JP2017149079A - Method for segmenting brittle substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily segment a brittle substrate with high quality while applying a crackless scribing technology when an intersection exists between scheduled segmentation lines.SOLUTION: A second scheduled segmentation line BL2 has an intermediate portion BL2m where an intersection CR with a first scheduled segmentation line BL1 exists, one portion BL2a and the other portion BL2b. A first trench line TL1 and a first crack line CL1 include a portion along one portion BL1a of the first scheduled segmentation line BL and the other portion BL1b. A second trench line TL2 is formed by movement of a blade tip 51 to a direction toward the intersection CR along the one portion BL2a of the second scheduled segmentation line BL2. The second crack line CL2 is formed by inversion of the movement direction of the blade tip 51. The blade tip 51 is separated from a brittle substrate 4. A third trench line TL3 is formed. Then, a third crack line CL3 is formed.SELECTED DRAWING: Figure 22

Description

  The present invention relates to a method for dividing a brittle substrate, and more particularly, to a method for dividing a brittle substrate using sliding of a blade edge.

  In the manufacture of electrical equipment such as flat display panels or solar cell panels, it is often necessary to break a brittle substrate such as a glass plate. In the present specification, a virtual line corresponding to a position to be divided in the brittle substrate is referred to as a “partition scheduled line”. In a typical cutting method, a crack line is formed on a brittle substrate along a line to be cut. In the present specification, the term “crack line” means that a crack partially progressing in the thickness direction of the brittle substrate extends in a line shape on the surface of the brittle substrate. Next, a so-called break process is performed. Specifically, by applying a stress to the brittle substrate, the cracks in the crack line are completely advanced in the thickness direction. Thereby, a brittle board | substrate is parted along the parting plan line.

  In Patent Document 1, it is recognized that when there is an intersection between division planned lines, the quality of the division can be lowered at this intersection. For this reason, in the technique of Patent Document 1, it is proposed that when there is an intersection between lines to be divided, consideration is given so that no intersection between crack lines is formed. In the technique of Patent Document 1, a crack line is formed on a glass plate by scribing using a cutter wheel. By rolling the cutter wheel on the upper surface of the glass plate, a line due to plastic deformation is formed on the upper surface of the glass plate. In this specification, a line resulting from such plastic deformation is referred to as a “trench line”. In the technique of Patent Document 1, a crack line is formed at the same time as the trench line is formed. As a method of forming a crack line, in addition to a method of rolling a cutter wheel as in Patent Document 1, a method of sliding a blade edge is widely used. Also in this case, typically, a crack line is formed at the same time as the trench line is formed. As described above, in the cutting technique that involves the formation of crack lines, typically, trench lines and crack lines are formed simultaneously.

  According to Patent Document 2, a cutting technique significantly different from the above-described typical cutting technique is proposed. According to this technique, first, a trench line without a crack line is formed by sliding the blade edge. Then, the crack line is formed by inducing the extension of the crack along the trench line. In this specification, a technique that actively uses a trench line without cracks is referred to as a “crackless scribing technique”. The trench line formed in the crackless scribing technique can be formed by sliding the blade edge at a lower load than a typical scribe line with simultaneous formation of cracks. If the load is small, the damage applied to the cutting edge is also small. Therefore, according to this cutting technique, the life of the cutting edge can be extended.

International Publication No. 2004/039549 International Publication No. 2015/151755

  In the crackless scribing technique, after forming a trench line, it is necessary to form a crack line along the trench line. In order to start forming the crack line, it is necessary to give the brittle substrate an opportunity to release the internal stress generated in the brittle substrate due to the formation of the trench line. Regarding the method of giving this trigger, various methods have been proposed in Patent Document 2. However, in Patent Document 2, a method that is particularly suitable in the case where there are intersections between the planned dividing lines has not been sufficiently disclosed. According to the inventor's study, in the case where there is an intersection between the splitting lines, simply applying the technique of Patent Document 2 makes the process for starting to form a crack line complicated, In some cases, the division quality is lowered at the intersection, or the yield of division is reduced due to failure to start forming crack lines.

  The present invention has been made in order to solve the above-described problems, and the object thereof is to easily and easily form a brittle substrate while applying a crackless scribing technique when there is an intersection between lines to be divided. It is an object to provide a method for dividing a brittle substrate, which can be divided with high quality.

A method for dividing a brittle substrate according to one aspect of the present invention is to divide a brittle substrate along a first division line and a second division line that intersects the first division line,
a) a step of forming a first scribe line on one surface of the brittle substrate, wherein the first scribe line includes a first trench line having a groove shape and a crack in the brittle substrate in the thickness direction; A first crack line configured to extend along one trench line, and the first parting line is an intermediate part in which an intersection with the second parting line exists, and an intermediate part And the first scribe line includes a portion along one portion and the other portion of the first scheduled cutting line, and
b) including a step of forming a second scribe line on one surface of the brittle substrate, wherein the second scribe line includes a second trench line having a groove shape and a crack in the brittle substrate in the thickness direction. A second crack line formed by extending along the two trench lines, and the second parting line is an intermediate part in which an intersection with the first parting line exists, and an intermediate part And the second scribe line is disposed along one part of the second scheduled cutting line, and step b) includes:
b1) On one surface of the brittle substrate, the second trench line is plastically deformed on one surface of the brittle substrate by moving the cutting edge in the direction toward the intersection along one portion of the second parting line. The second trench line is formed in a crackless state in which the brittle substrate is continuously connected in the direction intersecting the second trench line below the second trench line. And b2) after step b1), by reversing the direction in which the cutting edge moves, by extending the cracks of the brittle substrate in the thickness direction along the second trench line, the second Forming a crack line, the brittle substrate intersecting the second trench line below the second trench line by the second crack line. The continuous connection is broken in the direction
c) After the step b), comprising a step of separating the blade edge from the brittle substrate,
d) After the step c), the method includes a step of forming a third scribe line on one surface of the brittle substrate, and the third scribe line includes a third trench line having a groove shape and a thickness direction. And a third crack line formed by extending a crack of the brittle substrate along the third trench line, and the third scribe line is disposed along the other part of the second scheduled cutting line. And step d)
d1) On the one surface of the brittle substrate, the third trench line is plastically deformed on the one surface of the brittle substrate by moving the blade edge in the direction away from the intersection along the other part of the second parting line on the one surface of the brittle substrate In the third trench line, a crackless state is obtained in which the brittle substrate is continuously connected in the direction intersecting the third trench line below the third trench line. Further comprising, after d2) step d1), forming a third crack line by extending cracks of the brittle substrate in the thickness direction along the third trench line, The brittle substrate under the third trench line is connected continuously in the direction intersecting the third trench line by the crack line of Has been refused,
e) After the step a) and after the step d), the method includes a step of cutting the brittle substrate along the first planned cutting line and the second planned cutting line.

A method for dividing a brittle substrate according to another aspect of the present invention is to divide a brittle substrate along a first division line and a second division line that intersects the first division line,
a) a step of forming a first scribe line on one surface of the brittle substrate, wherein the first scribe line includes a first trench line having a groove shape and a crack in the brittle substrate in the thickness direction; A first crack line configured to extend along one trench line, and the first parting line is an intermediate part in which an intersection with the second parting line exists, and an intermediate part And the first scribe line includes a portion along one portion and the other portion of the first scheduled cutting line, and
b) including a step of forming a second scribe line on one surface of the brittle substrate, wherein the second scribe line includes a second trench line having a groove shape and a crack in the brittle substrate in the thickness direction. A second crack line formed by extending along the two trench lines, and the second parting line is an intermediate part in which an intersection with the first parting line exists, and an intermediate part And the second scribe line is disposed along one part of the second scheduled cutting line, and step b) includes:
b1) On one surface of the brittle substrate, the second trench line is plastically deformed on one surface of the brittle substrate by moving the cutting edge in the direction toward the intersection along one portion of the second parting line. The second trench line is formed in a crackless state in which the brittle substrate is continuously connected in the direction intersecting the second trench line below the second trench line. And b2) after step b1), by reversing the direction in which the cutting edge moves, by extending the cracks of the brittle substrate in the thickness direction along the second trench line, the second Forming a crack line, the brittle substrate intersecting the second trench line below the second trench line by the second crack line. The continuous connection is broken in the direction
c) After step b), the intermediate trench line is plastically deformed on one surface of the brittle substrate by moving the cutting edge along the middle portion of the second scheduled cutting line on one surface of the brittle substrate. Comprising the step of forming,
d) After the step c), the method includes a step of forming a third scribe line on one surface of the brittle substrate, and the third scribe line includes a third trench line having a groove shape and a thickness direction. And a third crack line formed by extending a crack of the brittle substrate along the third trench line, and the third scribe line is disposed along the other part of the second scheduled cutting line. And step d)
d1) On the one surface of the brittle substrate, the third trench line is plastically deformed on the one surface of the brittle substrate by moving the blade edge in the direction away from the intersection along the other part of the second parting line on the one surface of the brittle substrate In the third trench line, a crackless state is obtained in which the brittle substrate is continuously connected in the direction intersecting the third trench line below the third trench line. Further comprising, after d2) step d1), forming a third crack line by extending cracks of the brittle substrate in the thickness direction along the third trench line, The brittle substrate under the third trench line is connected continuously in the direction intersecting the third trench line by the crack line of Has been refused,
e) after step a) and after step d), comprising a step of cutting the brittle substrate along the first planned cutting line and the second planned cutting line;
In step c), the load applied to the blade edge is made smaller than the load applied to the blade edge in steps b1) and d1), so that the extension of cracks generated in step d2) is third. It stops at the boundary between the trench line and the intermediate trench line.

  According to the method for dividing a brittle substrate according to one aspect of the present invention, first, after the second trench line is formed along one portion of the second scheduled dividing line, and after the second scheduled dividing line. Before the third trench line is formed along the other part of the substrate, the cutting edge is separated from the brittle substrate. Thereby, it is possible to prevent a trench line from being formed along an intermediate portion of the second scheduled dividing line. Thereby, it is possible to prevent a trench line intersecting with the first scribe line from being formed. Therefore, it is possible to avoid the degradation of the division quality caused by the trench lines intersecting each other. Secondly, after the second trench line is formed in a crackless state, it is possible to give an opportunity to start the formation of the second crack line along the second trench line simply by reversing the direction in which the blade edge moves. Thereby, a 2nd crack line can be formed easily, applying a crackless scribing technique. From the above, in the case where there is an intersection between the lines to be divided, the brittle substrate can be divided easily and with high quality while applying the crackless scribing technique.

  According to the method for dividing a brittle substrate according to another aspect of the present invention, first, the extension of cracks generated in the step of forming the third scribe line is caused by the third trench line and the intermediate trench line. Stopped at the boundary. Thereby, it is possible to prevent the formation of a crack line along the intermediate trench line. In other words, it is possible to prevent the formation of a crack line along the middle portion of the second scheduled dividing line. Thereby, the crack line which cross | intersects a 1st scribe line can be prevented from being formed. Therefore, it is possible to avoid a decrease in the division quality caused by the crack lines crossing each other. Second, an intermediate trench line is formed along an intermediate portion of the second scheduled split line. Thereby, compared with the case where an intermediate trench line is not provided in an intermediate part among the 2nd division planned lines, the accuracy of the dividing position in an intermediate part can be raised. Thirdly, after the second trench line is formed in a crackless state, it is possible to give an opportunity to start the formation of the second crack line along the second trench line simply by reversing the direction in which the blade edge moves. Thereby, a 2nd crack line can be formed easily, applying a crackless scribing technique. From the above, in the case where there is an intersection between the lines to be divided, the brittle substrate can be divided easily and with high quality while applying the crackless scribing technique.

It is a top view which shows the example of the parting plan line in the parting method of the brittle board | substrate in each embodiment of this invention. It is a top view which shows the parting plan line in the parting method of a brittle board | substrate in each embodiment of this invention. It is a top view which shows the 1st division | segmentation planned line among the division | segmentation planned lines of FIG. It is a top view which shows the 2nd division | segmentation planned line among the division | segmentation planned lines of FIG. It is a flowchart which shows schematically the structure of the brittle board | substrate parting method in Embodiment 1 of this invention. It is a top view which shows roughly the 1st process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. FIG. 7 is a schematic end view taken along line VII-VII in FIG. 6. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. It is a top view which shows roughly the 4th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. FIG. 11 is a schematic end view taken along line XI-XI in FIG. 10. It is a top view which shows roughly the 5th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. FIG. 13 is a schematic end view taken along line XIII-XIII in FIG. 12. It is a top view which shows roughly the 6th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. It is a top view which shows roughly the 7th process of the cutting | disconnection method of a brittle board | substrate in Embodiment 1 of this invention. It is a top view which shows roughly the 8th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. FIG. 17 is a schematic end view taken along line XVII-XVII in FIG. 16. It is a top view which shows roughly the 9th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. FIG. 19 is a schematic end view taken along line XIX-XIX in FIG. 18. It is a top view which shows roughly the 10th process of the cutting | disconnection method of a brittle board | substrate in Embodiment 1 of this invention. It is a top view which shows roughly the 11th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. It is a top view which shows roughly the 12th process of the cutting method of a brittle board | substrate in Embodiment 1 of this invention. FIG. 23 is a schematic end view taken along line XXIII-XXIII in FIG. 22. It is a top view which shows 1 process of the cutting method of the brittle board | substrate of a comparative example. It is a top view which shows roughly the 1st process of the cutting method of the brittle board | substrate in Embodiment 2 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 2 of this invention. It is a top view which shows roughly the 1st process of the cutting method of the brittle board | substrate in Embodiment 3 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 3 of this invention. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 3 of this invention. It is a top view which shows roughly the 1st process of the cutting method of the brittle board | substrate in Embodiment 4 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 4 of this invention. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 4 of this invention. It is a top view which shows roughly the 4th process of the cutting method of a brittle board | substrate in Embodiment 4 of this invention. It is a top view which shows roughly 1 process of the modification of the cutting method of the brittle board | substrate in Embodiment 4 of this invention. It is a flowchart which shows schematically the structure of the cutting method of a brittle board | substrate in Embodiment 5 of this invention. It is a flowchart which shows schematically the structure of the brittle board | substrate parting method in Embodiment 6 of this invention. It is a top view which shows roughly the 1st process of the cutting method of a brittle board | substrate in Embodiment 6 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 6 of this invention. FIG. 39 is a schematic end view taken along line XXXIX-XXXIX in FIG. 38. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 6 of this invention. It is a top view which shows roughly the 4th process of the cutting method of a brittle board | substrate in Embodiment 6 of this invention. It is a top view which shows roughly the 5th process of the cutting method of a brittle board | substrate in Embodiment 6 of this invention. It is a top view which shows roughly the 6th process of the cutting method of the brittle board | substrate in Embodiment 6 of this invention. It is a top view which shows roughly 1 process of the cutting method of the brittle board | substrate in Embodiment 7 of this invention. It is a top view which shows roughly the 1st process of the cutting method of a brittle board | substrate in Embodiment 8 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 8 of this invention. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 8 of this invention. It is a top view which shows roughly 1 process of the cutting method of the brittle board | substrate in Embodiment 9 of this invention. It is a top view which shows roughly the 1st process of the cutting method of a brittle board | substrate in Embodiment 10 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 10 of this invention. It is a top view which shows roughly the 1st process of the cutting method of the brittle board | substrate in Embodiment 11 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 11 of this invention. It is a top view which shows roughly 1 process of the modification of the cutting method of a brittle board | substrate in Embodiment 11 of this invention. It is a flowchart which shows schematically the structure of the cutting method of a brittle board | substrate in Embodiment 12 of this invention. It is a side view which shows roughly the structure of the cutting instrument used for the cutting method of the brittle board | substrate in each embodiment of this invention. It is a schematic plan view in the viewpoint of the arrow LVI of FIG.

  Hereinafter, embodiments of the present invention and contents related thereto will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

<About the line to be divided>
FIG. 1 is a top view showing an example of a planned dividing line of a glass substrate 4 (brittle substrate) to be divided in each embodiment described later. The glass substrate has an upper surface SF1 (one surface) and a lower surface SF2 (not shown in FIG. 1) opposite to the upper surface SF1. In this example, four glass plates 90 positioned in 2 rows and 2 columns on the upper surface SF <b> 1 are cut out from the glass substrate 4. Each glass plate 90 is used as a part of an electric device such as a display device or a solar battery, for example. For this cutout, the glass substrate 4 is cut along a line to be cut on the upper surface SF1. In this example, the division planned line has four first division planned lines extending in the horizontal direction in the figure and four second planned division lines BL2 extending in the vertical direction in the figure. The first planned split line BL1 and the second planned split line BL2 cross each other at an intersection CR. As can be seen from FIG. 1, the number of each of the first scheduled split lines BL <b> 1 and the second scheduled split lines BL <b> 2 depends on the number and arrangement of the glass plates 90 cut out from the glass substrate 4.

  Referring to FIG. 2, in the following, in order to simplify the description, as a simpler example than FIG. 1, a case where each of the first scheduled dividing line BL <b> 1 and the second scheduled divided line BL <b> 2 is one. explain. The first planned split line BL1 and the second planned split line BL2 intersect each other at the intersection CR. A point CP1a and a point CP1b indicate positions on the first planned split line BL1, and an intersection CR is located between them. A point CP2a and a point CP2b indicate positions on the second scheduled split line BL2, and an intersection CR is located between them.

  Referring to FIG. 3, the first planned split line BL1 includes an intermediate part BL1m where an intersection CR with the second planned split line BL2 exists, one part BL1a and the other part BL1b separated from each other by the intermediate part BL1m. And have. The point CP1a corresponds to the boundary point between the one portion BL1a and the intermediate portion BL1m, and the point CP1b corresponds to the boundary point between the other portion BL1b and the intermediate portion BL1m. Referring to FIG. 4, the second planned split line BL2 includes an intermediate part BL2m where an intersection CR with the first planned split line BL1 exists, one part BL2a and the other part BL2b separated from each other by the intermediate part BL2m. And have. The point CP2a corresponds to the boundary point between the one part BL2a and the intermediate part BL2m, and the point CP2b corresponds to the boundary point between the other part BL2b and the intermediate part BL2m.

  Embodiments 1 to 12 will be described below as a method of dividing the glass substrate 4 along the first scheduled dividing line BL1 and the second scheduled divided line BL2 described with reference to FIGS.

<Embodiment 1>
FIG. 5 is a flowchart schematically showing the configuration of the glass substrate 4 dividing method according to the first embodiment. The method for dividing the glass substrate 4 in the present embodiment includes steps S10 to S50.

  First, in step S10 (step a)), a first scribe line is formed on the upper surface SF1 of the glass substrate 4. Specifically, the following steps are performed.

  Referring to FIG. 6, the blade edge 51 is moved along the first dividing line BL <b> 1 (FIG. 2) on the upper surface SF <b> 1 of the glass substrate 4 (see the arrow in the figure). Thereby, the first trench line TL1 is formed on the upper surface SF1 of the glass substrate 4 by plastic deformation. Referring to FIG. 7, first trench line TL <b> 1 has a groove shape like other trench lines described later. The first trench line TL1 is continuously connected in the direction DC in which the glass substrate 4 intersects the extending direction of the first trench line TL1 (lateral direction in FIG. 6) below the first trench line TL1. It is formed so that a crackless state which is a state can be obtained. In the crackless state, the first trench line TL1 is formed by plastic deformation, but no crack is formed along the first trench line TL1.

  In order to obtain a desired crackless state, the load applied to the blade edge 51 is so small that cracks do not occur at the time of forming the first trench line TL1, and cracks along the same can be generated in a later step. It is adjusted to be large enough to cause plastic deformation that creates a state of internal stress that can be generated. In order for such a load condition to exist, it is preferable that the movement of the blade edge 51 is sliding rather than rolling. In other words, the cutting edge 51 is preferably a fixed type rather than a wheel type. In addition, the specific example of a structure of the preferable blade edge 51 is mentioned later (refer FIG. 55 and FIG. 56). The first trench line TL1 is preferably generated only by plastic deformation of the glass substrate 4, and in this case, no scraping occurs on the upper surface SF1 of the glass substrate 4. In order to avoid cutting, the load on the blade edge 51 should not be excessively increased. By not scraping, it is possible to avoid undesirable fine fragments on the upper surface SF1. However, some shaving is usually acceptable.

  Note that the above-described characteristics of the first trench line TL1 in the crackless state similarly apply to other crackless state trench lines described later.

  Referring to FIG. 8, next, the direction in which the blade edge 51 moves is reversed (see the arrow in the figure). As a result of this inversion, a crack in the glass substrate 4 extends in the thickness direction DT (FIG. 7) along the first trench line TL1. Referring to FIG. 9, the first crack line CL1 is formed by the extension of the crack (see the arrow in the figure).

  Referring to FIG. 10 and FIG. 11, the first scribe line SL1 having the first trench line TL1 and the first crack line CL1 is formed by the above-described crack extension. The first crack line CL1 is configured by a crack in the glass substrate 4 extending in the thickness direction DT along the first trench line TL1. The continuous connection in the direction DC intersecting the first trench line TL1 is broken under the first trench line TL1 by the first crack line CL1. Here, “continuous connection” means a connection that is not interrupted by a crack. In addition, in the state where the continuous connection is cut as described above, the portions of the glass substrate 4 may be in contact with each other through the cracks of the first crack line CL1. Further, a slightly continuous connection may be left immediately below the first trench line TL1. Note that the above-described characteristics of the first trench line TL1 and the first crack line CL1 formed along the first trench line TL1 similarly apply to other trench lines and crack lines when the crackless scribing technique is applied. .

  As described above, the first scribe line SL1 is formed in step S10. In other words, the first scribe line SL1 is a crackless scribing technique for forming the first trench line TL1 in a crackless state and inducing the first crack line CL1 along the first trench line TL1. Is provided. The first scribe line SL1 includes a portion along one portion BL1a and the other portion BL1b (FIG. 3) of the first parting line BL1. Furthermore, in the present embodiment, the first scribe line SL1 also includes a portion along the middle portion BL1m of the first planned split line BL1.

  Next, in step S20 (step b)), a second scribe line is formed on the upper surface SF1 of the glass substrate 4. Specifically, the following steps are performed.

  Referring to FIG. 12, the blade edge 51 is moved in the direction toward the intersection CR along one portion BL2a (FIG. 4) of the second scheduled cutting line BL2 on the upper surface SF1 of the glass substrate 4 (in the drawing, the arrow reference). As a result, the second trench line TL2 is formed on the upper surface SF1 of the glass substrate 4 by plastic deformation. Referring to FIG. 13, the second trench line TL2 is formed so that a crackless state can be obtained as in the step of forming the first trench line TL1 (FIG. 7).

  Referring to FIG. 14, next, the direction in which the blade edge 51 moves is reversed (see the arrow in the figure). As a result of this inversion, a crack in the glass substrate 4 extends in the thickness direction DT (FIG. 13) along the second trench line TL2. Referring to FIG. 15, the second crack line CL2 is formed by the extension of the crack (see the arrow in the figure).

  Referring to FIGS. 16 and 17, the second scribe line SL <b> 2 having the second trench line TL <b> 2 and the second crack line CL <b> 2 is formed by the crack extension described above. The second crack line CL2 is configured by a crack in the glass substrate 4 in the thickness direction DT extending along the second trench line TL2. The continuous connection in the direction DC in which the glass substrate 4 intersects the second trench line TL2 is broken below the second trench line TL2 by the second crack line CL2.

  As described above, the second scribe line SL2 is formed in step S20. In other words, the second scribe line SL2 is a crackless scribing technique for forming the second trench line TL2 in a crackless state and inducing the second crack line CL2 along the second trench line TL2. Is provided. The second scribe line SL2 is disposed along one portion BL2a (FIG. 4) of the second scheduled split line BL2.

  In step S30 (step c)), the blade edge 51 is separated from the glass substrate 4 after step S20.

  Next, in step S40 (step d)), after step S30, a third scribe line is formed on the upper surface SF1 of the glass substrate 4. Specifically, the following steps are performed.

  Referring to FIG. 18, the blade edge 51 is moved on the upper surface SF <b> 1 of the glass substrate 4 along the other part BL <b> 2 b (FIG. 4) of the second scheduled cutting line BL <b> 2 in a direction away from the intersection CR. Thus, the third trench line TL3 is formed on the upper surface SF1 of the glass substrate 4 by plastic deformation. Referring to FIG. 19, third trench line TL <b> 3 is formed so as to obtain a crackless state, similarly to the formation process of first trench line TL <b> 1 (FIG. 7).

  Referring to FIG. 20, next, the direction in which the blade edge 51 moves is reversed (see arrows in the figure). As a result of this inversion, a crack in the glass substrate 4 extends in the thickness direction DT (FIG. 19) along the third trench line TL3. Referring to FIG. 21, the third crack line CL3 is formed by the extension of the crack (see the arrow in the figure).

  Referring to FIGS. 22 and 23, the third scribe line SL3 having the third trench line TL3 and the third crack line CL3 is formed by the extension of the crack described above. The third crack line CL3 is configured by a crack in the glass substrate 4 extending in the thickness direction DT along the third trench line TL3. The continuous connection in the direction DC intersecting the third trench line TL3 is broken under the third trench line TL3 by the third crack line CL3.

  As described above, the third scribe line SL3 is formed in step S40. In other words, the third scribe line SL3 is a crackless scribing technique for forming the third trench line TL3 in a crackless state and inducing the third crack line CL3 along the third trench line TL3. Is provided. The third scribe line SL3 is disposed along the other part BL2b (FIG. 4) of the second scheduled split line BL2.

  After steps S10 to S40, in step S50 (step e)), the glass substrate 4 is divided along the first scheduled dividing line BL1 and the second scheduled divided line BL2. That is, a so-called break process is performed. The breaking process can be performed by applying an external force to the glass substrate 4. For example, by pressing a stress applying member (for example, a member called “break bar”) on the lower surface SF2 toward the first scribe line SL1 on the upper surface SF1 of the glass substrate 4, the first crack line CL1. A stress that opens the crack is applied to the glass substrate 4. The breaking process along the second scribe line SL2 is performed in the same manner. If the crack line has completely progressed in the thickness direction DT at the time of formation, the formation of the crack line and the division of the glass substrate 4 occur simultaneously.

  FIG. 24 is a top view showing one step of the method for dividing the glass substrate 4 of the comparative example. In the present embodiment, the trigger for forming the second crack line CL2 (FIG. 15) is the reversal of the movement direction of the blade edge 51 (FIG. 14). On the other hand, in the present comparative example, the cutting edge 51 is triggered by the first scribe line SL1. This method can also provide an opportunity to start the formation of the second crack line CL2. However, according to the study of the present inventors, in the method of this comparative example, the probability that the second crack line CL2 is not formed may not be negligible. In particular, when the load applied to the blade edge 51 when forming the second trench line TL2 is equal to or less than the load applied to the blade edge 51 when forming the first trench line TL1, the second crack line The probability that CL2 was not formed increased. On the contrary, when the load applied to the blade edge 51 when the second trench line TL2 is formed is larger than the load applied to the blade edge 51 when the first trench line TL1 is formed, the second crack line CL2 is applied. The probability that no was formed could be suppressed to some extent. However, in this case, it was somewhat difficult to set the two types of loads appropriately. This is because the load range in which an appropriate crackless trench line can be formed is not so wide. The reason why the appropriate load range is not so wide is that if the edge load at the time of forming the trench line is too high, the crack line is formed at the same time. Conversely, if the edge load at the time of forming the trench line is too low, This is because induction is difficult. Therefore, in the crackless scribing technique, inducing the generation of a crack line without depending on an existing scribe line is considered to contribute to the stabilization of the process.

  According to the present embodiment, first, after the second trench line TL2 is formed along the one part BL2a of the second scheduled split line BL2 (FIG. 4), and after the second scheduled split line BL2 The blade edge 51 is separated from the glass substrate 4 before the third trench line TL3 is formed along the other portion BL2b. Thereby, it is possible to prevent a trench line from being formed along the intermediate portion BL2m of the second scheduled dividing line BL2. Thereby, it is possible to prevent a trench line intersecting with the first scribe line SL1 from being formed. Therefore, it is possible to avoid the degradation of the division quality caused by the trench lines intersecting each other. Secondly, after the second trench line TL2 is formed in a crackless state, the direction in which the blade edge 51 (FIG. 14) moves is only reversed as a trigger for forming the second crack line CL2 along the second trench line TL2. Can be given in Thereby, the second crack line CL2 can be easily formed while applying the crackless scribing technique. From the above, when there is an intersection between the planned dividing lines, the glass substrate 4 can be divided easily and with high quality while applying the crackless scribing technique.

  By reversing the direction in which the blade edge 51 (FIG. 20) moves, it is possible to give an opportunity to start the formation of the third crack line CL3 along the third trench line TL3. Thereby, the third crack line CL3 can be easily formed while applying the crackless scribing technique. Therefore, the glass substrate 4 can be more easily divided.

  The first scribe line SL1 includes a portion along the intermediate portion BL1m of the first parting line BL1 (FIG. 3). Thereby, compared with the case where 1st scribe line SL1 is not provided in intermediate | middle part BL1m among 1st division | segmentation plan lines BL1, the precision of the dividing position in intermediate | middle part BL1m can be improved.

  Step S10 includes a step of reversing the direction in which the blade edge 51 (FIG. 8) moves. This inversion can give an opportunity to start the formation of the first crack line CL1 along the first trench line TL1. Thereby, the first crack line CL1 can be easily formed while applying the crackless scribing technique. Therefore, the glass substrate 4 can be more easily divided.

  In the present embodiment, the case where the first scribe line SL1 is formed using the crackless scribing technique has been described. However, the first scribe line SL1 is formed using the conventional typical scribing technique. Also good. That is, the first trench line TL1 and the first crack line CL1 may be formed at the same time. Alternatively, the second and third scribe lines SL2 and SL3 may be formed after the first trench line TL1 is formed, and then the first crack line CL1 may be formed. The same applies to other embodiments described later.

<Embodiment 2>
Referring to FIG. 25, in the present embodiment, first scribe line SL1 is disengaged from intermediate portion BL1m (FIG. 3) of first division planned line BL1. In other words, the first scribe line SL1 is constituted by a portion along each of the one portion BL1a and the other portion BL1b (FIG. 3) of the first division line BL1. In addition, the formation method of each part may be based on a crackless scribing technique, or may be based on a conventional typical scribing technique.

  Referring to FIG. 26, next, as in the first embodiment, second scribe line SL2 and third scribe line SL3 are formed. Thereafter, the glass substrate 4 is divided as in the first embodiment.

  According to the present embodiment, the first scribe line SL1 is out of the middle portion BL1m of the first planned split line BL1. Thus, unlike the case where the first scribe line SL1 is provided in the intermediate portion BL1m of the first division planned line BL1, the first division planned line BL1 and the first division line BL1 are arranged immediately before the glass substrate 4 is divided. A region in which strength is ensured by the absence of a crack line is provided in the vicinity of the intersection with the second scheduled split line BL2. Therefore, it is suppressed that the glass substrate 4 will be divided unintentionally before a desired time.

<Embodiment 3>
First, the first scribe line SL1 and the second scribe line SL2 are formed by the same steps as those up to FIG. 16 in the first embodiment. Referring to FIG. 27, next, as in the step of FIG. 18 of the first embodiment, the third trench line TL3 starts to be formed.

  Referring to FIG. 28, in the present embodiment, cutting edge 51 cuts down edge ED of upper surface SF1 of glass substrate 4 (see the solid arrow in the figure). This cut-off provides an opportunity to start the formation of the third crack line CL3 along the third trench line TL3. As a result, a third crack line CL3 is formed (see the broken line arrow in the figure). Further, referring to FIG. 29, as a result, a third scribe line SL3 having a third trench line TL3 and a third crack line CL3 is formed as step S40 (FIG. 5) of the present embodiment.

  According to the present embodiment, the cutting edge 51 cuts down the edge ED of the upper surface SF1 of the glass substrate 4, thereby giving an opportunity to start the formation of the third crack line CL3 along the third trench line TL3. it can. Thereby, the third crack line CL3 can be easily formed while applying the crackless scribing technique. Therefore, the glass substrate 4 can be more easily divided.

  As a modification, the first scribe line SL1 (FIG. 25) described in the second embodiment may be applied to this embodiment.

<Embodiment 4>
In the present embodiment, the method of step S10 (FIG. 5) is different from that of the first embodiment. Specifically, the following steps are performed.

  Referring to FIG. 30, the blade edge 51 is moved along the first scheduled cutting line BL <b> 1 (FIG. 2) on the upper surface SF <b> 1 of the glass substrate 4. Further, referring to FIG. 31, next, the blade edge 51 cuts down the edge ED of the upper surface SF <b> 1 of the glass substrate 4 (see the solid line arrow in the figure). This cut-off gives an opportunity to start the formation of the first crack line CL1 along the first trench line TL1. Thereby, the first crack line CL1 is formed (see the broken line arrow in the figure). Further, referring to FIG. 32, thereby, as step S10 (FIG. 5) of the present embodiment, a first scribe line SL1 having a first trench line TL1 and a first crack line CL1 is formed.

  Referring to FIG. 33, next, as in the first embodiment, second scribe line SL2 and third scribe line SL3 are formed. Thereafter, the glass substrate 4 is divided as in the first embodiment.

  According to the present embodiment, the cutting edge 51 cuts down the edge ED of the upper surface SF1 of the glass substrate 4, thereby giving an opportunity to start the formation of the first crack line CL1 along the first trench line TL1. it can. Thereby, the first crack line CL1 can be easily formed while applying the crackless scribing technique. Therefore, the glass substrate 4 can be more easily divided.

  As a modification, as shown in FIG. 34, the third scribe line SL3 (FIG. 29) described in the third embodiment may be applied to the present embodiment.

<Embodiment 5>
FIG. 35 is a flowchart schematically showing the configuration of the glass substrate 4 dividing method according to the fifth embodiment. In the present embodiment, step S10 (FIG. 5) in each of the first to fourth embodiments is performed after step S40. Other configurations are substantially the same as the configurations of the first to fourth embodiments described above, and thus description thereof will not be repeated. According to the present embodiment, the same effect as in the first to fourth embodiments can be obtained.

<Embodiment 6>
FIG. 36 is a flowchart schematically showing the configuration of the glass substrate 4 dividing method according to the fifth embodiment. The method for dividing glass substrate 4 in the present embodiment includes step S30V instead of step S30 (FIG. 5) in the first to fourth embodiments. Hereinafter, a detailed method will be described.

  In steps S10 and S20, the first scribe line SL1 and the second scribe line SL2 are formed by the same processes as those up to FIG. 16 in the first embodiment.

  Referring to FIG. 37, in step S30V, the blade edge 51 is reversed again after step S20. Referring to FIG. 38, as a result, the blade edge 51 moves on the upper surface SF1 of the glass substrate 4 along the intermediate portion BL2m (FIG. 4) of the second scheduled cutting line BL2. Thereby, the intermediate trench line TLm is formed on the upper surface SF1 of the glass substrate 4 by plastic deformation. At this time, the load applied to the blade edge 51 is made smaller than the load applied to the blade edge 51 when the second trench line TL2 is formed. Referring to FIG. 39, since such a small load is used, intermediate trench line TLm is formed in a crackless state.

  Referring to FIGS. 40 to 43, in step S40, after step S30V, third scribe line SL3 is formed on upper surface SF1 of glass substrate 4. Step S40 itself is performed in the same manner as in FIG. 18 and FIGS. However, in the present embodiment, unlike the first embodiment, it is not necessary to separate the blade edge 51 from the glass substrate 4 between step S20 and step S40.

  The load applied to the blade edge 51 in step S30V described above is made smaller than the load applied to the blade edge 51 in order to form the third trench line TL3 in step S40. If the former load is sufficiently small, the extension of cracks generated in the process of FIG. 41 (see the broken line arrow in FIG. 42) is the boundary between the third trench line TL3 and the intermediate trench line TLm (see FIG. Stop at point CP2b) at 41.

  In step S50, glass substrate 4 is then divided in the same manner as in the first embodiment.

  According to the present embodiment, first, the extension of cracks generated in the step of forming the third scribe line SL3 (see the broken line arrow in FIG. 42) is caused by the third trench line TL3 and the intermediate trench line. It is stopped at the boundary with TLm (point CP2b in FIG. 41). Thereby, it is possible to prevent the formation of a crack line along the intermediate trench line TLm. In other words, it is possible to prevent the formation of a crack line along the intermediate portion BL2m of the second scheduled split line BL2 (FIG. 4). Thereby, it is possible to prevent the formation of a crack line that intersects the first scribe line SL1. Therefore, it is possible to avoid a decrease in the division quality caused by the crack lines crossing each other. Second, an intermediate trench line TLm is formed along the intermediate portion BL2m of the second scheduled split line BL2. Thereby, compared with the case where intermediate trench line TLm is not provided in intermediate part BL2m, the precision of the dividing position in intermediate part BL2m can be improved. Thirdly, after the second trench line TL2 is formed in a crackless state, the second crack line CL2 along which the second trench line CL2 starts to be formed can be given simply by reversing the direction in which the blade edge 51 moves. it can. Thereby, the second crack line CL2 can be easily formed while applying the crackless scribing technique. From the above, when there is an intersection between the planned dividing lines, the glass substrate 4 can be divided easily and with high quality while applying the crackless scribing technique.

  In addition, substantially the same effects as those described in the first embodiment can be obtained. As a modification, the first scribe line SL1 (FIG. 32) described in the fourth embodiment may be applied to this embodiment.

<Embodiment 7>
Referring to FIG. 44, in the present embodiment, first scribe line SL1 is disengaged from intermediate portion BL1m (FIG. 3) of first scheduled split line BL1, as in the second embodiment. Other configurations are almost the same as those of the above-described sixth embodiment, and therefore description thereof will not be repeated. According to the present embodiment, in addition to substantially the same effects as in the sixth embodiment, the effects described in the second embodiment can be obtained in relation to the first scribe line SL1.

<Eighth embodiment>
In the present embodiment, first, the first scribe line SL1, the second scribe line SL2, and the intermediate trench line TLm are formed by the same processes as those up to FIG. 38 in the sixth embodiment. Referring to FIG. 45, next, as in the step of FIG. 40 of the sixth embodiment, third trench line TL3 starts to be formed.

  Referring to FIG. 46, in the present embodiment, blade edge 51 cuts down edge ED of upper surface SF1 of glass substrate 4 (see the solid arrow in the figure). This cut-off provides an opportunity to start the formation of the third crack line CL3 along the third trench line TL3. As a result, a third crack line CL3 is formed (see the broken line arrow in the figure). Referring further to FIG. 47, this forms third scribe line SL3 having third trench line TL3 and third crack line CL3 as step S40 (FIG. 36) of the present embodiment.

  Since the configuration other than the above is substantially the same as the configuration of the sixth embodiment described above, the description thereof will not be repeated. According to the present embodiment, in addition to substantially the same effects as in the sixth embodiment, the effects described in the third embodiment can be obtained in relation to the third crack line CL3.

  As a modification, the first scribe line SL1 (FIG. 44) described in the seventh embodiment may be applied to the present embodiment.

<Embodiment 9>
In the present embodiment, the method of step S10 (FIG. 5) is different from that of the eighth embodiment. Specifically, the first scribe line SL1 (FIG. 32) described in the fourth embodiment is applied. As a result, as shown in FIG. 48, the first scribe line SL1, the second scribe line SL2, the intermediate trench line TLm, and the third scribe line SL3 are formed. Other configurations are almost the same as those of the above-described eighth embodiment, and therefore description thereof will not be repeated. According to the present embodiment, in addition to substantially the same effects as in the eighth embodiment, the effects described in the fourth embodiment can be obtained in relation to the first crack line CL1.

  As a modification, the first scribe line SL1 (FIG. 44) described in the seventh embodiment may be applied to the present embodiment.

<Embodiment 10>
Referring to FIG. 49, in the present embodiment, respective forming steps of second scribe line SL2, intermediate trench line TLm, and third scribe line SL3 in the sixth embodiment (FIGS. 37 to 43). In the same manner as described above, the first scribe line SL1 is divided into a portion along one portion BL1a (FIG. 3) of the first planned split line BL1 and an intermediate portion BL1m (FIG. 3) of the first planned split line BL1. The intermediate trench line along and the part along the other part BL1a (FIG. 3) of the first parting line BL1 in the first scribe line SL1 are formed.

  Referring to FIG. 50, next, similarly to the sixth embodiment, second scribe line SL2, intermediate trench line TLm, and third scribe line SL3 are formed. Thereafter, the glass substrate 4 is divided as in the sixth embodiment.

  Also according to the present embodiment, substantially the same effect as in the sixth embodiment can be obtained. Furthermore, in the present embodiment, an intermediate trench line TLm is formed along the intermediate portion BL1m of the first division planned line BL1 (FIG. 3). Thereby, compared with the case where the intermediate trench line TLm is not provided in the intermediate portion BL1m, the accuracy of the dividing position in the intermediate portion BL1m can be increased.

<Embodiment 11>
Referring to FIG. 51, in the present embodiment, the first scribe line SL2, the intermediate trench line TLm, and the third scribe line SL3 in the eighth embodiment are formed by the same method as that of the respective steps. A portion along one portion BL1a (FIG. 3) of the first planned split line BL1 of one scribe line SL1, an intermediate trench line along an intermediate portion BL1m (FIG. 3) of the first planned split line BL1, Of the one scribe line SL1, a portion along the other portion BL1a (FIG. 3) of the first scheduled split line BL1 is formed.

  Referring to FIG. 52, next, similarly to the sixth embodiment, second scribe line SL2, intermediate trench line TLm, and third scribe line SL3 are formed. Thereafter, the glass substrate 4 is divided as in the sixth embodiment.

  Also in the present embodiment, substantially the same effect as in the tenth embodiment can be obtained. Furthermore, in the present embodiment, the effects described in the third embodiment can be obtained in relation to the third crack line CL3.

  As a modification, as shown in FIG. 53, the third scribe line SL3 (FIG. 47) described in the eighth embodiment may be applied to the present embodiment.

<Embodiment 12>
FIG. 54 is a flowchart schematically showing the configuration of the glass substrate 4 dividing method according to the twelfth embodiment. In the present embodiment, step S10 (FIG. 36) in each of the sixth to eleventh embodiments is performed after step S40. Other configurations are substantially the same as the configurations of the above-described sixth to eleventh embodiments, and therefore description thereof will not be repeated. The effect similar to Embodiments 6-11 is acquired also by this Embodiment.

<Configuration of cutting edge>
In each of the above embodiments, a crack-less trench line is formed by the movement of the blade edge 51 on the upper surface SF1 of the glass substrate 4, and then a crack line along the trench line is induced. A configuration of the blade edge 51 and a method of using the blade edge 51 that are particularly suitable for these steps will be described below.

  FIG. 55 is a side view schematically showing a configuration of a cutting instrument having a blade edge 51. FIG. 56 is a schematic plan view from the viewpoint of the arrow LVI in FIG.

  In the cutting instrument 50, the cutting edge 51 is held by being fixed to a shank 52 as its holder. Therefore, the blade edge 51 is not a rolling type but a fixed type.

  The blade edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. The plurality of surfaces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and SD3 (first to third surfaces) face different directions and are adjacent to each other. The blade edge 51 has a vertex where the top surface SD1, the side surfaces SD2 and SD3 merge. A projection of the blade edge 51 is constituted by the vertex PP. Further, the side surfaces SD2 and SD3 form a ridge line PS constituting the side portion of the blade edge 51. The ridge line PS extends linearly from the apex PP and has a convex shape extending linearly. From the above configuration, the blade edge 51 forms a ridge line PS by being adjacent to the top surface SD1, the side surface SD2 adjacent to the top surface SD1, and the side surface SD2, and is apex by being adjacent to each of the top surface SD1 and the side surface SD2. And a side surface SD3 forming PP.

  In the step of forming the second trench line TL2 in step S20 and the step of forming the third trench line TL3 in step S40, the blade edge 51 is directed from the ridge line PS to the first surface SD1 on the upper surface SF1 of the glass substrate 4. It is preferable to be performed by sliding in the direction. Moreover, it is preferable that the formation process of 1st trench line TL1 in step S20 is performed by making the blade edge | tip 51 slide on the upper surface SF1 of the glass substrate 4 to the direction which goes to the 1st surface SD1 from the ridgeline PS.

  The cutting edge used for forming the first scribe line SL1 may be the same as the cutting edge used for forming the second scribe line SL2 and the third scribe line SL3. That is, all these scribe lines may be formed by the common cutting edge 51. Alternatively, the cutting edge for forming the first scribe line SL1 and the cutting edge for forming the second scribe line SL2 and the third scribe line SL3 may be separately prepared. These cutting edges may have the same shape as each other or may have shapes different from each other. Even when both have different shapes, it is preferable that the difference is due to a difference in arrangement between the top surface SD1, the side surface SD2, and the side surface SD3. The “shape” of the blade edge considered here is the shape of the portion near the vertex PP of the blade edge, that is, the action portion on the glass substrate 4, and the shape of the portion away from this action portion is: Usually not important.

  Preferably, the cutting edge 51 is a diamond point. That is, the cutting edge 51 is preferably made of diamond from the viewpoint that the hardness and the surface roughness can be reduced. More preferably, the cutting edge 51 is made of single crystal diamond. More preferably, crystallographically, the top surface SD1 is a {001} plane, and each of the side surfaces SD2 and SD3 is a {111} plane. In this case, although the side surfaces SD2 and SD3 have different orientations, they are crystal surfaces that are equivalent to each other in terms of crystallography. Diamond that is not a single crystal may be used. For example, polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, sintered diamond obtained by bonding polycrystalline diamond particles, which are sintered from fine graphite or non-graphitic carbon without containing a binder such as an iron group element, with a binder such as an iron group element is used. May be.

  The shank 52 extends along the axial direction AX. The blade edge 51 is preferably attached to the shank 52 so that the normal direction of the top surface SD1 is approximately along the axial direction AX. In this case, the blade edge 51 is pushed forward on the upper surface SF1 of the glass substrate 4 by the shank 52, as shown in FIG.

  According to the configuration of the present cutting edge, the crack line can be more reliably formed when the trigger for forming the crack line along the trench line is given by reversing the moving direction of the cutting edge 51. This is because the ridgeline of the blade edge 51 slid for forming the trench line locally applies stress to the trench line by the reversal of the blade edge 51. By applying this stress, an opportunity to start the formation of crack lines can be obtained with high certainty.

  In addition, when a trigger for forming a crack line along the trench line is given by cutting the edge of one surface of the glass substrate 4 by the cutting edge 51, the crack line can be formed more reliably. This is because the edge line ED of the blade edge 51 cuts down the edge ED of the upper surface SF <b> 1 of the glass substrate 4. By this cutting down, the trigger for starting the formation of crack lines can be obtained with high certainty.

  In each of the above-described embodiments, the case where each of the first scheduled split line BL1 and the second scheduled split line BL2 (FIG. 2) is one has been described in detail. However, the first scheduled split line BL1 and the second scheduled split line BL1 The number of each of the planned dividing lines BL2 can be arbitrarily set depending on the number and arrangement of the glass plates 90 (FIG. 1) cut out from the glass substrate 4. Further, although the case where the edge ED of the upper surface SF1 is rectangular is illustrated, other shapes may be used. Moreover, although the case where upper surface SF1 was flat was demonstrated, the upper surface may be curved. Further, although the case where the scribe line is linear has been described, the scribe line may be curved. Moreover, although the case where the glass substrate 4 was used as a brittle board | substrate was demonstrated, the brittle board | substrate may be made from brittle materials other than glass, for example, may be made from ceramics, silicon, a compound semiconductor, sapphire, or quartz.

BL1, BL2 First and second scheduled split lines CL1 to CL3 First to third crack lines CR Intersection ED Edge SD1 Top surface (first surface)
SD2 side (second side)
SD3 side (third side)
SF1 Upper surface (one surface)
SL1 to SL3 First to third scribe lines PP Apex PS Ridge line TLm Intermediate trench line TL1 to TL3 First to third trench lines 4 Glass substrate (brittle substrate)
51 cutting edge

Claims (10)

A method for dividing a brittle substrate, wherein the brittle substrate is divided along a first division line and a second division line that intersects the first division line,
a) a step of forming a first scribe line on one surface of the brittle substrate, wherein the first scribe line includes a first trench line having a groove shape and the brittle substrate in the thickness direction; A first crack line configured by extending a crack along the first trench line, and the first planned split line has an intersection with the second planned split line. An intermediate portion, and one portion and the other portion separated from each other by the intermediate portion, and the first scribe line includes a portion along the one portion and the other portion of the first scheduled cutting line. Including
b) including a step of forming a second scribe line on the one surface of the brittle substrate, wherein the second scribe line includes a second trench line having a groove shape and the brittleness in the thickness direction. A second crack line formed by extending a crack in the substrate along the second trench line, and the second dividing line has an intersection with the first dividing line. An intermediate portion present, and one portion and the other portion separated from each other by the intermediate portion, and the second scribe line is disposed along the one portion of the second parting line, Step b)
b1) By moving the cutting edge in the direction toward the intersection along the one part of the second parting line on the one surface of the brittle substrate, the second trench line is plastically deformed. Forming the second trench line continuously in a direction in which the brittle substrate intersects the second trench line below the second trench line. It is formed so that a crackless state, which is a connected state, is obtained, and b2) after the step b1), by reversing the direction in which the cutting edge moves, the thickness along the second trench line A step of forming the second crack line by extending a crack of the brittle substrate in the vertical direction, the second crack line The brittle substrate is disconnected continuously in the direction intersecting the second trench line below the second trench line,
c) after the step b), the step of separating the blade edge from the brittle substrate,
d) after the step c), comprising a step of forming a third scribe line on the one surface of the brittle substrate, the third scribe line including a third trench line having a groove shape; A third crack line formed by extending a crack of the brittle substrate in the thickness direction along the third trench line, and the third scribe line is divided into the second division line. Arranged along said other part of the planned line, said step d)
d1) The third trench line is plastically deformed by moving the blade edge in a direction away from the intersection point along the other part of the second parting line on the one surface of the brittle substrate. Forming on the one surface of the brittle substrate, wherein the third trench line is continuous in a direction in which the brittle substrate intersects the third trench line below the third trench line. D2) after the step d1), the crack of the brittle substrate in the thickness direction is extended along the third trench line. Forming a third crack line under the third trench line by the third crack line. On the other hand, the brittle substrate is disconnected continuously in the direction intersecting the third trench line,
e) after the step a) and after the step d), comprising the step of dividing the brittle substrate along the first division line and the second division line.
Method for cutting a brittle substrate. A method for dividing a brittle substrate, wherein the brittle substrate is divided along a first division line and a second division line that intersects the first division line,
a) a step of forming a first scribe line on one surface of the brittle substrate, wherein the first scribe line includes a first trench line having a groove shape and the brittle substrate in the thickness direction; A first crack line configured by extending a crack along the first trench line, and the first planned split line has an intersection with the second planned split line. An intermediate portion, and one portion and the other portion separated from each other by the intermediate portion, and the first scribe line includes a portion along the one portion and the other portion of the first scheduled cutting line. Including
b) including a step of forming a second scribe line on the one surface of the brittle substrate, wherein the second scribe line includes a second trench line having a groove shape and the brittleness in the thickness direction. A second crack line formed by extending a crack in the substrate along the second trench line, and the second dividing line has an intersection with the first dividing line. An intermediate portion present, and one portion and the other portion separated from each other by the intermediate portion, and the second scribe line is disposed along the one portion of the second parting line, Step b)
b1) By moving the cutting edge in the direction toward the intersection along the one part of the second parting line on the one surface of the brittle substrate, the second trench line is plastically deformed. Forming the second trench line continuously in a direction in which the brittle substrate intersects the second trench line below the second trench line. It is formed so that a crackless state, which is a connected state, is obtained, and b2) after the step b1), by reversing the direction in which the cutting edge moves, the thickness along the second trench line A step of forming the second crack line by extending a crack of the brittle substrate in the vertical direction, the second crack line The brittle substrate is disconnected continuously in the direction intersecting the second trench line below the second trench line,
c) After the step b), by moving the cutting edge along the intermediate portion of the second parting line on the one surface of the brittle substrate, the intermediate trench line is made brittle by plastic deformation. Forming on the one surface of the substrate,
d) after the step c), comprising a step of forming a third scribe line on the one surface of the brittle substrate, the third scribe line including a third trench line having a groove shape; A third crack line formed by extending a crack of the brittle substrate in the thickness direction along the third trench line, and the third scribe line is divided into the second division line. Arranged along said other part of the planned line, said step d)
d1) The third trench line is plastically deformed by moving the blade edge in a direction away from the intersection point along the other part of the second parting line on the one surface of the brittle substrate. Forming on the one surface of the brittle substrate, wherein the third trench line is continuous in a direction in which the brittle substrate intersects the third trench line below the third trench line. D2) after the step d1), the crack of the brittle substrate in the thickness direction is extended along the third trench line. Forming a third crack line under the third trench line by the third crack line. On the other hand, the brittle substrate is disconnected continuously in the direction intersecting the third trench line,
e) after the step a) and after the step d), comprising the step of dividing the brittle substrate along the first and second division lines.
The load applied to the cutting edge in the step c) is made smaller than the load applied to the cutting edge in the steps b1) and d1), thereby generating the step d2). A method for cutting a brittle substrate, wherein extension of cracks stops at a boundary between the third trench line and the intermediate trench line.   The brittle substrate cutting method according to claim 1 or 2, wherein the step d2) includes a step of reversing a direction in which the cutting edge moves.   The brittle substrate cutting method according to claim 1 or 2, wherein the step d2) includes a step in which the cutting edge cuts down an edge of the one surface of the brittle substrate.   5. The method for cutting a brittle substrate according to claim 1, wherein in the step a), the first scribe line includes a portion along the intermediate portion of the first scheduled cutting line. 6. .   5. The brittle substrate cutting method according to claim 1, wherein, in the step a), the first scribe line is deviated from the intermediate portion of the first scheduled cutting line. 6.   The step b1) and the step d1) include a first surface, a second surface adjacent to the first surface, a ridge line by being adjacent to the second surface, and the first surface. And a third surface that forms a vertex by adjoining each of the second surfaces, and slides the cutting edge in the direction from the ridge line toward the first surface on the one surface of the brittle substrate. The method for dividing a brittle substrate according to any one of claims 1 to 6, which is performed by moving the substrate. Said step a)
a1) a step of moving the cutting edge along the first scheduled cutting line on the one surface of the brittle substrate;
a2) after the step a1), reversing the direction in which the cutting edge moves;
The brittle board | substrate cutting method of any one of Claim 1 to 7 containing these. Said step a)
a1) a step of moving the cutting edge along the first scheduled cutting line on the one surface of the brittle substrate;
a2) After the step a1), the cutting edge cuts down the edge of the one surface of the brittle substrate;
The brittle board | substrate cutting method of any one of Claim 1 to 7 containing these.   The step a1) includes a first surface, a second surface adjacent to the first surface, and a ridge line by adjacent to the second surface, and the first surface and the second surface. By sliding a cutting edge having a third surface that apex by adjoining each of the surfaces in a direction from the ridge line toward the first surface on the one surface of the brittle substrate. The method for dividing a brittle substrate according to claim 7 or 8.

Images