CN104511974B - The breaking method thereof and brisement device of brittle substrate - Google Patents
The breaking method thereof and brisement device of brittle substrate Download PDFInfo
- Publication number
- CN104511974B CN104511974B CN201410378500.9A CN201410378500A CN104511974B CN 104511974 B CN104511974 B CN 104511974B CN 201410378500 A CN201410378500 A CN 201410378500A CN 104511974 B CN104511974 B CN 104511974B
- Authority
- CN
- China
- Prior art keywords
- brisement
- substrate
- convex portion
- brittle substrate
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Present invention offer is a kind of can be with brisement bar to having the breaking method thereof and brisement device that the substrate of convex portion ideally carries out brisement on surface.The breaking method thereof of the brittle substrate of the present invention, it is to being formed with convex portion (1) on the surface for the resin bed (W2) for being formed at the one side of substrate body (W1) and being formed with score line (S) brittle substrate (W) in the another side of substrate body (W1), pressed from the face of resin bed (W2) with brisement bar (9), make whereby brittle substrate (W) bend and along score line (S) brisement；Linear ridge line section (9a) in brisement bar (9) front end, part in the convex portion (1) relative to the brittle substrate (W) for brisement, formed for the embedded recess (9b) in the convex portion (1), and carry out brisement in the way of all bestowing the pressing load of equalization to the press surface of brittle substrate (W) when in the pressing of brisement bar (9).
Description
Technical field
The present invention is to being formed with the one side for the substrate body being made up of the fragile material such as glass or ceramics on a kind of
The substrate of the resin bed of silicon etc., along the score line (grooving) that is formed in substrate body substrate is carried out brisement breaking method thereof and
Brisement device.More particularly, the present invention is related to it is a kind of resin layer surface be formed with convex portion, the back side of substrate body leading portion walk
The breaking method thereof and its brisement device of the brittle substrate of score line are formed with rapid.
Background technology
It is existing known for example, being disclosed in the grade of 1~patent document of patent document 3 has in substrate surface, using break bar (also known as
Scribe wheel) or counteredge or laser beam etc. delineation means, form the score line of mutually orthogonal X-direction and Y-direction, it
Afterwards, substrate is made to bend or bend etc. by external force is applied from the face of the opposite side of score line, so that along score line brisement
Substrate, the method for taking out the unit article of chip etc..
In addition, carry out the means of brisement for making substrate be bent along score line, existing known have various means.
Fig. 6 (a), Fig. 6 (b), are the diagrams of one for representing general used breaking method thereof., will as shown in Fig. 6 (a)
Resin bed W2 substrate W ' is formed with substrate body W1 surfaces, is attached at by cut ring (dicing ring) (not shown) institute
The cutting of web (dicing tape) 16 with elastic tackness supported.Below substrate body W1, in leading portion step
Mutually orthogonal a plurality of score line S is formed with rapid, substrate W ' cutting of web 16 will be pasted with, across buffer substrate tablet
(cushion sheet) 18 and be placed on horizontal platform 17.Now, making the face for the score line S for being formed with substrate W ' turns into
Downside.Then, as shown in Fig. 6 (b), decline brisement bar 19 above substrate W ' and bend substrate W ', whereby, make substrate
Body W1 score line S cracking (crackle) is in progress toward thickness direction, also brisement resin bed while brisement substrate body W1
W2。
Fig. 7 is the diagram for representing other breaking method thereofs.In the method, above-mentioned buffer substrate tablet 18 is replaced, configuration clips delineation
Line S simultaneously bears a pair of substrate W ' and bears knife 20,20.Moreover, by from the substrate W ' for being attached at cutting of web 16 and setting
The face for having score line S is the face of opposite side, and brisement bar 19 is pressed on into substrate W ', and makes substrate W ' as described above along delineation
Line S flexures are so as to brisement.
Patent document 1：Japanese Unexamined Patent Publication 2013-071335 publications
Patent document 2：Japanese Unexamined Patent Publication 2012-131216 publications
Patent document 3：Japanese Unexamined Patent Publication 2011-212963 publications
It is that the face for the pressing of brisement bar is formed with flat face in most situations for the substrate W ' of brisement.Therefore, such as
Shown in Fig. 8, the linear front end ridge line section 19a of brisement bar 19 can be made, to substrate W ' with throughout its whole mode and with
Impartial pressing load pressing.
But according to substrate, such as shown in Fig. 1 (a), there are the periphery on resin bed W2 surface along substrate W and formed
There is convex portion 1, the X-Y side of differentiation unit article in the area encompassed of convex portion 1, is being formed with below substrate body W1
To score line S situation.
In situation so, front end ridge line section 19a is linearly formed with throughout its total length once utilizing as shown in Figure 8
Pressing Fig. 1 of brisement bar 19 (a) substrate W, the pressing force near convex portion 1 will be made compared with other parts to make to impose on substrate W by force
Load above is unequal.Accordingly, there exist point the problem of having following：The crackle that there are the score line S for making substrate body W1 is oblique
It is in progress partially, produces chip (shortcoming) etc., and situation about being irregularly cracked is produced in resin bed W2 inside and is turned into bad
Product, deteriorate product yield.
In addition, the problem of also there are following point：In the front end ridge line section 19a of the sword front end as brisement bar 19, by
The load bigger compared with other parts is born in the part for the convex portion 1 for abutting resin bed W2, therefore will be produced under repeatedly use
The abrasion of locality, and the brisement use as the substrate with flat surfaces can not be used by turning into.
The problem of existing in view of the breaking method thereof and brisement device of above-mentioned existing brittle substrate, the present inventor's base
Practical experience and professional knowledge abundant for many years is manufactured in being engaged in such product design, and coordinates the utilization of scientific principle, is actively subject to
Research and innovation, to found the breaking method thereof and brisement device of a kind of new brittle substrate, can improve general existing
The breaking method thereof and brisement device of brittle substrate, make it have more practicality.By constantly research, design, and pass through
After studying sample repeatedly and improving, the present invention having practical value is created finally.
The content of the invention
Above-mentioned problem is can solve the problem that it is an object of the invention to provide one kind and can be with brisement bar in resin layer surface
Brittle substrate with convex portion more ideally carries out the breaking method thereof and brisement device of brisement.
The object of the invention to solve the technical problems is realized using following technical scheme.According to present invention proposition
Brittle substrate breaking method thereof, be the surface of the resin bed in the one side for being formed at substrate body is formed with convex portion,
And the brittle substrate of score line is formed with the another side of the substrate body, pressed from the face of the resin bed with brisement bar
Pressure, make whereby the brittle substrate bend and along the score line brisement, it is characterised in that：Straight line in the front end of the brisement bar
Shape ridge line section, the part in the convex portion relative to the brittle substrate for brisement forms the recess being embedded in for the convex portion, and
The brisement bar press surface of brittle substrate is all bestowed in the way of impartial pressing is loaded when in the pressing of brisement bar
Row brisement.
The object of the invention to solve the technical problems is also realized using following technical scheme.According to proposed by the present invention
The brisement device of brittle substrate, be the surface of the resin bed in the one side for being formed at substrate body is formed with convex portion and
The brittle substrate of score line is formed with the another side of the substrate body, is pressed from the face of the resin bed with brisement bar
Pressure, make whereby the brittle substrate bend and along the score line brisement, it is characterised in that：Straight line in the front end of the brisement bar
Shape ridge line section, the part in the convex portion relative to the brittle substrate for brisement forms the recess being embedded in for the convex portion.
The object of the invention to solve the technical problems can be also applied to the following technical measures to achieve further.
The brisement device of foregoing brittle substrate, wherein, the depth of the recess of the brisement bar is formed as and the fragility
The height of the convex portion of material substrate is equal, the width of the recess, is formed with the size that the convex portion can be fully embedded in.
By above-mentioned technical proposal, the breaking method thereof and brisement device of brittle substrate of the present invention are at least with following excellent
Point and beneficial effect：
In the present invention, due to the front end ridge line section in brisement bar, formation can be embedded in the brittle substrate of confession brisement
The recess of convex portion, and all to bestow the pressing of equalization to the brisement bar press surface of brittle substrate in the pressing of brisement bar
The mode of load carries out brisement, therefore, it is possible to suppress because such as existing known load is unequal to cause irregularly in brisement
The generation of cracking and chip is produced in disjunction face, and along score line can more ideally carry out brisement to brittle substrate.
Brisement bar can be made to press the convex portion of brittle substrate and flat surface portion with impartial load, and
It can prevent the recess of brisement bar from touching the edge of convex portion at the convex portion of embedded brittle substrate and producing the bad of breakage
Situation.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, and in order to allow the above and other objects, features and advantages of the present invention can
Become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Brief description of the drawings
Fig. 1 (a) is to represent the diagram of one by the breaking method thereof of the present invention and the substrate of brisement device brisement.
Fig. 1 (b) is to represent the diagram of one by the breaking method thereof of the present invention and the substrate of brisement device brisement.
Fig. 1 (c) is to represent the diagram of one by the breaking method thereof of the present invention and the substrate of brisement device brisement.
Fig. 2 is the stereogram of one for representing the brisement device of the present invention.
Fig. 3 (a) is to represent the diagram using one of Fig. 2 brisement step of brisement device progress.
Fig. 3 (b) is to represent the diagram using one of Fig. 2 brisement step of brisement device progress.
Fig. 4 is the stereogram for representing to be pasted with the state of substrate in cutting of web.
Fig. 5 (a) is to represent the profile using one of Fig. 2 brisement step of brisement device progress.
Fig. 5 (b) is to represent the profile using one of Fig. 2 brisement step of brisement device progress.
Fig. 6 (a) is the explanation figure of one for representing existing known general breaking method thereof.
Fig. 6 (b) is the explanation figure of one for representing existing known general breaking method thereof.
Fig. 7 is other the explanation figure for representing existing known breaking method thereof.
Fig. 8 is the profile for the form for illustrating the brisement bar in existing known breaking method thereof.
【Main element symbol description】
A:Brisement device S:Score line
W:Brittle substrate W1:Substrate body
W2:Resin bed W ':Substrate
H:The depth h of recess:The height of convex portion
L1:The width L2 of recess:The width of convex portion
1:Convex portion 2:Platform
3:Guide rail 4:Screw shaft
5:Rotary driving part 6:Supporting pillar
7:Beam 8:Fluid cylinder
9:Brisement bar 9a:The linear ridge line section of brisement bar
9b:The recess 10 of brisement bar:Cut ring
11:Cutting of web 12:Buffer substrate tablet
13:Bridge portion 16:Cutting of web
17:Platform 18:Buffer substrate tablet
19:Brisement bar 19a:The front end ridge line section of brisement bar
20:Bear knife
Embodiment
Further to illustrate the present invention to reach the technological means and effect that predetermined goal of the invention is taken, below in conjunction with
Accompanying drawing and preferred embodiment, to its specific implementation of the breaking method thereof according to brittle substrate proposed by the present invention and brisement device
Mode, method, step, feature and its effect, are described in detail as after.
Hereinafter, according to implementations of the Fig. 1 (a) to Fig. 5 (b) for the substrate breaking method thereof and substrate brisement device of the present invention
Mode is illustrated.Fig. 1 (a)~Fig. 1 (c) is one of the form for representing the brittle substrate W by brisement of the present invention
Diagram.Brittle substrate W, is the substrate body W1 being made up of the fragile material such as glass or ceramics and is formed at the substrate sheet
The resin bed W2 of silicon above body W1 etc. is constituted.On resin bed W2 surface, such as Fig. 1 (a) stereogram, Fig. 1 (b) section
Shown in figure, Fig. 1 (c) top view, convex portion 1 is formed in the way of describing dimetric loop (l oop) along periphery above,
In the area encompassed of convex portion 1, the X-Y side for distinguishing unit article is formed in leading portion step below substrate body W1
To score line S.Hereinafter, brittle substrate W is referred to as into " substrate W ".
Fig. 2 is the diagram of one for representing the brisement device A of the present invention.
Brisement device A, possessing has the platform 2 for loading and keeping substrate W.Platform 2, as can be along the guide rail 3 of level in Y side
Driven to movement, and by the screw shaft 4 rotated using motor M.Further, platform 2, as can be by interior tangun
The rotary driving part 5 that reaches and turn in the horizontal plane.
Constituted by the supporting pillar 6,6 for the both sides for clipping platform 2 and setting and in the horizontal-extending beam of X-direction (crossbeam) 7
Bridge portion 13, be arranged to span on platform 2.In beam 7, the strip plate moved by fluid cylinder 8 towards platform about 2 is provided with
The brisement bar 9 of shape.Brisement bar 9, possessing in its lower end has the linear ridge line section 9a that leading section attenuates.Ridge line section 9a
Commitment positions that is, the convex portion 1 in following brisement action relative to the substrate W being placed on platform 2 position, set
There is the recess 9b (reference picture 3 (a)) being embedded in for convex portion 1.
As shown in Fig. 3 (a), the recess 9b of brisement bar 9 depth H is equal with the height h of substrate W convex portion 1, recess 9b's
Width L1, is formed as the width L2 length somewhat compared with convex portion 1 in the way of substrate W convex portion 1 can be fully embedded in.
When carrying out brisement to substrate W, first, as shown in figure 4, substrate W is attached in the way of score line S turns into lower section
In the cutting of web 11 with elastic tackness supported by cut ring 10.Then as shown in Fig. 3 (a), it will attach
There is substrate W cutting of web 11, be held in across the mounting of buffer substrate tablet 12 on brisement device A platform 2.Now, make to be formed with
Substrate W score line S face turns into downside.
Then as shown in Fig. 3 (b), brisement bar 9 is declined towards score line S above substrate W and press substrate W, make
Score line S bends on buffer substrate tablet 12 and score line S cracking is impregnated with and brisement substrate W toward thickness direction.
When carrying out brisement using the brisement bar 9, shown in such as Fig. 5 (a), Fig. 5 (b), because substrate W convex portion 1 is embedded in
The recess 9b of brisement bar 9, and recess 9b depth H is formed as equal with the height h of convex portion 1, therefore make the recess of brisement bar 9
Pressings of the 9b and linear ridge line section 9a to substrate W loads impartial.Whereby, can will not just like it is existing it is known because load not
Impartial and from substrate body W1 score line S departs from and produces irregular tortoise in oblique inclined ground brisement or in resin bed W2 inside
When splitting, brisement is more ideally carried out along score line S to substrate W.
In the present invention, in the above-described embodiments, though being that buffer substrate tablet 12 is equipped with below substrate W, by with brisement
Bar 9 is pressed and bends substrate W, but also may replace buffer substrate tablet 12, and setting is as shown in Figure 7 to be clipped score line S and bear substrate
A pair of W ' bear knife 20,20.
Present invention can apply to be formed with resin bed in the one side of substrate body, be formed with the crisp of convex portion in resin layer surface
The brisement of property material substrate.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, for example, can also omit above-mentioned cutting of web 11.In every case it is without departing from the technology of the present invention side
The content of case, any simple modification, equivalent variations and modification that the technical spirit according to the present invention is made to above example,
In the range of still falling within technical solution of the present invention.
Claims (3)
1. a kind of breaking method thereof of brittle substrate, is that the surface of the resin bed in the one side for being formed at substrate body is formed
There is convex portion and be formed with the brittle substrate of score line in the another side of the substrate body, the face from the resin bed is with brisement
Bar is pressed, make whereby the brittle substrate bend and along the score line brisement, it is characterised in that：
Part in the convex portion relative to the brittle substrate for brisement of the linear ridge line section of the front end of the brisement bar,
The recess being embedded in for the convex portion is formed, and all to be applied to the brisement bar press surface of brittle substrate in the pressing of brisement bar
The mode of the pressing load of equalization is given to carry out brisement.
2. a kind of brisement device of brittle substrate, is that the surface of the resin bed in the one side for being formed at substrate body is formed
There is convex portion and be formed with the brittle substrate of score line in the another side of the substrate body, the face from the resin bed is with brisement
Bar is pressed, make whereby the brittle substrate bend and along the score line brisement, it is characterised in that：
Part in the convex portion relative to the brittle substrate for brisement of the linear ridge line section of the front end of the brisement bar,
Form the recess being embedded in for the convex portion.
3. the brisement device of brittle substrate as claimed in claim 2, it is characterised in that wherein,
The depth of the recess of the brisement bar is formed as equal with the height of the convex portion of the brittle substrate, the width of the recess,
Formed with the size that the convex portion can be fully embedded in.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013203710A JP6185812B2 (en) | 2013-09-30 | 2013-09-30 | Method and apparatus for breaking brittle material substrate |
| JP2013-203710 | 2013-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104511974A CN104511974A (en) | 2015-04-15 |
| CN104511974B true CN104511974B (en) | 2017-09-05 |
Family
ID=52788134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410378500.9A Expired - Fee Related CN104511974B (en) | 2013-09-30 | 2014-08-01 | The breaking method thereof and brisement device of brittle substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6185812B2 (en) |
| KR (1) | KR102172681B1 (en) |
| CN (1) | CN104511974B (en) |
| TW (1) | TWI619589B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102073767B1 (en) * | 2018-10-30 | 2020-02-05 | 한국미쯔보시다이아몬드공업(주) | Method for inspecting thickness of rib mark |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1464866A (en) * | 2001-06-28 | 2003-12-31 | 三星钻石工业股份有限公司 | Device and method for breaking fragile material substrate |
| DE10311693B3 (en) * | 2003-03-17 | 2004-12-02 | Baumann Gmbh | Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness |
| CN1579013A (en) * | 2001-10-31 | 2005-02-09 | 三星钻石工业股份有限公司 | Method for forming scribe line on semiconductor wafer, and scribe line forming device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562803A (en) * | 1969-08-01 | 1971-02-09 | Centrifugal Products Inc | Plate breaking apparatus |
| JPS62121906U (en) * | 1986-01-24 | 1987-08-03 | ||
| JPH01178408A (en) * | 1988-01-07 | 1989-07-14 | Fujitsu Ltd | Dividing method for printed wiring board |
| JP2008229715A (en) * | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | Laser scribing apparatus |
| KR100959104B1 (en) * | 2008-07-16 | 2010-05-25 | 삼성모바일디스플레이주식회사 | Flat display panel breaking apparatus |
| JP2010204236A (en) | 2009-03-02 | 2010-09-16 | Seiko Epson Corp | Method of manufacturing electrooptical device, and electrooptical device |
| JP2010229005A (en) * | 2009-03-30 | 2010-10-14 | Mitsuboshi Diamond Industrial Co Ltd | Method for dividing brittle material substrate |
| JP5310278B2 (en) * | 2009-06-05 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | Break bar |
| JP5216040B2 (en) * | 2010-03-31 | 2013-06-19 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate |
| JP2011218607A (en) | 2010-04-06 | 2011-11-04 | Sharp Corp | Substrate dividing apparatus and substrate dividing method |
| JP5187421B2 (en) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
| JP2013071335A (en) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Method for dicing mother substrate |
| JP5790392B2 (en) * | 2011-10-12 | 2015-10-07 | 旭硝子株式会社 | Manufacturing method of electronic device |
| TWI488824B (en) * | 2011-12-05 | 2015-06-21 | Mitsuboshi Diamond Ind Co Ltd | The method and scribing device of glass substrate |
| JP5824365B2 (en) * | 2012-01-16 | 2015-11-25 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
-
2013
- 2013-09-30 JP JP2013203710A patent/JP6185812B2/en active Active
-
2014
- 2014-04-18 TW TW103114170A patent/TWI619589B/en not_active IP Right Cessation
- 2014-05-22 KR KR1020140061303A patent/KR102172681B1/en active IP Right Grant
- 2014-08-01 CN CN201410378500.9A patent/CN104511974B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1464866A (en) * | 2001-06-28 | 2003-12-31 | 三星钻石工业股份有限公司 | Device and method for breaking fragile material substrate |
| CN1579013A (en) * | 2001-10-31 | 2005-02-09 | 三星钻石工业股份有限公司 | Method for forming scribe line on semiconductor wafer, and scribe line forming device |
| DE10311693B3 (en) * | 2003-03-17 | 2004-12-02 | Baumann Gmbh | Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6185812B2 (en) | 2017-08-23 |
| TWI619589B (en) | 2018-04-01 |
| KR20150037482A (en) | 2015-04-08 |
| JP2015066832A (en) | 2015-04-13 |
| TW201511908A (en) | 2015-04-01 |
| KR102172681B1 (en) | 2020-11-02 |
| CN104511974A (en) | 2015-04-15 |
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