TWI715718B - Breaking method of brittle substrate - Google Patents
Breaking method of brittle substrate Download PDFInfo
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- TWI715718B TWI715718B TW106104255A TW106104255A TWI715718B TW I715718 B TWI715718 B TW I715718B TW 106104255 A TW106104255 A TW 106104255A TW 106104255 A TW106104255 A TW 106104255A TW I715718 B TWI715718 B TW I715718B
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- 239000000758 substrate Substances 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims description 49
- 238000005520 cutting process Methods 0.000 claims description 58
- 239000000314 lubricant Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 55
- 230000015572 biosynthetic process Effects 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 10
- 239000010432 diamond Substances 0.000 description 7
- 238000003754 machining Methods 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B5/00—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
本發明之課題在於在形成其下方不具有裂痕之溝槽線之後,更確實且容易地形成沿著溝槽線之裂痕線。 The subject of the present invention is to form a crack line along the groove line more reliably and easily after forming a groove line without a crack under it.
準備刃前緣51,該刃前緣51藉由具有第1~第3面SD1~SD3而具有稜線PS及頂點PP。藉由於脆性基板4之一個面SF1上使刃前緣51向自稜線PS朝向第1面SD1之方向滑動,而使具有槽形狀之溝槽線TL以無裂痕狀態形成。藉由刃前緣51之稜線PS切下脆性基板4之邊緣ED,而使厚度方向DT之脆性基板4之裂痕自邊緣ED沿著溝槽線TL伸展,藉此形成裂痕線CL。藉由裂痕線CL,使得於溝槽線TL之下方,脆性基板4於與溝槽線TL交叉之方向連續性之連接中斷。 The blade front edge 51 is prepared. The blade front edge 51 has a ridge PS and a vertex PP by having the first to third surfaces SD1 to SD3. By sliding the leading edge 51 on one surface SF1 of the brittle substrate 4 in the direction from the ridge line PS toward the first surface SD1, the groove line TL having a groove shape is formed in a crack-free state. The edge ED of the brittle substrate 4 is cut by the ridge line PS of the front edge 51, so that the crack of the brittle substrate 4 in the thickness direction DT extends from the edge ED along the groove line TL, thereby forming a crack line CL. With the crack line CL, under the trench line TL, the continuous connection of the brittle substrate 4 in the direction crossing the trench line TL is interrupted.
Description
本發明係關於一種脆性基板之分斷方法。 The invention relates to a method for breaking a brittle substrate.
於平面顯示器面板或太陽電池面板等電氣設備之製造中,常常必須分斷脆性基板。於典型性之分斷方法中,首先,於脆性基板上形成裂痕線。於本說明書中所謂「裂痕線」,係指於脆性基板之厚度方向局部地前進之裂痕於脆性基板之表面上線狀地延伸者。其次,進行所謂之斷裂步驟。具體而言,藉由對脆性基板施加應力,而使裂痕線之裂痕於厚度方向完全前進。藉此,脆性基板沿著裂痕線分斷。 In the manufacture of flat-panel display panels or solar cell panels and other electrical equipment, it is often necessary to break the brittle substrate. In a typical breaking method, first, crack lines are formed on the brittle substrate. The term "crack line" in this specification refers to a crack that locally advances in the thickness direction of the brittle substrate and extends linearly on the surface of the brittle substrate. Secondly, the so-called breaking step is carried out. Specifically, by applying stress to the brittle substrate, the crack of the crack line completely advances in the thickness direction. Thereby, the brittle substrate is broken along the crack line.
根據專利文獻1,處於玻璃板之上表面之凹陷會於切割時產生。於該專利文獻1中,將該凹陷稱為「劃線」。又,與該劃線之刻設同時地,產生自劃線向正下方向延伸之裂痕。如該專利文獻1之技術所呈現,於習知之典型性之技術中,與劃線之形成同時地形成裂痕線。
According to
根據專利文獻2,提出有與上述典型性之分斷技術明顯不同之分斷技術。根據該技術,首先,藉由利用脆性基板上之刃前緣之滑動產生塑性變形,而形成該專利文獻2中被稱為「劃線」之槽形狀。於本說明書中,以後將該槽形狀稱為「溝槽線」。於形成溝槽線之時間點,未於其下 方形成裂痕。然後,藉由沿著溝槽線使裂痕伸展,而形成裂痕線。即,與典型性之技術不同,不伴隨裂痕之溝槽線一旦形成,之後便沿著溝槽線形成裂痕線。然後,沿著裂痕線進行通常之斷裂步驟。 According to Patent Document 2, a breaking technique that is significantly different from the above-mentioned typical breaking technique is proposed. According to this technique, first, a groove shape called "scribing" in Patent Document 2 is formed by plastically deforming by the sliding of the leading edge of the blade on the brittle substrate. In this specification, this groove shape is hereinafter referred to as "groove line". At the point in time when the groove line is formed, not below it Fang formed a crack. Then, the crack line is formed by extending the crack along the groove line. That is, unlike the typical technology, once the groove line without a crack is formed, a crack line is formed along the groove line thereafter. Then, the usual breaking step is performed along the crack line.
上述專利文獻2之技術中所使用之不伴隨裂痕之溝槽線與伴隨裂痕之同時形成之典型性之劃線相比,能夠藉由更低之負載之刃前緣之滑動而形成。因負載較小,故施加至刃前緣之損傷變小。因此,根據該分斷技術,可延長刃前緣之壽命。 The groove line without cracks used in the technique of the above-mentioned Patent Document 2 can be formed by sliding of the cutting edge with a lower load than the typical scribing line formed simultaneously with cracks. Due to the smaller load, the damage applied to the leading edge of the blade becomes smaller. Therefore, according to this breaking technology, the life of the cutting edge can be extended.
[先前技術文獻] [Prior Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本專利特開平9-188534號公報 [Patent Document 1] Japanese Patent Laid-Open No. 9-188534
[專利文獻2]國際公開第2015/151755號 [Patent Document 2] International Publication No. 2015/151755
於習知之典型性之技術中,於劃刻時未形成裂痕係指劃刻失敗。然而,於上述專利文獻2之分斷技術中,藉由劃刻,而有意地形成不伴隨裂痕之溝槽線。而且,然後,產生沿著溝槽線之裂痕線。為了開始形成裂痕線,必須向脆性基板賦予使藉由溝槽線之形成而於脆性基板中產生之內部應力釋放之契機。關於賦予該契機之方法,於上述專利文獻2中提出有各種方法。根據本發明者之研究,該等方法亦有用,但殘留有形成裂痕線之概率稍低,或由於需要追加之斷裂步驟故而作業負擔稍大之課題。 In the conventional typical technique, no cracks formed during scribing means that the scribing failed. However, in the cutting technique of Patent Document 2 described above, groove lines without cracks are intentionally formed by scribing. And, then, a crack line along the groove line is generated. In order to start the formation of crack lines, it is necessary to give the brittle substrate an opportunity to release the internal stress generated in the brittle substrate by the formation of the groove line. Regarding the method of giving this opportunity, various methods are proposed in the aforementioned Patent Document 2. According to the research of the inventors, these methods are also useful, but there is a problem that the probability of forming a crack line is slightly lower, or the work burden is slightly greater due to the need for an additional breaking step.
本發明係為了解決如以上之課題而完成者,其目的在於提供一種於形成其下方不具有裂痕之溝槽線之後,可更確實且容易地形成沿著溝槽線之裂痕線的脆性基板之分斷方法。 The present invention was completed in order to solve the above-mentioned problems, and its purpose is to provide a brittle substrate that can more reliably and easily form a crack line along the groove line after forming a groove line without a crack underneath it. Breaking method.
按照本發明之一個態樣之脆性基板之分斷方法具有以下之步驟a)~e)。 The method for breaking a brittle substrate according to one aspect of the present invention has the following steps a) to e).
a)準備具有設置有邊緣之一個面及與一個面垂直之厚度方向之脆性基板。 a) Prepare a brittle substrate with a surface provided with edges and a thickness direction perpendicular to the surface.
b)準備刃前緣,該刃前緣具有:第1面;第2面,其與第1面相鄰;及第3面,其係藉由與第2面相鄰而形成稜線且藉由與第1面及第2面之各者相鄰而形成頂點。 b) Prepare the blade front edge, the blade front edge has: a first surface; a second surface, which is adjacent to the first surface; and a third surface, which forms a ridge line by being adjacent to the second surface and by It is adjacent to each of the first surface and the second surface to form a vertex.
c)藉由於脆性基板之一個面上使刃前緣向自稜線朝向第1面之方向滑動,而利用塑性變形使具有槽形狀之溝槽線形成於脆性基板之一個面上。 溝槽線係以成為無裂痕狀態之方式形成,即,於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續地連接之狀態。 c) A groove line with a groove shape is formed on one surface of the brittle substrate by plastic deformation by sliding the leading edge of the blade in the direction from the ridge line to the first surface on one surface of the brittle substrate. The groove line is formed in a crack-free state, that is, under the groove line, the brittle substrate is continuously connected in the direction intersecting the groove line.
d)藉由利用步驟c)滑動之刃前緣之稜線切下脆性基板之一個面之邊緣,而使厚度方向之脆性基板之裂痕自邊緣沿著溝槽線伸展,藉此形成裂痕線。藉由裂痕線,使得於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續性之連接中斷。 d) By using the ridge line of the sliding blade front edge in step c) to cut the edge of one surface of the brittle substrate, the cracks of the brittle substrate in the thickness direction are extended from the edge along the groove line, thereby forming a crack line. With the crack line, under the groove line, the continuous connection of the brittle substrate in the direction crossing the groove line is interrupted.
e)沿著裂痕線分斷脆性基板。 e) Break the brittle substrate along the crack line.
按照本發明之另一態樣之脆性基板之分斷方法具有以下之步驟a)~e)。 The method for breaking a brittle substrate according to another aspect of the present invention has the following steps a) to e).
a)準備具有一個面及與一個面垂直之厚度方向之脆性基板。於一個面上設置有輔助線,該輔助線具有:輔助溝槽線,其具有槽形狀;及輔助裂痕線,其係藉由厚度方向之脆性基板之裂痕沿著輔助溝槽線延伸而構成。 a) Prepare a brittle substrate with one surface and a thickness direction perpendicular to one surface. An auxiliary line is provided on one surface, and the auxiliary line has: an auxiliary groove line having a groove shape; and an auxiliary crack line, which is formed by the crack of the brittle substrate in the thickness direction extending along the auxiliary groove line.
b)準備刃前緣,該刃前緣具有:第1面;第2面,其與第1面相鄰;及第3面,其係藉由與第2面相鄰而形成稜線且藉由與第1面及第2面之各者相鄰而形成頂點。 b) Prepare the blade front edge, the blade front edge has: a first surface; a second surface, which is adjacent to the first surface; and a third surface, which forms a ridge line by being adjacent to the second surface and by It is adjacent to each of the first surface and the second surface to form a vertex.
c)藉由於脆性基板之一個面上使刃前緣向自稜線朝向第1面之方向滑動,而藉由塑性變形使具有槽形狀之溝槽線形成於脆性基板之一個面上。溝槽線係以成為無裂痕狀態之方式形成,即,於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續地連接之狀態。 c) A groove line with a groove shape is formed on one surface of the brittle substrate by plastic deformation by sliding the leading edge of the blade in the direction from the ridge line to the first surface due to one surface of the brittle substrate. The groove line is formed in a crack-free state, that is, under the groove line, the brittle substrate is continuously connected in the direction intersecting the groove line.
d)藉由利用步驟c)滑動之刃前緣之稜線與設置於脆性基板之一個面上之輔助線交叉,而使厚度方向之脆性基板之裂痕自輔助線沿著溝槽線伸展,藉此形成裂痕線。藉由裂痕線,使得於溝槽線之下方,脆性基板於與溝槽線交叉之方向連續性之連接中斷。 d) By using the ridge line of the sliding blade front edge in step c) to cross the auxiliary line provided on one surface of the brittle substrate, the cracks of the brittle substrate in the thickness direction extend along the groove line from the auxiliary line, thereby Form a crack line. With the crack line, under the groove line, the continuous connection of the brittle substrate in the direction crossing the groove line is interrupted.
e)沿著裂痕線分斷脆性基板。 e) Break the brittle substrate along the crack line.
根據按照本發明之一個態樣之脆性基板之分斷方法,第1,可容易地準備刃前緣。其原因在於,刃前緣之頂點係作為第1面、第2面及第3面之3個面相交之部位而設置。假設,於藉由超過3個面相交之部位而設置刃前緣之頂點之情形時,必須以通過3個面相交之點之方式,使剩餘之面之位置一致。因此,需要較高之加工精度。相對於此,於藉由3個面相交之部位而設置刃前緣之頂點之情形時,不需要那麼高之加工精 度。第2,可更確實地形成沿著溝槽線之裂痕線。其原因在於,為了形成溝槽線而滑動之刃前緣之稜線切下脆性基板之一個面之邊緣。藉由該切下,而以較高之確實性獲得裂痕線之形成開始之契機。 According to the method for cutting a brittle substrate according to one aspect of the present invention, first, the cutting edge can be easily prepared. The reason is that the apex of the leading edge of the blade is provided as a location where three of the first surface, the second surface, and the third surface intersect. Suppose that when the apex of the leading edge of the blade is set by the part where more than 3 faces intersect, the position of the remaining faces must be consistent by passing through the intersecting point of the 3 faces. Therefore, higher machining accuracy is required. On the other hand, in the case where the apex of the leading edge of the blade is set by the part where the three faces intersect, it does not require such high machining precision. degree. Second, the crack line along the groove line can be formed more reliably. The reason is that the ridge line of the leading edge of the blade that slides to form the groove line cuts the edge of one surface of the brittle substrate. With this cutting, the opportunity to start the formation of the crack line is obtained with higher certainty.
根據按照本發明之另一態樣之脆性基板之分斷方法,第1,可容易地準備刃前緣。其原因在於,刃前緣之頂點係作為第1面、第2面及第3面之3個面相交之部位而設置。假設,於藉由超過3個面相交之部位而設置刃前緣之頂點之情形時,必須以通過3個面相交之點之方式,使剩餘之面之位置一致。因此,需要較高之加工精度。相對於此,於藉由3個面相交之部位而設置刃前緣之頂點之情形時,不需要那麼高之加工精度。第2,可更確實地形成沿著溝槽線之裂痕線。其原因在於,為了形成溝槽線而滑動之刃前緣之稜線向設置於脆性基板之一個面之輔助線與藉由滑動之刃前緣之頂點而形成之溝槽線之交點局部地施加應力。藉由該應力施加,而以較高之確實性獲得裂痕線之形成開始之契機。 According to the method for separating a brittle substrate according to another aspect of the present invention, first, the cutting edge can be easily prepared. The reason is that the apex of the leading edge of the blade is provided as a location where three of the first surface, the second surface, and the third surface intersect. Suppose that when the apex of the leading edge of the blade is set by the part where more than 3 faces intersect, the position of the remaining faces must be consistent by passing through the intersecting point of the 3 faces. Therefore, higher machining accuracy is required. On the other hand, when the apex of the leading edge of the blade is set by the part where the three faces intersect, such high machining accuracy is not required. Second, the crack line along the groove line can be formed more reliably. The reason is that the ridge line of the sliding blade front edge to form the groove line locally applies stress to the intersection of the auxiliary line provided on one surface of the brittle substrate and the groove line formed by the apex of the sliding blade front edge . With the application of the stress, the opportunity for the formation of the crack line is obtained with higher certainty.
ED‧‧‧邊緣 ED‧‧‧Edge
AL‧‧‧輔助線 AL‧‧‧Auxiliary Line
CL‧‧‧裂痕線 CL‧‧‧Crack Line
SD1‧‧‧頂面(第1面) SD1‧‧‧Top surface (1st side)
SD2‧‧‧側面(第2面) SD2‧‧‧Side (Second side)
SD3‧‧‧側面(第3面) SD3‧‧‧Side (Side 3)
SF、SF1‧‧‧上表面(一個面) SF, SF1‧‧‧Upper surface (one surface)
PP‧‧‧頂點 PP‧‧‧Vertex
TL‧‧‧溝槽線 TL‧‧‧Trench line
PS‧‧‧稜線 PS‧‧‧Ridge
CLa‧‧‧輔助裂痕線 CLa‧‧‧Auxiliary Rift Line
TLa‧‧‧輔助溝槽線 TLa‧‧‧Auxiliary groove line
4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)
51‧‧‧刃前緣 51‧‧‧Blade front edge
51a‧‧‧輔助刃前緣 51a‧‧‧Auxiliary blade leading edge
圖1係概略性地表示本發明之實施形態1之脆性基板之分斷方法中所使用的切割器具之構成之側視圖。 Fig. 1 is a side view schematically showing the structure of a cutting tool used in the method of breaking a brittle substrate according to the first embodiment of the present invention.
圖2係圖1之箭頭II之視點之概略俯視圖。 Fig. 2 is a schematic plan view from the point of arrow II in Fig. 1.
圖3係概略性地表示本發明之實施形態1~5之脆性基板之分斷方法之構成的流程圖。
Fig. 3 is a flowchart schematically showing the structure of the method of breaking a brittle substrate according to the
圖4係概略性地表示本發明之實施形態1之脆性基板之分斷方法之第1 步驟的俯視圖。 Fig. 4 schematically shows the first method of breaking the brittle substrate in the first embodiment of the present invention Top view of steps.
圖5係沿著圖4之線V-V之概略端面圖。 Fig. 5 is a schematic end view taken along the line V-V of Fig. 4.
圖6係概略性地表示本發明之實施形態1之脆性基板之分斷方法之第2步驟的俯視圖。 Fig. 6 is a plan view schematically showing the second step of the method of breaking a brittle substrate according to the first embodiment of the present invention.
圖7係沿著圖6之線VII-VII之概略端面圖。 Fig. 7 is a schematic end view taken along the line VII-VII of Fig. 6.
圖8係概略性地表示比較例之脆性基板之分斷方法中所使用的切割器具之構成之俯視圖。 Fig. 8 is a plan view schematically showing the configuration of the cutting tool used in the method of breaking the brittle substrate of the comparative example.
圖9係概略性地表示本發明之實施形態2之脆性基板之分斷方法中的溝槽線之形成方法之構成之流程圖。 FIG. 9 is a flowchart schematically showing the structure of a method of forming a groove line in a method of breaking a brittle substrate according to the second embodiment of the present invention.
圖10係概略性地表示本發明之實施形態3之脆性基板之分斷方法之第1步驟之俯視圖。 Fig. 10 is a plan view schematically showing the first step of the method of breaking a brittle substrate according to the third embodiment of the present invention.
圖11係沿著圖10之線XI-XI之概略端面圖。 Fig. 11 is a schematic end view taken along the line XI-XI of Fig. 10.
圖12係概略性地表示本發明之實施形態3之脆性基板之分斷方法之第2步驟的俯視圖。 Fig. 12 is a plan view schematically showing the second step of the method of breaking a brittle substrate according to the third embodiment of the present invention.
圖13係概略性地表示本發明之實施形態3之脆性基板之分斷方法之第3步驟的俯視圖。 Fig. 13 is a plan view schematically showing the third step of the method of breaking a brittle substrate according to the third embodiment of the present invention.
圖14係概略性地表示本發明之實施形態4之脆性基板之分斷方法之第1步驟的俯視圖。 Fig. 14 is a plan view schematically showing the first step of the method of breaking a brittle substrate according to the fourth embodiment of the present invention.
圖15係概略性地表示本發明之實施形態4之脆性基板之分斷方法之第2步驟的俯視圖。 Fig. 15 is a plan view schematically showing the second step of the method of breaking a brittle substrate according to the fourth embodiment of the present invention.
圖16係概略性地表示本發明之實施形態5之脆性基板之分斷方法中所使用的刃前緣之構成之剖視圖。 Fig. 16 is a cross-sectional view schematically showing the structure of the cutting edge used in the method of breaking a brittle substrate according to the fifth embodiment of the present invention.
圖17係概略性地表示本發明之實施形態5之脆性基板之分斷方法中所使用的輔助刃前緣之構成之剖視圖。 Fig. 17 is a cross-sectional view schematically showing the structure of the leading edge of the auxiliary blade used in the method of breaking a brittle substrate according to the fifth embodiment of the present invention.
以下,基於圖式對本發明之實施形態進行說明。再者,於以下之圖式中對相同或相當之部分標註相同之參照編號,不重複其說明。 Hereinafter, an embodiment of the present invention will be described based on the drawings. Furthermore, the same or equivalent parts are marked with the same reference numbers in the following drawings, and the description is not repeated.
<實施形態1>
<
(切割器具之構成) (The composition of cutting equipment)
參照圖1及圖2,首先,對本實施形態之玻璃基板4(脆性基板)之分斷方法之溝槽線之形成步驟中所使用的切割器具50之構成進行說明。切割器具50具有刃前緣51及柄52。刃前緣51係藉由固定於作為其固持器之柄52而保持。
1 and 2, first, the structure of the
於刃前緣51設置有頂面SD1(第1面)及包圍頂面SD1之多個面。該等多個面包含側面SD2(第2面)及側面SD3(第3面)。頂面SD1、側面SD2及SD3(第1~第3面)朝向相互不同之方向,且相互相鄰。刃前緣51具有頂面SD1、側面SD2及SD3相交之頂點。藉由該頂點PP而構成刃前緣51之突起部。又,側面SD2及SD3形成構成刃前緣51之側部之稜線PS。稜線PS自頂點PP線狀地延伸,且具有線狀地延伸之凸形狀。根據以上之構成,刃前緣51具有:頂面SD1;側面SD2,其與頂面SD1相鄰;及側面SD3,其係藉由與側面SD2相鄰而形成稜線PS且藉由與頂面SD1及側面SD2之各者相鄰而形成頂點PP。
A top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1 are provided on the
較佳為刃前緣51為金剛石點。即,自可減小硬度及表面粗
糙度之方面而言,較佳為,刃前緣51由金剛石製成。更佳為,刃前緣51由單晶金剛石製成。進而較佳為,就結晶學而言,頂面SD1為{001}面,側面SD2及SD3之各者為{111}面。於該情形時,側面SD2及SD3具有不同之方向,但是結晶學上為相互等價之結晶面。
Preferably, the leading
再者,亦可使用並非單晶之金剛石,例如,亦可使用利用CVD(Chemical Vapor Deposition)法合成的多晶體金剛石。或者,亦可使用自微粒之石墨或非石墨狀碳將不包含鐵族元素等結合材燒結之多晶體金剛石粒子藉由鐵族元素等結合材而結合之燒結金剛石。 Furthermore, diamonds other than single crystals can also be used. For example, polycrystalline diamonds synthesized by the CVD (Chemical Vapor Deposition) method can also be used. Alternatively, it is also possible to use a sintered diamond in which polycrystalline diamond particles sintered from fine particles of graphite or non-graphite carbon without a binder such as iron group elements are bonded by a binder such as iron group elements.
柄52沿著軸向AX延伸。較佳為,刃前緣51以頂面SD1之法線方向大致沿著軸向AX之方式安裝於柄52。
The
(玻璃基板之分斷方法) (How to break the glass substrate)
其次,以下一面參照圖3所示之流程圖一面對玻璃基板4之分斷方法進行說明。
Next, the method of dividing the
於步驟S10(圖3)中,準備欲被分斷之玻璃基板4(圖1)。玻璃基板4具有上表面SF1(一個面)及其相反之下表面SF2(另一個面)。於上表面SF1設置有邊緣ED。於圖4所示之例中,邊緣ED具有長方形狀。玻璃基板4具有與上表面SF1垂直之厚度方向DT。又,於步驟S20(圖3)中,準備具有上述刃前緣51之切割器具50(圖1及圖2)。
In step S10 (FIG. 3), the
參照圖4,於步驟S30(圖3)中形成溝槽線TL。具體而言,進行以下之步驟。 Referring to FIG. 4, a trench line TL is formed in step S30 (FIG. 3). Specifically, perform the following steps.
首先,將刃前緣51(圖1)之頂點PP於位置N1壓抵於上表面SF1。藉此,刃前緣51接觸於玻璃基板4。較佳為,位置N1如圖所示,
自玻璃基板4之上表面SF1之邊緣ED離開。換言之,於刃前緣51之滑動開始時間點,避免刃前緣51與玻璃基板4之上表面SF1之邊緣ED碰撞。
First, the apex PP of the cutting edge 51 (FIG. 1) is pressed against the upper surface SF1 at the position N1. Thereby, the
其次,使如上所述壓抵之刃前緣51於玻璃基板4之上表面SF1上滑動(參照圖4之箭頭)。刃前緣51(圖1)於上表面SF1上向自稜線PS朝向頂面SD1之方向滑動。嚴格而言,刃前緣51向將自稜線PS經由頂點PP朝向頂面SD1之方向投影至上表面SF1上所成之方向DB滑動。方向DB大致沿著將頂點PP之附近之稜線PS之延伸方向投影至上表面SF1上所成之方向。於圖1中,方向DB對應於與將自刃前緣51延伸之軸向AX投影至上表面SF1上所成之方向相反之方向。因此,刃前緣51藉由柄52而壓入於上表面SF1上。
Next, the
於玻璃基板4之上表面SF1上滑動之刃前緣51(圖1)之稜線PS及頂面SD1之各者與玻璃基板4之上表面SF1形成角度AG1及角度AG2。較佳為,角度AG2小於角度AG1。
Each of the ridge PS and the top surface SD1 of the front edge 51 (FIG. 1) sliding on the upper surface SF1 of the
藉由上述滑動而於上表面SF1上產生塑性變形。藉此,於上表面SF1上形成具有槽形狀之溝槽線TL(圖5)。較佳為,溝槽線TL僅藉由玻璃基板4之塑性變形而產生,於該情形時,於玻璃基板4之上表面SF1上不會產生切削。為了避免切削,只要不使刃前緣51之負載過高即可。由於無切削,故可避免於上表面SF1上產生不佳之微細之碎片。但是,通常可容許少許之切削。
Plastic deformation is generated on the upper surface SF1 by the above sliding. Thereby, a groove line TL having a groove shape is formed on the upper surface SF1 (FIG. 5 ). Preferably, the groove line TL is only generated by the plastic deformation of the
溝槽線TL之形成係藉由於位置N1及位置N3e之間,使刃前緣51自位置N1經由位置N2向位置N3e滑動而進行。位置N2自玻璃基板4之上表面SF1之邊緣ED離開。位置N3e位於玻璃基板4之上表面SF1
之邊緣ED。
The groove line TL is formed by sliding the leading
溝槽線TL係以成為無裂痕狀態之方式形成,即,於溝槽線TL之下方,玻璃基板4於與溝槽線TL之延伸方向(圖4中之橫方向)交叉之方向DC(圖5)連續地連接之狀態。於無裂痕狀態中,雖然形成有由塑性變形而形成之溝槽線TL,但不形成沿著其之裂痕。為了獲得適當之無裂痕狀態,而調整施加至刃前緣51之負載,以使其小至於溝槽線TL形成時間點不產生裂痕之程度,且大至產生如成為可於之後之步驟中產生裂痕之內部應力之狀態的塑性變形之程度。
The trench line TL is formed in a crack-free state, that is, under the trench line TL, the
為了形成溝槽線TL,如上所述滑動之刃前緣51最終到達位置N3e。於刃前緣51位於位置N2之時間點維持無裂痕狀態,進而,維持至刃前緣51到達位置N3e之瞬間為止。若刃前緣51到達位置N3e,則刃前緣51之稜線PS(圖1)切下玻璃基板4之上表面SF1之邊緣ED。
To form the groove line TL, the sliding
參照圖6及圖7,藉由上述之切下,而於位置N3e產生微細之破壞。以該破壞為起點,以將溝槽線TL附近之內部應力釋放之方式產生裂痕。具體而言,厚度方向DT之玻璃基板4之裂痕自位於玻璃基板4之上表面SF1之邊緣ED之位置N3e沿著溝槽線TL伸展(參照圖6中之箭頭)。換言之,裂痕線CL之形成開始。藉此,作為步驟S50(圖3),自位置N3e向位置N1形成裂痕線CL。
Referring to FIGS. 6 and 7, by the above-mentioned cutting, a slight damage occurs at the position N3e. Taking this failure as a starting point, a crack is generated in a manner to release the internal stress near the trench line TL. Specifically, the crack of the
再者,為了使裂痕線CL之形成更加確實,亦可使刃前緣51自位置N2向位置N3e滑動之速度小於自位置N1至位置N2之速度。同樣地,亦可使於自位置N2至位置N3e施加至刃前緣51之負載大於在維持無裂痕狀態之範圍內自位置N1至位置N2之負載。
Furthermore, in order to make the formation of the crack line CL more reliable, the sliding speed of the
藉由裂痕線CL,使得於溝槽線TL之下方,玻璃基板4於與溝槽線TL之延伸方向(圖6中之橫方向)交叉之方向DC(圖7)連續性之連接中斷。此處所謂「連續性之連接」,換言之,係指不由裂痕遮蔽之連接。再者,於如上所述連續性之連接中斷之狀態中,亦可經由裂痕線CL之裂痕而使玻璃基板4之部分彼此接觸。又,亦可於溝槽線TL之正下方殘留少許連續性之連接。
With the crack line CL, the continuous connection of the
裂痕線CL(圖6)沿著溝槽線TL(圖4)而伸展之方向(圖6之箭頭)與形成有溝槽線TL之方向(圖4之箭頭)相反。為了利用此種方向關係產生裂痕線CL,於為了形成溝槽線TL而將刃前緣51向方向DB(圖1)滑動時,較佳為,使角度AG2小於角度AG1。若不滿足該角度關係,則不易產生裂痕線CL。又,若角度AG1及角度AG2大致相同,則是否產生裂痕線CL容易變得不穩定。
The direction in which the crack line CL (FIG. 6) extends along the groove line TL (FIG. 4) (arrow in FIG. 6) is opposite to the direction in which the groove line TL is formed (arrow in FIG. 4). In order to generate the crack line CL using this directional relationship, when sliding the leading
其次,於步驟S60(圖3)中,沿著裂痕線CL分斷玻璃基板4。即,進行所謂之斷裂步驟。斷裂步驟可藉由對玻璃基板4施加外力而進行。例如,藉由朝向玻璃基板4之上表面SF1上之裂痕線CL(圖7)將應力施加構件(例如,稱為「斷裂棒」之構件)壓抵於下表面SF2上,而將如打開裂痕線CL之裂痕之應力向玻璃基板4施加。再者,於裂痕線CL於其形成時於厚度方向DT完全前進之情形時,裂痕線CL之形成與玻璃基板4之分斷同時產生。
Next, in step S60 (FIG. 3), the
根據以上內容進行玻璃基板4之分斷。再者,上述裂痕線CL之形成步驟與所謂之斷裂步驟本質上不同。斷裂步驟係藉由將已經形成之裂痕於厚度方向進而伸展而將基板完全地分離者。另一方面,裂痕線CL
之形成步驟帶來自藉由溝槽線TL之形成而獲得之無裂痕狀態向具有裂痕之狀態的變化。認為該變化係藉由無裂痕狀態所具有之內部應力之釋放而產生。
According to the above, the
(比較例1) (Comparative example 1)
參照圖8,本比較例之刃前緣59之頂點PP設置於4個面SE1~SE4相交之部位。自頂點PP設置有4個稜線PS1~PS4。於該情形時,於圖4之步驟中,可將玻璃基板4之上表面SF1之邊緣ED利用稜線PS1~PS4之任一者切下。因此,與本實施形態同樣地,具有容易確實地形成裂痕線CL之優點。另一方面,刃前緣59之形成需要較高之加工精度,因此具有其形成並不容易之缺點。其原因在於,如本比較例般於由面SE1~SE4相交之部位設置刃前緣之頂點PP之情形時,必須以通過該等之中3個面相交之點之方式,使剩餘之1個面之位置一致。
Referring to FIG. 8, the vertex PP of the
(比較例2) (Comparative example 2)
於本比較例中,將刃前緣51之滑動方向設為與方向DB(圖1)相反者。於該情形時,於圖4之步驟中,由頂面SD1而非稜線PS切下玻璃基板4之上表面SF1之邊緣ED。即,於切下時,於上述本實施形態中銳利之稜線PS起作用,相對於此,於本比較例中,平坦之頂面SD1起作用。因此,於本比較例中,變得不易產生成為裂痕線CL之形成開始之契機之微細之破壞。因此,確實地不易形成裂痕線CL。
In this comparative example, the sliding direction of the
(效果) (effect)
根據本實施形態,第1,可容易地準備刃前緣51。其原因在於,與上述比較例1不同,刃前緣51之頂點係作為頂面SD1、側面SD2及側面SD3
之3個面相交之部位而設置。假設,於藉由超過3個面相交之部位而設置刃前緣之頂點之情形時,必須以通過3個面相交之點之方式,使剩餘之面之位置一致。因此,需要較高之加工精度。相對於此,於藉由3個面相交之部位而設置刃前緣之頂點之情形時,不需要那麼高之加工精度。第2,可更確實地形成沿著溝槽線TL之裂痕線CL。其原因在於,與上述比較例2不同,為了形成溝槽線TL而滑動之刃前緣51之稜線PS切下玻璃基板4之上表面SF1之邊緣ED。藉由該切下,而以較高之確實性獲得裂痕線CL之形成開始之契機。
According to this embodiment, first, the
<實施形態2> <Embodiment 2>
再次,參照圖4,於本實施形態中,對在玻璃基板4之上表面SF1上刃前緣51會滑動之位置供給潤滑劑。換言之,形成溝槽線TL(圖4)之步驟(圖3:步驟S30)如圖9所示,包含供給潤滑劑之步驟S31、及於供給有潤滑劑之位置使刃前緣51滑動之步驟S32。為了實施步驟S31,例如,只要於柄52(圖1)設置潤滑劑供給部(未圖示)即可。再者,關於該等以外之構成,由於與上述實施形態1之構成大致相同,故而不重複其說明。又,步驟S31亦能夠應用於下述實施形態3~5。
Again, referring to FIG. 4, in this embodiment, the lubricant is supplied to the position where the leading
於本實施形態中,與實施形態1同樣,選擇方向DB(圖1)作為刃前緣51之前進方向。於對刃前緣51之負載相同之條件下,向方向DB之滑動與向其相反方向之滑動相比,對刃前緣51之損傷容易變大。根據本實施形態,可有效地抑制該損傷。藉此,可延長刃前緣之壽命。
In this embodiment, as in the first embodiment, the direction DB (FIG. 1) is selected as the advancing direction of the
<實施形態3> <Embodiment 3>
參照圖10,於步驟S10(圖3)中,準備與上述實施形態1同樣之玻璃
基板4。但是,於本實施形態中,於玻璃基板4之上表面SF1上設置有輔助線AL。參照圖11,輔助線AL具有輔助溝槽線TLa及輔助裂痕線CLa。輔助溝槽線TLa具有槽形狀。輔助裂痕線CLa係藉由厚度方向DT之玻璃基板4之裂痕沿著輔助溝槽線TLa延伸而構成。
10, in step S10 (FIG. 3), prepare the same glass as in the first embodiment above
於本實施形態中,輔助線AL係藉由同時形成輔助溝槽線TLa及輔助裂痕線CLa之步驟而設置於玻璃基板4之上表面SF1。此種輔助線AL可藉由通常之典型性之切割方法而形成。例如,此種輔助線AL如圖10之箭頭所示,可藉由將刃前緣擱置於玻璃基板4之上表面SF1之邊緣ED,然後使其於上表面SF1上移動而進行。藉由擱置時之衝擊而產生微細之裂痕,從而,於形成輔助溝槽線TLa時,能夠容易地同時形成輔助裂痕線CLa。為了抑制對擱置時之刃前緣及玻璃基板4之損傷,該刃前緣較佳為具有與刃前緣51之形狀不同之適合於擱置之形狀者。具體而言,刃前緣較佳為能夠旋動地保持者(輪型者)。換言之,刃前緣較佳為於玻璃基板4上旋動者而並非滑動者。再者,輔助線AL之起點於圖10中為邊緣ED,但亦可自邊緣ED離開。
In the present embodiment, the auxiliary line AL is provided on the upper surface SF1 of the
其次,於步驟S20(圖3)中,準備與實施形態1同樣之刃前緣51。再者,為了使上述輔助線AL用之刃前緣之準備容易,亦可使用該刃前緣51形成上述之輔助線AL。或者,亦可使用具有與刃前緣51之形狀同樣之形狀之刃前緣形成上述輔助線AL。
Next, in step S20 (FIG. 3), the
參照圖12,其次,於步驟S30(圖3)中形成溝槽線TL。具體而言,進行以下之步驟。 Referring to FIG. 12, secondly, a trench line TL is formed in step S30 (FIG. 3). Specifically, perform the following steps.
首先,進行與實施形態1同樣之動作。具體而言,於位置
N1將刃前緣51(圖1)之頂點PP壓抵於上表面SF1。其次,使經壓抵之刃前緣51於玻璃基板4之上表面SF1上向方向DB(圖1)滑動(參照圖12之箭頭)。藉此,溝槽線TL以無裂痕狀態形成於上表面SF1上。
First, the same operation as in the first embodiment is performed. Specifically, in the position
N1 presses the apex PP of the cutting edge 51 (FIG. 1) against the upper surface SF1. Next, the pressed blade
於本實施形態中,溝槽線TL之形成係藉由使刃前緣51於位置N1及位置N3a之間自位置N1經由位置N2向位置N3a滑動而進行。位置N3a配置於輔助線AL上。位置N2配置於位置N1與位置N3a之間。較佳為,刃前緣51超過輔助線AL上之位置N3a進而滑動至位置N4為止。較佳為,位置N4自邊緣ED離開。
In this embodiment, the groove line TL is formed by sliding the
為了形成溝槽線TL,如上所述滑動之刃前緣51於位置N3a與輔助線AL交叉。因此,刃前緣51之稜線PS(圖1)亦與輔助線AL交叉。藉由該交叉而於位置N3a產生微細之破壞。以該破壞為起點,而以釋放溝槽線TL附近之內部應力之方式產生裂痕。具體而言,厚度方向DT之玻璃基板4之裂痕自位於輔助線AL上之位置N3a沿著溝槽線TL伸展(參照圖13之箭頭)。換言之,開始裂痕線CL之形成(圖13)。藉此,作為步驟S50(圖3),自位置N3a向位置N1形成裂痕線CL。於形成裂痕線CL之後,與實施形態1同樣,藉由裂痕線CL,使得於溝槽線TL之下方,玻璃基板4於與溝槽線TL交叉之方向連續性之連接中斷。
In order to form the groove line TL, the sliding
刃前緣51到達位置N3a之後,自玻璃基板4離開。較佳為,刃前緣51超過位置N3a滑動至位置N4為止之後,自玻璃基板4離開。
After the
其次,於步驟S60(圖3)中,與實施形態1同樣地,沿著裂痕線CL分斷玻璃基板4。根據以上內容,進行本實施形態之玻璃基板4之分斷方法。
Next, in step S60 (FIG. 3 ), as in the first embodiment, the
根據本實施形態,第1,以與實施形態1同樣之理由,可容易地準備刃前緣51。第2,與實施形態1同樣地,可更確實地形成沿著溝槽線TL之裂痕線CL。其原因在於,為了形成溝槽線TL而滑動之刃前緣51之稜線PS向設置於玻璃基板4之上表面SF1之輔助線AL與藉由滑動之刃前緣51之頂點而形成之溝槽線TL交叉的位置N3a(圖12)局部地施加應力。藉由該應力施加,而以較高之確實性獲得裂痕線CL之形成開始之契機。
According to this embodiment, first, for the same reason as in the first embodiment, the
<實施形態4>
<
於本實施形態中,與實施形態3不同,輔助線AL(圖11及圖12)所具有之輔助溝槽線TLa及輔助裂痕線CLa之各者係藉由類似於實施形態1中所說明之溝槽線TL及裂痕線CL之形成方法的方法而形成。以下,對該方法具體地進行說明。 In this embodiment, different from the third embodiment, the auxiliary groove line TLa and the auxiliary crack line CLa of the auxiliary line AL (FIG. 11 and FIG. 12) are similar to those described in the first embodiment. The trench line TL and the crack line CL are formed by the method of forming. Hereinafter, this method will be specifically described.
首先,準備使用於輔助線AL之形成之刃前緣。該刃前緣亦可與刃前緣51(圖1及圖2)相同。即,輔助線AL之形成與然後形成之溝槽線TL之形成亦可藉由共通之刃前緣51而進行。或者,作為用以形成輔助線AL之刃前緣,亦可準備與刃前緣51不同之刃前緣(以下,稱為「輔助刃前緣」)。輔助刃前緣亦可具有與刃前緣51(圖1及圖2)之形狀相同之形狀。或者,輔助刃前緣亦可具有與刃前緣51之形狀不同之形狀。於輔助刃前緣具有與刃前緣51之形狀不同之形狀之情形時,較佳亦為,輔助刃前緣具有形成頂點PP及稜線PS之頂面SD1、側面SD2及側面SD3之構成,上述形狀之差異係由該等構成間之配置之差異所引起者。此處考慮之刃前緣之「形狀」係刃前緣中頂點PP附近之部分,即對玻璃基板4起作用之部分之形狀,自該作用部分離開之部分之形狀通常並不重要。以下,為了不
贅述,存在將使用於輔助線AL之形成之刃前緣無論其為刃前緣51或者為輔助刃前緣均僅稱為「刃前緣」之情形。
First, prepare the leading edge for the formation of the auxiliary line AL. The blade front edge may also be the same as the blade front edge 51 (FIG. 1 and FIG. 2). That is, the formation of the auxiliary line AL and the formation of the trench line TL formed thereafter can also be performed by the
參照圖14,其次,藉由類似於溝槽線TL之形成(圖4)之方法,而以無裂痕狀態形成輔助溝槽線TLa。參照圖15,其次,藉由類似於沿著溝槽線TL之裂痕線CL之形成方法(圖6)之方法,而形成沿著輔助溝槽線TLa(圖14)之輔助溝槽線TLa。根據以上內容,形成輔助線AL(圖11)。 Referring to FIG. 14, secondly, by a method similar to the formation of the trench line TL (FIG. 4 ), the auxiliary trench line TLa is formed in a crack-free state. Referring to FIG. 15, secondly, the auxiliary trench line TLa along the auxiliary trench line TLa (FIG. 14) is formed by a method similar to the method for forming the crack line CL along the trench line TL (FIG. 6 ). Based on the above, the auxiliary line AL is formed (FIG. 11).
其次,與實施形態3同樣地,於步驟S30及S50(圖3)中,形成溝槽線TL(圖12)及裂痕線CL(圖13),於步驟S60(圖3)中,沿著裂痕線CL分斷玻璃基板4。根據以上內容,進行本實施形態之玻璃基板4之分斷方法。
Next, as in the third embodiment, in steps S30 and S50 (FIG. 3), the groove line TL (FIG. 12) and the crack line CL (FIG. 13) are formed, and in step S60 (FIG. 3), along the crack The line CL breaks the
於本實施形態中,於溝槽線TL(圖12)之形成時施加至刃前緣51之負載與於輔助溝槽線TLa(圖14)之形成時施加至刃前緣之負載相比較大。根據本發明者之實驗性之研究,藉由如此對負載設置差異,可更確實地產生裂痕線CL。
In this embodiment, the load applied to the
較佳為,溝槽線TL(圖12)之形成時之角度AG2(圖1)小於輔助溝槽線TLa之形成時之角度AG2(圖1)。藉由使用此種角度關係,尤其,即便於用以形成輔助溝槽線TLa之刃前緣為刃前緣51或者為具有與刃前緣51之形狀相同之形狀之輔助刃前緣之情形時,亦容易設置上述負載之差異。該理由在於,於刃前緣之形狀同樣之情形時,角度AG2越小,則能夠以無裂痕狀態形成溝槽線TL(或輔助溝槽線TLa)之負載越大。於溝槽線TL之形成時,若角度AG2過大,則難以同時實現以無裂痕狀態形成
溝槽線TL與使用較輔助溝槽線TLa之形成時之負載更大之負載。相對於此,於溝槽線TL(圖12)之形成時之角度AG2(圖1)小於輔助溝槽線TLa之形成時之角度AG2(圖1)之情形時,於溝槽線TL之形成時,容易使用較輔助溝槽線TLa之形成時之負載更大之負載。因此,無須擔心對溝槽線TL用之刃前緣51應用面向高負載之刃前緣設計,且對輔助溝槽線TLa用之刃前緣應用面向低負載之刃前緣設計。因此,於輔助溝槽線TLa之形成時,可使用溝槽線TL之形成時所使用之刃前緣51或具有與其形狀相同之形狀之輔助刃前緣。
Preferably, the angle AG2 (FIG. 1) when the trench line TL (FIG. 12) is formed is smaller than the angle AG2 (FIG. 1) when the auxiliary trench line TLa is formed. By using this angular relationship, especially, even when the leading edge used to form the auxiliary groove line TLa is the
於如上所述對角度AG2(圖1)設置差異之情形時,作為用以形成輔助溝槽線TLa之刃前緣,較佳為,與用以形成溝槽線TL之刃前緣51不同地,準備輔助刃前緣。藉此,可於刃前緣51之角度AG2適合於溝槽線TL之形成之狀態下固定刃前緣51之姿勢。換言之,於輔助溝槽線TLa之形成步驟與溝槽線TL之形成步驟之間,不需要用以使角度AG2最佳化之刃前緣51之姿勢調整。
In the case where the angle AG2 (FIG. 1) is different as described above, the leading edge for forming the auxiliary groove line TLa is preferably different from the leading
<實施形態5> <Embodiment 5>
參照圖16及圖17,於本實施形態中,於溝槽線TL之形成時使用刃前緣51,於輔助溝槽線TLa之形成時,使用輔助刃前緣51a作為實施形態4中所說明之輔助刃前緣。刃前緣51之形狀與輔助刃前緣51a之形狀相互不同。例如,於頂點PP(參照圖2)之附近,刃前緣51及輔助刃前緣51a之各者具有與稜線PS垂直之剖面之稜線PS之角度AP及APa,角度AP大於角度APa。再者,關於該等以外之構成,由於與上述實施形態4之構成大致相同,故而不重複其說明。
16 and 17, in this embodiment, the leading
根據本實施形態,於輔助溝槽線TLa之形成時與溝槽線TL之形成時,使用具有不同之形狀之刃前緣。藉此,作為刃前緣之形狀,於輔助溝槽線TLa及溝槽線TL之各者之形成時,可使用適合相對低負載者及適合高負載者。因此,於輔助溝槽線TLa及溝槽線TL之形成時可更確實地獲得無裂痕狀態,且可自輔助溝槽線TLa及溝槽線TL之各者更確實地產生輔助裂痕線CLa及裂痕線CL。 According to this embodiment, in the formation of the auxiliary trench line TLa and the formation of the trench line TL, the cutting edges having different shapes are used. Thereby, as the shape of the cutting edge, when forming each of the auxiliary groove line TLa and the groove line TL, those suitable for relatively low load and those suitable for high load can be used. Therefore, when the auxiliary trench line TLa and the trench line TL are formed, a crack-free state can be obtained more reliably, and the auxiliary crack line CLa and CLa can be generated more reliably from each of the auxiliary trench line TLa and the trench line TL. Crack line CL.
再者,於上述各實施形態中對上表面SF1之邊緣為長方形狀之情形時進行了圖示,但亦可使用其他形狀。又,對上表面SF1平坦之情形時進行了說明,但上表面亦可彎曲。又,對溝槽線TL為直線狀之情形時進行了說明,但溝槽線TL亦可為曲線狀。又,對使用玻璃基板4作為脆性基板之情形時進行了說明,但脆性基板亦可由玻璃以外之脆性材料製作,例如,可由陶瓷、矽、化合物半導體、藍寶石或石英製作。
In addition, in each of the above embodiments, the case where the edge of the upper surface SF1 is a rectangular shape is illustrated, but other shapes may be used. In addition, the case where the upper surface SF1 is flat has been described, but the upper surface may be curved. In addition, the case where the groove line TL is linear has been described, but the groove line TL may be curved. In addition, the case where the
AG1‧‧‧角度 AG1‧‧‧Angle
AG2‧‧‧角度 AG2‧‧‧Angle
AX‧‧‧軸向 AX‧‧‧axial
DB‧‧‧方向 DB‧‧‧direction
DT‧‧‧厚度方向 DT‧‧‧Thickness direction
ED‧‧‧邊緣 ED‧‧‧Edge
PP‧‧‧頂點 PP‧‧‧Vertex
PS‧‧‧稜線 PS‧‧‧Ridge
SD1‧‧‧頂面(第1面) SD1‧‧‧Top surface (1st side)
SD3‧‧‧側面(第3面) SD3‧‧‧Side (Side 3)
SF1‧‧‧上表面(一個面) SF1‧‧‧Upper surface (one surface)
SF2‧‧‧下表面(另一個面) SF2‧‧‧Lower surface (the other side)
4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)
50‧‧‧切割器具 50‧‧‧Cutting equipment
51‧‧‧刃前緣 51‧‧‧Blade front edge
52‧‧‧柄 52‧‧‧Handle
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CN105313231A (en) * | 2014-06-25 | 2016-02-10 | 三星钻石工业股份有限公司 | Dividing method for single crystal substrate and single crystal substrate |
TW201603981A (en) * | 2014-06-26 | 2016-02-01 | Mitsuboshi Diamond Ind Co Ltd | Method for cutting brittle substrate and scribing device |
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TW202039193A (en) | 2020-11-01 |
CN108698254B (en) | 2020-08-25 |
JP6648817B2 (en) | 2020-02-14 |
KR20180105208A (en) | 2018-09-27 |
WO2017145937A1 (en) | 2017-08-31 |
TW201741107A (en) | 2017-12-01 |
KR102155598B1 (en) | 2020-09-14 |
CN111347574A (en) | 2020-06-30 |
CN108698254A (en) | 2018-10-23 |
JPWO2017145937A1 (en) | 2018-11-29 |
KR20200017563A (en) | 2020-02-18 |
KR102205786B1 (en) | 2021-01-20 |
JP2019214213A (en) | 2019-12-19 |
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