JP2009154516A6 - Brittle substrate cutting aid - Google Patents

Abstract

In a method for cutting a brittle substrate by heating and then cooling, means for enabling high-speed processing is provided.
A cutting process in which a substrate made of a brittle material is heated and cooled by the processing means while moving the substrate relative to the processing means along a cutting line, and the substrate is cut by a thermal shock force generated at this time. As a brittle substrate cutting auxiliary device used in the method, a force is applied to the bending addition point in the direction in which the bending addition point, which is a point on or near the cutting line that moves as the substrate moves, moves to one side of the substrate. And a fixing means for fixing the fixing points existing on both sides of the bending addition point so as not to move in the direction.
[Selection] Figure 1

Description

  The present invention relates to a cutting assistance device used when a brittle substrate is divided by being heated and then cooled. Examples of the brittle substrate include a glass substrate and a laminated glass substrate.

As one of the cutting methods of the brittle substrate, a micro crack as a base point is attached to the brittle substrate to be processed in advance, and the brittle substrate is heated and expanded along the cutting line using a laser or the like with the crack point as a base point. A technique is known in which a cooling device is provided immediately after heating to cool an expanded brittle substrate, thereby forming a scribe line on the brittle substrate by a generated thermal shock or performing a full body cut. In addition, when making a scribe line, after the scribe line is formed, the scribe line is pressed by a roller or the like, or a step is provided below the scribe line and then cut by breaking along the scribe line. To do.
In the current production of liquid crystal substrates, the glass plates that are being made are becoming thin, and the cutting method of cutting by cooling after heating is much more processed than the method of physically scratching and cutting with a blade. Since it is clean, the strength of the material after processing is very high, and it is not necessary to polish it in a subsequent process, and thus has been attracting attention.

However, in this method, even when trying to process at high speed, the generated thermal shock is not mechanically cut, but uses the thermal stress of the material. Only a very shallow scribe line of about 100 microns is formed. Therefore, after the scribe line is formed as described above, an operation of breaking along the scribe line is required.
On the other hand, in order to perform a full body cut in order to omit the breaking work, it is necessary to transfer the heated heat to the lower surface of the glass, so that the processing is performed at a very low speed.
For this reason, at present, the cutting method of cutting by cooling after heating is not mainstream in the production of liquid crystal substrates, despite having various advantages.

  In view of such a problem, an object of the present invention is to provide means for enabling high-speed processing in a method of cutting a brittle substrate by cooling after heating.

In order to solve the above problems, the present invention has the following configuration.
In the first aspect of the present invention, while the substrate made of a brittle material is moved relative to the processing means along the cutting line, heating and cooling are performed by the processing means, and the thermal shock force generated at this time is used to A brittle substrate cutting auxiliary device used in a cutting method for cutting a substrate, in a direction in which a deflection addition point that is a point on or near the cutting line that moves as the substrate moves moves to one side of the substrate, There is a bending addition means for applying a force to the bending addition point, and a fixing means for fixing the fixing points existing on both sides of the bending addition point so as not to move in the direction. In addition, as a method of applying a force by the deflection adding means, a force is applied by suction from the movement direction side of the deflection addition point, a gas is blown from the side opposite to the movement direction of the deflection addition point, or pressure is applied by a roller. The method of applying force by doing is illustrated. In addition, as a fixing method by the fixing means, a method of blowing gas from the movement direction side of the bending addition point, restricting movement by pressurizing with a roller, or sucking the substrate from the side opposite to the movement direction of the bending addition point Is exemplified.

According to a second aspect of the present invention, in the brittle substrate cutting assist device, the bending addition means sucks the bending addition point by reducing the pressure in the vicinity of the surface of the substrate in a non-contact state with the substrate. And the fixing means includes a pressurizing portion that pressurizes the fixing point of the substrate in a direction opposite to a direction sucked by the suction portion and is movably formed on the substrate. Note that the pressurization includes not only positive pressurization but also pressurization generated by restricting the movement of the sucked substrate.
According to a third aspect of the present invention, in the brittle substrate cutting auxiliary device according to the second aspect, the substrate is cooled from one surface side, and the surface to be sucked by the deflection addition point and the suction portion. Is provided on the surface to be cooled.

According to a fourth aspect of the present invention, in the brittle substrate cutting auxiliary device according to the second or third aspect, the fixing means adds a fixing point by a roller having a rotation axis parallel to the substrate and perpendicular to the cutting line. Pressure.
According to a fifth aspect of the present invention, in the brittle substrate cutting auxiliary device according to the second or third aspect, the fixing means pressurizes the gas by blowing a gas onto the fixing point.
According to a sixth aspect of the present invention, in the brittle substrate cutting auxiliary device, the fixing means is formed such that a relative position of the fixing point with respect to the bending addition point is variably formed along the cutting line.
According to a seventh aspect of the present invention, in the brittle substrate cutting auxiliary device, the fixing means fixes two or more fixing points on both sides of the bending addition point.

According to an eighth aspect of the present invention, in the brittle substrate cutting assist, the bending addition means is formed such that the bending addition points are variably formed at two locations sandwiching the cooling position of the processing means in a direction along the cutting line. Is.
In the ninth aspect of the present invention, in the brittle substrate cutting assist, the bending addition points are provided at two points inside the fixing points on both sides and on both sides of the cooling position by the processing means.

The invention according to claim 10 is a table for fixing a substrate made of a brittle material, and a heating means for heating a cutting line portion of the substrate provided at a position facing the cutting line of the substrate fixed to the table. And a cooling means for cooling a cutting line portion of the substrate provided in a direction facing the cutting line of the substrate fixed to the table in a direction along the cutting line of the heating means, The moving means for moving the table, the cooling means, and the heating means along the cutting line relatively in a direction in which the table is directed from the heating means to the cooling means, and according to any one of claims 1 to 9. A brittle substrate cutting device having a brittle substrate cutting auxiliary device.
According to an eleventh aspect of the present invention, in the brittle substrate cutting apparatus, at least one of the deflection addition points is provided in the vicinity of the heating means side of the cooling position by the cooling means.
According to a twelfth aspect of the present invention, in the brittle substrate cutting device, the brittle substrate cutting auxiliary device is the brittle substrate cutting auxiliary device according to claim 9, and a line segment connecting the two bending addition points is the The deflection additional point is provided so as to pass through the cooling position by the cooling means.
According to a thirteenth aspect of the present invention, in the brittle substrate cutting apparatus, the bending addition point is provided on the side opposite to the heating means side of the cooling position by the cooling means.

  According to the first aspect of the present invention, stress is applied to the bending addition point on the cutting line to be pressed and cooled, and the vicinity of the bending addition point is bent by fixing the fixing points existing on both sides of the bending addition point. Thus, when the scribe line is generated, the material is pulled away from the scribe line in a direction perpendicular to the scribe line, and the crack forming the scribe line can be advanced.

The invention according to claim 2 has a configuration in which a force is applied to the bending addition point by suction, and the fixing point is fixed by applying pressure in a direction opposite to the suction direction. The force is applied to the point and the fixing point, and the brittle substrate cutting auxiliary device can be configured as an integrated device existing on one surface side of the substrate to be processed.
According to the third aspect of the present invention, since the bending is generated in the direction in which the cooled side spreads by sucking the bending addition point from the cooling surface side, the progress of the crack in the scribe line can be promoted.

According to the fourth aspect of the present invention, since the substrate is fixed by pressing the fixing point with the roller, the structure of the fixing means can be simplified.
The invention according to claim 5 is a configuration in which the substrate is fixed by pressurizing the fixing point by blowing gas, so that excessive force is not applied to the substrate, and unexpected damage of the substrate is caused. Occurrence is suppressed.
According to the sixth aspect of the present invention, there is a fixing point on the edge portion of the substrate in the forward and backward direction of the substrate by variably forming the position of the fixing point fixed by the fixing means with respect to the bending addition point. In such a case, the substrate can be more firmly fixed by moving the fixing point to the inside of the edge.
According to the seventh aspect of the present invention, the substrate can be more stably fixed by providing two or more fixing points on both sides of the bending addition point.

According to the eighth aspect of the present invention, when the bending position is added to the edge of the brittle substrate before and after the cooling position, the cooling position is sandwiched between the front and rear of the cutting direction. Although there are cases where the application does not occur at the same time, such a situation can be prevented by switching the deflection addition point.
According to the ninth aspect of the present invention, it is possible to make the cooling position coincide with the position where the deflection is applied by providing the bending addition points on both sides of the cooling position.

In the invention according to claim 10, by providing the brittle substrate cutting assisting device, the progress of cracks can be accelerated and the cutting processing speed of the brittle substrate can be increased.
The eleventh aspect of the present invention is to cool the cooling point on the cutting line at the edge in front of the traveling direction of the brittle substrate while adding the deflection by providing the deflection additional point in the vicinity of the heating means side of the cooling position. Can do.
In the invention according to the twelfth aspect, the cooling point on the cutting line of the brittle substrate coincides with the point to bend, so that the cooling and the bending can be reliably performed simultaneously.
The invention according to claim 13 is simpler than the case where the brittle substrate cutting auxiliary device is installed between the cooling means and the heating means by providing the bending addition point on the opposite side of the heating means at the cooling position. Can be installed.

(Embodiment 1)
FIG. 1 shows a perspective view of a brittle substrate cutting auxiliary device X according to Embodiment 1, and FIG. 2 shows a front view of the brittle substrate cutting auxiliary device X. The brittle substrate cutting auxiliary device X includes a rectangular parallelepiped main body 30, a suction part 10 serving as a bending addition means having an opening at the center of the bottom surface of the main body 30, and a pressurizing part 20 serving as a fixing means provided on both side surfaces of the main body 30. .
The main body 30 is a rectangular parallelepiped block body made of an aluminum material, and is formed inside so that a conduction portion 12 through which air of a suction portion 10 to be described later passes communicates from the bottom surface to the back surface. The upper surface of the main body 30 is provided with two pressing portions 40 including a compression coil spring 40a and a rod body 40b passing through the compression coil spring 40a on the left and right sides, and the upper end of the rod body of the pressing portion 40 is formed from a plate-like body. The stopper 40bb is provided above through the through-hole 50a provided in the fixed portion 50, so that it can be slid within the through-hole and fixed so as not to fall down.

The suction part 10 is connected to an opening 11 provided on the lower surface of the main body 30, a conduction part 12 formed in the main body 30 communicating from the opening 11 to the back of the main body 30, and an opening on the back side of the conduction part 12. And an air tube 13. A vacuum pump is connected to the proximal end side of the air tube 13.
The pressure unit 20 is formed by two rotating roller bodies, and includes a hard rubber roller and a shaft portion that pivotally supports the roller on the side surface of the main body 30. A bearing (not shown) is provided between the shaft portion and the roller.

Next, the operation of the brittle substrate cutting auxiliary device X having the above configuration will be described. FIG. 3 is a side view schematically showing a brittle substrate cutting device P having the brittle substrate cutting auxiliary device X.
In addition to the brittle substrate cutting auxiliary device X, the brittle substrate cutting device P cools the brittle substrate B, a stage S that is a table for placing and moving the brittle substrate B to be cut, a laser irradiator L that heats the brittle substrate B, and A cooler C, a support frame D for supporting and fixing the height of the fixing portion 50 of the brittle substrate cutting auxiliary device X, and a vacuum pump A. The laser irradiation position by the laser irradiator L, the cooling position by the cooler C, and the suction position by the opening 11 of the suction section 10 of the brittle substrate cutting auxiliary device X are arranged in a straight line along the moving direction of the stage S. ing.
Here, a glass substrate is used as the brittle substrate to be processed. Before processing, the vertical position of the fixing portion 50 of the brittle substrate cutting auxiliary device X is adjusted by the support frame D. When the height of the fixing portion 50 is lowered, the compression coil spring of the pressing portion 40 is pressed. Since the amount of shrinkage increases, the pressure applied to the brittle substrate B by the pressurizing unit 20 is increased, and conversely, if the height of the fixing unit 50 is decreased, the amount of compression of the compression coil spring of the pressing unit 40 is reduced. The pressure applied to the brittle substrate B by the pressure unit 20 is weakened.

  First, the brittle substrate B on which minute cracks are formed at the tip position of the cutting line is fixed to the stage S so that the cutting line passes through the laser irradiation position of the laser irradiator L. In this state, the stage S is moved in the direction of the arrow in the figure. Thereby, first, a laser is irradiated by the laser irradiator L along the cutting line, and immediately after that, the cutting line is cooled by the cooling device C. Thereby, a crack is generated inside the cutting line on the brittle substrate B. Further, the brittle substrate cutting auxiliary device X bends the glass in a direction that promotes a crack generated in the brittle substrate B. Specifically, as indicated by the imaginary line in FIG. 2, when the brittle substrate B is positioned under the brittle substrate cutting auxiliary device B, the roller of the pressing unit 20 suppresses the brittle substrate B and the suction unit 10 is brittle. Suck the substrate B. In the brittle substrate B, the point where the roller of the pressing unit 20 is pressing becomes a pressing point B2 as a fixed point, and the point sucked up by the suction unit 10 becomes a suction point B1 as a bending addition point. The pressurization point B2 and the suction point B1 are separated by about 10 mm to 20 mm. Thereby, the crack which generate | occur | produced in the cutting line of the brittle board | substrate B becomes large, and reaches the lower surface side.

FIGS. 4A to 4D schematically show how the brittle substrate B is cut. First, as shown in FIG. 4A, a minute crack is formed in the brittle substrate B. Here, when the laser is irradiated, the brittle substrate B is heated from the surface and expands as shown in FIG. Next, when this portion is rapidly cooled, as shown in FIG. 4C, the brittle substrate is cracked from the crack portion, and the crack is generated from the surface toward the inside. Here, since the brittle substrate cutting auxiliary device X bends the glass so that the crack is promoted in the brittle substrate B having cracks, the cracks reach the lower surface as shown in FIG. By performing this operation over the entire cutting line, the brittle substrate B can be cut in a full body.
By using this method, the processing speed for cutting the brittle substrate can be improved. For example, when a full-body cut is performed on a 0.7-t plate glass by a conventional method, 90 mm / sec to 120 mm / sec. Although the moving speed of the degree is the limit value, a full body cut of 300 mm / sec could be realized by using this apparatus.

The above operation will be described with a simplified model. First, the amount of expansion of the heated portion by laser heating is as follows. That is, from the linear expansion formula R = R0 (1 + αt) (α: linear expansion coefficient), the actual expansion amount ΔR by laser heating is ΔR = R0 · αt, where the laser beam width is R0.
Next, the elongation amount ΔD from the pressurization point to the suction point by this apparatus is obtained by approximating the deformation of the substrate to a right triangle composed of the pressurization point, the suction point, and the transition point of the substrate shown in FIG. (L0) ² + (L1) ² ) −L0 (L0: distance from the suction point to the pressurization point, L1: displacement of the substrate at the suction point). (Assuming that the pressure point does not move).
Of these, the amount of elongation ΔL for the laser beam width R portion is
ΔL = 2 ・ ΔD ・ (R0 / 2L0)
= 2 ・ ((√ (L0) ² + (L1) ² ) −L0) ・ (R0 / 2L0)
= (√ (L0) ² + (L1) ² ) · (R0 / L0) −R0
It becomes. That is, ΔL increased by curving can be added to the expansion ΔR generated by the original heating, and thereby the thermal shock force can be increased.

(Embodiment 2)
FIG. 6 shows a perspective view of the brittle substrate cutting auxiliary device Y according to the second embodiment, and FIG. 7 shows a front view of the brittle substrate cutting auxiliary device Y. The difference between the brittle substrate cutting assisting device Y and the brittle substrate cutting assisting device X according to the first embodiment is that the pressurizing unit 60 pressurizes with a roller and pressurizes by blowing air. It is a point which has. Since other configurations are the same as those of the brittle substrate cutting auxiliary device X according to the first embodiment, the description thereof is omitted.

  The pressure unit 60 is provided at two locations on both sides of the suction unit 10. Each pressurizing unit 60 has an opening 61 provided on the lower surface of the main body 30, a conduction portion 62 formed in the main body 30 communicating from the opening 61 to the back surface of the main body 30, and an opening on the back side of the conduction portion 62. And an air tube 63 to be connected. An air compressor is connected to the proximal end side of the air tube 63. The opening 11 of the suction unit 10 and the opening 61 of the pressurizing unit 60 are spaced from each other by about 10 mm to 20 mm.

Next, the operation of the brittle substrate cutting auxiliary device Y will be described. FIG. 8 is a side view schematically showing a brittle substrate cutting device Q having a brittle substrate cutting auxiliary device Y. The brittle substrate cutting apparatus Q has substantially the same configuration as the brittle substrate cutting apparatus P according to the first embodiment, but includes a brittle substrate cutting auxiliary device Y instead of the brittle substrate cutting auxiliary device X, and an air compressor A2. It differs in that it has
In use, the vertical position of the fixing portion 60 of the brittle substrate cutting auxiliary device Y is adjusted by the support frame D, and the cutting line is irradiated with the laser beam on the brittle substrate B in which minute cracks are formed at the tip position of the cutting line. The stage L is fixed to the stage S so as to pass through the laser irradiation position. Thereafter, the stage S is moved in the direction of the arrow in the figure. Thereby, first, a laser is irradiated by the laser irradiator L along the cutting line, and immediately after that, the cutting line is cooled by the cooling device C. Thereby, a crack is generated inside the cutting line on the brittle substrate B. Further, the brittle substrate cutting auxiliary device Y sucks the suction point which becomes the bending addition point on the cutting line by the suction unit 10, and the pressurizing unit 60 blows and fixes air to the pressurizing points located on both sides of the suction point. By fixing the pressure point to be a point so as not to move upward, the brittle substrate B is bent in a direction that promotes a crack generated in the brittle substrate B. Thereby, the crack which generate | occur | produced in the cutting line of the brittle board | substrate B becomes large, and reaches the lower surface side.
Since the brittle substrate cutting auxiliary device Y according to the present embodiment does not physically touch the brittle substrate, it does not apply excessive addition to the brittle substrate and makes fine adjustment of the applied pressure relatively easy. be able to.

(Embodiment 3)
In each of the above-described embodiments, the number of the opening portions 11 of the suction unit 10 is one, but two of them may be provided with the cooler C of the brittle substrate cutting apparatus interposed therebetween. A side view schematically showing the configuration of the brittle substrate cutting auxiliary device R having the brittle substrate cutting auxiliary device Z having the configuration according to FIG. 9 is shown, and FIG. 10 shows a bottom view of the brittle substrate cutting auxiliary device Z.
The brittle substrate cutting assisting device Z has two openings 71a and 71b arranged in the direction along the cutting line of the brittle substrate that cuts the lower surface of the main body 30 as the suction portion 70. A cooler C is provided between the openings 71a and 71b in the main body 30, and the space between the openings 71a and 71b is a cooling position. And the conduction | electrical_connection part 72a, 72b formed in the main body 30 connected to the back surface of the main body 30 from each opening part 71a, 71b, and the air tube 73a connected to the opening of the back side of each conduction | electrical_connection part 72a, 72b. 73b. Each air tube 73a, 73b is connected to the vacuum pump Ax of the brittle substrate cutting apparatus R, and it is possible to switch from which opening the suction is performed by a switching valve (not shown) in the vacuum pump Ax.
Further, the brittle substrate auxiliary device Z is provided with two sets of roller bodies 80 a and 80 b constituting the pressurizing unit 80 so as to correspond to the positions of the openings 71 a and 71 b of the suction unit 70.

The operation of the brittle substrate cutting device R having the brittle substrate cutting auxiliary device Z having such a configuration is basically the same as the brittle substrate cutting devices P and Q according to the first and second embodiments, but the brittle substrate B There is a feature in that the suction positions by the suction portions 71a and 71b are switched in accordance with the positions. That is, initially, by performing suction by the suction portion 71a on the side closer to the heating device L, even when the cutting line end near the front end edge of the brittle substrate B is cooled, the cooling position It is possible to give a deflection to. Then, after the brittle substrate B has advanced to some extent, switching to suction by the suction portion 71b far from the heating device L, and the cutting line end near the rear end edge in the traveling direction of the brittle substrate B is also cooled. The bending can be imparted to the cooling position.
As described above, the brittle substrate cutting assist device Z according to the present embodiment is provided with two openings of the suction part so as to sandwich the cooling position, and by appropriately switching the suction position, appropriate cutting assistance particularly at the end position. It can be performed.

(Embodiment 4)
In the third embodiment, the openings 71a and 71b of the suction unit 70 are provided so that the cooling position is sandwiched in the front-rear direction with respect to the traveling direction of the brittle substrate. It can also be provided so as to be sandwiched between. A side view schematically showing the configuration of the brittle substrate cutting device S having the brittle substrate cutting auxiliary device W having the configuration according to FIG. 11 is shown, and FIG. 12 shows a bottom view of the brittle substrate cutting auxiliary device W.
The brittle substrate cutting auxiliary device W has two openings 91 a and 91 b that are arranged on the lower surface of the main body 30 on the lower surface of the main body 30 along the cutting line of the brittle substrate. A cooler C is provided between the openings 91a and 91b in the main body 30, and the space between the openings 91a and 91b is a cooling position. An opening portion 91a, 91b communicates with one opening on the back side of the main body 30, and a moving portion 92 that is internally divided into two and an air tube 93 connected to the opening portion on the back side of the conducting portion 92 are provided. It is done. The air tube 93 is connected to the vacuum pump A.

  The operation of the brittle substrate cutting apparatus R having the brittle substrate cutting auxiliary device Z having such a configuration is the same as that of the brittle substrate cutting apparatuses P and Q according to the first and second embodiments, but the brittle substrate by the suction unit 90 is used. It is characterized in that the upper suction point is two points across the cutting line. With such a configuration, the position where the line segment connecting the two suction points by the openings 91a and 91b intersects the cutting line is the cooling position, so the brittle substrate cutting device S according to the present embodiment is on the cutting line. Deflection can be imparted to the cooling position almost simultaneously with cooling.

In the third and fourth embodiments, a roller is used as the pressure unit. However, as shown in the second embodiment, a configuration in which pressure is applied by blowing air may be employed. In addition, as shown in the third embodiment, two or more sets of pressurizing units may be provided so as to have a plurality of fixing points, and this is the same even in the case of applying pressure by blowing air shown in the second embodiment. Further, when a plurality of fixed points are provided, the pressure points may be changed as appropriate in addition to the case where pressure is applied simultaneously.
Further, in each of the above embodiments, the method of sucking the substrate is adopted as the deflection adding means. However, a slit is provided at a position located below the cutting line of the stage S, and a roller is pressed from below or air is supplied. You may make it push up below a cutting line by spraying.
Furthermore, in each said embodiment, it is set as the structure which provides bending to the location which is cooling in the cooling position, but it leaves | separated to the advancing direction side (direction which goes to a cooling position from a heating position) rather than a cooling position, You may make it provide bending. In this case, the action of the brittle substrate cutting assisting device does not assist the progress of cracks due to cooling, but breaks by bending the scribe line generated by cooling as in the prior art.

1 is a perspective view showing a brittle substrate cutting auxiliary device according to Embodiment 1. FIG. It is a front view of the brittle board | substrate cutting auxiliary device which concerns on Embodiment 1. FIG. It is a side view which shows typically the brittle board | substrate cutting device which has the brittle board | substrate cutting auxiliary device which concerns on Embodiment 1. FIG. (A)-(d) is a longitudinal cross-sectional view which shows a mode that a brittle board | substrate is cut | disconnected. It is a figure which shows the model for calculating the elongation by bending. It is a perspective view which shows the brittle board | substrate cutting auxiliary device which concerns on Embodiment 2. FIG. It is a front view of the brittle board | substrate cutting auxiliary device which concerns on Embodiment 2. FIG. It is a side view which shows typically the brittle substrate cutting device which has the brittle substrate cutting auxiliary device which concerns on Embodiment 2. FIG. It is a side view which shows typically the brittle board | substrate cutting device which has the brittle board | substrate cutting auxiliary device which concerns on Embodiment 3. FIG. It is a bottom view of the brittle board | substrate cutting auxiliary device which concerns on Embodiment 3. FIG. It is a side view which shows typically the brittle substrate cutting device which has the brittle substrate cutting auxiliary device which concerns on Embodiment 4. It is a bottom view of a brittle board cutting auxiliary device concerning Embodiment 4.

Explanation of symbols

X, Y, Z, W Brittle substrate cutting auxiliary device P, Q, R, S Brittle substrate cutting device L Laser irradiator C Cooler S Stage A, Ax Vacuum pump A2 Air compressor 10, 70, 90 Suction unit 20, 60 , 80 Pressurizing unit 30 body

Claims (13)

Used in a cutting method in which a substrate made of a brittle material is heated and cooled by the processing means while moving the substrate relative to the processing means along a cutting line, and the substrate is cut by a thermal shock force generated at this time. A cutting assistance device,
A deflection adding means for applying a force to the deflection addition point in a direction in which the deflection addition point, which is a point on or near the cutting line that moves as the substrate moves, moves to one surface side of the substrate;
The brittle board | substrate cutting | disconnection assistance apparatus which has a fixing means which fixes the fixing point which exists in the both sides of the said bending addition point so that it may not move to the said direction. The deflection adding means has a suction part that sucks by depressurizing the vicinity of the surface including the deflection addition point of the substrate in a non-contact state with the substrate,
2. The brittleness according to claim 1, wherein the fixing means includes a pressurizing unit configured to pressurize the fixing point of the substrate in a direction opposite to a direction sucked by the suction unit and to be movable on the substrate. Substrate cutting assist device. The substrate is cooled from one surface side,
The brittle substrate cutting auxiliary device according to claim 2, wherein the bending addition point and the surface sucked by the suction portion are provided on the surface to be cooled.   The brittle substrate cutting auxiliary device according to claim 2 or 3, wherein the fixing means pressurizes the fixing point with a roller having a rotation axis parallel to the substrate and perpendicular to the cutting line.   The brittle substrate cutting auxiliary device according to claim 2 or 3, wherein the fixing means is configured to pressurize the fixing point by blowing a gas.   The brittle substrate cutting assisting device according to any one of claims 1 to 5, wherein the fixing means is formed such that a relative position of the fixing point with respect to the bending addition point is variable along the cutting line.   The brittle substrate cutting auxiliary device according to any one of claims 1 to 5, wherein the fixing means has two or more fixing points on both sides of the bending addition point.   The brittle substrate according to any one of claims 1 to 7, wherein the deflection adding means is formed such that the bending addition points are variably formed at two locations sandwiching the cooling position of the processing means in a direction along the cutting line. Cutting aid.   The brittle substrate cutting auxiliary device according to claim 1, wherein the bending addition points are provided at two points on both sides of a cooling position by the processing means inside the fixing points on both sides. A table for fixing a substrate made of a brittle material;
Heating means for heating a cutting line portion of the substrate provided at a position facing the cutting line of the substrate fixed to the table;
A cooling means for cooling a cutting line portion of the substrate provided in a direction along the cutting line of the heating means at a position facing the cutting line of the substrate fixed to the table;
Moving means for moving the table, the cooling means, and the heating means along the cutting line relatively in a direction from the heating means to the cooling means;
A brittle substrate cutting apparatus comprising the brittle substrate cutting auxiliary device according to any one of claims 1 to 9.   The brittle substrate cutting device according to claim 10, wherein at least one of the bending addition points is provided in the vicinity of the heating unit side of the cooling position by the cooling unit. The brittle substrate cutting assist device is the brittle substrate cutting assist according to claim 9,
The brittle substrate cutting device according to claim 10, wherein the bending addition point is provided so that a line segment connecting the two bending addition points passes through a cooling position by the cooling means.   The brittle substrate cutting device according to claim 10, wherein the bending addition point is provided on a side opposite to the heating unit side of a cooling position by the cooling unit.

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