JP2012193060A - Cutting device for fragile plate and cutting method for fragile plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device for a fragile plate capable of cutting a large area fragile plate.SOLUTION: The cutting device 10 for a fragile plate includes: a plurality of suction parts 21, 22 having suction surfaces 23, 24 which attract a fragile plate 2, on the same plane; a processing head 30 which applies stress locally to the fragile plate 2 attracted by the plurality of suction parts 21, 22 to form cracks; and a transfer means 40 to transfer the processing head 30 along an imaginary line 50 preset between the plurality of suction parts 21, 22, wherein the cutting device 10 has an adjusting means 60 to independently adjust the gap between the suction parts 21, 22 at a plurality of points on the imaginary line 50 in a direction perpendicular to the imaginary line 50 and parallel to the suction surfaces 23, 24, and a control means 70 to control the adjusting means 60 on the basis of the position of the processing head 30.

Description

  The present invention relates to a brittle plate cutting apparatus and a brittle plate cutting method.

  As a cutting device for a brittle plate such as a glass substrate or a silicon substrate, it has a forming means for forming a scribe line (groove line) on the surface of the brittle plate and a dividing means for dividing the brittle plate along the formed scribe line. An apparatus is known (see, for example, Patent Document 1).

  This apparatus includes two suction parts having suction surfaces on the same plane for sucking a brittle plate, a drive source for moving a forming unit along a virtual line preset between the two suction parts, and a drive source During the operation, a moving mechanism for moving the two adsorbing portions closer to or away from each other in parallel with the adsorbing surface is provided.

  In recent years, a device for cutting a brittle plate without forming a scribe line has been developed as a brittle plate cutting device. For example, an apparatus including a machining head that applies a stress locally to a brittle plate to form a crack that penetrates the brittle plate in the thickness direction, and a drive source that moves the machining head relative to the brittle plate. There is.

JP 2006-199553 A

  By the way, the formation of a crack penetrating the brittle plate in the thickness direction is more difficult as the brittle plate has a larger area. This is because the larger the brittle plate, the higher the rigidity of the brittle plate, and the greater the frictional force between the brittle plate and the table on which the brittle plate is placed, so the brittle plate is difficult to deform. This problem is more conspicuous in the central portion of the brittle plate than in the outer peripheral portion of the brittle plate, and the formation of cracks sometimes stopped midway.

  Then, in order to assist the deformation | transformation of a brittle board at the time of a cutting | disconnection of a brittle board, using the moving mechanism of the said patent document 1 is considered, However, This moving mechanism has the following problems.

  FIG. 9 is an explanatory diagram of a conventional problem. The moving mechanism shown in FIG. 9 includes a drive source 104 that separates two suction portions 102 and 103 having suction surfaces on the same plane for sucking the brittle plate 101 in the direction of the arrow in parallel with the suction surfaces.

  This mechanism cannot separate the adsorbing portions 102 and 103 until the brittle plate 101 is completely divided into two. This is because the gap between the suction portions 102 and 103 is to be expanded in the same way on one end side and the other end side. Therefore, the formation of cracks cannot be assisted.

  In addition, in order to widen the gap between the adsorbing portions 102 and 103 in the same manner on one end side and the other end side, tensile stress is applied to the entire brittle plate 2, and the actual cutting position is determined from the planned cutting line. There is also a problem of shifting. This problem becomes apparent when a brittle plate is cut without forming a scribe line.

  FIG. 10 is an explanatory view of another conventional problem. The moving mechanism shown in FIG. 10 includes a hinge 105 that couples one end sides of the two suction portions 102 and 103, and a drive source 106 that opens the two suction portions 102 and 103 in the direction of the arrow about the hinge 105. .

  Also in this mechanism, the suction portions 102 and 103 cannot be opened until the brittle plate 101 is completely divided into two. This is because the gap between the suction portions 102 and 103 is to be widened simultaneously on one end side and the other end side. Therefore, the formation of cracks cannot be assisted.

  This invention is made | formed in view of the said subject, Comprising: It aims at providing the cutting apparatus of the brittle board which can cut | disconnect a brittle board of a large area, and the cutting method of a brittle board.

In order to solve the above object, the present invention provides:
A plurality of adsorbing portions having adsorbing surfaces for adsorbing the brittle plate on the same plane; a machining head for locally applying stress to the brittle plate adsorbed by the plurality of adsorbing portions; In a brittle plate cutting device having a moving means for moving the processing head along a preset virtual line between the suction portions of
Adjusting means for independently adjusting a gap between the suction portions in a direction perpendicular to the virtual line at a plurality of points on the virtual line and parallel to the suction surface;
There is provided a brittle plate cutting device comprising control means for controlling the adjusting means based on the position of the processing head.

In order to solve the above object, the present invention provides:
A first step of adsorbing the brittle plate by a plurality of adsorbing portions having adsorbing surfaces on the same plane for adsorbing the brittle plate; and applying stress locally to the brittle plate adsorbed by the plurality of adsorbing portions. In the cutting method of the brittle plate having a second step of moving a processing head for forming a crack along a virtual line set in advance between the plurality of suction portions,
In the second step, based on the position of the processing head, at a plurality of points on the imaginary line, between the suction parts in a direction perpendicular to the imaginary line and parallel to the suction surface Provided is a method for cutting a brittle plate, wherein the gap is adjusted independently.

  ADVANTAGE OF THE INVENTION According to this invention, the cutting apparatus of a brittle board which can cut | disconnect a brittle board of a large area, and the cutting method of a brittle board can be provided.

The perspective view of the cutting device of a brittle board by the 1st embodiment of the present invention. Explanatory drawing (1) of operation | movement of the cutting device of FIG. Explanatory drawing (2) of operation | movement of the cutting device of FIG. Illustration of machining head Explanatory drawing (1) of operation | movement of the cutting apparatus of a brittle board by the 2nd Embodiment of this invention. Explanatory drawing (2) of operation | movement of the cutting apparatus of a brittle board by the 2nd Embodiment of this invention. Explanatory drawing (1) of operation | movement of the cutting apparatus of a brittle board by the 3rd Embodiment of this invention. Explanatory drawing (2) of operation | movement of the cutting apparatus of a brittle board by the 3rd Embodiment of this invention. Illustration of conventional problems Illustration of another problem in the past

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each of the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof will be omitted.

[First Embodiment]
FIG. 1 is a perspective view of a brittle plate cutting device according to a first embodiment of the present invention. 2 to 3 are explanatory views of the operation of the cutting device of FIG. 2 to 3, the electrode 32 is not shown in order to make the drawings easy to see. In each drawing, the X direction is a direction parallel to the suction surface of the suction part and represents a direction orthogonal to the virtual line, and the Y direction is a direction parallel to the suction surface of the suction part and Represents a parallel direction. Note that the X direction and the Y direction are horizontal directions when the suction surface is disposed horizontally with respect to the ground.

  The cutting device 10 of this embodiment is a device for cutting the glass plate 2 that is a brittle plate. The glass plate 2 is made of general glass such as soda lime glass, non-alkali glass, or quartz glass.

  The cutting device 10 does not have means for forming a scribe line (groove line) along the planned cutting line 4 on the surface of the glass plate 2. This is because the configuration of the cutting device 10 is simplified and damage to the surface of the glass plate 2 is suppressed.

  The “scheduled cutting line” is a virtual line scheduled to be cut. The starting point and the end point of the planned cutting line 4 intersect with the outer peripheral part 6 of the glass plate 2.

  In the vicinity of the starting point of the planned cutting line 4, an initial crack serving as a starting point of cutting may be formed in the glass plate 2 in advance. However, in order to reduce the number of steps, the initial crack may not be formed in advance.

  Although the magnitude | size of the glass plate 2 is not specifically limited, For example, when the glass plate 2 is rectangular shape, the dimension of the short side of the glass plate 2 may be 20 mm or more.

  In addition, although the cutting device 10 of this embodiment cut | disconnected the glass plate 2, you may cut | disconnect other brittle boards, such as a silicon substrate and a sapphire board | substrate.

  The cutting apparatus 10 includes a plurality of suction portions 21 and 22 that suck the glass plate 2, a processing head 30 that forms a crack 8 in the glass plate 2 sucked by the plurality of suction portions 21 and 22, and a plurality of suction processing heads 30. It has the moving means 40 moved relatively with respect to the parts 21 and 22.

  The plurality of suction portions 21 and 22 have suction surfaces 23 and 24 that suck the glass plate 2 on the same plane. The suction surfaces 23 and 24 may be disposed horizontally with respect to the ground. Adsorption holes (not shown) are provided in the adsorption surfaces 23 and 24. The suction hole is connected to an intake source such as a vacuum pump.

  A virtual line 50 is set in advance between the plurality of suction units 21 and 22. The dimensional shape of the virtual line 50 is set according to the dimensional shape of the planned cutting line 4.

  The shape of the virtual line 50 is set to be linear in this embodiment, but may be set to be curved as long as it is set according to the shape of the planned cutting line 4 and is not particularly limited.

  In the present embodiment, the number of the suction portions 21 arranged on the left side of the virtual line 50 and the number of the suction portions 22 arranged on the right side of the virtual line 50 are one in the present embodiment. It is not limited.

  The two adsorbing portions 21 and 22 face each other with the virtual line 50 in between, and each has flexibility in a predetermined direction (X direction). This flexibility is determined by the width of the suction portions 21 and 22, the material of the suction portions 21 and 22, and the like. As materials for the adsorbing portions 21 and 22, for example, synthetic resins such as epoxy, Teflon (registered trademark), polyvinyl chloride, MC nylon (registered trademark), metals such as carbon steel, stainless steel, aluminum, and titanium alloys are used. .

  The processing head 30 is disposed on the side opposite to the plurality of suction portions 21 and 22 with the glass plate 2 as a reference.

  The processing head 30 locally applies stress to the glass plate 2 adsorbed by the plurality of adsorbing portions 21 and 22 to form the crack 8. The crack 8 penetrates the glass plate 2 having no scribe line in the thickness direction.

  FIG. 4 is an explanatory diagram of the machining head. The processing head 30 has a heating source for locally heating the glass plate 2 in order to apply thermal stress locally to the glass plate 2. As the heat source, for example, the discharge electrode 31 is used.

  The discharge electrode 31 has a tip that tapers toward the surface of the glass plate 2. Thereby, the heating range of the glass plate 2 can be narrowed.

  The discharge electrode 31 is electrically connected to the electrode 32 via a circuit 33. The electrode 32 and the circuit 33 are provided outside the processing head 30. The electrode 32 may be grounded.

  For example, as shown in FIG. 1, the electrode 32 is provided on the side end surface of the suction portion 21 on the suction portion 22 side. The electrode 32 has flexibility in a predetermined direction (X direction) so as to be bent and deformed together with the suction portion 21. The width of the electrode 32 in the X direction may be, for example, 0.2 to 2 mm in order to narrow the heating range of the glass plate 2.

  The circuit 33 includes a high-frequency power source 34 that applies an alternating current to the discharge electrode 31, a modulator 35 that modulates the frequency, duty ratio, and voltage of the alternating current applied to the discharge electrode 31.

  The high frequency power supply 34 applies an alternating current to the discharge electrode 31 to cause a discharge in a gap formed between the discharge electrode 31 (or / and the electrode 32) and the glass plate 2, and the surface of the glass plate 2 (or / And the back surface) is locally discharge-heated. The high frequency power supply 34 applies an alternating current to the discharge electrode 31, applies an alternating electric field to the glass plate 2, and locally dielectrically heats the inside of the glass plate 2. Thereby, the crack 8 which penetrates the glass plate 2 in a plate | board thickness direction is formed.

  In order to stabilize the discharge, the atmosphere around the discharge electrode 31 (or / and the electrode 32) is preferably an inert atmosphere such as a nitrogen atmosphere or an argon atmosphere, and more preferably a reduced pressure atmosphere.

  The moving means 40 (see FIG. 1) is a means for moving the processing head 30 relative to the suction portions 21 and 22. The moving means 40 may move the suction portions 21 and 22 side, may move the processing head 30 side, or may move both sides.

  The moving means 40 moves the machining head 30 along the virtual line 50. The moving means 40 includes, for example, a guide rail 42 that guides the machining head 30 in the Y direction, and a drive source 44 that moves the machining head 30 in the Y direction.

  In this embodiment, the moving means 40 moves the machining head 30 in a straight line. However, the moving means 40 may move the machining head 30 in a curved shape in accordance with the shape of the planned cutting line 4. There is no particular limitation.

  By moving the machining head 30 along the virtual line 50, the tip position of the crack 8 moves along the planned cutting line 4. The tip position of the crack 8 is in the vicinity of the machining head 30.

  For example, as shown in FIG. 1, the cutting device 10 further includes an adjusting unit 60 that adjusts the gap between the suction surfaces 23 and 24, and a control unit 70 that controls the adjusting unit 60.

  The adjusting means 60 is a means for independently adjusting the gap L (see FIG. 3) in the X direction between the suction portions 21 and 22 at a plurality of points on the virtual line 50. For example, the adjusting unit 60 includes a piezo actuator 61 that drives the suction units 21 and 22.

  A plurality of piezoelectric actuators 61 are provided along the virtual line 50. Each piezoelectric actuator 61 can be expanded and contracted in a predetermined direction (X direction). For example, as shown in FIG. 1, the piezoelectric actuator 61 is connected to the suction portion 21 at one end and is connected to the suction portion 22 at the other end. ing. When each piezo actuator 61 expands and contracts, a part of the adsorbing portions 21 and 22 contacts and separates from the virtual line 50. As a result, the gap L between the suction portions 21 and 22 partially changes, and the glass plate 2 sucked by the suction portions 21 and 22 is deformed. Since the displacement amount of the piezo actuator 61 is variable, the gap L is variable, and the deformation amount of the glass plate 2 is variable.

  The control means 70 is a means for controlling the adjusting means 60 based on the position of the machining head 30. The control unit 70 obtains position information of the machining head 30 from a control unit that controls the drive source 44 of the moving unit 40 or a detection sensor that detects the position of the machining head 30. The control means 70 is composed of, for example, a computer.

  For example, as shown in FIG. 1, the cutting device 10 of the present embodiment is disposed on the opposite side of the imaginary line 50 with respect to the suction portions 21 and 22, and supports a glass plate 2 so as to be movable. , 82 are further included.

  The surfaces (upper surfaces) 83 and 84 for supporting the glass plate 2 of the support portions 81 and 82 are substantially flush with the suction surfaces 23 and 24 of the suction portions 21 and 22.

  The support surfaces 83 and 84 of the support portions 81 and 82 are provided with air supply holes (not shown). The air supply hole is connected to a compressed gas source. When the support surfaces 83 and 84 have sufficiently smooth surfaces and can support the glass with almost no contact friction with the glass, the air supply holes are unnecessary.

  Next, referring to FIGS. 2 to 3 again, the operation of the cutting apparatus 10 having the above-described configuration will be described. The following operation of the cutting apparatus 10 is realized mainly under the control of the control means 70.

  First, as shown in FIG. 2, the glass plate 2 is placed on the suction surfaces 23 and 24 of the plurality of suction portions 21 and 22 and the support surfaces 83 and 84 of the plurality of support portions 81 and 82.

  When viewed from a direction orthogonal to the suction surfaces 23 and 24, the virtual line 50 and the planned cutting line 4 overlap. The virtual line 50 is arranged over the entire planned cutting line 4.

  Further, when viewed from a direction orthogonal to the suction surfaces 23 and 24, the electrode 32 and the planned cutting line 4 overlap each other. The electrode 32 is arranged over the entire cutting line 4.

  The two adsorption portions 21 and 22 are in contact with each other through the electrode 32.

  Next, the intake source is activated, the inside of the suction hole is depressurized, and the glass plate 2 is sucked onto the suction surfaces 23 and 24. Subsequently, the compressed gas source is activated, compressed gas is supplied into the air supply holes, and the contact pressure between the support surfaces 83 and 84 and the glass plate 2 is reduced by the wind pressure of the compressed gas.

  Next, the moving means 40 moves the machining head 30 to the vicinity of one end of the virtual line 50, and an alternating current is supplied from the high frequency power supply 34 to the discharge electrode 31 of the machining head 30. Thereby, since the processing head 30 locally heats the outer peripheral part 6 of the glass plate 2 and applies stress to the outer peripheral part 6, the crack 8 which penetrates the outer peripheral part 6 in a plate | board thickness direction is formed.

  Next, as shown in FIG. 3, the machining head 30 moves the tip position of the crack 8 by locally applying stress to the glass plate 2 while being moved along the virtual line 50.

  At this time, the control unit 70 controls the adjustment unit 60 based on the position of the machining head 30 to independently adjust the gap L at a plurality of points on the virtual line 50.

  Therefore, the control means 70 can deform the glass plate 2 so that a tensile stress acts on the glass plate 2 in the vicinity of the processing head 30 (specifically, the tip of the crack 8 and its vicinity). Therefore, the large-area glass plate 2 can be cut.

  In addition, the control means 70 can deform the glass plate 2 such that a compressive stress acts on the glass plate 2 in front of the processing head 30 in the moving direction (specifically, in front of the tip of the crack 8). Therefore, it can suppress that the glass plate 2 is cut | disconnected in the position which is not intended.

  For example, as shown in FIGS. 2 to 3, when the machining head 30 moves from one end side to the other end side of the virtual line 50, the control unit 70 controls the adjusting unit 60 to control a plurality of virtual lines 50 on the virtual line 50. Starting from the points near the one end of the imaginary line 50, the gap L is started to be expanded.

  Specifically, the control unit 70 starts to sequentially expand from the piezoelectric actuators 61 close to one end of the virtual line 50 among the plurality of piezoelectric actuators 61 arranged at intervals along the virtual line 50. At this time, since both the two adsorbing portions 21 and 22 are bent, the glass plate 2 is smoothly deformed, and the breakage of the glass plate 2 is suppressed.

  The timing at which the control means 70 finishes widening the gap L may be different at each point on the virtual line 50. That is, the timing at which the control means 70 ends the extension of the piezo actuator 61 may be different for each piezo actuator 61.

  At the point where the expansion of the gap L is completed, the control means 70 keeps the gap L at a predetermined value (for example, 50 μm) or more until the cutting of the glass plate 2 is completed. By maintaining the gap L at a predetermined value or more, the cut surfaces of the glass plate 2 are prevented from rubbing with each other, and the quality of the cut surface of the glass plate 2 is prevented from being deteriorated.

  The upper limit value of the gap L is set according to the dimensional shape and physical properties of the glass plate 2 so that the glass plate 2 is not damaged. The upper limit value of the gap L is, for example, 1000 μm.

  When the glass plate 2 is divided into two, the supply of alternating current from the high-frequency power source 34 to the discharge electrode 31 is stopped. Further, the suction of the glass plate 2 by the suction portions 21 and 22 is released, and the glass plate 2 is removed from the suction portions 21 and 22. Finally, the supply of compressed gas from the compressed gas source to the air supply holes is stopped.

[Second Embodiment]
In the first embodiment, the two adsorbing portions face each other across the virtual line, and each has flexibility in a predetermined direction (X direction). The two suction portions are each bent and deformed sequentially from one end side as the machining head 30 moves.

  On the other hand, in this embodiment, two adsorption | suction parts have faced on both sides of the virtual line, and one of two adsorption | suction parts has flexibility in a predetermined direction (X direction). Only one suction portion is sequentially bent and deformed from one end side with the movement of the machining head.

  Hereinafter, the configuration of the cutting apparatus according to the present embodiment will be described with reference to FIGS. 5 to 6, but the configuration other than the suction unit, the adjusting unit, and the control unit is the same as that of the first embodiment, and thus will be described. Is omitted.

  5-6 is explanatory drawing of operation | movement of the cutting apparatus of a brittle board by the 2nd Embodiment of this invention. 5 is a diagram corresponding to FIG. 2, and FIG. 6 is a diagram corresponding to FIG.

  As shown in FIGS. 5 to 6, the two suction portions 21 </ b> A and 22 face each other across the virtual line 50 </ b> A, and one of the two suction portions 21 </ b> A and 22 is flexible in a predetermined direction (X direction). Have sex.

  The other suction portion 21A is fixed to the virtual line 50A and sucks the entire one side portion of the left and right side portions of the planned cutting line (virtual line 50A) of the glass plate 2. The material of the other adsorbing portion 21A is not particularly limited. For example, synthetic resin such as epoxy, Teflon (registered trademark), polyvinyl chloride, MC nylon (registered trademark), carbon steel, stainless steel, aluminum, titanium alloy, etc. These metals, ceramics such as silicon carbide, silicon nitride, mullite, and alumina are used.

  Unlike the first embodiment, the electrode (electrode corresponding to the electrode 32 shown in FIG. 4) provided on the side end surface of the other suction portion 21A on the suction portion 22 side is flexible in a predetermined direction (X direction). It does not have to have. This is because the adsorbing portion 21A does not bend and deform.

  In the present embodiment, the electrode corresponding to the electrode 32 shown in FIG. 4 may be provided on the side end face of the one suction part 22 on the side of the suction part 21A. Furthermore, it has flexibility in a predetermined direction (X direction).

  The gap between the two adsorbing portions 21A and 22 is adjusted by the adjusting means 60A. The adjusting means 60A has a piezo actuator 61A that drives one of the suction portions 22.

  A plurality of piezoelectric actuators 61A are provided along the virtual line 50A. Each piezoelectric actuator 61A can be expanded and contracted in a predetermined direction (X direction). For example, as shown in FIG. 5, the piezoelectric actuator 61A is connected to the suction portion 21A at one end and is connected to the suction portion 22 at the other end. ing. When each piezo actuator 61A expands and contracts, a part of the adsorbing portion 22 contacts and separates from the virtual line 50A. As a result, the gap L between the suction portions 21A and 22 partially changes, and the glass plate 2 sucked by the suction portions 21A and 22 is deformed. Since the displacement amount of the piezo actuator 61A is variable, the gap L is variable, and the deformation amount of the glass plate 2 is variable.

  In the present embodiment, similarly to the first embodiment, the control unit 70A controls the adjusting unit 60A (specifically, the piezo actuator 61A) based on the position of the machining head 30, and thus on the virtual line 50A. The gap L is adjusted independently at a plurality of points. Therefore, the same effect as the first embodiment can be obtained.

  For example, when the machining head 30 moves from one end side to the other end side of the virtual line 50A, the control unit 70A controls the adjusting unit 60A to make one end of the virtual line 50A among a plurality of points on the virtual line 50A. Starting to increase the gap L sequentially from a close point.

  Specifically, the control unit 70A sequentially starts extending from the piezo actuators 61A close to one end of the imaginary line 50A among the piezo actuators 61A arranged at intervals along the imaginary line 50A.

  By the way, in this embodiment, since only one adsorption | suction part 22 bends according to expansion / contraction of the piezo actuator 61A, the left side in the figure in the left and right side portions of the planned cutting line (virtual line 50A) of the glass plate 2 The part is not deformed, only the right part is deformed. Therefore, among the left and right side portions of the planned cutting line (virtual line 50A) of the glass plate 2, it is possible to change the portion discarded after cutting without changing the portion that becomes the product after cutting. The cutting device of this embodiment is suitable for the case where the side edge portion of the glass plate 2 is excised.

  Incidentally, in the first embodiment, the left and right side portions of the planned cutting line 4 of the glass plate 2 are deformed. Therefore, when the change amount of the gap L is the same, the deformation amount of the one side portion is reduced as compared with the present embodiment. The cutting device of the first embodiment is suitable when the left and right side portions of the planned cutting line 4 of the glass plate 2 are products.

[Third Embodiment]
In the first embodiment, one suction part is disposed on each side of the imaginary line, and each suction part has flexibility in a predetermined direction (X direction).

  On the other hand, in the present embodiment, a plurality of suction portions are disposed on both sides of the virtual line. Moreover, each adsorption | suction part does not have flexibility.

  Hereinafter, the configuration of the cutting apparatus according to the present embodiment will be described with reference to FIGS. 7 to 8, but the configuration other than the suction unit is the same as that of the first embodiment, and thus the description thereof is omitted.

  7-8 is explanatory drawing of operation | movement of the cutting apparatus of a brittle board by the 3rd Embodiment of this invention. 7 is a diagram corresponding to FIG. 2, and FIG. 8 is a diagram corresponding to FIG.

  The plurality of suction portions 21B-1 to 21B-7 and 22B-1 to 22B-7 are arranged symmetrically with respect to the virtual line 50B. The plurality of suction portions 21B-1 to 21B-7 and 22B-1 to 22B-7 are independently movable in a predetermined direction (X direction).

  A gap L between the two suction portions 21B-n and 22B-n facing each other across the virtual line 50B is adjusted by the adjusting means 60B. The adjusting means 60B has a piezo actuator 61B that drives the two suction portions 21B-n and 22B-n.

  A plurality of piezo actuators 61B are provided along the virtual line 50B. Each piezoelectric actuator 61B can be expanded and contracted in a predetermined direction (X direction). For example, as shown in FIG. 5, the piezoelectric actuator 61B is connected to the suction portion 21B-n at one end and the suction portion 22B- at the other end. connected to n. When each piezo actuator 61B expands and contracts, the suction portions 21B-n and 22B-n come in contact with and separate from the virtual line 50B. As a result, the gap L between the adsorption portions 21B-n and 22B-n changes, and the glass plate 2 adsorbed by the adsorption portions 21B-n and 22B-n is deformed. Since the displacement amount of the piezo actuator 61B is variable, the gap L is variable, and the deformation amount of the glass plate 2 is variable.

  In the present embodiment, as in the first embodiment, the control unit 70B controls the adjusting unit 60B (specifically, the piezo actuator 61B) based on the position of the machining head 30, and thus on the virtual line 50B. The gap L is adjusted independently at a plurality of points. Therefore, the same effect as the first embodiment can be obtained.

  For example, when the processing head 30 moves from one end side to the other end side of the virtual line 50B, the control unit 70B controls the adjusting unit 60B so that one of the plurality of points on the virtual line 50B becomes one end of the virtual line 50B. Starting to increase the gap L sequentially from a close point.

  Specifically, the control unit 70B sequentially starts to expand from the piezo actuators 61B close to one end of the imaginary line 50 among a plurality of piezo actuators 61B arranged at intervals along the imaginary line 50B.

  The first to third embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments, and various modifications can be made to the above embodiments without departing from the scope of the present invention. Can be modified or replaced.

  For example, although the cutting apparatus 10 of the above embodiment does not have a means for forming a scribe line on the surface of the glass plate 2, it may be provided. In this case, the processing head 30 forms the crack 8 starting from the scribe line.

  Moreover, although the discharge electrode 31 of the above embodiment is electrically connected to the electrode 32 via the circuit 33, the electrode 32 may not be provided. When there is no electrode 32, the discharge electrode 31 is electrically connected to the glass plate 2 via the circuit 33. In this case, the glass plate 2 may be grounded.

  Moreover, although the processing head 30 of the above embodiment has the discharge electrode 31 as a heating source, it may have a laser light source instead of the discharge electrode 31. As a laser light source, UV laser (wavelength: 355 nm), green laser (wavelength: 532 nm), semiconductor laser (wavelength: 808 nm, 940 nm, 975 nm), fiber laser (wavelength: 1060 to 1100 nm), YAG laser (wavelength: 1064 nm, 2080 nm, 2940 nm).

  Moreover, the processing head 30 of the above embodiment may have a cooling source that locally cools the glass plate 2 in addition to the heating source. As the cooling source, for example, a nozzle that discharges a refrigerant is used. As the refrigerant, a gas such as cooling air or a liquid such as cold water is used. A combination of gas and liquid may be used.

  Moreover, although the processing head 30 of the above-described embodiment forms the crack 8 that penetrates the glass plate 2 in the plate thickness direction, the depth of the crack 8 may be 50% or more of the plate thickness of the glass plate 2. . In this case, since the crack 8 penetrates the glass plate 2 in the thickness direction with a force enough to touch the glass plate 2, when the adjusting means 60 (60A, 60B) widens the gap L, the crack 8 Is penetrated in the thickness direction.

  Moreover, although the processing head 30 of the above-described embodiment has a heating source, it may have a wheel cutter provided with a plurality of notches on the outer peripheral portion instead of the heating source. When the outer peripheral portion of the wheel cutter is pressed against the surface of the glass plate 2 and rolled, the depth of the crack 8 reaches about 80% of the plate thickness only by the outer peripheral portion biting into the glass plate 2 by several μm.

  Further, in the adjusting means 60 (60A, 60B) of the above-described embodiment, a plurality of the piezoelectric actuators 61 (61A, 61B) are provided at intervals along the virtual line 50 (50A, 50B). If it is movable along the line 50 (50A, 50B), only one may be provided.

  Further, the adjusting means 60 (60A, 60B) of the above-described embodiment has the piezo actuator 61 (61A, 61B) as a drive source for driving the suction portion, but instead of the piezo actuator 61 (61A, 61B). Further, a combination of a ball screw and a servo motor, a cylinder such as a hydraulic cylinder or a pneumatic cylinder, or a solenoid may be provided.

2 Glass plate (brittle plate)
4 Cutting line 10 Cutting device 21 Suction part 22 Suction part 23 Suction surface 24 Suction surface 30 Processing head 31 Discharge electrode 32 Electrode 40 Moving means 42 Guide rail 44 Drive source 50 Virtual line 60 Adjusting means 61 Piezo actuator 70 Control means

Claims (7)

A plurality of adsorbing portions having adsorbing surfaces for adsorbing the brittle plate on the same plane; a machining head for locally applying stress to the brittle plate adsorbed by the plurality of adsorbing portions; In a brittle plate cutting device having a moving means for moving the processing head along a preset virtual line between the suction portions of
Adjusting means for independently adjusting a gap between the suction portions in a direction perpendicular to the virtual line at a plurality of points on the virtual line and parallel to the suction surface;
A brittle plate cutting apparatus comprising: a control unit that controls the adjusting unit based on a position of the processing head.   The control means controls the adjusting means when the machining head is directed from one end side to the other end side of the imaginary line, from a point close to one end of the imaginary line among a plurality of points on the imaginary line. The brittle plate cutting device according to claim 1, which starts to widen the gap sequentially. Of the plurality of suction portions, two suction portions face each other across the virtual line, and each has a flexibility in a direction perpendicular to the virtual line and parallel to the suction surface. And
The brittle plate cutting device according to claim 1 or 2, wherein the control means controls the adjusting means to bend each of the two suction portions. Of the plurality of suction portions, two suction portions face each other across the virtual line, and one of the two suction portions is in a direction perpendicular to the virtual line and parallel to the suction surface. Flexible in the direction,
The brittle plate cutting device according to claim 1 or 2, wherein the control means controls the adjusting means to bend only the one suction portion. The adjusting means includes a piezo actuator that drives the suction unit;
The brittle board cutting device according to any one of claims 1 to 4, wherein a plurality of the piezoelectric actuators are provided along the virtual line. A first step of adsorbing the brittle plate by a plurality of adsorbing portions having adsorbing surfaces on the same plane for adsorbing the brittle plate; and applying stress locally to the brittle plate adsorbed by the plurality of adsorbing portions. In the cutting method of the brittle plate having a second step of moving a processing head for forming a crack along a virtual line set in advance between the plurality of suction portions,
In the second step, based on the position of the processing head, at a plurality of points on the imaginary line, between the suction parts in a direction perpendicular to the imaginary line and parallel to the suction surface A method for cutting a brittle plate, wherein the gap is adjusted independently.   In the second step, when the processing head moves from one end side to the other end side of the imaginary line, the gap is sequentially expanded from a point close to one end of the imaginary line among a plurality of points on the imaginary line. The method for cutting a brittle plate according to claim 6, wherein the cutting is started.

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