TWI365175B - Method and device for vibration assistant scribing process on a substrate - Google Patents
Method and device for vibration assistant scribing process on a substrateInfo
- Publication number
- TWI365175B TWI365175B TW097149349A TW97149349A TWI365175B TW I365175 B TWI365175 B TW I365175B TW 097149349 A TW097149349 A TW 097149349A TW 97149349 A TW97149349 A TW 97149349A TW I365175 B TWI365175 B TW I365175B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- scribing process
- vibration assistant
- assistant
- vibration
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0341—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0385—Rotary scoring blade
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097149349A TWI365175B (en) | 2008-12-18 | 2008-12-18 | Method and device for vibration assistant scribing process on a substrate |
US12/591,811 US20100154614A1 (en) | 2008-12-18 | 2009-12-02 | Method and device for vibration Assisted scribing process on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097149349A TWI365175B (en) | 2008-12-18 | 2008-12-18 | Method and device for vibration assistant scribing process on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201024238A TW201024238A (en) | 2010-07-01 |
TWI365175B true TWI365175B (en) | 2012-06-01 |
Family
ID=42264176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097149349A TWI365175B (en) | 2008-12-18 | 2008-12-18 | Method and device for vibration assistant scribing process on a substrate |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100154614A1 (en) |
TW (1) | TWI365175B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI555623B (en) * | 2012-02-27 | 2016-11-01 | Mitsuboshi Diamond Ind Co Ltd | Method of cutting ceramic substrate |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006012582B4 (en) * | 2006-03-16 | 2010-01-21 | Schott Ag | Apparatus and method for separating sections of glass rods |
KR101064977B1 (en) * | 2011-05-04 | 2011-09-15 | (주)아이에스티 코리아 | Processing machine for thin type light guiding plate marked intaglio dot pattern |
DE102011089356A1 (en) * | 2011-12-21 | 2013-06-27 | Wacker Chemie Ag | Polycrystalline silicon piece and method of breaking a silicon body |
JP6357746B2 (en) * | 2013-09-24 | 2018-07-18 | 三星ダイヤモンド工業株式会社 | Scribing wheel, holder unit, scribing device, scribing wheel manufacturing method and scribing method |
JP6201608B2 (en) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | Scribing method |
US10173316B2 (en) * | 2015-02-26 | 2019-01-08 | Wolfram Labs, Inc. | Marking stylus for automated marking systems |
JP6736151B2 (en) * | 2015-06-30 | 2020-08-05 | 三星ダイヤモンド工業株式会社 | Cutter wheel and manufacturing method thereof |
CN105417945B (en) * | 2015-12-29 | 2018-09-14 | 郑州旭飞光电科技有限公司 | The cutter holder assembly and knife rest of glass substrate marking-out cutter |
JP6422009B2 (en) * | 2017-12-29 | 2018-11-14 | 三星ダイヤモンド工業株式会社 | Scribing wheel and manufacturing method thereof |
US10656335B2 (en) * | 2018-07-18 | 2020-05-19 | International Business Machines Corporation | Cleaving fibers of differing composition |
US10611000B1 (en) * | 2019-04-16 | 2020-04-07 | Thomas E. Foster | Flexible sanding block using hook and loop fastener |
TWI754192B (en) * | 2019-12-13 | 2022-02-01 | 孫春雨 | Cutter wheel capable of adjusting blade sharpness through changing blade included angles |
WO2021183291A1 (en) * | 2020-03-12 | 2021-09-16 | Corning Incorporated | Systems and methods for separating glass substrates |
-
2008
- 2008-12-18 TW TW097149349A patent/TWI365175B/en active
-
2009
- 2009-12-02 US US12/591,811 patent/US20100154614A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI555623B (en) * | 2012-02-27 | 2016-11-01 | Mitsuboshi Diamond Ind Co Ltd | Method of cutting ceramic substrate |
Also Published As
Publication number | Publication date |
---|---|
TW201024238A (en) | 2010-07-01 |
US20100154614A1 (en) | 2010-06-24 |
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