TWI625314B - Scribing tool, manufacturing method of scribing tool, and forming method of scribing tool - Google Patents

Abstract

The present invention more reliably forms a starting crack for forming a scribing line.

The scribing tool includes a shank and diamond particles 51 mounted on the shank. The diamond grains 51 are provided with ridge lines EL having ends. The diamond grain 51 includes a first portion P1 and a second portion P2. The first portion P1 includes a first protrusion D1 provided at an end of the ridgeline EL and a first straight portion L1 extending from the first protrusion D1 along the ridgeline EL. The second portion P2 is provided with a recessed portion RA connected to the first straight portion L1 and disposed on the ridgeline EL. Between the first portion P1 and the second portion P2, the first linear portion L1 and the concave portion RA meet to form a second protrusion D2.

Description

Scribing tool, manufacturing method of scribing tool, and forming method of scribing tool

The present invention relates to a scribing tool, a method for manufacturing the scribing tool, and a method for forming a scribing method, and particularly to a scribing tool using diamond grains, a method for manufacturing a scribing tool, and a method for forming a scribing tool.

When manufacturing electrical devices such as flat panel display panels or solar cell panels, it is often necessary to cut off substrates made of brittle materials such as glass plates, semiconductor wafers, sapphire wafers, or ceramic plates. At this time, scribing is often performed on a substrate using a scribing device. That is, a scribe line is formed on the substrate surface. The scribe lines extend in a linear manner on the surface of the substrate.

When the crack is completely advanced in the thickness direction, the substrate can be completely cut along the scribe line only by the scribe line formation. When the crack progresses only in the thickness direction, a stress called a breaking step is performed after the scribe line is formed. The crack is completely advanced in the thickness direction by the breaking step, so that the substrate is completely cut along the scribe line.

Widely used as a scribing tool for forming scribing tools, there are diamond scribing tools. For example, according to Japanese Patent Application Laid-Open No. 2011-219308 (Patent Document 1), a diamond scribing tool includes synthetic diamond abrasive grains, and a handle holding the synthetic diamond abrasive grains. The synthetic diamond abrasive grains have the intersection of the (100) plane and the (111) plane of two adjacent planes as a point.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-219308

In order to form a scribing line, it is necessary to first generate a crack (hereinafter referred to as a starting point crack) which is the beginning of the substrate and faces the inside of the substrate. Once the starting crack is formed, the scribe line can be easily stretched on the substrate from the starting crack. On the contrary, when the starting point crack is not formed, even if the scribing tool is pulled sharply on the substrate, the damage is caused only on the substrate. If there is only such damage, the substrate cannot be cut even if stress is applied in the above-mentioned breaking step, and such a structure does not correspond to the "scribe line" in this specification.

The starting crack is particularly easy to form at the edge of the substrate. The reason is that when using a scribing tool to damage the end surface at the end edge, cracks toward the inside of the substrate are particularly likely to occur. However, there are cases where the damage is not sufficient to form a crack at the starting point despite being on the edge. In other words, the yield of the crack formation step is not 100%. Accordingly, a method for more reliably forming a crack at the starting point is desired.

The present invention has been made in order to solve the problems described above, and an object thereof is to provide a scribing tool capable of more reliably forming a starting crack for forming a scribing line, a method for manufacturing the scribing tool, and a method for forming a scribing line. .

The scribing tool of the present invention includes a shank and diamond grains mounted on the shank. The diamond grains are provided with ridges having ends. The diamond grain contains the first and second parts. The first portion includes a first protrusion provided at an end of the ridgeline, and a first linear portion extending from the first protrusion along the ridgeline. In the second portion, a recessed portion connected to the first straight portion and disposed on the ridge line is provided. Between the first and second portions, the first linear portion and the concave portion meet to form a second protrusion.

Preferably, the diamond particles further include a third portion having a second straight portion extending from the concave portion along the ridge line. The first and second straight portions are located on an imaginary straight line.

Preferably, the first straight portion has a length of more than 30 μm and less than 100 μm. It is preferable that the recessed portion has a length of more than 30 μm and less than 100 μm along the ridge line. Preferably, the recess It has a depth of more than 10 μm and less than 50 μm.

The method for manufacturing a scribing tool of the present invention includes the following steps. Diamond grains are prepared which are provided with a ridge line having a protruding end. The diamond particles are irradiated with laser light crossing the ridgeline at a position spaced from the protrusion, thereby forming a recess on the ridgeline.

The scribing method of the present invention is a scribing method for forming a scribing method on a substrate provided with a main surface having an end edge, and includes the following steps (1) to (3).

(1) A diamond grain having a ridge line having an end is prepared. The diamond grain contains the first and second parts. The first portion includes a first protrusion provided at an end of the ridgeline, and a first linear portion extending from the first protrusion along the ridgeline. In the second portion, a recessed portion connected to the first straight portion and disposed on the ridge line is provided. Between the first and second portions, the first linear portion and the concave portion meet to form a second protrusion.

(2) An initial crack is formed at the edge of the main surface of the substrate. The step of forming the initial crack includes a step of causing the concave portion of the diamond grain to be caught on the edge; and a step of scraping the edge of the concave portion with the second protrusion.

(3) The first part of the diamond grains is moved from the initial crack on the main surface so that the scribe line is extended.

In the method for forming the scribe line, it is preferable that the diamond particles further include a third portion having a second straight portion extending from the concave portion along the ridge line. The first and second straight portions are located on an imaginary straight line. The step of forming the initial crack includes a step of sliding the end edge of the main surface of the substrate on the ridge line from the second straight portion into the recessed portion before the step of scraping the edge of the recessed portion with the second protrusion.

According to the present invention, it is possible to more surely form a starting crack for forming a scribe line.

4‧‧‧ substrate

50‧‧‧ Crossing tool

51, 52‧‧‧diamond particles

59‧‧‧ handle

D1 ~ D3‧‧‧‧ protrusions (1st ~ 3rd protrusions)

EG‧‧‧Edge

EL‧‧‧Spine

FC‧‧‧ main face

IC‧‧‧ initial crack

L1, L2‧‧‧Straight parts (1st and 2nd straight parts)

LL‧‧‧Laser light

P0‧‧‧face

P1 ~ P3‧‧‧‧ (Parts 1 ~ 3)

P1a ~ P1d‧‧‧face

RA, RB‧‧‧ recess

SL‧‧‧ crossed

U2‧‧‧Arrow

U3‧‧‧ Arrow

VL‧‧‧imaginary straight line

FIG. 1 is a partial plan view showing a state where a scribe line is extended from an initial crack in Embodiment 1 of the present invention.

FIG. 2 is a schematic partial cross-sectional view taken along the line II-II of FIG. 1. FIG.

FIG. 3 is a top view of the diamond grains as viewed from the viewpoint of arrow III in FIG. 2.

FIG. 4 is a schematic partial cross-sectional view taken along line IV-IV of FIG. 3.

FIG. 5 is a view showing dimensions of the configuration of FIG. 4.

FIG. 6 is a partial cross-sectional view schematically showing a first step of a method for forming a scribe line in Embodiment 1 of the present invention.

Fig. 7 is a partial cross-sectional view schematically showing a second step of the method for forming a scribe line in the first embodiment of the present invention.

8 is a partial cross-sectional view schematically showing a third step of the method for forming a scribe line in the first embodiment of the present invention.

Fig. 9 is a partial cross-sectional view schematically showing a fourth step of the method for forming a scribing line in the first embodiment of the present invention.

Fig. 10 is a partial cross-sectional view schematically showing a fifth step of the method for forming a scribing line in the first embodiment of the present invention.

FIG. 11 is a plan view schematically showing a step of a method for manufacturing a scribing tool in Embodiment 2 of the present invention.

FIG. 12 is a partial cross-sectional view schematically showing a configuration of diamond grains provided in a scribe tool in Embodiment 3 of the present invention.

Hereinafter, embodiments of the present invention will be described based on the drawings. In the following drawings, the same reference numerals are given to the same or corresponding parts, and descriptions thereof are not repeated.

(Embodiment 1)

First, the outline of this embodiment will be described with reference to FIGS. 1 and 2. A scribing tool 50 is prepared. The scribing tool 50 includes a shank 59 and diamond grains 51 mounted on the shank 59. In addition, a substrate 4 having a main surface FC having an edge EG is prepared. An initial crack IC is formed by causing the diamond particles 51 to hit the edge EG. The scribe tool 50 moves on the main surface FC (arrow V4 in the figure), thereby extending the scribe SL from the initial crack IC. Thereby, a scribe line SL is formed.

Next, the structure of the diamond grains 51 will be described in detail.

Referring to FIG. 3, a surface P0 and surfaces P1 a to P1 d surrounding the surface P0 are provided on the diamond grains 51. The faces P1a and P1b are opposite to each other. A ridge line EL is provided on the diamond grain 51 at the boundary between the surfaces P1a and P1b. The ridge line EL has one end (the position of the protrusion D1 described later) of the connection surface P0 and the other end (not shown). Recesses RA are formed at positions spaced apart from one end and the other end on the ridge line EL. The details of the recessed portion RA will be described later.

The same applies to the pair of faces P1b and P1c, the pair of faces P1c and P1d, and the pair of faces P1d and P1a. Preferably, in terms of crystallography, the plane P0 is the (001) plane, and the planes P1a to P1d are the (111) plane, the (-111) plane, the (-1-11) plane, and the (1-11) plane, respectively. .

Referring to FIG. 4, the diamond particles 51 include portions P1 to P3 (parts 1 to 3). The portion P1 includes a protrusion D1 (first protrusion) provided at one end of the ridge line EL, and a straight portion L1 (first straight portion) extending from the protrusion D1 along the ridge line EL. In the portion P2, a recessed portion RA that connects the straight portion L1 and is disposed on the ridgeline EL is provided. Between the portions P1 and P2, the straight portion L1 and the recessed portion RA meet to form a protrusion D2 (second protrusion).

The portion P3 has a straight portion L2 (second straight portion) extending from the recessed portion RA along the ridge line EL. Between the portions P3 and P2, the recessed portion RA and the straight portion L2 meet to form a protrusion D3 (third protrusion). The straight portions L1 and L2 are located on a virtual straight line VL (a virtual straight line). Thereby, the recessed part RA is locally provided on the virtual straight line VL. The above-mentioned protrusions D1 to D3 are all corners formed by the ridge line EL and a plane or a curved surface, and the front ends thereof are point-shaped or minute curved surfaces.

Referring to FIG. 5, it is preferable that the straight portion L1 has a length M1 of more than 30 μm and less than 100 μm. It is preferable that the recessed portion RA has a length M2 of more than 30 μm and less than 100 μm along the ridge line EL. It is preferable that the recessed portion RA has a depth M3 of more than 10 μm and less than 50 μm.

Next, a scribing method for forming the scribing SL will be described in detail below.

First, a scribing tool 50 (FIG. 2) is prepared. Specifically, the diamond grains 51 (FIG. 5) mounted on the shank 59 (FIG. 2) are prepared.

6, a substrate 4 is prepared. The diamond grains 51 are arranged by moving the handle 59 (FIG. 2). In standby position. Specifically, the protrusions D1 of the diamond grains 51 are arranged higher than the main surface FC of the substrate 4. The protrusions D1 to D3 are arranged apart from the main surface FC. The recessed portion RA is arranged to face the end edge EG.

Referring to FIG. 7, as shown by an arrow V1 in the figure, the diamond particles 51 are lowered so that the entire recessed portion RA is located below the main surface FC. The distance from the main surface FC to the protrusion D1 at this time is called the cut-in amount, and is usually set to 100 μm or more.

Referring to FIG. 8, as shown by an arrow U2 in the figure, the diamond particles 51 are horizontally moved toward the substrate 4. Thereby, the straight portion L2 of the diamond grains 51 contacts the edge EG of the substrate 4. As a result, the diamond particles 51 straddle the upper substrate 4 (arrow V2 in the figure). In addition, in order to avoid excessive impact during the contact, the speed of the horizontal movement (arrow U2 in FIG. 8) is preferably sufficiently lower than the speed when the scribe line SL is formed (arrow V4 in FIG. 10). For example, the former is approximately 5 mm / sec to 20 mm / sec, and the latter is approximately 300 mm / sec to 500 mm / sec. The distance from the main surface FC to the protrusion D1 after the diamond particles 51 cross the upper substrate 4 (actually the depth that the diamond particles bite into the substrate 4) becomes about 1 to 7 μm.

Then, an initial crack IC is formed on the edge EG of the main surface FC of the substrate 4. Specifically, perform the following steps.

Further referring to FIG. 9, the horizontal movement is continued (arrow U3 in the figure), and the edge EG of the main surface FC of the substrate 4 is slid into the recess RA from the linear portion L2 on the ridge line EL. At this time, the protrusion D3 scrapes the edge EG and may damage the edge EG. As the horizontal movement continues, the concave portion RA of the diamond grain 51 is caught on the edge EG, and the protrusion D2 is used to scrape the edge EG caught on the concave portion RA (arrow V3 in the figure).

Referring to FIG. 10, an initial crack IC is formed on the edge EG of the main surface FC of the substrate 4 through the above steps. Then, a portion of the portion P1 of the diamond grain 51 (specifically, a portion of the protrusion D1 and the straight portion L1) is moved from the initial crack IC on the main surface FC (arrow V4 in the figure), so that the scribe line SL ( Figure 1 and Figure 2) Stretch. After the initial crack IC is formed, in the process of forming the scribe line SL, as shown in the figure, it is preferable that the concave portion RA is located outside the substrate 4.

In addition, the initial crack IC and the scribe line SL can be continuously pressed by pressing the diamond grains 51 on the main surface FC of the substrate 4 with an appropriate load and moving in the horizontal direction (right direction in FIGS. 8 to 10). form. As long as the load is selected appropriately, a small vertical movement including arrows V2 (Figure 8) and V3 (Figure 9) will be automatically generated without special control.

According to this embodiment, the edge EG (FIG. 9) caught on the recessed portion RA is scraped by the protrusion D2. Thereby, an initial crack IC can be formed more reliably (FIG. 10). Furthermore, before the protrusion D2 is scraped across the edge EG of the recessed portion RA, the edge EG of the substrate 4 slides from the straight portion L2 into the recessed portion RA. At this time, the protrusion D3 can also scratch the edge EG to form a damage. Due to the occurrence of this damage, the initial cracked IC can be formed more reliably.

The linear portion L1 has a length M1 (FIG. 5) of more than 30 μm, so that after the formation of the initial cracked IC, the scribe line SL is formed with a load suitable for scribing and a depth of cut (FIG. 10), the recess RA is sufficiently far from the substrate 4. Thereby, the influence of the recessed portion RA on the formation of the scribe line SL is easily avoided. The straight portion L1 has a length M1 (FIG. 5) of less than 100 μm, whereby the protrusion D2 surely contacts the edge EG. Assuming that the length M1 is too large, it is highly likely that the protrusion D2 is located on the main surface FC of the substrate 4 when the load suitable for the scribe and the depth of cut are set. In this case, the edge EG cannot be damaged.

The recessed portion RA has a length M2 (FIG. 5) of more than 30 μm along the ridge line EL, so that the recessed portion RA of the diamond grain 51 can be more reliably caught on the edge EG of the substrate 4. The recessed portion RA has a length M2 (FIG. 5) of less than 100 μm along the ridgeline EL, thereby reducing the sliding on the ridgeline EL caused by the edge EG of the main surface FC of the substrate 4 from the straight portion L2 into the recessed portion RA The deviation between the position where the protrusion D3 scrapes the damage formed by the edge EG and the position where the protrusion D2 scrapes. Thereby, it is easy to give two effects to the same part of the edge EG. As a result, the initial cracked IC can be formed more reliably.

The recess RA has a depth M3 (FIG. 5) of more than 10 μm, thereby scraping the edge EG of the substrate 4 with the protrusion D2 that sufficiently protrudes for forming the initial crack IC. Thereby, the initial crack IC can be formed more reliably. The recessed portion RA has a depth M3 (FIG. 5) of less than 50 μm. It is easier to form the recessed portion RA.

In this embodiment, as shown in FIG. 7, the diamond particles 51 are lowered so that the entire concave portion RA is located below the main surface FC. Alternatively, the diamond particles 51 may be lowered so that a part of the concave portions RA is located below the main surface FC. In this case, the end edge EG is inserted into the recessed portion RA by the horizontal movement of the diamond particles 51 later (FIG. 9: U3). After that, the above steps from FIG. 9 are performed.

According to this modification, the protrusion D3 does not contact the substrate 4, and the initial crack IC is formed only by one action of the protrusion D2 scraping the edge EG. With this, unlike the case where the initial cracked IC is formed by two or more actions, two or more initial cracked ICs are not formed due to positional deviation. If an initial crack IC is formed at an unnecessary location, unexpected crack extension may occur.

In the above description, the system-type diamond grains 51 are moved with respect to the substrate 4, but the substrate 4 may be moved with respect to the diamond grains 51 or both as long as the same relative movement can be obtained.

(Embodiment 2)

In this embodiment, a method for manufacturing the scribing tool 50 (FIG. 2) according to the first embodiment will be described.

Referring to Fig. 11, a diamond grain 51 to be mounted on a shank 59 (Fig. 2) is prepared. As described in the first embodiment, a ridge line EL is provided on the diamond grain 51, and the ridge line EL has an end provided with a protrusion D1. At this time, the recessed portion RA has not yet been formed (FIG. 3).

Next, the diamond particles 51 are irradiated with the laser light LL crossing the ridge line EL at a position spaced from the protrusion D1. With the laser ablation thus generated, a recessed portion RA is formed on the ridge line EL (FIG. 3).

According to this embodiment, the diamond grains 51 can be easily manufactured. Furthermore, the diamond particles 51 can also be mounted on the shank 59 after the above-mentioned laser ablation (FIG. 2).

(Embodiment 3)

Referring to FIG. 12, the scribing tool of this embodiment includes diamond grains 52 instead of diamond. Grain 51 (Embodiment 1: Fig. 4). The diamond grain 52 is provided with a recessed portion RB instead of the recessed portion RA (FIG. 4). In other words, a recessed portion RB that connects the straight portion L1 and is disposed on the ridgeline EL is provided at the portion P2. Between the portions P1 and P2, the straight portion L1 and the recessed portion RB meet to form a protrusion D2. In this embodiment, the recessed portion RB extends to the other end (not shown in FIG. 12) of the ridge line EL opposite to the end where the protrusion D1 is located. In other words, the portion P3 (FIG. 4) is not provided, and therefore the protrusion D3 (FIG. 4) is not provided.

In addition, the configuration other than the above is substantially the same as the configuration of the first embodiment. Therefore, the same or corresponding elements are denoted by the same reference numerals, and descriptions thereof are not repeated.

According to this embodiment, the diamond grain 52 does not have the protrusion D3, and the initial crack IC is formed only by the action of the protrusion D2 scraping the edge EG once. With this, unlike the case where the initial cracked IC is formed by two or more actions, two or more initial cracked ICs are not formed due to positional deviation. If an initial crack IC is formed at an unnecessary location, unexpected crack extension may occur.

It should be considered that the embodiments disclosed this time are illustrative and not restrictive. The scope of the present invention is not indicated by the above-mentioned embodiments, but is expressed by the scope of patent application, and is intended to include all modifications within the meaning and scope equivalent to the scope of patent application.

Claims (8)

A scribing tool comprising a shank and diamond grains mounted on the shank. The diamond grains are provided with a ridge line having ends. The diamond grains include: a first part having the ends provided on the ridge lines. A first protrusion and a first linear portion extending from the first protrusion along the ridge line; and a second portion provided with a concave portion connected to the first straight portion and disposed on the ridge line; and in the first portion Between the second portion and the second linear portion, the first linear portion and the concave portion are combined to form a second protrusion. For example, the scoring tool of claim 1, wherein the diamond grain further includes a third portion having a second straight portion extending from the concave portion along the ridge line, and the first and second straight portions are located on an imaginary On a straight line. The scribing tool according to claim 1 or 2, wherein the first linear portion has a length exceeding 30 μm and less than 100 μm. The scribe tool of claim 1 or 2, wherein the recessed portion has a length of more than 30 μm and less than 100 μm along the ridge line. The scribe tool of claim 1 or 2, wherein the recess has a depth of more than 10 μm and less than 50 μm. A method for manufacturing a scribing tool according to any one of claims 1 to 5, comprising the steps of: preparing diamond grains provided with a ridge line, the ridge line having an end provided with a protrusion; and being separated from the protrusion At the position, the diamond particles are irradiated with laser light crossing the ridge line, thereby forming a recess on the ridge line. A method for forming a scribing line is a scribing method for forming a scribing line on a substrate provided with a main surface having an end edge, and includes the step of preparing a diamond particle provided with a ridge line having an end, the diamond particle including A first protrusion provided on the end of the ridgeline and a first portion extending from the first protrusion along the ridgeline, and a first portion provided on the ridgeline and connected to the first straight portion. The second portion of the recessed portion, and between the first and second portions, the first linear portion and the recessed portion meet to form a second protrusion. The method for forming the scribe line further includes: The step of forming an initial crack on the edge, the step of forming the initial crack, includes the step of clamping the concave portion of the diamond grain to the edge, and scraping the second edge of the edge of the edge with the second protrusion. Step, the method for forming the scribe line further includes the step of moving the first part of the diamond grains from the initial crack on the main surface, thereby extending the scribe line. In the method for forming a scribe line according to claim 7, wherein the diamond grain further includes a third portion having a second straight portion extending from the concave portion along the ridge line, and the first and second straight portions are located on an imaginary straight line, In addition, the step of forming the initial crack may further include, before the step of scraping the end edge of the recessed portion with the second protrusion, further including the end edge of the main surface of the substrate on the ridge line from the second straight line. Step of sliding on the recess into the recess.