JP5129826B2 - Breaking method for brittle material substrate - Google Patents

Description

  The present invention relates to a breaking method for cutting along a scribe line formed on a brittle material substrate. The brittle material substrate here includes glass, ceramics (low-temperature fired ceramics and high-temperature fired ceramics), semiconductor materials such as silicon, sapphire, and the like. Further, the form of the substrate to be divided includes not only a single plate but also a bonded substrate in which two substrates are bonded.

FIG. 8 is a diagram illustrating an example of a conventional method of dividing a glass substrate on which a functional film such as a panel product is formed using a break bar. First, the board | substrate G is mounted on the table of a scribe apparatus, and the scribe line S is formed along the scheduled cutting line of a 1st surface using the cutter wheel W (FIG. 8 (a)). Subsequently, by placing the substrate G on the elastic table of the break device and applying a break load by applying a break bar F along the back of the scribe line S from the second surface opposite to the first surface. Breaking is performed by applying a bending moment symmetrically (see FIG. 8B) (see Patent Document 1).
When dividing with a break bar, since one scribe line S is divided at a stretch with a large load, the load applied to the substrate becomes large, the divided section is easily broken, and it is difficult to increase the end face strength. .

  Another conventional method for dividing a glass substrate is to use a break roller. For example, as shown in FIG. 9, when dividing the cell substrate on which the two substrates G1 and G2 are bonded, the scribe lines S1 and S2 are previously placed on the outer side surfaces (first and second surfaces) of the cell substrate. And a break load is applied by pressing the roller 64 along the scribe lines S1 and S2. The roller 64 uses a roller 64 in which a groove 63 is formed so as not to directly contact the scribe lines S1 and S2. Therefore, the roller 64 presses the left and right sides of the scribe lines S1 and S2 almost evenly (see Patent Document 2). In the roller break, the substrate is sequentially pressed from one end side to the other end side of the scribe line, and the crack is extended in response to the movement of the pressed portion. Therefore, the substrate is divided with a smaller load than when a break bar is used. And the load on the substrate is smaller than the break bar.

As described above, when the substrate is divided, whether it is a single plate or a bonded substrate, a scribe line is formed in the first step and a break is performed in the second step.
Note that the scribe in the first step is generally a mechanical scribe that forms a scribe line by rolling a cutter wheel, or a laser that forms a scribe line using a stress difference between heating by laser irradiation and subsequent cooling. Scribing is performed.

JP 2004-131341 A International Publication WO2006 / 129563

  In recent years, in order to reduce the weight of glass substrates and the like for flat panels, substrate materials have been made thinner and harder. Therefore, when the substrate is broken after the scribe line is formed, the sectional surface is easily broken due to the hardened substrate, chipping occurs, and it is difficult to obtain a desired end face strength. Moreover, even if it is a normal glass substrate, when the plate | board thickness is thick (for example, 1 mm or more), it is necessary to press a break bar with a big load in the case of a break, and chipping is still easy to generate | occur | produce. .

  Therefore, an object of the present invention is to provide a breaking method using a roller break, which can increase the end face strength more than before.

In order to solve the above problems, the present invention takes the following technical means. That is, the brittle material substrate breaking method of the present invention is a brittle material substrate breaking method comprising a step of forming a scribe line on the brittle material substrate and a breaking step of breaking along the scribe line, At this time, a load is applied to the brittle material substrate placed on the table by rolling the break roller along the position separated from the scribe line in the vicinity of the scribe line and press-contacting it. .
Here, the step of forming the scribe line may be a mechanical scribe that presses the cutter wheel, or may be a laser scribe using thermal stress caused by laser irradiation.

According to the present invention, the breaking load is not applied equally to the left and right sides of the scribe line during the breaking process, but is applied only to one side of the scribe line in the vicinity of the scribe line. Break to bend as it is applied.
Contrary to expectation, the sectional surface obtained in this way was able to have an end face strength superior to that of the sectional surface that had been divided by applying a load equally to the left and right.
This is because the influence of vibration applied to the substrate cross section when the break roller rolls is reduced, and furthermore, the same load is applied because the end of the break roller and the scribe line are separated in the horizontal direction. Even in this case, the amount of bending of the substrate is increased as compared with the case where a load is applied from directly above the scribe line as in the conventional case, and this is considered to be because the bending deformation equivalent to that of the conventional method can be generated even with a low load.

  In addition, by separating the position where the load is applied from the scribe line, the position where the load is applied at the time of the break is deviated from the scribe line and biased to one side. (Therefore, it was applied directly above the scribe line so that the dividing plane was vertical). However, it was found that the result of the actual division resulted in an almost vertical dividing section, which was not a problem.

In the above invention, the distance from the end of the pressure contact surface of the break roller to the scribe line is preferably 0.5 mm or more and 2 mm or less.
By setting the distance from the end of the pressure contact surface of the break roller to the scribe line within the above range, it can be divided with a lower load than before, and the end surface strength can be increased.

In the above invention, a table including an elastic layer may be used in the breaking step.
As a result, when a break load is applied, the amount of bending of the substrate can be increased, and even when the load is lower than when a table without an elastic layer is used, it is possible to divide and give to the section Since the load can be reduced, the end face strength can be further increased.

In the above invention, when the brittle material has a product region formed on one side of the scribe line and an end material region formed on the other side of the scribe line, the break roller is caused to roll on the end material region side. May be.
By performing the rolling of the break roller on the end material region side, it is possible to reduce the occurrence of product defects caused by the pressure contact force generated by the rolling of the break roller.

It is a figure which shows the whole structure of the breaking apparatus for enforcing the breaking method which is one Embodiment of this invention. It is a figure which shows the structure of the X stage 21 of FIG. It is sectional drawing of the roller head 40 of FIG. It is a figure which shows the structure of the roller part of the break roller of FIG. It is a figure which shows an example of the glass substrate of a division | segmentation object. It is a figure which shows the state when forming a scribe line in the board | substrate of FIG. It is a figure which shows a state when breaking the board | substrate of FIG. It is a figure which shows an example of the conventional method of dividing a glass substrate with a break bar. It is a figure which shows an example of the conventional method of dividing a glass substrate with a break roller.

  Hereinafter, the details of the breaking method of the present invention according to the present invention will be described in detail with reference to the drawings.

(Break device)
FIG. 1 is a diagram showing an overall configuration of a breaking device 10 used when carrying out a breaking method according to the present invention. A table 12 on which the substrate G is placed is provided on the base 11. The table 12 includes a Y-axis drive mechanism 13 that moves in the Y direction, and a table rotation mechanism 14 that is attached below the table 12 and rotates the table 12. Rubber 12a is laid on the upper surface of the table 12, so that the substrate can be easily bent when a load is applied to the substrate G from above.
The Y-axis drive mechanism 13 includes a Y stage 15 that supports the table 12 via a table rotation mechanism 14, a linear motor 16 that drives the Y stage 15 in the Y direction, and a linear guide 17 that guides the movement in the Y direction. .
The table rotation mechanism 14 is mounted on the Y stage 15 so that the table 12 can be rotated in a horizontal plane by a motor (not shown).

  An X stage 21 and an X axis drive mechanism 22 for moving the X stage 21 in the X direction are provided on the base 11. The X-axis drive mechanism 22 includes a bridge guide 24 that is arranged so as to straddle the table 12 and a column 23 that supports the bridge guide 24. The bridge guide 24 includes a linear motor (not shown) that drives the X stage 21 in the X direction and a linear guide 25 that guides the movement in the X direction.

Next, the X stage 21 will be described. FIG. 2 is a diagram showing the configuration of the X stage 21. Although FIG. 1 shows a state where a cover that covers the outside of the X stage 21 is attached, FIG. 2 shows the internal mechanism with the cover removed.
The X stage 21 is provided with a base plate 31 guided by a linear guide 25, and a Z-axis drive mechanism 33 for moving the roller 32 in the Z direction is provided on the base plate 31.
The Z-axis drive mechanism 33 includes a Z stage 34, a ball screw mechanism 35 that drives the Z stage 34 in the Z direction, and a linear guide 36 that guides the movement of the Z stage 34 in the Z direction.

A load applying cylinder 37 as a pressurizing mechanism for pressing the roller 32 against the substrate G is attached to the Z stage 34, and a roller head 40 is attached to a rod 37 a of the load applying cylinder 37 via a vibration actuator 38. is there. Specifically, an air cylinder, a servo motor, a voice coil motor, or the like can be used as the load application cylinder 37.
The vibration actuator 38 has a built-in giant magnetostrictive element, and applies vibration as necessary, and is attached as an option. By operating the vibration actuator 38, a stronger break can be performed by the vibration of the break load.

  The load applying cylinder 37 can adjust the load with which the roller 32 presses the substrate G after adjusting the height of the roller 32 by the Z-axis drive mechanism 33.

FIG. 3 is a cross-sectional view of the roller head 40 that supports the roller 32 and transmits the vibration of the vibration actuator 38 to the roller 32. The roller head 40 includes a main body 41 to which the vibration actuator 38 is fixed, a holder 42 that rotatably holds the roller 32, a shaft 43 that transmits vibration from the vibration actuator 38 to the holder 42, and movement of the shaft 43. And a guide 44 for guiding. A ball (not shown) is incorporated between the guide 44 and the shaft 43 so that the shaft 43 can move smoothly with respect to the guide 44. The rod 38 a of the vibration actuator 38 is screwed to the shaft 43 at the connecting portion 45. The lower end of the shaft 43 protrudes from the main body 41 and is screwed to the holder.
The lower end of the holder 42 is divided into two forks, and the roller 32 is rotatably supported by supporting the rotating shaft of the roller 32.

  FIG. 4 is a front view and a side view of the roller 32. The roller 32 has a cylindrical shape, and a hole 61 for passing a support shaft is formed at the center of rotation. Specific dimensions of the roller 32 can be selected within the range of 2 mm to 50 mm in outer diameter and 0.5 mm to 10 mm in thickness. A material having a rubber hardness Hs of 20 ° to 90 ° is used.

  The break device 10 is controlled by a computer system (not shown), and the computer system operates each part of the device including the X-axis drive mechanism 22, the Y-axis drive mechanism 13, the Z-axis drive mechanism 33, and the table rotation mechanism 14. .

(Break method)
Next, an embodiment of a breaking method using the breaking device 10 will be described with reference to the drawings. In general, when breaking the substrate in the XY direction, (1) first performing a cross scribe to form a scribe line in the X direction and the Y direction, and then performing a break in the X direction and the Y direction; (2) Any of the processing procedures in which a scribe line is formed in the X direction, then the X direction break is performed, the substrate is divided into strips, the Y direction scribe is performed, and finally the Y direction break is performed. Is adopted. Here, for convenience of explanation, the latter scribe process and break process in the X direction in the processing procedure of (2) will be described, but the subsequent cut in the Y direction is also divided in the same procedure. In addition, the same procedure is adopted for the break process in the case of performing the (1) cross-x live.

FIG. 5 is a plan view and AA ′ cross-sectional view of a glass substrate M (mother substrate) on which regions to be panel products P1 to P6 to be divided are formed. For convenience of illustration, the end material region between adjacent panel products is drawn wider than it actually is.
The glass substrate M has a structure in which the substrate G1 and the substrate G2 are bonded to each other, and each panel region P1 to P6 includes a region to be a terminal T.

FIGS. 6A and 6B are a plan view and a BB ′ sectional view showing a state when a scribe line is formed on the glass substrate M of FIG. In order to cut out the panels P1 to P6 from the glass substrate M, the scribe lines S1 to S6 are formed on the substrate G1 side at positions serving as the end sides of each panel.
The scribe lines S1 to S6 can be formed, for example, by moving the cutter wheel along the edge of each panel. Subsequently, scribe lines S7 to S12 are formed on the substrate G2 as well as the substrate G1. At this time, the scribe line S1 and the scribe line S7, the scribe line S3 and the scribe line S9, and the scribe line S5 and the scribe line S11 are formed so as to be displaced by the width of the terminal T in order to expose the terminal T. Note that the scribe line S2 and the scribe line S8, the scribe line S4 and the scribe line S10, and the scribe line S6 and the scribe line S12 are formed to face each other.

FIG. 7 is a plan view and a CC ′ sectional view showing a state when the break roller 32 (see FIG. 1) is pressed against the glass substrate M on which the scribe line is formed in FIG.
The rollers 32 are sequentially pressed against the substrate G1 on which the scribe lines S1 to S6 are formed. First, when performing a break with respect to the scribe line S1, the position where the roller 32 is brought into pressure contact is the end material region side (in FIG. 7 ) opposite to the panel P1 side (the right side of S1 in FIG. 7 ) across the scribe line S1. The left side of S1) is set so that the end of the roller 32 comes to a position B1 that is separated from the scribe line S1 by a distance of 1 mm in the vicinity of the scribe line S1. The distance from the scribe line S1 may be about 0.5 mm to 2 mm. Then, the roller 32 is pressed and rolled parallel to the scribe line S1. As a result, a force for bending and dividing the scribe line S1 is applied. Since the distance between the scribe line S1 and the end of the roller 32 is about 1 mm (0.5 mm to 2 mm), a larger bending moment is applied than when the scribe line S1 is pressed on the scribe line S1 as in the prior art. It is like that. Therefore, it becomes possible to divide with a small load, and the end face strength is improved.

Subsequently, the position at which the roller 32 is brought into pressure contact when breaking against the scribe line S2 is on the end material region side (in FIG. 7 ) opposite to the panel P1 side (left side of S2 in FIG. 7 ) across the scribe line S2. The right side of S2), and the end of the roller 32 is positioned at a position B2 that is separated from the scribe line S1 by a distance of 1 mm in the vicinity of the scribe line S1. In this case, the distance from the scribe line S2 may be about 0.5 mm to 2 mm.
Similarly, the scribe lines S3 to S6 are also pressed in such a manner that the ends of the rollers 32 come to positions B3 to B6 separated from the scribe lines S3 to S6 by about 1 mm on the end material region side.
As a result, the substrate G1 can be divided along the scribe lines S1 to S6 with a lower load than before.

Subsequently, the scribe lines S7 to S12 of the substrate G2 are similarly pressed on the opposite side of the panel with the rollers 32 at positions B7 to B12 separated from the scribe lines by about 1 mm with a low load. Thereby, the end surfaces on both sides of the substrates G1 and G2 are formed. By doing in this way, since the break load added in the case of a break can be made small, as a result of suppressing the load concerning an end surface, end surface strength becomes strong.
Further, since the vibration of the roller 32 is applied to a position separated from the scribe line and is located away from the panel side, the influence of the vibration is suppressed, so that the end face strength is increased.

  Then, after performing the break in the X direction, the same scribe and break are performed in the Y direction, so that the panels P1 to P6 are divided.

  In the above embodiment, the substrate in which the substrates G1 and G2 are bonded to each other has been described. However, the present invention can also be applied to a single plate structure.

  The breaking method of the present invention can be used when a substrate made of a brittle material such as glass is broken along a scribe line.

DESCRIPTION OF SYMBOLS 10 Break apparatus 12 Table 13 Y axis drive mechanism 14 Table rotation mechanism 21 X stage 22 X axis drive mechanism 32 Roller 33 Z axis drive mechanism 37 Load application cylinder 38 Vibration actuator 40 Roller head 43 Shaft 44 Guide S Scribe line G Substrate

Claims (4)

A brittle material substrate breaking method comprising a step of forming a scribe line on a brittle material substrate and a breaking step of breaking along the scribe line,
During the breaking process, a load is applied to the brittle material substrate placed on the table by rolling and breaking the breaking roller along a position separated from the scribe line on one side in the vicinity of the scribe line. A method for breaking a brittle material substrate.   The method for breaking a brittle material substrate according to claim 1, wherein the distance between the pressure contact surface of the break roller and the scribe line is 0.5 mm or more and 2 mm or less.   The method for breaking a brittle material substrate according to claim 1, wherein a table including an elastic layer is used in the breaking step. The break roller is rolled on the end material region side when the brittle material has a product region formed on one side of the scribe line and an end material region formed on the other side of the scribe line. brittle material substrate breaking method according to any one of claims 1 to 3.

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