TW201628983A - Cutting method of brittle substrate - Google Patents

Abstract

The cutting method of brittle substrate of the present invention is capable of performing exact cutting along a trench line having no crack under itself. A trench line TL having a first portion LR and a second portion HR is formed on a first surface SF1 of a glass substrate 11 in a crackless state. The glass substrate 11 is placed on a table so that the first surface SF1 faces to the table. A stress applying member is brought into contact with a second surface SF2 so as to contact a third portion that is opposite to the first portion LR of the trench line TL of the second surface SF2 of the glass substrate 11 and in contact with the second surface SF2 by separating from a fourth portion that is opposite to the second portion HR. The contacting process of the stress applying member is proceeded in such a way that the first portion LR is kept crackless. The stress applying member is brought into contact with the fourth portion while keeping in contact with the third portion, thereby forming a crack extended from the second portion HR toward the first portion LR of the trench line TL.

Description

Fragmentation method of brittle substrate

The present invention relates to a method of breaking a brittle substrate.

In the manufacture of electrical equipment such as flat panel display panels or solar panel panels, it is often necessary to break a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and secondly, the substrate is separated along the scribe line. The scribing can be formed by mechanically processing the substrate using a blade tip. A groove caused by plastic deformation is formed on the substrate by sliding or rolling on the substrate, and a vertical crack is formed directly under the groove. Thereafter, a stress imparting called a breaking step is performed. Thereby, the substrate is separated by causing the above-mentioned vertical crack to travel completely in the thickness direction.

The step of breaking the substrate is relatively more performed immediately after the step of forming the scribe line on the substrate. However, the step of processing the substrate between the step of forming the scribe line and the step of breaking is also proposed.

For example, according to the technique of International Publication No. 2002/104078, in the manufacturing method of an organic EL (electroluminescence) display, on the glass substrate, each region of each organic EL display is mounted before the sealing cap is mounted. Form a line. Therefore, contact between the sealing cap and the glass cutter which is a problem when the scribing is formed on the glass substrate after the sealing cap is provided can be avoided.

Further, for example, according to the technique of the international publication No. 2003/006391, in the method of manufacturing a liquid crystal display panel, two glass substrates are bonded together after forming a scribe line. This makes it possible to simultaneously separate two fragile substrates in one breaking step.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2002/104078

[Patent Document 2] International Publication No. 2003/006391

According to the above-described conventional technique, the processing of the brittle substrate is performed after the scribing is formed, and the breaking step is performed by the subsequent stress application. This means that there are already vertical cracks along the entire scribe line when processing the brittle substrate. As a result, the vertical crack is unexpectedly generated in the thickness direction during processing, whereby the brittle substrate which is integrated in the process may be separated. Further, even in the case where the substrate processing step is not performed between the step of forming the scribe line and the step of dividing the substrate, it is usually necessary to transport or store the substrate after the step of forming the scribe line and before the step of dividing the substrate. The substrate is sometimes accidentally broken.

In order to solve the above problems, the inventors have developed a separate breaking technique. According to this technique, a groove line having no crack immediately below is formed as a line defining a position at which the brittle substrate is broken. The position at which the brittle substrate is broken is defined by the formation of the grooved line. Thereafter, as long as the state in which the crack is not present directly under the groove line is maintained, the break along the groove line is less likely to occur. By using this state, the position at which the brittle substrate is separated can be defined in advance, and the brittle substrate can be prevented from being accidentally broken before the time point at which the bridging substrate should be broken.

As described above, the groove lines are more difficult to produce the break along them than the usual scribe lines. This prevents accidental breakage of the brittle substrate, but on the other hand, there is a problem that it is difficult to accurately perform the breaking of the brittle substrate along the groove line.

The present invention has been made to solve the above problems, and an object thereof is to provide a breaking method capable of accurately performing a brittle substrate along which a groove line having no cracks directly underneath is formed.

The breaking method of the brittle substrate has the following steps.

A fragile substrate having a first surface and a second surface opposite to the first surface and having a thickness direction perpendicular to the first surface is prepared.

By pressing the blade edge against the first surface of the brittle substrate and moving the blade edge on the first surface, plastic deformation occurs on the first surface of the brittle substrate, thereby forming the first and second portions. Groove line. The step of forming the trench line is performed in such a manner that the brittle substrate directly adjacent to at least the first portion of the trench line is continuously connected in a direction intersecting the groove line, that is, in a non-cracked state.

The brittle substrate is placed on the stage such that the first surface of the brittle substrate faces the stage.

The stress applying member is in contact with the brittle substrate so as to be in contact with the third portion of the second surface of the brittle substrate that faces the third portion of the trench line and is separated from the fourth portion that faces the second portion. 2 sides. The step of bringing the stress applying member into contact is carried out in such a manner that the first portion is maintained in a crack-free state.

The stress applying member is brought into contact with the fourth portion of the second surface of the brittle substrate while maintaining the stress applying member in contact with the third portion of the second surface of the brittle substrate, and the second portion of the groove line is generated. A crack that extends toward the first portion, thereby breaking the brittle substrate along the groove line.

According to the invention, when the brittle substrate is divided and the crack is extended from the second portion of the groove line to the first portion, the third portion of the second surface facing the first portion is in contact with the stress applying member in advance. Thereby, the crack is prevented from being deviated from the first portion of the groove line and stretched. Thereby, the division along the groove line can be accurately performed.

11‧‧‧Glass substrate (brittle substrate)

50, 50R, 50v‧‧‧ marking equipment

51, 51v‧‧‧ tip

51R‧‧‧marking wheel

52‧‧‧ handle

52R‧‧‧ Keeper

80‧‧‧stage

81‧‧‧Cushion

85‧‧‧ broken rod

AL‧‧‧Auxiliary line

AX, IVA, IVB, III, VI, VII, IX, X, XIV, XVII, XXI, XL, XLIA‧‧ lines

BL, BM‧‧‧ broken line

CL, CM‧‧‧ crack line

CP‧‧‧ gap

CT1, PR, RT‧‧‧ arrows

DA, DB, DC, DM‧‧ direction

DT‧‧‧ thickness direction

EG‧‧‧ edge

F‧‧‧load

Fi‧‧‧Inside ingredients

Fp‧‧‧ vertical component

FL1, FL2, FL3‧‧‧ process

HR, HS‧‧‧High load range (Part 2)

LR, LS‧‧‧ low load range (Part 1)

M1, M2, M3‧‧‧ arrows

MS‧‧‧ surface shape

Starting point for N1, Q1‧‧

N2, Q2, Q3‧‧‧ midway point

N3, Q4‧‧‧ end

PF‧‧‧Outer Week

PP, PPv‧‧‧ protrusion

PS, PSv‧‧‧ side

R1, R2, R3, R4, R5, R6, T1, T2, T3, T4, T5, T6‧‧

RX‧‧‧Rotary axis

S1, S2, S3‧‧‧ endpoints

SC‧‧‧Conical surface

SD1‧‧‧ top surface

SD2, SD3‧‧‧ side

SE‧‧‧ end face

SF1‧‧‧ upper surface (1st surface)

SF2‧‧‧ lower surface (2nd side)

SP3‧‧‧Part 3

SP4‧‧‧Part 4

TP1‧‧‧Part 1

TP2‧‧‧Part 2

TM, TL‧‧‧ trench lines

1 is a view schematically showing a method of breaking a brittle substrate according to Embodiment 1 of the present invention; Flow chart.

Fig. 2 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2 .

4(A) is a schematic cross-sectional view taken along line IVA-IVA of FIG. 2, and (B) is a schematic cross-sectional view taken along line IVB-IVB of FIG.

Fig. 5 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

Figure 6 is a schematic cross-sectional view taken along line VI-VI of Figure 5.

Figure 7 is a schematic cross-sectional view taken along line VII-VII of Figure 5.

Fig. 8 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

Figure 9 is a schematic cross-sectional view taken along line IX-IX of Figure 8.

Figure 10 is a schematic cross-sectional view taken along line X-X of Figure 8.

Fig. 11 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

Fig. 12 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 13 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 14 is a schematic side view of the field of view corresponding to the arrow XIV of Fig. 13.

Fig. 15 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 16 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 17 (A) is a view schematically showing the breaking side of the brittle substrate according to the first embodiment of the present invention. A side view of the configuration of the scribing device used in the method, and (B) is a bottom view of the blade edge in the field of view corresponding to the arrow XVII of Fig. 17(A).

FIG. 18 is a plan view schematically showing a step of a method of dividing a brittle substrate according to a first modification of the first embodiment of the present invention.

FIG. 19 is a plan view schematically showing one step of a method of dividing a brittle substrate according to a second modification of the first embodiment of the present invention.

Fig. 20 is a plan view schematically showing one step of a method of dividing a brittle substrate according to a third modification of the first embodiment of the present invention.

FIG. 21(A) is a side view schematically showing a configuration of a scribing device used in a method for dividing a brittle substrate according to a fourth modification of the first embodiment of the present invention, and FIG. (A) The bottom view of the tool tip on the field of view corresponding to the arrow XXI.

Fig. 22 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 23 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 24 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 25 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first modification of the second embodiment of the present invention.

Fig. 26 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first modification of the second embodiment of the present invention.

Fig. 27 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the second modification of the second embodiment of the present invention.

FIG. 28 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the third modification of the second embodiment of the present invention.

Figure 29 is a view schematically showing a method of breaking a brittle substrate according to a second embodiment of the present invention; A side view of the construction of the scribing device used in the present invention.

Fig. 30 (A) is a front view showing the configuration of the scribing wheel and the pin of Fig. 29, and (B) is a partially enlarged view of Fig. 30 (A).

Fig. 31 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the third embodiment of the present invention.

Fig. 32 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the third embodiment of the present invention.

Fig. 33 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 34 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 35 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 36 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 37 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

38 is a flow chart schematically showing a method of dividing a brittle substrate according to Embodiment 5 of the present invention.

Fig. 39 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

40 (A) to (C) are schematic partial cross-sectional views showing the steps of the breaking method of the brittle substrate according to the fifth embodiment of the present invention, sequentially showing the field of view of the line XL-XL of Fig. 39.

Figure 41 is a schematic cross-sectional view taken along the line XLIA-XLIA of Figure 39, (A) is a view showing the constitution of the groove line in a crack-free state, and (B) is shown in the same field of view as being directly below the groove line. A cross-sectional view showing a state in which a crack line is formed.

Fig. 42 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Figure 43 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to Embodiment 5 of the present invention.

Figure 44 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Fig. 45 is a schematic side view of the field of view corresponding to the arrow XLV of Fig. 44.

Fig. 46 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Fig. 47 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Fig. 48 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the sixth embodiment of the present invention.

Fig. 49 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the seventh embodiment of the present invention.

Fig. 50 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the seventh embodiment of the present invention.

Fig. 51 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the seventh embodiment of the present invention.

Fig. 52 is a flow chart schematically showing a method of dividing a brittle substrate according to an eighth embodiment of the present invention.

Fig. 53 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the eighth embodiment of the present invention.

Fig. 54 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the eighth embodiment of the present invention.

Figure 55 is a schematic side view of the end surface of the brittle substrate on the field of view of the arrow XLV of Figure 54 view.

Fig. 56 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate according to the eighth embodiment of the present invention.

Fig. 57 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate according to the eighth embodiment of the present invention.

Figure 58 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate in the eighth embodiment of the present invention.

Figure 59 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to an eighth embodiment of the present invention.

Fig. 60 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the ninth embodiment of the present invention.

Fig. 61 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the ninth embodiment of the present invention.

Hereinafter, a method of dividing a brittle substrate according to each embodiment of the present invention will be described based on the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof is not repeated.

(Embodiment 1)

Hereinafter, a method of dividing the glass substrate 11 (brittle substrate) of the present embodiment will be described with reference to the flow FL1 (Fig. 1).

The glass substrate 11 is prepared with reference to FIGS. 2 to 4 (FIG. 1: Step S110). The glass substrate 11 has an upper surface SF1 (first surface) and a lower surface SF2 (second surface opposite to the first surface). Further, the glass substrate 11 has a thickness direction DT perpendicular to the upper surface SF1.

Further, a scribing tool having a blade tip is prepared. The details of the scribing apparatus will be described below.

Next, the blade tip is pressed against the upper surface SF1 of the glass substrate 11 while being pressed. The blade edge 51 moves from the starting point N1 to the end point N3 via the midway point N2 on the upper surface SF1. Thereby, plastic deformation occurs on the upper surface SF1 of the glass substrate 11. Thereby, a groove line TL extending from the starting point N1 to the end point N3 via the intermediate point N2 is formed on the upper surface SF1 (FIG. 1: Step S120). In FIG. 2, three TLs are formed by the movement of the blade edge in the direction DA.

The step of forming the trench line TL includes: forming a low load section LR (Part 1) as a part of the trench line TL (FIG. 1: Step S120L); and forming a high load section HR (Part 2) as a trench The step of one of the lines TL (Fig. 1: step S120H). In FIG. 2, a low load section is formed from the starting point N1 to the halfway point N2, and a high load section is formed from the midway point N2 to the end point N3. The load applied to the cutting edge 51 in the step of forming the high load section HR is higher than the load used in the step of forming the low load section LR. Conversely, the load applied to the cutting edge 51 in the step of forming the low load section LR is lower than the load used in the step of forming the high load section HR, for example, about 30 to 50% of the load of the high load section HR. . Therefore, the width of the high load section HR is larger than the width of the low load section LR. For example, the high load section HR has a width of 10 μm, and the low load section LR has a width of 5 μm. The depth of the high load interval HR is greater than the depth of the low load interval LR. The cross section of the groove line TL has, for example, a V shape having an angle of about 150°.

The step of forming the trench line TL is such that the glass substrate 11 directly intersects the trench line TL in the high load section HR and the low load section LR of the trench line TL (FIG. 4(A) and (B). )) is carried out in a state in which it is continuously connected, that is, in a state in which no crack is present. Therefore, the load applied to the blade tip is so large that the glass substrate 11 is plastically deformed to such an extent that cracks starting from the plastic deformation portion are not generated.

Next, a crack line is formed as follows (FIG. 1: Step S130).

Referring to FIGS. 5 to 7, first, an auxiliary line AL crossing the high-load section HR is formed on the upper surface SF1 of the glass substrate 11. The auxiliary line AL is accompanied by a crack that penetrates in the thickness direction of the glass substrate 11. The auxiliary line AL can be formed by a usual scribing method.

Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can take advantage of the usual points The step is broken. With this separation as a result, the crack of the glass substrate 11 in the thickness direction extends along the groove line TL only in the high load section HR in the groove line TL.

Referring to FIGS. 8 and 9, by the above steps, cracks are generated only along the low load section LR of the groove line TL and the high load section HR in the high load section HR. Specifically, a crack line CL is formed in a portion between the side newly formed by the separation and the halfway point N2 in the high load section HR. The direction in which the crack line CL is formed is opposite to the direction DA (Fig. 2) in which the groove line TL is formed. Further, it is difficult to form the crack line CL with a portion between the newly generated side and the end point N3 by the separation. This direction dependence is caused by the state of the tool tip when the high load section HR is formed, which will be described in detail below.

Referring to Fig. 10, the continuous connection of the glass substrate 11 in the direction DC intersecting the extending direction of the groove line TL is broken by the crack line CL just below the high load section HR of the groove line TL. Here, "continuously connected", in other words, is connected without being cut by cracks. Further, in a state where the continuous connection is disconnected as described above, portions of the glass substrate 11 may be in contact with each other via a crack of the crack line CL.

Next, a breaking step of dividing the glass substrate 11 along the groove line TL is performed (FIG. 1: Step S140). At this time, by applying stress to the glass substrate 11, the crack is stretched along the low load section LR with the crack line CL as a starting point. The direction in which the crack is stretched (arrow PR of Fig. 11) is opposite to the direction DA (Fig. 2) in which the groove line TL is formed.

Next, the details of the above-described breaking step will be described below.

Referring to Fig. 12, the glass substrate 11 (Fig. 9) on which the crack line CL is formed is placed over the spacer 81 so that the upper surface SF1 of the glass substrate 11 faces the stage 80 with the spacer 81 interposed therebetween. Placed on the stage 80. The backing 81 includes a material that is more deformable than the material of the glass substrate 11 and the stage 80.

The breaking lever 85 (stress applying member) is prepared with reference to Figs. 13 and 14 . The breaking lever 85 preferably has a shape that protrudes so as to locally press the surface of the glass substrate 11 as shown in FIG. 14, and has a substantially V-shaped shape in FIG. As shown in Figure 13, the break The protruding portion of the rod 85 extends linearly.

Next, the breaking rod 85 is brought into contact with a portion of the lower surface SF2 of the glass substrate 11. The contact portion of the breaking lever 85 is separated from the portion SP4 opposed to the crack line CL in the thickness direction (the longitudinal direction of FIG. 13) from the lower surface SF2. The portion SP4 is also a portion of the lower surface SF2 that faces the high load interval HR in the thickness direction.

Next, as indicated by the arrow CT1, the above-mentioned contact portion spreads along the low load section LR of the groove line TL, and approaches the side of the portion SP4. At the initial contact as described above, or by extension of the subsequent contact portion, the breaking lever 85 is brought into contact with the portion SP3 (part 3) opposite to the low load interval LR on the lower surface SF2, and The above part of SP4 (Part 4) leaves the state. Such selective contact can be easily obtained, for example, by changing the posture of the breaking lever 85 having a certain degree of elasticity. Furthermore, at this point of time, the low load section LR is maintained in a crack-free state.

Referring to Fig. 15, the further travel is extended as indicated by the arrow CT2, so that the above-mentioned contact portion reaches the portion SP4. In other words, while the breaking lever 85 is in contact with the portion SP3 of the lower surface SF2 of the glass substrate 11, the breaking lever 85 is brought into contact with the portion SP4 of the lower surface SF2 of the glass substrate 11. Thereby, the breaking lever 85 first applies stress to the low load section LR in the crack line CL by the above-described steps, and thereafter, simultaneously applies stress to the crack line CL. By this stress, the crack propagates from the crack line CL (Fig. 15) along the low load section LR (refer to the arrow PR of Fig. 16). In other words, a crack is generated from the high load section HR of the groove line TL extending to the low load section LR. As a result, the glass substrate 11 is separated along the groove line TL.

The division of the glass substrate is carried out by the above-described breaking step (Fig. 11).

Referring to Figs. 17(A) and (B), a scribing tool 50 suitable for forming the above-described groove line TL will be described. The scribing tool 50 scribes the glass substrate 11 by relatively moving relative to the glass substrate 11 by being attached to a scribing head (not shown). The scribing tool 50 has a blade tip 51 and a handle 52. The tip 51 is held by the shank 52.

The blade tip 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. This The plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and the SD3 face different directions from each other and are adjacent to each other. The blade edge 51 has a vertex where the top surface SD1, the side surfaces SD2, and SD3 merge, and the apex constitutes the protrusion PP of the blade edge 51. Further, the side faces SD2 and SD3 form a ridge line constituting the side portion PS of the blade edge 51. The side portion PS extends linearly from the protrusion portion PP. Further, since the side portion PS is a ridge line as described above, it has a convex shape extending in a line shape.

The tip 51 is preferably a diamond pen. That is, it is preferable that the blade edge 51 is made of diamond. In this case, the hardness can be easily made high and the surface roughness can be made small. More preferably, the tip 51 is made of single crystal diamond. In terms of crystallography, it is more preferable that the top surface SD1 is a {001} plane, and each of the side surfaces SD2 and SD3 is a {111} plane. In this case, although the side faces SD2 and SD3 have mutually different directions, they are crystallographically equivalent crystal faces.

Further, a diamond which is not a single crystal may be used, and for example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may also be used. Alternatively, a polycrystalline diamond obtained by sintering particulate graphite or non-graphite carbon in a case where a bonding material such as an iron group element is not contained, or a sintered diamond in which diamond particles are bonded by a bonding material such as an iron group element may be used. .

The shank 52 extends in the axial direction AX. The blade edge 51 is preferably attached to the shank 52 such that its normal direction of the top surface SD1 is substantially along the axial direction AX.

In the formation of the groove line TL using the scribing tool 50, the blade edge 51 is first pressed against the upper surface SF1 of the glass substrate 11. Specifically, the protrusion PP and the side portion PS of the blade edge 51 are pressed toward the thickness direction DT of the glass substrate 11 .

Next, the pressed blade tip 51 is slid in the direction DA on the upper surface SF1. The direction DA is a direction in which the projection portion PP is projected onto the upper surface SF1 in the direction in which the side portion PS extends, and substantially corresponds to a direction in which the axial direction AX is projected onto the upper surface SF1. When sliding, the cutting edge 51 is pulled and slid on the upper surface SF1 by the shank 52. By the sliding Plastic deformation occurs on the upper surface SF1 of the glass substrate 11. The groove line TL is formed by the plastic deformation.

Further, in the formation of the groove line TL from the starting point N1 to the end point N3 in the present embodiment, when the blade edge 51 is moved toward the direction DB, in other words, when the blade edge 51 is moved in the direction of the blade edge 51 When the posture of 51 is inclined in the reverse direction, it is more difficult to produce the crack line CL shown in Fig. 9 and the travel of the crack shown in Fig. 16 as compared with the case where the direction DA is used. More generally, in the groove line TL formed by the movement of the blade edge 51 in the direction DA, the crack is easily stretched in the direction opposite to the direction DA. On the other hand, in the groove line TL formed by the movement of the blade edge 51 toward the direction DB, the crack is easily stretched in the same direction as the direction DB. It is presumed that the directional dependence may be related to the stress distribution generated in the glass substrate 11 due to the plastic deformation generated when the groove line TL is formed.

According to the present embodiment, when the glass substrate 11 is cut and the crack is extended from the high load section HR of the groove line TL to the low load section LR (FIG. 16: arrow PR), as shown in FIG. 15, the lower surface SF2 The portion opposite to the middle and low load section LR is in advance in contact with the breaking lever 85. Thereby, the crack is prevented from being deviated from the low load section LR of the groove line TL and stretched. Thereby, the division can be accurately performed along the groove line TL.

Further, before the step of dividing the glass substrate 11, the crack line CL is formed only along the low load section LR of the groove line TL and the high load section HR in the high load section HR (FIG. 9). That is, before the breaking step, the crack line CL which is the starting point of the breaking of the glass substrate 11 is formed. Thereby, the division of the glass substrate 11 in the breaking step can be performed more reliably.

Further, when the groove line TL (FIGS. 2 and 3) for defining the position at which the glass substrate 11 is to be separated is formed, the tool nose 51 is formed in the low load section LR as compared with the high load section HR (Fig. 2). 17(A)) The applied load is reduced. This makes it possible to reduce the damage of the cutting edge 51.

Further, when the low load section LR and the low load section LR in the high load section HR are in the non-cracked state (Figs. 8 and 9), there is no crack in the low load section LR which is the starting point of the breaking glass substrate 11. . Thereby, the glass substrate 11 is subjected to arbitrary processing in this state. In the case of the shape, even if an unexpected stress is applied to the low load section LR, it is difficult for the glass substrate 11 to be accidentally broken. Thereby, the above processing can be performed stably.

Further, when both the low load section LR and the high load section HR are in the non-cracked state (FIGS. 2 and 3), no crack is formed on the groove line TL to break the starting point of the glass substrate 11. Therefore, when the glass substrate 11 is arbitrarily processed in this state, even if an unexpected stress is applied to the groove line TL, it is difficult for the glass substrate 11 to be accidentally broken. Thereby, the above processing can be performed stably.

Further, the groove line TL is formed before the formation of the auxiliary line AL. Thereby, it is possible to avoid the influence of the auxiliary line AL when the groove line TL is formed. In particular, it is possible to avoid the occurrence of an abnormality immediately after the blade edge 51 passes through the auxiliary line AL in order to form the groove line TL.

Next, a modification of the first embodiment will be described below.

Referring to Fig. 18, it is also possible to form the crack line CL by the intersection of the auxiliary line AL and the groove line TL. This phenomenon occurs when the stress applied to the glass substrate 11 when the auxiliary line AL is formed is large.

Referring to Fig. 19, an auxiliary line AL may be formed first on the upper surface SF1 of the glass substrate 11, and a groove line TL (not shown in Fig. 19) may be formed thereafter.

Referring to Fig. 20, the auxiliary line AL can also be formed on the lower surface SF2 of the glass substrate 11 so as to intersect the high load section HR in the planar layout. Thereby, both the auxiliary line AL and the groove line TL can be formed without affecting each other.

Referring to Figs. 21(A) and (B), a scribing device 50v may be used instead of the scribing device 50 (Figs. 17(A) and (B)). The blade edge 51v has a conical shape having a vertex and a conical surface SC. The protrusion PPv of the blade edge 51v is constituted by a vertex. The side portion PSv of the blade edge is constituted by an imaginary line (broken line in Fig. 21(B)) extending from the vertex along the conical surface SC. Thereby, the side portion PSv has a convex shape extending in a line shape.

(Embodiment 2)

Referring to Fig. 22, first, the glass substrate 11 is prepared. A scribing tool with a knife tip is also prepared. The details of the scribing apparatus will be described below.

Then, by the movement of the blade edge on the upper surface SF1 of the glass substrate 11 in the direction DB, an auxiliary line AL intersecting the high-load section HR (FIG. 23) to be described later is formed on the upper surface SF1.

Referring to Fig. 23, a groove line TL is formed on the upper surface SF1 of the glass substrate 11 from the starting point Q1 via the intermediate points Q2 and Q3 to the end point Q4 by the movement of the blade edge in the direction DB. A groove line TL from the starting point Q1 to the halfway point Q2 and from the intermediate point Q3 to the end point Q4 is formed as the low load section LR. A groove line TL having a point Q2 to a midway point Q3 is formed as a high load section HR.

Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a usual breaking step. With this separation as a result, the crack of the glass substrate 11 in the thickness direction extends along the groove line TL only in the high load section HR in the groove line TL.

Referring to Fig. 24, a crack line CL is formed along a portion of the groove line TL by the extension of the above-mentioned crack. Specifically, a crack line CL is formed in a portion between the newly generated side and the intermediate point Q3 by separation in the high load section HR. The direction in which the crack line CL is formed is the same as the direction DB (Fig. 23) in which the groove line TL is formed. Further, a crack line CL is formed in a portion between the newly generated side and the halfway point Q2 by separation. This direction dependence is caused by the state of the tool tip when the high load section HR is formed, which will be described in detail below.

Next, in the same breaking step (Figs. 12 to 16) as in the first embodiment, a step of dividing the crack along the groove line TL from the crack line CL and extending the crack from the intermediate point Q3 to the end point Q4 is performed. The brittle substrate 11 is thus separated.

Referring to FIGS. 25 and 26, as a first modification, the groove line TL may be formed first, and then the auxiliary line AL may be formed. Referring to Fig. 27, as a second modification, the crack line CL can be formed by the formation of the auxiliary line AL. Referring to Fig. 28, the auxiliary line AL can also be formed on the lower surface SF2 of the glass substrate 11 so as to intersect the high load section HR in a planar layout. Further, in the present embodiment, the high load section HR is formed from the halfway point Q2 to Q3, but as long as it is high negative The charge interval HR may be formed in a portion intersecting the auxiliary line AL, and may be formed, for example, from the starting point Q1 to the intermediate point Q3.

Next, a scribing tool 50R suitable for the formation of the groove line TL of the present embodiment will be described with reference to Fig. 29 . The scribing tool 50R has a scribing wheel 51R, a retainer 52R, and a pin 53. The scribing wheel 51R has a substantially disk-like shape, and its diameter is typically about several mm. The scribing wheel 51R is rotatably held around the rotation axis RX via the pin 53 and held by the holder 52R.

The scribing wheel 51R has a peripheral portion PF provided with a blade edge. The outer peripheral portion PF extends in an annular shape around the rotation axis RX. As shown in Fig. 30(A), the outer peripheral portion PF is ridged at a visual level to form a blade edge including a ridge line and an inclined surface. On the other hand, at the microscope level, as shown in Fig. 30(B), the portion of the scribing wheel 51R actually acting by intrusion into the upper surface SF1 (the two-point chain line of Fig. 30(B) Below), the ridgeline of the outer peripheral portion PF has a fine surface shape MS. The surface shape MS is in a front view (Fig. 30(B)), preferably in the shape of a curve having a finite radius of curvature. The scribing wheel 51R is formed using a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond. From the viewpoint of reducing the surface roughness of the ridge line and the inclined surface, the entire scribing wheel 51R may be made of single crystal diamond.

The formation of the groove line TL using the scribing tool 50R is performed by rolling the scribing wheel 51R on the upper surface SF1 of the glass substrate 11 (FIG. 29: arrow RT). The 51R travels in the direction DB on the upper surface SF1. The rolling traveling system is performed by applying a load F to the scribing wheel 51R and pressing the outer peripheral portion PF of the scribing wheel 51R against the upper surface SF1 of the glass substrate 11. Thereby, the groove line TL having the groove shape is formed by plastic deformation on the upper surface SF1 of the glass substrate 11. The load F has a vertical component Fp parallel to the thickness direction DT of the glass substrate 11, and an in-plane component Fi parallel to the upper surface SF1. The direction DB is the same as the in-plane component Fi.

Furthermore, the formation of the groove line TL can also use the marking device 50 that moves in the direction DB (Fig. Instead of using the scribing tool 50R that moves in the direction DB, 17(A) and (B)) or 50v (Figs. 21(A) and (B)).

In addition, the configuration other than the above is substantially the same as the configuration of the above-described first embodiment, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

According to this embodiment, substantially the same effects as those of the first embodiment can be obtained. Further, in the present embodiment, since the groove line TL can be formed using the rotating blade edge without the fixed blade edge, the life of the blade edge can be extended.

(Embodiment 3)

Referring to Fig. 31, first, a glass substrate 11 and a scribing tool having a blade edge are prepared. A groove line is formed between the points R1 and R6 on the upper surface SF1 of the glass substrate 11 by the movement of the blade edge. A groove line TL between the point R1 and the point R2, between the points R3 and R4, and between the points R5 and R6 is formed as a high load section HR. A groove line TL between the points R2 and R3 and between the points R4 and R5 is formed as a low load section LR. As a method of forming the trench line TL, any of the methods described in the above-described first or second embodiment (including variations thereof) can be used.

Next, the glass substrate 11 is separated by a plurality of break lines BL that intersect the high load section HR, respectively. The formation of the breaking line BL can also be carried out by any conventional method such as a usual scribing step or a step of generating a vertical crack from the groove line TL, and the separation of the breaking line BL can be performed by a usual breaking step.

Referring to Fig. 32, in the separation of the glass substrate 11, a crack line CL is formed in a portion between the side newly formed by the separation and one of the midway points passing through the side. The direction in which the crack line CL is formed is opposite to the direction DA in the case where the groove line TL is formed in the direction DA (Fig. 17(A) or Fig. 21(A)), and the direction of the direction DB (Fig. 17(A), Fig. 21) (A) or FIG. 29) The direction DB is the same when the groove line TL is formed.

Next, by the same breaking step (Figs. 12 to 16) as in the first embodiment, a step of dividing the crack along the groove line TL from the crack line CL is performed. The brittle substrate 11 is thus separated.

According to the present embodiment, the position of the glass substrate 11 can be determined by the plurality of groove lines TL and the plurality of break lines BL intersecting therewith.

(Embodiment 4)

Referring to Fig. 33, the blade edge 51 is moved in the direction DA (see Fig. 17(A)), and a groove line direction DL is formed between the end points S1 and S3 on the upper surface SF1 of the glass substrate 11. The groove line TL between the end point S1 and the halfway point S2 is formed as the low load section LR. The groove line TL between the halfway point S2 and the end point S3 is formed as a high load section HR.

Referring to Fig. 34, the blade edge 51 is pressed against the upper surface SF1 of the glass substrate 11, and the blade edge 51 is moved in the direction DA (Fig. 17(A)) on the upper surface SF1 of the glass substrate 11. This causes plastic deformation on the upper surface SF1 of the glass substrate 11, so that on the upper surface SF1, an intersecting groove line TM intersecting the low load section LR of the groove line TL is formed in the direction DM. The step of forming the intersecting groove line TM is performed in the same manner as the groove line TL to obtain a crack-free state. That is, the step of forming the intersecting groove line TM is performed in such a manner that the glass substrate 11 directly under the intersecting groove line TM is continuously connected in a direction intersecting the intersecting groove line TM, that is, in a non-cracked state.

Next, the glass substrate 11 is separated along the break line BM crossing the intersecting groove line TM. This separation can be carried out by a usual scribing step and a breaking step. The break line BM intersects the intersecting groove line TM at a point where the intersection of the intersecting groove line TM and the groove line TL is shifted toward the direction DM. With this separation, a crack line CM (Fig. 35) along with the crack in the thickness direction of the glass substrate 11 is formed along the intersecting groove line TM.

Next, the glass substrate 11 is separated by the breaking line BL which intersects the high load section HR of the groove line TL. This separation can be carried out by a usual scribing step and a breaking step. In the high load section HR, a crack line CL (Fig. 36) accompanying a crack in the thickness direction of the glass substrate 11 is formed in the high load section HR.

Next, by the same breaking step (Figs. 12 to 16) as in the first embodiment, a step of dividing the crack along the groove line TL from the crack line CL is performed. Thus along the trench The line TL breaks the brittle substrate 11 (Fig. 37). Thereafter, the breaking step is performed along the crack line CM to further divide the brittle substrate 11.

According to the present embodiment, the position of the glass substrate 11 can be determined by the groove line TL and the intersecting groove line TM intersecting therewith.

Further, instead of the blade edge 51 (Fig. 17(A)), the blade edge 51v (Fig. 21 (A)) may be used. Further, the groove line TL may be formed in the opposite direction to the direction DL (Fig. 33). In this case, the blade edge 51 (Fig. 17(A)) moves in the direction DB. Similarly, the formation of the intersecting groove line TM may be performed in the opposite direction to the direction DM (Fig. 34). In this case, the blade edge 51 (Fig. 17(A)) moves in the direction DB. In the case where the blade edge is moved in the direction DB, the blade edge of the scribing wheel 51R (Fig. 29) may be used instead of the blade edge 51.

(Embodiment 5)

Fig. 38 is a flow chart FL2 schematically showing a method of dividing the glass substrate 11 (brittle substrate) of the present embodiment. Fig. 39 is a plan view schematically showing a state immediately after completion of step S220 (Fig. 38). Figure 40 is a cross-sectional view (A) - (C) showing a schematic portion of the steps along the line XL-XL of Figure 39.

First, the glass substrate 11 is prepared (FIG. 38: Step S210). The glass substrate 11 includes a surface SF1 having an edge EG and a lower surface SF2. Further, the glass substrate 11 has a thickness direction DT perpendicular to the upper surface SF1. Further, a scribing tool 50R (Fig. 29) having a scribing wheel 51R (Fig. 30(A)) provided with a blade edge is prepared.

Next, the blade edge of the scribing wheel 51R is brought into contact with the edge EG of the upper surface SF1 of the glass substrate 11 by the movement of the scribing wheel 51R shown by the arrow M1 (Fig. 40(A)). Next, the blade edge is pressed against the glass substrate 11 while moving the blade edge on the glass substrate 11 (FIG. 38: Step S220). This step will be described below.

First, the blade edge straddles the edge EG of the glass substrate 11 by the movement of the scribing wheel 51R shown by the arrow M2 (Fig. 40 (B)). Thereby, a notch CP (FIG. 40(C)) is formed at a position on the edge EG, that is, the starting point N1 (FIG. 39) (FIG. 38: Step S220C).

Then, the blade tip of the starting point N1 is pushed over the upper surface SF1 of the glass substrate 11 by the step of forming the notch CP as described above, and is set as indicated by an arrow M3 (Fig. 40(C)). The knurled wheel 51R having the tip end moves on the upper surface SF1. Thereby, plastic deformation occurs on the upper surface SF1 of the glass substrate 11. As a result, a groove line TL (first groove line) is formed from the starting point N1 to the other end position on the upper surface SF1, that is, the end point N3 (FIG. 38: Step S220T). Thereby, the groove line TL has the first portion TP1 (see FIG. 43) separated from the notch CP and the second portion TP2 (see FIG. 43) located on the notch CP. The groove line TL is formed in such a manner as to obtain the above-described crack-free state directly under the portion away from the notch CP. Further, it is preferable that the notch CP is formed in such a manner that a crack-free state is obtained directly underneath.

Referring to FIG. 41(A), the step of forming the trench line TL is performed in such a manner that the glass substrate 11 is continuously connected in the direction DC intersecting the groove line TL directly under the groove line TL, that is, in a crack-free state. . In the crack-free state, although the groove line TL is formed by plastic deformation, the crack along the groove line TL is not formed. Thereby, even if a bending moment is applied to the glass substrate 11, the division along the groove line TL is less likely to occur. In order to obtain a crack-free state, the load of the blade tip 11 being pressed against the glass substrate 11 may be excessively large. In addition, FIG. 41(B) shows a comparative example of FIG. 41(A), and shows a state in which the groove line TL and the crack line CL which is a crack extending directly below the groove line TL are formed.

The desired number of trench lines can be obtained by repeating the above-described formation steps of the trench lines TL as needed. Fig. 39 illustrates a case where three groove lines TL are formed.

Referring to Fig. 42, the breaking step is performed next. Specifically, by applying stress to the glass substrate 11, the crack starting from the notch CP is extended from the starting point N1 to the end point N3, whereby the glass substrate 11 is separated along the groove line TL (FIG. 38: Step S230). The breaking step can be performed multiple times depending on the number of groove lines TL. Furthermore, a more detailed description of the breaking step will be described below.

The glass substrate 11 is separated along the groove line TL by the above steps.

Next, the breaking step of this embodiment will be described below.

Referring to Fig. 43, the glass substrate 11 (Fig. 39) on which the groove line TL is formed is placed between the glass substrate 11 (Fig. 39) in which the groove line TL is formed so that the upper surface SF1 of the glass substrate 11 faces the stage 80 with the spacer 81 interposed therebetween. It is placed on the stage 80.

The breaking lever 85 is prepared with reference to Figs. 44 and 45. As shown in FIG. 45, the breaking lever 85 preferably has a shape that protrudes so as to locally press the surface of the glass substrate 11, and has a substantially V-shape in FIG. As shown in Fig. 44, the protruding portion extends linearly.

Next, the breaking rod 85 is brought into contact with a portion of the lower surface SF2 of the glass substrate 11. The contact portion is separated from the portion SP4 opposite to the portion TP2 of the groove line TL in the thickness direction (the longitudinal direction of FIG. 9) from the lower surface SF2.

Next, as indicated by the arrow CT1, the above-mentioned contact portion spreads along the groove line TL and approaches the side of the portion SP4. When the first contact is made, or by the subsequent extension of the contact portion, the breaking lever 85 is brought into contact with the portion SP3 (part 3) of the lower surface SF2 opposite to the portion TP1 of the groove line TL, And the state of leaving from the above part SP4 (part 4). This selective contact can be easily obtained, for example, by changing the posture of the breaking lever 85 having a certain degree of elasticity. Further, at this point of time, the portion TP1 of the groove line TL is maintained in a crack-free state.

Referring to Fig. 46, the contact portion is brought to the portion SP4 by further extending the expansion as indicated by the arrow CT2. In other words, while the breaking lever 85 is in contact with the portion SP3 of the lower surface SF2, the breaking lever 85 is brought into contact with the portion SP4 of the lower surface SF2. Thereby, the breaking lever 85 first applies stress to the portion TP1 of the groove line TL by the above-described steps, and thereafter applies stress to the notch CP at the same time. The crack is caused to extend from the notch CP along the groove line TL by the stress (refer to the arrow PR of Fig. 47). In other words, a crack is generated from the portion TP2 of the groove line TL extending toward the portion TP1. As a result, the glass substrate 11 is separated along the groove line TL.

The division of the glass substrate 11 is performed by the above breaking step (Fig. 42).

According to the present embodiment, when the glass substrate 11 is separated and the crack is extended from the portion TP2 of the groove line TL toward the portion TP1 (FIG. 47: arrow PR), as shown in FIG. 46, the lower surface SF2 and the portion TP1 are formed. The opposite portion of the SP3 is in advance in contact with the breaking rod 85. Thereby, the crack is prevented from being deviated from the portion TP1 of the groove line to be stretched. Thereby, the division can be accurately performed along the groove line TL.

Further, the notch CP formed on the edge EG of the glass substrate 11 is used as a trigger for stretching the crack along the groove line TL. This notch CP is formed only by the edge EG of the glass substrate 11 which is moved by the cutting edge when the groove line TL is formed. Thereby, the division of the glass substrate 11 can be performed along the groove line TL by a simple procedure.

Further, in the formation of the notch CP, the cutting edge of the scribing wheel 51R, that is, the rotating blade edge is used. Thereby, it is possible to suppress the damage of the blade tip when the blade edge straddles the edge EG of the glass substrate 11 as compared with the case of using a blade tip fixed like a diamond pen.

(Embodiment 6)

Referring to Fig. 48, in the present embodiment, a step of forming a high load section HR as one of the trench lines TL and a step of forming the low load section LR as one of the trench lines TL are performed. The high load section HR is formed from the starting point N1 to the intermediate point N2 between the starting point N1 and the ending point N3. The low load section LR is formed from the midway point N2 to the end point N3. The load applied to the tool tip in the step of forming the low load interval LR is lower than the load used in the step of forming the high load interval HR.

In addition, the configuration other than the above is substantially the same as the configuration of the above-described fifth embodiment, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

According to the present embodiment, the high load section HR which is a portion extending from the notch CP in the groove line TL is formed by plastic deformation under high load. Thereby, compared with the case where the entire groove line TL is formed by plastic deformation under a low load used in the low load section LR, It is easy to generate cracks from the notch CP to the groove line TL. Thereby, in the breaking step (FIGS. 43 to 47), it is possible to more reliably generate the crack with the notch CP as a trigger. Thereby, it is possible to more reliably perform the extension of the crack to separate the glass substrate 11 along the groove line TL.

Further, in FIG. 39, the end point N3 is separated from the edge EG of the glass substrate 11, but the end point N3 may also be located on the edge EG of the glass substrate 11 (in the example of FIG. 39, on the right side of the surface SF1 of the glass substrate 11) ).

(Embodiment 7)

Referring to Fig. 49, first, in the same manner as in the fifth embodiment, the groove line TL having the notch CP at the starting point and extending to the end point is formed in the direction DL.

Referring to Fig. 50, the blade edge is pressed against the upper surface SF1 of the glass substrate 11 by applying a load, and the blade edge is moved toward the upper surface SF1 in the direction DM. Thereby, plastic deformation occurs on the upper surface SF1 of the glass substrate 11, and a intersecting groove line TM (second groove line) is formed between the points T1 and T6. The formation of the intersecting groove line TM is the same as the method described for the groove line TL (Fig. 41 (A)) in the fifth embodiment, and is performed in such a manner that the intersecting groove line TM is obtained in a crack-free state.

A high load interval HS is formed between the point T1 and the point T2, between the points T3 and T4, and between the points T5 and T6 as a part of the intersecting groove line TM. A low load section LS is formed between the points T2 and T3 and between the points T4 and T5 as a part of the intersecting groove line TM. The load applied to the tool tip in the step of forming the high load interval HS is higher than the load used in the step of forming the low load interval LS. The high load interval HS intersects the groove line TL. Further, the method of forming the intersecting trench line TM can use the same method as the method of forming the trench line TL.

Next, by the same breaking step as in the fifth embodiment, the crack is extended along the groove line TL with the notch CP as a starting point. Thereby, the glass substrate 11 is separated along the groove line TL (Fig. 51). Taking this break as an opportunity, the crack extends only in the high load interval HS in the intersecting groove line TM. As a result, a crack line CL is formed along one portion of the intersecting groove line TM. Specifically, borrow A crack line CL is formed in the high load section HS on a portion between the newly generated side and the one of the pair of midway points crossing the side.

Further, it is difficult to form the crack line CL even in the high load section HS in the portion between the newly generated side by the division and the other of the pair of midway points passing through the side. The reason for this is that there is a directional dependence of the ease of stretching of the crack along the crack line CL. It is presumed that the direction dependence is caused by the distribution of internal stress generated when the glass substrate 11 is scribed.

In the high load section HS, as shown in FIG. 41(B), the glass substrate 11 is continuously under the intersecting groove line TM, and is continuously connected to the crack in the direction DC intersecting the extending direction of the intersecting groove line TM. The line CL is disconnected. Here, "continuously connected" means, in other words, connected without being cut by cracks. Further, in a state where the continuous connection is disconnected as described above, portions of the glass substrate 11 may be in contact with each other via a crack of the crack line CL.

Then, stress is applied to the glass substrate 11 by the same breaking step as in the fifth embodiment, whereby the crack extends along the low load section LS starting from the crack line CL. Thereby, the glass substrate 11 is separated along the intersecting groove line TM. That is, in addition to the division along the groove line TL, the division along the intersecting groove line TM is performed.

According to this embodiment, substantially the same effects as those of the fifth embodiment can be obtained. Further, the position of the glass substrate 11 can be determined by the groove line TL and the intersecting groove line TM intersecting therewith.

(Embodiment 8)

Fig. 52 is a flow chart FL3 schematically showing a method of dividing the glass substrate 11 (brittle substrate) of the present embodiment. Fig. 53 is a plan view schematically showing a state immediately after completion of step S320 (Fig. 52).

First, the glass substrate 11 is prepared (FIG. 52: step S310). The glass substrate 11 has an upper surface SF1 and its opposite surface, that is, a lower surface. Moreover, the scribing tool 50 provided with the blade edge 51 is prepared (FIG. 17 (A)).

Next, the blade tip is moved while being pressed against the upper surface SF1 of the glass substrate 11. Thereby, plastic deformation occurs on the upper surface SF1. As a result, a groove line TL extending from the point N1 to the point N3 via the point N2 (one point) is formed on the upper surface SF1 (FIG. 52: step S320). When the groove line TL is formed, the blade edge moves in the scribe line direction DL (one direction) at the point N2. Further, points N1 to N3 indicate positions on the upper surface SF1.

The desired number of trench lines TL can be formed by repeating the above-described formation steps of the trench lines TL as needed. Fig. 53 illustrates a case where three groove lines TL are formed.

The step of forming the groove line TL is carried out in such a manner as to obtain the above-described crack-free state (Fig. 41 (A)). Further, in a state where it is not in a crack-free state (FIG. 41 (B)), the glass substrate 11 is crossed by the groove line TL by the crack line CL extending along the groove line TL directly under the groove line TL. The direction is broken on the DC. A conventional scribe line formed to separate a glass substrate is accompanied by a crack line CL, and is not formed in a crack-free state.

Next, the glass substrate 11 is separated along the breaking line BL where the point N2 on the upper surface SF1 of the glass substrate 11 and the groove line TL intersect. This separation can be performed, for example, by the formation of a normal scribe line along the break line BL followed by the usual breaking step.

Referring to Fig. 54, the end face SE exposing the groove line TL is formed by the above separation (Fig. 52: step S330). The normal direction (normal vector) DN of the end face SE on the portion where the groove line TL is exposed has a component in the scribe direction DL (Fig. 53). The normal direction DN and the scribe direction DL are preferably substantially the same.

Referring to Fig. 55, the step of separating the glass substrate 11 is carried out in such a manner as to maintain a crack-free state. Therefore, the load applied to the blade tip when the groove line TL is formed may be sufficient to be plastically deformed on the upper surface SF1 without being excessively large.

Next, the surface roughness of the end face SE is increased. This step can be performed by machining the portion of the end surface SE where at least the groove line TL is exposed, accompanied by micro-crushing. Specifically, it is possible to grind the portion of the end surface SE where the groove line TL is exposed. get on. This grinding can be performed, for example, using a tool such as a file or a shaft grindstone.

Next, the glass substrate 11 is separated along the groove line TL (FIG. 52: step S340). For this purpose Next, by the step of applying a stress to the portion of the groove line TL exposed on the end surface SE, the crack is extended along the groove line TL starting from the portion. The breaking step can be performed multiple times depending on the number of groove lines TL. Hereinafter, the details of the preferred breaking step will be described.

Referring to Fig. 56, the glass substrate 11 (Fig. 53) on which the groove line TL is formed is placed with the spacer 81 interposed therebetween by the spacer SF1 facing the upper surface SF1 of the glass substrate 11 via the spacer 81. It is placed on the stage 80.

The breaking lever 85 is prepared with reference to FIG. Next, the breaking rod 85 is brought into contact with a portion of the lower surface SF2 of the glass substrate 11. The contact portion is separated from the end face SE of the glass substrate 11.

Next, as indicated by the arrow CT1, the above-mentioned contact portion spreads along the groove line TL and approaches toward the side of the end face SE. At the initial contact, or by the subsequent extension of the contact portion, the breaking lever 85 is in contact with the portion SP3 of the lower surface SF2 opposite to the portion TP1 of the groove line TL which is separated from the end surface SE, And a state in which the portion TP2 connected to the end face SE of the trench line TL is separated from the lower surface SF2. This selective contact can be easily obtained, for example, by changing the posture of the breaking lever 85 having a certain degree of elasticity. Further, at this point of time, the portion TP1 of the groove line TL is maintained in a crack-free state.

Referring to Fig. 58, the extension portion is further advanced as indicated by an arrow CT2, and the contact portion is brought to the portion SP4. In other words, while the breaking lever 85 is in contact with the portion SP3 of the lower surface SF2, the breaking lever 85 is brought into contact with the portion SP4 of the lower surface SF2. Thereby, the breaking lever 85 first applies stress to the portion TP1 of the groove line TL by the above-described steps, and thereafter, simultaneously applies stress to the portion TP2 having the exposed portion on the end surface SE. The crack is caused to extend from the exposed portion along the groove line TL by the stress (see an arrow PR in Fig. 59). In other words, a crack is generated from the portion TP2 of the groove line TL extending toward the portion TP1. As a result, the glass substrate 11 is separated along the groove line TL.

The division of the glass substrate 11 is performed by the above breaking step.

When the scribing device 50 (Fig. 17(A)) is applied to the case of this embodiment, it is pressed. The blade edge 51 slides in the direction DA on the upper surface SF1. When the direction DB opposite to the direction DA is used, it is difficult to generate cracks along the groove line TL in the present embodiment. It is presumed that the dependence of the direction is caused by the distribution of the stress in the glass substrate 11 caused by the formation of the groove line TL. Further, as a modification, a scribing device 50v (Fig. 21(A)) can also be used.

According to the present embodiment, when the glass substrate 11 is separated and the crack is extended from the portion TP2 of the groove line TL toward the portion TP1 (FIG. 59: arrow PR), as shown in FIG. 58, the lower surface SF2 and the portion TP1 are formed. The opposite portion of the SP3 is in advance in contact with the breaking rod 85. Thereby, the crack is prevented from being deviated from the portion TP1 of the groove line to be stretched. Thereby, it is possible to accurately divide along the groove line TL.

Further, in order to form a portion that causes the crack to extend along the groove line TL, the surface roughness of the end surface SE (Fig. 55) where the groove line TL is exposed is increased. Thereby, it is easy to generate a crack starting from the portion where the groove line TL is exposed on the end surface SE. Thereby, even when the groove line TL is formed with a low load, the groove line TL (Fig. 3(A)) having no crack immediately below it can be divided.

(Embodiment 9)

Referring to Fig. 60, groove lines TL are formed on the upper surface SF1 of the glass substrate 11 in substantially the same manner as in the eighth embodiment (Fig. 53). In the present embodiment, it is preferable to use the scribing tool 50R (Fig. 29) having the scribing wheel 51R.

Next, in the same manner as in the eighth embodiment, the glass substrate 11 is separated along the break line BL.

Referring to Fig. 61, an end surface SE exposing the groove line TL is formed by the above separation. In the present embodiment, the normal direction DN of the end surface SE at the portion where the groove line TL is exposed has a component opposite to the scribe direction DL (Fig. 60). The normal direction DN and the scribe direction DL are preferably substantially opposite.

Next, substantially the same steps as in the eighth embodiment are performed. That is, the surface roughness of the end surface SE is increased, and then the glass substrate 11 is separated along the groove line TL.

According to this embodiment, substantially the same effects as those of the eighth embodiment can be obtained. and then According to the present embodiment, the scribing wheel 51R can be used when the groove line TL is formed. Further, when the scribing wheel 51R is applied to the eighth embodiment, it is difficult to generate cracks along the groove line TL as compared with the present embodiment.

Further, instead of the scribing device 50R, a scribing device 50 (FIG. 17(A)) or 50v (FIG. 21(A)) may be used. In this case, it is preferable to use the direction DB which is the opposite direction of the direction DA, instead of the direction DA. Thereby, it is easier to generate cracks along the groove line TL.

The breaking method of the brittle substrate of each of the above embodiments can be particularly preferably applied to a glass substrate, but the brittle substrate can also be made of a material other than glass. For example, as a material other than glass, ceramics, ruthenium, compound semiconductors, sapphire or quartz can also be used.

11‧‧‧Glass substrate (brittle substrate)

IVA, IVB, III‧‧‧ lines

DA‧‧‧ directions

HR‧‧‧High load range (Part 2)

LR‧‧‧Low load range (Part 1)

Starting point for N1‧‧

N2‧‧‧ halfway point

N3‧‧‧ end point

SF1‧‧‧ upper surface (1st surface)

TL‧‧‧ trench line

Claims (5)

A method for breaking a brittle substrate, comprising: preparing a brittle substrate having a first surface and a second surface opposite to the first surface, and having a thickness direction perpendicular to the first surface; The blade tip is pressed against the first surface of the brittle substrate, and the blade edge is moved on the first surface to be plastically deformed on the first surface of the brittle substrate, thereby forming the first and the first a step of forming a trench line; and forming the trench line to obtain a continuous connection of the brittle substrate directly in a direction crossing the trench line directly under at least the first portion of the trench line The method of breaking the brittle substrate further includes the step of placing the brittle substrate on the stage such that the first surface of the brittle substrate faces the stage And causing the stress applying member to contact the third portion facing the first portion of the groove line and the fourth portion facing the second portion in contact with the second surface of the brittle substrate the way a step of contacting the second surface of the brittle substrate; and the step of contacting the stress applying member is performed such that the first portion is maintained in a non-cracked state; and the breaking method of the brittle substrate further includes the following steps: The stress applying member is brought into contact with the fourth portion of the second surface of the brittle substrate while maintaining the stress applying member in contact with the third portion of the second surface of the brittle substrate. A crack extending from the second portion of the groove line toward the first portion breaks the brittle substrate along the groove line. The method for breaking a brittle substrate according to claim 1, wherein the brittle substrate is separated Before the step, the method further includes the step of generating a crack only along the second portion of the first and second portions of the groove line. The method for breaking a brittle substrate according to claim 2, wherein in the step of forming the trench line, a load applied to the blade tip for forming the second portion of the trench line is higher than forming the trench The load applied to the tip of the blade in the first part of the line. The method for breaking a brittle substrate according to claim 1, further comprising the step of forming a notch at the edge by traversing the edge of the first surface of the brittle substrate, and the step of the groove line 2 parts are located on the above gap. The method for breaking a brittle substrate according to claim 1, wherein the step of separating the brittle substrate further comprises: forming a step of exposing an end surface of the second portion of the trench line on the brittle substrate; and causing the end surface The step of increasing the surface roughness.