TWI619589B - Fracture method and device for brittle material substrate - Google Patents

Abstract

The invention provides a breaking method and a breaking device capable of perfectly breaking a substrate having a convex portion on a surface by a breaking rod.

The brittle material substrate breaking method of the present invention is a brittle material having a convex portion 1 formed on the surface of a resin layer W2 formed on one surface of the substrate body W1 and a score line S formed on the other surface of the substrate body W1. The substrate W is pressed from the surface of the resin layer W2 with the breaking rod 9 to bend the brittle material substrate W and break along the scribe line S. The linear ridge portion 9a at the front end of the breaking rod 9 is opposite to On the part of the convex portion 1 of the brittle material substrate W to be broken, a concave portion 9b in which the convex portion 1 is inserted is formed, and the entire pressing surface of the brittle material substrate W is applied equally when the breaking rod 9 is pressed. It is broken by pressing the load.

Description

Fracture method and device for brittle material substrate

The present invention relates to a substrate in which a resin layer such as silicon is formed on one side of a substrate body made of a brittle material such as glass or ceramic, and the substrate is fractured along a scribe line (groove) formed in the substrate body. Breaking method and breaking device. In particular, the present invention relates to a method for breaking a brittle material substrate having a convex portion formed on the surface of a resin layer and a scribe line formed on the back surface of the substrate body in a previous step, and a device for breaking the same.

Conventionally, for example, Patent Documents 1 to 3 disclose that on the surface of a substrate, a scoring means such as a cutter wheel (also referred to as a scribing wheel), a fixed blade, or a laser beam is used to form X orthogonal to each other. Scribe lines in the Y direction and Y direction, and then apply external force from the side opposite to the scribe line to bend or bend the substrate, etc., to break the substrate along the scribe line and take out a unit such as a wafer. Product methods.

In addition, various methods are known for flexing a substrate along a score line and breaking it.

FIG. 6 is a diagram showing an example of a breaking method generally used. As shown in FIG. 6 (a), a substrate W 'having a resin layer W2 formed on the surface of the substrate body W1 is attached to an elastic adhesive substrate supported by a dicing ring (not shown). Dicing tape 16. Below the substrate body W1, a plurality of mutually orthogonal scribe lines S are formed in the previous step, and the cutting tape 16 to which the substrate W 'is attached is placed via a cushion sheet 18 Horizontal On platform 17. At this time, the surface of the scribe line S on which the substrate W 'is formed is set to the lower side. Then, as shown in FIG. 6 (b), the breaking rod 19 is lowered from above the substrate W 'to deflect the substrate W', thereby cracking (cracking) the scribe line S of the substrate body W1 toward The thickness direction progresses, and the resin body W2 is also fractured at the same time as the substrate body W1 is fractured.

FIG. 7 is a diagram showing another method of breaking. In this method, instead of the buffer sheet 18 described above, a pair of receiving blades 20, 20 are arranged to receive the substrate W 'with the scribe line S interposed therebetween. Then, the substrate W 'is pressed against the substrate W' from the surface of the substrate W 'attached to the dicing tape 16 and the surface on which the scribe line S is provided, so that the substrate W' and the above-mentioned Similarly, it bends along the score line S and breaks.

Patent Document 1: Japanese Patent Application Publication No. 2013-071335

Patent Document 2: Japanese Patent Application Publication No. 2012-131216

Patent Document 3: Japanese Patent Application Laid-Open No. 2011-212963

In many cases, the substrate W 'for cracking is a flat surface that forms a surface for pressing the cracking lever. Therefore, as shown in FIG. 8, the straight lower end ridgeline portion 19a of the breaking lever 19 can be pressed against the substrate W 'with a uniform pressing load throughout the entire area.

However, according to the substrate, for example, as shown in FIG. 1 (a), a convex portion 1 is formed on the surface of the resin layer W2 along the peripheral portion of the substrate W. In a region surrounded by the convex portion 1, it is formed on the substrate body W1. Below it, there is a case where the scribe line S in the XY direction of the unit product is distinguished.

In such a situation, once the front end ridge portion 19a is formed linearly over the entire length of the broken rod 19 as shown in FIG. 8 to press the substrate W of FIG. 1, the pressing force near the convex portion 1 will be lower than others. The part is strong and the load applied to the substrate W is uneven. So there are the following Problems: The cracks of the scribe line S of the substrate body W1 progress obliquely, chips (defects) are generated, and irregular cracks are generated inside the resin layer W2. Product yield deteriorated.

In addition, there is also a problem in that a portion of the front end ridgeline portion 19a that becomes the tip of the blade of the rupture lever 19 receives a larger load than the other portion because it is in contact with the convex portion 1 of the resin layer W2. Under ground use, local abrasion will occur, making it unsuitable for cracking as a substrate with a flat surface.

Therefore, an object of the present invention is to provide a cracking method and a cracking device which can solve the above-mentioned problems, and which can perfectly break a brittle material substrate having a convex portion on the surface of the resin layer with a cracking rod.

In order to solve the above-mentioned problems, the following technical means are proposed in the present invention. That is, the method for breaking a brittle material substrate according to the present invention is a brittle material substrate having a convex portion formed on a surface of a resin layer formed on one surface of the substrate body and a score line formed on the other surface of the substrate body. Pressing the breaking bar from the surface of the resin layer, thereby flexing the brittle material substrate and breaking along the scribe line, is characterized in that a linear ridge portion at the front end of the breaking bar is at With respect to the part of the convex part of the brittle material substrate for breaking, a recess for the convex part to be embedded is formed, and the entire area of the breaking rod pressing surface of the brittle material substrate is equally pressed when the breaking lever is pressed. Load breaks.

In addition, the breaking device for a brittle material substrate of the present invention, which is completed from another viewpoint, has a convex portion formed on a surface of a resin layer formed on one surface of the substrate body, and a score is formed on the other surface of the substrate body. The brittle material substrate of the wire is pressed by a breaking rod from the surface of the resin layer, thereby flexing the brittle material substrate and breaking along the score line, which is characterized by: A linear ridge portion at the front end of the breaking rod forms a concave portion into which the convex portion is inserted with respect to a portion of the convex portion of the brittle material substrate for breaking.

In the present invention, since the ridge line portion at the front end of the breaking rod forms a recess that can be embedded in the convex portion of the brittle material substrate for breaking, and presses the breaking rod pressing surface of the brittle material substrate when the breaking rod is pressed Splitting is performed by applying an equal pressing load all over the world. Therefore, it is possible to suppress the occurrence of irregular cracks due to uneven load and the like at the time of cracking, and the generation of debris on the fracture surface. The brittle material substrate is cracked more perfectly along the scribe line.

In the present invention, the depth of the concave portion of the breaking rod may be formed to be equal to the height of the convex portion of the brittle material substrate, and the width of the concave portion is formed in a size in which the convex portion can be fully embedded.

Thereby, the breaking rod can be pressed against the convex portion of the brittle material substrate and the flat surface portion with an equal load, and the concave portion of the breaking rod can be prevented from touching the edge of the convex portion when it is embedded in the convex portion of the brittle material substrate. A bad condition like breakage occurs.

A‧‧‧ Splitting device

S‧‧‧ scribed

W‧‧‧ Brittle material substrate

W1‧‧‧ substrate body

W2‧‧‧Resin layer

1‧‧‧ convex

2‧‧‧ platform

9‧‧‧ split

9a‧‧‧Edge Line

9b‧‧‧ recess

11‧‧‧ cutting strip

12‧‧‧ buffer sheet

FIG. 1 is a diagram showing an example of a substrate broken by the breaking method and the breaking device of the present invention.

Fig. 2 is a perspective view showing an example of a breaking device of the present invention.

FIG. 3 is a diagram showing a breaking step performed by the breaking device of FIG. 2.

FIG. 4 is a perspective view showing a state where a substrate is attached to a dicing tape.

FIG. 5 is a cross-sectional view showing a breaking step performed by the breaking device of FIG. 2.

FIG. 6 is an explanatory diagram showing an example of a conventional general breaking method.

FIG. 7 is an explanatory diagram showing another example of the conventional breaking method.

FIG. 8 is a cross-sectional view for explaining a form of a breaking rod in a conventional breaking method.

In the following, embodiments of the substrate breaking method and the substrate breaking device of the present invention will be described with reference to FIGS. 1 to 5. FIG. 1 is a diagram showing an example of a form of a brittle material substrate W that is broken by the present invention. The brittle material substrate W is composed of a substrate body W1 made of a brittle material such as glass or ceramic, and a resin layer W2 of silicon or the like formed on the substrate body W1. On the surface of the resin layer W2, as shown in a perspective view of FIG. 1 (a), a cross-sectional view of FIG. 1 (b), and a plan view of FIG. 1 (c), a quadrangular loop is drawn along the upper peripheral portion. The convex portion 1 is formed in a manner, and in the area surrounded by the convex portion 1, a scribe line S in the XY direction that distinguishes the unit product is formed in the previous step under the substrate body W1. Hereinafter, this brittle material substrate W is simply referred to as "substrate W".

Fig. 2 is a view showing an example of a breaking device A according to the present invention.

The breaking device A includes a stage 2 on which a substrate W is placed and held. The platform 2 is movable in the Y direction along a horizontal guide rail 3 and is driven by a screw shaft 4 which is rotated by a motor M. Further, the platform 2 is capable of rotating in a horizontal plane by a rotation driving portion 5 with a built-in motor.

A bridge portion 13 composed of support columns 6 and 6 provided on both sides of the platform 2 and a beam (transverse beam) 7 extending horizontally in the X direction is provided so as to straddle the platform 2. The beam 7 is provided with a long plate-shaped breaking rod 9 that moves up and down toward the platform 2 by the fluid cylinder 8. The breaking lever 9 is provided at the lower end with a linear ridgeline portion 9a having a tapered front end portion. The predetermined position of the ridgeline portion 9a, that is, the position of the ridgeline portion 9a with respect to the convex portion 1 of the substrate W placed on the platform 2 during the breaking operation described below is provided with a concave portion 9b into which the convex portion 1 is fitted (see FIG. a)).

As shown in FIG. 3 (a), the depth H of the concave portion 9b of the rupture lever 9 is equal to the height h of the convex portion 1 of the substrate W. The width L1 of the concave portion 9b is such that the convex portion 1 of the substrate W can be fully embedded It is formed to be slightly longer than the width L2 of the convex portion 1.

When the substrate W is fractured, first, as shown in FIG. 4, the substrate W is attached to the dicing tape 11 having elasticity and supported by the cutting ring 10 so that the score line S becomes downward. . Then, as shown in FIG. 3 (a), the cutting tape 11 to which the substrate W has been attached is placed and held on the platform 2 of the breaking device A via the buffer sheet 12. At this time, the surface on which the scribe line S of the substrate W is formed is set to the lower side.

Then, as shown in FIG. 3 (b), the breaking rod 9 is lowered from above the substrate W toward the score line S, and the substrate W is pressed, so that the score line S is flexed on the buffer sheet 12 and the score line S is The crack penetrates into the thickness direction and breaks the substrate W.

When the breaking lever 9 is used for breaking, as shown in FIGS. 5 (a) and 5 (b), the convex portion 1 of the substrate W is embedded in the concave portion 9b of the breaking rod 9, and the depth H of the concave portion 9b is formed as Since the height h of the convex portion 1 is equal, the pressing load of the concave portion 9b and the linear ridgeline portion 9a of the breaking lever 9 on the substrate W is made equal. Thereby, it is possible to prevent the chip body from being detached from the scribe line S of the substrate body W1 due to uneven load as in the conventional case, and it will not be broken diagonally, or irregular cracks will be generated inside the resin layer W2. The substrate W is broken perfectly along the scribe line S.

In the present invention, in the above-mentioned embodiment, although the buffer sheet 12 is laid under the substrate W, and the substrate W is bent by pressing with the breaking rod 9, the buffer sheet 12 can also be replaced as shown in FIG. A pair of receiving blades 20, 20 sandwiching the scribe line S and receiving the substrate W 'as shown in FIG.

As mentioned above, although the typical embodiment of this invention was described, this invention is not limited to the said embodiment structure. For example, the cutting tape 11 described above may be omitted. In addition, in the present invention, modifications and changes can be appropriately made within the scope of achieving the object without departing from the scope of patent application.

The invention can be applied to the breaking of a brittle material substrate having a resin layer formed on one surface of the substrate body and a convex portion formed on the surface of the resin layer.

Claims (3)

A method for breaking a brittle material substrate is a brittle material substrate having a convex portion formed on a surface of a resin layer formed on one surface of the substrate body and a score line formed on the other surface of the substrate body. The surface is pressed by a breaking rod, thereby flexing the brittle material substrate and breaking along the scribe line, and is characterized in that the brittleness of the straight ridge portion of the breaking rod is relative to the brittleness of the breaking rod. A part of the convex part of the material substrate forms a concave part for the convex part to be embedded, and is fractured in such a manner that an equal pressing load is applied to the entire area of the fracture rod pressing surface of the brittle material substrate when the fracture bar is pressed. The ridgeline portion is disposed at the front end of the rupture rod. A cracking device for a brittle material substrate is a brittle material substrate having a convex portion formed on a surface of a resin layer formed on one surface of the substrate body and a score line formed on the other surface of the substrate body. The surface is pressed by a breaking rod, thereby flexing the brittle material substrate and breaking along the scribe line, and is characterized in that the brittleness of the straight ridge portion of the breaking rod is relative to the brittleness of the breaking rod. A portion of the convex portion of the material substrate forms a concave portion in which the convex portion is embedded, and the ridge line portion is disposed at the front end of the breaking rod. For example, the cracking device for a brittle material substrate of the second patent application range, wherein the depth of the concave portion of the cracking rod is equal to the height of the convex portion of the brittle material substrate, and the width of the concave portion is based on the convex portion. Fully embedded dimensions are formed.