする材料、例えば、半導体結晶基板等の分割対象材料にスクライブライン、例えば、ダイヤモンドカッターによるケガキ線を形成し、該ケガキ線に沿って分割する方法がある。 BACKGROUND OF THE INVENTION Materials to be split, for example, scribe lines dividing-target material, such as a semiconductor crystal substrate, for example, to form a scribe line by a diamond cutter, there is a method of dividing along the scribe line.

【0003】例えば、図3に示すように、分割対象材料aにスクライブラインbを形成し、分割対象材料aのスクライブラインbを境にした一方の部分a′のスクライブラインbに近接した部分をクランパーcによって挟着支持し、スクライブラインbを境にした他方の部分a″ [0003] For example, as shown in FIG. 3, division target material a to form a scribe line b, the portion close to the scribe line b of the divided target material a scribe line b one portion as a boundary a of ' supported clamping by the clamper c, the other portion a which is the boundary of the scribe line b "
にスクライブラインbが形成された面の側から荷重dをかけて、分割対象材料aをスクライブラインbに沿って分割する方法や、図4に示すように、スクライブラインbを形成した分割対象材料aのスクライブラインbを形成した面と反対側の面eを粘着シートfに貼り付け、分割対象材料aのスクライブラインbを境にした2つの部分a′及びa″をそれぞれ反対の方向、すなわち、矢印g′、g″方向に延伸し、分割対象材料aをスクライブラインbに沿って分割する方法がある。 Over from the side of the surface where scribe line b is formed a load d to the divided target material a and how to split along the scribe line b, as shown in FIG. 4, a division target material to form a scribe line b paste a scribe line b formed was surface with a surface e of the opposite side of the adhesive sheet f, divided target material two that the boundary of the scribe line b of a portion a 'and a "to opposite directions, i.e. , arrow g ', g "and extend in a direction, the dividing-target material a is a method of dividing along the scribe line b.

【0004】 [0004]

【発明が解決しようとする課題】ところで、上記した従来の分割方法にあっては、それぞれにおいてかけた荷重による応力のスクライブラインbに沿った部分への集中が弱く、応力が分割対象材料aの面内で分散し、分割対象材料aに著しい負担をかけるので、クラックhやズレが発生し、また、半導体の特性上必要となる良好なヘキ開断面を得ることができず、そのため、歩留まりが悪く、また、良好な品質も得られない等の問題があった。 Meanwhile [0007], in the conventional dividing method described above, weak concentration on the scribe line b in along a portion of the stress due to the load by multiplying the respective stresses of the dividing-target material a dispersed in the plane, so place a significant burden on division target material a, cracks h or misalignment occurs, also, it is not possible to obtain a good cleaving sectional needed on characteristics of a semiconductor, therefore, yield poor, also has a problem such that not be obtained good quality.

【0005】そこで、本発明は、ケガキ線に沿って応力を集中させて、ケガキ線に沿って正確に材料を分割し、 [0005] Therefore, the present invention is to concentrate the stress along the scribe line, divided exactly material along the scribe line,
クラックなどの発生を減少させることを課題とする。 It is an object to reduce the occurrence of cracks.

【0006】 [0006]

【課題を解決するための手段】本発明ケガキ線で材料を分割する方法は、上記した課題を解決するために、材料のケガキ線を形成した面と反対側の面のケガキ線に近い部分を所定の荷重の弾発手段で、また、ケガキ線に遠い部分を上記弾発手段より低荷重の弾発手段で支持し、ケガキ線を形成した面のケガキ線から離間した部分に荷重をかけるようにしたものである。 How to divide the material in the present invention the marking line Means for Solving the Problems In order to solve the problems described above, the portion near the scribe line on the opposite side of the surface as formed by the surface of the scribe line of the material by the resilient means predetermined load, also the distant parts scribed line is supported by the resilient means of the low load from the resilient means, so as to apply a load to the portion separated from the scribe line of the surface forming the marking line it is obtained by the.

【0007】従って、本発明ケガキ線で材料を分割する方法にあっては、材料に与えられた荷重による応力は、 Accordingly, in the method of dividing the material in the present invention the marking line, the stress due to the load given to the material,
弾発手段の作用により、ケガキ線に近い部分で高く、ケガキ線から遠い部分で低くなり、これにより応力がケガキ線に沿った部分に集中し、応力の分散によるクラックやズレの発生が防止され、また、良好なヘキ開断面が得られ、歩留まり及び品質が向上する。 By the action of resilient means, higher in a portion near the scribe line is lower in the portion far from the scribe lines, thereby the stress concentrates on the portion along the scribe line, the occurrence of cracks or displacement due to the dispersion of stress is prevented In addition, good cleaving section is obtained, yield and quality is improved.

【0008】また、本発明ケガキ線で材料を分割する装置は、ケガキ線を形成された材料のケガキ線を境にした一方の部分を固定支持する固定部材と、上記材料のケガキ線を境にして他方の部分のケガキ線が形成された面と反対側の面を支持する支持部材と、上記支持部材の材料載置面と反対側の面の上記固定部材に近い部分を支持する所定の荷重の弾発手段と、上記支持部材の材料載置面と反対側の面の上記固定部材に遠い部分を支持する上記弾発手段より低荷重の弾発手段と、上記材料の上記支持部材に支持された側の部分に支持部材の方に向かって荷重をかける荷重手段とを備えたものである。 Further, an apparatus for dividing the material in the present invention the marking line is to a fixing member for fixing and supporting one part that the boundary of the marking line material formed a scribe line, the scribe line of the material boundary a support member for supporting the other surface opposite to the scribe lines formed surface portions Te, predetermined load to support the portion near to the fixing member opposite to the surface the material placing surface of the support member and resilient means, the resilient means of the low load than the resilient means for supporting the portion far to the fixing member opposite to the surface the material placing surface of the support member, supported by the supporting member of the above materials has been in the portion of the side toward the support member is obtained by a load means for applying a load.

【0009】従って、本発明ケガキ線で材料を分割する装置にあっては、荷重手段により与えられる荷重による応力は、弾発手段の作用により、ケガキ線に近い部分で高く、ケガキ線から遠い部分で低くなり、これにより応力がケガキ線に沿った部分に集中し、応力の分散によるクラックやズレの発生が防止され、また、良好なヘキ開断面が得られ、歩留まり及び品質が向上する。 Accordingly, in the apparatus for dividing the material in the present invention the marking line, the stress due to the load provided by the load means, under the action of resilient means, higher in a portion near the scribe line, a portion far from the scribe line in lowered, thereby the stress concentrates on the portion along the scribe line, is prevented occurrence of cracking or displacement due to the dispersion of stress, also good cleaving section is obtained, yield and quality is improved.

【0010】別の本発明ケガキ線で材料を分割する装置は、材料のケガキ線が形成された面と反対側の面のケガキ線に近い部分を支持する所定の荷重の弾発手段と、上記材料のケガキ線が形成された面と反対側の面のケガキ線に遠い部分を支持する上記弾発手段より低荷重の弾発手段と、上記材料のケガキ線が形成された側の面にほぼ上記弾発手段の方向へ荷重をかける荷重手段とを備えたものである。 [0010] Another apparatus for dividing the material in the present invention scribe line includes a resilient means of a predetermined load supporting a portion close to the scribe line of the opposite surface to the surface on which the scribe line of the material is formed, the and low load of the resilient means from said resilient means for supporting the far portion scribed line on the opposite side surface to the surface on which the scribe lines are formed of a material, substantially on the side of the surface where scribe lines are formed of the material is obtained by a load means for applying a load in the direction of the resilient means.

【0011】従って、この別の本発明ケガキ線で材料を分割する装置にあっても、荷重手段により与えられる荷重による応力は、弾発手段の作用により、ケガキ線に近い部分で高く、ケガキ線から遠い部分で低くなり、これにより応力がケガキ線に沿った部分に集中し、応力の分散によるクラックやズレの発生が防止され、また、良好なヘキ開断面が得られ、歩留まり及び品質が向上する。 Accordingly, even in an apparatus for dividing the material in this alternative of the invention the marking line, the stress due to the load provided by the load means, under the action of resilient means, higher in a portion near the scribe line, the marking line low in the portion far from, thereby stress is concentrated on the portion along the scribe line, is prevented occurrence of cracking or displacement due to the dispersion of stress, also good cleaving section is obtained, improving the yield and quality to.

【0012】 [0012]

【発明の実施の形態】以下に、本発明ケガキ線で材料を分割する方法及び装置の実施の形態を添付図面を参照して説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, an embodiment of the method and apparatus for dividing the material in the present invention the marking line with reference to the accompanying drawings.

【0013】図1に示すものは、例えば、半導体結晶基板等の分割対象材料1の表面1aに例えば、ダイヤモンドカッターによるケガキ線であるスクライブライン2を形成し、支持部材であるクランパー3のクランプ部3a [0013] as shown in FIG. 1, for example, for example, on the surface 1a of the dividing-target material 1 such as a semiconductor crystal substrate, forming a scribe line 2 is scribed line with a diamond cutter, the clamping portion of the clamper 3 is a support member 3a
によって上記分割対象材料1のスクライブライン2を境にした一方の部分1′のスクライブライン2に近接した部分を挟着保持し、スクライブライン2を境にした他方の部分1″の裏面1bを支持板4の上に載置し、該支持板4のスクライブライン2に近い側を所定の荷重のスプリング(弾発手段)5Aで支持し、支持板4のスクライブライン2から遠い部分を上記スプリング5Aより低荷重のスプリング(弾発手段)5Bで支持する。 Supporting the disk portion close to the live line 2 held clamping, the rear surface 1b of the other portion 1 'in which the scribe line 2 the border of the dividing-target material 1 of the scribe line 2 one portion 1 which as a boundary' by is placed on the plate 4, the side closer to the scribe line 2 of the support plate 4 is supported at a predetermined load of the spring (resilient means) 5A, the support plate 4 of the scribe line 2 from a far portion of the spring 5A It is supported by a lower load of the spring (resilient means) 5B.

【0014】その状態で、分割対象材料1の他方の部分1″に上方から、すなわち、スクライブライン2を形成した面1aの側から図示しない荷重手段により図中矢印の方向に荷重を加える。 [0014] In this state, from the upper to the other part 1 "of the division target material 1, i.e., a load is applied in the direction of the arrow in the drawing by the load means (not shown) from the side surface 1a forming the scribe line 2.

【0015】これによって、上記荷重による応力が分割対象材料1内に生じる。 [0015] Thus, stress due to the load occurs in the dividing-target material 1. すなわち、上記荷重を反対側から支えるスプリング5A、5Bの作用により、より低荷重のスプリング5Bによって支えられているスクライブライン2から遠い部分では低応力が、また、より高荷重のスプリング5Aで支えられているスクライブライン2 That is, the spring 5A to support the load from the opposite side, by the action of 5B, a portion away from the scribe line 2 is supported by a spring 5B of lower load low stress, also supported by the higher-load spring 5A in which the scribe lines 2
に近い部分では高応力が生じ、この結果スクライブライン2に沿って効果的に応力が集中し、クラックやズレが生ずること無しにスクライブライン2に沿ってきれいに、すなわち、良好なヘキ開断面をもって分割される。 High stresses occur in the portion close to this result effectively stress is concentrated along the scribe line 2, clean along the scribe line 2 without cracks or misalignment occurs, i.e., divided with good cleaving section It is.
そのため、歩留まりや品質が向上する。 Therefore, to improve the yield and quality.

【0016】従って、例えば、サファイヤ基板のように、分割のために高荷重を必要とし、スクライブ分割、 [0016] Thus, for example, as a sapphire substrate, and it requires high load for the split, scribing division,
すなわち、ケガキ線による分割が困難とされている分割対象材料に対してもスクライブ分割が可能となる。 In other words, it is possible to scribe divided against division target material divided by the scribe line is difficult.

【0017】図2に示したものは、例えば、半導体結晶基板等の分割対象材料1の表面1aに例えば、ダイヤモンドカッターによるケガキ線であるスクライブライン2 [0017] those shown in FIG. 2, for example, for example, on the surface 1a of the dividing-target material 1 such as a semiconductor crystal substrate, the scribe line 2 is scribed line with a diamond cutter
を形成し、該分割対象材料1の裏面1bに粘着シート6 Forming a pressure-sensitive adhesive sheet 6 on the rear surface 1b of the split target material 1
を貼着する。 The sticking.

【0018】そして、粘着シート6が貼着された分割対象材料1の裏面1bをスプリング5、5、・・・によって支持する。 [0018] Then, supports the division target material 1 in the rear surface 1b of the adhesive sheet 6 is adhered spring 5,5, by .... すなわち、スクライブライン2を境にした2つの部分1′、1″、それぞれの部分の裏面1bのスクライブライン2に近い部分を所定の荷重のスプリング5A、5Aで支持し、スクライブライン2から遠い部分を上記スプリング5A、5Aより低荷重のスプリング5 That is, the scribe line 2 two parts 1 as a boundary ', 1 ", spring 5A of a predetermined load a portion close to the scribe line 2 of the back surface 1b of each portion, supported by 5A, portions far from the scribe line 2 the spring 5A, the spring of lower load than 5A 5
B、5Bで支持する。 B, is supported by 5B.

【0019】そして、分割対象材料1の表面、すなわち、スクライブライン2が形成された面1aの側から図中矢印で示す方向に、すなわち、裏面1b方向に、且つ、2つの部分1′、1″をスクライブライン2を境に離間させる方向に図示しない荷重手段によって荷重をかける。 [0019] Then, the surface of the division target material 1, i.e., from the side of the surface 1a of the scribe line 2 is formed in the direction indicated by the arrow, i.e., the back surface 1b direction and two parts 1 ', 1 "applying a load by a load means (not shown) in the direction away the boundary of the scribe line 2.

【0020】これによって、上記荷重による応力が分割対象材料1内に生じる。 [0020] Thus, stress due to the load occurs in the dividing-target material 1. すなわち、上記荷重を反対側から支えるスプリング5A、5A、5B、5Bの作用により、より低荷重のスプリング5B、5Bによって支えられているスクライブライン2から遠い部分では低応力が、また、より高荷重のスプリング5A、5Aで支えられているスクライブライン2に近い部分では高応力が生じ、この結果スクライブライン2に沿って効果的に応力が集中し、クラックやズレが生ずること無しにスクライブライン2に沿ってきれいに、すなわち、良好なヘキ開断面をもって分割される。 That is, the spring 5A to support the load from the opposite side, 5A, 5B, by the action of 5B, a lower load of the spring 5B, the portion away from the scribe line 2 is supported by 5B is a low stress, also, higher load spring 5A, high stresses occur in the portion close to the scribe line 2 is supported by 5A, this results scribe line 2 effectively stress is concentrated along the, without cracks or deviation occurs in the scribe line 2 clean along, i.e., it is divided with good cleaving section. そのため、歩留まりや品質が向上する。 Therefore, to improve the yield and quality.

【0021】なお、上記した実施の形態において、弾発手段としてコイル状のスプリングを示したが、弾発手段はコイルスプリングに限定されるものではない。 [0021] In the embodiments described above, although the coil spring as the resilient means, the resilient means is not limited to the coil spring. また、 Also,
弾発手段として、より高荷重スプリング5Aとより低荷重スプリング5Bの2種類のスプリングを示したが、3 As the resilient means, it showed two spring higher load spring 5A and a lower load spring 5B, 3
種類以上のスプリングを使用しても構わないし、また、 It may be used or more types of spring, also,
無段階で各部分の荷重が変化するものを使用しても構わない。 May be used as the load of each portion changes steplessly.

【0022】また、本発明分割方法及び装置はサファイヤ基板のようなスクライブ分割が困難な材料の分割に使用して好適である旨を述べたが、本発明方法や装置はスクライブ分割が比較的容易な材料、例えば、ガリウム砒素(GaAs)基板等の分割に用いても有効である。 Further, the present invention divides the method and apparatus has been stated that it is preferable to use the divided scribe split difficult materials such as sapphire substrate, the present invention method and apparatus is relatively easy scribing division materials, for example, it is effective also be used to split such as gallium arsenide (GaAs) substrate.

【0023】その他、上記した実施の形態において示した各部の形状乃至構造は、何れも本発明を実施するに際して行う具体化のほんの一例を示したものに過ぎず、これらによって、本発明の技術的範囲が限定的に解釈されるようなことがあってはならないものである。 [0023] Other, shape or structure of the respective units shown in the above-described embodiments are all only show just one example of embodiment for performing practicing the present invention, these technical of the present invention range in which it shall not be possible as restrictive.

【0024】 [0024]

【発明の効果】以上に記載したところから明らかなように、本発明ケガキ線で材料を分割する方法は、対象となる材料に形成したケガキ線に沿って応力を加え該ケガキ線に沿って材料を分割する材料分割方法であって、材料のケガキ線を形成した面と反対側の面のケガキ線に近い部分を所定の荷重の弾発手段で、また、ケガキ線に遠い部分を上記弾発手段より低荷重の弾発手段で支持し、ケガキ線を形成した面のケガキ線から離間した部分に荷重をかけることを特徴とする。 As it is apparent from the described above, according to the present invention, a method of dividing the material in the present invention scribe lines along the scribe lines stressed along a scribe line formed in the material of interest materials a material dividing method for dividing the portion near the scribe line on the opposite side of the surface as formed by the surface of the scribe line of the material by the resilient means predetermined load, also the resilient distant part marking line It is supported by a low load of the resilient means from the means and applying a load to the portion separated from the scribe line of the surface forming the marking line.

【0025】従って、本発明ケガキ線で材料を分割する方法にあっては、材料に与えられた荷重による応力は、 [0025] Therefore, in the method of dividing the material in the present invention the marking line, the stress due to the load given to the material,
弾発手段の作用により、ケガキ線に近い部分で高く、ケガキ線から遠い部分で低くなり、これにより応力がケガキ線に沿った部分に集中し、応力の分散によるクラックやズレの発生が防止され、また、良好なヘキ開断面が得られ、歩留まり及び品質が向上する。 By the action of resilient means, higher in a portion near the scribe line is lower in the portion far from the scribe lines, thereby the stress concentrates on the portion along the scribe line, the occurrence of cracks or displacement due to the dispersion of stress is prevented In addition, good cleaving section is obtained, yield and quality is improved.

【0026】請求項2に記載した発明にあっては、ケガキ線を境にして一方の部分を固定し、他方の部分を上記弾発手段で支持すると共に荷重をかけるようにしたので、簡単な構成で、ケガキ線に沿った部分に応力を集中させることができる。 [0026] In the invention according to claim 2, the one part is fixed to the boundary of the marking line, since the other part was set to apply a load while supporting by the resilient means, a simple composed, it is possible to concentrate the stress on the portion along the scribe line.

【0027】請求項3に記載した発明にあっては、ケガキ線を境にして両側の部分をそれぞれ上記弾発手段で支持すると共に荷重をかけるようにしたので、簡単な構成で、ケガキ線に沿った部分に応力を集中させることができる。 [0027] In the invention described in claim 3, since each on both sides of the portion in the boundary marking line was set to apply a load while supporting by the resilient means, with a simple configuration, the scribe line stress can be concentrated on along portions.

【0028】本発明ケガキ線で材料を分割する装置は、 The device for dividing the material in the present invention scribe line,
ケガキ線を形成された材料のケガキ線を境にした一方の部分を固定支持する固定部材と、上記材料のケガキ線を境にして他方の部分のケガキ線が形成された面と反対側の面を支持する支持部材と、上記支持部材の材料載置面と反対側の面の上記固定部材に近い部分を支持する所定の荷重の弾発手段と、上記支持部材の材料載置面と反対側の面の上記固定部材に遠い部分を支持する上記弾発手段より低荷重の弾発手段と、上記材料の上記支持部材に支持された側の部分に支持部材の方に向かって荷重をかける荷重手段とを備えたことを特徴とする。 A fixing member for fixing and supporting one part that the boundary of the marking line material formed a scribe line, the surface opposite to the surface on which the scribe lines are formed in the other portion as a boundary scribe line of the material a support member for supporting said material mounting surface of the support member and the resilient means predetermined load supporting a portion close to the fixing member opposite to the surface, the material placing surface of the support member opposite load applied and the resilient means of the low load from the resilient means, the load toward the support member to the supporting member supported on the side portions of the material supporting the portion far to the fixing member surface of characterized by comprising a means.

【0029】従って、本発明ケガキ線で材料を分割する装置にあっては、荷重手段により与えられる荷重による応力は、弾発手段の作用により、ケガキ線に近い部分で高く、ケガキ線から遠い部分で低くなり、これにより応力がケガキ線に沿った部分に集中し、応力の分散によるクラックやズレの発生が防止され、また、良好なヘキ開断面が得られ、歩留まり及び品質が向上する。 [0029] Therefore, in the apparatus for dividing the material in the present invention the marking line, the stress due to the load provided by the load means, under the action of resilient means, higher in a portion near the scribe line, a portion far from the scribe line in lowered, thereby the stress concentrates on the portion along the scribe line, is prevented occurrence of cracking or displacement due to the dispersion of stress, also good cleaving section is obtained, yield and quality is improved.

【0030】また、別の本発明ケガキ線で材料を分割する装置は、材料のケガキ線が形成された面と反対側の面のケガキ線に近い部分を支持する所定の荷重の弾発手段と、上記材料のケガキ線が形成された面と反対側の面のケガキ線に遠い部分を支持する上記弾発手段より低荷重の弾発手段と、上記材料のケガキ線が形成された側の面にほぼ上記弾発手段の方向へ荷重をかける荷重手段とを備えたことを特徴とする。 Further, an apparatus for dividing the material in another of the present invention scribe line has a predetermined elastic means of the load for supporting the portion close to the scribe line of the opposite surface to the surface on which the scribe lines are formed of the material , a resilient means of the low load than the resilient means for supporting the far portion scribed line on the opposite side surface to the surface on which the scribe lines are formed of the above materials, the surface on the side where scribe lines are formed of the material characterized by comprising a load means for applying a load to almost direction of the resilient means.

【0031】従って、この別の本発明ケガキ線で材料を分割する装置にあっても、荷重手段により与えられる荷重による応力は、弾発手段の作用により、ケガキ線に近い部分で高く、ケガキ線から遠い部分で低くなり、これにより応力がケガキ線に沿った部分に集中し、応力の分散によるクラックやズレの発生が防止され、また、良好なヘキ開断面が得られ、歩留まり及び品質が向上する。 [0031] Thus, even in an apparatus for dividing the material in this alternative of the invention the marking line, the stress due to the load provided by the load means, under the action of resilient means, higher in a portion near the scribe line, the marking line low in the portion far from, thereby stress is concentrated on the portion along the scribe line, is prevented occurrence of cracking or displacement due to the dispersion of stress, also good cleaving section is obtained, improving the yield and quality to.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明ケガキ線で材料を分割する方法及び装置の実施の形態を示す概略側面図である。 1 is a schematic side view showing an embodiment of a method and apparatus for dividing the material in the present invention the marking line.

【図2】本発明ケガキ線で材料を分割する方法及び装置の別の実施の形態を示す概略側面図である。 It is a schematic side view of another embodiment of a method and apparatus for dividing the material in the present invention; FIG scribe line.

【図3】従来のケガキ線で材料を分割する方法を示す概略側面図である。 Figure 3 is a schematic side view showing a method of dividing the material in a conventional scribe lines.

【図4】従来のケガキ線で材料を分割する別の方法を示す概略側面図である。 4 is a schematic side view illustrating another method of dividing the material in a conventional scribe lines.

【符号の説明】 DESCRIPTION OF SYMBOLS

1…分割対象材料(材料)、1a…ケガキ線を形成した面、1b…ケガキ線をを形成した面と反対側の面、1′ 1 ... divided target material (material), 1a ... surface forming the scribe line, 1b ... opposite surface and forming the surface of the scribe line, 1 '
…ケガキ線を境にした一方の部分、1″…ケガキ線を境にした他方の部分、2…スクライブライン(ケガキ線)、3…クランパー(固定手段)、4…支持板(支持手段)、5A…より高荷重のスプリング(高荷重の弾発手段)5B…より低荷重のスプリング(低荷重の弾発手段) ... one portion as a boundary marking line, 1 "... the other portion as a boundary marking line, 2 ... scribe lines (scribe lines), 3 ... clamper (fixing means), 4 ... supporting plate (supporting means), 5A ... than the high-load spring (high load of the resilient means) 5B ... than the low load of the spring (resilient means of low load)

Claims (5)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 対象となる材料に形成したケガキ線に沿って応力を加え該ケガキ線に沿って材料を分割する材料分割方法であって、 材料のケガキ線を形成した面と反対側の面のケガキ線に近い部分を所定の荷重の弾発手段で、また、ケガキ線に遠い部分を上記弾発手段より低荷重の弾発手段で支持し、 ケガキ線を形成した面のケガキ線から離間した部分に荷重をかけることを特徴とするケガキ線で材料を分割する方法。 1. A material dividing method for dividing the material along the scribe line stressed along a scribe line formed on the target material, the surface opposite to the formed surface of the scribe line of the material at a predetermined near portion of the scribe line of the load of the resilient means, spaced distant part scribe line is supported by the resilient means of the low load from the resilient means, the scribe line of the surface forming the marking line how to divide the material in scribe line, characterized in that applied to the portion of the load.
  2. 【請求項2】 ケガキ線を境にして一方の部分を固定し、 他方の部分を上記弾発手段で支持すると共に荷重をかけることを特徴とする請求項1に記載のケガキ線で材料を分割する方法。 Wherein the one part is fixed to the boundary of the marking line, divides the material and the other part scribe line according to claim 1, characterized in that applying a load while supporting by the resilient means how to.
  3. 【請求項3】 ケガキ線を境にして両側の部分をそれぞれ上記弾発手段で支持すると共に荷重をかけることを特徴とする請求項1に記載のケガキ線で材料を分割する方法。 3. A method of dividing the material in scribe line according to claim 1, characterized in that applying a load with respective opposite sides of the portion in the boundary marking line is supported by the resilient means.
  4. 【請求項4】 ケガキ線を形成された材料のケガキ線を境にした一方の部分を固定支持する固定部材と、 上記材料のケガキ線を境にして他方の部分のケガキ線が形成された面と反対側の面を支持する支持部材と、 上記支持部材の材料載置面と反対側の面の上記固定部材に近い部分を支持する所定の荷重の弾発手段と、 上記支持部材の材料載置面と反対側の面の上記固定部材に遠い部分を支持する前記弾発手段より低荷重の弾発手段と、 上記材料の上記支持部材に支持された側の部分に支持部材の方に向かって荷重をかける荷重手段とを備えたことを特徴とするケガキ線で材料を分割する装置。 4. A fixing member of the one part that the boundary of the marking line material formed a scribe line to a fixed support, the surface scribe lines are formed in the other portion as a boundary scribe line of the material and a support member for supporting the opposite side surface, and resilient means having a predetermined load supporting a portion close to the fixing member opposite to the surface the material placing surface of the support member, placing the material of the support member said resilient low load of the resilient means from the means for supporting the portion far to the fixing member opposite to the surface with the surface, the supported side portions to the support member of the material toward the support member apparatus for dividing the material in scribe line, characterized in that a load means for applying a load Te.
  5. 【請求項5】 材料のケガキ線が形成された面と反対側の面のケガキ線に近い部分を支持する所定の荷重の弾発手段と、 上記材料のケガキ線が形成された面と反対側の面のケガキ線に遠い部分を支持する上記弾発手段より低荷重の弾発手段と、上記材料のケガキ線が形成された側の面にほぼ上記弾発手段の方向へ荷重をか ける荷重手段とを備えたことを特徴とするケガキ線で材料を分割する装置。 And wherein the surface of the marking line is formed of the material and the resilient means predetermined load supporting a portion close to the scribe line of the opposite surface, the surface on which the scribe lines are formed in the material opposite and resilient means low load than the resilient means for supporting the far part scribe line of the plane, the load takes either a load to almost direction of the resilient means on the surface on the side where scribe lines are formed of the material apparatus for dividing the material in scribe line, characterized in that a means.
JP2000060240A 2000-03-06 2000-03-06 Method and apparatus for dividing material along scribing line Pending JP2001250798A (en)

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