TWI365175B - Method and device for vibration assistant scribing process on a substrate - Google Patents

Method and device for vibration assistant scribing process on a substrate

Info

Publication number
TWI365175B
TWI365175B TW097149349A TW97149349A TWI365175B TW I365175 B TWI365175 B TW I365175B TW 097149349 A TW097149349 A TW 097149349A TW 97149349 A TW97149349 A TW 97149349A TW I365175 B TWI365175 B TW I365175B
Authority
TW
Taiwan
Prior art keywords
substrate
scribing process
vibration assistant
assistant
vibration
Prior art date
Application number
TW097149349A
Other languages
English (en)
Other versions
TW201024238A (en
Inventor
Yunn Shiuan Liao
Yu Sheng Hsu
Saw Chi Mya
Original Assignee
Univ Nat Taiwan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Taiwan filed Critical Univ Nat Taiwan
Priority to TW097149349A priority Critical patent/TWI365175B/zh
Priority to US12/591,811 priority patent/US20100154614A1/en
Publication of TW201024238A publication Critical patent/TW201024238A/zh
Application granted granted Critical
Publication of TWI365175B publication Critical patent/TWI365175B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
TW097149349A 2008-12-18 2008-12-18 Method and device for vibration assistant scribing process on a substrate TWI365175B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097149349A TWI365175B (en) 2008-12-18 2008-12-18 Method and device for vibration assistant scribing process on a substrate
US12/591,811 US20100154614A1 (en) 2008-12-18 2009-12-02 Method and device for vibration Assisted scribing process on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097149349A TWI365175B (en) 2008-12-18 2008-12-18 Method and device for vibration assistant scribing process on a substrate

Publications (2)

Publication Number Publication Date
TW201024238A TW201024238A (en) 2010-07-01
TWI365175B true TWI365175B (en) 2012-06-01

Family

ID=42264176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097149349A TWI365175B (en) 2008-12-18 2008-12-18 Method and device for vibration assistant scribing process on a substrate

Country Status (2)

Country Link
US (1) US20100154614A1 (zh)
TW (1) TWI365175B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555623B (zh) * 2012-02-27 2016-11-01 Mitsuboshi Diamond Ind Co Ltd Method of cutting ceramic substrate

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006012582B4 (de) * 2006-03-16 2010-01-21 Schott Ag Vorrichtung und Verfahren zum Abtrennen von Abschnitten von Glasstangen
KR101064977B1 (ko) * 2011-05-04 2011-09-15 (주)아이에스티 코리아 음각 도트 패턴이 각인된 박판형 도광판 가공 장치
DE102011089356A1 (de) * 2011-12-21 2013-06-27 Wacker Chemie Ag Polykristallines Siliciumstück und Verfahren zum Brechen eines Siliciumkörpers
JP6357746B2 (ja) * 2013-09-24 2018-07-18 三星ダイヤモンド工業株式会社 スクライビングホイール、ホルダユニット、スクライブ装置、スクライビングホイールの製造方法及びスクライブ方法
JP6201608B2 (ja) * 2013-10-08 2017-09-27 三星ダイヤモンド工業株式会社 スクライブ方法
US10173316B2 (en) * 2015-02-26 2019-01-08 Wolfram Labs, Inc. Marking stylus for automated marking systems
JP6736151B2 (ja) * 2015-06-30 2020-08-05 三星ダイヤモンド工業株式会社 カッターホイール並びにその製造方法
CN105417945B (zh) * 2015-12-29 2018-09-14 郑州旭飞光电科技有限公司 玻璃基板划线切割装置的刀架总成和刀架
JP6422009B2 (ja) * 2017-12-29 2018-11-14 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
US10656335B2 (en) * 2018-07-18 2020-05-19 International Business Machines Corporation Cleaving fibers of differing composition
US10611000B1 (en) * 2019-04-16 2020-04-07 Thomas E. Foster Flexible sanding block using hook and loop fastener
TWI754192B (zh) * 2019-12-13 2022-02-01 孫春雨 透過刀鋒夾角調整鋒利度之切割刀輪
KR20220152305A (ko) * 2020-03-12 2022-11-15 코닝 인코포레이티드 유리 기판들을 분리하기 위한 시스템들 및 방법들

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555623B (zh) * 2012-02-27 2016-11-01 Mitsuboshi Diamond Ind Co Ltd Method of cutting ceramic substrate

Also Published As

Publication number Publication date
US20100154614A1 (en) 2010-06-24
TW201024238A (en) 2010-07-01

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