KR101851070B1 - Method for dividing brittle substrate - Google Patents

Abstract

[PROBLEMS] To easily form a crack line along a trench line.
A first trench line (TL1) is formed by sliding the blade (51) at a first speed from a first position (N1) to a second position (N2) of the brittle substrate (4). The second trench line TL2 is formed by further sliding the blade 51 from the second position N2 to the third position N3 at a second speed that is slower than the first speed. The first crack line CL1 is formed by extending the crack along the second trench line TL2 as the blade 51 reaches the third position N3. The first crack line CL1 reaches the second position N2 so that the second crack line CL2 is formed by extending the crack from the second position N2 along the first trench line TL1 do. The brittle substrate 4 is divided along the first crack line CL1 and the second crack line CL2.

Description

[0001] METHOD FOR DIVIDING BRITTLE SUBSTRATE [0002]

The present invention relates to a method of breaking a brittle substrate.

In the production of electric devices such as flat display panels or solar panels, it is often necessary to separate the brittle substrate. In a typical breaking method, crack lines are formed on a brittle substrate first. Here, "crack line" means that a crack partially extending in the thickness direction of the brittle substrate extends in a line shape on the surface of the brittle substrate. Next, a so-called break process is performed. Specifically, by applying stress to the brittle substrate, the cracks in the crack line progress completely in the thickness direction. As a result, the brittle substrate is divided along the crack line.

According to Japanese Patent Application Laid-Open No. 9-188534 (Patent Document 1), a predetermined indentation portion is formed on the upper surface of the glass sheet at the time of scribing. In this publication, this recessed portion is referred to as a " scribe line ". At the same time as inserting the scribe line, a crack extending downward from the scribe line is generated. Therefore, in the technique of dividing the above publication, it can be said that the above-mentioned crack line is formed simultaneously with the formation of the " scribe line ".

JPH09-188534A

The inventors of the present invention have developed an independent division technique different from the above conventional division technique. According to this technique, a groove shape called a trench line is first formed by generating plastic deformation by sliding a blade (blade tip) on a brittle substrate. At the time when the trench line is formed, a crack is not formed under the trench line. Thereafter, by extending a crack along the trench line, a crack line is formed. That is, unlike the conventional technique, a trench line that does not involve cracks is once formed, and then a crack line is formed along the trench line. Thereafter, the breaking process is performed along the crack line.

The trench line not accompanied by the crack can be formed by sliding the blade at a lower load as compared with the conventional scribe line involving cracks. If the load applied to the blade is small, the damage to the blade is also reduced. Thus, according to this unique separation technique, the life of the blade can be prolonged.

In the above-described unique technology, a process for starting to form a crack line along the trench line is required. For this reason, it is necessary to open the internal stress that has occurred in the brittle substrate by the formation of the trench line. As one of the methods for imparting this gauge, the present inventors have found that a process of forming a normal scribe line so as to cross the trench line is effective. However, due to this process, the method of dividing the brittle substrate has been complicated. Therefore, an easier process has been demanded in place of this process.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a method of forming a trench line having no cracks under the trench line, Method.

The breaking method of the brittle substrate of the present invention comprises the following steps.

A first trench line having a groove shape is formed by causing plastic deformation on one surface by sliding the blade at a first speed from a first position to a second position on one surface of the brittle substrate. The step of forming the first trench line is performed so as to obtain a crack-free state under the first trench line, in which the brittle substrate is continuously connected in the direction crossing the first trench line.

After the step of forming the first trench line, by further sliding the blade at a second speed on one side of the brittle substrate from the second position to the third position, which is slower than the first speed, plastic deformation Thereby forming a second trench line having a groove shape. The step of forming the second trench line is performed so as to obtain a crack-free state under the second trench line, in which the brittle substrate is continuously connected in the direction intersecting the second trench line.

In the process of forming the second trench line, the first crack line is formed by extending the slidable blade to the third position, thereby extending a crack of the brittle substrate along the second trench line from the third position. The brittle substrate is disconnected continuously in the direction crossing the second trench line under the second trench line by the first crack line.

By reaching the first crack line at the second position, a second crack line is formed by extending a crack of the brittle substrate from the second position along the first trench line. The brittle substrate is disconnected continuously in the direction crossing the first trench line under the first trench line by the second crack line.

The brittle substrate is divided along the first crack line and the second crack line.

According to the present invention, the sliding blade is also slid to the third position to form the first trench line, thereby forming a second crack line along the first trench line. That is, by further continuing the sliding of the blade for forming the first trench line, it is possible to easily form the second crack line along the first trench line.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart schematically showing a configuration of a method for separating a brittle substrate according to Embodiment 1 of the present invention;
2 is a plan view schematically showing a first step of a brittle substrate breaking method according to Embodiment 1 of the present invention;
Figure 3 is a schematic cross-sectional view along line III-III in Figure 2;
Figure 4 is a schematic cross-sectional view along line IV-IV in Figure 2;
5 is a plan view schematically showing a second step of the brittle substrate cutting method according to the first embodiment of the present invention;
Figure 6 is a schematic cross-sectional view along line VI-VI of Figure 5;
Figure 7 is a schematic cross-sectional view along line VII-VII of Figure 5;
8 is a plan view schematically showing a third step of a brittle substrate cutting method according to Embodiment 1 of the present invention;
Figure 9 is a schematic cross-sectional view along line IX-IX of Figure 8;
10 is a micrograph of a cross section along the first crack line of the brittle substrate;
11 is a micrograph of a cross section along the second crack line of the brittle substrate;
12 is a side view schematically showing a configuration of a cutting mechanism used in a method of cutting a brittle substrate according to Embodiment 1 of the present invention;
FIG. 13 is a schematic plan view at the time of the arrow XIII in FIG. 12; FIG.
FIG. 14 is a side view schematically showing a configuration of a cutting mechanism used in a method of dividing a brittle substrate according to Embodiment 2 of the present invention; FIG.
FIG. 15 is a schematic plan view at the time of the arrow XV in FIG. 14; FIG.
16 is a side view schematically showing a configuration of a cutting mechanism used in a method of dividing a brittle substrate according to Embodiment 3 of the present invention;
FIG. 17 is a schematic plan view at the time of the arrow XVII in FIG. 16; FIG.
18 is a plan view schematically showing a first step of a brittle substrate breaking method according to Embodiment 4 of the present invention;
19 is a schematic cross-sectional view along line XIX-XIX of Fig. 18;
20 is a plan view schematically showing a second step of the brittle substrate breaking method according to the fourth embodiment of the present invention;
Figure 21 is a schematic cross-sectional view along line XXI-XXI in Figure 20;
Fig. 22 is a plan view schematically showing a third step of the brittle substrate breaking method according to the fourth embodiment of the present invention; Fig.
23 is a schematic cross-sectional view along line XXIII-XXIII in Fig. 22;

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

≪ Embodiment 1 >

(Method of dividing glass substrate)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flowchart schematically showing a configuration of a method of dividing a brittle substrate in the present embodiment. Fig. Hereinafter, the dividing method will be described.

Referring to Figs. 2 to 4, first, a glass substrate 4 (brittle substrate) to be divided is prepared. The glass substrate 4 has an upper surface SF1 (one surface) and a lower surface SF2 opposite thereto. The glass substrate 4 has a thickness direction DT (Fig. 3) perpendicular to the upper surface SF1. Further, a cutting mechanism 50 (Fig. 4) having a blade 51 is prepared. Details of the configuration of the cutting mechanism 50 and the method of using the same will be described later.

Next, the blade 51 disposed apart from the glass substrate 4 is brought close to the glass substrate 4. Then, The blade 51 is brought into contact with the glass substrate 4 at the position N1 (first position) on the upper surface SF1 of the glass substrate 4. As a result, The position N1 is away from the edge of the upper surface SF1 of the glass substrate 4. [

Next, on the upper surface SF1 of the glass substrate 4, as shown by an arrow M1 (Fig. 2 and Fig. 4), from the position N1 to the position N1, The blade 51 is slid to a position N2 (second position) different from the position N2 (second position). The first speed, which is the speed of the sliding, may be a typical scribing speed when using a mechanical blade, for example, about 100 mm / second. This sliding causes plastic deformation on the upper surface SF1. Thus, a trench line TL1 (first trench line) having a groove shape is formed.

The trench line TL1 is formed so as to obtain a crack-free state. Here, the crack-free state refers to a state in which the glass substrate 4 under the trench line TL1 extends in the direction DC (also referred to as " vertical direction ") in which the trench line TL1 extends 3). In the crack-free state, the trench line TL1 due to plastic deformation is formed, but no crack is formed. In order to obtain a crack-free state, the load applied to the blade 51 is adjusted to such a degree that cracks do not occur, plastic deformation occurs, and cracks occur therebelow. With respect to another trench line, which will be described later, a crack free state is similarly defined.

Further, the plastic deformation is sufficiently formed at a low load without cutting the surface of the glass substrate 4, but the glass substrate 4 may be slightly shaved. However, it is preferable that such sloping does not occur because it may cause undesirable fine debris.

2 and 4) on the upper surface SF1 of the glass substrate 4 in the step S20 (Fig. 1), the position N1 is changed from the position N2 to the position N2, The blade 51 is further slid to the position N3 (third position), which is different from that of the position N2. Including the above-described step of forming the trench line TL1, the blade 51 is continuously slid from the position N1 to the position N3 via the position N2. The position N3 is away from the edge of the upper surface SF1 of the glass substrate 4. [ This sliding causes plastic deformation on the upper surface SF1. Thus, a trench line TL2 (second trench line) having a groove shape is formed.

The trench line TL2 is formed so as to obtain a crack-free state. The load applied to the blade 51 when the trench line TL2 is formed may be equal to or different from the load applied to the blade 51 when the trench line TL1 is formed. If the two loads are the same, the load control is easy.

The sliding of the blade from the position N2 to the position N3 is performed at a second speed which is slower than the first speed described above. The second speed is preferably less than 25 mm / second, more preferably less than 5 mm / second, for example about 1 mm / second. Therefore, in terms of the efficiency of the process, when the first speed is 100 mm / sec or more, the second speed is preferably smaller than 25%, and more preferably smaller than 5% of the first speed.

5 to 7, in step S30 (Fig. 1), the slidable blade 51 reaches the position N3 in the step of forming the trench line TL2, 7, a crack of the glass substrate 4 in the thickness direction DT is extended from the position N3 along the trench line TL2. As a result, the crack line CL1 (first crack line) is formed.

By the formation of the crack line CL1, the crack-free state of the trench line TL2 is lost. In other words, the glass substrate 4 on the lower side of the trench line TL2 by the crack line CL1 intersects the extending direction of the trench line TL2 (the lateral direction in Figs. 5 and 7) DC) (Fig. 6). Here, "continuous connection" means, in other words, a connection that is not blocked by a crack. As described above, portions of the glass substrate 4 may be in contact with each other through a crack of the crack line CL1 in a state where the continuous connection is disconnected. Also, some continuous connection may be left just below the trench line TL.

As described above, the detailed mechanism of initiation of the extension of the crack is unclear, and it is difficult to precisely predict in advance where the position N3 will be. However, if the second velocity is sufficiently small, the position N3 is located sufficiently close to the position N2 with a high probability accordingly.

When the crack line CL1 reaches the position N2 in step S40 (Fig. 1), it becomes a gauge and moves from the position N2 to the trench line TL1 (Fig. 5) A crack of the glass substrate 4 in the thickness direction is expanded. As a result, the crack line CL2 (second crack line) is formed. By the formation of the crack line CL2, the crack-free state of the trench line TL1 is lost. In other words, the glass substrate 4 is disconnected continuously in the direction crossing the trench line TL1 below the trench line TL1 by the crack line CL2.

8 and 9, in the present embodiment, even after the crack line CL1 is formed as described above, the sliding of the blade 51 continues. That is, on the upper surface SF1 of the glass substrate 4, as shown by the arrow M3, a position N4 (fourth position) different from any of the positions N1 to N3 from the position N3, The blade 51 is further slid at a second speed. This sliding causes plastic deformation on the upper surface SF1. As a result, a trench line TL3 (third trench line) having a groove shape is formed. The trench line TL3 can be formed to obtain a crack-free state. In other words, the blade 51 is slid at the positions N1 to N4, and cracks occur at any one of the positions N3 to N4.

Next, at a position N4 on the upper surface SF1 of the glass substrate 4, the blade 51 is detached from the glass substrate 4. Then, as shown in Fig. The position N4 is separated from the edge of the upper surface SF1 of the glass substrate 4. [ This completes the sliding process of the blade 51 from the position N1 to the position N4 via the position N2 and the position N3 in order. The distance that the blade 51 slides between the position N2 and the position N4 is shorter than the distance that the blade 51 slides between the positions N1 and N2. The distance that the blade 51 slides between the position N2 and the position N4 is preferably 2 mm or more, and more preferably 20 mm or more. Therefore, when the second speed is 1 mm / second, the time for the blade 51 to slide between the position N2 and the position N4 is preferably 2 seconds or more, more preferably 20 seconds Or more.

Next, in step S50 (Fig. 1), the glass substrate 4 is divided along the crack line CL1 and the crack line CL2. Namely, a so-called brake process is performed. The breaking process can be performed by application of an external force to the glass substrate 4. [ For example, a stress applying member (for example, a stress applying member) is formed on the lower surface SF2 toward the crack line CL1 and the crack line CL2 (FIG. 9) on the upper surface SF1 of the glass substrate 4, A stress is applied to the glass substrate 4 such that cracks in the crack line CL1 and the crack line CL2 are caused to occur by pressing a member called a " break bar " When the crack line CL1 and the crack line CL2 are completely advanced in the thickness direction DT at the time of formation thereof, the formation of the crack line CL1 and the crack line CL2 and the division of the glass substrate 4 This happens at the same time.

In addition, the crack line forming process described above is essentially different from the so-called break process. The breaking process completely separates the substrate by further extending the already formed cracks in the thickness direction. On the other hand, the crack line forming process causes a change from a crack-free state obtained by forming the trench line to a crack-containing state. This change is considered to be caused by the opening of the internal stress having a crack-free state.

As a result, the glass substrate 4 is divided. As for the quality of the sectional plane of the glass substrate 4, the portion along the crack line CL2 is better than the portion along the crack line CL1. Each of Figs. 10 and 11 is a microphotograph of a cross section along a crack line CL1 and a crack line CL2 of the glass substrate 4. Fig. On the sectional plane (FIG. 10) along the crack line CL1, the shape of the tooth shape of the shark due to the unevenness was clearly observed in the area of the crack line CL1. On the other hand, on the sectional plane (FIG. 10) along the crack line CL2, such a shape was not observed, and a better mirror surface was observed.

(Cutting mechanism)

Fig. 12 is a side view schematically showing the configuration of the cutting mechanism 50. Fig. 13 is a schematic plan view at the time of the arrow XIII in Fig. The direction of the arrow XIII corresponds to the normal direction of the upper surface SF1 of the glass substrate 4. [ The cutting mechanism 50 has a blade 51 and a shank 52. The blade 51 is held by being fixed to the shank 52 as its holder.

The blade 51 has a projection PP, ridgelines PS1 to PS4 (first to fourth ridgelines), and sides SD1 to SD4. The side faces SD1 to SD4 face in different directions. The ridge portion PS1 is a boundary portion between the side surfaces SD1 and SD2. The ridge portion PS2 is a boundary portion between the side surfaces SD3 and SD4. The ridge portion PS3 is a boundary portion between the side surfaces SD1 and SD3. The ridge portion PS4 is a boundary portion between the side surfaces SD2 and SD4. The ridge portion PS1 and the ridge portion PS2 in the plan view of the blade 51 viewed from the field of view of the arrow XIII (Fig. 12) (PP). The angle made by the ridge portions PS1 and PS2 in FIG. 12, in other words, the direction in which the ridge portion PS1 extends from the projection PP and the ridge portion PS2 extends from the projection PP, And is, for example, about 140 degrees. As shown in Figs. 12 and 13, the blade 51 preferably has a shape of a vertex of a quadrangular pyramid.

Since the ridge portion PS1 is a portion where the surface of the blade 51 joins between the side surface SD1 and the side surface SD2, a slight radius of curvature (hereinafter referred to as a ridge portion PS1) Quot; radius of curvature "). This radius of curvature is, for example, about several 탆 to about ten 탆. The same applies to the ridge line portion PS2. The radius of curvature of the ridge portion PS1 and the radius of curvature of the ridge portion PS2 may be the same or different.

The blade 51 is preferably made of diamond in that it can reduce the hardness and surface roughness. That is, the blade 51 is preferably a diamond point. More preferably, the blade 51 is made of single crystal diamond. Alternatively, a diamond other than a single crystal may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, a sintered diamond obtained by bonding single crystal or polycrystalline diamond particles with a binding material such as an iron family element may be used. The polycrystalline diamond particles can be produced by sintering fine graphite or non-graphite carbon in the absence of a binder such as an iron family element.

The shank 52 extends along the axial direction AX. In the example shown in Fig. 12, the axial direction AX generally follows the direction in which the ridge portion PS1 extends from the projection PP and the middle direction in which the ridge portion PS2 extends from the projection PP. (51) is attached to the shank (52).

Next, a method of using the cutting mechanism 50 at the time of forming the trench lines TL1 to TL3 (Fig. 9) will be described below.

First, the protrusion PP of the blade 51 (Fig. 12) is pressed to the upper surface SF1 at the position N1 (Fig. 4). Next, the pressed blade 51 is slid on the upper surface SF1 of the glass substrate 4. Then, The blade 51 is slid in the direction DA from the ridge portion PS2 to the ridge portion PS1 on the upper surface SF1. Strictly speaking, the blade 51 is slid in the direction (DA) in which the direction from the ridge portion PS2 to the ridge portion PS1 is projected onto the upper surface SF1. The direction DA substantially follows the direction in which the ridge portions PS1 and the ridge portion PS2 in the vicinity of the projection PP are projected on the upper surface SF1. In Fig. 12, the direction DA corresponds to the direction in which the axial direction AX extending from the blade 51 is projected on the upper surface SF1. Therefore, the blade 51 is attracted by the shank 52 on the upper surface SF1.

Each of the ridge portions PS1 and ridge portions PS2 of the blade 51 (Fig. 12) sliding on the upper surface SF1 of the glass substrate 4 is sandwiched between the upper surface SF1 of the glass substrate 4, And the angle AG1 and the angle AG2. It is preferable that the angle AG2 is larger than the angle AG1. If the angle AG2 is smaller than the angle AG1, the crack line CL1 (Fig. 7) is hard to occur. If the angle AG1 and the angle AG2 are substantially equal to each other, whether or not the crack line CL1 is generated is liable to become unstable. The mechanism by which these events occur is unclear, but it is presumed that the distribution of the stress generated in the glass substrate 4 due to the sliding of the blade 51 is changed by the posture of the blade 51.

(effect)

According to this embodiment, as shown in Figs. 2 and 4, the sliding blade 51 is further slid to the position N3 in order to form the trench line TL1. As a result, as shown in Figs. 5 and 7, the trench line TL2 is formed, and then the crack line CL1 is formed along the trench line TL2. This crack line CL1 reaches the position N2, and a crack line CL2 along the trench line TL1 is formed. From the above, it is possible to easily form the crack line CL2 along the trench line TL1 by further continuing the sliding of the blade 51 for forming the trench line TL1.

The position N1 (Fig. 4) is away from the upper surface SF1 of the glass substrate 4. Fig. This avoids the problem caused by the collision between the edge of the blade 51 and the upper surface SF1 of the glass substrate 4. Concretely, control of the height of the blade 51 is facilitated. In addition, damage to the blade 51 can be suppressed. In addition, breaking of the edge of the glass substrate 4 can be avoided.

The position N3 is away from the edge of the upper surface SF1 of the glass substrate 4 (Fig. 7). Thereby, it is not necessary to necessarily slide the blade 51 to the edge of the upper surface SF1 of the glass substrate 4 in order to generate the crack line CL1. Therefore, it is possible to avoid the problem caused by the knife 51 hitting the edge of the glass substrate 4. Concretely, control of the height of the blade 51 is facilitated. In addition, damage to the blade 51 can be suppressed. In addition, breaking of the edge of the glass substrate 4 can be avoided.

In this embodiment, even after the crack line CL1 is formed, the sliding of the blade 51 continues. 9) is formed by further sliding the blade 51 at a second speed from the position N3 to the position N4 on the upper surface SF1 of the glass substrate 4. In this way, do. This is because it is difficult to predict the timing at which the crack line CL1 is formed or to instantaneously perform the feedback for changing the sliding state of the blade 51 at the moment when the crack line CL1 is formed. For this reason, the formation of the trench line continuously, that is, the formation of the trench line TL3, after a certain time later than the point at which the crack line CL1 is likely to start to be probable, CL1) is a highly practical method for sufficiently improving the probability of occurrence. However, when the use of a high-level control system is allowed, the above-described feedback is possible. In this case, for example, the end point of sliding of the blade 51 may be the position N3.

The position N4 (Fig. 9) is away from the edge of the upper surface SF1 of the glass substrate 4. Fig. Thereby, it is not necessary to slide the blade 51 to the edge of the upper surface SF1 of the glass substrate 4. Therefore, it is possible to avoid the problem caused by the knife 51 hitting the edge of the glass substrate 4. Concretely, control of the height of the blade 51 is facilitated. In addition, damage to the blade 51 can be suppressed. In addition, breaking of the edge of the glass substrate 4 can be avoided.

The distance that the blade 51 slides between the positions N2 and N4 is shorter than the distance that the blade 51 slides between the positions N1 and N2. This increases the ratio of the trench line TL1 in the total distance that the blade 51 slides. Since the first speed at which the trench line TL1 is formed is faster than the second speed at which the trench line TL2 is formed, the time required for the process is shortened. 11) along the trench line TL1 (that is, along the crack line CL2) has a higher quality than that of the broken line along the trench line TL2 (that is, along the crack line CL1) It is possible to increase the proportion of the high quality portion of the cross section.

The distance that the blade 51 (FIG. 9) slides between the position N2 and the position N4 is preferably 2 mm or more, and more preferably 20 mm or more. As a result, the crack line CL1 can be more surely generated.

The second speed, which is the sliding speed of the blade 51 when the trench line TL2 (FIG. 4) is formed, is preferably less than 25 mm / second, and more preferably less than 5 mm / second. As a result, the crack line CL1 can be more surely generated.

≪ Embodiment 2 >

Referring to Figs. 14 and 15, in this embodiment, a cutting mechanism 50u is used instead of the cutting mechanism 50 (Fig. 12). The cutting mechanism 50u has a blade 51u instead of the blade 51 (Figs. 12 and 13). In the blade 51u, a plurality of surfaces surrounding the ceiling scene TD1 and the ceiling scene TD1 are formed. These plurality of surfaces include a side surface TD2 and a side surface TD3. The ceiling scene TD1, the side surface TD2, and the side surface TD3 are oriented in different directions and are adjacent to each other. The blade 51u has a vertex at which the ceiling surface TD1, the side surface TD2 and the side surface TD3 join together and the protrusion PP of the blade 51u is constituted by the vertex. The side surface TD2 and the side surface TD3 form a ridge portion PS extending from the projection PP.

Next, two methods of using the cutting mechanism 50u in forming the trench lines TL1 to TL3 (Fig. 9) will be described below.

In the first use method, first, the protrusion PP of the blade 51u (Fig. 14) is pressed to the upper surface SF1 at the position N1 (Fig. 4). Next, the pressed blade 51u is slid on the upper surface SF1 of the glass substrate 4. Then, The blade 51u is slid in the direction DA from the ceiling scene TD1 to the ridgeline PS on the upper surface SF1. Strictly speaking, the blade 51u slides in the direction DA in which the direction from the ceiling scene TD1 to the ridge portion PS is projected onto the upper surface SF1. The direction DA substantially follows the direction in which the extending direction of the ridge portion PS in the vicinity of the projection PP is projected onto the upper surface SF1. In Fig. 14, the direction DA corresponds to the direction in which the axial direction AX extending from the blade 51u is projected onto the upper surface SF1. Therefore, the blade 51u is attracted by the shank 52 on the upper surface SF1. Each of the ridge line PS and the ceiling surface TD1 of the blade 51u sliding on the upper surface SF1 of the glass substrate 4 is formed so as to be inclined with respect to the upper surface SF1 of the glass substrate 4 AH1 and an angle AH2. In order to easily generate the crack line CL1 (Fig. 7), the posture of the blade 51 may be adjusted so that the angle AH1 becomes smaller and the angle AH2 becomes larger.

In the second use method, the sliding direction of the blade 51u is the direction DB opposite to the direction DA. The blade 51u is advanced by the shank 52 from the position N1 to the position N4 on the upper surface SF1. The posture of the blade 51 may be adjusted so that the angle AH1 becomes larger and the angle AH2 becomes smaller in order to facilitate generation of the crack line CL1 (Fig. 7).

≪ Embodiment 3 >

16 and 17, in this embodiment, a cutting mechanism 50v is used instead of the cutting mechanism 50 (Fig. 12). The cutting mechanism 50v has a blade 51v instead of the blade 51 (Figs. 12 and 13). The blade 51v is formed with a conical surface SC having a vertex as a protrusion PP.

Next, a method of using the cutting mechanism 50v in forming the trench lines TL1 to TL3 (Fig. 9) will be described. First, the protrusion PP of the blade 51v (Fig. 16) is pressed to the upper surface SF1 at the position N1 (Fig. 4). Next, the pressed blade 51v is slid on the upper surface SF1 of the glass substrate 4. Then, In Fig. 16, the direction DA corresponds to the direction in which the axial direction AX extending from the blade 51v is projected onto the upper surface SF1. Thus, the blade 51v is attracted by the shank 52 on the upper surface SF1. In order to facilitate the generation of the crack line CL1 (Fig. 7), the angle formed by the conical surface SC and the upper surface SF1 is set so that the angle (Right side in Fig. 16) in the direction DA as compared to the left side in Fig.

≪ Fourth Embodiment >

18 and 19, in this embodiment, in forming the trench line TL1 and forming the trench line TL2, not only the sliding speed of the blade 51, but also the blade 51, (4) is changed. Concretely, when the trench line TL1 is formed by sliding the blade 51 at the first speed described above, the load of the blade 51 is lower than that of the other embodiments in this embodiment do. The load at the time of forming the trench line TL2 by the sliding of the blade 51 at the above-mentioned second speed is the same as that in the other embodiments. Therefore, the load at the time of forming the trench line TL1 is smaller than the load at the time of forming the trench line TL2. As a result of the selection of the load, the width of the trench line TL1 becomes smaller than the width of the trench line TL2. The depth of the trench line TL1 is smaller than the depth of the trench line TL2.

20 and 21, in the process of forming the trench line TL2, as the sliding blade 51 reaches the position N3 on the upper surface SF1 of the glass substrate 4, A crack of the glass substrate 4 in the thickness direction DT is extended along the trench line TL2 from the position N3 to the position N2 as indicated by R1. As a result, the crack line CL1 is formed. In this embodiment, since the load of the blade 51 at the time of forming the trench line TL1 is small as described above, the crack line CL2 (Figs. 5 and 7), unlike the first embodiment, Is not formed. In other words, a crack line is formed only in the trench line TL1 and the trench line TL2 among the trench line TL2.

Referring to Figs. 22 and 23, thereafter, the sliding of the blade 51 continues from the position N3 to the position N4 for the same reason as in the first embodiment (Figs. 8 and 9). Thus, the trench line TL3 is formed. The load at the time of forming the trench line TL3 may be equal to the load at the time of forming the trench line TL2. Next, the blade 51 is separated from the glass substrate 4 at the position N4. This completes the sliding process of the blade 51 from the position N1 to the position N4 via the position N2 and the position N3 in order.

Next, the glass substrate 4 is divided along the crack line CL1 (in other words, the trench line TL2) and the trench line TL1. Namely, a so-called brake process is performed. The breaking process can be performed by application of an external force to the glass substrate 4. [ A stress applying member (for example, a member called a " break bar ") is formed on the lower surface SF2 toward the crack line CL1 (Fig. 23) on the upper surface SF1 of the glass substrate 4, Stress is applied to the glass substrate 4 so as to crack the crack line CL1. This application of stress acts as a trigger and a crack is extended along the trench line TL1 from the position N2 toward the position N1. Therefore, the position where the glass substrate 4 is divided is defined by the trench line TL1 in addition to the crack line CL1 (in other words, the trench line TL2).

Components other than those described above are substantially the same as those of the other embodiments described above, and thus the same or corresponding elements are denoted by the same reference numerals and description thereof will not be repeated.

According to the present embodiment, the load of the blade 51 at the time of forming the trench line TL1 becomes smaller. As a result, wear of the blade 51 can be suppressed.

In the above embodiments, the upper surface SF1 of the glass substrate 4 is flat. However, the upper surface SF1 may be curved. In addition, although the case where the trench lines TL1 to TL3 are linear is shown, the trench lines TL1 to TL3 may be curved. Since the sliding of the blade 51 on the upper surface SF1 of the glass substrate 4 is performed by the relative movement between the glass substrate 4 and the blade 51, the glass substrate 4 and the blade 51 May be controlled if movement of at least one of them is controlled. The brittle substrate may be made of a brittle material other than glass or may be made of ceramics, silicon, a compound semiconductor, sapphire or quartz, for example. have.

4: Glass substrate (brittle substrate)
50, 50u, 50v: Cutting mechanism
51, 51u, 51v: blade
CL1, CL2: crack line (first and second crack lines
N1 to N4: position (first to fourth positions)
SF1: upper surface (one surface)
TL1 to TL3: trench lines (first to third trench lines)

Claims (8)

As a brittle substrate cutting method,
Forming a first trench line having a groove shape by causing plastic deformation on the one surface by sliding the blade at a first speed from a first position to a second position on one surface of the brittle substrate, Is performed so as to obtain a crack-free state in a state in which the brittle substrate is continuously connected in a direction intersecting the first trench line under the first trench line, the step of forming the first trench line ;
Further sliding the blade at a second speed that is slower than the first speed from the second position to the third position on the one face of the brittle substrate after the step of forming the first trench line, Forming a second trench line having a groove shape by causing plastic deformation on the surface of the brittle substrate in a direction intersecting with the second trench line at a position below the second trench line, Forming the second trench line so as to obtain a crack-free state in a connected state;
The sliced blade reaches the third position in the step of forming the second trench line so that the cracks of the brittle substrate are extended from the third position along the second trench line, Wherein the brittle substrate is disconnected continuously in a direction intersecting with the second trench line under the second trench line by the first crack line, ;
Forming a second crack line by extending a crack of the brittle substrate from the second position along the first trench line as the first crack line reaches the second position, Forming a second crack line under the first trench line by a crack line, wherein the brittle substrate is disconnected continuously in a direction crossing the first trench line; And
And dividing the brittle substrate along the first crack line and the second crack line. The method of claim 1, further comprising: prior to the step of forming the first trench line, bringing the blade disposed away from the brittle substrate closer to the brittle substrate, Further comprising the step of contacting said blade with said brittle substrate, wherein said first position is away from an edge of said one face of said brittle substrate. The method of claim 1, wherein the third location is remote from an edge of the one side of the brittle substrate. 2. The method of claim 1, further comprising, after the step of forming the first crack line, further sliding the blade at the second speed from the third position to the fourth position on the one face of the brittle substrate, Forming a third trench line having a groove shape by causing plastic deformation on one surface, wherein the step of forming the third trench line further comprises: forming a first trench line Cracked state in which the substrate is continuously connected in the direction crossing the third trench line. 5. The method of claim 4, further comprising, after the step of forming the third trench line, releasing the blade from the brittle substrate at the fourth location on the one surface of the brittle substrate, And wherein the fourth location is remote from the edge of the one surface of the brittle substrate. 5. The method of claim 4, wherein the distance that the blade slides between the second position and the fourth position is shorter than the distance that the blade slides between the first position and the second position. 5. The method of claim 4, wherein the distance that the blade slides between the second position and the fourth position is at least 2 mm. 8. A method according to any one of claims 1 to 7, wherein the second speed is less than 25 mm / second.

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