TWI740945B - Breaking method of brittle substrate - Google Patents
Breaking method of brittle substrate Download PDFInfo
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- TWI740945B TWI740945B TW106117305A TW106117305A TWI740945B TW I740945 B TWI740945 B TW I740945B TW 106117305 A TW106117305 A TW 106117305A TW 106117305 A TW106117305 A TW 106117305A TW I740945 B TWI740945 B TW I740945B
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- brittle substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
本發明準備設置有具有軸方向(AX)上之軸對稱性之前端部(51N)的刀尖(51)。使刀尖(51)之軸方向(AX)相對於脆性基板(4)之一面(SF1)垂直,並且使刀尖(51)之前端部(51N)於一面(SF1)上滑動,藉此形成無裂縫狀態之溝槽線。藉由使厚度方向(DT)上之脆性基板(4)之裂縫沿溝槽線(TL)伸展而形成裂縫線。沿裂縫線分斷脆性基板(4)。 The present invention prepares a tool tip (51) with a front end (51N) of axial symmetry in the axial direction (AX). Make the axis direction (AX) of the tool tip (51) perpendicular to one surface (SF1) of the brittle substrate (4), and slide the front end (51N) of the tool tip (51) on one surface (SF1), thereby forming Groove line without cracks. The crack line is formed by extending the crack of the brittle substrate (4) in the thickness direction (DT) along the trench line (TL). Break the brittle substrate (4) along the crack line.
Description
本發明係關於一種脆性基板之分斷方法。 The present invention relates to a method for breaking a brittle substrate.
於平面顯示器面板或太陽電池面板等電氣機器之製造中,時常需要分斷脆性基板。於典型之分斷方法中,首先,於脆性基板上形成裂縫線。本說明書中所謂「裂縫線」,意指於脆性基板之厚度方向上部分性地進展之裂縫於脆性基板之表面上以線狀延伸而成者。其次,進行所謂斷裂步驟。具體而言,藉由對脆性基板施加應力,而使裂縫線之裂縫於厚度方向上徹底進展。藉此,沿裂縫線分斷脆性基板。 In the manufacture of electrical equipment such as flat-panel display panels or solar cell panels, it is often necessary to break brittle substrates. In a typical breaking method, first, crack lines are formed on the brittle substrate. The term "crack line" in this specification refers to a crack that partially progresses in the thickness direction of the brittle substrate and extends in a line on the surface of the brittle substrate. Next, a so-called breaking step is carried out. Specifically, by applying stress to the brittle substrate, the cracks of the crack lines are fully developed in the thickness direction. Thereby, the brittle substrate is broken along the crack line.
根據專利文獻1,刻劃時產生位於玻璃板之上表面之凹陷。於該專利文獻1中,該凹陷被稱為「劃線」。又,與刻設該劃線同時地產生自劃線向正下方延伸之裂縫。如該專利文獻1之技術所示般,於習知之典型技術中,於形成劃線之同時形成裂縫線。
According to
根據專利文獻2,提出有與上述典型分斷技術明顯不同之分斷技術。根據該技術,首先,藉由刀尖於脆性基板上滑動而產生塑性變形,藉此形成該專利文獻2中稱為「劃線」之槽形狀。於本說明書中,以下將該槽形狀稱為「溝槽線」。於形成溝槽線之時點,未於其下方形成裂縫。其 後藉由使裂縫沿溝槽線伸展而形成裂縫線。即,與典型技術不同,暫時形成不伴有裂縫之溝槽線,其後沿溝槽線形成裂縫線。其後,沿裂縫線進行通常之斷裂步驟。 According to Patent Document 2, a breaking technique that is significantly different from the above-mentioned typical breaking technique is proposed. According to this technique, first, the blade tip slides on the brittle substrate to generate plastic deformation, thereby forming a groove shape called "scribing" in Patent Document 2. In this specification, this groove shape is hereinafter referred to as "groove line". At the point when the trench line was formed, no crack was formed below it. That Then, the crack line is formed by extending the crack along the groove line. That is, unlike the typical technique, groove lines without cracks are temporarily formed, and then crack lines are formed along the groove lines. Thereafter, the usual breaking steps are carried out along the crack line.
上述專利文獻2之技術中所使用之不伴有裂縫之溝槽線,與伴有同時形成裂縫之典型劃線相比,可藉由更低負荷下之刀尖之滑動而形成。藉由負荷小而使對刀尖造成之損害變小。因此,根據該分斷技術,可延長刀尖之壽命。 The groove line without cracks used in the technique of Patent Document 2 mentioned above can be formed by sliding of the tool tip under a lower load than a typical scribing line with simultaneous formation of cracks. The small load reduces the damage to the tool tip. Therefore, according to this breaking technology, the life of the tool tip can be prolonged.
於上述專利文獻2中,使用具有刀尖、及作為其保持具之柄之切割器具。切割器具具有軸方向,柄沿軸方向延伸。溝槽線係藉由刀尖於脆性基板上滑動而形成。刀尖保持於沿軸方向延伸之保持具。軸方向相對於脆性基板之上表面而傾斜。將軸方向朝脆性基板上投影之方向對應於刀尖之滑動方向。 In the above-mentioned Patent Document 2, a cutting tool having a blade tip and a shank as its holder is used. The cutting tool has an axial direction, and the handle extends along the axial direction. The groove line is formed by sliding the tip of the knife on the brittle substrate. The tip of the knife is held by a holder extending in the axial direction. The axis direction is inclined with respect to the upper surface of the brittle substrate. The direction in which the axis direction is projected onto the brittle substrate corresponds to the sliding direction of the tool tip.
[專利文獻1]日本特開平9-188534號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 9-188534
[專利文獻2]國際公開第2015/151755號 [Patent Document 2] International Publication No. 2015/151755
根據上述專利文獻2,將軸方向朝玻璃基板上投影之方向對應於刀尖之滑動方向。換言之,對於脆性基板之刀尖於基板上之作用存在異向性。因此,必須對應於刀尖之滑動方向而調整軸方向。因此,必須於 脆性基板之分斷裝置設置用以以軸方向與滑動方向對應之方式調整刀尖之姿勢之機構。又,尤其是,於刀尖之滑動方向不固定之情形時,必須設置控制刀尖之姿勢之機構。刀尖之姿勢之調整及控制之必要性會帶來分斷裝置之成本增加、及步驟所需時間增長、刻劃位置之精度降低等缺點。 According to the aforementioned Patent Document 2, the direction in which the axial direction is projected onto the glass substrate corresponds to the sliding direction of the blade tip. In other words, there is anisotropy in the effect of the blade tip of the brittle substrate on the substrate. Therefore, the axis direction must be adjusted corresponding to the sliding direction of the tool tip. Therefore, it must be The breaking device of the brittle substrate is provided with a mechanism for adjusting the posture of the blade tip in a way that the axis direction corresponds to the sliding direction. Moreover, especially when the sliding direction of the blade tip is not fixed, a mechanism for controlling the posture of the blade tip must be provided. The necessity of adjusting and controlling the posture of the knife tip will bring about the disadvantages such as the increase of the cost of the breaking device, the increase of the time required for the steps, and the decrease of the accuracy of the scribing position.
本發明係用以解決以上課題而完成者,其目的在於提供一種無需根據刀尖之滑動方向而調整刀尖之姿勢之脆性基板之分斷方法。 The present invention was completed to solve the above problems, and its purpose is to provide a method for breaking a brittle substrate without adjusting the posture of the tool tip according to the sliding direction of the tool tip.
本發明之一態樣之脆性基板的分斷方法具有以下步驟a)~e)。 The method for breaking a brittle substrate according to one aspect of the present invention has the following steps a) to e).
a)準備具有一面、及與一面垂直之厚度方向之脆性基板。 a) Prepare a brittle substrate with one side and a thickness direction perpendicular to one side.
b)準備設置有具有軸方向上之軸對稱性之前端部,且前端部之曲率半徑設為3μm以上且40μm以下,前端部之沿軸方向之尺寸設為0.5μm以上的刀尖。 b) Prepare a cutting edge with a front end that has axial symmetry in the axial direction, and the radius of curvature of the front end is set to 3 μm or more and 40 μm or less, and the size of the front end in the axial direction is set to 0.5 μm or more.
c)藉由使刀尖之軸方向相對於脆性基板之一面垂直,並且使刀尖之前端部於一面上滑動,而於脆性基板之一面上藉由塑性變形形成具有槽形狀之溝槽線。溝槽線以獲得如下狀態之方式形成:於溝槽線之下方、脆性基板在與溝槽線交叉之方向上連續地連結之狀態即無裂縫狀態。 c) By making the axis direction of the tool tip perpendicular to one surface of the brittle substrate, and sliding the front end of the tool tip on one surface, a groove line with a groove shape is formed by plastic deformation on one surface of the brittle substrate. The groove line is formed in a state in which the brittle substrate is continuously connected in a direction crossing the groove line under the groove line, that is, a crack-free state.
d)藉由使厚度方向上之脆性基板之裂縫沿溝槽線伸展而形成裂縫線。藉由裂縫線,而於溝槽線之下方,脆性基板在與溝槽線交叉之方向上斷開連續之連結。 d) The crack line is formed by extending the crack of the brittle substrate in the thickness direction along the groove line. With the crack line, below the groove line, the brittle substrate breaks a continuous connection in the direction intersecting the groove line.
e)沿裂縫線分斷脆性基板。 e) Break the brittle substrate along the crack line.
再者,上述「a)」~「e)」之字母文字係用以區別步驟而附 加者,並非意味著步驟之實施順序。 Furthermore, the above-mentioned alphabetical characters "a)" ~ "e)" are used to distinguish the steps and are attached The addition does not imply the order of implementation of the steps.
根據本發明,於使設置有具有軸對稱性之前端部之刀尖於脆性基板之一面上滑動時,刀尖之軸方向相對於一面垂直。藉此,刀尖中與脆性基板直接接觸之部分,成為實質上包含於前端部,且不依賴滑動方向而軸方向與滑動方向之關係變得固定。因此,無需根據刀尖之滑動方向而調整刀尖之姿勢。 According to the present invention, when the blade tip provided with the axially symmetrical front end is slid on one surface of the brittle substrate, the axial direction of the blade tip is perpendicular to one surface. Thereby, the part of the tip of the blade that is in direct contact with the brittle substrate is substantially included in the tip portion, and the relationship between the axial direction and the sliding direction becomes fixed without depending on the sliding direction. Therefore, there is no need to adjust the posture of the knife tip according to the sliding direction of the knife tip.
AL:輔助線 AL: auxiliary line
CL:裂縫線 CL: Crack line
AX:軸方向 AX: axis direction
SF1:上表面(一面) SF1: Upper surface (one side)
HR:高負荷區間 HR: High load range
LR:低負荷區間 LR: Low load zone
TL、TL1、TL2:溝槽線 TL, TL1, TL2: groove line
4:玻璃基板(脆性基板) 4: Glass substrate (brittle substrate)
50、150:切割器具 50, 150: cutting equipment
51、151:刀尖 51, 151: knife point
51N、151N、151Na~151Nc、151Ni~151Nk:前端部 51N, 151N, 151Na~151Nc, 151Ni~151Nk: tip
52:支持部 52: Support Department
圖1係概略性地表示本發明之實施形態1中之脆性基板之分斷方法所使用的切割器具之構成之立體圖。 Fig. 1 is a perspective view schematically showing the structure of a cutting tool used in the method of breaking a brittle substrate in the first embodiment of the present invention.
圖2係概略性地表示本發明之實施形態1中之脆性基板之分斷方法所使用的切割器具之構成之側視圖。 Fig. 2 is a side view schematically showing the structure of a cutting tool used in the method of breaking a brittle substrate in the first embodiment of the present invention.
圖3係圖1及圖2之刀尖之前端部的附近之局部剖面圖。 Fig. 3 is a partial cross-sectional view of the vicinity of the front end of the tool tip of Figs. 1 and 2;
圖4係概略性地表示本發明之實施形態1中之脆性基板之分斷方法的構成之流程圖。 Fig. 4 is a flowchart schematically showing the structure of a method for breaking a brittle substrate in the first embodiment of the present invention.
圖5係概略性地表示本發明之實施形態1中之脆性基板之分斷方法的第1步驟之俯視圖。 Fig. 5 is a plan view schematically showing the first step of the method of breaking a brittle substrate in the first embodiment of the present invention.
圖6係沿圖5之線VI-VI之概略端視圖。 Fig. 6 is a schematic end view taken along the line VI-VI of Fig. 5;
圖7係概略性地表示本發明之實施形態1中之脆性基板之分斷方法的第2步驟之俯視圖。 Fig. 7 is a plan view schematically showing the second step of the method of breaking a brittle substrate in the first embodiment of the present invention.
圖8係沿圖7之線VIII-VIII之概略端視圖。 Fig. 8 is a schematic end view taken along the line VIII-VIII of Fig. 7;
圖9係概略性地表示本發明之實施形態2中之脆性基板之分斷方法的第1步驟之俯視圖。 Fig. 9 is a plan view schematically showing the first step of the method of breaking a brittle substrate in the second embodiment of the present invention.
圖10係說明圖9之步驟中之脆性基板上之刀尖之滑動方向的圖。 FIG. 10 is a diagram illustrating the sliding direction of the blade tip on the brittle substrate in the step of FIG. 9.
圖11係概略性地表示本發明之實施形態2中之脆性基板之分斷方法的第2步驟之俯視圖。 Fig. 11 is a plan view schematically showing the second step of the method of breaking a brittle substrate in the second embodiment of the present invention.
圖12係概略性地表示本發明之實施形態3中之脆性基板之分斷方法的一步驟之俯視圖。 Fig. 12 is a plan view schematically showing one step of the method of breaking a brittle substrate in the third embodiment of the present invention.
圖13係說明圖12之步驟中之脆性基板上之刀尖之滑動方向的圖。 FIG. 13 is a diagram illustrating the sliding direction of the blade tip on the brittle substrate in the step of FIG. 12.
圖14係概略性地表示本發明之實施形態4中之脆性基板之分斷方法的第1步驟之俯視圖。 Fig. 14 is a plan view schematically showing the first step of the method of breaking a brittle substrate in the fourth embodiment of the present invention.
圖15係說明圖14之步驟中之脆性基板上之刀尖之滑動方向的圖。 FIG. 15 is a diagram illustrating the sliding direction of the blade tip on the brittle substrate in the step of FIG. 14.
圖16係概略性地表示本發明之實施形態4中之脆性基板之分斷方法的第2步驟之俯視圖。 Fig. 16 is a plan view schematically showing the second step of the method of breaking a brittle substrate in the fourth embodiment of the present invention.
圖17係概略性地表示本發明之實施形態5中之脆性基板之分斷方法的一步驟之俯視圖。 Fig. 17 is a plan view schematically showing one step of the method of breaking a brittle substrate in the fifth embodiment of the present invention.
圖18係說明圖17之步驟中之脆性基板上之刀尖之滑動方向的圖。 FIG. 18 is a diagram illustrating the sliding direction of the blade tip on the brittle substrate in the step of FIG. 17.
圖19係概略性地表示本發明之實施形態6中之脆性基板之分斷方法的一步驟之側視圖。 Fig. 19 is a side view schematically showing one step of the method of breaking a brittle substrate in the sixth embodiment of the present invention.
圖20係概略性地表示本發明之實施形態7中之脆性基板之分斷方法的一部構成之流程圖。 Fig. 20 is a flowchart schematically showing a part of the method of breaking a brittle substrate in the seventh embodiment of the present invention.
圖21係概略性地表示本發明之實施形態8中之脆性基板之分斷方法的第1步驟之俯視圖。 Fig. 21 is a plan view schematically showing the first step of the method of breaking a brittle substrate in the eighth embodiment of the present invention.
圖22係沿圖21之線XXII-XXII之概略端視圖。 Fig. 22 is a schematic end view taken along the line XXII-XXII of Fig. 21.
圖23係概略性地表示本發明之實施形態8中之脆性基板之分斷方法的第2步驟之俯視圖。 Fig. 23 is a plan view schematically showing the second step of the method of breaking a brittle substrate in the eighth embodiment of the present invention.
圖24係概略性地表示本發明之實施形態8中之脆性基板之分斷方法的第3步驟之俯視圖。 Fig. 24 is a plan view schematically showing the third step of the method of breaking a brittle substrate in the eighth embodiment of the present invention.
圖25係概略性地表示本發明之實施形態9中之脆性基板之分斷方法的一部分構成之流程圖。 Fig. 25 is a flowchart schematically showing a part of the constitution of a method of breaking a brittle substrate in the ninth embodiment of the present invention.
圖26係概略性地表示本發明之實施形態9中之脆性基板之分斷方法的一步驟之俯視圖。 Fig. 26 is a plan view schematically showing one step of the method of breaking a brittle substrate in the ninth embodiment of the present invention.
圖27係沿圖26之線XXVII-XXVII之概略剖面圖。 Fig. 27 is a schematic cross-sectional view taken along the line XXVII-XXVII of Fig. 26.
圖28係沿圖26之線XXVIII-XXVIII之概略剖面圖。 Fig. 28 is a schematic cross-sectional view taken along the line XXVIII-XXVIII of Fig. 26.
圖29係沿圖26之線XXIX-XXIX之概略剖面圖。 Fig. 29 is a schematic cross-sectional view taken along the line XXIX-XXIX of Fig. 26.
圖30係概略性地表示本發明之實施形態9中之脆性基板之分斷方法的一步驟之俯視圖。 Fig. 30 is a plan view schematically showing one step of the method of breaking a brittle substrate in the ninth embodiment of the present invention.
圖31係沿圖30之線XXXI-XXXI之概略剖面圖。 Fig. 31 is a schematic cross-sectional view taken along the line XXXI-XXXI of Fig. 30.
圖32係沿圖30之線XXXII-XXXII之概略剖面圖。 Fig. 32 is a schematic cross-sectional view taken along the line XXXII-XXXII of Fig. 30.
圖33係概略性地表示本發明之實施形態9中之脆性基板之分斷方法的一步驟之俯視圖。 Fig. 33 is a plan view schematically showing one step of the method of breaking a brittle substrate in the ninth embodiment of the present invention.
圖34係沿圖33之線XXXIV-XXXIV之概略剖面圖。 Fig. 34 is a schematic cross-sectional view taken along the line XXXIV-XXXIV of Fig. 33.
圖35係沿圖33之線XXXV-XXXV之概略剖面圖。 Fig. 35 is a schematic cross-sectional view taken along the line XXXV-XXXV of Fig. 33.
圖36係概略性地表示本發明之實施形態9中之脆性基板之分斷方法的一步驟之俯視圖。 Fig. 36 is a plan view schematically showing one step of the method of breaking a brittle substrate in the ninth embodiment of the present invention.
圖37係概略性地表示本發明之實施形態10中之脆性基板之分斷方法所使用之切割器具的構成之立體圖。 Fig. 37 is a perspective view schematically showing the structure of a cutting tool used in the method of breaking a brittle substrate in the tenth embodiment of the present invention.
圖38係沿圖37之線XXXVIII-XXXVIII之概略剖面圖。 Fig. 38 is a schematic cross-sectional view taken along the line XXXVIII-XXXVIII of Fig. 37.
圖39係沿圖38之線A-A之刀尖之前端部的表面形狀之例。 Fig. 39 is an example of the surface shape of the front end of the cutting edge along the line A-A of Fig. 38.
圖40係沿圖38之線A-A之、刀尖之前端部的表面形狀之例。 Fig. 40 is an example of the surface shape of the front end of the cutting edge along the line A-A of Fig. 38.
以下,基於圖式對本發明之實施形態進行說明。再者,以下圖式中對同一或相當之部分標附同一參考編號且不再重複其說明。 Hereinafter, an embodiment of the present invention will be described based on the drawings. Furthermore, the same or equivalent parts in the following drawings are marked with the same reference number and the description will not be repeated.
圖1及圖2之各者係概略性地表示本實施形態中之玻璃基板4(脆性基板)之分斷方法所使用之切割器具50的構成之立體圖。圖3係圖1及圖2之刀尖51之前端部51N附近之局部剖面圖。
Each of FIGS. 1 and 2 is a perspective view schematically showing the configuration of the
切割器具50具有刀尖51及支持部52。刀尖51與支持部52可為由同一材料所構成之一體之構件。
The cutting
如圖3所示,於刀尖51設置有具有軸方向AX上之軸對稱性之前端部51N。即,前端部51N之表面係藉由使曲線圍繞軸方向AX旋轉而獲得之面。前端部51N之表面係朝向外側具有凸形狀之曲面。前端部51N之表面可為球面之一部分。前端部51N之曲率半徑較佳為3μm以上且40μm以下。前端部51N之表面亦可為圓錐面,該圓錐面之頂點亦可帶弧度。前端部51N之沿軸方向AX之尺寸典型而言為0.5μm以上,通常只要為1.0μm以上就足夠,較佳為2.0μm以上。藉此,刀尖51中與玻璃基板4直
接接觸之部分通常實質上包含於前端部51N。再者,上述「軸對稱性」較佳為理想之幾何學軸對稱性,但亦可為鑒於對玻璃基板4之作用之實質性之軸對稱性。本說明書中將後者稱為「準軸對稱性」,對其詳細內容於下述實施形態10中進行說明。
As shown in FIG. 3, the
較佳為包括前端部51N之刀尖51之整體具有軸方向AX上之軸對稱性。圖3中,刀尖51包括具有軸方向AX上之軸對稱性之直圓錐形狀,於該直圓錐形狀之頂點設置有前端部51N。於包含軸方向AX之剖面(圖3)中,若無視前端部51N之形狀,則該直圓錐形狀之頂點之角度較佳為120°以上,更佳為130°以上。又,該角度較佳為160°以下,更佳為150°以下。
It is preferable that the
支持部52較佳為沿軸方向AX延伸。切割器具50之整體可具有軸方向AX上之軸對稱性。
The supporting
繼而,以下一面參照圖4所示之流程圖,一面對玻璃基板4之分斷方法進行說明。
Then, referring to the flowchart shown in FIG. 4, the method of dividing the
於步驟S10(圖4)中,準備待分斷之玻璃基板4(圖2)。玻璃基板4具有上表面SF1(一面)、及與其相反之下表面SF2(另一面)。上表面SF1設置有邊緣ED。上表面SF1典型的是平坦。於圖5所示之例中,邊緣ED具有長方形狀。玻璃基板4具有與上表面SF1垂直之厚度方向DT。又,於步驟S20(圖4)中,準備上述之具有刀尖51之切割器具50(圖1~圖3)。
In step S10 (FIG. 4), the
參照圖5,藉由步驟S30(圖4),形成具有直線形狀之溝槽線TL。具體而言,進行以下之步驟。 Referring to FIG. 5, by step S30 (FIG. 4), a trench line TL having a linear shape is formed. Specifically, perform the following steps.
首先,將刀尖51(圖1~圖3)之前端部51N於位置N1壓抵於上表面SF1。藉此前端部51N與玻璃基板4接觸。位置N1如圖示般,較佳為自玻璃基板4之上表面SF1之邊緣ED遠離。於此情形時,避免於刀尖51開始滑動時刀尖51碰撞於玻璃基板4之上表面SF1之邊緣ED。
First, the
繼而,使刀尖51之軸方向AX相對於玻璃基板4之上表面SF1垂直,並且使刀尖51之前端部51N於上表面SF1上滑動(參照圖5之箭頭)。於滑動時對刀尖51自外部施加負荷。該負荷方向相對於上表面SF1垂直。藉由滑動而於上表面SF1上產生塑性變形。
Then, the axial direction AX of the
藉由該塑性變形,於玻璃基板4之上表面SF1上形成具有槽形狀(參照圖6)之溝槽線TL。溝槽線TL以獲得於溝槽線TL之下方,玻璃基板4在與溝槽線TL之延伸方向(圖5中之橫方向)交叉之方向DC(圖6)上連續地連結之狀態即無裂縫狀態之方式形成。於無裂縫狀態下,雖然形成有利用塑性變形所得之溝槽線TL,但未形成沿其之裂縫。為了獲得無裂縫狀態,對施加於刀尖51之負荷以如下方式調整,即,於溝槽線TL形成時間點較小為不產生裂縫之程度,且於其後步驟中較大為產生形成能產生裂縫之內部應力之狀態之塑性變形的程度。
By this plastic deformation, a groove line TL having a groove shape (refer to FIG. 6) is formed on the upper surface SF1 of the
溝槽線TL較佳為僅藉由玻璃基板4之塑性變形而產生,於此情形時,於玻璃基板4之上表面SF1上不產生切削。為了避免切削,不過度提高刀尖51之負荷即可。藉由無切削,可避免於上表面SF1上產生不良之微細之破片。但是,通常可容許輕微切削。
The groove line TL is preferably generated only by the plastic deformation of the
溝槽線TL之形成係藉由於位置N1及位置N3e之間,使刀尖51之前端部51N自位置N1經由位置N2向位置N3e滑動而進行。位置
N2自玻璃基板4之上表面SF1之邊緣ED遠離。位置N3e位於玻璃基板4之上表面SF1之邊緣ED。因此,為了形成溝槽線TL而滑動之刀尖51最終到達位置N3e。無裂縫狀態於刀尖51位於位置N2之時間點仍維持著,進而,維持至刀尖51到達位置N3e之瞬間為止。當刀尖51到達位置N3e時,刀尖51切下玻璃基板4之上表面SF1之邊緣ED。
The groove line TL is formed by sliding the
參照圖7及圖8,藉由上述切下而於位置N3e產生微細之破裂。以該破裂為起點,以釋放溝槽線TL附近之內部應力之方式產生裂縫。具體而言,厚度方向DT上之玻璃基板4之裂縫自位於玻璃基板4之上表面SF1之邊緣ED的位置N3e沿溝槽線TL伸展(參照圖7中之箭頭)。換言之,開始形成裂縫線CL。藉此,作為步驟S50(圖4),自位置N3e向位置N1形成裂縫線CL。裂縫線CL沿溝槽線TL伸展之方向(圖7之箭頭)與形成溝槽線TL之方向(圖5之箭頭)相反。
Referring to FIGS. 7 and 8, a fine crack is generated at the position N3e by the above-mentioned cutting. Taking the crack as a starting point, a crack is generated in a way to relieve the internal stress near the trench line TL. Specifically, the crack of the
再者,為了更確實地形成裂縫線CL,可使刀尖51自位置N2滑動至位置N3e之速度小於自位置N1至位置N2之速度。同樣地,可使於自位置N2至位置N3e施加於刀尖51之負荷大於維持無裂縫狀態之範圍下自位置N1至位置N2之負荷。
Furthermore, in order to form the crack line CL more reliably, the speed at which the
藉由裂縫線CL,而於溝槽線TL之下方,玻璃基板4在與溝槽線TL之延伸方向(圖7中之橫方向)交叉之方向DC(圖8)上斷開連續之連結。此處所謂「連續之連結」,換言之意指未被裂縫阻斷之連結。再者,於如上所述般連續之連結被斷開之狀態下,玻璃基板4之部分彼此可經由裂縫線CL之裂縫而接觸。又,亦可於溝槽線TL之正下方殘留少量連續之連結。
With the crack line CL, below the trench line TL, the
繼而,於步驟S60(圖4),沿裂縫線CL分斷玻璃基板4。即,進行所謂斷裂步驟。斷裂步驟可藉由向玻璃基板4施加外力而進行。例如,藉由朝向玻璃基板4之上表面SF1上之裂縫線CL(圖8)將應力施加構件(例如被稱作「斷裂棒」之構件)壓抵至下表面SF2上,而對玻璃基板4施加使裂縫線CL之裂縫裂開之應力。再者,於裂縫線CL在其形成時於厚度方向DT上完全進展之情形時,裂縫線CL之形成與玻璃基板4之分斷同時產生。
Then, in step S60 (FIG. 4 ), the
藉由以上步驟而進行玻璃基板4之分斷。再者,上述裂縫線CL之形成步驟與所謂斷裂步驟本質上不同。斷裂步驟係藉由使已經形成之裂縫於厚度方向進一步伸展而使基板完全地分離者。另一方面,裂縫線CL之形成步驟係帶來自藉由溝槽線TL之形成而獲得之自無裂縫狀態向具有裂縫之狀態之變化者。認為該變化係藉由無裂縫狀態所具有之內部應力之釋放而產生。
The
根據本實施形態,設置有具有軸對稱性之前端部51N之刀尖51於玻璃基板4之上表面SF1上滑動時,刀尖51之軸方向AX相對於上表面SF1垂直(圖2)。藉此,不依賴刀尖51之前端部51N所滑動之方向DA而軸方向AX與滑動方向DA之關係變得固定。因此,無需根據刀尖51之滑動方向DA而調整刀尖51之狀態。
According to this embodiment, when the
再者,即便於下述其他實施形態中,於為了形成溝槽線TL而使刀尖51於玻璃基板4之上表面SF1上滑動時,刀尖51之軸方向AX亦與上表面SF1垂直。因此,即便於其他實施形態中,亦獲得與本實施形態相同之效果。
Furthermore, even in other embodiments described below, when the
於實施形態1中,溝槽線TL具有直線形狀。與此相對,於本實施形態中,溝槽線TL包括曲線形狀。以下,對形成溝槽線TL之步驟進行詳細說明。
In
參照圖9,於本實施形態中,溝槽線TL具有曲線形狀。與此對應,形成溝槽線TL之步驟包括:使刀尖51之前端部51N朝向方向DA1(第1方向)滑動之步驟;及其後使前端部51N朝向方向DA2(第2方向)滑動之步驟。
9, in this embodiment, the trench line TL has a curved shape. Correspondingly, the step of forming the groove line TL includes: sliding the
參照圖10,方向DA2與方向DA1不同。又,刀尖51之前端部51N之滑動方向DA於方向DA1與方向DA2間如圖中之虛線所示般連續地變化。
10, the direction DA2 is different from the direction DA1. In addition, the sliding direction DA of the
繼而,沿溝槽線TL形成裂縫線。參照圖11,沿該裂縫線分斷玻璃基板4。
Then, a crack line is formed along the trench line TL. 11, the
再者,關於上述以外之構成,由於與上述實施形態1之構成大致相同,故而對同一或對應之要素標附同一元件符號,不再重複其說明。 In addition, the configuration other than the above is substantially the same as the configuration of the first embodiment described above, so the same or corresponding elements are given the same reference numerals, and the description thereof will not be repeated.
於本實施形態中,滑動方向DA於方向DA1與方向DA2間變化。由於刀尖51之前端部51N具有軸對稱性,且,刀尖51之軸方向AX相對於上表面SF1垂直(圖2),故而上述滑動方向DA之變化不影響軸方向AX與滑動方向DA之關係。因此,無需根據刀尖51之滑動方向DA而調整刀尖51之狀態。換言之,即便於形成包含曲線部之溝槽線TL時,亦不需要根據刀尖51之滑動方向DA而調整刀尖51之狀態。
In this embodiment, the sliding direction DA changes between the direction DA1 and the direction DA2. Since the
參照圖12,於本實施形態中,溝槽線TL實質上包含封閉曲線。與此對應,如圖13所示,滑動方向DA如圖中之虛線所示般遍及所有方向而變化。換言之,刀尖51之前端部51N朝所有方向滑動。再者,關於上述以外之構成,由於與上述實施形態2之構成大致相同,故而對同一或對應之要素標附同一元件符號,不再重複其說明。
Referring to FIG. 12, in this embodiment, the trench line TL substantially includes a closed curve. Corresponding to this, as shown in FIG. 13, the sliding direction DA changes in all directions as shown by the dotted line in the figure. In other words, the
參照圖14及圖15,於本實施形態中,於形成溝槽線TL時,一面使刀尖51之前端部51N接觸於玻璃基板4之上表面SF1上,一面使前端部51N所朝向之方向DA自方向DA1至方向DA2不連續地變化。
14 and 15, in this embodiment, when the groove line TL is formed, the
繼而,沿溝槽線TL形成裂縫線。參照圖16,沿該裂縫線分斷玻璃基板4。
Then, a crack line is formed along the trench line TL. 16, the
再者,關於上述以外之構成,由於與上述實施形態2之構成大致相同,故而對同一或對應之要素標附同一元件符號,不再重複其說明。 In addition, since the configuration other than the above is substantially the same as the configuration of the above-mentioned second embodiment, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
於方向DA不連續變化之瞬間,刀尖51相對於玻璃基板4相對性地幾乎停止。於此種停止狀態下,假若調整刀尖51之狀態,則容易對刀尖51之前端部51N或玻璃基板4產生損害。根據本實施形態,由於無需調整刀尖51之狀態,故而可避免上述損害。
At the moment when the direction DA discontinuously changes, the
參照圖17,本實施形態中所形成之溝槽線TL包含相互平行之溝槽線TL1及溝槽線TL2。溝槽線TL1及溝槽線TL2交替形成。於形成溝槽線TL1時,一面使刀尖51之前端部51N接觸於玻璃基板4之上表面SF1上,一面使前端部51N所朝向之方向DA為方向DA1。於形成溝槽線TL2時,一面
使刀尖51之前端部51N接觸於玻璃基板4之上表面SF1上,一面使前端部51N所朝向之方向DA為方向DA2。方向DA1與方向DA2相反。因此,如圖18所示般,前端部51N所朝向之方向DA為方向DA1及方向DA2之任一者。於溝槽線TL之形成中,滑動方向DA於方向DA1與方向DA2間不連續地變化。
Referring to FIG. 17, the trench line TL formed in this embodiment includes a trench line TL1 and a trench line TL2 that are parallel to each other. The trench line TL1 and the trench line TL2 are alternately formed. When the groove line TL1 is formed, the
再者,關於上述以外之構成,由於與上述實施形態4之構成大致相同,故而對同一或對應之要素標附同一元件符號,不再重複其說明。 In addition, since the configuration other than the above is substantially the same as the configuration of the fourth embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
假若溝槽線TL1及溝槽線TL2之兩方係藉由方向DA1之滑動而形成,則於藉由使刀尖51自一邊緣(圖中,左側邊緣)向另一邊緣(圖中,右側邊緣)移動而形成溝槽線TL1後,必須進行僅用以使刀尖51向上述一邊緣側返回之動作。與此相對,根據本實施形態,於該動作中形成溝槽線TL2。藉此,縮短步驟所需時間。因此可提高生產性。
If the two sides of the groove line TL1 and the groove line TL2 are formed by sliding in the direction DA1, the
參照圖19,於上述各實施形態中,形成溝槽線TL時,亦可使刀尖51圍繞軸方向AX旋轉(參照圖中,旋轉RT)。旋轉RT亦可於玻璃基板4之上表面SF1上一面使刀尖51之前端部51N滑動一面進行。旋轉RT亦可於滑動中始終進行,亦可間斷地進行。或者,旋轉RT亦可於玻璃基板4之上表面SF1上不使刀尖51之前端部51N滑動而進行。於此情形時,以刀尖51停止之狀態、或刀尖51自玻璃基板4遠離之狀態旋轉刀尖51。
19, in each of the above-mentioned embodiments, when the groove line TL is formed, the
根據本實施形態,避免刀尖51之局部磨損。因此可延長刀尖51之壽命。
According to the present embodiment, local wear of the
於上述各實施形態中,形成溝槽線TL時,亦可對刀尖51之前端部51N於玻璃基板4之上表面SF1上滑動之位置供給潤滑劑。換言之,形成溝槽線TL之步驟(圖4:步驟S30)如圖20所示般,可包括供給潤滑劑之步驟S31、及刀尖51於供給有潤滑劑之位置滑動之步驟S32。作為潤滑劑,可使用例如常溫下液體之潤滑油或常溫下固體之潤滑劑。
In each of the above embodiments, when the groove line TL is formed, a lubricant may be supplied to the position where the
上述各實施形態中,於形成溝槽線TL時,於玻璃基板4之上表面SF1滑動之刀尖51容易磨損。根據本實施形態,可抑制此種磨損。
In each of the above embodiments, when the groove line TL is formed, the
參照圖21,於步驟S10(圖4),準備與上述實施形態1相同之玻璃基板4。但是,於本實施形態中,於玻璃基板4之上表面SF1上預先設置有輔助線AL。參照圖22,輔助線AL具有輔助溝槽線TLa與輔助裂縫線CLa。輔助溝槽線TLa具有槽形狀。輔助裂縫線CLa係藉由厚度方向DT上之玻璃基板4之裂縫沿輔助溝槽線TLa延伸而構成。
Referring to Fig. 21, in step S10 (Fig. 4), the
於本實施形態中,輔助線AL係藉由於玻璃基板4之上表面SF1同時形成輔助溝槽線TLa及輔助裂縫線CLa之步驟而設置。此種輔助線AL可藉由習知典型之刻劃方法而形成。例如,此種輔助線AL如圖21之箭頭所表示般,可藉由刀尖跨上玻璃基板4之上表面SF1之邊緣ED,然後於上表面SF1上移動而形成。該刀尖較佳為可旋動地保持者(輪型者)。換言之,刀尖較佳為不於玻璃基板4上滑動而於玻璃基板4上旋動者。
In this embodiment, the auxiliary line AL is provided by the step of simultaneously forming the auxiliary trench line TLa and the auxiliary crack line CLa on the upper surface SF1 of the
再者,輔助線AL之起點於圖21中為邊緣ED,但亦可自邊緣ED遠離。又,輔助線AL可藉由與上述實施形態1~7之任一者中之裂縫線CL的形成方法相同之方法而形成。又,亦可利用於玻璃基板4上滑動
之刀尖而形成上述輔助線AL。或者,為了容易準備上述輔助線AL用之刀尖,上述輔助線AL可利用該刀尖51而形成。
Furthermore, the starting point of the auxiliary line AL is the edge ED in FIG. 21, but it can also be far away from the edge ED. In addition, the auxiliary line AL can be formed by the same method as the formation method of the crack line CL in any one of the above-mentioned
繼而於步驟S20(圖4),準備與實施形態1相同之刀尖51。
Next, in step S20 (FIG. 4 ), the
參照圖23,繼而,於步驟S30(圖4)形成溝槽線TL。於本實施形態中,溝槽線TL之形成係藉由於位置N1及位置N3a間,使刀尖51自位置N1經由位置N2向位置N3a滑動而進行。位置N3a配置於輔助線AL上。位置N2配置於位置N1與位置N3a之間。較佳為刀尖51超過輔助線AL上之位置N3a進而滑動至位置N4。位置N4較佳為自邊緣ED遠離。
Referring to FIG. 23, then, a trench line TL is formed in step S30 (FIG. 4). In this embodiment, the groove line TL is formed by sliding the
用以形成溝槽線TL而如上述般滑動之刀尖51於位置N3a與輔助線AL交叉。藉由該交叉而於位置N3a產生微細之破裂。以該破裂為起點,以釋放溝槽線TL附近之內部應力之方式產生裂縫。具體而言,厚度方向上之玻璃基板4之裂縫自位於輔助線AL上之位置N3a沿溝槽線TL伸展(參照圖24之箭頭)。換言之,開始形成裂縫線CL(圖24)。藉此,作為步驟S50(圖4),自位置N3a向位置N1形成裂縫線CL。
The
刀尖51到達位置N3a後,自玻璃基板4離開。較佳為刀尖51超過位置N3a滑動至位置N4後,自玻璃基板4離開。
After the
繼而,藉由步驟S60(圖4),與實施形態1相同地,沿裂縫線CL分斷玻璃基板4。藉由以上步驟進行本實施形態之玻璃基板4之分斷方法。
Then, in step S60 (FIG. 4 ), as in the first embodiment, the
於實施形態1中,刀尖51於位置N3e(圖5)切下玻璃基板4。與此相對,根據本實施形態,無需此種切下。藉此,可避免利用刀尖51之切下時可能產生之對刀尖51或玻璃基板4之損害。
In
再者,可能有僅藉由刀尖51與輔助線AL交叉而無法獲得裂縫線CL之形成開始之契機的情況。於此種情形時,形成與輔助線AL交叉之溝槽線TL後,沿輔助線AL分斷玻璃基板4即可。藉此,可獲得裂縫線CL之形成開始之契機。
Furthermore, there may be cases where the starting point of the formation of the crack line CL cannot be obtained simply by crossing the
參照圖26,首先與其他實施形態相同,準備玻璃基板4(圖4:步驟S10)。又,準備刀尖51(圖4:步驟S20)。
Referring to Fig. 26, first, as in the other embodiments, a
繼而,與其他實施形態相同,使刀尖51之軸方向AX相對於玻璃基板4之上表面SF1垂直,並且使刀尖51之前端部51N於上表面SF1上滑動。該滑動自始點N1經由中途點N2進行至終點N3。藉此於玻璃基板4之上表面SF1上產生塑性變形。藉此於上表面SF1上形成自始點N1經由中途點N2向終點N3延伸之溝槽線TL(圖4:步驟S30)。
Then, as in the other embodiments, the axial direction AX of the
形成溝槽線TL之各者之步驟包含形成低負荷區間LR作為溝槽線TL之一部分之步驟(圖25:步驟S30L)、及形成高負荷區間HR作為溝槽線TL之一部分之步驟(圖25:步驟S30H)。於圖26中,自始點N1至中途點N2形成低負荷區間LR,自中途點N2至終點N3形成高負荷區間HR。於形成高負荷區間HR之步驟中施加於刀尖51之負荷較形成低負荷區間LR之步驟中所使用之負荷更高。相反而言,形成低負荷區間LR之步驟中施加於刀尖51之負荷較形成高負荷區間HR之步驟中所使用之負荷更低,例如,為高負荷區間HR之負荷之30~50%左右。因此,高負荷區間HR中之溝槽線之寬度較低負荷區間LR之寬度更大。又,如圖27所示般,高負荷區間HR之深度較低負荷區間LR之深度更大。溝槽線TL之剖面具
有例如角度150°左右之V字形狀。
The step of forming each of the trench lines TL includes a step of forming a low-load section LR as a part of the trench line TL (FIG. 25: step S30L), and a step of forming a high-load section HR as a part of the trench line TL (FIG. 25: Step S30H). In FIG. 26, a low-load section LR is formed from the start point N1 to the midway point N2, and a high-load section HR is formed from the midway point N2 to the end point N3. The load applied to the
再者,由於在高負荷區間HR向刀尖51施加高負荷,故而若考慮刀尖51之壽命,則高負荷區間HR之距離較小為佳。進而,於在溝槽線TL形成中使負荷變化之情形時,由於在更小之距離充分增大高負荷區間HR中之負荷,故而於高負荷區間HR較佳為減小刻劃速度。即,由於難以控制使刀尖51之負荷瞬間增加,實際上以位置N2為始點,於固定之區間一面增大負荷直至達到預先規定之負荷、一面進行刻劃。因此,藉由減小高負荷區間HR中之速度,可於更小距離形成高負荷,可減小高負荷區間HR整體之距離。
Furthermore, since a high load is applied to the
形成溝槽線TL之步驟係以獲得於溝槽線TL之正下方,玻璃基板4在與溝槽線TL交叉之方向DC(圖28及圖29)上連續地連結之狀態即無裂縫狀態之方式而進行。因此,施加於刀尖之負荷大至使玻璃基板4產生塑性變形之程度,且小至不產生以該塑性變形部為起點之裂縫。
The step of forming the trench line TL is to obtain a state in which the
繼而,形成裂縫線之步驟(圖4:步驟S50)按以下之方式進行。 Then, the step of forming the crack line (FIG. 4: Step S50) is performed in the following manner.
參照圖30~圖32,首先,於玻璃基板4之上表面SF1上形成與高負荷區間HR交叉之輔助線AL。輔助線AL伴有於玻璃基板4之厚度方向滲透之裂縫。輔助線AL可藉由通常之刻劃方法而形成。
Referring to FIGS. 30 to 32, first, on the upper surface SF1 of the
繼而,沿輔助線AL分離玻璃基板4。該分離可藉由通常之斷裂步驟而進行。以該分離為契機,厚度方向上之玻璃基板4之裂縫沿溝槽線TL,溝槽線TL中僅伸展至高負荷區間HR。
Then, the
參照圖33及圖34,藉由以上步驟,沿溝槽線TL之一部分 形成裂縫線CL。具體而言,於高負荷區間HR中,於藉由分離而新產生之邊與中途點N2間之部分形成裂縫線CL。形成裂縫線CL之方向與形成溝槽線TL之方向DA(圖26)相反。 33 and 34, through the above steps, along a part of the trench line TL A crack line CL is formed. Specifically, in the high-load section HR, a crack line CL is formed between the side newly generated by the separation and the halfway point N2. The direction in which the crack line CL is formed is opposite to the direction DA in which the trench line TL is formed (FIG. 26).
再者,於藉由分離而新產生之邊與終點N3間之部分難以形成裂縫線CL。推測其理由在於:溝槽線TL附近所產生之內部應力之分佈具有依賴於溝槽線TL之形成方向之異向性。 Furthermore, it is difficult to form a crack line CL in the portion between the side newly generated by the separation and the end point N3. It is presumed that the reason is that the distribution of internal stress generated near the trench line TL has anisotropy depending on the formation direction of the trench line TL.
參照圖35,藉由裂縫線CL,於溝槽線TL之高負荷區間HR之正下方,玻璃基板4在與溝槽線TL之延伸方向交叉之方向DC上斷開連續之連結。此處所謂「連續地連結」,換言之,意指並非由裂縫遮蔽之連結。再者,如上所述,於斷開連續之連結之狀態下,玻璃基板4之部分彼此可經由裂縫線CL之裂縫而接觸。
35, by the crack line CL, the
繼而,進行沿溝槽線TL分斷玻璃基板4之斷裂步驟(圖4:步驟S60)。此時,藉由向玻璃基板4施加應力而使裂縫以裂縫線CL為起點沿低負荷區間LR伸展。裂縫伸展之方向(圖36中之箭頭PR)與形成溝槽線TL之方向DA(圖26)相反。
Then, a breaking step of breaking the
藉由以上步驟而分斷玻璃基板4。
The
根據本實施形態,用以規定玻璃基板4分斷之位置之溝槽線TL(圖26及圖27)之形成時,與高負荷區間HR相比,於低負荷區間LR減輕施加於刀尖51(圖1)之負荷。藉此可減小對刀尖51之損害。
According to this embodiment, when the groove line TL (FIG. 26 and FIG. 27) is formed to define the position where the
又,於低負荷區間LR及高負荷區間HR中低負荷區間LR為無裂縫狀態之情形時(圖33及圖34),低負荷區間LR無成為分斷玻璃基板4之起點之裂縫。因此於該狀態中對玻璃基板4進行任意之處理之情形
時,即便向低負荷區間LR施加意外之應力,亦難以產生玻璃基板4之無意之分斷。因此可穩定地進行上述處理。
In addition, when the low-load section LR in the low-load section LR and the high-load section HR is in a crack-free state (FIGS. 33 and 34 ), the low-load section LR does not have a crack that becomes the starting point for breaking the
又,於低負荷區間LR及高負荷區間HR之兩方為無裂縫狀態之情形時(圖26及圖27),溝槽線TL無成為分斷玻璃基板4之起點之裂縫。因此於該狀態中對玻璃基板4進行任意之處理之情形時,即便向溝槽線TL施加意外之應力,亦難以產生玻璃基板4之無意之分斷。因此可更穩定地進行上述處理。
In addition, when both the low-load section LR and the high-load section HR are in a crack-free state (FIGS. 26 and 27 ), the groove line TL does not have a crack that becomes the starting point for breaking the
又,溝槽線TL係於輔助線AL之形成前而形成。藉此,可避免溝槽線TL之形成時輔助線AL造成影響。尤其是,可避免為了形成溝槽線TL而刀尖51通過輔助線AL上後立即形成異常。
In addition, the trench line TL is formed before the formation of the auxiliary line AL. In this way, the influence of the auxiliary line AL during the formation of the trench line TL can be avoided. In particular, it can be avoided that an abnormality is formed immediately after the
於本實施形態中,對刀尖之前端部具有上述實施形態1中言及之準軸對稱性之情況進行說明。 In this embodiment, the case where the front end of the tool tip has the quasi-axial symmetry mentioned in the first embodiment will be described.
圖37係概略性地表示本實施形態中之切割器具150之構成的立體圖。切割器具150具有設置有前端部151N之刀尖151,代替設置有前端部51N之刀尖51(圖2)。刀尖151具有有帶弧度之頂點之多稜錐的形狀。多稜錐具有側面SD與稜線RG。多稜錐之頂點設置有前端部151N。
Fig. 37 is a perspective view schematically showing the configuration of the
圖38係沿圖37之線XXXVIII-XXXVIII之、與軸方向AX垂直之概略剖面圖。線XXXVIII-XXXVIII(圖37)係與刀尖151中之前端部151N與除此以外之部分之交界附近之、與軸方向AX垂直之剖面相對應。以下,對該剖面觀察中之前端部151N之形狀進行說明。
Fig. 38 is a schematic cross-sectional view taken along the line XXXVIII-XXXVIII of Fig. 37 and perpendicular to the axis direction AX. The line XXXVIII-XXXVIII (FIG. 37) corresponds to the cross section perpendicular to the axis direction AX near the boundary between the
前端部151N之形狀為與上述多稜錐對應之n邊多邊形(n
≧3),較佳為正多邊形。圖38中例示有16邊形(n=16)。前端部151N對應n個稜線RG(圖37)而具有n個點PT,點PT之各者與外切圓CC相切。又,前端部151N對應n個側面SD(圖37)而具有n條邊SD,邊SD之各者具有尺寸DS。固定外切圓CC之大小,n越大,尺寸DS越小,結果前端部151N之剖面形狀越接近圓形。因此n越大,前端部151N之軸方向AX上之軸對稱性越接近理想的幾何學對稱性。因此,n於某種程度上越大,則前端部151N可謂於其功能上越具有軸對稱性。即,前端部151N可謂具有上述準軸對稱性。根據本發明者之研究,若尺寸DS為1μm以下,則可謂前端部151N具有準軸對稱性。滿足該條件之n可根據例如前端部151N之角度、及軸AX附近之前端部151N之曲率半徑而算出。以下對該算出之例進行說明。
The shape of the
圖39係與沿圖38之線A-A之剖面觀察相對應,作為前端部151N之例,表示於軸AX附近具有曲率半徑R=3μm之前端部151Na~151Nc之表面形狀。前端部151Na~151Nc之各者具有前端角度120°、130°及140°。由於軸AX附近之曲率半徑R為3μm,故而於前端部51N之沿軸方向AX之尺寸為1μm之情形時,前端部151Na~151Nc之各者具有直徑5.08μm、5.62μm及6.56μm。換言之,前端部151Na~151Nc之各者具有圓周15.96μm、17.65μm及20.60μm。因此,將尺寸DS(圖38)設為1μm以下之n於前端部151Na之情形時為16以上,於前端部151Nb之情形時為18以上,於前端部151Nc之情形時為21以上。
FIG. 39 corresponds to the cross-sectional view taken along the line A-A of FIG. 38. As an example of the
圖40係與沿圖38之線A-A之剖面觀察相對應,作為前端部151N之例,表示於軸AX附近具有曲率半徑R=5μm之前端部151Ni
~151Nk之表面形狀。前端部151Ni~151Nk之各者具有前端角度120°、130°及140°。由於軸AX附近之曲率半徑R為5μm,故而於前端部51N之沿軸方向AX之尺寸為1μm之情形時,前端部151Ni~151Nk之各者具有直徑6.17μm、6.51μm及7.26μm。換言之,前端部151Ni~151Nk之各者具有圓周19.38μm、20.45μm及22.80μm。因此,將尺寸DS(圖38)設為1μm以下之n於前端部151Ni之情形時為20以上,於前端部151Nj之情形時為21以上,於前端部151Nk之情形時為23以上。
Fig. 40 corresponds to the cross-sectional view taken along the line A-A of Fig. 38. As an example of the
根據圖39及圖40之研究結果,例如若n≧16,則有可獲得準軸對稱性之情況。因此n較佳為16以上。若n≧25,可利用通常使用之範圍內之任意之前端角度及曲率半徑並獲得準軸對稱性。若鑒於用以形成前端部之作業之作業性及加工時間,則n較佳為不過大,因此n較佳為25以下。 According to the research results of Fig. 39 and Fig. 40, for example, if n≧16, quasi-axial symmetry may be obtained. Therefore, n is preferably 16 or more. If n≧25, any front end angle and radius of curvature within the usual range can be used to obtain quasi-axial symmetry. In view of the workability and processing time of the work for forming the front end portion, n is preferably not too large, and therefore n is preferably 25 or less.
為了獲得刀尖151,例如,藉由對具有多稜柱形狀之材料片(例如鑽石片)之前端進行多次研磨,而對該鑽石片之前端部賦予大致多稜錐形狀即可。作為變化例,可對稜線RG(圖37)實施R倒角。藉此,由於邊SD(圖38)之直線部分變短,故而前端部151N之形狀更接近圓形。即,前端部151N之軸對稱性更接近理想的軸對稱性。於此情形時,即便更小之n亦可獲得準軸對稱性。
In order to obtain the
再者,上述各實施形態中圖示有上表面SF1之邊緣為長方形狀之情況,但亦可使用其他形狀。又,說明有上表面SF1平坦之情況,但上表面亦可彎曲。又,說明有溝槽線TL為直線狀之情況,但溝槽線TL亦可為曲線狀。又,說明使用玻璃基板4作為有脆性基板之情況,但脆性基
板亦可由玻璃以外之脆性材料而製成,例如,可由陶瓷、矽、化合物半導體、藍寶石或石英而製成。
In addition, in each of the above-mentioned embodiments, the case where the edge of the upper surface SF1 has a rectangular shape is illustrated, but other shapes may also be used. In addition, it is explained that there is a case where the upper surface SF1 is flat, but the upper surface may be curved. In addition, although the groove line TL is described as a straight line, the groove line TL may also be curved. Also, explain the case where the
4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)
50‧‧‧切割器具 50‧‧‧Cutting equipment
51‧‧‧刀尖 51‧‧‧Knife Point
51N‧‧‧前端部 51N‧‧‧Front end
52‧‧‧支持部 52‧‧‧Support Department
AX‧‧‧軸方向 AX‧‧‧Axis direction
SF1‧‧‧上表面(一面) SF1‧‧‧Upper surface (one side)
SF2‧‧‧下表面(另一面) SF2‧‧‧Lower surface (the other side)
ED‧‧‧邊緣 ED‧‧‧Edge
DA‧‧‧滑動方向 DA‧‧‧Slide direction
DT‧‧‧厚度方向 DT‧‧‧Thickness direction
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JP2016069195A (en) * | 2014-09-26 | 2016-05-09 | 三星ダイヤモンド工業株式会社 | Substrate segmentation method |
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