EP2458628A4 - Substrate holder system, substrate joining apparatus and method for manufacturing a device - Google Patents

Substrate holder system, substrate joining apparatus and method for manufacturing a device

Info

Publication number
EP2458628A4
EP2458628A4 EP20100802073 EP10802073A EP2458628A4 EP 2458628 A4 EP2458628 A4 EP 2458628A4 EP 20100802073 EP20100802073 EP 20100802073 EP 10802073 A EP10802073 A EP 10802073A EP 2458628 A4 EP2458628 A4 EP 2458628A4
Authority
EP
Grant status
Application
Patent type
Prior art keywords
substrate
manufacturing
device
method
holder system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20100802073
Other languages
German (de)
French (fr)
Other versions
EP2458628A1 (en )
Inventor
Isao Sugaya
Junichi Chonan
Hidehiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185Joining of semiconductor bodies for junction formation
    • H01L21/187Joining of semiconductor bodies for junction formation by direct bonding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833Details of electrostatic chucks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1744Means bringing discrete articles into assembled relationship
EP20100802073 2009-07-21 2010-07-21 Substrate holder system, substrate joining apparatus and method for manufacturing a device Pending EP2458628A4 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009170513 2009-07-21
JP2009253438 2009-11-04
PCT/JP2010/004659 WO2011010452A1 (en) 2009-07-21 2010-07-21 Substrate holder system, substrate joining apparatus and method for manufacturing a device

Publications (2)

Publication Number Publication Date
EP2458628A1 true EP2458628A1 (en) 2012-05-30
EP2458628A4 true true EP2458628A4 (en) 2016-12-21

Family

ID=43498934

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20100802073 Pending EP2458628A4 (en) 2009-07-21 2010-07-21 Substrate holder system, substrate joining apparatus and method for manufacturing a device

Country Status (6)

Country Link
US (1) US9054140B2 (en)
EP (1) EP2458628A4 (en)
JP (1) JP5810914B2 (en)
KR (1) KR20120037999A (en)
CN (1) CN102498559B (en)
WO (1) WO2011010452A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011115498A1 (en) * 2011-10-11 2012-12-20 Carl Zeiss Smt Gmbh Storage device e.g. wafer stage for mounting substrate e.g. wafer in microlithography projection exposure system, has coupling unit arranged such that fixing unit is coupled by magnetic forces to supporting unit
CN105074898A (en) 2013-03-27 2015-11-18 Ev 集团 E·索尔纳有限责任公司 Receptacle device, device and method for handling substrate stacks
US9947637B2 (en) 2013-11-01 2018-04-17 Nikon Corporation System and method for clamping wafers together in alignment using pressure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040073087A (en) * 2003-02-13 2004-08-19 삼성전자주식회사 Wafer holder
WO2009057710A1 (en) * 2007-10-30 2009-05-07 Nikon Corporation Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JP2673239B2 (en) * 1988-11-07 1997-11-05 東京エレクトロン株式会社 Processing equipment
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP3296108B2 (en) * 1994-08-08 2002-06-24 神鋼電機株式会社 Container for the electronic board
JPH11261000A (en) 1998-03-13 1999-09-24 Japan Science & Technology Corp Manufacture of three-dimensional semiconductor integrated-circuit device
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通ヴィエルエスアイ株式会社 Bonded substrate manufacturing apparatus and a substrate laminating method pasting
CN1325981C (en) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 Working platform structure of binding machine and its control method
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
JP4626160B2 (en) 2004-03-04 2011-02-02 株式会社ニコン How superimposed wafers and wafer overlay device
JP4465225B2 (en) * 2004-05-28 2010-05-19 有限会社都波岐精工 Substrate bonding device, the substrate joining method and a recording disc manufacturing method
JP4548239B2 (en) * 2005-06-21 2010-09-22 パナソニック株式会社 Substrate bonding method and a substrate joining apparatus
JP4107316B2 (en) 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー Substrate bonding apparatus
JP2007115978A (en) 2005-10-21 2007-05-10 Nikon Corp Pressure device and semiconductor device manufacturing method
US7245350B2 (en) * 2005-11-11 2007-07-17 Canon Kabushiki Kaisha Exposure apparatus
JP2008087847A (en) * 2006-10-05 2008-04-17 Clean Surface Gijutsu:Kk Substrate board storage case
JP2008140986A (en) * 2006-12-01 2008-06-19 Murata Mach Ltd Single wafer transfer tray

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040073087A (en) * 2003-02-13 2004-08-19 삼성전자주식회사 Wafer holder
WO2009057710A1 (en) * 2007-10-30 2009-05-07 Nikon Corporation Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
US20100206454A1 (en) * 2007-10-30 2010-08-19 Maeda Hidehiro Substrate holding unit, substrate bonding apparatus, multi-layered substrate manufacturing apparatus, substrate bonding method, multi-layered substrate manufacturing method, and multi-layered semiconductor apparatus manufacturing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011010452A1 *

Also Published As

Publication number Publication date Type
CN102498559B (en) 2016-03-02 grant
US9054140B2 (en) 2015-06-09 grant
JPWO2011010452A1 (en) 2012-12-27 application
WO2011010452A1 (en) 2011-01-27 application
KR20120037999A (en) 2012-04-20 application
US20120205024A1 (en) 2012-08-16 application
EP2458628A1 (en) 2012-05-30 application
JP5810914B2 (en) 2015-11-11 grant
CN102498559A (en) 2012-06-13 application

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Legal Events

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Owner name: NIKON CORPORATION

RA4 Despatch of supplementary search report

Effective date: 20161123

RIC1 Classification (correction)

Ipc: H01L 21/18 20060101ALI20161117BHEP

Ipc: H01L 21/683 20060101AFI20161117BHEP

Ipc: H01L 21/67 20060101ALI20161117BHEP

Ipc: H01L 21/02 20060101ALI20161117BHEP

17Q First examination report

Effective date: 20180813