TWI678343B - Breaking method of brittle substrate - Google Patents
Breaking method of brittle substrate Download PDFInfo
- Publication number
- TWI678343B TWI678343B TW104136383A TW104136383A TWI678343B TW I678343 B TWI678343 B TW I678343B TW 104136383 A TW104136383 A TW 104136383A TW 104136383 A TW104136383 A TW 104136383A TW I678343 B TWI678343 B TW I678343B
- Authority
- TW
- Taiwan
- Prior art keywords
- line
- crack
- substrate
- glass substrate
- breaking
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明之脆性基板之分斷方法可準確地沿於其正下方不具有裂痕之溝槽線進行分斷。 The cutting method of the brittle substrate of the present invention can accurately perform cutting along a trench line without cracks directly below it.
將具有第1部分LR及第2部分HR之溝槽線TL,以獲得無裂痕狀態之方式形成於玻璃基板11之第1面SF1上。以第1面SF1與載台對向之方式將玻璃基板11置於載台上。使應力施加構件以接觸於玻璃基板11之第2面SF2中與溝槽線TL之第1部分LR對向之第3部分、且自與第2部分HR對向的第4部分離開之方式接觸於第2面SF2。使應力施加構件接觸之步驟係以第1部分LR保持為無裂痕狀態之方式進行。藉由一面保持應力施加構件接觸於第3部分之狀態,一面使應力施加構件接觸於第4部分,而產生自溝槽線TL之第2部分HR向第1部分LR伸展之裂痕。 A trench line TL having a first portion LR and a second portion HR is formed on the first surface SF1 of the glass substrate 11 so as to obtain a crack-free state. The glass substrate 11 is placed on the stage so that the first surface SF1 faces the stage. The stress applying member is brought into contact with the third portion facing the first portion LR of the trench line TL in the second surface SF2 of the glass substrate 11 and away from the fourth portion facing the second portion HR. On the second side SF2. The step of bringing the stress applying member into contact is performed so that the first portion LR is kept in a crack-free state. By keeping the stress applying member in contact with the third part while keeping the stress applying member in contact with the fourth part, a crack extending from the second part HR of the groove line TL to the first part LR is generated.
Description
本發明係關於一種脆性基板之分斷方法。 The invention relates to a method for breaking a brittle substrate.
於平板顯示器面板或太陽能電池面板等電氣機器之製造中,常常需要將玻璃基板等脆性基板分斷。首先於基板上形成劃線,其次沿該劃線分斷基板。劃線可藉由使用刀尖機械性對基板進行加工而形成。藉由刀尖於基板上滑動或滾動而於基板上形成由塑性變形所致之溝槽,並同時於該溝槽之正下方形成有垂直裂痕。其後,實施稱為分斷步驟之應力賦予。由此藉由使上述垂直裂痕完全沿厚度方向行進而分斷基板。 In the manufacture of electrical equipment such as flat panel display panels or solar cell panels, it is often necessary to break fragile substrates such as glass substrates. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. The scribe line can be formed by mechanically processing a substrate using a blade edge. A groove caused by plastic deformation is formed on the substrate by sliding or rolling the blade tip on the substrate, and at the same time, a vertical crack is formed directly below the groove. Thereafter, a stress application called a breaking step is performed. Thereby, the substrate is divided by allowing the vertical cracks to run completely in the thickness direction.
分斷基板之步驟相對較多的是於在基板形成劃線之步驟後立即進行。然而,亦提出於形成劃線之步驟與分斷步驟之間進行加工基板之步驟。 The relatively large number of steps for breaking the substrate is performed immediately after the step of forming a scribe on the substrate. However, a step of processing a substrate between the step of forming a scribe line and the step of breaking is also proposed.
例如根據國際公開第2002/104078號之技術,於有機EL(electroluminescence,電致發光)顯示器之製造方法中,於安裝密封頂蓋之前,針對成為各有機EL顯示器之每一區域而於玻璃基板上形成劃線。因此,可避免於在設置密封頂蓋之後於玻璃基板上形成劃線時成為問題之密封頂蓋與玻璃切割器之接觸。 For example, according to the technology of International Publication No. 2002/104078, in a method for manufacturing an organic EL (electroluminescence) display, before installing a sealed top cover, a glass substrate is provided for each area that becomes an organic EL display Form a scribe. Therefore, it is possible to avoid contact between the sealing top cover and the glass cutter, which becomes a problem when a scribe is formed on the glass substrate after the sealing top cover is provided.
又,例如根據國際公開第2003/006391號之技術,於液晶顯示面板之製造方法中,將2個玻璃基板於形成劃線之後加以貼合。由此能夠於1次分斷步驟中同時將2片脆性基板分斷。 In addition, for example, according to the technique of International Publication No. 2003/006391, in a method for manufacturing a liquid crystal display panel, two glass substrates are bonded after forming a scribe line. Thereby, two fragile substrates can be cut simultaneously in one cutting step.
[專利文獻1]國際公開第2002/104078號 [Patent Document 1] International Publication No. 2002/104078
[專利文獻2]國際公開第2003/006391號 [Patent Document 2] International Publication No. 2003/006391
根據上述以往之技術,對脆性基板之加工係於形成劃線之後進行,藉由其後之應力賦予而進行分斷步驟。此意味著於對脆性基板加工時沿劃線全體既已存在有垂直裂痕。由此,於加工中意外產生該垂直裂痕於厚度方向上之進一步伸展,由此於加工中本該一體之脆性基板有可能分離。又,即便於未於劃線之形成步驟與基板之分斷步驟之間進行基板之加工步驟之情形時,通常於劃線之形成步驟之後且基板之分斷步驟之前需要搬送或保管基板,此時基板亦有時會意外地被分斷。 According to the conventional technique described above, the processing of the fragile substrate is performed after the scribe line is formed, and the breaking step is performed by applying a subsequent stress. This means that there are already vertical cracks along the entire scribe line when processing a fragile substrate. As a result, during the processing, the vertical crack is further extended in the thickness direction, and the brittle substrate that is supposed to be integrated during processing may be separated. In addition, even when the processing step of the substrate is not performed between the step of forming the scribe line and the step of cutting the substrate, it is usually necessary to transport or store the substrate after the step of forming the scribe line and before the step of cutting the substrate. Sometimes the substrate is accidentally broken.
為解決上述問題,本發明者開發出獨自之分斷技術。根據該技術,首先形成未於正下方具有裂痕之溝槽線作為規定將脆性基板分斷之位置之線。藉由形成有溝槽線而規定將脆性基板分斷之位置。其後,只要維持溝槽線之正下方不存在裂痕之狀態,則不易產生沿溝槽線之分斷。藉由使用該狀態,能夠預先規定將脆性基板分斷之位置,並且亦能夠防止脆性基板於應分斷之時間點之前意外分斷。 In order to solve the above problems, the present inventors have developed a unique breaking technique. According to this technique, first, a groove line having no crack directly below is formed as a line defining a position where the fragile substrate is to be broken. The position where the fragile substrate is divided is defined by the formation of the trench lines. Thereafter, as long as a state where no crack exists directly under the trench line is maintained, it is not easy to generate a break along the trench line. By using this state, the position at which the fragile substrate is broken can be specified in advance, and the fragile substrate can be prevented from being accidentally broken before the time at which the fragile substrate should be broken.
如上所述,溝槽線與通常之劃線相比更難以產生沿其之分斷。由此可防止脆性基板之意外分斷,但另一方面存在沿溝槽線準確地進行脆性基板之分斷之難度提高之問題。 As described above, it is more difficult for the trench line to generate a break along it as compared with a general scribe line. This can prevent accidental breaking of the fragile substrate, but on the other hand, there is a problem that it is difficult to accurately break the fragile substrate along the groove line.
本發明係為解決以上問題而完成者,其目的在於提供一種能夠準確地進行沿於其正下方不具有裂痕之溝槽線之分斷之脆性基板之分斷方法。 The present invention has been made in order to solve the above problems, and an object thereof is to provide a method for cutting a brittle substrate that can accurately perform cutting along a trench line without a crack directly below it.
脆性基板之分斷方法具有以下步驟。 The method for breaking a fragile substrate has the following steps.
準備脆性基板,該脆性基板具有第1面及與第1面相反之第2面,且具有與第1面垂直之厚度方向。 A brittle substrate having a first surface and a second surface opposite to the first surface and having a thickness direction perpendicular to the first surface is prepared.
藉由一面將刀尖向脆性基板之第1面上按壓、一面使刀尖於第1面上移動而於脆性基板之第1面上產生塑性變形,由此形成具有第1及第2部分之溝槽線。形成溝槽線之步驟係以獲得於溝槽線之至少第1部分之正下方脆性基板於與溝槽線交叉之方向上連續地相連之狀態即無裂痕狀態之方式進行。 The blade tip is pressed against the first surface of the fragile substrate while the blade tip is moved on the first surface to cause plastic deformation on the first surface of the fragile substrate, thereby forming the first and second portions. Grooved line. The step of forming the trench line is performed in such a manner as to obtain a state in which the fragile substrate directly below at least the first part of the trench line is continuously connected in a direction crossing the trench line, that is, a crack-free state.
以脆性基板之第1面與載台對向之方式將脆性基板載置於載台上。 The fragile substrate is placed on the stage so that the first surface of the fragile substrate faces the stage.
使應力施加構件以接觸於脆性基板之第2面中與溝槽線之第1部分對向之第3部分、且自與第2部分對向的第4部分離開之方式接觸於脆性基板之第2面。使應力施加構件接觸之步驟係以第1部分保持為無裂痕狀態之方式進行。 The stress-applying member is brought into contact with the third part of the fragile substrate that is opposed to the first part of the trench line and the third part facing away from the fourth part opposite to the second part of the fragile substrate. 2 sides. The step of bringing the stress applying member into contact is performed so that the first part is kept in a crack-free state.
藉由一面保持應力施加構件接觸於脆性基板之第2面之第3部分之狀態,一面使應力施加構件接觸於脆性基板之第2面之第4部分,而產生自溝槽線之第2部分向第1部分伸展之裂痕,由此沿溝槽線分斷脆性基板。 By maintaining the state where the stress applying member is in contact with the third part of the second face of the fragile substrate, and by bringing the stress applying member into contact with the fourth part of the second face of the fragile substrate, the second part of the groove line is generated. The crack extending toward the first part thereby cuts off the fragile substrate along the groove line.
根據本發明,於為分斷脆性基板而使裂痕自溝槽線之第2部分向第1部分伸展時,第2面中與第1部分對向之第3部分預先接觸於應力施加構件。由此抑制裂痕偏離於溝槽線之第1部分而伸展。由此可準確地進行沿溝槽線之分斷。 According to the present invention, when a crack is extended from the second portion of the groove line to the first portion in order to break the brittle substrate, the third portion of the second surface opposing the first portion comes into contact with the stress applying member in advance. As a result, the crack is prevented from extending away from the first portion of the groove line. This allows accurate division along the trench line.
11‧‧‧玻璃基板(脆性基板) 11‧‧‧ glass substrate (brittle substrate)
50、50R、50v‧‧‧劃線器具 50, 50R, 50v
51、51v‧‧‧刀尖 51, 51v‧‧‧‧tip
51R‧‧‧劃線輪 51R‧‧‧ crossed wheel
52‧‧‧柄 52‧‧‧ handle
52R‧‧‧保持器 52R‧‧‧Retainer
80‧‧‧載台 80‧‧‧ carrier
81‧‧‧襯墊物 81‧‧‧ cushion
85‧‧‧分斷桿 85‧‧‧ Breaking lever
AL‧‧‧輔助線 AL‧‧‧Auxiliary line
AX、IVA、IVB、III、VI、VII、IX、X、XIV、XVII、XXI、XL、XLIA‧‧‧線 AX, IVA, IVB, III, VI, VII, IX, X, XIV, XVII, XXI, XL, XLIA ‧‧‧ lines
BL、BM‧‧‧分斷線 BL, BM‧‧‧ branch break
CL、CM‧‧‧裂痕線 CL, CM‧‧‧ Rift Line
CP‧‧‧缺口 CP‧‧‧ gap
CT1、PR、RT‧‧‧箭頭 CT1, PR, RT‧‧‧arrow
DA、DB、DC、DM‧‧‧方向 DA, DB, DC, DM‧‧‧
DT‧‧‧厚度方向 DT‧‧‧thickness direction
EG‧‧‧邊緣 EG‧‧‧Edge
F‧‧‧負荷 F‧‧‧Load
Fi‧‧‧面內成分 Fi‧‧‧ in-plane ingredients
Fp‧‧‧垂直成分 Fp‧‧‧ vertical composition
FL1、FL2、FL3‧‧‧流程 FL1, FL2, FL3 ‧‧‧ flow
HR、HS‧‧‧高負荷區間(第2部分) HR, HS‧‧‧‧High Load Section (Part 2)
LR、LS‧‧‧低負荷區間(第1部分) LR, LS‧‧‧‧Low load interval (Part 1)
M1、M2、M3‧‧‧箭頭 M1, M2, M3‧‧‧ arrows
MS‧‧‧表面形狀 MS‧‧‧ Surface shape
N1、Q1‧‧‧起點 N1, Q1‧‧‧ starting point
N2、Q2、Q3‧‧‧中途點 N2, Q2, Q3
N3、Q4‧‧‧終點 N3, Q4‧‧‧
PF‧‧‧外周部 PF‧‧‧ Peripheral Department
PP、PPv‧‧‧突起部 PP, PPv ‧‧‧ protrusion
PS、PSv‧‧‧側部 PS, PSv‧‧‧ side
R1、R2、R3、R4、R5、R6、T1、T2、T3、T4、T5、T6‧‧‧點 R1, R2, R3, R4, R5, R6, T1, T2, T3, T4, T5, T6‧‧‧points
RX‧‧‧旋轉軸 RX‧‧‧Rotary shaft
S1、S2、S3‧‧‧端點 S1, S2, S3‧‧‧ endpoints
SC‧‧‧圓錐面 SC‧‧‧ cone
SD1‧‧‧頂面 SD1‧‧‧Top
SD2、SD3‧‧‧側面 SD2, SD3‧‧‧ side
SE‧‧‧端面 SE‧‧‧face
SF1‧‧‧上表面(第1面) SF1‧‧‧upper surface (first side)
SF2‧‧‧下表面(第2面) SF2‧‧‧ lower surface (second side)
SP3‧‧‧第3部分 SP3‧‧‧Part 3
SP4‧‧‧第4部分 SP4‧‧‧Part 4
TP1‧‧‧第1部分 TP1‧‧‧Part 1
TP2‧‧‧第2部分 TP2‧‧‧Part 2
TM、TL‧‧‧溝槽線 TM, TL‧‧‧Trench line
圖1係概略性地表示本發明之實施形態1之脆性基板之分斷方法 之流程圖。 FIG. 1 is a schematic view showing a method for cutting a brittle substrate according to Embodiment 1 of the present invention. The flowchart.
圖2係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 2 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 1 of the present invention.
圖3係沿圖2之線III-III之概略剖視圖。 FIG. 3 is a schematic cross-sectional view taken along the line III-III of FIG. 2.
圖4(A)係沿圖2之線IVA-IVA之概略剖視圖,及(B)係沿圖2之線IVB-IVB之概略剖視圖。 FIG. 4 (A) is a schematic cross-sectional view along the line IVA-IVA in FIG. 2, and (B) is a schematic cross-sectional view along the line IVB-IVB in FIG. 2.
圖5係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 5 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 1 of the present invention.
圖6係沿圖5之線VI-VI之概略剖視圖。 FIG. 6 is a schematic cross-sectional view taken along the line VI-VI of FIG. 5.
圖7係沿圖5之線VII-VII之概略剖視圖。 FIG. 7 is a schematic cross-sectional view taken along the line VII-VII in FIG. 5.
圖8係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 8 is a plan view schematically showing one step of a method for cutting a brittle substrate according to the first embodiment of the present invention.
圖9係沿圖8之線IX-IX之概略剖視圖。 FIG. 9 is a schematic cross-sectional view taken along the line IX-IX of FIG. 8.
圖10係沿圖8之線X-X之概略剖視圖。 Fig. 10 is a schematic cross-sectional view taken along the line X-X in Fig. 8.
圖11係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 11 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 1 of the present invention.
圖12係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 12 is a cross-sectional view schematically showing one step of a method for cutting a brittle substrate according to the first embodiment of the present invention.
圖13係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 13 is a cross-sectional view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 1 of the present invention.
圖14係與圖13之箭頭XIV對應之視野上之概略性之側視圖。 FIG. 14 is a schematic side view in a field of view corresponding to the arrow XIV in FIG. 13.
圖15係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 15 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 1 of the present invention.
圖16係概略性地表示本發明之實施形態1之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 16 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to the first embodiment of the present invention.
圖17(A)係概略性地表示本發明之實施形態1之脆性基板之分斷方 法中所使用之劃線器具之構成之側視圖,及(B)係與圖17(A)之箭頭XVII對應之視野上之刀尖之仰視圖。 FIG. 17 (A) is a schematic view showing a breaking direction of a brittle substrate according to Embodiment 1 of the present invention. The side view of the constitution of the scoring device used in the method, and (B) are bottom views of the blade tip in the field of vision corresponding to the arrow XVII in FIG. 17 (A).
圖18係概略性地表示本發明之實施形態1之第1變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 18 is a plan view schematically showing a step of a method for breaking a brittle substrate according to a first modification of the first embodiment of the present invention.
圖19係概略性地表示本發明之實施形態1之第2變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 19 is a plan view schematically showing a step of a method for breaking a brittle substrate according to a second modification of the first embodiment of the present invention.
圖20係概略性地表示本發明之實施形態1之第3變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 20 is a plan view schematically showing one step of a method for breaking a brittle substrate according to a third modification of the first embodiment of the present invention.
圖21(A)係概略性地表示本發明之實施形態1之第4變化例之脆性基板之分斷方法中所使用之劃線器具之構成之側視圖,及(B)係表示與圖21(A)之箭頭XXI對應之視野上之刀尖之仰視圖。 FIG. 21 (A) is a side view schematically showing a configuration of a scribing device used in a method for cutting a brittle substrate according to a fourth modified example of Embodiment 1 of the present invention, and (B) is a view showing the same structure as FIG. 21 Bottom view of the blade tip in the field of view corresponding to arrow XXI of (A).
圖22係概略性地表示本發明之實施形態2之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 22 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 2 of the present invention.
圖23係概略性地表示本發明之實施形態2之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 23 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 2 of the present invention.
圖24係概略性地表示本發明之實施形態2之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 24 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 2 of the present invention.
圖25係概略性地表示本發明之實施形態2之第1變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 25 is a plan view schematically showing one step of a method for breaking a brittle substrate according to a first modification of the second embodiment of the present invention.
圖26係概略性地表示本發明之實施形態2之第1變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 26 is a plan view schematically showing one step of a method for breaking a brittle substrate according to a first modification of the second embodiment of the present invention.
圖27係概略性地表示本發明之實施形態2之第2變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 27 is a plan view schematically showing a step of a method for breaking a brittle substrate according to a second modification of the second embodiment of the present invention.
圖28係概略性地表示本發明之實施形態2之第3變化例之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 28 is a plan view schematically showing one step of a method for breaking a brittle substrate according to a third modification of the second embodiment of the present invention.
圖29係概略性地表示本發明之實施形態2之脆性基板之分斷方法 中所使用之劃線器具之構成之側視圖。 FIG. 29 is a schematic view showing a method for cutting a brittle substrate according to Embodiment 2 of the present invention; Side view of the composition of the marking device used in
圖30(A)係概略性地表示圖29之劃線輪及銷之構成之前視圖,及(B)係圖30(A)之部分放大圖。 Fig. 30 (A) is a front view schematically showing the configuration of the scribing wheel and pin of Fig. 29, and (B) is an enlarged view of a part of Fig. 30 (A).
圖31係概略性地表示本發明之實施形態3之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 31 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 3 of the present invention.
圖32係概略性地表示本發明之實施形態3之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 32 is a plan view schematically showing one step of a method for breaking a brittle substrate according to Embodiment 3 of the present invention.
圖33係概略性地表示本發明之實施形態4之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 33 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 4 of the present invention.
圖34係概略性地表示本發明之實施形態4之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 34 is a plan view schematically showing one step of a method for breaking a brittle substrate according to Embodiment 4 of the present invention.
圖35係概略性地表示本發明之實施形態4之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 35 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 4 of the present invention.
圖36係概略性地表示本發明之實施形態4之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 36 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 4 of the present invention.
圖37係概略性地表示本發明之實施形態4之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 37 is a plan view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 4 of the present invention.
圖38係概略性地表示本發明之實施形態5之脆性基板之分斷方法之流程圖。 Fig. 38 is a flowchart schematically showing a method for cutting a brittle substrate according to a fifth embodiment of the present invention.
圖39係概略性地表示本發明之實施形態5之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 39 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 5 of the present invention.
圖40(A)~(C)係於沿圖39之線XL-XL之視野上依序表示本發明之實施形態5之脆性基板之分斷方法之步驟之概略部分剖視圖。 40 (A)-(C) are schematic partial cross-sectional views showing steps of a method for breaking a fragile substrate according to a fifth embodiment of the present invention in the field of view along the line XL-XL in FIG. 39.
圖41係沿圖39之線XLIA-XLIA之概略剖視圖,(A)係表示無裂痕狀態下之溝槽線之構成之圖,及(B)係於同樣之視野上表示於溝槽線正下方形成有裂痕線之狀態之剖視圖。 Fig. 41 is a schematic cross-sectional view of XLIA-XLIA along the line of Fig. 39, (A) is a diagram showing the structure of a groove line in a state without cracks, and (B) is shown directly below the groove line in the same field A sectional view of a state where a crack line is formed.
圖42係概略性地表示本發明之實施形態5之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 42 is a plan view schematically showing a step of a method for breaking a brittle substrate according to Embodiment 5 of the present invention.
圖43係概略性地表示本發明之實施形態5之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 43 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 5 of the present invention.
圖44係概略性地表示本發明之實施形態5之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 44 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 5 of the present invention.
圖45係與圖44之箭頭XLV對應之視野上之概略性之側視圖。 FIG. 45 is a schematic side view in a field of view corresponding to the arrow XLV of FIG. 44.
圖46係概略性地表示本發明之實施形態5之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 46 is a cross-sectional view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 5 of the present invention.
圖47係概略性地表示本發明之實施形態5之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 47 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 5 of the present invention.
圖48係概略性地表示本發明之實施形態6之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 48 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 6 of the present invention.
圖49係概略性地表示本發明之實施形態7之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 49 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 7 of the present invention.
圖50係概略性地表示本發明之實施形態7之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 50 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 7 of the present invention.
圖51係概略性地表示本發明之實施形態7之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 51 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 7 of the present invention.
圖52係概略性地表示本發明之實施形態8之脆性基板之分斷方法之流程圖。 Fig. 52 is a flowchart schematically showing a method for cutting a brittle substrate according to Embodiment 8 of the present invention.
圖53係概略性地表示本發明之實施形態8之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 53 is a plan view schematically showing one step of a method for breaking a brittle substrate according to Embodiment 8 of the present invention.
圖54係概略性地表示本發明之實施形態8之脆性基板之分斷方法之一步驟之俯視圖。 Fig. 54 is a plan view schematically showing one step of a method for breaking a brittle substrate according to Embodiment 8 of the present invention.
圖55係圖54之箭頭XLV之視野上之脆性基板之端面之概略部分側 視圖。 Fig. 55 is a schematic partial side of the end face of the brittle substrate in the field of view of the arrow XLV of Fig. 54 view.
圖56係概略性地表示本發明之實施形態8之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 56 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 8 of the present invention.
圖57係概略性地表示本發明之實施形態8之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 57 is a cross-sectional view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 8 of the present invention.
圖58係概略性地表示本發明之實施形態8之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 58 is a cross-sectional view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 8 of the present invention.
圖59係概略性地表示本發明之實施形態8之脆性基板之分斷方法之一步驟之剖視圖。 FIG. 59 is a cross-sectional view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 8 of the present invention.
圖60係概略性地表示本發明之實施形態9之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 60 is a plan view schematically showing one step of a method for cutting a brittle substrate according to Embodiment 9 of the present invention.
圖61係概略性地表示本發明之實施形態9之脆性基板之分斷方法之一步驟之俯視圖。 FIG. 61 is a plan view schematically showing a step of a method for cutting a brittle substrate according to Embodiment 9 of the present invention.
以下,基於圖式對本發明之各實施形態之脆性基板之分斷方法進行說明。再者,於以下之圖式中對相同或相當之部分附上相同參照編號,且不重複其說明。 Hereinafter, a method for dividing a brittle substrate according to each embodiment of the present invention will be described based on the drawings. Moreover, the same or equivalent parts are given the same reference numerals in the drawings below, and descriptions thereof are not repeated.
以下參照流程FL1(圖1)對本實施形態之玻璃基板11(脆性基板)之分斷方法進行說明。 Hereinafter, a method for cutting the glass substrate 11 (brittle substrate) according to this embodiment will be described with reference to the flow FL1 (FIG. 1).
參照圖2~圖4來準備玻璃基板11(圖1:步驟S110)。玻璃基板11具有上表面SF1(第1面)、及下表面SF2(與第1面相反之第2面)。又,玻璃基板11具有與上表面SF1垂直之厚度方向DT。 The glass substrate 11 is prepared with reference to FIGS. 2 to 4 (FIG. 1: step S110). The glass substrate 11 has an upper surface SF1 (first surface) and a lower surface SF2 (second surface opposite to the first surface). The glass substrate 11 has a thickness direction DT perpendicular to the upper surface SF1.
又,準備具有刀尖之劃線器具。下文對劃線器具之詳細內容進行敍述。 In addition, a scribing tool having a blade tip is prepared. The details of the scribing device are described below.
接下來,一面將刀尖向玻璃基板11之上表面SF1上按壓,一面使 刀尖51於上表面SF1上自起點N1經由中途點N2向終點N3移動。由此於玻璃基板11之上表面SF1上產生塑性變形。由此於上表面SF1上,形成有自起點N1經由中途點N2向終點N3延伸之溝槽線TL(圖1:步驟S120)。於圖2中,藉由刀尖向方向DA移動而形成有3個TL。 Next, while pressing the blade tip against the upper surface SF1 of the glass substrate 11, The blade point 51 moves on the upper surface SF1 from the start point N1 to the end point N3 via the halfway point N2. As a result, plastic deformation occurs on the upper surface SF1 of the glass substrate 11. As a result, a groove line TL extending from the starting point N1 to the ending point N3 via the halfway point N2 is formed on the upper surface SF1 (FIG. 1: Step S120). In FIG. 2, three TLs are formed by the blade tip moving in the direction DA.
形成溝槽線TL之步驟包括:形成低負荷區間LR(第1部分)作為溝槽線TL之一部分之步驟(圖1:步驟S120L);及形成高負荷區間HR(第2部分)作為溝槽線TL之一部分之步驟(圖1:步驟S120H)。於圖2中,自起點N1至中途點N2形成有低負荷區間,且自中途點N2至終點N3形成有高負荷區間。於形成高負荷區間HR之步驟中施加至刀尖51之負荷,高於在形成低負荷區間LR之步驟所使用之負荷。反言之,於形成低負荷區間LR之步驟中施加至刀尖51之負荷,低於在形成高負荷區間HR之步驟所使用之負荷,例如為高負荷區間HR之負荷之30~50%左右。因此,高負荷區間HR之寬度大於低負荷區間LR之寬度。例如,高負荷區間HR具有10μm之寬度,低負荷區間LR具有5μm之寬度。又高負荷區間HR之深度大於低負荷區間LR之深度。溝槽線TL之剖面例如具有角度150°左右之V字形狀。 The step of forming the trench line TL includes: forming a low load section LR (part 1) as a part of the trench line TL (FIG. 1: step S120L); and forming a high load section HR (part 2) as a trench Step of a part of the line TL (FIG. 1: Step S120H). In FIG. 2, a low-load interval is formed from the start point N1 to the halfway point N2, and a high-load interval is formed from the halfway point N2 to the end point N3. The load applied to the cutting edge 51 in the step of forming the high load section HR is higher than the load used in the step of forming the low load section LR. In other words, the load applied to the cutting edge 51 in the step of forming the low load section LR is lower than the load used in the step of forming the high load section HR, for example, about 30 to 50% of the load in the high load section HR. . Therefore, the width of the high load interval HR is larger than the width of the low load interval LR. For example, the high-load interval HR has a width of 10 μm, and the low-load interval LR has a width of 5 μm. The depth of the high load interval HR is greater than the depth of the low load interval LR. The cross section of the trench line TL has, for example, a V shape with an angle of about 150 °.
形成溝槽線TL之步驟係以獲得於溝槽線TL之高負荷區間HR及低負荷區間LR之正下方玻璃基板11於與溝槽線TL交叉之方向DC(圖4(A)及(B))上連續地相連之狀態即無裂痕狀態之方式進行。因此,施加至刀尖之負荷大至使玻璃基板11產生塑性變形之程度,且小至不產生以該塑性變形部為起點之裂痕之程度。 The step of forming the trench line TL is to obtain the glass substrate 11 directly below the high-load interval HR and the low-load interval LR of the trench line TL in a direction crossing the trench line TL (FIG. 4 (A) and (B )) Is performed in a state of being continuously connected, that is, a state without cracks. Therefore, the load applied to the blade edge is large enough to cause plastic deformation of the glass substrate 11 and small enough not to generate cracks starting from the plastic deformed portion.
其次,如以下般形成裂痕線(圖1:步驟S130)。 Next, a crack line is formed as follows (FIG. 1: Step S130).
參照圖5~圖7,首先於玻璃基板11之上表面SF1上形成與高負荷區間HR交叉之輔助線AL。輔助線AL伴隨有沿玻璃基板11之厚度方向滲透之裂痕。輔助線AL可利用通常之劃線方法形成。 Referring to FIGS. 5 to 7, an auxiliary line AL that intersects the high-load section HR is first formed on the upper surface SF1 of the glass substrate 11. The auxiliary line AL is accompanied by a crack that penetrates in the thickness direction of the glass substrate 11. The auxiliary line AL can be formed by a general scribing method.
其次,使玻璃基板11沿輔助線AL分離。該分離可利用通常之分 斷步驟進行。以該分離為契機,厚度方向上之玻璃基板11之裂痕沿溝槽線TL僅於溝槽線TL中之高負荷區間HR伸展。 Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can use the usual points The breaking step is performed. Taking this separation as an opportunity, the crack of the glass substrate 11 in the thickness direction extends along the groove line TL only in the high-load interval HR in the groove line TL.
參照圖8及圖9,藉由以上步驟而僅沿溝槽線TL之低負荷區間LR及高負荷區間HR中之高負荷區間HR產生裂痕。具體而言,於高負荷區間HR中之藉由分離而新產生之邊與中途點N2之間之部分形成有裂痕線CL。形成裂痕線CL之方向與形成有溝槽線TL之方向DA(圖2)相反。再者,難以於藉由分離而新產生之邊與終點N3之間之部分形成裂痕線CL。該方向相依性起因於形成高負荷區間HR時之刀尖之狀態,下文進行詳細敍述。 Referring to FIGS. 8 and 9, by the above steps, cracks are generated only along the low-load interval LR and the high-load interval HR of the high-load interval HR along the groove line TL. Specifically, a crack line CL is formed in a portion between the edge newly generated by separation and the halfway point N2 in the high-load interval HR. The direction in which the crack line CL is formed is opposite to the direction DA (FIG. 2) in which the trench line TL is formed. Furthermore, it is difficult to form a crack line CL in a part between the newly generated edge and the end point N3 by separation. This direction dependency is due to the state of the blade tip when the high-load section HR is formed, which will be described in detail below.
參照圖10,藉由裂痕線CL而於溝槽線TL之高負荷區間HR之正下方,玻璃基板11於與溝槽線TL之延伸方向交叉之方向DC上之連續之相連被斷開。此處“連續之相連”,換言之係指未被裂痕截斷之相連。再者,於如上所述般連續之相連被斷開之狀態下,玻璃基板11之部分彼此亦可隔著裂痕線CL之裂痕而接觸。 Referring to FIG. 10, by the crack line CL directly below the high load interval HR of the trench line TL, the continuous connection of the glass substrate 11 in the direction DC crossing the extending direction of the trench line TL is disconnected. Here, "continuous connection", in other words, refers to the connection that has not been cut off by the fissure. In addition, in a state where the continuous connection is disconnected as described above, portions of the glass substrates 11 may be in contact with each other via the crack of the crack line CL.
其次,進行沿溝槽線TL分斷玻璃基板11之分斷步驟(圖1:步驟S140)。此時,藉由對玻璃基板11施加應力而使裂痕以裂痕線CL為起點沿低負荷區間LR伸展。裂痕伸展之方向(圖11之箭頭PR)與形成有溝槽線TL之方向DA(圖2)相反。 Next, a cutting step of cutting the glass substrate 11 along the trench line TL is performed (FIG. 1: step S140). At this time, the stress is applied to the glass substrate 11 so that the cracks extend along the low load section LR starting from the crack line CL. The direction in which the crack extends (arrow PR in FIG. 11) is opposite to the direction DA (FIG. 2) in which the trench line TL is formed.
接下來,對上述分斷步驟之詳細內容進行以下說明。 Next, the details of the above-mentioned breaking step will be described below.
參照圖12,以玻璃基板11之上表面SF1隔著襯墊物81而與載台80對向之方式,將形成有裂痕線CL之玻璃基板11(圖9)隔著襯墊物81而載置於載台80上。襯墊物81包含較玻璃基板11及載台80之材料更易於變形之材料。 Referring to FIG. 12, a glass substrate 11 (FIG. 9) having a crack line CL formed thereon is placed on the top surface SF1 of the glass substrate 11 and faces the stage 80 with a spacer 81 interposed therebetween. It is placed on the stage 80. The spacer 81 includes a material that is easier to deform than the materials of the glass substrate 11 and the stage 80.
參照圖13及圖14來準備分斷桿85(應力施加構件)。分斷桿85較佳為如圖14所示般具有以能夠局部性地按壓玻璃基板11之表面之方式突出之形狀,於圖14中具有大致V字狀之形狀。如圖13所示般,該分斷 桿85之突出部分呈直線狀延伸。 13 and 14, a breaking lever 85 (a stress applying member) is prepared. The breaking lever 85 preferably has a shape protruding as shown in FIG. 14 so as to be able to locally press the surface of the glass substrate 11, and has a substantially V-shape in FIG. 14. As shown in Figure 13, the break The protruding portion of the rod 85 extends linearly.
其次,使分斷桿85接觸於玻璃基板11之下表面SF2之一部分。該分斷桿85之接觸部分自下表面SF2中於厚度方向(圖13之縱向)上與裂痕線CL對向之部分SP4離開。部分SP4亦為下表面SF2中於厚度方向上與高負荷區間HR對向之部分。 Next, the breaking lever 85 is brought into contact with a part of the lower surface SF2 of the glass substrate 11. The contact portion of the breaking lever 85 is separated from the portion SP4 of the lower surface SF2 that faces the crack line CL in the thickness direction (longitudinal direction in FIG. 13). Part SP4 is also the part of the lower surface SF2 that faces the high load section HR in the thickness direction.
其次,如箭頭CT1所示般,上述接觸部分沿溝槽線TL之低負荷區間LR擴展,且向部分SP4之側靠近。於上述之最初接觸時,或藉由繼其後之接觸部分之擴展,而產生分斷桿85於下表面SF2上接觸於與低負荷區間LR對向之部分SP3(第3部分)、且自上述之部分SP4(第4部分)離開之狀態。此種選擇性之接觸例如可藉由使具有某種程度之彈性之分斷桿85之姿勢變化而容易地獲得。再者,於該時間點,低負荷區間LR保持於無裂痕狀態。 Next, as indicated by arrow CT1, the above-mentioned contact portion extends along the low-load interval LR of the trench line TL and approaches the side of the portion SP4. At the initial contact mentioned above, or by the subsequent extension of the contact part, the breaking lever 85 is brought into contact with the part SP3 (part 3) opposite to the low load section LR on the lower surface SF2, and since The above part SP4 (Part 4) is left. Such selective contact can be easily obtained, for example, by changing the posture of the breaking lever 85 having a certain degree of elasticity. Moreover, at this point in time, the low load section LR is maintained in a crack-free state.
參照圖15,如箭頭CT2所示般擴展進一步行進,從而上述接觸部分到達部分SP4。換言之,一面保持分斷桿85接觸於玻璃基板11之下表面SF2之部分SP3之狀態,一面使分斷桿85接觸於玻璃基板11之下表面SF2之部分SP4。由此分斷桿85藉由上述步驟而首先對裂痕線CL中之低負荷區間LR施加應力,其後,進而亦同時對裂痕線CL施加應力。藉由該應力而使裂痕自裂痕線CL(圖15)沿低負荷區間LR伸展(參照圖16之箭頭PR)。換言之,產生自溝槽線TL之高負荷區間HR向低負荷區間LR伸展之裂痕。其結果,沿溝槽線TL分斷玻璃基板11。 Referring to FIG. 15, as shown by an arrow CT2, the expansion is further advanced so that the above-mentioned contact portion reaches the portion SP4. In other words, while maintaining the state of the part SP3 of the breaking lever 85 in contact with the lower surface SF2 of the glass substrate 11, the state of the breaking lever 85 in contact with the part SP4 of the lower surface SF2 of the glass substrate 11. As a result, the breaking lever 85 first applies stress to the low-load interval LR in the crack line CL by the above steps, and thereafter, also simultaneously applies stress to the crack line CL. Due to the stress, the crack is extended from the crack line CL (FIG. 15) along the low load section LR (see arrow PR in FIG. 16). In other words, a crack is generated that extends from the high load section HR to the low load section LR of the groove line TL. As a result, the glass substrate 11 is cut along the trench line TL.
藉由以上之分斷步驟而進行玻璃基板之分斷(圖11)。 The glass substrate is divided by the above-mentioned division steps (FIG. 11).
參照圖17(A)及(B),對適於形成上述之溝槽線TL之劃線器具50進行說明。劃線器具50藉由利用安裝於劃線頭(未圖示)來相對於玻璃基板11相對性地移動而對玻璃基板11進行劃線。劃線器具50具有刀尖51及柄52。刀尖51被保持於柄52。 17 (A) and (B), the scribe tool 50 suitable for forming the above-mentioned groove line TL is demonstrated. The scribing tool 50 scribes the glass substrate 11 by being relatively moved with respect to the glass substrate 11 by being mounted on a scribing head (not shown). The scribing tool 50 includes a blade point 51 and a handle 52. The blade tip 51 is held by the shank 52.
於刀尖51設置有頂面SD1(第1面)、及包圍頂面SD1之多個面。這 些多個面包含側面SD2(第2面)及側面SD3(第3面)。頂面SD1、側面SD2及SD3朝向互不相同之方向,且相互相鄰。刀尖51具有頂面SD1、側面SD2及SD3合流之頂點,由該頂點構成刀尖51之突起部PP。又,側面SD2及SD3形成構成刀尖51之側部PS之稜線。側部PS自突起部PP呈線狀延伸。又,側部PS如上所述為稜線,因此具有呈線狀延伸之凸形狀。 The cutting edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. This These multiple surfaces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top faces SD1, the side faces SD2, and SD3 face different directions and are adjacent to each other. The cutting edge 51 has a vertex at which the top surface SD1, the lateral surfaces SD2, and SD3 merge, and the apex constitutes a protrusion PP of the cutting edge 51. In addition, the side surfaces SD2 and SD3 form a ridge line forming the side portion PS of the blade edge 51. The side portion PS extends linearly from the protrusion portion PP. Since the side portion PS is a ridge line as described above, it has a convex shape extending linearly.
刀尖51較佳為金剛石筆。即較佳為刀尖51由金剛石製成。該情形時,能夠容易地使硬度較高且使表面粗糙度較小。更較佳為刀尖51由單晶金剛石製成。就結晶學上而言,進而較佳為頂面SD1為{001}面,側面SD2及SD3之各者為{111}面。該情形時,側面SD2及SD3雖然具有相異之方向,但於結晶學上為相互等效之結晶面。 The blade 51 is preferably a diamond pen. That is, it is preferable that the cutting edge 51 is made of diamond. In this case, the hardness can be easily made high and the surface roughness can be made small. More preferably, the cutting edge 51 is made of single crystal diamond. In terms of crystallography, it is further preferred that the top surface SD1 is a {001} surface, and each of the side surfaces SD2 and SD3 is a {111} surface. In this case, although the side faces SD2 and SD3 have different directions, they are crystallographically equivalent crystalline faces.
再者,亦可使用不為單晶之金剛石,例如,亦可使用利用CVD(Chemical Vapor Deposition,化學氣相沈積)法合成之多晶金剛石。或者,亦可使用由微粒石墨或非石墨狀碳於不包含鐵族元素等結合材之情形時進行燒結而成之多晶金剛石,或藉由鐵族元素等結合材使金剛石粒子結合之燒結金剛石。 Furthermore, diamonds other than single crystals can also be used. For example, polycrystalline diamonds synthesized by a CVD (Chemical Vapor Deposition) method can also be used. Alternatively, polycrystalline diamond sintered from particulate graphite or non-graphite carbon without a binding material such as iron group elements, or sintered diamond in which diamond particles are bonded by a binding material such as iron group elements .
柄52沿軸方向AX延伸。刀尖51較佳為以頂面SD1之法線方向大致沿軸方向AX之方式安裝於柄52上。 The shank 52 extends in the axial direction AX. The blade point 51 is preferably mounted on the shank 52 such that the normal direction of the top surface SD1 is substantially along the axial direction AX.
於使用劃線器具50之溝槽線TL之形成中,首先將刀尖51按壓於玻璃基板11之上表面SF1。具體而言,將刀尖51之突起部PP及側部PS向玻璃基板11所具有之厚度方向DT按壓。 In the formation of the trench line TL using the scribing device 50, the blade tip 51 is first pressed against the upper surface SF1 of the glass substrate 11. Specifically, the protruding portion PP and the side portion PS of the blade point 51 are pressed in the thickness direction DT of the glass substrate 11.
其次,使被按壓之刀尖51於上表面SF1上朝方向DA滑動。方向DA為將自突起部PP沿側部PS延伸之方向投影至上表面SF1上而成之方向,大致對應於將軸方向AX向上表面SF1上投影而成之方向。於滑動時,刀尖51藉由柄52而於上表面SF1上牽引滑動。藉由該滑動而於 玻璃基板11之上表面SF1上產生塑性變形。藉由該塑性變形而形成有溝槽線TL。 Next, the pressed blade point 51 is slid in the direction DA on the upper surface SF1. The direction DA is a direction obtained by projecting a direction extending from the protruding portion PP along the side portion PS onto the upper surface SF1, and substantially corresponds to a direction obtained by projecting the axial direction AX onto the upper surface SF1. When sliding, the blade 51 is pulled and slid on the upper surface SF1 by the handle 52. With this sliding Plastic deformation occurs on the upper surface SF1 of the glass substrate 11. The groove lines TL are formed by the plastic deformation.
再者,於本實施形態中之自起點N1向終點N3之溝槽線TL之形成中,當使刀尖51朝方向DB移動時,換言之,當以刀尖51之移動方向為基準而刀尖51之姿勢向反方向傾斜時,與使用方向DA之情形相比,更難以產生圖9所示之裂痕線CL之形成、及圖16所示之裂痕之行進。更一般而言,於藉由刀尖51朝方向DA之移動而形成之溝槽線TL中,於與方向DA相反之方向上裂痕易於伸展。另一方面,於藉由刀尖51朝方向DB之移動而形成之溝槽線TL中,於與方向DB相同之方向上裂痕易於伸展。推測該方向相依性可能與由形成溝槽線TL時所產生之塑性變形所致產生於玻璃基板11內之應力分佈相關。 Furthermore, in the formation of the groove line TL from the start point N1 to the end point N3 in this embodiment, when the tool tip 51 is moved toward the direction DB, in other words, when the tool tip 51 is moved based on the moving direction of the tool tip 51 as a reference, the tool tip When the posture of 51 is tilted in the opposite direction, it is more difficult to generate the crack line CL shown in FIG. 9 and the progress of the crack shown in FIG. 16 than in the case of using the direction DA. More generally, in the groove line TL formed by the movement of the blade point 51 in the direction DA, a crack is easily extended in a direction opposite to the direction DA. On the other hand, in the groove line TL formed by the movement of the blade point 51 in the direction DB, a crack is easily extended in the same direction as the direction DB. It is speculated that the direction dependency may be related to the stress distribution in the glass substrate 11 caused by the plastic deformation generated when the trench line TL is formed.
根據本實施形態,於為分斷玻璃基板11而使裂痕自溝槽線TL之高負荷區間HR向低負荷區間LR伸展時(圖16:箭頭PR),如圖15所示般,下表面SF2中與低負荷區間LR對向之部分預先接觸於分斷桿85。由此抑制裂痕偏離於溝槽線TL之低負荷區間LR而伸展。由此可準確地沿溝槽線TL進行分斷。 According to this embodiment, when the crack is extended from the high load section HR to the low load section LR of the groove line TL to break the glass substrate 11 (FIG. 16: arrow PR), as shown in FIG. 15, the lower surface SF2 The portion facing the middle and low load section LR is in contact with the breaking lever 85 in advance. As a result, the crack is prevented from extending away from the low load interval LR of the trench line TL. This makes it possible to accurately cut off along the trench line TL.
又,於分斷玻璃基板11之步驟之前,僅沿溝槽線TL之低負荷區間LR及高負荷區間HR中之高負荷區間HR形成裂痕線CL(圖9)。即,於分斷步驟之前,形成作為玻璃基板11之分斷起點之裂痕線CL。由此可更切實地進行分斷步驟中之玻璃基板11之分斷。 In addition, before the step of breaking the glass substrate 11, a crack line CL is formed only along the low load section LR and the high load section HR of the groove line TL (FIG. 9). That is, before the breaking step, a crack line CL is formed as a breaking point of the glass substrate 11. This makes it possible to more reliably perform the division of the glass substrate 11 in the division step.
又,於形成用以規定將玻璃基板11分斷之位置之溝槽線TL(圖2及圖3)時,與高負荷區間HR相比而於低負荷區間LR中,對刀尖51(圖17(A))施加之負荷減輕。由此能夠減小刀尖51之損傷。 In addition, when the groove line TL (FIG. 2 and FIG. 3) for defining the position where the glass substrate 11 is divided is formed, the tool tip 51 (FIG. 17 (A)) The load applied is reduced. This can reduce damage to the blade tip 51.
又,於低負荷區間LR及高負荷區間HR中之低負荷區間LR為無裂痕狀態之情形時(圖8及圖9),於低負荷區間LR中無成為分斷玻璃基板11之起點之裂痕。由此於在該狀態下對玻璃基板11進行任意處理之情 形時,即便對低負荷區間LR施加意外之應力,玻璃基板11亦難以意外地產生分斷。由此能夠穩定地進行上述處理。 Further, when the low-load interval LR in the low-load interval LR and the low-load interval LR in the high-load interval HR is in a crack-free state (FIGS. 8 and 9), there is no crack in the low-load interval LR that becomes the starting point for breaking the glass substrate 11. . Therefore, in this state, the glass substrate 11 is arbitrarily processed. In the shape, even if an unexpected stress is applied to the low load section LR, it is difficult for the glass substrate 11 to be accidentally broken. Thereby, the above-mentioned processing can be performed stably.
又,於低負荷區間LR及高負荷區間HR之兩者為無裂痕狀態之情形時(圖2及圖3),於溝槽線TL上無成為分斷玻璃基板11之起點之裂痕。由此於在該狀態下對玻璃基板11進行任意處理之情形時,即便對溝槽線TL施加意外之應力,玻璃基板11亦難以意外地產生分斷。由此能夠穩定地進行上述處理。 In addition, when both the low load section LR and the high load section HR are in a crack-free state (FIGS. 2 and 3), there is no crack on the groove line TL that becomes the starting point for breaking the glass substrate 11. Therefore, when the glass substrate 11 is arbitrarily processed in this state, even if an unexpected stress is applied to the trench line TL, it is difficult for the glass substrate 11 to be accidentally broken. Thereby, the above-mentioned processing can be performed stably.
又,溝槽線TL係於形成輔助線AL之前形成。由此,可避免於形成溝槽線TL時對輔助線AL造成影響。尤其,可避免為形成溝槽線TL而使刀尖51通過輔助線AL上後立即發生形成異常。 The trench line TL is formed before the auxiliary line AL is formed. Accordingly, it is possible to avoid affecting the auxiliary line AL when the trench line TL is formed. In particular, it is possible to avoid formation abnormality immediately after the blade tip 51 passes over the auxiliary line AL to form the groove line TL.
接下來,對實施形態1之變化例進行以下說明。 Next, a modification of the first embodiment will be described below.
參照圖18,亦能以輔助線AL與溝槽線TL交叉為契機而形成裂痕線CL。於在形成輔助線AL時對玻璃基板11施加之應力較大之情形時會產生該現象。 Referring to FIG. 18, the crack line CL can also be formed by taking the opportunity of the auxiliary line AL and the groove line TL crossing. This phenomenon occurs when the stress applied to the glass substrate 11 when forming the auxiliary line AL is large.
參照圖19,亦可於玻璃基板11之上表面SF1,首先形成輔助線AL,其後形成溝槽線TL(圖19中未圖示)。 Referring to FIG. 19, an auxiliary line AL may be formed on the upper surface SF1 of the glass substrate 11 first, and then a trench line TL is formed (not shown in FIG. 19).
參照圖20,輔助線AL亦能以於平面佈局中與高負荷區間HR交叉之方式形成於玻璃基板11之下表面SF2上。由此,能夠於不相互影響之情形時形成輔助線AL及溝槽線TL之兩者。 Referring to FIG. 20, the auxiliary line AL can also be formed on the lower surface SF2 of the glass substrate 11 in such a manner as to intersect the high load section HR in a planar layout. This makes it possible to form both the auxiliary line AL and the trench line TL when they do not affect each other.
參照圖21(A)及(B),亦可使用劃線器具50v來代替劃線器具50(圖17(A)及(B))。刀尖51v呈具有頂點及圓錐面SC之圓錐形狀。刀尖51v之突起部PPv由頂點構成。刀尖之側部PSv係自頂點沿於圓錐面SC上延伸之假想線(圖21(B)之虛線)而構成。由此,側部PSv具有呈線狀延伸之凸形狀。 Referring to Figs. 21 (A) and (B), a scribing device 50v may be used instead of the scribing device 50 (Figs. 17 (A) and (B)). The cutting edge 51v has a conical shape having a vertex and a conical surface SC. The protruding portion PPv of the blade point 51v is constituted by a vertex. The side portion PSv of the cutting edge is constituted from an apex along an imaginary line (dashed line in FIG. 21 (B)) extending on the conical surface SC. Thereby, the side portion PSv has a convex shape extending linearly.
參照圖22,首先準備玻璃基板11。又準備具有刀尖之劃線器具。 下文對劃線器具之詳細內容進行敍述。 22, first, a glass substrate 11 is prepared. A scoring device with a blade tip is also prepared. The details of the scribing device are described below.
其次,藉由刀尖於玻璃基板11之上表面SF1上之朝方向DB之移動,而於上表面SF1上形成與後述之高負荷區間HR(圖23)交叉之輔助線AL。 Next, an auxiliary line AL is formed on the upper surface SF1 that intersects a later-described high load section HR (FIG. 23) by moving the blade point in the direction DB on the upper surface SF1 of the glass substrate 11.
參照圖23,藉由刀尖朝方向DB之移動,而於玻璃基板11之上表面SF1上自起點Q1經由中途點Q2及Q3並至終點Q4形成有溝槽線TL。形成有自起點Q1至中途點Q2、及自中途點Q3至終點Q4之溝槽線TL作為低負荷區間LR。形成有自中途點Q2至中途點Q3之溝槽線TL作為高負荷區間HR。 Referring to FIG. 23, a groove line TL is formed on the upper surface SF1 of the glass substrate 11 from the starting point Q1 through the midpoints Q2 and Q3 and to the ending point Q4 by moving the blade tip in the direction DB. A groove line TL is formed from the start point Q1 to the halfway point Q2 and from the halfway point Q3 to the end point Q4 as the low-load interval LR. A groove line TL from the halfway point Q2 to the halfway point Q3 is formed as the high load section HR.
其次,使玻璃基板11沿輔助線AL分離。該分離可藉由通常之分斷步驟而進行。以該分離為契機,厚度方向上之玻璃基板11之裂痕沿溝槽線TL僅於溝槽線TL中之高負荷區間HR伸展。 Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a usual breaking step. Taking this separation as an opportunity, the crack of the glass substrate 11 in the thickness direction extends along the groove line TL only in the high-load interval HR in the groove line TL.
參照圖24,藉由上述裂痕之伸展,沿溝槽線TL之一部分而形成有裂痕線CL。具體而言,於高負荷區間HR中藉由分離而新產生之邊與中途點Q3之間之部分形成有裂痕線CL。形成裂痕線CL之方向與形成有溝槽線TL之方向DB(圖23)相同。再者,於藉由分離而新產生之邊與中途點Q2之間之部分形成有裂痕線CL。該方向相依性起因於形成高負荷區間HR時之刀尖之狀態,下文進行詳細敍述。 Referring to FIG. 24, a crack line CL is formed along a portion of the groove line TL by the extension of the crack. Specifically, a crack line CL is formed in a portion between the edge newly generated by separation and the halfway point Q3 in the high load section HR. The direction in which the crack line CL is formed is the same as the direction DB (FIG. 23) in which the trench line TL is formed. Furthermore, a crack line CL is formed in a portion between the edge newly generated by the separation and the halfway point Q2. This direction dependency is due to the state of the blade tip when the high-load section HR is formed, which will be described in detail below.
其次,藉由與實施形態1相同之分斷步驟(圖12~圖16),進行以裂痕線CL為起點沿溝槽線TL並自中途點Q3向終點Q4使裂痕伸展之分斷步驟。由此分斷脆性基板11。 Next, with the same breaking step (FIG. 12 to FIG. 16) as in the first embodiment, a breaking step of extending the crack along the groove line TL starting from the crack line CL and extending from the halfway point Q3 to the end point Q4 is performed. Thereby, the fragile substrate 11 is cut.
參照圖25及圖26,作為第1變化例,亦可首先形成溝槽線TL,其後形成輔助線AL。參照圖27,作為第2變化例,亦能以形成輔助線AL為契機而形成裂痕線CL。參照圖28,輔助線AL亦能以於平面佈局上與高負荷區間HR交叉之方式形成於玻璃基板11之下表面SF2上。又,於本實施形態中高負荷區間HR形成於自中途點Q2至Q3,但只要高負 荷區間HR形成於與輔助線AL交叉之部分即可,例如亦可形成於自起點Q1至中途點Q3。 25 and 26, as a first modification, the trench line TL may be formed first, and the auxiliary line AL may be formed after that. Referring to FIG. 27, as a second modification example, a crack line CL can also be formed with the formation of the auxiliary line AL as an opportunity. Referring to FIG. 28, the auxiliary line AL can also be formed on the lower surface SF2 of the glass substrate 11 in such a manner as to intersect with the high-load section HR in a planar layout. In addition, in the present embodiment, the high-load interval HR is formed from the halfway point Q2 to Q3. The charge interval HR may be formed at a portion crossing the auxiliary line AL, and may be formed from the starting point Q1 to the halfway point Q3, for example.
接下來,參照圖29對適於本實施形態之溝槽線TL之形成之劃線器具50R進行說明。劃線器具50R具有劃線輪51R、保持器52R、及銷53。劃線輪51R具有大致圓盤狀之形狀,其直徑典型的是為數mm左右。劃線輪51R係能夠繞旋轉軸RX旋轉地經由銷53而被保持於保持器52R。 Next, a scribing tool 50R suitable for forming the trench line TL in this embodiment will be described with reference to FIG. 29. The scribing device 50R includes a scribing wheel 51R, a holder 52R, and a pin 53. The scribing wheel 51R has a substantially disc-like shape, and its diameter is typically about several mm. The scribing wheel 51R is held by a holder 52R via a pin 53 so as to be rotatable about a rotation axis RX.
劃線輪51R具有設置有刀尖之外周部PF。外周部PF繞旋轉軸RX呈圓環狀延伸。外周部PF如圖30(A)所示般,於目視級別上呈稜線狀峭立,由此構成包含稜線與傾斜面之刀尖。另一方面,於顯微鏡級別上,如圖30(B)所示般,於劃線輪51R藉由向上表面SF1內侵入而實際上作用之部分(圖30(B)之較二點鏈線靠下方),外周部PF之稜線具有微細之表面形狀MS。表面形狀MS於前視下(圖30(B)),較佳為呈具有有限之曲率半徑之曲線形狀。劃線輪51R使用超硬合金、燒結金剛石、多晶金剛石或單晶金剛石等硬質材料而形成。於減小上述稜線及傾斜面之表面粗糙度之觀點來看,劃線輪51R全體亦可由單晶金剛石製成。 The scribing wheel 51R has an outer peripheral portion PF provided with a knife edge. The outer peripheral portion PF extends in a ring shape around the rotation axis RX. As shown in FIG. 30 (A), the outer peripheral portion PF is ridged at a visual level, thereby forming a cutting edge including a ridge and an inclined surface. On the other hand, at the microscope level, as shown in FIG. 30 (B), the portion where the scribing wheel 51R actually invades by invading the upper surface SF1 (FIG. 30 (B) is closer to the two-point chain line Bottom), the ridge line of the outer peripheral portion PF has a fine surface shape MS. The surface shape MS in a front view (FIG. 30 (B)) is preferably a curved shape having a limited radius of curvature. The scribing wheel 51R is formed using a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond. From the viewpoint of reducing the surface roughness of the ridgeline and the inclined surface, the entire scribing wheel 51R may be made of single crystal diamond.
使用劃線器具50R之溝槽線TL之形成係藉由如下方式進行,即藉由使劃線輪51R於玻璃基板11之上表面SF1上滾動(圖29:箭頭RT),而使劃線輪51R於上表面SF1上朝方向DB行進。利用該滾動之行進係一面藉由對劃線輪51R施加負荷F而將劃線輪51R之外周部PF向玻璃基板11之上表面SF1上按壓一面進行。由此,藉由於玻璃基板11之上表面SF1上產生塑性變形而形成具有溝槽形狀之溝槽線TL。負荷F具有與玻璃基板11之厚度方向DT平行之垂直成分Fp、及與上表面SF1平行之面內成分Fi。方向DB與面內成分Fi之方向相同。 The formation of the groove line TL using the scribing device 50R is performed by rolling the scribing wheel 51R on the upper surface SF1 of the glass substrate 11 (FIG. 29: arrow RT) to make the scribing wheel 51R travels in the direction DB on the upper surface SF1. This rolling travel is performed while applying a load F to the scribing wheel 51R to press the outer peripheral portion PF of the scribing wheel 51R against the upper surface SF1 of the glass substrate 11. Accordingly, the groove line TL having a groove shape is formed by plastic deformation on the upper surface SF1 of the glass substrate 11. The load F has a vertical component Fp parallel to the thickness direction DT of the glass substrate 11 and an in-plane component Fi parallel to the upper surface SF1. The direction DB is the same as the direction of the in-plane component Fi.
再者,溝槽線TL之形成亦可使用向方向DB移動之劃線器具50(圖 17(A)及(B))或50v(圖21(A)及(B))來代替使用向方向DB移動之劃線器具50R。 In addition, the formation of the trench line TL can also be performed using a scribing device 50 (FIG. 17 (A) and (B)) or 50v (Figs. 21 (A) and (B)) instead of using the scribing device 50R moving in the direction DB.
再者,除上述以外之構成與上述實施形態1之構成大致相同,因此對相同或對應之要素附上相同之符號,且不重複其說明。 In addition, the configuration other than the above is substantially the same as the configuration of the first embodiment, and therefore the same or corresponding elements are assigned the same reference numerals, and descriptions thereof will not be repeated.
根據本實施形態,亦可獲得與實施形態1大致相同之效果。又,於本實施形態中,能夠使用旋轉之刀尖而不係固定之刀尖來形成溝槽線TL,因此能夠延長刀尖之壽命。 According to this embodiment, it is also possible to obtain substantially the same effects as in the first embodiment. Moreover, in this embodiment, since the groove line TL can be formed using a rotating blade tip without being fixed, it is possible to extend the life of the blade tip.
參照圖31,首先準備玻璃基板11、及具有刀尖之劃線器具。藉由刀尖之移動而於玻璃基板11之上表面SF1上於點R1與R6之間形成溝槽線。點R1與點R2之間、點R3與R4之間、及點R5與R6之間之溝槽線TL係作為高負荷區間HR而形成。點R2與R3之間、點R4與R5之間之溝槽線TL係作為低負荷區間LR而形成。溝槽線TL之形成方法可使用上述實施形態1或2(包含其等之變化例)中所說明之任意方法。 Referring to FIG. 31, first, a glass substrate 11 and a scribe tool having a blade tip are prepared. A groove line is formed between the points R1 and R6 on the upper surface SF1 of the glass substrate 11 by the movement of the blade point. The groove lines TL between the points R1 and R2, between the points R3 and R4, and between the points R5 and R6 are formed as the high load section HR. The trench line TL between the points R2 and R3 and between the points R4 and R5 is formed as a low load interval LR. As the method for forming the trench line TL, any method described in the above-mentioned Embodiment 1 or 2 (including variations thereof) can be used.
其次,使玻璃基板11沿分別與高負荷區間HR交叉之多個分斷線BL分離。該分斷線BL之形成亦可利用通常之劃線步驟或自溝槽線TL產生垂直裂痕之步驟等任意方法進行,分斷線BL之分離可藉由通常之分斷步驟而進行。 Next, the glass substrate 11 is separated along a plurality of breaking lines BL that intersect the high load section HR. The formation of the break line BL can also be performed by any method such as a normal scribing step or a step of generating a vertical crack from the trench line TL, and the break line BL can be separated by a normal break step.
參照圖32,以上述玻璃基板11之分離為契機,於藉由分離而新產生之邊與隔著該邊之一對中途點中之一者之間之部分形成裂痕線CL。形成裂痕線CL之方向與朝方向DA(圖17(A)或圖21(A))形成溝槽線TL之情形時之方向DA相反,且與朝方向DB(圖17(A)、圖21(A)或圖29)形成溝槽線TL之情形時之方向DB相同。 Referring to FIG. 32, taking the above-mentioned separation of the glass substrate 11 as an opportunity, a crack line CL is formed at a portion between an edge newly generated by the separation and one of a pair of halfway points across the edge. The direction in which the crack line CL is formed is opposite to the direction DA when the trench line TL is formed in the direction DA (FIG. 17 (A) or FIG. 21 (A)), and is opposite to the direction DB (FIG. 17 (A), FIG. 21). (A) or FIG. 29) The direction DB when the trench line TL is formed is the same.
其次,藉由與實施形態1相同之分斷步驟(圖12~圖16),而進行使裂痕以裂痕線CL為起點沿溝槽線TL伸展之分斷步驟。由此分斷脆性基板11。 Next, with the same breaking step (FIG. 12 to FIG. 16) as in the first embodiment, a breaking step of extending the crack along the groove line TL with the crack line CL as a starting point is performed. Thereby, the fragile substrate 11 is cut.
根據本實施形態,能夠藉由多個溝槽線TL及與其交叉之多個分斷線BL而規定分斷玻璃基板11之位置。 According to the present embodiment, the position where the glass substrate 11 is cut can be specified by the plurality of trench lines TL and the plurality of break lines BL intersecting the plurality of trench lines TL.
參照圖33,藉由刀尖51朝方向DA移動(參照圖17(A)),而於玻璃基板11之上表面SF1上於端點S1與S3之間形成溝槽線方向DL。端點S1與中途點S2之間之溝槽線TL係作為低負荷區間LR而形成。中途點S2與端點S3之間之溝槽線TL係作為高負荷區間HR而形成。 Referring to FIG. 33, the blade point 51 moves in the direction DA (see FIG. 17 (A)), and a groove line direction DL is formed on the upper surface SF1 of the glass substrate 11 between the endpoints S1 and S3. The trench line TL between the end point S1 and the halfway point S2 is formed as a low load section LR. The trench line TL between the halfway point S2 and the end point S3 is formed as a high load section HR.
參照圖34,接下來,一面將刀尖51向玻璃基板11之上表面SF1上按壓,一面使刀尖51於玻璃基板11之上表面SF1上向方向DA(圖17(A))移動,由此於玻璃基板11之上表面SF1上產生塑性變形,從而於上表面SF1上,於方向DM上形成有與溝槽線TL之低負荷區間LR交叉之交叉溝槽線TM。形成交叉溝槽線TM之步驟係與溝槽線TL相同以獲得無裂痕狀態之方式進行。即,形成交叉溝槽線TM之步驟係以獲得於交叉溝槽線TM之正下方玻璃基板11於與交叉溝槽線TM交叉之方向上連續地相連之狀態即無裂痕狀態之方式進行。 Referring to FIG. 34, next, while pressing the knife edge 51 on the upper surface SF1 of the glass substrate 11, the knife edge 51 is moved in the direction DA (FIG. 17 (A)) on the upper surface SF1 of the glass substrate 11, This causes plastic deformation on the upper surface SF1 of the glass substrate 11, so that on the upper surface SF1, an intersecting trench line TM that intersects the low load interval LR of the trench line TL is formed in the direction DM. The step of forming the cross trench line TM is performed in the same manner as the trench line TL to obtain a crack-free state. That is, the step of forming the cross trench line TM is performed so as to obtain a state in which the glass substrate 11 immediately below the cross trench line TM is continuously connected in a direction crossing the cross trench line TM, that is, a state without cracks.
其次,使玻璃基板11沿與交叉溝槽線TM交叉之分斷線BM分離。該分離可藉由通常之劃線步驟及分斷步驟而進行。分斷線BM於自交叉溝槽線TM與溝槽線TL之交叉點朝方向DM偏移之點上與交叉溝槽線TM交叉。以該分離為契機,沿交叉溝槽線TM而形成有伴隨著於玻璃基板11之厚度方向滲透之裂痕之裂痕線CM(圖35)。 Next, the glass substrate 11 is separated along a break line BM crossing the cross groove line TM. This separation can be performed by a usual scribing step and a breaking step. The break line BM crosses the cross trench line TM at a point shifted from the intersection of the cross trench line TM and the trench line TL in the direction DM. Taking this separation as an opportunity, a crack line CM (FIG. 35) is formed along the cross groove line TM along with a crack that penetrates in the thickness direction of the glass substrate 11.
其次,使玻璃基板11沿與溝槽線TL之高負荷區間HR交叉之分斷線BL分離。該分離可藉由通常之劃線步驟及分斷步驟而進行。以該分離為契機,沿高負荷區間HR形成有伴隨著於玻璃基板11之厚度方向滲透之裂痕之裂痕線CL(圖36)。 Next, the glass substrate 11 is separated along a break line BL that intersects the high load section HR of the trench line TL. This separation can be performed by a usual scribing step and a breaking step. Taking this separation as an opportunity, a crack line CL (FIG. 36) is formed along the high load section HR along with a crack that penetrates in the thickness direction of the glass substrate 11.
其次,藉由與實施形態1相同之分斷步驟(圖12~圖16),而進行使裂痕以裂痕線CL為起點沿溝槽線TL伸展之分斷步驟。由此沿溝槽 線TL分斷脆性基板11(圖37)。其後,沿裂痕線CM進行分斷步驟而進一步分斷脆性基板11。 Next, with the same breaking step (FIG. 12 to FIG. 16) as in the first embodiment, a breaking step of extending the crack along the groove line TL with the crack line CL as a starting point is performed. Thus along the trench The line TL breaks the fragile substrate 11 (FIG. 37). Thereafter, a breaking step is performed along the crack line CM to further break the brittle substrate 11.
根據本實施形態,能夠藉由溝槽線TL及與其交叉之交叉溝槽線TM而規定分斷玻璃基板11之位置。 According to this embodiment, the position where the glass substrate 11 is divided can be specified by the trench line TL and the cross trench line TM crossing it.
再者,亦可使用刀尖51v(圖21(A))來代替刀尖51(圖17(A))。又,溝槽線TL之形成亦可於與方向DL(圖33)為反方向上進行,該情形時,刀尖51(圖17(A))向方向DB移動。相同地,交叉溝槽線TM之形成亦可於與方向DM(圖34)為反方向上進行,該情形時,刀尖51(圖17(A))向方向DB移動。於刀尖向方向DB移動之情形時,亦可使用劃線輪51R(圖29)之刀尖來代替刀尖51。 It is also possible to use a cutting edge 51v (FIG. 21 (A)) instead of the cutting edge 51 (FIG. 17 (A)). The formation of the trench line TL may be performed in a direction opposite to the direction DL (FIG. 33). In this case, the blade point 51 (FIG. 17 (A)) moves in the direction DB. Similarly, the formation of the cross trench line TM can also be performed in a direction opposite to the direction DM (FIG. 34). In this case, the blade point 51 (FIG. 17 (A)) moves in the direction DB. When the blade tip moves in the direction DB, the blade tip of the scribing wheel 51R (FIG. 29) may be used instead of the blade tip 51.
圖38係概略性地表示本實施形態之玻璃基板11(脆性基板)之分斷方法之流程FL2。圖39係概略性地表示剛完成步驟S220(圖38)後之狀態之俯視圖。圖40係於沿圖39之線XL-XL之視野上依序表示步驟之概略部分剖視圖(A)~(C)。 FIG. 38 is a flowchart FL2 schematically showing a method for cutting the glass substrate 11 (brittle substrate) according to this embodiment. FIG. 39 is a plan view schematically showing a state immediately after step S220 (FIG. 38) is completed. FIG. 40 is a schematic partial cross-sectional view (A) to (C) showing steps sequentially in the field of view along the line XL-XL in FIG. 39.
首先,準備玻璃基板11(圖38:步驟S210)。玻璃基板11包括具有邊緣EG之上表面SF1、及下表面SF2。又,玻璃基板11具有與上表面SF1垂直之厚度方向DT。又,準備具有設置有刀尖之劃線輪51R(圖30(A))之劃線器具50R(圖29)。 First, the glass substrate 11 is prepared (FIG. 38: Step S210). The glass substrate 11 includes an upper surface SF1 and a lower surface SF2 having edges EG. The glass substrate 11 has a thickness direction DT perpendicular to the upper surface SF1. Further, a scribing tool 50R (FIG. 29) having a scribing wheel 51R (FIG. 30 (A)) provided with a blade tip is prepared.
其次,藉由箭頭M1(圖40(A))所示之劃線輪51R之移動,而使該劃線輪51R之刀尖接觸於玻璃基板11之上表面SF1之邊緣EG。其次,一面將刀尖向玻璃基板11上按壓一面使刀尖於玻璃基板11上移動(圖38:步驟S220)。以下對該步驟進行說明。 Next, the blade of the scribing wheel 51R is brought into contact with the edge EG of the upper surface SF1 of the glass substrate 11 by the movement of the scribing wheel 51R shown by the arrow M1 (FIG. 40 (A)). Next, the blade tip is moved on the glass substrate 11 while pressing the blade tip against the glass substrate 11 (FIG. 38: Step S220). This step is described below.
首先,藉由箭頭M2(圖40(B))所示之劃線輪51R之移動,而使刀尖跨上玻璃基板11之邊緣EG。由此,於邊緣EG上之一位置即起點N1(圖39)形成有缺口CP(圖40(C))(圖38:步驟S220C)。 First, by moving the scribing wheel 51R shown by an arrow M2 (FIG. 40 (B)), the blade edge is made to cross the edge EG of the glass substrate 11. Accordingly, a notch CP is formed at a position on the edge EG, that is, the starting point N1 (FIG. 39) (FIG. 40 (C)) (FIG. 38: step S220C).
其次,一面將藉由如上述般形成缺口CP之步驟而跨上起點N1之刀尖向玻璃基板11之上表面SF1上按壓,一面如箭頭M3(圖40(C))所示般,使設置有刀尖之劃線輪51R於上表面SF1上移動。由此,於玻璃基板11之上表面SF1上產生塑性變形。其結果,自起點N1至上表面SF1上之另一位置即終點N3形成有溝槽線TL(第1溝槽線)(圖38:步驟S220T)。由此,溝槽線TL具有自缺口CP離開之第1部分TP1(參照圖43)、及位於缺口CP上之第2部分TP2(參照圖43)。溝槽線TL係以於位於自缺口CP離開之位置之部分之正下方獲得上述之無裂痕狀態之方式形成。再者,較佳為缺口CP亦以於其正下方獲得無裂痕狀態之方式形成。 Next, the blade tip of the upper starting point N1 is pressed against the upper surface SF1 of the glass substrate 11 by the step of forming the notch CP as described above, and the setting is as shown by the arrow M3 (FIG. 40 (C)). The knife-pointed scribing wheel 51R moves on the upper surface SF1. As a result, plastic deformation occurs on the upper surface SF1 of the glass substrate 11. As a result, a trench line TL (first trench line) is formed from the starting point N1 to another end point N3 on the upper surface SF1 (FIG. 38: Step S220T). Accordingly, the trench line TL includes a first portion TP1 (refer to FIG. 43) separated from the notch CP and a second portion TP2 (refer to FIG. 43) located on the notch CP. The trench line TL is formed in such a manner as to obtain the above-mentioned crack-free state immediately below the portion located away from the notch CP. Furthermore, it is preferable that the notch CP is also formed in such a manner that a crack-free state is obtained just below it.
參照圖41(A),形成溝槽線TL之步驟以獲得於溝槽線TL之正下方玻璃基板11於與溝槽線TL交叉之方向DC上連續地相連之狀態即無裂痕狀態之方式進行。於無裂痕狀態下,雖然利用塑性變形形成有溝槽線TL,但未形成沿該溝槽線TL之裂痕。由此,即便對玻璃基板11施加彎曲力矩,亦不易產生沿溝槽線TL之分斷。為獲得無裂痕狀態,只要不使刀尖按壓於玻璃基板11之負荷變得過大即可。再者,圖41(B)表示圖41(A)之比較例,且表示形成有溝槽線TL、及沿該溝槽線TL向其正下方延伸之裂痕即裂痕線CL之狀態。 Referring to FIG. 41 (A), the step of forming the trench line TL is performed to obtain a state where the glass substrate 11 directly below the trench line TL is continuously connected in a direction DC crossing the trench line TL, that is, a state without cracks . In the crack-free state, although the groove line TL is formed by plastic deformation, no crack is formed along the groove line TL. Therefore, even if a bending moment is applied to the glass substrate 11, it is difficult to generate a break along the groove line TL. In order to obtain a crack-free state, it is sufficient if the load of the blade tip against the glass substrate 11 is not excessively increased. 41 (B) shows a comparative example of FIG. 41 (A), and shows a state where a trench line TL is formed and a crack extending along the trench line TL, that is, a crack line CL, is formed.
藉由根據需要重複上述溝槽線TL之形成步驟,而可獲得所期望之數量之溝槽線。圖39例示形成有3個溝槽線TL之情形。 By repeating the formation steps of the trench lines TL as needed, a desired number of trench lines can be obtained. FIG. 39 illustrates a case where three trench lines TL are formed.
參照圖42,其次進行分斷步驟。具體而言,藉由對玻璃基板11施加應力而使以缺口CP為起點之裂痕自起點N1向終點N3伸展,由此沿溝槽線TL分斷玻璃基板11(圖38:步驟S230)。分斷步驟可根據溝槽線TL之數量而進行多次。再者,下文對分斷步驟之更詳細之方法進行敍述。 Referring to FIG. 42, the breaking step is performed next. Specifically, by applying stress to the glass substrate 11, a crack starting from the notch CP is extended from the start point N1 to the end point N3, and the glass substrate 11 is divided along the groove line TL (FIG. 38: Step S230). The breaking step may be performed multiple times according to the number of the trench lines TL. Furthermore, a more detailed method of the breaking step is described below.
藉由以上步驟而沿溝槽線TL分斷玻璃基板11。 Through the above steps, the glass substrate 11 is cut along the trench line TL.
接下來,對本實施形態之分斷步驟進行以下說明。 Next, the division procedure of this embodiment will be described below.
參照圖43,以玻璃基板11之上表面SF1隔著襯墊物81而與載台80對向之方式,將形成有溝槽線TL之玻璃基板11(圖39)隔著襯墊物81而載置於載台80上。 Referring to FIG. 43, the glass substrate 11 (FIG. 39) in which the groove line TL is formed is placed across the spacer 81 so that the upper surface SF1 of the glass substrate 11 faces the stage 80 through the spacer 81. Placed on the stage 80.
參照圖44及圖45而準備分斷桿85。分斷桿85如圖45所示般,較佳為具有以能夠局部性地按壓玻璃基板11之表面之方式突出之形狀,於圖45中具有大致V字狀之形狀。如圖44所示般,該突出部分呈直線狀延伸。 A breaking lever 85 is prepared with reference to FIGS. 44 and 45. As shown in FIG. 45, the breaking lever 85 preferably has a shape protruding so as to be able to locally press the surface of the glass substrate 11, and has a substantially V-shape in FIG. 45. As shown in FIG. 44, the protruding portion extends linearly.
其次,使分斷桿85接觸於玻璃基板11之下表面SF2之一部分。該接觸部分自下表面SF2中於厚度方向(圖9之縱向)上與溝槽線TL之部分TP2對向之部分SP4離開。 Next, the breaking lever 85 is brought into contact with a part of the lower surface SF2 of the glass substrate 11. The contact portion is separated from the portion SP4 facing the portion TP2 of the trench line TL in the thickness direction (longitudinal direction in FIG. 9) in the lower surface SF2.
其次,如箭頭CT1所示般,上述接觸部分沿溝槽線TL擴展,並向部分SP4之側靠近。於上述最初之接觸時,或藉由繼其後之接觸部分之擴展,而產生分斷桿85接觸於下表面SF2中與溝槽線TL之部分TP1對向之部分SP3(第3部分)、且自上述部分SP4(第4部分)離開之狀態。該選擇性之接觸例如可藉由使具有某程度之彈性之分斷桿85之姿勢變化而容易地獲得。再者,於該時間點,溝槽線TL之部分TP1保持於無裂痕狀態。 Next, as indicated by arrow CT1, the above-mentioned contact portion extends along the trench line TL and approaches the side of the portion SP4. At the time of the above-mentioned initial contact, or by the subsequent expansion of the contact portion, the breaking rod 85 comes into contact with the portion SP3 (part 3) of the lower surface SF2 opposite to the portion TP1 of the groove line TL, And from the state of the above-mentioned part SP4 (part 4). This selective contact can be easily obtained, for example, by changing the posture of the breaking lever 85 having a certain degree of elasticity. Furthermore, at this point in time, a portion TP1 of the trench line TL is maintained in a crack-free state.
參照圖46,藉由如箭頭CT2所示般使擴展進一步行進而使上述接觸部分到達部分SP4。換言之,一面保持分斷桿85接觸於下表面SF2之部分SP3之狀態,一面使分斷桿85接觸於下表面SF2之部分SP4。由此分斷桿85藉由上述步驟而首先對溝槽線TL之部分TP1施加應力,其後進而亦同時對缺口CP施加應力。藉由該應力而使裂痕自缺口CP沿溝槽線TL伸展(參照圖47之箭頭PR)。換言之,產生自溝槽線TL之部分TP2向部分TP1伸展之裂痕。其結果,沿溝槽線TL分斷玻璃基板11。 Referring to FIG. 46, as shown by arrow CT2, the expansion is further advanced so that the above-mentioned contact portion reaches the portion SP4. In other words, while maintaining the state where the breaking lever 85 is in contact with the portion SP3 of the lower surface SF2, the breaking lever 85 is in contact with the portion SP4 of the lower surface SF2. As a result, the breaking lever 85 first applies stress to the portion TP1 of the trench line TL through the above steps, and thereafter, simultaneously applies stress to the notch CP. Due to this stress, the crack extends from the notch CP along the groove line TL (see arrow PR in FIG. 47). In other words, a crack is generated that extends from a portion TP2 to a portion TP1 of the trench line TL. As a result, the glass substrate 11 is cut along the trench line TL.
藉由以上分斷步驟而進行玻璃基板11之分斷(圖42)。 The glass substrate 11 is divided by the above-mentioned division steps (FIG. 42).
根據本實施形態,於為分斷玻璃基板11而使裂痕自溝槽線TL之部分TP2向部分TP1伸展時(圖47:箭頭PR),如圖46所示般,下表面SF2中與部分TP1對向之部分SP3預先接觸於分斷桿85。由此抑制裂痕偏離於溝槽線之部分TP1而伸展。由此可準確地沿溝槽線TL進行分斷。 According to this embodiment, when the crack is extended from the portion TP2 to the portion TP1 of the trench line TL to break off the glass substrate 11 (FIG. 47: arrow PR), as shown in FIG. 46, the lower surface SF2 and the portion TP1 The opposing portion SP3 contacts the breaking lever 85 in advance. This suppresses the crack from extending away from the portion TP1 of the trench line. This makes it possible to accurately cut off along the trench line TL.
又,使用形成於玻璃基板11之邊緣EG上之缺口CP作為使裂痕沿溝槽線TL伸展之契機。該缺口CP僅係利用開始形成溝槽線TL時移動之刀尖跨上玻璃基板11之邊緣EG而形成。由此可利用簡單之步驟沿溝槽線TL進行玻璃基板11之分斷。 In addition, the notch CP formed on the edge EG of the glass substrate 11 is used as an opportunity to extend the crack along the groove line TL. This notch CP is formed only by the edge of the upper glass substrate 11 that is moved by the blade tip that is moved when the trench line TL is started to be formed. Thus, the glass substrate 11 can be divided along the trench line TL in a simple procedure.
又,於缺口CP之形成中,使用劃線輪51R之刀尖、即旋轉之刀尖。由此,與使用如金剛石筆般之固定之刀尖之情形相比,可抑制於刀尖跨上玻璃基板11之邊緣EG時刀尖所受之損傷。 In the formation of the notch CP, a cutting edge of the scribing wheel 51R, that is, a rotating cutting edge is used. Therefore, compared with a case where a fixed blade tip such as a diamond pen is used, damage to the blade tip when the blade tip crosses the edge EG of the glass substrate 11 can be suppressed.
參照圖48,於本實施形態中,進行形成高負荷區間HR作為溝槽線TL之一部分之步驟、及形成低負荷區間LR作為溝槽線TL之一部分之步驟。高負荷區間HR形成於自起點N1至起點N1與終點N3之間之中途點N2。低負荷區間LR形成於自中途點N2至終點N3。於形成低負荷區間LR之步驟中對刀尖施加之負荷,低於在形成高負荷區間HR之步驟中所使用之負荷。 Referring to FIG. 48, in this embodiment, a step of forming a high load interval HR as a part of the trench line TL and a step of forming a low load interval LR as a part of the trench line TL are performed. The high-load interval HR is formed from the starting point N1 to a midpoint N2 between the starting point N1 and the ending point N3. The low load interval LR is formed from the halfway point N2 to the end point N3. The load applied to the tool tip in the step of forming the low load section LR is lower than the load used in the step of forming the high load section HR.
再者,至於除上述以外之構成,由於與上述實施形態5之構成大致相同,因此對相同或對應之要素附上相同之符號,且不重複其說明。 In addition, as for the structure other than the above, since the structure is substantially the same as that of the fifth embodiment, the same or corresponding elements are given the same reference numerals, and descriptions thereof will not be repeated.
根據本實施形態,溝槽線TL中自缺口CP延伸之部分即高負荷區間HR係利用高負荷下之塑性變形而形成。由此,與利用低負荷區間LR中使用之低負荷下之塑性變形而形成溝槽線TL全體之情形相比, 易於自缺口CP向溝槽線TL產生裂痕。由此於分斷步驟(圖43~圖47)中,能夠更切實地產生以缺口CP為契機之裂痕。由此,能夠更切實地進行使用該裂痕之伸展沿溝槽線TL分斷玻璃基板11。 According to this embodiment, the portion of the groove line TL extending from the notch CP, that is, the high-load section HR is formed by plastic deformation under a high load. As a result, compared with a case where the entire groove line TL is formed by plastic deformation under a low load used in the low load section LR, A crack is easily generated from the notch CP to the trench line TL. Accordingly, in the breaking step (FIG. 43 to FIG. 47), a crack with the gap CP as an opportunity can be more reliably generated. Thereby, the glass substrate 11 can be divided more reliably along the groove line TL using the extension of the crack.
再者,於圖39中終點N3自玻璃基板11之邊緣EG離開,但終點N3亦可位於玻璃基板11之邊緣EG上(於圖39之例中為玻璃基板11之表面SF1之右邊之邊緣上)。 Furthermore, the end point N3 leaves the edge EG of the glass substrate 11 in FIG. 39, but the end point N3 may also be located on the edge EG of the glass substrate 11 (in the example of FIG. 39, it is on the right edge of the surface SF1 of the glass substrate 11). ).
參照圖49,首先藉由與實施形態5大致相同之方法,朝方向DL形成有於其起點伴隨有缺口CP且延伸至終點之溝槽線TL。 Referring to FIG. 49, first, a trench line TL is formed in the direction DL along with a notch CP at the starting point and extending to the end point by a method substantially the same as that in the fifth embodiment.
參照圖50,其次一面藉由施加負荷而使刀尖向玻璃基板11之上表面SF1上按壓,一面使刀尖於上表面SF1上朝方向DM移動。由此於玻璃基板11之上表面SF1上產生塑性變形,從而於點T1與T6之間形成有交叉溝槽線TM(第2溝槽線)。交叉溝槽線TM之形成係與實施形態5中針對溝槽線TL(圖41(A))所說明之方法相同,以交叉溝槽線TM獲得無裂痕狀態之方式進行。 Referring to FIG. 50, the blade tip is pressed against the upper surface SF1 of the glass substrate 11 by applying a load, and the blade tip is moved toward the direction DM on the upper surface SF1. As a result, plastic deformation occurs on the upper surface SF1 of the glass substrate 11, and a cross trench line TM (second trench line) is formed between the points T1 and T6. The formation of the cross trench line TM is the same as the method described for the trench line TL (FIG. 41 (A)) in the fifth embodiment, and the cross trench line TM is obtained in a crack-free state.
點T1與點T2之間、點T3與T4之間、及點T5與T6之間形成有高負荷區間HS來作為交叉溝槽線TM之一部分。點T2與T3之間、點T4與T5之間形成有低負荷區間LS來作為交叉溝槽線TM之一部分。於形成高負荷區間HS之步驟中對刀尖施加之負荷,高於在形成低負荷區間LS之步驟中所使用之負荷。高負荷區間HS與溝槽線TL交叉。再者,交叉溝槽線TM之形成方法能夠使用與溝槽線TL之形成方法相同之方法。 Between the points T1 and T2, between the points T3 and T4, and between the points T5 and T6, high load sections HS are formed as part of the cross-groove line TM. A low load interval LS is formed between the points T2 and T3 and between the points T4 and T5 as a part of the cross trench line TM. The load applied to the tool tip in the step of forming the high load section HS is higher than the load used in the step of forming the low load section LS. The high load section HS crosses the trench line TL. The method of forming the cross trench line TM can be the same as the method of forming the trench line TL.
其次,藉由與實施形態5相同之分斷步驟,而使裂痕以缺口CP為起點沿溝槽線TL伸展。由此沿溝槽線TL分斷玻璃基板11(圖51)。以該分斷為契機,裂痕僅於交叉溝槽線TM中之高負荷區間HS伸展。其結果,沿交叉溝槽線TM之一部分而形成有裂痕線CL。具體而言,於藉 由分斷而新產生之邊與隔著該邊之1對中途點中之一者之間之部分上,於高負荷區間HS形成有裂痕線CL。 Next, the crack is extended along the trench line TL starting from the notch CP by the same breaking step as in the fifth embodiment. As a result, the glass substrate 11 is cut along the trench line TL (FIG. 51). Taking this break as an opportunity, the crack extends only in the high-load section HS in the cross-groove line TM. As a result, a crack line CL is formed along a part of the intersecting trench line TM. Specifically, in borrowing A crack line CL is formed in the high-load section HS on a portion between the edge newly generated by the division and one of a pair of halfway points across the edge.
再者,於藉由分斷而新產生之邊與隔著該邊之1對中途點中之另一者之間之部分上,即便於高負荷區間HS亦難以形成裂痕線CL。其原因在於,裂痕沿裂痕線CL之伸展容易度存在方向相依性。推測該方向相依性起因於在對玻璃基板11劃線時產生之內部應力之分佈。 Furthermore, it is difficult to form a crack line CL even in a high-load section HS on a portion between the edge newly generated by the division and the other of a pair of halfway points across the edge. The reason for this is that there is a direction dependency on the ease of extension of the crack along the crack line CL. It is presumed that this direction dependency is due to the distribution of internal stress generated when the glass substrate 11 is scribed.
於高負荷區間HS中,如圖41(B)所示般,玻璃基板11於交叉溝槽線TM之正下方,於與交叉溝槽線TM之延伸方向交叉之方向DC上連續之相連因裂痕線CL而被斷開。此處“連續之相連”換言之係指未被裂痕截斷之相連。再者,於如上所述連續之相連被斷開之狀態下,玻璃基板11之部分彼此亦可隔著裂痕線CL之裂痕而接觸。 In the high-load section HS, as shown in FIG. 41 (B), the glass substrate 11 is continuously connected in the direction DC that intersects with the extending direction of the crossing groove line TM directly below the crossing groove line TM due to cracks The line CL is disconnected. Here "continuous connection" in other words means a connection that has not been interrupted by a fissure. Furthermore, in a state where the continuous connection is disconnected as described above, portions of the glass substrates 11 may be in contact with each other via the crack of the crack line CL.
其次,藉由與實施形態5相同之分斷步驟而對玻璃基板11施加應力,由此裂痕以裂痕線CL為起點沿低負荷區間LS伸展。由此,沿交叉溝槽線TM分斷玻璃基板11。即,除沿上述溝槽線TL之分斷以外,還進行沿交叉溝槽線TM之分斷。 Next, stress is applied to the glass substrate 11 in the same breaking step as in the fifth embodiment, whereby the cracks extend along the low load section LS starting from the crack line CL. Thereby, the glass substrate 11 is divided along the cross groove line TM. That is, in addition to the division along the trench line TL, the division along the crossing trench line TM is also performed.
根據本實施形態,可獲得與實施形態5大致相同之效果。又,能夠藉由溝槽線TL及與其交叉之交叉溝槽線TM規定分斷玻璃基板11之位置。 According to this embodiment, it is possible to obtain substantially the same effects as those of the fifth embodiment. In addition, the position where the glass substrate 11 is broken can be specified by the trench line TL and the crossing trench line TM crossing it.
圖52係概略性地表示本實施形態之玻璃基板11(脆性基板)之分斷方法之流程FL3。圖53係概略性地表示剛完成步驟S320(圖52)後之狀態之俯視圖。 FIG. 52 is a flowchart FL3 schematically showing a method for cutting the glass substrate 11 (brittle substrate) according to this embodiment. Fig. 53 is a plan view schematically showing a state immediately after step S320 (Fig. 52) is completed.
首先,準備玻璃基板11(圖52:步驟S310)。玻璃基板11具有上表面SF1及其相反面即下表面。又,準備設置有刀尖51之劃線器具50(圖17(A))。 First, the glass substrate 11 is prepared (FIG. 52: Step S310). The glass substrate 11 has an upper surface SF1 and a lower surface which is the opposite surface. Further, a scribing tool 50 provided with a blade point 51 is prepared (FIG. 17 (A)).
其次,使刀尖一面向玻璃基板11之上表面SF1上按壓一面移動。 由此於上表面SF1上產生塑性變形。其結果,於上表面SF1上形成自點N1經由點N2(一點)向點N3延伸之溝槽線TL(圖52:步驟S320)。於形成溝槽線TL時,刀尖於點N2上向劃線方向DL(一方向)移動。再者,點N1~N3表示上表面SF1上之位置。 Next, the blade tip is moved while pressing on the upper surface SF1 of the glass substrate 11. As a result, plastic deformation occurs on the upper surface SF1. As a result, a trench line TL extending from the point N1 to the point N3 through the point N2 (one point) is formed on the upper surface SF1 (FIG. 52: Step S320). When the groove line TL is formed, the blade tip moves at the point N2 in the scribe direction DL (one direction). The points N1 to N3 indicate positions on the upper surface SF1.
藉由根據需要重複上述溝槽線TL之形成步驟,而可形成所期望之數量之溝槽線TL。圖53例示形成有3個溝槽線TL之情形。 By repeating the formation steps of the trench lines TL as needed, a desired number of trench lines TL can be formed. FIG. 53 illustrates a case where three trench lines TL are formed.
形成溝槽線TL之步驟以獲得上述之無裂痕狀態(圖41(A))之方式進行。再者於未處於無裂痕狀態之狀態下(圖41(B)),玻璃基板11藉由於溝槽線TL之正下方沿溝槽線TL延伸之裂痕線CL,而於與溝槽線TL交叉之方向DC上分斷。為分斷玻璃基板而形成之以往之典型之劃線伴隨有裂痕線CL,並非為以無裂痕狀態形成者。 The step of forming the trench line TL is performed in such a manner as to obtain the above-mentioned crack-free state (FIG. 41 (A)). Furthermore, in a state where there is no crack (FIG. 41 (B)), the glass substrate 11 crosses the trench line TL due to the crack line CL extending along the trench line TL directly below the trench line TL. It breaks in the direction of DC. The conventional typical scribe line formed for breaking a glass substrate is accompanied by a crack line CL, and is not formed in a crack-free state.
其次,沿於玻璃基板11之上表面SF1上之點N2與溝槽線TL交叉之分斷線BL分離玻璃基板11。該分離例如可藉由沿分斷線BL之通常之劃線之形成、及其後之通常之分斷步驟而進行。 Next, the glass substrate 11 is separated along a break line BL at which the point N2 on the upper surface SF1 of the glass substrate 11 intersects the trench line TL. This separation can be performed, for example, by the formation of a usual scribe line along the break line BL, and the usual break step thereafter.
參照圖54,藉由上述分離而形成有露出溝槽線TL之端面SE(圖52:步驟S330)。於露出溝槽線TL之部位上之端面SE之法線方向(法線向量)DN具有劃線方向DL(圖53)之成分。法線方向DN與劃線方向DL較佳為大致相同。 Referring to FIG. 54, the end surface SE exposing the trench line TL is formed by the above separation (FIG. 52: step S330). The normal direction (normal vector) DN of the end surface SE on the portion where the trench line TL is exposed has a component in the scribe direction DL (FIG. 53). The normal direction DN and the scribe direction DL are preferably substantially the same.
參照圖55,分離玻璃基板11之步驟係以維持無裂痕狀態之方式進行。因此,於形成上述溝槽線TL時對刀尖施加之負荷只要為足以於上表面SF1上產生塑性變形之大小但又不過度大即可。 Referring to FIG. 55, the step of separating the glass substrate 11 is performed in a manner to maintain a crack-free state. Therefore, the load applied to the cutting edge when the groove line TL is formed may be a size sufficient to cause plastic deformation on the upper surface SF1 but not excessively large.
其次,使端面SE之表面粗糙度增大。該步驟能夠藉由對端面SE之至少露出溝槽線TL之部位進行伴隨有微小破碎之機械加工而進行,具體而言,能夠藉由對端面SE之露出溝槽線TL之部位進行磨削而進行。該磨削例如能夠使用銼刀或帶軸磨石等工具進行。 Second, the surface roughness of the end surface SE is increased. This step can be performed by machining at least the portion of the end surface SE where the groove line TL is exposed, and, specifically, by grinding the portion of the end surface SE where the groove line TL is exposed. get on. This grinding can be performed using a tool such as a file or a grindstone with a shaft.
其次,沿溝槽線TL分斷玻璃基板11(圖52:步驟S340)。於該目的 下,藉由對溝槽線TL於端面SE上露出之部位施加應力之分斷步驟,而使裂痕以該部位為起點沿溝槽線TL伸展。分斷步驟可根據溝槽線TL之數量而進行多次。以下,對較佳為之分斷步驟之詳細內容進行說明。 Next, the glass substrate 11 is cut along the trench line TL (FIG. 52: Step S340). For that purpose Next, a cracking step of applying stress to a portion of the groove line TL exposed on the end surface SE is performed, so that the crack extends along the groove line TL with the portion as a starting point. The breaking step may be performed multiple times according to the number of the trench lines TL. In the following, the details of the cutting step which is preferably performed will be described.
參照圖56,以玻璃基板11之上表面SF1隔著襯墊物81而與載台80對向之方式,將形成有溝槽線TL之玻璃基板11(圖53)隔著襯墊物81而載置於載台80上。 Referring to FIG. 56, the glass substrate 11 (FIG. 53) in which the trench line TL is formed is opposed to the stage 80 with the spacer 81 interposed therebetween via the spacer 81. Placed on the stage 80.
參照圖57準備分斷桿85。其次,使分斷桿85接觸於玻璃基板11之下表面SF2之一部分。該接觸部分自玻璃基板11之端面SE離開。 A breaking lever 85 is prepared with reference to FIG. 57. Next, the breaking lever 85 is brought into contact with a part of the lower surface SF2 of the glass substrate 11. This contact portion is separated from the end surface SE of the glass substrate 11.
其次,如箭頭CT1所示般,上述接觸部分沿溝槽線TL擴展並向端面SE之側靠近。於上述最初之接觸時,或藉由繼其後之接觸部分之擴展,而產生分斷桿85接觸於下表面SF2中與溝槽線TL之自端面SE離開之部分TP1對向之部分SP3、且自下表面SF2中與溝槽線TL之端面SE相連之部分TP2離開之狀態。該選擇性之接觸例如可藉由使具有某程度之彈性之分斷桿85之姿勢變化而容易地獲得。再者,於該時間點,溝槽線TL之部分TP1保持於無裂痕狀態。 Next, as indicated by arrow CT1, the above-mentioned contact portion extends along the groove line TL and approaches the side of the end surface SE. At the time of the above-mentioned initial contact, or by the subsequent expansion of the contact portion, the breaking rod 85 comes into contact with the portion SP3 of the lower surface SF2 that is opposite to the portion TP1 of the groove line TL that leaves from the end surface SE, And it is in a state of leaving from a portion TP2 of the lower surface SF2 that is connected to the end surface SE of the trench line TL. This selective contact can be easily obtained, for example, by changing the posture of the breaking lever 85 having a certain degree of elasticity. Furthermore, at this point in time, a portion TP1 of the trench line TL is maintained in a crack-free state.
參照圖58,藉由如箭頭CT2所示般使擴展進一步行進,而使上述接觸部分到達部分SP4。換言之,一面保持分斷桿85接觸於下表面SF2之部分SP3之狀態,一面使分斷桿85接觸於下表面SF2之部分SP4。由此,分斷桿85藉由上述步驟而首先對溝槽線TL之部分TP1施加應力,其後進而亦同時於端面SE上對具有露出部之部分TP2施加應力。藉由該應力而使裂痕自上述露出部沿溝槽線TL伸展(參照圖59之箭頭PR)。換言之,產生自溝槽線TL之部分TP2向部分TP1伸展之裂痕。其結果,沿溝槽線TL分斷玻璃基板11。 Referring to FIG. 58, as shown by the arrow CT2, the expansion is further advanced so that the above-mentioned contact portion reaches the portion SP4. In other words, while maintaining the state where the breaking lever 85 is in contact with the portion SP3 of the lower surface SF2, the breaking lever 85 is in contact with the portion SP4 of the lower surface SF2. As a result, the breaking lever 85 first applies stress to the portion TP1 of the trench line TL through the above steps, and thereafter, simultaneously applies stress to the portion TP2 having the exposed portion on the end surface SE. Due to the stress, a crack is extended from the exposed portion along the groove line TL (see arrow PR in FIG. 59). In other words, a crack is generated that extends from a portion TP2 to a portion TP1 of the trench line TL. As a result, the glass substrate 11 is cut along the trench line TL.
藉由以上分斷步驟而進行玻璃基板11之分斷。 The glass substrate 11 is divided by the above-mentioned division steps.
於劃線器具50(圖17(A))應用於本實施形態之情形時,被按壓之 刀尖51於上表面SF1上朝方向DA滑動。當使用與方向DA相反之方向DB時,於本實施形態中難以產生沿溝槽線TL之裂痕。推測該方向相依性起因於由形成溝槽線TL所致產生之玻璃基板11內之應力之分佈。再者作為變化例,亦可使用劃線器具50v(圖21(A))。 When the scribing device 50 (FIG. 17 (A)) is applied to this embodiment, it is pressed The blade point 51 slides in the direction DA on the upper surface SF1. When the direction DB opposite to the direction DA is used, it is difficult to generate cracks along the trench line TL in this embodiment. It is presumed that this direction dependency is caused by the distribution of the stress in the glass substrate 11 caused by the formation of the trench line TL. Furthermore, as a modification, a scribing device 50v may be used (FIG. 21 (A)).
根據本實施形態,於為分斷玻璃基板11而使裂痕自溝槽線TL之部分TP2向部分TP1伸展時(圖59:箭頭PR),如圖58所示般,下表面SF2中與部分TP1對向之部分SP3預先接觸於分斷桿85。由此抑制裂痕偏離於溝槽線之部分TP1而伸展。由此能夠準確地沿溝槽線TL進行分斷。 According to this embodiment, when the crack is extended from the portion TP2 to the portion TP1 of the trench line TL to break the glass substrate 11 (FIG. 59: arrow PR), as shown in FIG. 58, the lower surface SF2 and the portion TP1 The opposing portion SP3 contacts the breaking lever 85 in advance. This suppresses the crack from extending away from the portion TP1 of the trench line. This makes it possible to accurately cut off along the trench line TL.
又,為形成成為使裂痕沿溝槽線TL伸展之契機之部分,而使露出溝槽線TL之端面SE(圖55)之表面粗糙度增大。由此,易於產生以溝槽線TL於端面SE上露出之部位為起點之裂痕。由此,即便於以低負荷形成溝槽線TL之情形時,亦可沿於其正下方不具有裂痕之溝槽線TL(圖3(A))進行分斷。 In addition, in order to form a portion that is an opportunity for the crack to extend along the trench line TL, the surface roughness of the end surface SE (FIG. 55) exposing the trench line TL is increased. This makes it easy to generate a crack starting from the portion of the trench line TL exposed on the end surface SE. Therefore, even when the trench line TL is formed with a low load, it can be divided along the trench line TL (FIG. 3 (A)) without a crack directly below it.
參照圖60,與實施形態8(圖53)大致相同地於玻璃基板11之上表面SF1上形成溝槽線TL。其中於本實施形態中,較佳為使用具有劃線輪51R之劃線器具50R(圖29)。 60, a trench line TL is formed on the upper surface SF1 of the glass substrate 11 in substantially the same manner as in the eighth embodiment (FIG. 53). Among them, in this embodiment, it is preferable to use a scribing device 50R having a scribing wheel 51R (FIG. 29).
其次,與實施形態8相同地使玻璃基板11沿分斷線BL分離。 Next, the glass substrate 11 is separated along the break line BL in the same manner as in the eighth embodiment.
參照圖61,藉由上述分離而形成有露出溝槽線TL之端面SE。於露出溝槽線TL之部位上之端面SE之法線方向DN,於本實施形態中具有與劃線方向DL(圖60)為相反方向之成分。法線方向DN與劃線方向DL較佳為大致相反。 Referring to FIG. 61, the end surface SE exposing the trench line TL is formed by the above separation. The normal direction DN of the end surface SE on the portion where the trench line TL is exposed has a component in the present embodiment which is opposite to the scribe direction DL (FIG. 60). The normal direction DN and the scribe direction DL are preferably substantially opposite.
其次,進行與實施形態8大致相同之步驟。即,使端面SE之表面粗糙度增大,繼而沿溝槽線TL分斷玻璃基板11。 Next, steps substantially the same as those in the eighth embodiment are performed. That is, the surface roughness of the end surface SE is increased, and then the glass substrate 11 is cut along the groove line TL.
根據本實施形態,亦可獲得與實施形態8大致相同之效果。進而 根據本實施形態,於形成溝槽線TL時能夠使用劃線輪51R。再者,當劃線輪51R應用於實施形態8時,與本實施形態相比,難以沿溝槽線TL產生裂痕。 According to the present embodiment, it is also possible to obtain substantially the same effects as in the eighth embodiment. and then According to this embodiment, the scribing wheel 51R can be used when forming the groove line TL. Furthermore, when the scribing wheel 51R is applied to the eighth embodiment, cracks are less likely to occur along the groove line TL than in the present embodiment.
再者,亦可使用劃線器具50(圖17(A))或50v(圖21(A))代替劃線器具50R。該情形時,較佳為與實施形態8相反,不使用方向DA而使用該方向DA之相反方向即方向DB。由此,更易於沿溝槽線TL產生裂痕。 The scribing device 50 (FIG. 17 (A)) or 50v (FIG. 21 (A)) may be used instead of the scribing device 50R. In this case, it is preferable to use the direction DB, which is the opposite direction to the direction DA, instead of the direction DA, as in the eighth embodiment. This makes it easier to generate cracks along the trench line TL.
上述各實施形態之脆性基板之分斷方法可特佳地應用於玻璃基板,但脆性基板亦可由除玻璃以外之材料製成。例如作為除玻璃以外之材料,亦可使用陶瓷、矽、化合物半導體、藍寶石或石英。 The method for cutting a brittle substrate in each of the above embodiments can be particularly preferably applied to a glass substrate, but the brittle substrate can also be made of a material other than glass. For example, as materials other than glass, ceramics, silicon, compound semiconductors, sapphire, or quartz can also be used.
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014237467A JP6413694B2 (en) | 2014-11-25 | 2014-11-25 | Method for dividing brittle substrate |
JP2014-237467 | 2014-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201628983A TW201628983A (en) | 2016-08-16 |
TWI678343B true TWI678343B (en) | 2019-12-01 |
Family
ID=56037277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104136383A TWI678343B (en) | 2014-11-25 | 2015-11-04 | Breaking method of brittle substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6413694B2 (en) |
KR (1) | KR20160062695A (en) |
CN (1) | CN105621876B (en) |
TW (1) | TWI678343B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI605024B (en) * | 2015-08-07 | 2017-11-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking method of brittle substrate |
JP6555002B2 (en) * | 2015-08-19 | 2019-08-07 | 三星ダイヤモンド工業株式会社 | Scribe line inspection method |
JP2018150191A (en) * | 2017-03-13 | 2018-09-27 | 日本電気硝子株式会社 | Production method of glass sheet |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007039302A (en) * | 2005-08-05 | 2007-02-15 | Matsushita Electric Ind Co Ltd | Method and apparatus for cutting glass substrate |
JP2008195571A (en) * | 2007-02-13 | 2008-08-28 | Shiraitekku:Kk | Apparatus for dividing substrate |
TW201130591A (en) * | 2009-07-28 | 2011-09-16 | Hamamatsu Photonics Kk | Method for cutting workpiece |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6402004B1 (en) * | 1998-09-16 | 2002-06-11 | Hoya Corporation | Cutting method for plate glass mother material |
JP3792508B2 (en) * | 2000-12-19 | 2006-07-05 | 三星ダイヤモンド工業株式会社 | Method for dividing bonded brittle substrates |
JP3602846B2 (en) | 2001-06-14 | 2004-12-15 | 三星ダイヤモンド工業株式会社 | Organic EL display manufacturing apparatus and organic EL display manufacturing method |
TWI226877B (en) | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
JP5076662B2 (en) * | 2007-06-13 | 2012-11-21 | 澁谷工業株式会社 | Method and apparatus for cleaving brittle materials |
JP4730345B2 (en) * | 2007-06-18 | 2011-07-20 | ソニー株式会社 | Display device having glass substrate pair and cutting method thereof |
JP5686291B2 (en) * | 2011-03-04 | 2015-03-18 | 旭硝子株式会社 | Rectangular plate-like material cutting device and manufacturing method |
JP2012193060A (en) * | 2011-03-15 | 2012-10-11 | Asahi Glass Co Ltd | Cutting device for fragile plate and cutting method for fragile plate |
CN103359925B (en) * | 2012-03-27 | 2016-04-27 | 三星钻石工业股份有限公司 | The rose method of hardened glass substrate and scoring device |
JP2014051415A (en) * | 2012-09-07 | 2014-03-20 | Mitsuboshi Diamond Industrial Co Ltd | Scribing method for brittle material substrate |
CN104684856B (en) * | 2012-11-09 | 2017-07-07 | 日本电气硝子株式会社 | Initial crack forming apparatus and forming method |
JP6311798B2 (en) * | 2014-11-25 | 2018-04-18 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle substrate |
-
2014
- 2014-11-25 JP JP2014237467A patent/JP6413694B2/en not_active Expired - Fee Related
-
2015
- 2015-11-04 TW TW104136383A patent/TWI678343B/en not_active IP Right Cessation
- 2015-11-18 KR KR1020150161659A patent/KR20160062695A/en not_active Application Discontinuation
- 2015-11-19 CN CN201510801190.1A patent/CN105621876B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007039302A (en) * | 2005-08-05 | 2007-02-15 | Matsushita Electric Ind Co Ltd | Method and apparatus for cutting glass substrate |
JP2008195571A (en) * | 2007-02-13 | 2008-08-28 | Shiraitekku:Kk | Apparatus for dividing substrate |
TW201130591A (en) * | 2009-07-28 | 2011-09-16 | Hamamatsu Photonics Kk | Method for cutting workpiece |
Also Published As
Publication number | Publication date |
---|---|
CN105621876A (en) | 2016-06-01 |
TW201628983A (en) | 2016-08-16 |
JP6413694B2 (en) | 2018-10-31 |
CN105621876B (en) | 2020-03-10 |
JP2016098153A (en) | 2016-05-30 |
KR20160062695A (en) | 2016-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI663134B (en) | Breaking method of brittle substrate | |
TWI678343B (en) | Breaking method of brittle substrate | |
TW201941365A (en) | Segmentation method for crisp substrate | |
JP6555354B2 (en) | Method for dividing brittle substrate | |
CN106079116B (en) | Method for breaking brittle material substrate | |
JP6350669B2 (en) | Method for dividing brittle substrate | |
JP6493537B2 (en) | Method for dividing brittle substrate | |
TWI653201B (en) | Fragmentation method of brittle substrate | |
TWI712478B (en) | Breaking method of brittle substrate | |
TWI610892B (en) | Fragmentation method of brittle substrate | |
TWI656102B (en) | Breaking method of brittle substrate | |
TWI715718B (en) | Breaking method of brittle substrate | |
JP2017149079A (en) | Method for segmenting brittle substrate | |
TW201620843A (en) | Dividing method of brittle substrate | |
JP2017065007A (en) | Method of segmenting brittle substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |