TWI605024B - Breaking method of brittle substrate - Google Patents

Description

Fragmentation method of brittle substrate

The present invention relates to a method of breaking a brittle substrate.

In the manufacture of electrical equipment such as flat panel displays or solar panel panels, it is often necessary to break a brittle substrate such as a glass substrate. A scribe line is first formed on the substrate, and then the substrate is broken along the scribe line. The scribe line is formed by mechanically processing the substrate using the tip end of the blade. By sliding or rolling the front end of the blade on the substrate, a vertical crack is formed immediately below the groove while the groove is formed by plastic deformation on the substrate. Thereafter, a stress application called a cracking step is performed. Thereby, the above-mentioned vertical crack is completely progressed in the thickness direction, and the substrate is divided.

The step of breaking the substrate is mostly performed immediately after the step of forming the scribe line on the substrate. However, there is also a step of processing the substrate between the step of forming the score line and the step of breaking.

For example, according to the technique of the international publication No. 2002/104078, in the manufacturing method of the organic EL display, a scribe line is formed on the glass substrate for each region which becomes the organic EL display before the sealing cover is mounted. Therefore, it is possible to avoid contact between the sealing cover and the glass cutter which are problematic when the scribe line is formed on the glass substrate after the sealing cover is provided.

Further, for example, according to the technique of International Publication No. 2003/006391, in the method of manufacturing a liquid crystal display panel, two glass substrates are bonded after being formed with a score line. With this, It is possible to simultaneously break the two brittle substrates in one breaking step.

Patent Document 1: International Publication No. 2002/104078

Patent Document 2: International Publication No. 2003/006391

According to the above-described prior art, the processing of the brittle substrate is performed after the scribe line is formed, and the cracking step is performed by the subsequent stress application. This means that when processing a brittle substrate, vertical cracks already exist along the scribe line as a whole. Accordingly, in the past, unexpectedly, the vertical crack was further stretched in the thickness direction in the processing, resulting in a situation in which the brittle substrate which should be integrated during processing was separated. Further, in the case where the processing step of the substrate is not performed between the scribe line forming step and the substrate rupturing step, it is usually necessary to carry out the substrate transfer or storage after the scribe line forming step and before the substrate rupture step. There are also cases where the substrate is accidentally broken.

In order to solve the above problems, the inventor of the present invention developed a unique breaking technique. According to this technique, as a line defining a position at which the brittle substrate is to be separated, first, a groove line having no crack immediately below it is formed. The position at which the brittle substrate is broken is defined by forming the groove lines. Thereafter, if the state in which no crack exists immediately below the groove line is maintained, the break along the groove line is less likely to occur. By using this state, it is possible to prevent the breaking of the brittle substrate before the time point to be broken, while predetermining the breaking position of the brittle substrate.

The groove line as described above is less likely to be broken along with the general scribe line. This prevents accidental breakage of the brittle substrate, but on the other hand, there is a problem that it is difficult to accurately perform the breaking of the brittle substrate along the groove line.

The present invention has been made to solve the above problems, and an object thereof is to provide a method for breaking a brittle substrate, which can correctly perform a groove having no crack immediately below it The division of the line.

A method for breaking a brittle substrate according to the present invention, comprising: a) preparing a brittle substrate having a first surface opposite to the first surface and having a second surface opposite to the first surface, and having a thickness direction perpendicular to the first surface; and b) By pressing the tip end of the blade toward the first surface of the brittle substrate, the tip end of the blade is moved on the first surface to plastically deform the first surface of the brittle substrate, thereby forming the first and second portions. In the step of forming the groove line, in the step of forming the groove line, the load applied to the tip end of the blade in order to form the second portion of the groove line is higher than the load applied to the front end of the blade by forming the first portion of the groove line And the step of forming the trench line is performed in a state in which the brittle substrate is continuously connected in a direction intersecting the groove line, that is, in a non-crack state, immediately below the groove line; and further has: c a step of generating a crack only along the second portion of the first and second portions of the groove line; d) after step c), placing the brittle substrate such that the first surface of the brittle substrate faces the support portion a step on the support; e) after step d), applying stress The member is separated from the third portion of the second surface of the brittle substrate that faces the first portion of the trench line, and is in contact with the fourth portion of the second surface of the brittle substrate that faces the second portion of the trench line. And; f) the step of contacting the stress applying member to the third portion of the second surface of the brittle substrate after the step e).

According to the invention, the stress applying member is brought into contact with the brittle substrate so as to be in contact with the fourth portion facing the second portion of the trench line and away from the third portion facing the first portion of the second surface of the brittle substrate. The second side. That is, before the stress applying member is in contact with the third portion, First contact with the fourth part opposite to the second part along which the crack has been generated. Thereby, the separation of the brittle substrate along the second portion can be stably generated. Thereafter, the stress applying member is brought into contact with the third portion facing the first portion of the groove line. Thereby, further separation of the brittle substrate is stably generated along the first portion. In this way, the brittle substrate can be stably separated along the entire groove line.

AL‧‧‧Auxiliary line

CL‧‧‧crack line

HR‧‧‧High load range (Part 2)

LR‧‧‧Low load range (Part 1)

SF1‧‧‧ first side

SF2‧‧‧2nd

SP3‧‧‧ Part (Part 3)

SP4‧‧‧ Part (Part 4)

TL‧‧‧ trench line

11‧‧‧Glass substrate (brittle substrate)

50, 50R, 50v‧‧‧ sculpting apparatus

51, 51v‧‧‧ blade front end

51R‧‧‧scribed wheel

80‧‧‧Loading blade (support)

85‧‧‧Cracking rod (stress applying member)

Fig. 1 is a flow chart schematically showing a method of dividing a brittle substrate in the first embodiment of the present invention.

Fig. 2 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention.

Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2 .

4 is a schematic cross-sectional view (A) taken along line IVA-IVA of FIG. 2, and a schematic cross-sectional view (B) taken along line IVB-IVB of FIG.

Fig. 5 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view taken along line VI-VI of Fig. 5.

Figure 7 is a schematic cross-sectional view taken along line VII-VII of Figure 5.

Fig. 8 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention.

Figure 9 is a schematic cross-sectional view taken along line IX-IX of Figure 8.

Figure 10 is a schematic cross-sectional view taken along line X-X of Figure 8.

Figure 11 is a view schematically showing a method of breaking a brittle substrate in the first embodiment of the present invention. A top view of a step.

Fig. 12 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate in the first embodiment of the present invention.

Fig. 13 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate in the first embodiment of the present invention.

Figure 14 is a schematic partial cross-sectional view taken along line XIV-XIV of Figure 13 .

Fig. 15 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate in the first embodiment of the present invention.

Fig. 16 is a cross-sectional view schematically showing one step of the breaking method of the brittle substrate in the first embodiment of the present invention.

Fig. 17 is a side view (A) schematically showing the configuration of the scribing device used in the breaking method of the brittle substrate in the first embodiment of the present invention, and the field of view corresponding to the arrow XVII of Fig. 17(A). Top view of the front end of the blade (B).

FIG. 18 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first modification of the first embodiment of the present invention.

FIG. 19 is a plan view schematically showing one step of the breaking method of the brittle substrate in the second modification of the first embodiment of the present invention.

FIG. 20 is a plan view schematically showing one step of the breaking method of the brittle substrate in the third modification of the first embodiment of the present invention.

FIG. 21 is a side view (A) schematically showing the configuration of the scribing device used in the breaking method of the brittle substrate in the fourth modification of the first embodiment of the present invention, and FIG. 21(A) A top view (B) of the tip end of the arrow XXI.

Fig. 22 is a plan view schematically showing one step of the breaking method of the brittle substrate in the second embodiment of the present invention.

Fig. 23 is a plan view schematically showing one step of the breaking method of the brittle substrate in the second embodiment of the present invention.

Fig. 24 is a plan view schematically showing one step of the breaking method of the brittle substrate in the second embodiment of the present invention.

Fig. 25 is a plan view schematically showing a step of a method of dividing a brittle substrate in a first modification of the second embodiment of the present invention.

FIG. 26 is a plan view schematically showing one step of the breaking method of the brittle substrate in the first modification of the second embodiment of the present invention.

Fig. 27 is a plan view schematically showing a step of a method of dividing a brittle substrate in a second modification of the second embodiment of the present invention.

FIG. 28 is a plan view schematically showing a step of a method of dividing a brittle substrate in a third modification of the second embodiment of the present invention.

Fig. 29 is a side view schematically showing the configuration of a scribing device used in the breaking method of the brittle substrate in the second embodiment of the present invention.

Fig. 30 is a front view (A) schematically showing the configuration of the scoring wheel and the pin of Fig. 29, and a partially enlarged view (B) of Fig. 30 (A).

Hereinafter, a method of dividing a brittle substrate in each embodiment of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding components are denoted by the same reference numerals and the description is not repeated.

(Embodiment 1)

The method of dividing the glass substrate 11 (brittle substrate) of the present embodiment will be described below with reference to the flowchart of Fig. 1 .

Referring to Fig. 2 to Fig. 4, first, a glass substrate 11 is prepared (Fig. 1: step S110). The glass substrate 11 has a first surface SF1 and a second surface SF2 opposite thereto. Further, the glass substrate 11 has a thickness direction DT perpendicular to the first surface SF1.

In addition, a scoring device having a blade tip is prepared. The details of the sculpting apparatus are left to be described later.

Then, while the tip end of the blade is pressed against the first surface SF1 of the glass substrate 11, the blade tip end 51 is moved from the starting point N1 to the end point N3 from the starting point N1 on the first surface SF1. Thereby, plastic deformation is caused in the first surface SF1 of the glass substrate 11. Thereby, the groove line TL extending from the starting point N1 to the end point N3 via the intermediate point N2 is formed on the first surface SF1 (FIG. 1: Step S120). In Fig. 2, three groove lines TL are formed by the movement of the blade leading end in the direction DA.

The step of forming the trench line TL includes a step of forming a low load section LR (first part) as a part of the trench line TL (FIG. 1: step S120L), and forming a high load section as a part of the trench line TL Step of HR (Part 2) (Figure 1: Step S120H). In FIG. 2, a low load section is formed from the start point N1 to the midway point N2, and a high load section is formed from the midpoint N2 to the end point N3. The load applied to the blade tip end 51 in the step of forming the high load section HR is higher than the load used in the step of forming the low load section LR. Conversely, the load applied to the blade tip end 51 in the step of forming the low load section LR is lower than the load used in the step of forming the high load section HR, for example, about 30 to 50% of the load of the high load section HR. because Therefore, the width of the high load interval HR is greater than the width of the low load interval LR. For example, the high load interval HR has a width of 10 μm, and the low load interval LR has a width of 5 μm. In addition, the depth of the high load interval HR is greater than the depth of the low load interval LR. The cross section of the groove line TL has, for example, a V shape having an angle of about 150°.

The step of forming the trench line TL is such that the glass substrate 11 immediately below the trench line TL can be continuously connected in the direction DC (Figs. 4(A) and (B)) intersecting the trench line TL. That is, in a manner that does not have a crack state. Therefore, the load applied to the tip end of the blade is so large that the plastic deformation of the glass substrate 11 occurs, and the degree of cracking from the plastic deformation portion is not generated.

Next, a crack line is formed in the following manner (FIG. 1: Step S130).

Referring to FIGS. 5 to 7 , first, an auxiliary line AL intersecting the high load section HR is formed on the first surface SF1 of the glass substrate 11 . The auxiliary line AL is accompanied by a crack that penetrates in the thickness direction of the glass substrate 11. The auxiliary line AL can be formed by a general scribing method.

Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a general cracking step. Starting from this separation, the crack of the glass substrate 11 in the thickness direction extends only along the low load section LR of the trench line TL and the high load section HR in the high load section HR.

Referring to FIGS. 8 and 9, in the above manner, cracks are generated only in the low load section LR of the groove line TL and the high load section HR in the high load section HR. Specifically, among the high load sections HR, a crack line CL is formed in a portion between the newly generated side by separation and the midway point N2. The direction in which the crack line CL is formed is opposite to the direction DA (Fig. 2) in which the groove line TL is formed. In addition, it is difficult to form a crack between the newly formed side and the end point N3 by separation. Thread CL. This direction dependency is due to the state of the blade tip at the time of formation of the high load section HR, and will be described in detail below.

Referring to Fig. 10, the continuity of the glass substrate 11 in the direction intersecting the direction in which the groove line TL extends is broken by the crack line CL immediately below the high load interval HR of the groove line TL. Here, the "continuous connection", in other words, is not blocked by a crack. Further, as described above, in a state in which the continuous connection is disconnected, the portions of the glass substrate 11 can be brought into contact with each other through the crack of the crack line CL.

Next, a cracking step of breaking the glass substrate 11 along the groove line TL is performed. At this time, by applying stress to the glass substrate 11, the crack is stretched along the low load section LR with the crack line CL as a starting point. The direction in which the crack extends (arrow PR in Fig. 11) is opposite to the direction DA (Fig. 2) in which the groove line TL is formed.

Next, the details of the above-described cracking step will be described below.

Referring to Fig. 12, a bearing blade 80 (support portion) is prepared. The load bearing blade 80 has a flat surface provided with a groove GP (refer to FIG. 14 and described below). Then, the glass substrate 11 (FIG. 9) on which the crack line CL is formed is placed on the carrier blade 80 such that the first surface SF1 of the glass substrate 11 faces the carrier blade 80 (FIG. 1: Step S140).

Referring to Fig. 13 and Fig. 14, a split rod 85 (stress applying member) is prepared. As shown in FIG. 14, the split rod 85 preferably has a shape that can partially press the surface of the glass substrate 11, and has a substantially V-shape in FIG. As shown in Fig. 13, the protruding portion extends linearly. Further, a groove GP is provided in a portion of the surface of the load bearing blade 80 opposed to the above-mentioned protruding portion of the split rod 85.

Then, the crack is formed at a distance from the second surface SF2 of the glass substrate 11 The broken bar 85 faces the second surface SF2. Here, the second surface SF2 has a portion SP3 (third portion) opposed to the low load region LR of the groove line TL in the thickness direction, and a high load region HR in the thickness direction and the groove line TL. Part SP4 (Part 4). The split rod 85 is opposed to the second surface SF2 such that the distance between the split rod 85 and the portion SP4 is smaller than the distance between the split rod 85 and the portion SP3.

Specifically, the split bar 85 having the protruding portion (the lower side in FIG. 13) extending in a straight line is prepared, and the split bar 85 is disposed such that the straight line is inclined with respect to the second surface SF2. For example, when the surface (the upper surface in Fig. 13) of the load bearing blade 80 is a horizontal plane, the split bar 85 is disposed such that the straight line is inclined with respect to the horizontal plane. Conversely, when the straight line is along a horizontal plane, the surface of the load bearing edge 80 is inclined with respect to the horizontal plane. The distance from the reference surface to the end (the left end in FIG. 13) of the splitting bar 85 on the side of the portion SP3 is defined as the distance L3 from the reference surface including the plane including the second surface SF2. When the distance from the end of the split bar 85 on the SP4 side (the right end in FIG. 13) is the distance L4, in order to obtain the above inclination, the distance L3 > the distance L4 may be set. The difference between the distance L3 and the distance L4 is, for example, about 200 μm, preferably 300 μm or less. If the difference between the distances is too large, when the split rod 85 and the load-bearing blade 80 are relatively close by linear movement, the portion (the left portion in FIG. 13) of the split rod 85 on the portion SP3 side contacts the glass substrate 11 Previously, the end of the split bar 85 on the side of the SP4 (the right end in Fig. 13) contacts the load bearing edge 80. This situation will prevent the left portion of the split rod 85 from functioning.

Referring to Fig. 15, next, the split rod 85 is relatively linearly moved in the direction DR (one direction) with respect to the bearing blade 80. Thereby, the split rod 85 is separated from the portion SP3 in the second surface SF2 of the glass substrate 11 and is in contact with the portion SP4 (FIG. 1: Step S150). The direction DR may be selected in such a manner that the breaking bar 85 approaches the bearing edge 80, for example, the carrier and the carrier blade 80 The vertical direction of the surface (top of the figure).

The portion SP4 is pressed by the split bar 85 and pressed into the portion SP4 in the direction DR to apply stress to the portion SP4. According to this, the crack is expanded from the crack line CL (FIG. 13) which is disposed along the portion SP4 along the high load section HR. As a result, the glass substrate 11 is separated along the high load section HR.

Referring to Fig. 16, next, the split rod 85 is further moved linearly relative to the bearing blade 80 in the direction DR (one direction). As a result, the split rod 85 further enters the glass substrate 11 from the portion SP4 of the second surface SF2 and contacts the portion SP3 (FIG. 1: Step S160).

The split rod 85 contacts the portion SP3 and is pressed into the portion SP3 in the direction DR, thereby applying stress to the portion SP3. According to this, the crack is expanded from the high load section HR side (the right side in the drawing) along the low load section LR opposed to the portion SP3 as indicated by the arrow PR. As a result, the glass substrate 11 is separated along the low load section LR.

In the above manner, the glass substrate 11 is separated along both the high load section HR and the low load section LR. Thereby, the cracking step of breaking the glass substrate 11 as shown in FIG. 11 is performed.

Further, although the cracking step using the split rod 85 (stress applying member) is specifically described above, the cracking step may be carried out by other methods. In order to perform the severing step, the stress applying member may be brought into contact with the portion SP3 of the second surface SF2 of the glass substrate 11 to contact the portion SP4, and then contact the portion SP3 of the second surface SF2 of the glass substrate 11. In order to apply stress to the glass substrate 11, a roller that rolls on the second surface SF2 may be used instead of the split rod. In the above case, since the stress applying member moves from the portion SP4 to the portion SP3, it is not necessarily required to come into contact with the portion SP4 when it comes into contact with the portion SP3. Moreover, the relative movement of the stress applying member relative to the load bearing edge 80 (more generally, the support portion), and It is not limited to moving only in a straight line in one direction, but may be accompanied by more complicated movement. Further, the stress applying member has a plurality of portions which can also be individually moved.

The scribing tool 50 applied to the formation of the above-described groove line TL will be described with reference to FIGS. 17(A) and (B). The scribing tool 50 is relatively movable with respect to the glass substrate 11 by being attached to a scribing head (not shown), thereby scribing the glass substrate 11. The scoring device 50 has a blade front end 51 and a shank 52. The blade leading end 51 is held by the shank 52.

The blade front end 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. These plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and SD3 face each other in different directions and are adjacent to each other. The blade tip end 51 has a vertex where the top surface SD1, the side surfaces SD2, and SD3 intersect, and the vertex constitutes the protrusion portion PP of the blade tip end 51. Further, the side faces SD2 and SD3 form a ridge line constituting the side portion PS of the blade tip end 51. The side portion PS extends linearly from the protrusion portion PP. Further, the side portion PS is a ridge line as described above, and thus has a convex shape extending in a line shape.

The blade front end 51 is preferably a diamond cusp. That is, the blade leading end 51 is preferably made of diamond. At this time, the hardness can be easily increased and the surface roughness can be lowered. More preferably, the blade front end 51 is made of a single crystal diamond. More preferably, in terms of crystallography, the top surface SD1 is a {001} plane, and each side surface SD2 and SD3 is a {111} plane. At this time, the side faces SD2 and SD3 have different orientations, but are crystallographically equivalent to each other.

Further, a non-single crystal diamond may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may also be used. Alternatively, a polycrystalline diamond obtained by sintering fine particles of graphite or non-graphite carbon, a bonding material such as an iron-free element, or a combination of a diamond particle and a bonding material such as an iron group element may be used. Sintered drill stone.

The shank 52 extends in the axial direction AX. The blade tip end 51 is preferably attached to the shank 52 so as to be substantially along the axial direction AX in the normal direction of the top surface SD1.

In forming the groove line TL using the scribing tool 50, the blade tip end 51 is first pressed against the first surface SF1 of the glass substrate 11. Specifically, the protrusion portion PP and the side portion PS of the blade tip end 51 are pressed in the thickness direction DT of the glass substrate 11.

Next, the pressing blade tip end 51 is slid in the direction DA on the first surface SF1. The direction DA is formed by projecting the projection portion PP in the direction in which the side portion PS extends on the first surface SF1, and substantially corresponds to a direction in which the axial direction AX is projected on the first surface SF1. When sliding, the blade leading end 51 slides on the first surface SF1 by the shank 52. By this sliding, plastic deformation occurs on the first surface SF1 of the glass substrate 11. The groove line TL is formed by plastic deformation thereby.

Further, in the present embodiment, the groove line TL is formed from the starting point N1 to the end point N3, and when the blade tip end 51 is moved in the direction DB, in other words, the posture of the blade tip end 51 is based on the moving direction of the blade tip end 51. When the opposite direction is inclined, the formation of the crack line CL shown in Fig. 9 and the progress of the crack shown in Fig. 16 are less likely to occur than in the case of using the direction DA. More simply, in the groove line TL formed by the blade tip end 51 moving in the direction DA, the crack easily extends in the opposite direction to the direction DA. On the other hand, in the groove line TL formed by the blade tip end 51 moving in the direction DB, the crack easily extends in the same direction as the direction DB. The above-described direction dependence is presumed to be related to the stress distribution generated in the glass substrate 11 due to plastic deformation generated when the groove line TL is formed.

According to the present embodiment, as shown in FIG. 15, the split rod 85 is brought into contact with the second surface SF2 so as to contact the portion SP4 of the second surface SF2 of the glass substrate 11 and to be separated from the portion SP3. That is, the split rod 85 is brought into contact with the portion SP4 opposed to the high load section HR along which the crack has occurred before the contact portion SP3. Thereby, the separation of the glass substrate 11 along the high load section HR opposed to the portion SP4 can be stably achieved. Thereafter, as shown in Fig. 16, the split rod 85 is brought into contact with the portion SP3. Thereby, the glass substrate 11 is stably separated further along the low load section LR. According to this, the glass substrate 11 can be stably separated along the entire groove line TL.

Further, unlike the present embodiment, when the split bar 85 is brought into contact with the portion SP3 before the contact portion SP4, it is promoted before the separation of the high load portion HR opposed to the portion SP4. Part of SP3's low load interval LR is the separation of the starting point. However, since the crack which is the starting point of the separation is not provided in the low load section LR, it is difficult to stably generate the separation along the low load section LR. Therefore, it is highly probable that the glass substrate 11 is broken at a portion deviated from the low load interval LR. That is, it is difficult to stably divide the glass substrate 11 along the groove line TL.

It is preferable that the contact of the split bar 85 with the second surface SF2 of the glass substrate 11 is performed such that the split bar 85 linearly moves in the direction DR with respect to the bearing blade 80. Thereby, the breakage can be performed without the complicated operation of the split bar 85 or the load bearing blade 80.

Further, when the groove line TL (Figs. 2 and 3) for defining the position at which the glass substrate 11 is cut is formed, the front end 51 of the blade edge is reduced in the low load section LR as compared with the high load section HR (Fig. 17 (Fig. 17) A)) The applied load. Thereby, the damage to the tip end 51 of the blade can be reduced.

Further, when the low load section LR in the low load section LR and the high load section HR is in a crack-free state ( FIGS. 8 and 9 ), the crack as the starting point of the split glass substrate 11 does not exist in the low load section. LR. Therefore, when the glass substrate 11 is subjected to an arbitrary treatment in this state, even if an unintentional stress is applied to the low load region LR, the glass substrate is less likely to be generated. 11 unexpected breaks. According to this, the above processing can be performed stably.

Further, when both the low load section LR and the high load section HR are in a crack-free state ( FIGS. 2 and 3 ), cracks which are the starting points of the split glass substrate 11 do not exist in the trench line TL. Therefore, when the glass substrate 11 is subjected to an arbitrary treatment in this state, even if an unintentional stress is applied to the groove line TL, the glass substrate 11 is unlikely to be accidentally broken. According to this, the above processing can be performed stably.

Further, the groove line TL is formed before the auxiliary line AL is formed. Thereby, it is possible to avoid the influence of the auxiliary line AL when the groove line TL is formed. In particular, it is possible to avoid the formation of an abnormality after the blade tip end 51 passes through the auxiliary line AL in order to form the groove line TL.

Next, a modification of the first embodiment will be described below.

Referring to Fig. 18, the auxiliary line AL and the groove line TL may be crossed to form a crack line CL. The above situation may occur when the stress applied to the glass substrate 11 when the auxiliary line AL is formed is large.

Referring to Fig. 19, an auxiliary line AL may be formed first on the first surface SF1 of the glass substrate 11, and then a groove line TL (not shown in Fig. 19) may be formed.

Referring to Fig. 20, the auxiliary line AL may be formed on the second surface SF2 of the glass substrate 11 so as to intersect the high load section HR in a plane layout. Thereby, both the auxiliary line AL and the groove line TL can be formed without affecting each other.

Referring to Figs. 21(A) and (B), instead of the scribing device 50 (Figs. 17(A) and (B)), the scribing device 50v may be used. The blade leading end 51v has a conical shape having a vertex and a conical surface SC. The protrusion PPv of the blade tip end 51v is constituted by a vertex. The side portion PSv of the tip end of the blade is formed along an imaginary line (broken line in Fig. 21(B)) extending from the vertex on the conical surface SC. By this side The portion PSv has a convex shape extending in a line shape.

(Embodiment 2)

Referring to Fig. 22, first, the glass substrate 11 is prepared. In addition, a scoring device having a blade tip is prepared. Details regarding the scoring apparatus will be explained below.

Next, by the movement of the tip end on the first surface SF1 of the glass substrate 11 in the direction DB, the auxiliary line AL is formed on the first surface SF1, and the auxiliary line AL and the high load section HR described below (FIG. 23) cross.

Referring to Fig. 23, a groove line TL passing through the intermediate points Q2 and Q3 to the end point Q4 from the starting point Q1 is formed on the first surface SF1 of the glass substrate 11 by the movement of the blade tip end in the direction DB. The groove line TL from the starting point Q1 to the halfway point Q2 and from the intermediate point Q3 to the end point Q4 is formed as the low load section LR. The groove line TL from the halfway point Q2 to the halfway point Q3 is formed as the high load section LR.

Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out in a general cracking step. By this separation, the crack of the glass substrate 11 in the thickness direction extends along the groove line TL and only in the high load section HR in the groove line TL.

Referring to Fig. 24, a crack line CL is formed along a portion of the groove line TL by the extension of the above crack. Specifically, in the high load section HR, a crack line CL is formed in a portion between the newly generated side and the intermediate point Q3 by separation. The direction in which the crack line CL is formed is the same as the direction DB (FIG. 23) in which the groove line TL is formed. Further, it is difficult to form the crack line CL in the portion between the side newly formed by the separation and the halfway point Q2. This direction dependency is due to the state of the tip end when the high load section HR is formed, and will be described in detail below.

Then, in the same cracking step (Figs. 12 to 16) as in the first embodiment, the cracking step of stretching the crack is performed toward the end point Q4 from the intermediate point Q3 along the groove line TL with the crack line CL as a starting point. Thereby, the glass substrate 11 is cut.

Referring to FIGS. 25 and 26, as a first modification, the groove line TL may be formed first, and then the auxiliary line AL may be formed. Referring to Fig. 27, as a second modification, the formation of the auxiliary line AL may be used to form the crack line CL. Referring to Fig. 28, the auxiliary line AL may be formed on the second surface SF2 of the glass substrate 11 so as to intersect the high load section HR in the planar arrangement. Further, in the present embodiment, the high load section HR is formed from the intermediate point Q2 to the intermediate point Q3, but the high load section HR may be formed in a portion intersecting the auxiliary line AL, for example, from the starting point Q1. Formed to the midway point Q3.

Referring to Fig. 29, a scribing tool 50R suitable for the formation of the groove line TL in the present embodiment will be described next. The scribing device 50R has a scoring wheel 51R, a holder 52R, and a pin 53. The scoring wheel 51R has a substantially disk-like shape, and its diameter is typically about several mm. The scribing wheel 51R is held by the holder 52R via the pin 53 so as to be rotatable about the rotation axis RX.

The scribing wheel 51R has a peripheral portion PF provided with a tip end. The outer peripheral portion PF extends in an annular shape around the rotation axis RX. As shown in Fig. 30(A), the outer peripheral portion PF is cut to have a ridge shape in a visual degree, thereby forming a tip end formed by a ridge line and an inclined surface. On the other hand, as shown in Fig. 30(B), as shown in Fig. 30(B), the scribing wheel 51R is invaded into the first surface SF1 so as to be in the actual action portion (below the chain line of the two points of Fig. 30(B)). The ridgeline of the outer peripheral portion PF has a fine surface shape MS. The surface shape MS, preferably having a curved shape under front view (Fig. 30(B)), has a finite radius of curvature. The scoring wheel 51R uses superhard alloy, sintered diamond, A hard material such as a polycrystalline diamond or a single crystal diamond is formed. From the viewpoint of reducing the surface roughness of the ridge line and the inclined surface, the single crystallization diamond can also be used to form the entire scribe wheel 51R.

By forming the groove line TL of the scribing tool 50R, the scribing wheel 51R is rolled on the first surface SF1 of the glass substrate 11 (FIG. 29: arrow RT), so that the scribing wheel 51R is on the first surface SF1. The upward direction DB travels accordingly. This rolling is performed by applying a load F to the scribing wheel 51R to press the outer peripheral portion PF of the scribing wheel 51R onto the first surface SF1 of the glass substrate 11. Thereby, the first surface SF1 of the glass substrate 11 is plastically deformed to form a groove line TL having a groove shape. The load F has a vertical component Fp parallel to the thickness direction DT of the glass substrate 11 and an in-plane component Fi parallel to the first surface SF1. The direction DB is the same as the in-plane component Fi.

In addition, the groove line TL may be formed instead of the scribe device 50R moving in the direction DB, and the scribe device 50 (Fig. 17(A) and (B)) or 50v (Fig. 21 (Fig. 17) may be used to move in the direction DB. A) and (B)).

The components other than the above are substantially the same as those of the above-described first embodiment, and the same or corresponding elements are designated by the same reference numerals and the description thereof will not be repeated.

According to this embodiment, substantially the same effects as those of the first embodiment can be obtained. Further, in the present embodiment, since the groove line TL can be formed using the tip end of the blade without using the fixed tip end, the life of the blade tip can be extended.

The breaking method of the brittle substrate of each of the above embodiments is particularly suitable for a glass substrate, but the brittle substrate may be made of a material other than glass. For example, as a material other than glass, ceramic, tantalum, compound semiconductor, sapphire, or quartz can be used.

CL‧‧‧crack line

HR‧‧‧High load range (Part 2)

LR‧‧‧Low load range (Part 1)

SF1‧‧‧ first side

SF2‧‧‧2nd

SP3‧‧‧ Part (Part 3)

SP4‧‧‧ Part (Part 4)

TL‧‧‧ trench line

11‧‧‧Glass substrate (brittle substrate)

80‧‧‧Loading blade (support)

85‧‧‧Cracking rod (stress applying member)

DR‧‧‧ direction

Claims (2)

A method for breaking a brittle substrate, comprising: a) preparing a brittle substrate having a first surface opposite to a first surface opposite to the first surface and having a thickness direction perpendicular to the first surface; and b) borrowing When the tip end of the blade is pressed against the first surface of the brittle substrate, the tip end of the blade is moved on the first surface to plastically deform the first surface of the brittle substrate, thereby forming the first and In the step of forming the trench line in the second portion, in the step of forming the trench line, the load applied to the front end of the blade in order to form the second portion of the trench line is formed by forming the groove line The portion is applied with a high load applied to the front end of the blade, and the step of forming the trench line is such that the brittle substrate is continuously connected in a direction crossing the groove line immediately below the groove line. And in a non-cracked state; and further comprising: c) a step of generating a crack only along the second portion of the first and second portions of the trench line; d) after the step c) The brittle substrate is oriented such that the first surface of the brittle substrate faces the support portion a step of placing the support portion; e) after the step d), moving the stress applying member away from the third portion of the second surface of the brittle substrate opposite the first portion of the trench line; a step of contacting the fourth portion of the second surface of the brittle substrate opposite the second portion of the trench line; and f) contacting the stress applying member to the brittleness after the step e) a step of the third portion of the second surface of the substrate. For example, the method for breaking a brittle substrate according to claim 1 of the patent scope further comprises: g) before the step e), the step of causing the stress applying member to face the second surface of the brittle substrate and the second facing surface to face the stress applying member The distance between the stress applying member and the fourth portion is smaller than the distance between the stress applying member and the third portion; the step e) and the step f) are after the step g) The stress applying member is moved linearly in one direction with respect to the support portion.