EP2458628A4 - Substrate holder system, substrate joining apparatus and method for manufacturing a device - Google Patents

Substrate holder system, substrate joining apparatus and method for manufacturing a device

Info

Publication number
EP2458628A4
EP2458628A4 EP10802073.6A EP10802073A EP2458628A4 EP 2458628 A4 EP2458628 A4 EP 2458628A4 EP 10802073 A EP10802073 A EP 10802073A EP 2458628 A4 EP2458628 A4 EP 2458628A4
Authority
EP
European Patent Office
Prior art keywords
substrate
manufacturing
joining apparatus
holder system
substrate holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10802073.6A
Other languages
German (de)
French (fr)
Other versions
EP2458628A1 (en
Inventor
Isao Sugaya
Junichi Chonan
Hidehiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of EP2458628A1 publication Critical patent/EP2458628A1/en
Publication of EP2458628A4 publication Critical patent/EP2458628A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
EP10802073.6A 2009-07-21 2010-07-21 Substrate holder system, substrate joining apparatus and method for manufacturing a device Withdrawn EP2458628A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009170513 2009-07-21
JP2009253438 2009-11-04
PCT/JP2010/004659 WO2011010452A1 (en) 2009-07-21 2010-07-21 Substrate holder system, substrate joining apparatus and method for manufacturing a device

Publications (2)

Publication Number Publication Date
EP2458628A1 EP2458628A1 (en) 2012-05-30
EP2458628A4 true EP2458628A4 (en) 2016-12-21

Family

ID=43498934

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10802073.6A Withdrawn EP2458628A4 (en) 2009-07-21 2010-07-21 Substrate holder system, substrate joining apparatus and method for manufacturing a device

Country Status (8)

Country Link
US (1) US9054140B2 (en)
EP (1) EP2458628A4 (en)
JP (1) JP5810914B2 (en)
KR (1) KR20120037999A (en)
CN (1) CN102498559B (en)
IN (1) IN2012DN01481A (en)
TW (1) TW201131689A (en)
WO (1) WO2011010452A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011115498A1 (en) * 2011-10-11 2012-12-20 Carl Zeiss Smt Gmbh Storage device e.g. wafer stage for mounting substrate e.g. wafer in microlithography projection exposure system, has coupling unit arranged such that fixing unit is coupled by magnetic forces to supporting unit
SG2014013023A (en) * 2013-03-27 2015-02-27 Ev Group E Thallner Gmbh Retaining system, device and method for handling substrate stacks
US9947637B2 (en) 2013-11-01 2018-04-17 Nikon Corporation System and method for clamping wafers together in alignment using pressure
EP3103135B1 (en) * 2014-02-03 2021-05-12 Ev Group E. Thallner GmbH Method and device for bonding substrates
JP6378942B2 (en) 2014-06-12 2018-08-22 東京エレクトロン株式会社 Mounting table and plasma processing apparatus
SG11201603148VA (en) 2014-12-18 2016-07-28 Ev Group E Thallner Gmbh Method for bonding substrates
CN109791898B (en) 2016-09-29 2023-02-03 Ev 集团 E·索尔纳有限责任公司 Apparatus and method for bonding two substrates
JP6516889B2 (en) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Housing system and apparatus and method for handling substrate stacks

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040073087A (en) * 2003-02-13 2004-08-19 삼성전자주식회사 Wafer holder
WO2009057710A1 (en) * 2007-10-30 2009-05-07 Nikon Corporation Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JP2673239B2 (en) * 1988-11-07 1997-11-05 東京エレクトロン株式会社 Processing equipment
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP3296108B2 (en) * 1994-08-08 2002-06-24 神鋼電機株式会社 Electronic board container
JPH11261000A (en) 1998-03-13 1999-09-24 Japan Science & Technology Corp Manufacture of three-dimensional semiconductor integrated-circuit device
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method
US7040525B2 (en) 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
CN1325981C (en) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 Working platform structure of binding machine and its control method
JP4626160B2 (en) * 2004-03-04 2011-02-02 株式会社ニコン Wafer overlay method and wafer overlay apparatus
JP4465225B2 (en) * 2004-05-28 2010-05-19 有限会社都波岐精工 Substrate bonding apparatus, substrate bonding method, and recording disk manufacturing method
JP4548239B2 (en) * 2005-06-21 2010-09-22 パナソニック株式会社 Substrate bonding method and substrate bonding apparatus
JP4107316B2 (en) 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー Board bonding equipment
JP2007115978A (en) 2005-10-21 2007-05-10 Nikon Corp Pressure device and semiconductor device manufacturing method
US7245350B2 (en) * 2005-11-11 2007-07-17 Canon Kabushiki Kaisha Exposure apparatus
JP2008087847A (en) * 2006-10-05 2008-04-17 Clean Surface Gijutsu:Kk Substrate board storage case
JP2008140986A (en) * 2006-12-01 2008-06-19 Murata Mach Ltd Single wafer transfer tray

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040073087A (en) * 2003-02-13 2004-08-19 삼성전자주식회사 Wafer holder
WO2009057710A1 (en) * 2007-10-30 2009-05-07 Nikon Corporation Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
US20100206454A1 (en) * 2007-10-30 2010-08-19 Maeda Hidehiro Substrate holding unit, substrate bonding apparatus, multi-layered substrate manufacturing apparatus, substrate bonding method, multi-layered substrate manufacturing method, and multi-layered semiconductor apparatus manufacturing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011010452A1 *

Also Published As

Publication number Publication date
EP2458628A1 (en) 2012-05-30
US9054140B2 (en) 2015-06-09
TW201131689A (en) 2011-09-16
IN2012DN01481A (en) 2015-06-05
CN102498559B (en) 2016-03-02
CN102498559A (en) 2012-06-13
JP5810914B2 (en) 2015-11-11
KR20120037999A (en) 2012-04-20
JPWO2011010452A1 (en) 2012-12-27
WO2011010452A1 (en) 2011-01-27
US20120205024A1 (en) 2012-08-16

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20120220

AK Designated contracting states

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Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: NIKON CORPORATION

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20161123

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/18 20060101ALI20161117BHEP

Ipc: H01L 21/683 20060101AFI20161117BHEP

Ipc: H01L 21/67 20060101ALI20161117BHEP

Ipc: H01L 21/02 20060101ALI20161117BHEP

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Effective date: 20180813

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18D Application deemed to be withdrawn

Effective date: 20190515