TWI625313B - Scribing method - Google Patents

Scribing method Download PDF

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Publication number
TWI625313B
TWI625313B TW103123189A TW103123189A TWI625313B TW I625313 B TWI625313 B TW I625313B TW 103123189 A TW103123189 A TW 103123189A TW 103123189 A TW103123189 A TW 103123189A TW I625313 B TWI625313 B TW I625313B
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Taiwan
Prior art keywords
substrate
line
scribe
blade tip
auxiliary line
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TW103123189A
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Chinese (zh)
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TW201514108A (en
Inventor
Tadanobu Nakano
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Mitsuboshi Diamond Ind Co Ltd
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Publication of TW201514108A publication Critical patent/TW201514108A/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085On sheet material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

本發明係一方面抑制對刀尖之損傷,並於所需之位置確實地開始形成劃線。 On the one hand, the present invention suppresses damage to the blade tip and reliably starts to form a scribe line at a desired position.

準備設置有由具有由第1及第2邊D1、D2構成之角之邊緣所包圍之表面之基板4。藉由對基板4之表面進行劃線,而以與第1邊D1之間局部地夾著基板4之表面之方式形成第1輔助線AL1。將刀尖壓抵於基板4之表面上之自邊緣離開且位於第1邊D1與第1輔助線AL1之間之位置。使刀尖在與第1輔助線AL1交叉之第1軌道上滑動。以刀尖與第1輔助線AL1交叉為開端,開始形成第1劃線SL1。 The substrate 4 is provided with a surface surrounded by edges having corners formed by the first and second sides D1 and D2. The first auxiliary line AL1 is formed by scribing the surface of the substrate 4 so as to partially sandwich the surface of the substrate 4 with the first side D1. The blade tip is pressed against the surface of the substrate 4 to be separated from the edge and located between the first side D1 and the first auxiliary line AL1. Slide the blade tip on the first track crossing the first auxiliary line AL1. Starting from the intersection of the blade tip and the first auxiliary line AL1, the first scribe line SL1 starts to form.

Description

劃線方法 Scribing method

本發明係關於一種基板之劃線方法,尤其關於一種使用刀尖之劃線方法。 The present invention relates to a scribing method for a substrate, and more particularly, to a scribing method using a blade tip.

於平面顯示面板或太陽電池板等電氣機器之製造中,經常必須將例如玻璃板、半導體晶圓、藍寶石晶圓、或陶瓷板等由脆性材料製成之基板切斷。此時,經常地利用劃線裝置對基板進行劃線。即,於基板表面形成劃線。劃線係指於基板之厚度方向上至少局部地行進之裂紋於基板之表面上線狀地延伸者。於裂紋在厚度方向上完全地行進之情形時,僅形成劃線便可沿劃線將基板完全地切斷。於裂紋在厚度方向上僅局部地行進之情形時,在形成劃線後,實施被稱為分斷步驟之應力施加。藉由利用分斷步驟使裂紋於厚度方向上完全地行進,而沿著劃線將基板完全地切斷。 In the manufacture of electrical devices such as flat display panels or solar panels, substrates made of brittle materials, such as glass plates, semiconductor wafers, sapphire wafers, or ceramic plates, must often be cut. At this time, the substrate is often scribed with a scribe device. That is, a scribe line is formed on the substrate surface. Scribing refers to a crack that runs at least partially in the thickness direction of the substrate and extends linearly on the surface of the substrate. When a crack progresses completely in the thickness direction, the substrate can be completely cut along the scribe line only by forming a scribe line. When a crack progresses only partially in the thickness direction, a stress application called a breaking step is performed after the scribe line is formed. The crack is completely advanced in the thickness direction by the breaking step, and the substrate is completely cut along the scribe line.

若以基板之邊緣為起點,則可容易地形成劃線。其原因在於:於基板之邊緣易於引起局部破裂,從而能夠以該破裂為起點使劃線延伸。然而,期望於基板上自與邊緣離開之位置開始形成劃線之情形亦較為多見。於此情形時,因劃線之起點位於基板表面之平坦面上,因而,當開始形成劃線時,容易導致刀尖於基板上打滑。因此,不易產生作為用以開始形成劃線之開端之破裂(以下稱為起點裂紋)。因此,形成起點裂紋之技正在進行研究。 If the edge of the substrate is used as a starting point, a scribe line can be easily formed. The reason is that a local crack is easily caused at the edge of the substrate, so that the scribe line can be extended with the crack as a starting point. However, it is more common to expect to form a scribe line on a substrate from a position away from the edge. In this case, since the starting point of the scribe line is located on a flat surface of the substrate surface, when the scribe line starts to be formed, it is easy to cause the blade tip to slip on the substrate. Therefore, cracks (hereinafter referred to as starting cracks) which are the beginnings for starting the formation of the scribe lines are less likely to occur. Therefore, the technique of starting crack formation is being studied.

根據日本專利特開2000-264656號公報(專利文獻1),揭示了於工 件面形成劃線之劃線方法。劃線裝置包含包括切刀、及對切刀施加振動之振動產生構件之劃線本體。根據該方法,藉由使劃線本體於與工件離開而位於上方之狀態下沿工件面相對移動,而使切刀位於劃線開始點之正上方。繼而,藉由使劃線本體下降,而使切刀之前端以劃線本體之自重觸及劃線開始點。其後,藉由對劃線本體施加衝擊,而於工件面上,在與邊緣離開之劃線開始點形成起點裂紋。藉由對工件施加振動,而以起點裂紋為開端形成劃線。 According to Japanese Patent Laid-Open No. 2000-264656 (Patent Document 1), Yu Gong is disclosed The method of scoring the piece surface. The scribing device includes a scribing body and a scribing body including a vibration generating member that applies vibration to the cutter. According to this method, the scribe body is relatively moved along the workpiece surface in a state where the scribe body is separated from the workpiece and positioned upward, so that the cutter is positioned directly above the scribe starting point. Then, by lowering the scribing body, the front end of the cutter touches the scribing start point with the weight of the scribing body. Thereafter, by applying an impact to the scribing body, a starting crack is formed on the workpiece surface at the starting point of the scribing line that is separated from the edge. By applying vibration to the workpiece, a scribe line is formed starting from the crack at the starting point.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2000-264656號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2000-264656

根據上述公報記載之劃線裝置,起點裂紋係藉由對劃線本體(劃線頭)施加衝擊而形成。然而,若意圖僅依存於衝擊獲得劃線之起點,則必須對切刀施加較大之衝擊力。因此,對切刀之刀尖造成較大損傷。 According to the scribing device described in the above publication, the starting crack is formed by applying an impact to the scribing body (scribing head). However, if the intention is to rely solely on the impact to obtain the starting point of the scribe line, a large impact force must be applied to the cutter. Therefore, the tip of the cutter is greatly damaged.

本發明係為了解決如上問題而完成,其目的在於提供一種可一面抑制對刀尖之損傷,一面自基板之與邊緣離開之位置開始形成劃線之劃線方法。 The present invention is completed in order to solve the above problems, and an object thereof is to provide a scribing method capable of forming a scribing line from the position where the substrate is separated from the edge while suppressing damage to the blade tip.

本發明之劃線方法包括如下步驟。準備設置有由具有由第1及第2邊構成之角之邊緣所包圍之表面之基板。藉由對基板之表面進行劃線,而以與第1邊之間局部地夾著基板之表面之方式形成第1輔助線。將自基板離開之刀尖壓抵於基板表面上之自邊緣離開且位於第1邊與第1輔助線之間之位置。使壓抵於基板之表面上之刀尖在與第1輔助線交叉之第1軌道上滑動。以刀尖與第1輔助線交叉為開端,開始形成第 1劃線。 The scribing method of the present invention includes the following steps. A substrate provided with a surface surrounded by edges having corners composed of first and second sides is prepared. The first auxiliary line is formed by scribing the surface of the substrate to partially sandwich the surface of the substrate with the first side. The blade tip that is separated from the substrate is pressed against the substrate that is separated from the edge and located between the first side and the first auxiliary line. The blade tip pressed against the surface of the substrate is slid on the first track crossing the first auxiliary line. Beginning with the intersection of the blade tip and the first auxiliary line, the first 1 underline.

根據該劃線方法,以滑動之刀尖與第1輔助線交叉為開端開始形成第1劃線。藉此,無需為了確保第1劃線之形成開端而對刀尖施加較大之衝擊。因此,可一面抑制對刀尖之損傷,一面自基板之自邊緣離開之位置開始形成第1劃線。 According to this scribing method, the first scribing line is formed starting from the intersection of the sliding blade tip and the first auxiliary line. Thereby, it is not necessary to apply a large impact to the blade tip in order to secure the opening of the first scribe line. Therefore, the first scribe line can be formed from the position where the edge of the substrate leaves from the edge while suppressing damage to the blade edge.

較佳為,當形成第1輔助線時,自第2邊對基板之表面進行劃線。藉此,能夠以第2邊為開端開始形成第1輔助線。 Preferably, when the first auxiliary line is formed, the surface of the substrate is scribed from the second side. With this, it is possible to start forming the first auxiliary line starting from the second side.

更佳為,當自第2邊劃線基板之表面時,使刀尖於基板之表面上滑動。一般而言,不易獲得將滑動之刀尖切入基板之表面之開端,但於基板之第2邊上、即邊緣上,易於將滑動之刀尖切入基板中。因此,即便使用滑動之刀尖,亦可容易地開始形成第1輔助線。 More preferably, when the surface of the substrate is scribed from the second side, the blade tip is caused to slide on the surface of the substrate. Generally speaking, it is not easy to obtain the beginning of cutting the sliding blade tip into the surface of the substrate, but it is easy to cut the sliding blade tip into the substrate on the second side of the substrate, that is, on the edge. Therefore, even if a sliding blade is used, it is possible to easily start forming the first auxiliary line.

上述劃線方法可進而包括如下步驟。將自基板離開之刀尖壓抵於基板之表面上自邊緣離開且位於第2邊與第1劃線之間之位置。使壓抵於基板之表面上之刀尖在與第1劃線交叉之第2軌道上滑動。以刀尖與第1劃線交叉為開端,開始形成第2劃線。藉此,第1劃線被用作確保第2劃線之形成開端之輔助線。因此,與另行形成輔助線之情形相比,可簡化步驟。 The scribing method may further include the following steps. The blade tip that is separated from the substrate is pressed against the surface of the substrate and is separated from the edge and located between the second side and the first scribe line. The blade tip pressed against the surface of the substrate is slid on the second track crossing the first scribe line. Starting with the intersection of the blade tip and the first scribe line, a second scribe line begins to form. Thereby, the first scribe line is used as an auxiliary line for ensuring the formation of the second scribe line. Therefore, the steps can be simplified as compared with a case where an auxiliary line is separately formed.

或者,上述劃線方法可進而包括如下步驟。藉由自第1邊對基板之表面進行劃線,而形成以夾於第2邊與第1劃線之間之方式延伸之第2輔助線。將自基板離開之刀尖壓抵於基板之表面上自邊緣離開且位於第2邊與第2輔助線之間之位置。使壓抵於基板之表面上之刀尖在依序與第2輔助線及第1劃線交叉之第2軌道上滑動。以刀尖與第2輔助線交叉為開端,開始形成第2劃線。藉此,利用第2輔助線開始形成之第2劃線於因伸展而穩定化之後,與第1劃線交叉。因此,可於第1劃線之附近穩定地形成第2劃線。 Alternatively, the scribing method may further include the following steps. A second auxiliary line extending between the second side and the first scribe line is formed by scribing the surface of the substrate from the first side. The blade tip that is separated from the substrate is pressed against the surface of the substrate and is separated from the edge and located between the second side and the second auxiliary line. The blade point pressed against the surface of the substrate is slid on the second track which sequentially intersects the second auxiliary line and the first scribe line. Starting with the intersection of the blade tip and the second auxiliary line, a second scribe line begins to form. Thereby, the second scribe line started to be formed by the second auxiliary line crosses the first scribe line after being stabilized by stretching. Therefore, the second scribe line can be formed stably near the first scribe line.

根據本發明,如上所述,可一面抑制對刀尖之損傷,一面自基板之自邊緣離開之位置開始形成劃線。 According to the present invention, as described above, it is possible to form a scribing line from the position where the substrate moves away from the edge while suppressing damage to the blade edge.

4‧‧‧母基板(基板) 4‧‧‧ mother substrate (substrate)

11‧‧‧工作台 11‧‧‧Workbench

30‧‧‧劃線頭 30‧‧‧ crossed head

110‧‧‧主體部 110‧‧‧Main body

120‧‧‧切刀 120‧‧‧ Cutter

121‧‧‧刀尖 121‧‧‧Blade

122‧‧‧刀架 122‧‧‧ knife holder

130‧‧‧負荷部 130‧‧‧Load Department

131‧‧‧缸 131‧‧‧cylinder

132‧‧‧按壓銷 132‧‧‧Press pin

AL1、AL1v‧‧‧輔助線(第1輔助線) AL1, AL1v‧‧‧Auxiliary line (1st auxiliary line)

AL2‧‧‧輔助線(第2輔助線) AL2‧‧‧Auxiliary line (second auxiliary line)

AX‧‧‧支點 AX‧‧‧ Fulcrum

D1~D4‧‧‧邊(第1~第4邊) D1 ~ D4‧‧‧sides (1st ~ 4th sides)

DR1、DR2‧‧‧方向 DR1, DR2‧‧‧ direction

F、LD‧‧‧力 F, LD‧‧‧force

NL1、NL2‧‧‧區間 NL1, NL2 ‧‧‧ intervals

PA1、PA2‧‧‧交叉點 PA1, PA2 ‧‧‧ intersection

PE1、PE2、PE2‧‧‧終點 PE1, PE2, PE2

PL1‧‧‧起點 PL1‧‧‧Start

PP1、PP2‧‧‧接觸點 PP1, PP2‧‧‧ contact points

PS2‧‧‧交叉點 PS2‧‧‧ Intersection

SL1、SL1v‧‧‧劃線(第1劃線) SL1, SL1v ‧‧‧ crossed (first crossed)

SL1a~SL1d、SL1va~SL1vd‧‧‧劃線 SL1a ~ SL1d, SL1va ~ SL1vd‧‧‧

SL2、SL2v‧‧‧劃線(第2劃線) SL2, SL2v ‧‧‧ crossed (2nd crossed)

SL2a、SL2b、SL2va、SL2vb‧‧‧劃線 SL2a, SL2b, SL2va, SL2vb‧‧‧

TJ1、TJ1v‧‧‧軌道(第1軌道) TJ1, TJ1v‧‧‧track (track 1)

TJ2、TJ2v‧‧‧軌道(第2軌道) TJ2, TJ2v‧‧‧track (Track 2)

U1~U12‧‧‧單位基板 U1 ~ U12‧‧‧Unit substrate

圖1係概略地表示本發明之實施形態1中之劃線方法之流程圖。 FIG. 1 is a flowchart schematically showing a scribing method in Embodiment 1 of the present invention.

圖2係概略地表示本發明之實施形態1中之劃線方法之第1步驟之俯視圖。 FIG. 2 is a plan view schematically showing the first step of the scribing method in Embodiment 1 of the present invention.

圖3係概略地表示本發明之實施形態1中之劃線方法之第2步驟之俯視圖。 Fig. 3 is a plan view schematically showing a second step of the scribing method in the first embodiment of the present invention.

圖4係概略地表示本發明之實施形態1中之劃線方法之第3步驟之俯視圖。 Fig. 4 is a plan view schematically showing a third step of the scribing method in the first embodiment of the present invention.

圖5係概略地表示本發明之實施形態1中之劃線方法之第4步驟之俯視圖。 5 is a plan view schematically showing a fourth step of the scribing method in the first embodiment of the present invention.

圖6係概略地表示本發明之實施形態1中之劃線方法之第5步驟之俯視圖。 Fig. 6 is a plan view schematically showing a fifth step of the scribing method in the first embodiment of the present invention.

圖7係概略地表示本發明之實施形態1中之劃線方法之第6步驟之俯視圖。 Fig. 7 is a plan view schematically showing a sixth step of the scribing method in the first embodiment of the present invention.

圖8係概略地表示本發明之實施形態1中之劃線方法之第7步驟之俯視圖。 8 is a plan view schematically showing a seventh step of the scribing method in the first embodiment of the present invention.

圖9係概略地表示圖2之步驟之局部側視圖。 Fig. 9 is a partial side view schematically showing the step of Fig. 2;

圖10係概略地表示本發明之實施形態2中之劃線方法之一步驟之局部側視圖。 Fig. 10 is a partial side view schematically showing a step of the scribing method in Embodiment 2 of the present invention.

圖11係概略地表示本發明之實施形態3中之劃線方法之第1步驟之俯視圖。 11 is a plan view schematically showing a first step of a scribing method in Embodiment 3 of the present invention.

圖12係概略地表示本發明之實施形態3中之劃線方法之第2步驟之俯視圖。 FIG. 12 is a plan view schematically showing a second step of the scribing method in Embodiment 3 of the present invention.

圖13係概略地表示本發明之實施形態3中之劃線方法之第3步驟 之俯視圖。 Fig. 13 is a diagram showing the third step of the scribing method in the third embodiment of the present invention. Top view.

圖14係概略地表示本發明之實施形態3中之劃線方法之第4步驟之俯視圖。 FIG. 14 is a plan view schematically showing a fourth step of the scribing method in Embodiment 3 of the present invention.

圖15係概略地表示本發明之實施形態3中之劃線方法之第5步驟之俯視圖。 Fig. 15 is a plan view schematically showing a fifth step of the scribing method in the third embodiment of the present invention.

圖16係概略地表示本發明之實施形態3中之劃線方法之第6步驟之俯視圖。 Fig. 16 is a plan view schematically showing a sixth step of the scribing method in the third embodiment of the present invention.

圖17係概略地表示本發明之實施形態3中之劃線方法之第7步驟之俯視圖。 Fig. 17 is a plan view schematically showing a seventh step of the scribing method in the third embodiment of the present invention.

圖18係概略地表示本發明之實施形態4中之劃線方法之流程圖。 FIG. 18 is a flowchart schematically showing a scribing method in Embodiment 4 of the present invention.

圖19係概略地表示本發明之實施形態4中之劃線方法之第1步驟之俯視圖。 FIG. 19 is a plan view schematically showing the first step of the scribing method in Embodiment 4 of the present invention.

圖20係概略地表示本發明之實施形態4中之劃線方法之第2步驟之俯視圖。 FIG. 20 is a plan view schematically showing a second step of the scribing method in Embodiment 4 of the present invention.

圖21係概略地表示本發明之實施形態4中之劃線方法之第3步驟之俯視圖。 FIG. 21 is a plan view schematically showing the third step of the scribing method in Embodiment 4 of the present invention.

圖22係概略地表示本發明之實施形態4中之劃線方法之第4步驟之俯視圖。 22 is a plan view schematically showing a fourth step of the scribing method in Embodiment 4 of the present invention.

以下,基於圖式,對本發明之實施形態進行說明。再者,於以下圖式中,對同一或相符之部分標註同一參照編號,且不重複進行其說明。 Hereinafter, embodiments of the present invention will be described based on the drawings. Moreover, in the following drawings, the same or corresponding parts are marked with the same reference numbers, and the description thereof will not be repeated.

(實施形態1) (Embodiment 1)

圖1係概略地表示本實施形態中之劃線方法之流程圖。圖2~圖8係依序地表示該劃線方法之步驟之俯視圖。 FIG. 1 is a flowchart schematically showing a scribing method in this embodiment. 2 to 8 are top views sequentially showing steps of the scribing method.

參照圖2,準備由玻璃製成之母基板4(基板)(圖1:步驟S10)。於 母基板4設置有由具有邊D1~D4(第1~第4邊)之邊緣包圍之表面。邊D1及D2構成圖中之左上角。邊D2及D3構成圖中之右上角。邊D3及D4構成圖中之右下角。邊D4及D1構成圖中之左下角。於本實施形態中,母基板4之表面係由具有該等4個角之長方形之邊緣包圍。此處,長方形係包含正方形在內之概念。 Referring to Fig. 2, a mother substrate 4 (substrate) made of glass is prepared (Fig. 1: Step S10). to The mother substrate 4 is provided with a surface surrounded by edges having sides D1 to D4 (first to fourth sides). The sides D1 and D2 constitute the upper left corner in the figure. The edges D2 and D3 constitute the upper right corner in the figure. The edges D3 and D4 constitute the lower right corner in the figure. The sides D4 and D1 constitute the lower left corner in the figure. In this embodiment, the surface of the mother substrate 4 is surrounded by rectangular edges having these four corners. Here, a rectangle is a concept including a square.

自邊D2朝向與邊D1平行之方向DR1對母基板4之表面進行劃線。具體而言,進而參照圖9,在受支持於工作台11上之母基板4之表面上,使切刀120之刀尖121(圖9)朝方向DR1滑動。藉此,自與邊D1離開且位於邊D2上之起點PL1朝方向DR1形成輔助線AL1(第1輔助線)(圖1:步驟S20)。輔助線AL1係以與邊D1之間局部地夾著母基板4之表面之方式(圖中以夾著母基板4之左部分之方式)而形成。於本實施形態中,輔助線AL1係與邊D1平行地延伸,且將邊D2及D4之間連接。 The surface of the mother substrate 4 is scribed from the side D2 toward a direction DR1 parallel to the side D1. Specifically, referring to FIG. 9, on the surface of the mother substrate 4 supported on the table 11, the tip 121 (FIG. 9) of the cutter 120 is slid in the direction DR1. Thereby, the auxiliary line AL1 (the first auxiliary line) is formed in the direction DR1 from the starting point PL1 which is separated from the side D1 and located on the side D2 (FIG. 1: Step S20). The auxiliary line AL1 is formed so as to partially sandwich the surface of the mother substrate 4 with the side D1 (in the figure, the left portion of the mother substrate 4 is sandwiched). In this embodiment, the auxiliary line AL1 extends parallel to the side D1 and connects the sides D2 and D4.

再者,如圖9所示,切刀120亦可包含保持刀尖121之刀架122。切刀120較佳為鑽石頭(diamond point)。即,刀尖121較佳為由鑽石製成。鑽石係天然或合成之單晶體鑽石、多晶體鑽石、或者利用鐵族元素等結合材料使鑽石粒子結合而成之燒結鑽石。 Furthermore, as shown in FIG. 9, the cutting blade 120 may further include a blade holder 122 holding a blade tip 121. The cutter 120 is preferably a diamond point. That is, the blade tip 121 is preferably made of diamond. Diamonds are natural or synthetic single crystal diamonds, polycrystalline diamonds, or sintered diamonds made by combining diamond particles with binding materials such as iron group elements.

參照圖3,將自母基板4離開之刀尖121(圖9)壓抵於母基板4表面上之接觸點PP1(圖1:步驟S30)。接觸點PP1係母基板4之自邊緣離開且邊D1與輔助線AL1之間。此處,所謂「邊D1與輔助線AL1之間」係指夾於邊D1及輔助線AL1之間,且與邊D1及輔助線AL1各者離開之位置。於本實施形態中,該刀尖121係與用以形成輔助線AL1之刀尖同一或同樣者。繼而,使壓抵於母基板4表面上之刀尖121在與輔助線AL1於交叉點PA1交叉並延伸至邊D3之軌道TJ1(第1軌道)上,朝與邊D2平行之方向DR2滑動(圖1:步驟S40)。 Referring to FIG. 3, the blade tip 121 (FIG. 9) separated from the mother substrate 4 is pressed against the contact point PP1 on the surface of the mother substrate 4 (FIG. 1: step S30). The contact point PP1 is separated from the edge of the mother substrate 4 between the edge D1 and the auxiliary line AL1. Here, the "between the side D1 and the auxiliary line AL1" means a position sandwiched between the side D1 and the auxiliary line AL1 and separated from each of the side D1 and the auxiliary line AL1. In this embodiment, the cutting edge 121 is the same as or the same as the cutting edge used to form the auxiliary line AL1. Then, the blade tip 121 pressed against the surface of the mother substrate 4 is caused to slide on the track TJ1 (the first track) that crosses the auxiliary line AL1 at the intersection PA1 and extends to the side D3 (DR2 in a direction parallel to the side D2 ( Figure 1: Step S40).

參照圖4,以刀尖121與輔助線AL1交叉為開端,開始形成劃線SL1(第1劃線)。具體而言,於接觸點PP1至交叉點PA1為止之區間NL1 在母基板4之表面上滑行之刀尖121於交叉點PA1扣入輔助線AL1之裂紋。藉此,刀尖121以交叉點PA1為起點開始形成劃線SL1。 Referring to FIG. 4, starting from the intersection of the blade tip 121 and the auxiliary line AL1, a scribe line SL1 (first scribe line) is formed. Specifically, the interval NL1 from the contact point PP1 to the intersection PA1 The blade tip 121 sliding on the surface of the mother substrate 4 buckles into the crack of the auxiliary line AL1 at the intersection PA1. Thereby, the knife edge 121 starts to form the scribe line SL1 starting from the intersection PA1.

再者,於刀尖121在母基板4之表面滑行之情形時,容易於母基板4之表面形成劃痕。該劃痕對於用於上述分斷步驟而言過淺,故不屬於本說明書中之「劃線」。 Moreover, when the blade tip 121 slides on the surface of the mother substrate 4, it is easy to form a scratch on the surface of the mother substrate 4. This scratch is too shallow for use in the above-mentioned breaking step, so it does not belong to the "scribe line" in this specification.

參照圖5,於劃線SL1與邊D4之間形成與劃線SL1並行之劃線SL1a~SL1d。劃線SL1a~SL1d之形成方法係與劃線SL1之形成方法相同。 Referring to FIG. 5, scribe lines SL1 a to SL1 d are formed between the scribe line SL1 and the side D4 in parallel with the scribe line SL1. The method for forming the scribe lines SL1a to SL1d is the same as the method for forming the scribe lines SL1.

參照圖6,將與母基板4離開之刀尖121(圖9)壓抵於母基板4之表面上之接觸點PP2(圖1:步驟S50)。接觸點PP2係母基板4之與邊緣離開且邊D2與劃線SL1之間。此處,所謂「邊D2與劃線SL1之間」係指夾於邊D2及劃線SL1之間且與邊D2及劃線SL1各者離開之位置。於本實施形態中,該刀尖121係與用以形成輔助線AL1之刀尖同一或同樣者。繼而,使壓抵於母基板4之表面上之刀尖121以與劃線SL1在交叉點PS2交叉之軌道TJ2(第2軌道),與邊D1平行地滑動(圖1:步驟S60)。 Referring to FIG. 6, the blade tip 121 (FIG. 9) separated from the mother substrate 4 is pressed against the contact point PP2 on the surface of the mother substrate 4 (FIG. 1: Step S50). The contact point PP2 is separated from the edge of the mother substrate 4 and is between the edge D2 and the scribe line SL1. Here, the "between the edge D2 and the scribe line SL1" means a position sandwiched between the edge D2 and the scribe line SL1 and separated from each of the edge D2 and the scribe line SL1. In this embodiment, the cutting edge 121 is the same as or the same as the cutting edge used to form the auxiliary line AL1. Then, the blade tip 121 pressed against the surface of the mother substrate 4 is slid in parallel with the side D1 on the track TJ2 (second track) crossing the scribe line SL1 at the intersection PS2 (FIG. 1: Step S60).

參照圖7,以刀尖121與劃線SL1交叉為開端,開始形成劃線SL2(第2劃線)。具體而言,於接觸點PP2至交叉點PS2為止之區間NL2在母基板4之表面滑行之刀尖121於交叉點PS2扣入劃線SL1之裂紋,藉此,以交叉點PS2為起點開始形成劃線SL2。 Referring to FIG. 7, starting from the intersection of the blade point 121 and the scribe line SL1, a scribe line SL2 (second scribe line) is started. Specifically, the blade tip 121 sliding on the surface of the mother substrate 4 between the contact point PP2 and the intersection point PS2 snaps into the crack SL1 at the intersection point PS2, thereby starting to form with the intersection point PS2 as a starting point. Line SL2.

參照圖8,於劃線SL2與邊D3之間形成與劃線SL2並行之劃線SL2a及SL2b。劃線SL2a及SL2b之形成方法係與劃線SL2之形成方法相同。 Referring to FIG. 8, scribe lines SL2a and SL2b are formed between the scribe line SL2 and the side D3 in parallel with the scribe line SL2. The formation method of the scribe lines SL2a and SL2b is the same as the formation method of the scribe lines SL2.

利用以上方式,藉由與邊D2平行地並行之劃線SL1及SL1a~SL1d、及與邊D1平行地並行之輔助線AL1、劃線SL2、SL2a及SL2b而劃分作為單位基板U1~U12之部分。繼而,將母基板4搬送至分斷裝 置(未圖示)。繼而,進行母基板4之分斷步驟。藉此,獲得相互分離之單位基板U1~U12。 In the above manner, the lines SL1 and SL1a to SL1d parallel to the side D2, and the auxiliary lines AL1, SL2, SL2a, and SL2b parallel to the side D1 are divided into the parts of the unit substrates U1 to U12. . Next, the mother substrate 4 is transported to a separation package. (Not shown). Then, the breaking step of the mother substrate 4 is performed. Thereby, the unit substrates U1 to U12 separated from each other are obtained.

根據本實施形態,以滑動之刀尖121(圖9)與輔助線AL1(圖4)在交叉點PA1交叉為開端,開始形成劃線SL1。藉此,無需為了確保劃線SL1之形成開端而對刀尖121施加較大之衝擊。因此,可一面抑制對刀尖121之損傷,一面自母基板4之與邊緣離開之位置(交叉點PA1)開始形成劃線SL1。 According to this embodiment, the sliding blade point 121 (FIG. 9) and the auxiliary line AL1 (FIG. 4) intersect at the intersection PA1 as an opening, and the scribe line SL1 is formed. Thereby, it is not necessary to apply a large impact to the blade tip 121 in order to secure the start of the scribe line SL1. Therefore, the scribe line SL1 can be formed from the position (crossing point PA1) where the edge of the mother substrate 4 is separated from the edge of the mother substrate 4 while suppressing damage to the blade tip 121.

又,當形成輔助線AL1(圖2)時,自邊D2上之起點PL1對母基板4之表面進行劃線。藉此,能夠以邊D2為開端開始形成輔助線AL1。又,當自邊D2對母基板4之表面進行劃線時,使刀尖121(圖9)於母基板4之表面上滑動。一般而言,不易獲得將滑動之刀尖121切入母基板4之表面之開端,但於母基板4之邊D2上即邊緣上,易於將滑動之刀尖121切入母基板4中。因此,即便使用滑動之刀尖121,亦可容易地開始形成輔助線AL1。 When the auxiliary line AL1 (FIG. 2) is formed, the surface of the mother substrate 4 is scribed from the starting point PL1 on the side D2. Thereby, the auxiliary line AL1 can be formed starting from the side D2. When the surface of the mother substrate 4 is scribed from the side D2, the blade tip 121 (FIG. 9) is caused to slide on the surface of the mother substrate 4. Generally speaking, it is not easy to obtain the beginning of cutting the sliding blade point 121 into the surface of the mother substrate 4, but it is easy to cut the sliding blade point 121 into the mother substrate 4 on the edge D2 of the mother substrate 4, that is, on the edge. Therefore, even if the sliding blade point 121 is used, the auxiliary line AL1 can be easily formed.

又,以刀尖121與劃線SL1(圖7)在交叉點PS2交叉為開端,開始形成劃線SL2。藉此,劃線SL1被用作確保劃線SL2之形成開端之輔助線。因此,與另行形成輔助線之情形相比,可簡化步驟。 Further, starting from the intersection of the blade edge 121 and the scribe line SL1 (FIG. 7) at the intersection PS2, the scribe line SL2 is formed. Thereby, the scribe line SL1 is used as an auxiliary line for ensuring the start of the formation of the scribe line SL2. Therefore, the steps can be simplified as compared with a case where an auxiliary line is separately formed.

(實施形態2) (Embodiment 2)

參照圖10,本實施形態係於實施形態1中形成劃線SL1時(圖3及圖4),使用劃線頭30。將劃線頭30與使劃線頭30對於母基板4相對移位之機構(於圖10中未圖示)一同地裝入至劃線裝置而使用。 Referring to FIG. 10, when the scribe line SL1 is formed in the first embodiment (FIG. 3 and FIG. 4), the scribe head 30 is used in this embodiment. The scribing head 30 and a mechanism (not shown in FIG. 10) for relatively displacing the scribing head 30 with respect to the mother substrate 4 are installed in a scribing device and used.

劃線頭30包括主體部110、切刀120(圖9)、及負荷部130。切刀120係安裝於主體部110。切刀120因來自主體部110之作用,而以力F被壓抵於母基板4之表面。主體部110可圍繞支點AX旋動地受到支持。負荷部130能夠以對母基板4之表面上壓抵切刀120之方式對主體部110施加連續之力LD。負荷部130包括用以產生力LD之缸131、及用 以傳遞力之按壓銷132。 The scribe head 30 includes a main body portion 110, a cutter 120 (FIG. 9), and a load portion 130. The cutter 120 is attached to the main body portion 110. The cutter 120 is pressed against the surface of the mother substrate 4 with a force F due to the action from the main body portion 110. The main body portion 110 is rotatably supported around the fulcrum AX. The load portion 130 can apply a continuous force LD to the main body portion 110 so as to press the cutting blade 120 against the surface of the mother substrate 4. The load part 130 includes a cylinder 131 for generating a force LD, and The pin 132 is pressed with a force transmission.

藉由利用缸131對主體部110施加連續之力LD,而將切刀120之刀尖121以力F朝向母基板4之表面上壓抵。藉由於施加力F之狀態下使劃線頭30朝方向DR2移動,而使刀尖121於母基板4之表面上移動。方向DR2係沿著自支點AX朝向刀尖121之方向。由此,使刀尖121在母基板4之表面上之移動以支點AX位於刀尖121之後側之方式進行。 By applying a continuous force LD to the main body portion 110 with the cylinder 131, the blade tip 121 of the cutter 120 is pressed against the surface of the mother substrate 4 with a force F. By moving the scribing head 30 in the direction DR2 under the state of applying the force F, the blade tip 121 is moved on the surface of the mother substrate 4. The direction DR2 is along the direction from the fulcrum AX toward the blade tip 121. Thereby, the movement of the blade edge 121 on the surface of the mother substrate 4 is performed so that the fulcrum AX is located behind the blade edge 121.

再者,上述以外之構成係與上述實施形態1之構成大致相同,因此,對同一或對應之要素標註同一符號,且不重複進行其之說明。 In addition, the configuration other than the above is substantially the same as the configuration of the first embodiment. Therefore, the same or corresponding elements are denoted by the same reference numerals, and descriptions thereof will not be repeated.

根據本實施形態,可藉由主體部110之旋動運動而將負荷傳遞至刀尖121。又,當刀尖121於母基板4之表面上移動時,支點AX位於刀尖121之後側。藉此,於劃線SL1之形成中,切刀120易於切入母基板4中。因此,可於交叉點PA1(圖4)更確實地獲得開始形成劃線SL1之開端。因此,可更確實地形成劃線SL1。 According to this embodiment, the load can be transmitted to the blade tip 121 by the rotational movement of the main body portion 110. When the tool tip 121 moves on the surface of the mother substrate 4, the fulcrum AX is located behind the tool tip 121. Thereby, in the formation of the scribe line SL1, the cutter 120 is easily cut into the mother substrate 4. Therefore, the beginning of the formation of the scribe line SL1 can be obtained more surely at the intersection PA1 (FIG. 4). Therefore, the scribe line SL1 can be formed more reliably.

(實施形態3) (Embodiment 3)

圖11~圖17係依序表示本實施形態中之劃線方法之步驟之俯視圖。 11 to 17 are top views sequentially showing steps of the scribing method in this embodiment.

參照圖11,準備母基板4(圖1:步驟S10)。藉由刀尖121(圖9)而自邊D2朝與邊D1平行之方向DR1對母基板4之表面劃線至終點PE1。終點PE1係與母基板4之表面之邊緣離開。藉此,自與邊D1離開且位於邊D2上之起點PL1朝方向DR1形成輔助線AL1v(第1輔助線)(圖1:步驟S20)。輔助線AL1係以與邊D1之間局部地夾著母基板4之表面之方式(圖中以夾著母基板4之左上部分之方式)而形成。於本實施形態中,輔助線AL1係與邊D1平行地延伸。 11, a mother substrate 4 is prepared (FIG. 1: step S10). The surface of the mother substrate 4 is drawn from the edge D2 to the direction DR1 parallel to the edge D1 by the knife edge 121 (FIG. 9) to the end point PE1. The end point PE1 is separated from the edge of the surface of the mother substrate 4. Thereby, the auxiliary line AL1v (the first auxiliary line) is formed in the direction DR1 from the starting point PL1 which is separated from the side D1 and located on the side D2 (FIG. 1: Step S20). The auxiliary line AL1 is formed by partially sandwiching the surface of the mother substrate 4 with the side D1 (in the figure, the upper left portion of the mother substrate 4 is sandwiched). In this embodiment, the auxiliary line AL1 extends parallel to the side D1.

參照圖12,將與母基板4離開之刀尖121(圖9)壓抵於母基板4之表面上之接觸點PP1(圖1:步驟S30)。接觸點PP1係母基板4之與邊緣離開且邊D1與輔助線AL1v之間。此處,所謂「邊D1與輔助線AL1v之 間」係指夾於邊D1及輔助線AL1v之間且與邊D1及輔助線AL1v各者離開之位置。於本實施形態中,該刀尖121係與用以形成輔助線AL1v之刀尖同一或同樣者。繼而,使壓抵於母基板4之表面上之刀尖121在與輔助線AL1v於交叉點PA1交叉並延伸至終點PE2之軌道TJ1v(第1軌道)上,朝與邊D2平行之方向DR2滑動(圖1:步驟S40)。終點PE2係與母基板4之表面之邊緣離開。 Referring to FIG. 12, the blade tip 121 (FIG. 9) separated from the mother substrate 4 is pressed against the contact point PP1 on the surface of the mother substrate 4 (FIG. 1: step S30). The contact point PP1 is separated from the edge of the mother substrate 4 and between the edge D1 and the auxiliary line AL1v. Here, the so-called "edge D1 and auxiliary line AL1v "Between" means a position sandwiched between the side D1 and the auxiliary line AL1v and away from each of the side D1 and the auxiliary line AL1v. In this embodiment, the cutting edge 121 is the same as or the same as the cutting edge used to form the auxiliary line AL1v. Then, the blade tip 121 pressed on the surface of the mother substrate 4 is caused to slide on the track TJ1v (the first track) that crosses the auxiliary line AL1v at the intersection PA1 and extends to the end point PE2, and is directed to the direction DR2 parallel to the side D2 (Figure 1: Step S40). The end point PE2 is separated from the edge of the surface of the mother substrate 4.

參照圖13,以刀尖121與輔助線AL1v交叉為開端,開始形成劃線SL1v(第1劃線)。具體而言,於自接觸點PP1至交叉點PA1為止之區間NL1在母基板4之表面滑行之刀尖121於交叉點PA1扣入輔助線AL1v之裂紋,藉此,以交叉點PA1為起點開始形成劃線SL1v。 Referring to FIG. 13, starting at the intersection of the blade point 121 and the auxiliary line AL1v, a scribe line SL1v (first scribe line) is formed. Specifically, the blade tip 121 sliding on the surface of the mother substrate 4 from the contact point PP1 to the intersection point PA1 is snapped into the crack of the auxiliary line AL1v at the intersection point PA1, thereby starting from the intersection point PA1. A scribe line SL1v is formed.

參照圖14,於劃線SL1v與邊D4之間形成與劃線SL1v並行之劃線SL1va~SL1vd。劃線SL1va~SL1vd之形成方法係與劃線SL1v之形成方法相同。 Referring to FIG. 14, scribe lines SL1va to SL1vd are formed between the scribe line SL1v and the side D4 in parallel with the scribe line SL1v. The method for forming the scribe lines SL1va to SL1vd is the same as the method for forming the scribe lines SL1v.

參照圖15,將與母基板4離開之刀尖121(圖9)壓抵於母基板4之表面上之接觸點PP2(圖1:步驟S50)。接觸點PP2係母基板4之與邊緣離開且邊D2與劃線SL1v之間。此處,所謂「邊D2與劃線SL1v之間」係指夾於邊D2及劃線SL1v且與邊D2及劃線SL1v各者離開之位置。於本實施形態中,該刀尖121係與用以形成輔助線AL1v之刀尖同一或同樣者。繼而,使壓抵於母基板4之表面上之刀尖121在與劃線SL1v於交叉點PS2交叉並延伸至終點PE3之軌道TJ2v(第2軌道)上,與邊D1平行地滑動(圖1:步驟S60)。終點PE3係與母基板4之表面之邊緣離開。 Referring to FIG. 15, the blade tip 121 (FIG. 9) separated from the mother substrate 4 is pressed against the contact point PP2 on the surface of the mother substrate 4 (FIG. 1: step S50). The contact point PP2 is separated from the edge of the mother substrate 4 and is between the edge D2 and the scribe line SL1v. Here, the "between the edge D2 and the scribe line SL1v" means a position sandwiched between the edge D2 and the scribe line SL1v and separated from each of the edge D2 and the scribe line SL1v. In this embodiment, the cutting edge 121 is the same as or the same as the cutting edge used to form the auxiliary line AL1v. Then, the blade tip 121 pressed against the surface of the mother substrate 4 is slid in parallel with the side D1 on the track TJ2v (second track) crossing the scribe line SL1v at the intersection PS2 and extending to the end point PE3 (FIG. 1) : Step S60). The end point PE3 is separated from the edge of the surface of the mother substrate 4.

參照圖16,以刀尖121與劃線SL1v交叉為開端,開始形成劃線SL2v(第2劃線)。具體而言,於接觸點PP2至交叉點PS2為止之區間NL2在母基板4之表面上滑行之刀尖121於交叉點PS2扣入劃線SL1v之裂紋,藉此,以交叉點PS2為起點開始形成劃線SL2v。 Referring to FIG. 16, starting from the intersection of the blade point 121 and the scribe line SL1v, a scribe line SL2v (second scribe line) is started. Specifically, the blade tip 121 sliding on the surface of the mother substrate 4 from the contact point PP2 to the intersection point PS2 snaps into the crack SL1v at the intersection point PS2, thereby starting from the intersection point PS2 A scribe line SL2v is formed.

參照圖17,於劃線SL2v與邊D3之間形成與劃線SL2v並行之劃線 SL2va及SL2vb。劃線SL2va及SL2vb之形成方法係與劃線SL2v之形成方法相同。 Referring to FIG. 17, a scribe line parallel to the scribe line SL2v is formed between the scribe line SL2v and the edge D3. SL2va and SL2vb. The formation method of the scribe lines SL2va and SL2vb is the same as the formation method of the scribe lines SL2v.

利用以上方式,藉由與邊D2平行地並行之劃線SL1v及SL1va~SL1vd、及與邊D1平行地並行之輔助線AL1v、劃線SL2v、SL2va及SL2vb,劃分出成為單位基板U1~U12之部分。繼而,將母基板4搬送至分斷裝置(未圖示)。繼而,進行母基板4之分斷步驟。藉此,獲得相互分離之單位基板U1~U12。 In the above manner, the scribe lines SL1v and SL1va ~ SL1vd parallel to the side D2 and the auxiliary lines AL1v, scribe lines SL2v, SL2va, and SL2vb parallel to the side D1 are divided into unit substrates U1 to U12. section. Then, the mother substrate 4 is transferred to a breaking device (not shown). Then, the breaking step of the mother substrate 4 is performed. Thereby, the unit substrates U1 to U12 separated from each other are obtained.

再者,上述以外之構成係與上述實施形態1或2之構成大致相同,因此,對同一或對應之要素標註同一符號,且不重複進行其之說明。 In addition, the configuration other than the above is substantially the same as the configuration of the first or second embodiment. Therefore, the same or corresponding elements are denoted by the same reference numerals, and descriptions thereof will not be repeated.

根據本實施形態,於劃線結束之時間點,母基板4之表面之邊緣如圖17所示地排列成行。具體而言,未被劃線分開之區域係沿著邊緣自邊D1依序經由邊D4及邊D3連續地延伸至邊D2。藉此,可抑制於劃線後且分斷前之母基板4之搬送過程中母基板4意外地分離成複數個部分。 According to this embodiment, at the time point when the scribe is finished, the edges of the surface of the mother substrate 4 are arranged in a row as shown in FIG. 17. Specifically, the area not divided by the scribe line extends along the edge from edge D1 to edge D2 in sequence through edge D4 and edge D3. This can prevent the mother substrate 4 from being accidentally separated into a plurality of portions during the transportation of the mother substrate 4 after the scribing and before the cutting.

(實施形態4) (Embodiment 4)

圖18係概略地表示本實施形態中之劃線方法之流程圖。於本實施形態中,首先進行與實施形態1之圖2~圖5相同之步驟(與圖1之步驟S10~S40相同之步驟)。以下,對此後之步驟進行說明。 FIG. 18 is a flowchart schematically showing a scribing method in this embodiment. In this embodiment, first, the same steps as those in FIGS. 2 to 5 of the first embodiment (the same steps as steps S10 to S40 in FIG. 1) are performed. The following steps will be described below.

參照圖19,藉由自邊D1對母基板4之表面進行劃線,而形成以夾於邊D2與劃線SL1之間之方式延伸之輔助線AL2(第2輔助線)(圖18:步驟S52)。 Referring to FIG. 19, by scoring the surface of the mother substrate 4 from the side D1, an auxiliary line AL2 (second auxiliary line) extending to be sandwiched between the side D2 and the scribe line SL1 is formed (FIG. 18: Step S52).

參照圖20,將與母基板4離開之刀尖121(圖9)壓抵於母基板4之表面上之接觸點PP2(圖18:步驟S54)。接觸點PP2係母基板4之與邊緣離開且邊D2與輔助線AL2之間。此處,所謂「邊D2與輔助線AL2之間」係指夾於邊D2及輔助線AL2之間且與邊D2及輔助線AL2各者離開之位 置。於本實施形態中,該刀尖121係與用以形成輔助線AL1之刀尖同一或同樣者。繼而,使壓抵於母基板4之表面上之刀尖121在依序與輔助線AL2及劃線SL1交叉之軌道TJ2(第2軌道)上滑動(圖18:步驟S62)。 Referring to FIG. 20, the blade tip 121 (FIG. 9) separated from the mother substrate 4 is pressed against the contact point PP2 on the surface of the mother substrate 4 (FIG. 18: step S54). The contact point PP2 is separated from the edge of the mother substrate 4 and between the edge D2 and the auxiliary line AL2. Here, the term "between the edge D2 and the auxiliary line AL2" refers to a position sandwiched between the side D2 and the auxiliary line AL2 and separated from each of the side D2 and the auxiliary line AL2. Home. In this embodiment, the cutting edge 121 is the same as or the same as the cutting edge used to form the auxiliary line AL1. Then, the blade tip 121 pressed against the surface of the mother substrate 4 is slid on the track TJ2 (second track) which sequentially crosses the auxiliary line AL2 and the scribe line SL1 (FIG. 18: Step S62).

參照圖21,以刀尖121與輔助線AL2交叉為開端,開始形成劃線SL2(第2劃線)。具體而言,於自接觸點PP2至交叉點PA2為止之區間NL2在母基板4之表面滑行之刀尖121於交叉點PA2扣入輔助線AL2之裂紋,藉此,以交叉點PA2為起點,開始形成劃線SL2。 21, starting from the intersection of the blade point 121 and the auxiliary line AL2, a scribe line SL2 (second scribe line) is started. Specifically, the blade tip 121 sliding on the surface of the mother substrate 4 from the contact point PP2 to the intersection point PA2 is buckled into the crack of the auxiliary line AL2 at the intersection point PA2, thereby taking the intersection point PA2 as a starting point, The formation of the scribe line SL2 begins.

參照圖22,於劃線SL2與邊D3之間形成與劃線SL2並行之劃線SL2a及SL2b。劃線SL2a及SL2b之形成方法係與劃線SL2之形成方法相同。 22, scribe lines SL2a and SL2b are formed between the scribe line SL2 and the side D3 in parallel with the scribe line SL2. The formation method of the scribe lines SL2a and SL2b is the same as the formation method of the scribe lines SL2.

利用以上方式,藉由與邊D2平行地並行之劃線SL1及SL1a~SL1d、及與邊D1平行地並行之輔助線AL1、劃線SL2、SL2a及SL2b,而劃分作為單位基板U1~U12之部分。繼而,將母基板4搬送至分斷裝置(未圖示)。繼而,進行母基板4之分斷步驟。藉此,獲得相互分離之單位基板U1~U12。 In the above manner, the scribe lines SL1 and SL1a to SL1d parallel to the side D2 and the auxiliary lines AL1, scribe lines SL2, SL2a, and SL2b parallel to the side D1 are divided into the unit substrates U1 to U12. section. Then, the mother substrate 4 is transferred to a breaking device (not shown). Then, the breaking step of the mother substrate 4 is performed. Thereby, the unit substrates U1 to U12 separated from each other are obtained.

根據本實施形態,利用輔助線AL2(圖21)而開始形成之劃線SL2於因伸展而穩定化後,與劃線SL1交叉。由此,可於劃線SL1之附近穩定地形成劃線SL2。 According to this embodiment, the scribe line SL2 started to be formed using the auxiliary line AL2 (FIG. 21) crosses the scribe line SL1 after being stabilized by stretching. Thereby, the scribe line SL2 can be stably formed in the vicinity of the scribe line SL1.

再者,本發明可於其發明範圍內自由地組合各實施形態,或將各實施形態適當地變化、省略。例如,於上述各實施形態中,輔助線AL1係自母基板4之邊D2上之起點PL1(圖2)形成,但亦可自與邊D2離開之起點形成。又,亦可取代圖9所示地藉由一面靜置母基板4一面使刀尖121移動進行劃線,而以於母基板4與刀尖121之間產生與其等效之相對移動之方式,一面使刀尖121靜止一面使母基板4移動,或者使兩者進行移動。又,母基板4係由玻璃製成,但亦可由其他脆性材料 製成。又,用以形成輔助線AL1(圖2)之劃線亦可藉由輪狀刀尖之轉動而進行,取代刀尖121在母基板4之表面上之滑動(圖9)。關於輔助線AL2(圖19)亦情形相同。 In addition, the present invention can freely combine various embodiments within the scope of the invention, or appropriately change or omit each embodiment. For example, in each of the above embodiments, the auxiliary line AL1 is formed from the starting point PL1 (FIG. 2) on the side D2 of the mother substrate 4, but may be formed from the starting point away from the side D2. In addition, instead of moving the knife edge 121 while standing the mother substrate 4 as shown in FIG. 9 to perform scribing, a relative equivalent movement between the mother substrate 4 and the knife edge 121 may be generated. The mother substrate 4 is moved while the blade tip 121 is stationary, or both are moved. The mother substrate 4 is made of glass, but may be made of other brittle materials. production. In addition, the scribe line for forming the auxiliary line AL1 (FIG. 2) can also be performed by turning the wheel-shaped blade tip instead of sliding the blade tip 121 on the surface of the mother substrate 4 (FIG. 9). The same applies to the auxiliary line AL2 (FIG. 19).

Claims (5)

一種劃線方法,其包括如下步驟:準備設置有由具有由第1及第2邊構成之角之邊緣包圍之表面之基板;藉由對上述基板之上述表面進行劃線,而以與上述第1邊之間局部地夾著上述基板之上述表面之方式形成第1輔助線;將自上述基板離開之刀尖壓抵於上述基板之上述表面上之自上述邊緣離開且位於上述第1邊與上述第1輔助線之間之位置;及使壓抵於上述基板之上述表面上之上述刀尖在與上述第1輔助線交叉之第1軌道上滑動;且以上述刀尖與上述第1輔助線交叉為開端,開始形成第1劃線。A scribing method includes the steps of preparing a substrate provided with a surface surrounded by edges having corners composed of first and second sides; and by scribing the surface of the substrate, the surface is aligned with the first The first auxiliary line is formed in such a manner that the surface of the substrate is sandwiched between one side; the blade tip separated from the substrate is pressed against the surface of the substrate and separated from the edge and located on the first side and The position between the first auxiliary line; and the blade tip pressed against the surface of the substrate slides on a first track that intersects the first auxiliary line; and the blade tip and the first auxiliary The line crosses at the beginning and begins to form the first scribe line. 如請求項1之劃線方法,其中形成上述第1輔助線之步驟包含自上述第2邊對上述基板之上述表面進行劃線之步驟。For example, the scribe method of item 1, wherein the step of forming the first auxiliary line includes a step of scribe the surface of the substrate from the second side. 如請求項2之劃線方法,其中自上述第2邊對上述基板之上述表面進行劃線之步驟包含使刀尖於上述基板之上述表面上滑動之步驟。For example, the scribing method of claim 2, wherein the step of scribing the surface of the substrate from the second side includes a step of sliding a knife edge on the surface of the substrate. 如請求項1至3中任一項之劃線方法,其進而包括如下步驟:將自上述基板離開之刀尖壓抵於上述基板之上述表面上之自上述邊緣離開且位於上述第2邊與上述第1劃線之間之位置;及使壓抵於上述基板之上述表面上之上述刀尖在與上述第1劃線交叉之第2軌道上滑動;且以上述刀尖與上述第1劃線交叉為開端,開始形成第2劃線。The scribing method according to any one of claims 1 to 3, further comprising the step of: pressing a blade tip separated from the substrate against the surface of the substrate and leaving from the edge and located on the second side and The position between the first scribe line; and the blade tip pressed against the surface of the substrate slides on a second track crossing the first scribe line; and the blade tip and the first scribe The line crosses at the beginning and begins to form a second scribe line. 如請求項1至3中任一項之劃線方法,其包括如下步驟:藉由自上述第1邊對上述基板之上述表面進行劃線,而形成以夾於上述第2邊與上述第1劃線之間之方式延伸之第2輔助線;將自上述基板離開之刀尖壓抵於上述基板之上述表面上之自上述邊緣離開且位於上述第2邊與上述第2輔助線之間之位置;及使壓抵於上述基板之上述表面上之刀尖在依序與上述第2輔助線及上述第1劃線交叉之第2軌道上滑動;且以上述刀尖與上述第2輔助線交叉為開端,開始形成第2劃線。The scribing method according to any one of claims 1 to 3, which includes the following steps: by scribing the surface of the substrate from the first side to form a sandwich between the second side and the first The second auxiliary line extending between the scribe lines; pressing the blade tip separated from the substrate against the surface of the substrate from the edge and located between the second side and the second auxiliary line Position; and the blade tip pressed against the surface of the substrate slides on the second track which sequentially intersects the second auxiliary line and the first scribe line; and the blade tip and the second auxiliary line The cross is the beginning, and a second scribe line begins to form.
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